Composite resin for Topcon assembly packaging and preparation method and application thereof

Abstract

The invention relates to composite resin for packaging a Topcon component as well as a preparation method and application of the composite resin. Comprising an acrylate monomer, an aliphatic polyurethane acrylate oligomer, hydroxyl acrylate, bisphenol A acrylate, maleic anhydride modified epoxy acrylate, a light curing agent, a latent curing agent, a flame retardant A, a flame retardant B, a thixotropic agent, an anti-aging agent, a UV absorbent and a light stabilizer. The composite resin has the comprehensive performance of high viscosity, low shrinkage, super weather resistance and flame retardance, the aluminum-containing backboard prepared from the composite resin is high in water resistance and super weather resistance, due to the fact that light-heat double-stage curing is adopted for curing, the resin collapses and is cured to generate a solid phase, and in the follow-up aluminum foil hot-pressing curing process, the solid phase is solidified to form a solid phase; the resin is further infiltrated and cured, the porosity of the resin can be greatly reduced through a dual-curing system, water cannot enter the interior in the long-term use process, and voltage breakdown reduction of the aluminum-containing back plate under the long-term damp and hot condition is completely eradicated.

Description

Technical Field

[0001] The invention belongs to the technical field of lightweight flexible components, and in particular relates to a composite resin for Topcon component packaging, a preparation method and an application thereof. Background Art

[0002] Lightweight flexible components are widely used in construction, transportation and other fields because of their low requirements for the installation environment, light weight, and can be installed in scenes with limited load-bearing capacity. However, with the update and iteration of battery cell technology, PERC batteries are gradually being eliminated, and Topcon batteries are the mainstream in the current market. However, lightweight flexible Topcon battery components have higher requirements for the water-blocking performance of the packaging material, such as the use of PET with a coating on the front panel. The usual solution for the backplane is to add aluminum film, but in order to prepare high-rigidity lightweight flexible components, the backplane usually uses epoxy glass fiber composite materials or PP glass fiber composite materials. The composite materials containing glass fiber have different linear thermal expansion coefficients from aluminum. Therefore, after high and low temperature shock or long-term wet and hot aging, the aluminum film and epoxy resin layer will peel off, causing gaps and being broken down by high voltage. Under the requirement of symmetrical packaging, the aluminum film is best placed in the middle of the enhanced water-blocking backplane, which puts higher requirements on the porosity and reliability of the packaging material.

[0003] CN 116914009 A Modified polyethylene film through lamination, water barrier reaches <0.5g / (m 2 ·24h), the patent does not change the water permeability of PET film, and is suitable for PERC high water-blocking front film. CN 117317051 A achieves water blocking by evaporating PET layer and laminating polyolefin, but still cannot achieve 0 water-blocking backplane. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a composite resin for Topcon component packaging and a preparation method and application thereof, wherein the composite resin has the comprehensive properties of high viscosity, low shrinkage, super weather resistance and flame retardancy.

[0005] The present invention provides a composite resin for Topcon component packaging, which comprises the following components in parts by weight: 5-25 parts of acrylate monomer; 10-25 parts of aliphatic polyurethane acrylate oligomer; 20-30 parts of hydroxy acrylate; Bisphenol A acrylate 20-40 parts; Maleic anhydride modified epoxy acrylate 5-10 parts; 0.5~3 parts of light curing agent; 5-15 parts of latent curing agent; Flame retardant A 10-15 parts; Flame retardant B 5-10 parts; 2~4 parts of thixotropic agent; Anti-aging agent 0.3~0.8 parts; UV absorber 0.5~1 part; Light stabilizer 0.2~0.5 parts.

[0006] Preferably, the acrylic acid ester monomer is one or more of isobornyl methacrylate, tricyclodecane dimethanol diacrylate, and tricyclodecane dimethanol dimethacrylate.

[0007] Preferably, the hydroxy acrylate is one or more of 2-hydroxyethyl acrylate, hydroxypropyl methacrylate, and pentaerythritol triacrylate.

[0008] Preferably, the bisphenol A acrylate is one or more of ethoxylated bisphenol A dimethacrylate and ethoxylated bisphenol A methyl diacrylate.

[0009] Preferably, the preparation method of the maleic anhydride modified epoxy acrylate comprises the following steps: (1) reacting maleic anhydride (MA) and polyethylene glycol (PEG) at 70-80° C. for 100-120 min to obtain maleic acid polyethylene glycol monoester; (2) dissolving the epoxy resin and the maleic acid polyethylene glycol monoester obtained in step (1) in a toluene solution, adding a catalyst and an inhibitor, reacting at 95-100° C. for 0.5-1 h, and distilling under reduced pressure to obtain maleic anhydride-modified epoxy acrylate.

[0010] Furthermore, the polyethylene glycol in step (1) may be one of PEG200, PEG300 and PEG400, preferably PEG400.

[0011] Furthermore, the mass ratio of maleic anhydride to polyethylene glycol in step (1) is Mw(maleic anhydride)·1.05:Mw(polyethylene glycol), where Mw represents the weight average molecular weight.

[0012] Furthermore, the epoxy resin in step (2) is a bisphenol A epoxy resin having an epoxy value between 0.2 and 0.6.

[0013] Furthermore, the mass ratio of the epoxy resin to maleic acid polyethylene glycol monoester in the step (2) is 8-10:1.

[0014] Furthermore, the catalyst in step (2) is triethylamine, and the added amount is 2-3 wt % of the epoxy resin.

[0015] Furthermore, the polymerization inhibitor in step (2) is hydroquinone, and the amount added is 0.1-0.2 wt % of the entire reaction system.

[0016] Preferably, the photocuring agent is one or more of photocuring agent TPO and photocuring agent 184.

[0017] Preferably, the latent curing agent is an aliphatic blocked polyisocyanate.

[0018] Preferably, the flame retardant A is hexaphenoxycyclotriphosphazene.

[0019] Preferably, the flame retardant B is a DOPO derivative, such as DOPO-hydroquinone DOPO-phenyl vinyl phosphate, DOPO-bisphenol A, 10-(2,5-dihydroxyphenyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide.

[0020] Preferably, the thixotropic agent is silicon dioxide.

[0021] Preferably, the anti-aging agent is one or more of the hindered phenol anti-aging agents 1076, 1098, and 1010; the UV absorber is one or more of the triazine UV absorbers UV1164, UV1577, and UV400; and the light stabilizer is one or more of the benzotriazole light stabilizers UV1130 and UV928.

[0022] The present invention also provides a method for preparing a composite resin for Topcon component packaging, comprising the following steps: Add all components into a stirring kettle, raise the temperature to 40-60°C, and mix them evenly to obtain a composite resin for Topcon component packaging.

[0023] The present invention also provides an application of a composite resin for Topcon component packaging in the preparation of an aluminum-containing backplane.

[0024] Beneficial Effects (1) The composite resin of the present invention has the comprehensive properties of high viscosity, low shrinkage, super weather resistance and flame retardancy. The aluminum-containing backplane prepared by the composite resin of the present invention has high water resistance and super weather resistance. Since the curing adopts light-heat dual-stage curing, the resin first collapses and solidifies before producing a solid phase. In the subsequent hot pressing curing process with aluminum foil, the resin is further infiltrated and cured. The dual curing system can greatly reduce the porosity of the resin and prevent the voltage breakdown of the aluminum-containing backplane under long-term wet and hot conditions.

[0025] (2) The present invention reduces the shrinkage rate and linear thermal expansion coefficient of the material without reducing the cohesive energy. At the same time, in order to reduce the porosity, a wet system is used for production, and then a high water-resistant and super-weather-resistant backplane is prepared through lamination.

[0026] (3) The present invention uses maleic anhydride to modify epoxy acrylate, while retaining double bonds and some epoxy functional groups, which is reactive and can increase adhesion, thereby improving the adhesion between the composite resin and aluminum, so that the product will not delaminate when subjected to high and low temperature impacts on TC200 and PCT, resulting in a decrease in the product's voltage breakdown resistance. DETAILED DESCRIPTION

[0027] The present invention will be further described below in conjunction with specific embodiments. It should be understood that these embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention. In addition, it should be understood that after reading the content taught by the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms fall within the scope limited by the appended claims of the application equally.

[0028] Unless otherwise specified, the reagents, methods and equipment used in the present invention are conventional reagents, methods and equipment in the art.

[0029] The preparation method of maleic anhydride modified epoxy acrylate comprises the following steps: (1) reacting maleic anhydride (MA) and polyethylene glycol (PEG400) at 75°C for 100 min, wherein the mass ratio of MA to PEG is Mw(maleic anhydride)·1.05:Mw(polyethylene glycol), where Mw represents the weight average molecular weight, to obtain maleic acid polyethylene glycol monoester; (2) Dissolve bisphenol A epoxy resin E51 and maleic acid polyethylene glycol monoester obtained in step (1) in a toluene solution at a mass ratio of 9:1, add catalyst triethylamine (2 wt% of bisphenol A epoxy resin E51) and inhibitor hydroquinone (0.1 wt% of the entire reaction system), react at 95° C. for 1 h, and remove toluene by reduced pressure distillation to obtain maleic anhydride modified epoxy acrylate.

[0030] Table 1 Formula of composite resin for Topcon module encapsulation (parts by weight)

[0031] Table 2 Formula of composite resin for Topcon module encapsulation (parts by weight)

[0032] The embodiment provides a method for preparing an aluminum-containing backplane, comprising the following steps: (1) Add all components into a stirring tank, raise the temperature to 40°C, and mix them evenly to obtain a composite resin for Topcon module encapsulation; (2) Using a wet prepreg line, pass the glass fiber cloth through a glue tank, coat the top and bottom with the above composite resin, and enter the light curing area, using PET with silicone release on both sides; (3) Light curing uses LED, with an irradiation power of 2~3W / cm 2 , the temperature is controlled below 80°C, the line speed is 1-3m / min, the edge is cut and rolled up, the viscosity of the resin at 120°C is <3000mPa·s, and the prepreg is obtained; (4) Using an oil temperature press, 2 layers of the prepreg + 1 layer of aluminum foil + 2 layers of the prepreg are first evacuated in a vacuum mold, heated to 130° C. at 2 atm, and cured for 10 minutes to obtain an aluminum-containing backplane.

[0033] Table 3 Test data of aluminum back sheet in the embodiment

[0034] Table 4 Comparative Example Aluminum Back Sheet Test Data

Claims

1. A composite resin for Topcon module encapsulation, characterized in that: In parts by weight, it comprises the following components: 5-25 parts of acrylate monomer; 10-25 parts of aliphatic polyurethane acrylate oligomer; 20-30 parts of hydroxy acrylate; Bisphenol A acrylate 20-40 parts; Maleic anhydride modified epoxy acrylate 5-10 parts; 0.5~3 parts of light curing agent; 5-15 parts of latent curing agent; Flame retardant A 10-15 parts; Flame retardant B 5-10 parts; 2~4 parts of thixotropic agent; Anti-aging agent 0.3~0.8 parts; UV absorber 0.5~1 part; Light stabilizer 0.2~0.5 parts.

2. The composite resin according to claim 1, characterized in that: The acrylic acid ester monomer is one or more of isobornyl methacrylate, tricyclodecane dimethanol diacrylate, and tricyclodecane dimethanol dimethacrylate.

3. The composite resin according to claim 1, characterized in that: The hydroxy acrylate is one or more of 2-hydroxyethyl acrylate, hydroxypropyl methacrylate, and pentaerythritol triacrylate; the bisphenol A acrylate is one or more of ethoxylated bisphenol A dimethacrylate and ethoxylated bisphenol A methyl diacrylate.

4. The composite resin according to claim 1, characterized in that: The photocuring agent is one or more of photocuring agent TPO and photocuring agent 184; the latent curing agent is aliphatic blocked polyisocyanate.

5. The composite resin according to claim 1, characterized in that: The flame retardant A is hexaphenoxy cyclotriphosphazene; and the flame retardant B is a DOPO derivative.

6. The composite resin according to claim 1, characterized in that: The thixotropic agent is silicon dioxide.

7. The composite resin according to claim 1, characterized in that: The anti-aging agent is one or more of the hindered phenol anti-aging agents 1076, 1098, and 1010; the UV absorber is one or more of the triazine UV absorbers UV1164, UV1577, and UV400; and the light stabilizer is one or more of the benzotriazole light stabilizers UV1130 and UV928.

8. A method for preparing a composite resin for Topcon module encapsulation as claimed in claim 1, comprising the following steps: Add all components into a stirring kettle, raise the temperature to 40-60°C, and mix them evenly to obtain a composite resin for Topcon component packaging.

9. Use of the composite resin for Topcon module encapsulation as claimed in claim 1 in preparing an aluminum-containing backplane.

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