LED packaging structure

Abstract

The invention relates to an LED (light-emitting diode) packaging structure, which comprises a substrate provided with a die bonding area and a circuit layer, the die bonding area is provided with an LED wafer, and the circuit layer is arranged around the die bonding area and is electrically connected with the LED wafer; the antenna layer is located outside the die bonding area and is insulated from the substrate; the radio frequency identification chip is arranged on the substrate and electrically connected with the antenna layer, and the radio frequency identification chip and the substrate are arranged in an insulated mode; and the colloid box dam layer is arranged on the side, facing the radio frequency identification chip, of the substrate and encloses the die bonding area, and the colloid box dam layer covers the radio frequency identification chip and the antenna layer. According to the LED packaging structure provided by the embodiment of the invention, the anti-counterfeiting traceability and level of the packaging structure can be improved.

Description

Technical Field

[0001] The present invention relates to the field of LEDs, and in particular to an LED packaging structure. Background Art

[0002] In the LED field, since a single LED package is limited by its structural size, it is difficult to achieve anti-counterfeiting and traceability for each LED package.

[0003] In the prior art, for COB (Chips on Board) LED packages, a QR code is generally printed on the back of the LED package to prevent counterfeiting. However, this method is not very effective in preventing counterfeiting. Counterfeiting can also be achieved by printing a fake QR code on the back of the LED package. The LED package is still easily counterfeited and imitated, and it is difficult for users to identify whether the LED package is genuine or a counterfeit. Summary of the invention

[0004] Therefore, in order to overcome at least some of the defects and shortcomings of the above-mentioned prior art, an embodiment of the present invention proposes an LED packaging structure to improve the anti-counterfeiting and traceability capability and level of the LED packaging structure.

[0005] On the one hand, an LED packaging structure proposed in an embodiment of the present invention includes, for example: a substrate, provided with a solid crystal area and a circuit layer, wherein an LED chip is provided in the solid crystal area, and the circuit layer is arranged around the solid crystal area and electrically connected to the LED chip; an antenna layer is located outside the solid crystal area and is insulated from the substrate; a radio frequency identification chip is arranged on the substrate and electrically connected to the antenna layer; the radio frequency identification chip is insulated from the substrate; a colloidal dam layer is arranged on a side of the substrate facing the radio frequency identification chip and encloses the solid crystal area, and the colloidal dam layer covers the radio frequency identification chip and the antenna layer.

[0006] On the other hand, an LED packaging structure proposed in an embodiment of the present invention, for example, includes: a substrate, provided with a solid crystal area and a circuit layer, wherein the solid crystal area is provided with an LED chip, and the circuit layer is arranged around the solid crystal area and electrically connected to the LED chip; an antenna layer is located in the solid crystal area and is insulated from the substrate and the LED chip respectively; a radio frequency identification chip is arranged on the solid crystal area and is electrically connected to the antenna layer, and the radio frequency identification chip is insulated from the LED chip; a colloidal dam layer is arranged on the substrate facing the radio frequency identification chip and enclosing the solid crystal area; a sealing layer is arranged in the colloidal dam layer and seals the solid crystal area; the sealing layer covers the radio frequency identification chip and the antenna layer.

[0007] From the above, it can be seen that the LED packaging structure provided by the embodiment of the present invention buries the antenna layer and the RFID chip under the colloidal dam layer and / or in the solid crystal area. The user can identify and read the data in the RFID chip through a reader / writer, thereby determining the authenticity of the LED package, and tracing the LED package according to the data read by the reader / writer, thereby improving the ability to verify the authenticity and trace the source of the LED package. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0009] Figure 1 This is a schematic diagram of the overall structure of the LED packaging structure provided in the first embodiment of the present application.

[0010] Figure 2 for Figure 1 Schematic diagram of the decomposition structure shown.

[0011] Figure 3 for Figure 2 Enlarged view of point A in the middle.

[0012] Figure 4 for Figure 1 Schematic diagram of the structure after removing the dam glue layer.

[0013] Figure 5 Schematic diagram of the decomposed structure of the LED package structure when the antenna layer is a multi-turn antenna.

[0014] Figure 6 A schematic flow chart of a method for preparing an LED packaging structure is provided for the second embodiment of the present application.

[0015] Figure 7 for Figure 6 The flowchart of the additional steps after step S602 is shown.

[0016] Figure 8a-8d for Figure 6 Schematic diagram of the specific preparation process involved.

[0017] Fig. 9 This is a schematic diagram of the exploded structure of the LED packaging structure provided in the third embodiment of the present application.

[0018] Fig.10 This is a schematic structural diagram of the LED packaging structure provided in the third embodiment of the present application, in which the RFID chip is connected to the antenna layer after the dam glue layer is removed.

[0019] Fig.11 This is a schematic structural diagram of the LED packaging structure provided in the third embodiment of the present application, after the dam glue layer is removed, and the RFID chip is flip-chip connected to the antenna layer.

[0020] Fig.12 A schematic flow chart of a method for preparing an LED packaging structure is provided for the fourth embodiment of the present application.

[0021] Figure 13a-Figure 13c for Fig.12 Schematic diagram of the specific preparation process involved.

[0022] [Description of Reference Numerals]

[0023] 1: LED packaging structure; 10: substrate; 11: solid crystal area; 12: circuit layer; 111: LED chip; 112: first gap; 20: antenna layer; 21: first connection end; 22: second connection end; 23: multi-ring ring structure; 24: opening; 30: insulation layer; 31: electrical contact point; 40: RFID chip; 51: colloidal dam layer; 52: sealing layer; 53: metal wire. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] [First embodiment]

[0026] In this embodiment, if Figure 1-Figure 4 As shown, an embodiment of the present invention provides an LED packaging structure 1. The LED packaging structure 1 includes, for example: a substrate 10, an antenna layer 20, a radio frequency identification chip 40 and a colloid dam layer 51.

[0027] like Figure 2As shown, a solid crystal area 11 and a circuit layer 12 are provided on the front of the substrate 10, wherein the solid crystal area 11 is provided with an LED chip 111, and the circuit layer 12 is arranged around the solid crystal area 11 and is electrically connected to the LED chip 111. Wherein, the substrate 10 is, for example, a circuit board, and the circuit board is, for example, a flexible circuit board, or a non-flexible circuit board, and the material of the circuit board can be flexibly selected, for example, but not limited to, thick copper foil, high TG circuit board, aluminum-based circuit board, copper-based board, halogen-free board, Rogers high-frequency board, ceramic board, polyimide, etc. For example, a solid crystal area 11 is distributed in the central area of ​​the front of the circuit board, and multiple LED chips 111 are placed in the solid crystal area 11 and connected. Wherein, the electrical connection between the multiple LED chips 111 can be in series, in parallel, or in combination of series and parallel. A circuit layer 12 is provided at the edge of the solid crystal area 11, which is electrically connected to the connecting circuit on the circuit board and is used to electrically connect to the positive and negative electrodes of the LED chip respectively. The circuit layer 12 is, for example, an arc-shaped circuit structure or an annular non-closed metal circuit structure. Of course, in other embodiments, the structure of the circuit layer 12 can be set according to actual conditions, such as a long strip, a circle, a ring, etc., which is not limited here.

[0028] The antenna layer 20 is located outside the solid crystal area 11 and is insulated from the substrate, wherein the antenna layer 20 is, for example, a signal antenna, and the signal antenna may be composed of a metal material, and an insulating material is provided between the metal material and the substrate 10 to achieve insulation between the antenna layer 20 and the substrate 10, and the insulating material is used to insulate between the antenna layer 20 and the substrate to prevent a short circuit from occurring after the antenna layer 20 is electrically connected to the radio frequency identification chip 40, thereby affecting the function of the radio frequency identification chip 40 electrically connected to the antenna layer 20. The signal antenna may be, for example, a signal antenna with an annular structure, a signal antenna with a circular structure, or a sawtooth-shaped signal antenna, and may be a single-loop or multi-loop structure, and the like.

[0029] The RFID chip 40 is disposed on the front side of the substrate 10 and is electrically connected to the antenna layer 20. The RFID chip 40 is insulated from the substrate 10. The RFID chip 40 stores, for example, relevant label information and product information or manufacturer information of the LED package structure 1. The label information is, for example, identification information and digital code. The digital code is, for example, a unique digital code corresponding to each product of the LED package structure to ensure the uniqueness of each product. The identification information is, for example, an identity identifier of the product. The product information includes, for example, the origin information of the LED package structure 1, product model information, and product manufacturing information, transportation, and seller information.

[0030] The colloidal dam layer 51 is arranged on the side of the substrate 10 facing the RFID chip 40, that is, the colloidal dam layer 51 is located on the front side of the substrate 10, and the colloidal dam layer 51 can enclose the solid crystal area 11, and the colloidal dam layer 51 covers the RFID chip 40 and the antenna layer 20. The colloidal dam layer 51 can be, for example, a white glue after curing, and the white glue is cured on the insulating layer 30 to form a white colloidal layer with a light reflecting function. The white colloidal layer is, for example, in the shape of a bowl that encloses the LED chip 111 in the solid crystal area 11, so that the light emitted by the LED chip 111 in the solid crystal area 11 can be reflected and refracted by the side wall of the bowl formed by the white colloid and then mixed and emitted, which can improve the brightness of the light and improve the uniformity of the light; at the same time, the bowl can also form physical protection for the LED chip 111 in the solid crystal area 11, thereby improving the safety of the LED chip 111. When the colloidal dam layer 51 is formed on the front side of the substrate 10, it can cover the RFID chip 40 and the antenna layer 20, that is, the antenna layer 20 and the RFID chip 40 are both buried under the colloidal dam layer 51. And because the colloidal dam layer 51 is a white colloid, it is difficult for a user to recognize the RFID chip 40 buried therein with the naked eye, but the various data stored in the RFID chip 40 can be recognized and read by a reader / writer communicating with the RFID chip 40, thereby identifying the authenticity of the LED package structure 1 and the product traceability of the LED package structure 1.

[0031] The LED packaging structure 1 of this embodiment buries the antenna layer 20 and the RFID chip 40 under the colloidal dam layer 51, that is, the colloidal dam layer 51 can cover the RFID chip 40 and the antenna layer 20, so that the colloidal dam layer 51 can be sealed with the RFID chip 40 and the antenna layer 20 as a whole. Since the dam glue of the colloidal dam layer 51 forms a white colloid after curing, it is difficult for the naked eye to identify the internal objects, and the data in the RFID chip 40 can be identified and read by a reader, so that the authenticity of the LED packaging structure 1 can be determined and the product of the LED packaging structure 1 can be traced, thereby improving the anti-counterfeiting and traceability capabilities of the LED packaging structure 1. At the same time, the various structures of the LED packaging structure 1 can be constructed as a whole. When the colloidal dam layer 51 and the RFID chip 40 are artificially damaged, the function of the entire LED packaging structure 1 will also be lost, thereby improving the anti-counterfeiting capability and level of the LED packaging structure 1.

[0032] Furthermore, if Figure 2 As shown, the antenna layer 20 is a ring structure and is arranged around the periphery of the solid crystal area 11. Setting the antenna layer 20 as a ring structure can extend the length of the antenna in the antenna layer, thereby improving the sensing function of the antenna layer 20.

[0033] Furthermore, if Figure 4 As shown, the antenna layer 20 may be, for example, a multi-turn ring structure 23 , that is, the antenna layer 20 is a multi-turn ring signal antenna, which can further extend the length of the signal antenna, thereby further improving the sensing function of the antenna layer 20 .

[0034] Furthermore, if Figure 2 As shown, an opening 24 is provided on one end of the antenna layer 20; the RFID chip 40 is arranged at the opening 24, that is, the antenna layer 20 is a ring-shaped non-closed structure, and an opening 24 is provided at one end thereof so that the antenna layer forms a first connection end 21 and a second connection end 22 at both ends of the opening 24, respectively. The RFID chip 40 is arranged at the opening 24, which can facilitate the RFID chip 40 to be electrically connected to the antenna layer.

[0035] Furthermore, the LED packaging structure 1 further includes, for example, an insulating layer 30, which is disposed on a side of the antenna layer 20 away from the substrate 10 and is attached to the antenna layer 20, and the insulating layer 30 exposes the connection end of the antenna layer 20, and the RFID chip 40 is fixed on a side of the insulating layer 30 away from the antenna layer 20 and is electrically connected to the connection end. The exposed portion of the insulating layer 30 is, for example, an electrical contact point 31, which is, for example, a contact hole, which can expose the first connection end 21 and the second connection end 22 of the antenna layer 20, or the RFID chip 40 is electrically connected to the first connection end 21 and the second connection end 22 respectively by passing a connecting wire through the contact hole. The antenna layer 20 is disposed on the back of the insulating layer 30, and the RFID chip 40 is disposed on the front of the insulating layer 30. By respectively arranging the antenna layer 20 and the RFID chip 40 on both sides of the insulating layer 30, insulation can be achieved between the RFID chip 40 and the antenna layer 20, and the RFID chip 40 is connected to the antenna layer 20 through a connecting wire, so that insulation and electrical connection between the antenna layer 20 and the RFID chip 40 can be achieved.

[0036] Among them, a hollow portion can be set on the insulating layer 30, and the hollow portion corresponds to a part of the circuit layer 12. The circuit layer includes, for example, a plurality of circuit structures made of metal, such as an arc-shaped circuit structure and an arrow-shaped circuit structure. Since the circuit layer is made of metal, the edge of the metal is prone to warping. In order to reduce the occurrence of warping of the metal circuit, a hollow portion is set so that the metal circuit can be partially exposed, and the edge of the metal circuit is just covered by the insulating layer 30, thereby reducing the occurrence of warping of the metal circuit.

[0037] Furthermore, if Figure 2As shown, there is a first gap 112 between the circuit layer 12 and the solid crystal area 11, and the antenna layer 20 is arranged in the first gap 112. By arranging the antenna layer 20 between the circuit layer 12 and the solid crystal area 11, the circuit layer 12 and the antenna layer 20 can be arranged on the back of the insulating layer 30, so that the antenna layer 20 does not need to be insulated from the insulating layer 30 by another layer of insulating material, so that the antenna layer 20 on the substrate 10 cannot be seen by naked eyes, which can further improve the anti-counterfeiting and traceability level of the LED packaging structure 1.

[0038] Furthermore, the solid crystal area 11 is provided with a plurality of LED chips 111, and the plurality of LED chips 111 are connected in various ways; the LED chips 111 are face-mounted LED chips, flip-chip LED chips or vertical LED chips, such as Figure 2 , Figure 4 and Figure 5 As shown, the plurality of LED chips 111 are upright LED chips, which are connected in series through connecting wires, wherein the first LED chip and the last LED chip in the plurality of LED chips are electrically connected to the circuit layer 12. The LED chip may be, for example, an upright LED chip, a flip-chip LED chip, or a vertical LED chip. In this embodiment, only the connection method of the upright LED chip is exemplified. In other embodiments, the LED chip may be a flip-chip LED chip or a vertical LED chip. The upright, flip-chip, or vertical LED chip may be flexibly set as a single setting or a mixed setting according to the needs, and the specific setting is not limited here.

[0039] Furthermore, if Figure 2 As shown, the RFID chip 40 is a normal-mounted RFID chip. The RFID chip 40 can be connected to the first connection end 21 and the second connection end 22 respectively through a metal wire 53, and the RFID chip 40 is fixed on the insulating layer 30. The RFID chip 40 can be fixed on the insulating layer 30, for example, by a conductive adhesive.

[0040] [Second embodiment]

[0041] like Figure 6 , Figures 8a to 8d As shown, this embodiment provides a method for preparing an LED packaging structure, and the method includes, for example:

[0042] S601, preparing a substrate, wherein a crystal bonding area and a circuit layer are distributed on the front side of the substrate, wherein an LED chip is arranged in the crystal bonding area, and the circuit layer is arranged around the crystal bonding area;

[0043] S602, disposing an antenna layer outside the crystal bonding area, and insulating the antenna layer from the substrate;

[0044] S603, placing a radio frequency identification chip next to the antenna layer, and insulating the radio frequency identification chip from the substrate; and electrically connecting the radio frequency identification chip to the antenna layer;

[0045] S604, printing and forming a colloidal dam layer enclosing the die-bonding area in a direction from the substrate toward the antenna layer, so that the colloidal dam layer covers the RFID chip and the antenna layer;

[0046] S605 , completing the die bonding of the LED wafer in the die bonding area in the colloidal dam layer so that the LED wafer is electrically connected to the circuit layer, and providing a sealing layer in the colloidal dam layer to cover the LED wafer.

[0047] The technical effects produced by the various structures in this embodiment can be referred to the specific description in the first embodiment, and will not be repeated here.

[0048] Furthermore, if Figure 7 As shown, after step S602, the method further includes:

[0049] S606, printing an insulating layer on a side of the antenna layer away from the substrate, and exposing a connection end of the antenna layer;

[0050] S607 , fixing the RFID chip on a side of the insulating layer away from the antenna layer, and making the RFID chip electrically connected to a connection end of the antenna layer.

[0051] In this embodiment, the steps S606 - S607 are performed after the antenna layer 20 is provided on the substrate 10 and before the RFID chip 40 is placed.

[0052] Specifically, in this embodiment, Figure 8a to Figure 8d Provide specific instructions.

[0053] First, prepare a substrate 10, for example, a flexible circuit board or a non-flexible circuit board can be selected as the substrate. Figure 8a As shown, a solid crystal area 11 and a metal circuit layer 12 are distributed on the front of the substrate 10, wherein a plurality of LED chips 111 are arranged in the solid crystal area 11, and the circuit layer 12 is arranged around the outer edge of the solid crystal area 11, and then an antenna layer 20 is arranged in a first gap 112 formed between the solid crystal area 11 and the circuit layer 12 of the substrate 10, and the antenna layer 20 is insulated from the substrate 10. The antenna layer 20 is a ring-shaped unclosed signal antenna, that is, the antenna layer 20 has an opening 24, and the two ends of the opening 24 of the antenna layer 20 are respectively a first connection end 21 and a second connection end 22.

[0054] Next, prepare the insulating layer 30, such as Figure 8b As shown, the position of the insulating layer 30 corresponding to the antenna layer 20 does not have a hollow portion, and a hollow portion is provided on the corresponding circuit layer 12. The insulating layer 30 is printed on the front side of the substrate 10 so that the insulating layer 30 and the antenna layer 20 are bonded together, so that the antenna layer 20 has insulation. At the same time, the hollow portion can expose part of the metal circuit layer, and the edge of the metal circuit layer is bonded to the insulating layer 30, so that the insulating layer 30 can prevent the metal circuit layer 12 from warping, and insulate the antenna layer 20 to prevent the antenna layer 20 from short-circuiting.

[0055] like Figure 8c As shown, the RFID chip 40 is fixed on the side of the insulating layer 30 away from the substrate 10 by insulating glue, and the RFID chip 40 is electrically connected to the first connection end 21 and the second connection end 22 through the electrical contact points 31 .

[0056] like Figure 8d As shown, a colloidal dam layer 51 is printed on the insulating layer 30 to enclose the solid crystal area 11 and cover the RFID chip 40 and the antenna layer 20; the solid crystal of the LED chip 111 is completed in the solid crystal area 11 in the colloidal dam layer 51 to complete the connection between multiple LED chips 111 and the electrical connection between the LED chip 111 and the circuit layer 12. At the same time, after the colloidal dam layer 51 is fixed and formed, a sealing layer 52 covering the LED chip 111 can be set in the colloidal dam layer 51 (that is, the cavity in the bowl-shaped structure) to provide reliable physical protection for the LED chip 111; the sealing layer 52 can be made of a sealing material, for example, and the sealing material can be formed by curing after mixing a packaging glue and a phosphor. When the sealing layer is a packaging glue, the packaging glue can be set in the colloidal dam layer 51 by, but not limited to, dispensing, spraying, printing, molding, etc. And the selected packaging glue can be a transparent glue or a translucent glue, or a luminescent conversion glue or other types of packaging glue. The packaging and assembly of the LED are completed to obtain the LED packaging structure 1.

[0057] The LED packaging structure 1 of this embodiment is formed by burying the antenna layer 20 under the insulating layer 30 and fixing the RFID chip 40 on the insulating layer 30. The RFID chip 40 is electrically connected to the antenna layer 20 through the electrical contact point 31 of the insulating layer 30. Then, a colloidal dam layer 51 is provided on the insulating layer 30. The colloidal dam layer 51 can cover the RFID chip 40 and the antenna layer 20. Thus, the colloidal dam layer 51 can be sealed together with the RFID chip 40 and the antenna layer 20. Since the dam glue of the colloidal dam layer 51 forms a dam with a The white colloid with reflective light function makes it difficult for the naked eye to identify the internal objects. The data in the RFID chip 40 can be read by a reader / writer, so as to determine the authenticity of the LED packaging structure 1 and trace the product of the LED packaging structure 1, thereby improving the traceability capability of the LED packaging structure 1. At the same time, the various structures of the LED packaging structure 1 can be constructed as a whole. When the colloid dam layer 51 and the RFID chip 40 are damaged artificially, the function of the entire LED packaging structure 1 will also be lost, thereby improving the anti-counterfeiting capability and level of the LED packaging structure 1.

[0058] [Third embodiment]

[0059] like Fig. 9 As shown, this embodiment provides an LED packaging structure 1, whose basic structure is basically similar to the LED packaging structure in the first embodiment, except that: the antenna layer 20 is arranged in the solid crystal area 11 and the radio frequency identification chip 40 is arranged in the solid crystal area 11,

[0060] Specifically, as shown in FIG. 8 , the LED package structure 1 includes, for example: a substrate 10 , an antenna layer 20 , a radio frequency identification chip 40 , a colloid dam layer 51 and a sealing layer 52 .

[0061] The substrate 10 is provided with a crystal-bonding area 11 and a circuit layer 12, wherein the crystal-bonding area 11 is provided with a plurality of LED chips 111, and the circuit layer 12 is arranged around the outer edge of the crystal-bonding area 11 and is electrically connected to the LED chips 111;

[0062] The antenna layer 20 is arranged in the solid crystal area 11 and is insulated from the substrate 10 and the LED chip 111 respectively, that is, the signal antenna included in the antenna layer 20 can be arranged in the gap between the multiple LED chips 111, and will not be electrically connected to the LED chips 111. The antenna layer 20 can be first arranged in the solid crystal area 11, and then the LED chip 111 is placed in the solid crystal area 11. In other embodiments, the LED chip 111 can also be placed in the solid crystal area 11 first, and then the antenna layer 20 is placed, and finally the electrical connection between the LED chips is achieved.

[0063] The RFID chip 40 is disposed on the solid crystal area 11 and is electrically connected to the antenna layer 20. The RFID chip 40 is insulated from the LED chip 111. The colloid dam layer 51 is disposed on a side of the substrate 10 close to the RFID chip 40 and surrounds the solid crystal area 11. The sealing layer 52 is disposed in the colloid dam layer 51 and seals the solid crystal area 11; the sealing layer 52 covers the RFID chip 40.

[0064] The sealing layer 52 may be made of a sealing material, for example, and the sealing material may be a packaging glue. When the sealing layer is a packaging glue, the packaging glue may be arranged in the colloid dam layer 51 by, but not limited to, dispensing, spraying, printing, molding, etc. The selected packaging glue is mixed with the phosphor and solidified to be a transparent or translucent colloid in yellow or orange. The LED packaging structure 1 of this embodiment buries the antenna layer 20 and the RFID chip 40 under the sealing layer 52, and the RFID chip 40 can be arranged in the solid crystal area 11, and the RFID chip 40 can be directly electrically connected to the antenna layer 20. Then, a colloidal dam layer 51 is first arranged above the substrate 10, and then a sealing layer 52 is arranged inside the colloidal dam layer 51, so that the antenna layer 20 and the RFID chip 40 are buried under the sealing layer 52. Since the sealing material of the sealing layer 52 is an opaque or translucent colored colloid, it is difficult for the naked eye to identify the LED wafer 111 and the RFID chip 40 in the packaged colloid, but the data in the RFID chip 40 can be read out by a reader / writer, so that the authenticity of the LED packaging structure 1 can be determined and the product of the LED packaging structure 1 can be traced, thereby improving the anti-counterfeiting and traceability capabilities of the LED packaging structure 1.

[0065] Furthermore, if Fig. 9 As shown, the LED packaging structure 1 further includes an insulating layer 30, which is disposed on a side of the antenna layer 20 away from the substrate 10 and adheres to the circuit layer 12; the insulating layer 30 exposes a portion of the circuit layer 12. Fig.13b As shown, the insulating layer 30 may be provided with a hollow portion, and the hollow portion corresponds to a portion of the circuit layer 12. The circuit layer, for example, includes a plurality of circuit structures made of metal, such as an arc-shaped circuit structure and an arrow-shaped circuit structure. Since the circuit layer is made of metal, the edge of the metal is prone to warping. In order to reduce the occurrence of warping of the metal circuit, the hollow portion is provided so that the metal circuit can be partially exposed, and the edge of the metal circuit is just covered by the insulating layer 30, thereby reducing the occurrence of warping of the metal circuit.

[0066] Furthermore, if Fig.10As shown, the antenna layer 20 may be, for example, a ring-shaped or folded-line structure, and is disposed around the LED chip 111. Thus, the sensing function and effect of the antenna layer 20 may be enhanced.

[0067] Furthermore, the antenna layer 20 may be, for example, a multi-circle ring or a folded line structure, thereby further improving the sensing function and effect of the antenna layer 20 .

[0068] Furthermore, if Fig.10 As shown, the antenna layer 20 includes a first connection end 21 and a second connection end 22, and a second gap is provided between the first connection end 21 and the second connection end 22, that is, the first connection end 21 is spaced from the second connection end 22. The RFID chip 40 can be electrically connected to the first connection end 21 and the second connection end 22 through a connecting wire.

[0069] Furthermore, if Fig.10 As shown, the RFID chip 40 is a normal-mounted RFID chip, and the RFID chip 40 is connected to the first connection end 21 and the second connection end 22 through a metal wire 53 .

[0070] Alternatively, the RFID chip 40 is a flip-chip RFID chip; Fig.11 As shown, the RFID chip 40 is welded to the first connection end 21 and the second connection end 22 by means of conductive adhesive.

[0071] [Fourth embodiment]

[0072] like Fig.12 , Figures 13a to 13c As shown, this embodiment provides a method for preparing an LED packaging structure, and the method includes, for example:

[0073] S701, preparing a substrate, wherein a crystal bonding area and a circuit layer are distributed on the front side of the substrate, wherein the crystal bonding area is provided with an LED chip, and the circuit layer is provided around the crystal bonding area;

[0074] S702, printing an antenna layer in the die-bonding area, and making the antenna layer insulated from the substrate and the LED chip respectively;

[0075] S703, placing a radio frequency identification chip on the die-bonding area, and insulating the radio frequency identification chip from the LED wafer;

[0076] S704, forming a colloidal dam layer enclosing the crystal bonding area around the crystal bonding area by printing;

[0077] S705 , completing the bonding of the LED chip in the bonding area within the colloidal dam layer so that the LED chip is electrically connected to the circuit layer, and forming a sealing layer covering the antenna layer and the RFID chip on the bonding area by printing.

[0078] Specifically, in this embodiment, Figure 13a to Figure 13c Provide specific instructions.

[0079] First, prepare a substrate 10, for example, a flexible circuit board or a non-flexible circuit board can be selected as the substrate. Fig.13a As shown, a solid crystal region 11 and a circuit layer 12 are distributed on the front side of the substrate 10, wherein the solid crystal region 11 is provided with a plurality of LED chips 111, the circuit layer 12 is arranged around the outer edge of the solid crystal region 11, and an antenna layer 20 is arranged in the solid crystal region 11. The antenna layer 20 is arranged in the solid crystal region 11 and is insulated from the LED chips.

[0080] like Fig.13b As shown, the RFID chip 40 is disposed in the die-bonding area 11 and fixed, and the RFID chip 40 is electrically connected to the first connection end 21 and the second connection end 22 on the antenna layer 20 through the metal wire 53, and the RFID chip 40 is insulated from the LED chip 111.

[0081] like Fig.13c As shown, a colloidal dam layer 51 is printed on the front side of the substrate 10 to enclose the solid crystal area 11; the solid crystal of the LED chip 111 is completed in the solid crystal area 11 in the colloidal dam layer 51, and the electrical connection between the multiple LED chips 111 and the electrical connection between the LED chip 111 and the circuit layer 12 are achieved. After the colloidal dam layer 51 is fixed and formed, a sealing layer 52 covering the LED chip 111 can be provided in the colloidal dam layer 51 (i.e., the cavity in the bowl-shaped structure), and the sealing layer 52 can provide reliable physical protection for the LED chip 111; the sealing layer 52 covers the antenna layer 20 and the radio frequency identification chip 40. The sealing layer 52 can be made of a sealing material, for example, and the sealing material can be a transparent or translucent colloid formed by mixing with fluorescent powder. When the sealing layer is a sealing glue, the way of providing the sealing glue in the colloidal dam layer 51 can be, but not limited to, dispensing, spraying, printing, molding, etc. The packaging glue used can be transparent glue or translucent glue, or can be luminescence conversion glue or other types of packaging glue, etc. The packaging and assembly of the LED are completed to obtain the LED packaging structure 1.

[0082] The LED packaging structure 1 of this embodiment buries the antenna layer 20 and the RFID chip 40 under the sealing layer 52. The RFID chip 40 can be set in the solid crystal area 11, and the RFID chip 40 can be directly connected to the first connection end 21 and the second connection end 22 of the antenna layer 20 through a connecting wire. Then, a colloid dam layer 51 is firstly set above the insulating layer 30, and then a sealing layer 52 is set in the colloid dam layer 51, and the antenna layer 20 and the RFID chip 40 are buried through the sealing layer 52. Since the sealing material of the sealing layer 52 is a transparent, translucent or opaque colloid, it is difficult for the naked eye to identify the internal objects. The data in the RFID chip 40 can be read by a reader / writer, so that the authenticity of the LED packaging structure 1 can be determined and the product of the LED packaging structure 1 can be traced, thereby improving the anti-counterfeiting ability and traceability ability of the LED packaging structure 1.

[0083] In addition, it can be understood that the aforementioned embodiments are only exemplary descriptions of the present invention. Under the premise that the technical features do not conflict, the structures do not contradict, and the purpose of the present invention is not violated, the technical solutions of the various embodiments can be arbitrarily combined and used in combination.

[0084] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An LED packaging structure (1), characterized in that: include: A substrate (10) is provided with a crystal-fixing area (11) and a circuit layer (12), wherein an LED chip (111) is provided in the crystal-fixing area (11), and the circuit layer (12) is arranged around the crystal-fixing area (11) and is electrically connected to the LED chip (111); An antenna layer (20) is located outside the crystal-fixing region (12) and is insulated from the substrate (10); a radio frequency identification chip (40) disposed on the substrate (10) and electrically connected to the antenna layer (20), the radio frequency identification chip (40) being insulated from the substrate (10); A colloidal dam layer (51) is arranged on a side of the substrate (10) facing the radio frequency identification chip (40) and surrounds the crystal bonding area (11); the colloidal dam layer (51) covers the radio frequency identification chip (40) and the antenna layer (20).

2. The LED packaging structure (1) according to claim 1, characterized in that: The antenna layer (20) is an annular structure and is arranged around the solid crystal area (11); or the antenna layer (20) includes a multi-ring annular structure (23) and is arranged around the solid crystal area (11).

3. The LED packaging structure (1) according to claim 2, characterized in that: An opening (24) is provided at one end of the antenna layer (20); and the radio frequency identification chip (40) is arranged at the opening (24).

4. The LED packaging structure (1) according to any one of claims 1 to 3, characterized in that: The LED packaging structure (1) further comprises an insulating layer (30), the insulating layer (30) being arranged on a side of the antenna layer (20) away from the substrate (10) and being in contact with the antenna layer (20), the insulating layer (30) exposing a connection end of the antenna layer (20), and the radio frequency identification chip (40) being fixed on a side of the insulating layer (30) away from the antenna layer (20) and being electrically connected to the connection end via a connecting wire.

5. The LED packaging structure (1) according to claim 1, characterized in that: A first gap (112) is provided between the circuit layer (12) and the crystal-fixing region (11), and the antenna layer (20) is arranged in the first gap (112).

6. An LED packaging structure (1), characterized in that: include: A substrate (10) is provided with a crystal-fixing area (11) and a circuit layer (12), wherein an LED chip is arranged in the crystal-fixing area, and the circuit layer (12) surrounds the crystal-fixing area (11) and is electrically connected to the LED chip (111); An antenna layer (20) is located in the crystal-fixing area (11) and is insulated from the substrate (10) and the LED chip (111) respectively; A radio frequency identification chip (40) is arranged on the die-bonding area (11) and is electrically connected to the antenna layer (20); the radio frequency identification chip (40) is insulated from the LED chip (111); A colloidal dam layer (51) is disposed on a side of the substrate (10) facing the radio frequency identification chip (40) and surrounds the crystal bonding area (11); A sealing layer (52) is disposed in the colloid dam layer (51) and seals the solid crystal region (11); the sealing layer (52) covers the radio frequency identification chip (40) and the antenna layer (20).

7. The LED packaging structure (1) according to claim 6, characterized in that: The antenna layer (20) is a ring-shaped structure and is disposed around the LED chip (111); or, the antenna layer (20) is a multi-ring ring-shaped structure and is disposed around the LED chip (111).

8. The LED packaging structure (1) according to any one of claims 6 to 7, characterized in that: The antenna layer (20) comprises a first connection end (21) and a second connection end (22), and a second gap is provided between the first connection end (21) and the second connection end (22); the radio frequency identification chip (40) is arranged on the second gap and is electrically connected to the first connection end (21) and the second connection end (22), respectively.

9. The LED packaging structure (1) according to claim 8, characterized in that: The radio frequency identification chip (40) is a normal-mounted radio frequency identification chip, and the radio frequency identification chip (40) is respectively connected to the first connection end (21) and the second connection end (22) via a metal wire (53), or; The radio frequency identification chip (40) is a flip-chip radio frequency identification chip, and the radio frequency identification chip (40) is welded to the first connection end (21) and the second connection end (22) by means of a conductive adhesive.

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