Fan

Abstract

The invention discloses a fan. The fan comprises a circuit board; the fan module is electrically connected with the circuit board and located at the air inlet; the temperature control module is electrically connected with the circuit board and communicates with the fan module, the temperature control module comprises at least one semiconductor chilling plate, a cold plate set and a hot plate set, the semiconductor chilling plate is provided with a cold area and a hot area which are oppositely arranged, the cold plate set is correspondingly arranged in the cold area of the semiconductor chilling plate, and the hot plate set is correspondingly arranged in the hot area of the semiconductor chilling plate; wherein the fan module is used for guiding air flow to the temperature control module, the air flow passes through a cold piece set located in a cold area and a hot piece set located in a hot area in the temperature control module to form cold air and hot air, the cold air and the hot air are exhausted through a cold air outlet and a hot air outlet which are arranged at intervals, effective separation of the cold air and the hot air can be achieved, and the refrigeration efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of fans, and in particular to a fan. Background Art

[0002] With the development of science and technology, people's pursuit of quality of life is increasing day by day, especially in the hot summer, the demand for cooling equipment is more urgent. Traditional fans can only bring a certain sense of coolness through air flow, but cannot achieve a real cooling effect. Summary of the invention

[0003] The embodiment of the present application provides a fan that can effectively separate cold air and hot air, thereby improving cooling efficiency.

[0004] An embodiment of the present application provides a fan, comprising:

[0005] Circuit boards;

[0006] A fan module electrically connected to the circuit board and located at the air inlet;

[0007] A temperature control module electrically connected to the circuit board is communicated with the fan module, the temperature control module includes at least one semiconductor refrigeration sheet, a cold sheet group and a hot sheet group, the semiconductor refrigeration sheet has a cold zone and a hot zone arranged oppositely, the cold sheet group is arranged correspondingly in the cold zone of the semiconductor refrigeration sheet, and the hot sheet group is arranged correspondingly in the hot zone of the semiconductor refrigeration sheet;

[0008] Among them, the fan module is used to guide the airflow to the temperature control module, and the airflow passes through the cold plate group located in the cold zone and the hot plate group located in the hot zone in the temperature control module to form cold air and hot air respectively, and the cold air and hot air are discharged through the cold air outlet and hot air outlet arranged at intervals respectively.

[0009] An embodiment of the present application provides a fan, comprising: a circuit board; a fan module electrically connected to the circuit board, located at an air inlet; a temperature control module electrically connected to the circuit board, communicated with the fan module, the temperature control module comprising at least one semiconductor refrigeration plate, a cold plate group and a hot plate group, the semiconductor refrigeration plate having a cold zone and a hot zone arranged relatively, the cold plate group being arranged correspondingly in the cold zone of the semiconductor refrigeration plate, and the hot plate group being arranged correspondingly in the hot zone of the semiconductor refrigeration plate; wherein the fan module is used to guide the airflow to the temperature control module, the airflow passes through the cold plate group located in the cold zone and the hot plate group located in the hot zone in the temperature control module to form cold air and hot air respectively, and the cold air and hot air are discharged through the cold air outlet and the hot air outlet arranged at intervals respectively. The fan provided in the embodiment of the present application adopts semiconductor refrigeration film technology, and the fan can directly convert the heat in the airflow between the cold zone and the hot zone, thereby generating cold air and hot air; the cold film group is correspondingly arranged in the cold zone of the refrigeration film, effectively absorbing and lowering the air temperature to form cold air; and the hot film group is arranged in the hot zone to dissipate the generated heat in time to avoid heat accumulation affecting the cooling effect. This design enables the fan to maintain efficient operation during the cooling process and quickly reduce the temperature of the surrounding environment; through the cold air outlet and hot air outlet arranged at intervals, it is ensured that the cold air and hot air are not mixed inside the fan, and are discharged independently, thereby realizing effective separation of cold air and hot air, improving cooling efficiency, and avoiding energy loss and discomfort caused by the mixing of cold and hot air, so that users can choose to blow cold air or hot air according to their needs to meet the usage requirements in different scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0011] Figure 1 A schematic diagram of the three-dimensional structure of the horizontal air intake method of the fan provided in an embodiment of the present application.

[0012] Figure 2 This is a cross-sectional view at FF of the horizontal air intake mode of the fan provided in an embodiment of the present application.

[0013] Figure 3 A front view of the horizontal air intake method of the fan provided in an embodiment of the present application.

[0014] Figure 4 A rear view of the horizontal air intake method of the fan provided in an embodiment of the present application.

[0015] Figure 5 A top view of the horizontal air intake method of the fan provided in an embodiment of the present application.

[0016] Figure 6 A bottom view of the horizontal air intake method of the fan provided in an embodiment of the present application.

[0017] Figure 7 A schematic diagram of the three-dimensional structure of the bottom air intake method of the fan provided in an embodiment of the present application.

[0018] Figure 8 This is a cross-sectional view taken at HH of the bottom air intake method of the fan provided in an embodiment of the present application.

[0019] Fig. 9 A front view of the bottom air intake method of the fan provided in an embodiment of the present application.

[0020] Fig.10 A rear view of the bottom air intake method of the fan provided in an embodiment of the present application.

[0021] Fig.11 A top view of the bottom air intake method of the fan provided in an embodiment of the present application.

[0022] Fig.12 A bottom view of the bottom air intake method of the fan provided in an embodiment of the present application. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0024] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0025] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0026] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0027] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can appreciate the application of other processes and / or the use of other materials.

[0028] For details, please refer to Figures 1 to 12 The embodiment of the present application provides a fan 100 , which includes a circuit board 10 , a fan module 20 and a temperature control module 30 .

[0029] The circuit board 10, as the core control component of the fan 100, is responsible for receiving and processing external operation instructions and / or signals from different components, and controlling the working states of the fan module 20 and the temperature control module 30 according to these signals. The circuit board 10 integrates necessary circuits and components, such as a processor, a drive circuit, a power management, etc., to ensure the stable operation of the entire fan 100.

[0030] The fan module 20 electrically connected to the circuit board 10 is located at the air inlet 40 .

[0031] For example, the main function of the fan module 20 is to introduce external air into the fan. The fan module 20 is powered and controlled by the circuit board 10, and the speed can be adjusted as needed to adjust the air volume. The fan module 20 may include a fan motor 21 and fan blades 22. When the fan motor 21 is started, the fan blades 22 rotate, thereby sucking in external air to form airflow A. The airflow A is guided to the temperature control module 30 under the action of the fan module 20 to achieve air circulation and heat exchange.

[0032] Among them, the temperature control module 30 electrically connected to the circuit board 10 is connected to the fan module 20. The temperature control module 30 includes at least one semiconductor refrigeration plate 31, a cold plate group 32 and a hot plate group 33. The semiconductor refrigeration plate 31 has a relatively set cold zone 301 and a hot zone 302. The cold plate group 32 is correspondingly arranged in the cold zone 301 of the semiconductor refrigeration plate 31, and the hot plate group 33 is correspondingly arranged in the hot zone 302 of the semiconductor refrigeration plate 31.

[0033] For example, the semiconductor refrigeration sheet 31 works based on the Beltier effect, which is a thermoelectric effect. When direct current passes through a couple formed by two different semiconductor materials in series, the two ends of the couple will absorb heat and release heat respectively, thereby achieving the purpose of cooling. The semiconductor refrigeration sheet 31 is composed of P-type and N-type semiconductor materials. When direct current passes through these materials, heat will be transferred from one end where the current flows into the other end, forming a cold zone 301 and a hot zone 302. When direct current passes, the cold zone 301 absorbs heat and the hot zone 302 releases heat. The cold plate group 32 is correspondingly arranged in the cold zone 301 of the semiconductor refrigeration sheet 31, and is used to enhance the cooling effect of the cold zone 301. The hot plate group 33 is correspondingly arranged in the hot zone 302 of the semiconductor refrigeration sheet 31, and is used to enhance the heat dissipation effect of the hot zone 302. The cold zone 301 and the hot zone 302 of the semiconductor refrigeration sheet 31 correspond to the cold plate group 32 and the hot plate group 33 respectively, so as to achieve the separation of cold and hot air flows.

[0034] In the application embodiment, the substrate of the semiconductor cooling sheet 31 can be made of metal with high thermal conductivity, such as copper (Cu) or silver (Ag), to replace the traditional ceramic (aluminum oxide) substrate. This choice can significantly improve the thermal utilization rate and enhance the cooling and heating effects.

[0035] Among them, the fan module 20 is used to guide the airflow A to the temperature control module 30. The airflow A passes through the cold plate group 32 located in the cold zone 301 and the hot plate group 33 located in the hot zone 302 in the temperature control module 30 to form cold air B and hot air C respectively. The cold air B and hot air C are discharged through the cold air outlet 50 and the hot air outlet 60 respectively arranged at intervals, thereby realizing the temperature control and airflow regulation functions of the fan 100.

[0036] In some embodiments, Figure 2 or Figure 8As shown, the fan 100 includes a gripping portion 70 and a ventilation portion 80 which are perpendicular to each other. The gripping portion 70 is used for being gripped by a user, and the temperature control module 30 is located in the ventilation portion 80 .

[0037] Among them, the holding portion 70 and the ventilation portion 80 of the fan 100 are perpendicular to each other. This design makes the fan 100 easy for the user to hold with one hand or both hands, while ensuring that the ventilation portion 80 has enough space to accommodate the temperature control module 30 and other components.

[0038] The design of the grip 70 takes the user's experience into full consideration, and its shape, size and material are carefully selected to ensure that the user can comfortably and firmly hold the fan 100. At the same time, the grip 70 may also be equipped with anti-slip, anti-sweat and other properties to further improve the user's comfort.

[0039] The ventilation part 80 is the core functional area of ​​the fan 100, which includes key components such as the fan module 20 and the temperature control module 30. The temperature control module 30 is located in the ventilation part 80 and works closely with the fan module 20 to jointly achieve airflow regulation and temperature control.

[0040] In some embodiments, Figures 1 to 6 In the fan 100 with horizontal air intake shown in the figure, the fan module 20 and the temperature control module 30 are horizontally arranged in the ventilation part 80, the hot zone 302 and the cold zone 301 of the semiconductor cooling plate 31 are arranged up and down, the air inlet 40 is located on one side of the ventilation part 80, and is used to guide the air flow A from the air inlet 40 to the cold zone 301 and the hot zone 302 of the semiconductor cooling plate 31, the cold air B generated in the cold zone 301 is discharged from the cold air outlet 50 on the other side of the ventilation part 80 opposite to the air inlet 40, and the hot air C generated in the hot zone 302 is discharged from the hot air outlet 60 at the upper part of the ventilation part 80.

[0041] Among them, the fan module 20 and the temperature control module 30 are arranged horizontally in the ventilation part 80. This layout not only makes the structure of the fan 100 more compact, but also helps to improve the circulation efficiency of the airflow and the accuracy of temperature control. The semiconductor cooling sheet 31 is the core component of the temperature control module 30, and its hot zone 302 and cold zone 301 are arranged up and down. This design utilizes the natural convection principle that hot air rises and cold air falls, which helps to further separate the cold air B and the hot air C, and improve the working efficiency of the fan 100.

[0042] The air inlet 40 is located on one side of the ventilation part 80. This position selection helps the user to hold the fan 100 without blocking the airflow. After the airflow A enters through the air inlet 40, it is guided by the fan module 20 to the cold zone 301 and the hot zone 302 of the semiconductor cooling plate 31 to achieve heat exchange. This layout allows the cold air B and the hot air C to be effectively discharged through different paths, thereby avoiding interference and mixing between the cold and hot air flows.

[0043] The cold air B generated in the cold zone 301 is discharged through the cold air outlet 50 on the other side opposite to the air inlet 40. This design helps the user to directly feel the blowing of the cold air B when holding the fan 100, providing the user with a cool blowing experience. The hot air C is discharged through the hot air outlet 60 on the upper part of the ventilation part 80, which not only avoids the accumulation of hot air C inside the fan 100 and affects the use effect, but also avoids the hot air C from blowing directly to the user, thereby improving the use experience. This design not only ensures the separation and effective discharge of cold and hot air flows, but also improves the heat dissipation efficiency of the fan and the user comfort.

[0044] In some embodiments, Figures 7 to 12 In the bottom air intake fan 100 shown, the air inlet 40 is located at the bottom of the holding portion 70, the fan module 20 is located inside the holding portion 70, the cold zone 301 of the semiconductor cooling plate 31 is arranged corresponding to the cold air outlet 50 on one side of the ventilation portion 80, and the hot zone 302 of the semiconductor cooling plate 31 is arranged corresponding to the hot air outlet 60 on the other side opposite to the ventilation portion 80. The fan module 20 guides the air flow A from the bottom of the holding portion 70 to the temperature control module 30 to form cold air B and hot air C respectively, and the cold air B and hot air C are discharged through the cold air outlet 50 and the hot air outlet 60 respectively.

[0045] The air inlet 40 is arranged at the bottom of the grip portion 70. This layout enables the fan 100 to naturally inhale air from below the user during operation, thereby increasing convenience and comfort of use.

[0046] The fan module 20 is located inside the grip 70. This layout not only saves space, but also effectively protects the fan drive components. The fan module 20 is responsible for generating and accelerating the airflow A, sucking it in from the air inlet 40, and discharging it after a series of treatments.

[0047] The cold zone 301 and the hot zone 302 of the semiconductor cooling sheet 31 correspond to the two sides of the ventilation part 80 respectively. This layout helps to effectively separate the cold air B and the hot air C. The cold zone 301 is close to the cold air outlet 50 on one side, and the hot zone 302 is close to the hot air outlet 60 on the other side, so that the cold and hot air flows do not interfere with each other when they are discharged.

[0048] The fan module 20 guides the airflow A from the air inlet 40 at the bottom of the grip 70 to the temperature control module 30, and the airflow is divided into cold air B and hot air C when passing through the semiconductor cooling sheet 31. This design ensures that the airflow can be evenly distributed after entering the temperature control module 30, thereby improving the cooling and heating efficiency.

[0049] The cold air B is discharged through the cold air outlet 50, and the hot air C is discharged through the hot air outlet 60. This design allows the user to feel the cold air B from one side and the hot air C from the other side when holding the fan 100. This layout avoids the mixing of cold and hot air flows, improves the heat dissipation efficiency of the fan, and avoids the hot air from blowing directly to the user, thereby improving the user experience.

[0050] In some embodiments, Figure 8 As shown, the fan 100 also includes a guide device 90 located between the fan module 20 and the temperature control module 30, and the guide device 90 is used to guide the airflow A to the cold zone 301 to form cold air B, or to guide the airflow A to the hot zone 302 to form hot air C.

[0051] Among them, the guide device 90 is located between the fan module 20 and the temperature control module 30. Its main function is to guide the flow direction of the airflow A inside the temperature control module 30 to ensure that the airflow can efficiently pass through the cold plate group 32 and the hot plate group 33 to form cold air B and hot air C.

[0052] In some embodiments, Figure 8 As shown, the guide device 90 includes a first guide plate 91, a second guide plate 92 and a third guide plate 93;

[0053] The first guide plate 91 is disposed adjacent to the cold air outlet 50 , and the air cavity between the first guide plate 91 and the cold plate group 32 forms a cold zone 301 ;

[0054] The second guide plate 92 is disposed adjacent to the hot air outlet 60 , and the air cavity between the first guide plate 91 and the heat plate group 33 forms a hot zone 302 ;

[0055] The third guide plate 93 is disposed at the lower end of the temperature control module 30 , one end of the third guide plate 93 is connected to the second guide plate 92 , and the other end of the third guide plate 93 extends to the air duct 71 of the grip portion 70 .

[0056] The first guide plate 91 is disposed adjacent to the cold air outlet 50, and cooperates with the air cavity between the cold plate groups 32 to form a cold zone 301. The design of the first guide plate 91 helps guide the airflow A to the cold plate groups 32, promotes heat exchange, and thus generates cold air B.

[0057] The second guide plate 92 is disposed adjacent to the hot air outlet 60, and cooperates with the air cavity between the heat plate group 33 to form a hot zone 302. The design of the second guide plate 92 helps guide the airflow A to the heat plate group 33, promotes the release of heat, and thus generates hot air C.

[0058] Among them, the third guide plate 93 is arranged at the lower end of the temperature control module 30, and its main function is to guide the airflow A in the air duct 71 of the grip portion 70 to flow to the cold zone 301 and the hot zone 302 more effectively. By accurately designing the shape and angle of the third guide plate 93, the distribution of the airflow can be optimized and the heat exchange efficiency can be improved. One end of the third guide plate 93 is connected to the second guide plate 92, and the other end extends to the air duct 71. This design helps to further separate the cold air B and the hot air C. By controlling the path of the airflow, the mixing between the cold and hot airflows can be reduced, thereby improving the purity of the cold air and the hot air.

[0059] In some embodiments, Figure 8 As shown, the third guide plate 93 is movably arranged. When the temperature control module 30 is turned on, the third guide plate 93 is turned on to guide the airflow A to the hot zone 302 to form hot air C, and the hot air C formed by guiding the hot zone 302 through the second guide plate 92 is discharged through the hot air outlet 60, and the cold air B formed by guiding the cold zone 301 through the first guide plate 91 is discharged through the cold air outlet 50; or

[0060] When the temperature control module 30 is turned off, the third guide plate 93 is closed to block the airflow A from entering the hot zone 302 , and the airflow A that enters the cold zone 301 alone through the first guide plate 91 is discharged through the cold air outlet 50 .

[0061] The movable setting of the third guide plate 93 gives the guide device 90 higher flexibility and energy efficiency management capabilities. This design not only allows the user to adjust the airflow path according to actual needs, but also optimizes the heat exchange efficiency in different working modes, further improving the intelligence of the device and user experience.

[0062] For example, when the temperature control module 30 is activated, the third guide plate 93 will automatically open to a predetermined position. This action ensures that the airflow A through the channel 71 can enter the hot zone 302 unimpeded. In the hot zone 302, the airflow A and the heat plate group 33 perform efficient heat exchange, thereby being heated to form hot air C. Subsequently, under the guidance of the second guide plate 92, the hot air C is safely and orderly discharged to the external environment through the hot air outlet 60, effectively avoiding the accumulation of heat inside the fan 100. At the same time, the third guide plate 93 continues to guide another part of the airflow A into the cold zone 301, in which the airflow A and the cold plate group 32 perform heat exchange and are cooled to form cold air B. Under the guidance of the first guide plate 91, the cold air B is discharged through the cold air outlet 50, providing a cooling effect for the fan 100 or the surrounding environment. This design ensures that the fan 100 can provide both cooling and heating functions during operation to meet the needs of a variety of application scenarios.

[0063] For example, when the temperature control module 30 is turned off, the third guide plate 93 will be closed accordingly or adjusted to a position that blocks the airflow A from entering the hot zone 302. This action effectively prevents unnecessary heat exchange, reduces energy waste, and helps to extend the service life of the equipment. While closing the third guide plate 93, the first guide plate 91 remains open and continues to guide the airflow A into the cold zone 301. This means that even if the temperature control module 30 is turned off as a whole, the device can still maintain a certain degree of cooling capacity. The cold air B discharged through the cold air outlet 50 can provide a continuous cooling effect for application scenarios that require a low temperature environment.

[0064] For example, the first guide plate 91 and the second guide plate 92 may be movably arranged. When the fan 100 is turned on, the first guide plate 91 and the second guide plate 92 are turned on, so that the cold air B formed by the first guide plate 91 guiding the cold zone 301 is discharged through the cold air outlet 50, and the hot air C formed by the second guide plate 92 guiding the hot zone 302 is discharged through the hot air outlet 60, providing the user with the required cooling effect. When the fan 100 is turned off, the first guide plate 91 and the second guide plate 92 are turned off to prevent foreign matter from falling into the fan 100, effectively blocking the passage for external foreign matter to enter the fan 100, protecting the internal structure and components of the fan 100, and extending the service life of the fan 100.

[0065] For example, the operation of the guide device 90 can be integrated with the intelligent control system of the fan 100, and the adjustment signal is received by the circuit board 10 to automatically adjust the states of the first guide plate 91, the second guide plate 92 and the third guide plate 93 to achieve the cold and hot air flow output required by the user.

[0066] In some embodiments, Figure 2 or Figure 8As shown, the fan 100 also includes a temperature detection module 110 electrically connected to the circuit board 10, which is used to detect the temperature of the hot zone 302. When the temperature detection module 110 detects that the temperature of the hot zone 302 is abnormal, the circuit board 10 controls the fan speed of the fan module 20 to reduce the temperature of the hot zone 302.

[0067] For example, the temperature detection module 110 may use a highly sensitive temperature sensor, such as a thermistor, a thermocouple or a digital temperature sensor, etc. These sensors can accurately capture the temperature changes of the hot zone 302, and convert these temperature changes into electrical signals and send them to the microprocessor or control unit on the circuit board 10. For example, the temperature detection module 110 can be set on the temperature control module 30, or be set adjacent to the temperature control module 30.

[0068] When the temperature detection module 110 detects that the temperature of the hot zone 302 exceeds the preset safety threshold or reaches an abnormally high temperature level, it will immediately send an alarm signal to the circuit board 10. The control logic on the circuit board 10 is then activated, and according to the received temperature data, the circuit board 10 can dynamically adjust the fan speed of the fan module 20. This adjustment process is intended to accelerate air flow by increasing the fan speed, thereby more effectively taking away the heat of the hot zone 302, achieving rapid cooling, and preventing possible equipment damage or performance degradation caused by overheating.

[0069] In addition, this intelligent temperature control mechanism can also include more complex algorithms for comprehensively judging and optimizing the fan speed adjustment strategy based on factors such as the rate of temperature change, the current ambient temperature, and the power consumption limit of the fan 100, so as to achieve the purpose of both effective heat dissipation and energy saving.

[0070] By integrating the temperature detection module 110, the fan 100 can not only monitor and respond to the temperature changes of the hot zone 302 in real time, but also maintain the thermal stability of the fan 100 by intelligently adjusting the fan speed, ensuring that the fan 100 operates in the best condition, extending its service life, and improving overall energy efficiency.

[0071] In some embodiments, Figure 2 or Figure 8 As shown, the fan 100 also includes a control switch 120 electrically connected to the circuit board 10, which is used to generate a control instruction in response to the control operation. The circuit board 10 controls the fan speed of the fan module 20 and / or the cooling capacity of the cold air B according to the control instruction.

[0072] For example, the control switch 120 may be disposed on the grip portion 70 . This design allows the user to conveniently perform control operations when holding the fan 100 without having to search for or touch control elements in other locations.

[0073] For example, the control switch 120 may adopt a knob structure, and the user adjusts the fan speed of the fan module 20 and / or the cooling capacity of the temperature control module 30 by rotating the knob. The knob provides intuitive feedback, and the user can perceive the current setting through the damping and scale of the knob.

[0074] When the user operates the control switch 120, it generates corresponding control instructions. These control instructions are sent to the circuit board 10 through the circuit connection. After receiving the control instructions, the circuit board 10 adjusts the fan speed of the fan module 20 and / or the cooling capacity of the temperature control module 30.

[0075] For example, the circuit board 10 controls the fan speed of the fan module 20 by changing the supply voltage or supply current of the fan module 20 according to the control instruction of the control switch 120. At the same time, the circuit board 10 can also control the cooling capacity of the cold air B by adjusting the current of the semiconductor cooling plate 31.

[0076] For example, the fan 100 may also be equipped with an external temperature sensor for real-time monitoring of the ambient temperature or the temperature of the hot zone 302. The circuit board 10 may intelligently adjust the fan speed according to the detection data of the external temperature sensor to achieve variable frequency speed regulation to maintain a suitable temperature difference.

[0077] In some embodiments, the fan 100 may also be equipped with a display screen or indicator light to provide feedback to the user on the current fan speed and cooling capacity setting, thereby providing interactivity to the user interface and enabling the user to clearly understand the working status of the fan.

[0078] By regulating the switch 120 , the user can adjust the working state of the fan 100 according to personal preference and actual needs to achieve a balance between energy saving and comfort.

[0079] For example, the control switch 120 can support the selection of multiple working modes, such as standard mode, energy-saving mode, strong mode, etc. The user can select the appropriate mode according to different usage scenarios.

[0080] By setting the control switch 120, the fan 100 not only provides a user-friendly control method, but also enhances the adaptability of the fan 100 and the user's experience through intelligent speed regulation and multi-mode selection.

[0081] In some embodiments, Figure 8 As shown, the fan 100 further includes an air intake splitter plate 130 located between the cold fin group 32 and the hot fin group 33 . The air intake splitter plate 130 is used to split the airflow A left from the fan module 20 to the cold fin group 32 and the hot fin group 33 .

[0082] The air inlet diverter plate 130 is located between the cold plate group 32 and the hot plate group 33. Its function is to evenly distribute the airflow A to the cold plate group 32 and the hot plate group 33 after the airflow A enters the temperature control module 30, ensuring that both receive an appropriate amount of airflow for effective heat exchange. The design of the air inlet diverter plate 130 helps to achieve even distribution of the airflow A between the cold plate group 32 and the hot plate group 33. This even distribution is very important for improving the cooling and heating efficiency because it ensures that the cold zone 301 and the hot zone 302 of the semiconductor cooling plate 31 can reach the best working state.

[0083] For example, the air intake splitter plate 130 may be made of a light and strong material, such as plastic or metal alloy, to ensure that it can withstand the airflow pressure while maintaining a relatively light weight.

[0084] The shape and size of the air inlet diverter plate 130 need to be precisely designed according to the internal structure and airflow requirements of the fan 100. For example, the air inlet diverter plate 130 may have a streamlined shape to reduce airflow resistance. For example, the air inlet diverter plate 130 may also be equipped with appropriate guide grooves or holes to ensure that the airflow can be evenly distributed to the cold plate group 32 and the hot plate group 33. For example, the air inlet diverter plate 130 may have a specific curved or bifurcated structure to guide the airflow to flow along a specific path.

[0085] The air inlet diverter plate 130 works in cooperation with the fan module 20 . The fan module 20 is responsible for introducing the airflow A into the temperature control module 30 , while the air inlet diverter plate 130 is responsible for further distributing the airflow A to the cold plate group 32 and the hot plate group 33 .

[0086] For example, the design of the air intake diverter plate 130 can also take into account the convenience of maintenance and cleaning. It can be easily disassembled so that the user can easily clean or inspect it.

[0087] For example, the air inlet diverter plate 130 may be movably arranged, allowing the air inlet diverter plate 130 to adjust its position or angle according to actual needs, thereby accurately controlling the airflow ratio flowing into the cold plate group 32 and the hot plate group 33 .

[0088] In order to achieve more intelligent air flow distribution, the air intake manifold plate 130 can receive signals from the control switch 120 or other sensors through the circuit board 10. Specifically, the user can select different working modes or set specific temperature values ​​through the control switch 120. After receiving these instructions, the circuit board 10 will calculate the optimal air flow distribution ratio according to a preset algorithm and control the air intake manifold plate 130 to move accordingly through a driving mechanism (such as a motor, an electromagnet, etc.).

[0089] In addition, if the fan 100 can also be equipped with other sensors (such as temperature sensors, humidity sensors, etc.), these sensors can monitor environmental parameters in real time and feed the data back to the circuit board 10. The circuit board 10 will further adjust the position of the air intake manifold 130 according to these real-time data to achieve more accurate and dynamic airflow distribution.

[0090] By automatically adjusting the position of the air intake manifold 130, the fan 100 can flexibly control the output ratio of cold air B and hot air C to meet the needs of users in different scenarios. For example, when more cold air is needed in summer, the circuit board 10 can drive the air intake manifold 130 to guide more airflow to the cold plate group 32; and when more hot air is needed in winter, more airflow can be guided to the hot plate group 33.

[0091] The circuit board 10 may receive a signal from the control switch 120 or other sensors to control the movement of the air intake diverter plate 130 to automatically adjust the air flow distribution to achieve the cold and hot air flow output required by the user.

[0092] By providing the air inlet diverter plate 130, the fan 100 can achieve more efficient and uniform airflow distribution, improve cooling and heating performance, and also provide users with a more comfortable and controllable use experience.

[0093] In some embodiments, Figure 2 or Figure 8 As shown, the fan 100 further includes a cooling switch 140 for turning on or off the temperature control module 30 .

[0094] For example, the cooling switch 140 can be conveniently arranged on the fan grip portion 70. Such a design enables the user to easily touch and operate the cooling switch while holding the fan, thereby improving the convenience and comfort of use.

[0095] For example, when the user presses the refrigeration switch 140, the circuit board 10 receives the start signal and starts the temperature control module 30. At this time, the semiconductor refrigeration sheet 31 starts to work, the cold zone 301 generates cold air B, and the hot zone 302 generates hot air C, which are discharged through the cold air outlet 50 and the hot air outlet 60 respectively, to achieve a cooling effect.

[0096] For example, when the user presses the cooling switch 140 again, the circuit board 10 receives the shutdown signal and then turns off the temperature control module 30. At this time, the semiconductor cooling sheet 31 stops working, no longer generates cold air and hot air, and the fan returns to a non-cooling state.

[0097] In some embodiments, Figure 2 or Figure 7 As shown, the fan 100 further includes a power switch 150 for turning the fan 100 on or off.

[0098] The power switch 150 allows the user to control the power state of the fan 100. By operating the power switch 150, the user can turn on the fan 100 to start working, or turn off the fan 100 to stop working and disconnect the power supply.

[0099] For example, the power switch 150 can be arranged on the gripping portion 70 so that the user can conveniently perform the switch operation when holding the fan 100. It can also be arranged at other easily accessible positions of the fan 100, such as the side of the ventilation portion 80, etc.

[0100] For example, the power switch 150 can be a button type, a slide type, or a rotary type, and the specific design should take into account the convenience of user operation and the aesthetics of the device. It can also provide clear feedback, such as touch or sound, to confirm the switch state.

[0101] Among them, the power switch 150 is electrically connected to the circuit board 10. When the user operates the power switch 150, it will send a signal to the circuit board 10. After receiving the signal, the circuit board 10 will control the power supply of the fan module 20 and the temperature control module 30.

[0102] In some embodiments, Figure 2 or Figure 8 As shown, the fan 100 further includes a power supply 160 for supplying power to the fan 100 .

[0103] The power supply 160 provides the required power for the fan 100. It may be powered by a built-in battery, an external power adapter, or a USB interface, depending on the design and usage scenario of the fan 100.

[0104] If the power source 160 is a built-in battery, the capacity of the battery will determine the life of the fan 100. The selection of the battery should take into account the power consumption of the fan 100 and the user's usage habits.

[0105] If the power source 160 is a rechargeable battery, the fan 100 may also include a charging circuit and a battery management system to ensure safe charging and effective management of the battery.

[0106] The design of the power supply 160 should take into account compatibility with different power adapters or charging devices, so that the user can charge the fan 100 in different environments.

[0107] For example, the fan 100 may include an energy-saving mode. When the power switch 150 is turned off or the battery power is low, the circuit board 10 may control the fan to enter a low-power state to extend the battery life.

[0108] The fan 100 of the embodiment of the present application is not only applicable to small portable products such as handheld fans, portable air conditioners, etc., but also to desktop products such as small desktop fans, computer radiators, etc. This wide range of application scenarios demonstrates the flexibility and practicality of the fan 100.

[0109] All of the above technical solutions can be arbitrarily combined to form optional embodiments of the present application, which will not be described in detail here.

[0110] The embodiment of the present application provides a fan 100, comprising: a circuit board 10; a fan module 20 electrically connected to the circuit board 10 and located at an air inlet 40; a temperature control module 30 electrically connected to the circuit board 10 and communicated with the fan module 20, the temperature control module 30 comprising at least one semiconductor refrigeration plate 31, a cold plate group 32 and a hot plate group 33, the semiconductor refrigeration plate 31 having a cold zone 301 and a hot zone 302 arranged opposite to each other, the cold plate group 32 being arranged correspondingly in the cold zone 301 of the semiconductor refrigeration plate 31, and the hot plate group 33 being arranged correspondingly in the hot zone 302 of the semiconductor refrigeration plate 31; wherein the fan module 20 is used to guide an airflow A to the temperature control module 30, the airflow A passes through the cold plate group 32 located in the cold zone 301 and the hot plate group 33 located in the hot zone 302 in the temperature control module 30 to form cold air B and hot air C respectively, and the cold air B and the hot air C are discharged respectively through the cold air outlet 50 and the hot air outlet 60 arranged at intervals. The fan provided in the embodiment of the present application adopts semiconductor refrigeration plate 31 technology. The fan can directly convert the heat in the airflow A between the cold zone 301 and the hot zone 302, thereby generating cold air B and hot air C; the cold plate group 32 is correspondingly arranged in the cold zone 301 of the refrigeration plate, effectively absorbing and lowering the temperature to form cold air B; and the hot plate group 33 is arranged in the hot zone 302 to dissipate the generated heat in time to avoid heat accumulation affecting the cooling effect. This design enables the fan to maintain efficient operation during the cooling process and quickly reduce the temperature of the surrounding environment; through the interval-arranged cold air outlet 50 and hot air outlet 60, it is ensured that the cold air B and the hot air C are not mixed inside the fan, and are discharged independently, thereby realizing effective separation of cold air B and hot air C, improving cooling efficiency, and avoiding energy loss and discomfort caused by the mixing of cold and hot air C, so that users can choose to blow cold air or hot air according to their needs to meet the usage requirements in different scenarios.

[0111] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0112] In the description of the embodiments of the present application, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0113] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A fan, characterized in that: include: Circuit boards; A fan module electrically connected to the circuit board and located at the air inlet; A temperature control module electrically connected to the circuit board is communicated with the fan module, the temperature control module includes at least one semiconductor refrigeration sheet, a cold sheet group and a hot sheet group, the semiconductor refrigeration sheet has a cold zone and a hot zone arranged oppositely, the cold sheet group is arranged correspondingly in the cold zone of the semiconductor refrigeration sheet, and the hot sheet group is arranged correspondingly in the hot zone of the semiconductor refrigeration sheet; Among them, the fan module is used to guide the airflow to the temperature control module, and the airflow passes through the cold plate group located in the cold zone and the hot plate group located in the hot zone in the temperature control module to form cold air and hot air respectively, and the cold air and hot air are discharged through the cold air outlet and hot air outlet arranged at intervals respectively.

2. The fan according to claim 1, characterized in that The fan comprises a gripping portion and a ventilation portion which are perpendicular to each other, the gripping portion is used for being gripped by a user, and the temperature control module is located in the ventilation portion.

3. The fan according to claim 2, characterized in that The fan module and the temperature control module are horizontally arranged in the ventilation part, the hot zone and the cold zone of the semiconductor refrigeration plate are arranged up and down, the air inlet is located on one side of the ventilation part, and is used to guide the airflow from the air inlet to the cold zone and the hot zone of the semiconductor refrigeration plate, the cold air generated in the cold zone is discharged from the cold air outlet on the other side of the ventilation part opposite to the air inlet, and the hot air generated in the hot zone is discharged from the hot air outlet on the upper part of the ventilation part.

4. The fan according to claim 2, characterized in that: The air inlet is located at the bottom of the holding portion, the fan module is located inside the holding portion, the cold zone of the semiconductor refrigeration plate corresponds to the cold air outlet on one side of the ventilation portion, and the hot zone of the semiconductor refrigeration plate corresponds to the hot air outlet on the other side of the ventilation portion. The fan module guides the airflow from the bottom of the holding portion to the temperature control module to form cold air and hot air respectively, and the cold air and hot air are discharged through the cold air outlet and the hot air outlet respectively.

5. The fan according to claim 4, characterized in that The fan further comprises a flow guiding device located between the fan module and the temperature control module, wherein the flow guiding device is used to guide the airflow to a cold zone to form cold air, or to guide the airflow to a hot zone to form hot air.

6. The fan according to claim 5, characterized in that The guide device comprises a first guide plate, a second guide plate and a third guide plate; The first guide plate is disposed adjacent to the cold air outlet, and the air cavity between the first guide plate and the cold plate group forms the cold zone; The second guide plate is disposed adjacent to the hot air outlet, and the air cavity between the first guide plate and the heat plate group forms the hot zone; The third guide plate is arranged at the lower end of the temperature control module, one end of the third guide plate is connected to the second guide plate, and the other end of the third guide plate extends to the air duct of the gripping part.

7. The fan according to claim 6, characterized in that The third guide plate is movably arranged. When the temperature control module is turned on, the third guide plate is turned on to guide the airflow to the hot zone to form hot air, and the hot air formed in the hot zone is guided by the second guide plate to be discharged through the hot air outlet, and the cold air formed in the cold zone is guided by the first guide plate to be discharged through the cold air outlet; or When the temperature control module is turned off, the third guide plate is closed to block the airflow from entering the hot zone, and the airflow that enters the cold zone alone through the first guide plate is discharged through the cold air outlet.

8. The fan according to any one of claims 1 to 7, characterized in that: The fan also includes a temperature detection module electrically connected to the circuit board for detecting the temperature of the hot zone. When the temperature detection module detects that the temperature of the hot zone is abnormal, the circuit board controls the fan speed of the fan module to reduce the temperature of the hot zone.

9. The fan according to any one of claims 1 to 7, characterized in that: The fan also includes a control switch electrically connected to the circuit board, which is used to generate a control instruction in response to a control operation, and the circuit board controls the fan speed of the fan module and / or the cooling capacity of the cold air according to the control instruction.

10. The fan according to any one of claims 1 to 7, characterized in that: The fan further comprises an air intake splitter plate located between the cold fin group and the hot fin group, wherein the air intake splitter plate is used to split the airflow left from the fan module to the cold fin group and the hot fin group.

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