Propeller-assisted immersed liquid cooling heat dissipation device for data center cabinet

Abstract

The invention discloses a propeller-assisted immersed liquid cooling heat dissipation device for a data center cabinet. The propeller-assisted immersed liquid cooling heat dissipation device comprises the structural design of a heat sink and a propeller and the combined design and arrangement deformation of the heat sink and the propeller. The heat sink is used for increasing the heat dissipation area of the chip, the thruster is arranged on the front portion or the rear portion of a heat sink fin, and the thruster accelerates a local flow field by generating suction force and thrust force in cooling liquid, so that the heat dissipation strengthening effect is achieved. Aiming at different types of heat dissipation, noise, vibration and energy consumption requirements, the invention comprises a plurality of design and assembly modes of propellers and heat sinks; wherein the designed parameters comprise the total arrangement number of the heat sink-propeller combination in the server, the relative positions of the propellers and the heat sinks, the body structure design of the propellers and the heat sinks and the number of the propellers matched with the single heat sinks. According to the invention, the single-phase immersion liquid cooling has higher heat dissipation capability, the use scene of the single-phase immersion liquid cooling in the cooling of the high-power chip server is expanded, the installation is simple and convenient, and the server does not need to be greatly changed.

Description

Technical Field

[0001] The present invention belongs to the technical field of servers, and in particular relates to a thruster-assisted immersed liquid cooling device for a data center cabinet. Background Art

[0002] With the development trend of chip miniaturization and high power, the chips with smaller process technology bring performance improvement while also bringing the problem of high heat flux heat dissipation. Nowadays, the problem of high heat flux heat dissipation has become a difficult problem to be solved in the academic and engineering fields. Studies have shown that when the operating temperature of electronic devices reaches 70-80℃, the reliability decreases by about 5% for every 1℃ increase in temperature. Statistics show that more than 55% of electronic equipment damage is caused by thermal runaway. The current air cooling technology can no longer meet the growing demand for heat dissipation and energy consumption of electronic equipment. Liquid cooling technology represented by immersion cooling is widely used in thermal management in fields such as data center servers, personal computers, high-energy lasers, and phased array radars, and has shown good heat dissipation and energy saving effects. Single-phase immersion liquid cooling mainly controls the temperature of electronic devices through convective heat transfer of liquid. Due to the insulation requirements, the commonly used immersion liquid cooling fluids are mainly cooling oil and fluorinated liquids. Compared with water, these fluids have higher viscosity and lower thermal conductivity. As the computing power requirements of the central processing unit (CPU) and graphic processing unit (GPU) in immersion liquid cooling servers, especially artificial intelligence and big data, increase, the chip power and server power consumption will increase significantly, resulting in local hot spots in immersion liquid cooling servers. If the local hot spots are eliminated by increasing the overall flow rate of the coolant, the pump work will be greatly increased and the system energy efficiency will be reduced. Therefore, there is an urgent need for local hot spot heat dissipation enhancement technology. Summary of the invention

[0003] In order to overcome the shortcomings of the prior art, the present invention provides a thruster-assisted data center cabinet immersion liquid cooling device, including the structural design of the heat sink and the thruster itself, as well as their combined design and arrangement deformation. The heat sink is used to increase the heat dissipation area of ​​the chip. The thruster is arranged at the front or rear of the heat sink fin. The thruster accelerates the local flow field by generating suction and thrust in the coolant to achieve the effect of enhanced heat dissipation. In response to different types of heat dissipation, noise, vibration and energy consumption requirements, the present invention includes a variety of design and assembly methods for thrusters and heat sinks, wherein the parameters designed by the present invention include: the overall arrangement number of the heat sink-thruster combination in the server, the relative position of the thruster and the heat sink, the thruster and heat sink body structure design, and the number of thrusters matched with a single heat sink. The present invention enables single-phase immersion liquid cooling to have a higher heat dissipation capacity, expands its use scenarios in the cooling of high-power chip servers, is easy to install and does not require major changes to the server.

[0004] The technical solution adopted by the present invention to solve the technical problem is as follows:

[0005] A propeller-assisted data center cabinet immersion liquid cooling device comprises a heat sink and a propeller; the propeller comprises a propeller blade, a propeller hub and a duct;

[0006] The bottom of the heat sink is in close contact with the heat source;

[0007] The propeller is placed at the end of the fin of the heat sink;

[0008] The propeller blades are installed in the duct, and the hub is used to fix the propeller blades.

[0009] Furthermore, the propeller is placed in front of the fins of the heat sink.

[0010] Furthermore, the propeller is placed behind the fins of the heat sink.

[0011] Furthermore, the heat sink is a heat sink that expands the heat dissipation area through fins.

[0012] Furthermore, the heat sink is a heat sink combined with a vapor chamber temperature equalizer VC.

[0013] Furthermore, the heat sink and the thruster may be combined and arranged at multiple locations where hot spots are generated in the immersion liquid-cooled server.

[0014] Furthermore, the conduit is a circular conduit.

[0015] Furthermore, the conduit is a rectangular conduit.

[0016] Furthermore, the heat sink can be matched with multiple thrusters.

[0017] Furthermore, the propeller blades are right-handed propeller blades or left-handed propeller blades.

[0018] Furthermore, a plurality of propeller blades may be installed in the duct.

[0019] The beneficial effects of the present invention are as follows:

[0020] 1. The suction or thrust generated by the propeller rotation can accelerate the flow of liquid between the heat sink fins, strengthen the convective heat transfer on the heat sink surface, improve the local heat transfer conditions, and eliminate or weaken local hot spots;

[0021] 2. Compared with increasing the overall flow rate of the coolant in the data center cabinet to eliminate hot spots, the thruster's auxiliary enhanced heat dissipation is highly targeted and has high energy conversion efficiency, which can significantly reduce the energy consumption required to eliminate hot spots;

[0022] 3. The present invention enables single-phase immersion liquid cooling to have higher heat dissipation capacity, expands its application scenarios in high-power chip server cooling, is easy to install and does not require major changes to the server. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the arrangement of multiple heat sink-thruster combinations in an immersion liquid-cooled server cabinet.

[0024] Figure 2 It is a schematic diagram of the structure of the heat sink-thruster combination.

[0025] Figure 3 It is a schematic diagram of the relative positions of the thruster and the heat sink.

[0026] Figure 4 It is a schematic diagram of different thruster body structure designs.

[0027] Figure 5 This is a schematic diagram of a single heat sink matching different numbers of thrusters.

[0028] Figure 6 It is a schematic diagram of the heat sink-thruster combination design.

[0029] In the figure: 1-thruster, 2-heat sink, 3-power supply compartment, 4-power supply, 5-memory bar, 6-external device and hard disk compartment, 7-high-power chip, 8-coolant outlet, 9-duct, 10-propeller blade, 11-hub, 12-circular duct, 13-right-hand blade, 14-rectangular duct, 15-left-hand blade. DETAILED DESCRIPTION

[0030] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0031] The present invention proposes a thruster-assisted data center cabinet immersion liquid cooling heat dissipation solution, which reduces and eliminates local hot spots of the server without significantly increasing the system cooling energy consumption, and realizes efficient thermal management of high-power servers. The proposed thruster-assisted data center cabinet immersion liquid cooling heat dissipation solution includes a thruster and a heat sink. The heat sink is used to increase the heat dissipation area of ​​the chip. The thruster is arranged in front of or behind the heat sink fins. The thruster generates suction and thrust in the coolant to accelerate the local flow field, thereby achieving the effect of enhancing heat dissipation.

[0032] The present invention discloses a thruster-assisted immersion liquid cooling solution for a data center cabinet, comprising a heat sink and a thruster. The bottom of the heat sink is close to the heat source, and the thruster is arranged in front of or behind the heat sink fins. The thruster generates suction and thrust in the coolant to accelerate the local flow field, thereby achieving the effect of strengthening heat dissipation and eliminating local hot spots.

[0033] The bottom surface of the heat sink is close to the heat source of the server, the propeller is placed in front of or behind the heat sink, and the propeller is close to the fins of the heat sink or keeps a certain distance.

[0034] The thruster is similar to the propeller thrusters of ships and underwater vehicles, and its structural parameters can be designed according to the needs of the immersion liquid-cooled server.

[0035] The heat sink can be an ordinary heat sink that simply expands the heat dissipation area through fins, or it can be a heat sink combined with a vapor chamber (VC).

[0036] The fins improve the heat dissipation effect by expanding the heat exchange area of ​​the heat sink. They can be used for ordinary heat sinks as well as for VC cold ends.

[0037] The steam chamber temperature plate uses the latent heat of phase change of the liquid inside the VC to diffuse the heat of the server hotspot to a larger area, and then finally takes away the heat of the server hotspot through convection heat transfer between the cold end of the VC and the coolant.

[0038] The combination of heat sinks and thrusters can be placed at multiple locations in immersion liquid-cooled servers where hot spots are likely to occur.

[0039] Example:

[0040] Figure 1 Schematic diagram of heat sink-thruster combination on the motherboard of immersion liquid cooling server, Figure 2 The structural diagram of the heat sink-propeller combination is shown. The heat sink-propeller combination is mainly composed of a propeller 1 and a heat sink 2, wherein the heat sink 2 is used to increase the heat dissipation area of ​​the chip, and can be an ordinary heat sink that simply expands the heat dissipation area through fins, or a heat sink combined with VC, and the propeller 1 is composed of propeller blades 10, a hub 11 and a duct 9. In response to different types of heat dissipation, noise, vibration and energy consumption requirements, the present invention includes a variety of design and assembly methods for propellers and heat sinks, wherein the design parameters of the present invention include: the overall arrangement number of the heat sink-propeller combination in the server, the relative positions of the propeller and the heat sink, the propeller and heat sink body structure design, and the number of propellers matched with a single heat sink. Figure 3 is a schematic diagram of the relative positions of the thruster and the heat sink. Figure 4 This is a schematic diagram of the thruster body structure design. Figure 5 This is a schematic diagram of a single heat sink matching different numbers of thrusters.

[0041] Specifically, Figure 3 As shown, the propeller 1 can be arranged in front of or behind the heat sink 2, and the propeller 1 can be close to the fins of the heat sink 2 or keep a certain distance. Figure 4 As shown, the main structure of the propeller 1 can be changed according to different needs, such as changing the circular conduit 12 into a rectangular conduit 14. Figure 5As shown, the number of propellers 1 matched with a single heat sink 2 can be changed as needed, such as changing the scheme of matching a single heat sink 2 with a single propeller 1 to a scheme of matching two propellers 1 with a single heat sink; at the same time, the rotation direction of the propeller blades 10 can also be changed as needed, such as changing the right-handed blades 13 to the left-handed blades 15; the rotation mode of the propeller blades 10 can also be changed according to actual conditions, such as the two propeller blades 10 rotating at the same time or in opposite directions, and the opposite rotation mode is inward or outward, etc. Figure 6 As shown, the above design parameters can be changed individually or in multiples at the same time according to actual needs to form a new heat sink-thruster combination design scheme.

Claims

1. A thruster-assisted data center cabinet immersion liquid cooling device, characterized in that: It includes a heat sink and a propeller; the propeller includes propeller blades, a hub and a duct; The bottom of the heat sink is in close contact with the heat source; The propeller is placed at the end of the fin of the heat sink; The propeller blades are installed in the duct, and the hub is used to fix the propeller blades.

2. The thruster-assisted data center cabinet immersion liquid cooling device according to claim 1 is characterized in that: The propeller is placed in front of the fins of the heat sink.

3. The thruster-assisted data center cabinet immersion liquid cooling device according to claim 1 is characterized in that: The propeller is placed behind the fins of the heat sink.

4. The thruster-assisted data center cabinet immersion liquid cooling device according to claim 1 is characterized in that: The heat sink is a heat sink that expands the heat dissipation area through fins.

5. The thruster-assisted data center cabinet immersion liquid cooling device according to claim 1, characterized in that: The heat sink is a heat sink combined with a vapor chamber and a temperature equalizing plate VC.

6. The thruster-assisted data center cabinet immersion liquid cooling device according to claim 1, characterized in that: The heat sink and thruster combination can be arranged at multiple locations where hot spots are generated in the immersion liquid cooling server.

7. The thruster-assisted data center cabinet immersion liquid cooling device according to claim 1, characterized in that: The conduit is a circular conduit or a rectangular conduit.

8. The thruster-assisted data center cabinet immersion liquid cooling device according to claim 1, characterized in that: The heat sink can be matched with multiple thrusters.

9. The thruster-assisted data center cabinet immersion liquid cooling device according to claim 1, characterized in that: The propeller blades are right-handed propeller blades or left-handed propeller blades.

10. The thruster-assisted data center cabinet immersion liquid cooling device according to claim 1, characterized in that: A plurality of propeller blades may be mounted in the duct.

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