Crystal ring carrying device and carrying method

Abstract

The invention provides a crystal ring carrying device and a carrying method.The crystal ring carrying device comprises a moving part, a rotating part, a mounting plate and a plurality of ring taking assemblies, the rotating part is connected to a movable part of the moving part, the mounting plate is horizontally connected to the movable part of the rotating part, and the ring taking assemblies are arranged on the circumferential side of the mounting plate in the circumferential direction; the sliding blocks can slide on the mounting plate in the radial direction; the moving part is configured to drive the mounting plate to translate and descend so as to adjust the plurality of ring taking assemblies to the peripheral side of the crystal ring; the rotating part is configured to drive the mounting plate to rotate, and the plurality of ring taking assemblies are configured to synchronously slide towards the crystal ring, so that the crystal ring is spirally cut into the ring taking assemblies; and the moving part is further configured to drive the mounting plate to ascend so as to drive the plurality of ring taking assemblies to strip the crystal ring from the coating film, and drive the mounting plate to horizontally move so as to carry the stripped crystal ring to a target position. Before the crystal ring is carried, the bonding between the crystal ring and the coating film is removed, so that the risk of breakage of the crystal ring is reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor device production, and more specifically to a wafer ring transport device and a transport method. Background Art

[0002] During the semiconductor production process, it is sometimes necessary to perform ring cutting on the wafer to remove the material at the edge of the wafer. After the wafer is ring cut, the cut ring-shaped wafer waste needs to be peeled off from the edge of the wafer, and then the wafer ring needs to be moved to a waste box for waste disposal.

[0003] like Figure 1 As shown, the ring cutting operation process is to first use a dicing machine to perform a ring cutting operation on the wafer 100 carried on the cover film 200 (the cover film 200 is stretched on the stretcher 300, and the stretcher 300 is fixed on the carrier 400) to form a wafer ring 101 at the peripheral edge of the wafer 100. Subsequently, the wafer ring 101 is subjected to a debonding process, and then the wafer ring 101 is picked up by a wafer ring transport device and transported to a waste box.

[0004] The existing wafer ring handling device generally sucks the wafer ring 101 through a plurality of suction cups arranged along the circumference, and then pulls the wafer ring 101 upward, so that the wafer ring 101 is peeled off from the circumference of the wafer. However, since the wafer ring is thin and fragile, and there is still a certain degree of adhesion between the wafer ring 101 and the film 200, it is easy to break the wafer ring 101 when the wafer ring 101 is peeled off from the film 200 by pulling upward, thereby increasing the difficulty of removing the wafer ring 101. Summary of the invention

[0005] In order to solve the above technical problems, the present application provides a wafer ring transport device, which adopts the following technical solutions:

[0006] A wafer ring handling device is used to peel and carry the wafer ring on the circumferential side of the wafer. The wafer is carried on a coating, and the coating is stretched on a stretching frame. The wafer ring handling device includes a moving part, a rotating part, a mounting plate and a plurality of ring removal components, wherein:

[0007] The rotating part is connected to the movable part of the moving part, the mounting plate is horizontally connected to the movable part of the rotating part, and a plurality of ring-removing assemblies are circumferentially arranged on the peripheral side of the mounting plate and can slide on the mounting plate in the radial direction;

[0008] The moving part is configured to drive the mounting plate to translate and descend, so as to adjust a plurality of ring-removing assemblies to the peripheral side of the crystal ring;

[0009] The rotating part is configured to drive the mounting plate to rotate, and the plurality of ring removal assemblies are configured to slide synchronously toward the crystal ring so that the crystal ring is spirally cut into the ring removal assemblies;

[0010] The moving part is also configured to drive the mounting plate to rise, so as to drive a plurality of ring-removing assemblies to peel the crystal ring from the covering film, and to drive the mounting plate to translate, so as to transport the peeled crystal ring to a target position.

[0011] The crystal ring handling device provided by the present application is used to implement the peeling and handling of the crystal ring. While the ring removal assembly slides radially toward the crystal ring, the rotating part mounting plate rotates to drive the ring removal assembly to rotate, so that the crystal ring is spirally cut into the ring removal assembly. In this way, on the one hand, several ring removal assemblies can cooperate to support the crystal ring, and on the other hand, the bonding between the crystal ring and the underlying film can be released. This ensures that when the moving part drives the mounting plate to rise, several ring removal assemblies can smoothly peel the crystal ring from the film, reducing the risk of the crystal ring breaking.

[0012] In some embodiments, the ring taking assembly includes a slide rail, a sliding bracket, a translational drive, a connecting rod and a roller, wherein: the slide rail is radially arranged on the mounting plate; the sliding bracket is slidably connected to the slide rail via a slider, and is transmission-connected to the translational drive arranged on the mounting plate; the connecting rod is arranged in the vertical direction, and the upper end of the connecting rod is fixedly connected to the sliding bracket; the roller is installed at the lower end of the connecting rod, and a groove is arranged on the circumference of the roller, and the width of the groove in the vertical direction is greater than the thickness of the crystal ring; when the rotating part drives the mounting plate to rotate, the translational drive synchronously drives the sliding bracket to slide along the slide rail toward the crystal ring, so that the crystal ring spirally cuts into the groove of the roller.

[0013] A ring removal assembly with a simple structure is provided, which drives a roller with a slot to slide toward a crystal ring through a translation drive member, so that the crystal ring is spirally cut into the slot of the roller. In other words, the part of the roller below the slot is inserted between the crystal ring and the film along a spiral track. In this process, the roller realizes the release of the bonding between the crystal ring and the film below.

[0014] In some embodiments, the upper end of the connecting rod is rotatably connected to the sliding bracket via a bearing, or the roller is rotatably connected to the lower end of the connecting rod via a rolling bearing.

[0015] Since the roller can rotate relative to the mounting plate, when the part of the roller below the slot spirally cuts into between the crystal ring and the film, the roller generates adaptive rotation under the push of viscous resistance, thereby preventing the roller from tearing the film due to the viscous resistance and causing the crystal ring to break.

[0016] In some embodiments, a plurality of radially extending avoidance grooves corresponding to the ring removal assemblies are provided on the side of the mounting plate; the connecting rods of each ring removal assembly are located in the avoidance groove and can move along the avoidance groove.

[0017] The mounting plate avoids the connecting rod, ensuring that the roller can slide relative to the mounting plate in the radial direction.

[0018] In some embodiments, the wafer ring handling device includes three ring taking assemblies, and the included angle between the slide rails of the three ring taking assemblies is 120°.

[0019] By providing three ring removal assemblies and setting the installation angles of the three ring removal assemblies, on the one hand, the support stability of the ring removal assemblies for the crystal ring can be ensured, and on the other hand, the equipment cost can be reduced.

[0020] In some embodiments, the moving part includes a translation drive module and a lifting drive module, wherein the lifting drive module is connected to the movable part of the translation drive module, and the rotating part is connected to the movable part of the lifting drive module, the translation drive module is used to drive the mounting plate to translate, and the lifting drive module is used to drive the mounting plate to lift and lower.

[0021] By configuring the moving part to include a translation driving module and a lifting driving module, the moving part can drive the mounting plate to translate or lift, or drive the mounting plate to lift while driving the mounting plate to translate, thereby improving the driving flexibility.

[0022] In some embodiments, the wafer ring handling device also includes a positioning component, which is disposed on a mounting plate and is signal-connected to a control end of a moving mechanism; the positioning component is configured to position the wafer ring to obtain position information of the wafer ring, and to send the position information of the wafer ring to a control end of the moving mechanism; the moving mechanism is configured to drive the mounting plate to translate according to the position information of the wafer ring, so that the rotation center of the mounting plate is aligned with the center of the wafer.

[0023] By setting the positioning component, the positioning of the crystal ring is achieved (that is, the outer circle trajectory information of the crystal ring is obtained), so that the center position of the wafer can be further obtained. Finally, the moving mechanism can drive the mounting plate to translate according to the center position of the wafer, so that the rotation center of the mounting plate is aligned with the center of the wafer. In this way, when the moving part drives the mounting plate to translate and descend into place, a number of ring removal components can be arranged on the periphery of the crystal ring, and the spacing between each ring removal component and the crystal ring is equal, which ultimately ensures that each ring removal component can synchronously contact the crystal ring when sliding toward the crystal ring to prevent uneven force on the crystal ring.

[0024] In some embodiments, the positioning assembly includes a plurality of fiber optic sensors circumferentially disposed on the bottom of the mounting plate.

[0025] A method for implementing a positioning component is provided, which implements the positioning of a crystal ring through an optical fiber sensor with a positioning function. Several optical fiber sensors cooperate with each other to implement the positioning of the crystal ring from different positions, thereby ensuring the positioning accuracy of the crystal ring.

[0026] In some embodiments, the positioning assembly includes a camera disposed at the bottom of the mounting plate, and the camera is connected to the PLC signal, wherein: the camera is used to take a picture of the wafer to obtain an image of the crystal ring, and transmit the image of the crystal ring to the PLC, and the PLC obtains the position information of the crystal ring by performing image analysis on the image.

[0027] Another implementation of the positioning component is provided, which obtains the position information of the crystal ring through image analysis technology, and the PLC can directly calculate the center position of the crystal ring based on the position information of the crystal ring.

[0028] The present application also provides a wafer ring transport method, which is implemented by any of the wafer ring transport devices described above, and the wafer ring transport method includes:

[0029] The moving part drives the mounting plate to translate so that the rotation center of the mounting plate is aligned with the center of the wafer;

[0030] The moving part drives the mounting plate to descend toward the wafer so that a plurality of ring removal assemblies are evenly arranged around the wafer ring and press the coating downward;

[0031] The rotating part drives the mounting plate to rotate, and a plurality of ring-removing assemblies synchronously slide toward the crystal ring, so that the crystal ring is spirally cut into the ring-removing assemblies;

[0032] The moving part drives the mounting plate to rise away from the wafer, so as to drive a plurality of ring removal components to peel the wafer ring from the covering film;

[0033] The moving part drives the mounting plate to translate so as to carry the peeled wafer ring to a target position.

[0034] The crystal ring handling method provided in the present application is used to implement the peeling and handling of the crystal ring. While a number of ring-taking components slide toward the crystal ring, the rotating part mounting plate rotates to drive the ring-taking components to rotate, so that the crystal ring spirally cuts into the ring-taking components. In this way, on the one hand, the number of ring-taking components can cooperate to implement the support and pick-up of the crystal ring, and on the other hand, the bonding between the crystal ring and the underlying film can be released, thereby ensuring that when the moving part drives the mounting plate to rise, the number of ring-taking components can smoothly peel the crystal ring from the film, reducing the risk of the crystal ring breaking. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A schematic diagram of the state of a wafer after ring cutting is completed;

[0036] Figure 2 Schematic diagram of the structure of the wafer ring transport device in the embodiment of the present application;

[0037] Figure 3 It is a schematic diagram of the top view of the mounting plate and the ring removal assembly in the embodiment of the present application;

[0038] Figure 4 It is a bottom view structural schematic diagram of the mounting plate and the ring removal assembly in the embodiment of the present application;

[0039] Figure 5 This is a schematic diagram of the supporting and fixing effect of the three rollers in cooperation with each other on the crystal ring in the embodiment of the present application;

[0040] Figure 6 This is a schematic diagram of the supporting and fixing effect of the roller on the crystal ring in the embodiment of the present application;

[0041] Figures 1 to 6 Included:

[0042] Moving part 1: translation driving module 11, lifting driving module 12;

[0043] Rotating part 2;

[0044] Mounting plate 3: avoidance groove 31;

[0045] Ring removal assembly 4: slide rail 41, sliding bracket 42, translation drive 43, connecting rod 44, roller 45, card slot 451, positioning assembly 5: optical fiber sensor 51, optical fiber amplifier 52;

[0046] Wafer 100 , wafer ring 101 , coating 200 , frame 300 , and carrier 400 . DETAILED DESCRIPTION

[0047] The technical solution of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0048] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0049] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0050] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0051] As described in the background technology section, the existing wafer ring handling device uses a number of suction cups arranged along the circumference to absorb the wafer ring, and then pulls the wafer ring upward, so that the wafer ring is peeled off the circumference of the wafer. Since the wafer ring is thin and fragile, and there is still a certain adhesion between the wafer ring and the film, the forward pulling method can easily cause the wafer ring to break, making it more difficult to remove the wafer.

[0052] To this end, the present application first provides a wafer ring transport device, which is used to peel and transport the wafer ring on the circumference of the wafer. Figure 1 As shown, the wafer 100 is supported on the cover film 200, and the cover film 200 is stretched on the stretcher 300. The wafer ring 101 is a ring-shaped waste located on the periphery of the wafer 100 after the ring cutting process.

[0053] like Figure 2 As shown, the crystal ring transport device in the embodiment of the present application includes a moving part 1, a rotating part 2, a mounting plate 3 and a plurality of ring removal assemblies 4, where "several" means "three and more".

[0054] The rotating part 2 is connected to the movable part of the moving part 1, and the mounting plate 3 is horizontally connected to the movable part of the rotating part 2. The moving part 1 is used to drive the mounting plate 3 to translate in the horizontal plane and to rise and fall in the vertical direction, wherein the translation can be translation along the X-axis direction, translation along the Y-axis direction, or translation including the X-axis direction and the Y-axis direction. The rotating part 2 is used to drive the mounting plate 3 to rotate in the horizontal plane.

[0055] Several ring taking components 4 are arranged on the peripheral side of the mounting plate 3 along the circumferential direction, and can slide on the mounting plate 3 along the radial direction. In other words, each ring taking component 4 can slide toward or away from the center of the mounting plate 3.

[0056] The optional working process of the wafer ring transport device in the embodiment of the present application is as follows:

[0057] First, the moving part 1 drives the mounting plate 3 to translate in a horizontal plane, so that the projections of the plurality of ring removal assemblies 4 on the coating 200 are all located outside the wafer ring 101 .

[0058] Subsequently, the moving part 1 drives the mounting plate 3 to descend, so that the plurality of ring removal assemblies 4 surround the periphery of the wafer ring 101 , and the plurality of ring removal assemblies 4 all press the coating film 200 downward.

[0059] Subsequently, the rotating part 2 drives the mounting plate 3 to rotate, and at the same time, several ring-removing assemblies 4 synchronously slide radially toward the wafer ring 101. That is, the ring-removing assemblies 4 move radially toward the center point of the wafer 100 while rotating with the rotating part 2, and the effect produced thereby is that the ring-removing assemblies 4 move toward the wafer ring 101 along a spiral path, and finally the wafer ring 101 is spirally cut into each ring-removing assemblies 4. In this way, on the one hand, several ring-removing assemblies 4 can cooperate to complete the support of the wafer ring 101, and on the other hand, the bonding between the wafer ring 101 and the underlying film 200 can be released.

[0060] Finally, the moving part 1 drives the mounting plate 3 to rise, so as to drive the plurality of ring removal assemblies 4 to peel the wafer ring 101 from the coating 200 , and drives the mounting plate 3 to translate, so as to transport the peeled wafer ring 101 to the target position.

[0061] It can be seen that the wafer ring transporting device provided in the present application can release the bonding between the wafer ring 101 and the coating 200 before transporting the wafer ring 101 , thereby reducing the risk of the wafer ring 101 breaking.

[0062] Optional, such as Figure 2 As shown, the moving part 1 includes a translation driving module 11 and a lifting driving module 12, wherein the lifting driving module 12 is connected to the movable part of the translation driving module 11, and the rotating part 2 is connected to the movable part of the lifting driving module 12. The translation driving module 11 is used to drive the installation plate 3 to translate, and the lifting driving module 12 is used to drive the installation plate 3 to rise and fall.

[0063] The translation drive module 11 and the lifting drive module 12 can adopt various existing linear drive modules, such as synchronous belt drive module, screw drive module, etc. The rotating part 2 can adopt various existing drive modules such as rotating motor module that can drive the mounting plate 3 to rotate.

[0064] like Figures 3 to 6As shown, optionally, the ring removal assembly 4 includes a slide rail 41, a sliding bracket 42, a translation driving member 43, a connecting rod 44 and a roller 45, wherein: the slide rail 41 is radially arranged on the mounting plate 3. The sliding bracket 42 is slidably connected to the slide rail 41 through a slider and is transmission-connected to the translation driving member 43 arranged on the mounting plate 3. The connecting rod 44 is arranged in the vertical direction, and the upper end of the connecting rod 44 is fixedly connected to the sliding bracket 42. The roller 45 is installed at the lower end of the connecting rod 44, and a card slot 451 is arranged on the peripheral side of the roller 45, and the width a of the card slot 451 in the vertical direction is greater than the thickness b of the crystal ring 101.

[0065] When the moving part 1 drives the mounting plate 3 to descend, so that the plurality of ring-taking assemblies 4 surround the periphery of the crystal ring 101, the rotating part 2 drives the mounting plate 3 to rotate. At the same time, the translation driving member 43 of each ring-taking assembly 4 synchronously drives the corresponding sliding bracket 42 to slide along the slide rail toward the crystal ring 101, so that the crystal ring 101 is spirally cut into the slot 451 of the roller 45 of each ring-taking assembly 4. In other words, Figure 6 As shown, the portion 452 of the roller 45 below the slot 451 is spirally inserted between the wafer ring 101 and the coating 200 . During this process, the roller 45 releases the bonding between the wafer ring 101 and the coating 200 and supports the wafer ring 101 .

[0066] Of course, the part 452 of the roller 45 located below the slot 451 is spirally inserted into place. After the translation drive 43 of the ring removal assembly 4 stops driving, the rotating part 2 can continue to drive the mounting plate 3 to rotate, so that the roller 45 can further release the bonding between the crystal ring 101 and the coating 200.

[0067] Optionally, the upper end of the connecting rod 44 is rotatably connected to the sliding bracket 42 via a bearing. Alternatively, the roller 45 is rotatably connected to the lower end of the connecting rod 44 via a rolling bearing. In this arrangement, the roller 45 can rotate relative to the mounting plate 3, and when the portion 452 of the roller 45 located below the slot is inserted between the crystal ring 101 and the coating 200, the roller 45 generates adaptive rotation under the push of the adhesive resistance, thereby preventing the roller 45 from tearing the coating 200 due to the adhesive resistance, causing the crystal ring 101 to break.

[0068] like Figure 3 As shown, optionally, a plurality of radially extending avoidance grooves 31 corresponding to the ring taking assemblies 4 are provided on the side of the mounting plate 3. The connecting rods 44 of each ring taking assembly 4 are all located in the corresponding avoidance grooves 31 and can move along the avoidance grooves 31. By providing the avoidance grooves 31 on the mounting plate 3, the mounting plate 3 avoids the connecting rods 44 of each ring taking assembly 4, so that the rollers 45 of each ring taking assembly 4 can move relative to the mounting plate 3 in the radial direction.

[0069] like Figures 3 to 5As shown, optionally, the crystal ring handling device in the embodiment of the present application includes three ring taking assemblies 4, and the angle between the slide rails 41 of the three ring taking assemblies 4 is 120°. Such a configuration can ensure that the rollers of the three ring taking assemblies 4 can stably support the crystal ring 101, and reduce the equipment cost on the other hand.

[0070] like Figure 4 As shown, optionally, the wafer ring handling device in the embodiment of the present application further includes a positioning component 5, which is disposed on the mounting plate 3, and the positioning component 5 is connected to the control end signal of the moving mechanism 1. The positioning component 5 is configured to position the wafer ring 101 to obtain the position information of the wafer ring 101, and to send the position information of the wafer ring 101 to the control end of the moving mechanism 1. The moving mechanism 1 is configured to drive the mounting plate 3 to translate according to the position information of the wafer ring 101, so that the rotation center of the mounting plate 3 is aligned with the center of the wafer 100.

[0071] By setting the positioning assembly, the positioning of the wafer ring 101 is achieved (i.e., the outer circle trajectory information of the wafer ring 101 is obtained), so that the center position of the wafer 100 can be further obtained. Finally, the moving mechanism 1 can drive the mounting plate 3 to translate according to the center position of the wafer 100, so that the rotation center of the mounting plate 3 is aligned with the center of the wafer 100.

[0072] In this way, when the moving part 1 drives the mounting plate 2 to translate and descend into place, a number of ring-removing assemblies 4 can be arranged on the circumferential side of the crystal ring 101, and the spacing between each ring-removing assembly 4 and the crystal ring 101 is equal, ultimately ensuring that each ring-removing assembly 4 can synchronously contact the crystal ring 101 when sliding toward the crystal ring 101, thereby preventing uneven force on the crystal ring 101.

[0073] Figure 4 In the illustrated embodiment, the positioning assembly 5 includes a plurality of (for example, three) optical fiber sensors 51 circumferentially arranged at the bottom of the mounting plate 3. The plurality of optical fiber sensors 51 cooperate with each other to implement positioning of the crystal ring 101 from different positions, thereby ensuring the positioning accuracy of the crystal ring 101. Optionally, each optical fiber sensor 51 is correspondingly configured with an optical fiber amplifier 52, and the optical fiber sensor 51 sends the positioning information to the corresponding optical fiber amplifier 52, which amplifies the signal and sends the positioning information to the control end of the mobile mechanism 1. Positioning of the target object by using an optical fiber sensor is a technology well known to those skilled in the art, and its specific positioning process will not be described in detail here.

[0074] In some other optional embodiments, the positioning assembly 5 includes a camera disposed at the bottom of the mounting plate, and the camera is connected to the PLC signal, wherein: the camera is used to take a picture of the crystal ring to obtain an image of the crystal ring, and transmit the image of the crystal ring to the PLC, and the PLC performs image analysis on the image to obtain the position information of the crystal ring. The position information of the crystal ring includes the outer periphery track of the crystal ring and the center position of the crystal ring, and the center position of the crystal ring is also the center position of the wafer.

[0075] Based on the same inventive concept, an embodiment of the present application further provides a wafer ring transport method, which is implemented by the wafer ring transport device of any of the above embodiments, and the wafer ring transport method includes:

[0076] The moving part 1 drives the mounting plate 3 to translate so that the rotation center of the mounting plate 3 is aligned with the center of the wafer.

[0077] The moving part drives the mounting plate 3 to descend toward the wafer, so that a plurality of ring removal assemblies 4 are evenly arranged around the wafer ring and press the coating downward.

[0078] The rotating part 2 drives the mounting plate 3 to rotate, and a plurality of ring-removing assemblies 4 slide synchronously toward the crystal ring, so that the crystal ring is spirally cut into the ring-removing assemblies 4 .

[0079] The moving part 1 drives the mounting plate 3 to rise away from the wafer, so as to drive a plurality of ring removal assemblies 4 to peel the wafer ring from the film.

[0080] The moving part 1 drives the mounting plate 3 to translate so as to carry the peeled wafer ring to a target position.

[0081] The crystal ring handling method provided in the embodiment of the present application is used to implement the peeling and handling of the crystal ring. While a number of ring-removing components slide radially toward the crystal ring, the rotating part drives the number of ring-removing components to rotate, so that the crystal ring is spirally cut into the ring-removing component. In this way, on the one hand, the number of ring-removing components can cooperate to support the crystal ring, and on the other hand, the bonding between the crystal ring and the underlying film can be released. That is, the crystal ring handling method provided in the embodiment of the present application realizes the bonding between the crystal ring and the film before the crystal ring is transported, thereby reducing the risk of the crystal ring breaking.

[0082] The present application is described in sufficient detail above with certain particularity. It should be understood by those skilled in the art that the description in the embodiments is merely exemplary, and all changes made without departing from the true spirit and scope of the present application should fall within the scope of protection of the present application. The scope of protection claimed in the present application is defined by the claims, rather than by the above description in the embodiments.

Claims

1. A wafer ring transport device, characterized in that: Used to peel and transport the wafer ring on the circumferential side of the wafer, the wafer is carried on the film, the film is stretched on the stretcher, the wafer ring transport device includes a moving part, a rotating part, a mounting plate and a plurality of ring removal components, wherein: The rotating part is connected to the movable part of the moving part, the mounting plate is horizontally connected to the movable part of the rotating part, and a plurality of ring-removing assemblies are circumferentially arranged on the peripheral side of the mounting plate and can slide on the mounting plate radially; The moving part is configured to drive the mounting plate to translate and descend, so as to adjust the plurality of ring removal assemblies to the peripheral side of the crystal ring; The rotating part is configured to drive the mounting plate to rotate, and a plurality of ring-removing assemblies are configured to slide synchronously toward the crystal ring so that the crystal ring is spirally cut into the ring-removing assemblies; The moving part is also configured to drive the mounting plate to rise, so as to drive a plurality of ring-removing assemblies to peel the crystal ring from the covering film, and to drive the mounting plate to translate, so as to transport the peeled crystal ring to a target position.

2. The wafer transport device according to claim 1, wherein: The ring removal assembly includes a slide rail, a sliding bracket, a translation drive member, a connecting rod and a roller, wherein: The slide rail is radially arranged on the mounting plate; The sliding bracket is slidably connected to the sliding rail via a slider, and is drivingly connected to the translation driving member arranged on the mounting plate; The connecting rod is arranged in a vertical direction, and the upper end of the connecting rod is fixedly connected to the sliding bracket; The roller is mounted at the lower end of the connecting rod, and a slot is provided on the circumference of the roller, wherein the width of the slot in the vertical direction is greater than the thickness of the crystal ring; When the rotating part drives the mounting plate to rotate, the translation driving member synchronously drives the sliding bracket to slide along the slide rail toward the crystal ring, so that the crystal ring is spirally cut into the clamping groove of the roller.

3. The wafer transport device according to claim 2, wherein: The upper end of the connecting rod is rotatably connected to the sliding bracket via a bearing, or the roller is rotatably connected to the lower end of the connecting rod via a rolling bearing.

4. The wafer transport device according to claim 2, wherein: A plurality of radially extending avoidance grooves corresponding to the ring removal assemblies are arranged on the side of the mounting plate; The connecting rods of each ring-removing assembly are located in the avoidance groove and can move along the avoidance groove.

5. The wafer transport device according to claim 2, wherein: The crystal ring transport device comprises three ring taking assemblies, and the included angle between the slide rails of the three ring taking assemblies is 120°.

6. The wafer transport device according to claim 1, wherein: The moving part includes a translation driving module and a lifting driving module, wherein the lifting driving module is connected to the movable part of the translation driving module, and the rotating part is connected to the movable part of the lifting driving module. The translation driving module is used to drive the installation plate to translate, and the lifting driving module is used to drive the installation plate to lift and lower.

7. The wafer transport device according to claim 1, wherein: The wafer ring handling device further comprises a positioning component, which is arranged on the mounting plate and is connected to the control end of the moving mechanism by signal; The positioning component is configured to position the crystal ring to obtain position information of the crystal ring, and send the position information of the crystal ring to the control end of the moving mechanism; The moving mechanism is configured to drive the mounting plate to translate according to the position information of the wafer ring so that the rotation center of the mounting plate is aligned with the center of the wafer.

8. The wafer ring transport device according to claim 6, characterized in that: The positioning assembly includes a plurality of optical fiber sensors circumferentially arranged at the bottom of the mounting plate.

9. The wafer ring transport device according to claim 6, characterized in that: The positioning assembly includes a camera disposed at the bottom of the mounting plate, the camera being connected to a PLC signal, wherein: The camera is used to take a picture of the crystal ring to obtain an image of the crystal ring, and transmit the image of the crystal ring to the PLC. The PLC obtains the position information of the crystal ring by performing image analysis on the image.

10. A method for transporting a wafer ring, characterized in that: The wafer ring transport method is implemented by the wafer ring transport device according to any one of claims 1 to 9, and the wafer ring transport method includes: The moving part drives the mounting plate to translate so that the rotation center of the mounting plate is aligned with the center of the wafer; The moving part drives the mounting plate to descend toward the wafer, so that a plurality of the ring removal assemblies are evenly arranged around the wafer ring and press the coating downward; The rotating part drives the mounting plate to rotate, and a plurality of ring-removing assemblies synchronously slide toward the crystal ring, so that the crystal ring is spirally cut into the ring-removing assemblies; The moving part drives the mounting plate to move upward away from the wafer, so as to drive a plurality of ring removal assemblies to peel the wafer ring from the covering film; The moving part drives the mounting plate to translate so as to carry the peeled wafer ring to a target position.

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