Defect detection equipment for connecting plate chip

Abstract

The invention relates to the technical field of chip defect detection, in particular to a connecting plate chip defect detection device which comprises a mounting plate, a feeding and discharging mechanism, a transfer mechanism, a detection table and a defect detection mechanism, and the feeding and discharging mechanism, the transfer mechanism, the detection table and the defect detection mechanism are arranged on the mounting plate. A plurality of materials which are arranged along a Z-axis array are arranged in the feeding and discharging mechanism; the feeding and discharging mechanism can drive the multiple materials to synchronously move along the Z axis. A first clamping jaw is arranged on the transfer mechanism and can clamp or loosen materials; the transfer mechanism can move along the Y axis and the Z axis so as to transfer materials between the feeding and discharging mechanism and the detection table. The detection table can move along an X axis and a Y axis; the defect detection mechanism can move along the Z axis; the defect detection mechanism can perform defect detection on the material placed on the detection table; after the defect detection of one material is completed every time, the feeding and discharging mechanism enables the multiple materials to synchronously and unidirectionally move by a set distance along the Z axis, and the set distance is the distance between the top faces of the adjacent materials.

Description

Technical Field

[0001] The present invention relates to the technical field of chip defect detection, and particularly to a defect detection device for a multi-chip module (MCM) chip. Background Art

[0002] During the manufacturing, transportation and other processes of chips, wire bonding defects and appearance defects may occur. Therefore, it is necessary to detect the defects of chips through manual or defect detection equipment to prevent defective products from flowing out.

[0003] Existing chip defect detection equipment generally transfers chips by means of a suction nozzle. However, the MCM chip is relatively large in size and heavy in weight. Therefore, the effect of adsorbing the MCM chip by the suction nozzle is poor. In addition, the existing chip defect detection equipment places multiple MCM chips flat on a tray. On the one hand, the occupied space of the tray is relatively large. On the other hand, gold wires are arranged on the end face of the MCM chip, and the adsorption position of the suction nozzle on the end face of the MCM chip is limited, making adsorption inconvenient, and ultimately resulting in poor adsorption stability of the suction nozzle to the chip. Summary of the Invention

[0004] (1) Technical Problems to be Solved

[0005] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a defect detection device for an MCM chip, which solves the technical problem of poor adsorption stability of the existing defect detection device for an MCM chip to the chip.

[0006] (2) Technical Solutions

[0007] To achieve the above object, the defect detection device for an MCM chip of the present invention includes a mounting plate, and a loading and unloading mechanism, a transfer mechanism, a detection table and a defect detection mechanism arranged on the mounting plate;

[0008] There are a plurality of materials arranged in an array along the Z-axis inside the loading and unloading mechanism; the loading and unloading mechanism can drive the plurality of materials to move synchronously along the Z-axis;

[0009] A first jaw is arranged on the transfer mechanism, and the first jaw can clamp or release the material; the transfer mechanism can move along the Y-axis and the Z-axis to transfer the material between the loading and unloading mechanism and the detection table;

[0010] The detection table can move along the X-axis and the Y-axis; the defect detection mechanism can move along the Z-axis; the defect detection mechanism can detect the defects of the material placed on the detection table;

[0011] Wherein, after the defect detection of each material is completed, the loading and unloading mechanism moves the plurality of materials synchronously along the Z-axis in a one-way manner by a set distance, and the set distance is the distance between the top surfaces of adjacent materials.

[0012] Optionally, the loading and unloading mechanism includes a lifting bracket, a gripper, a pusher, and a cartridge box;

[0013] The lifting bracket and the gripper are both arranged on the mounting plate; the gripper is mounted on the lifting bracket, and the two are slidably connected along the X-axis; the gripper can grip or release the cartridge box;

[0014] A cavity penetrating along the Y-axis is formed inside the cartridge box; a plurality of the materials are embedded in the wall surface of the cavity, and the two are slidably connected along the Y-axis; the pusher is arranged at one end of the cavity and can push the material to move along the Y-axis in the cavity; the first jaw can pick up or unload materials at the other end of the cavity.

[0015] Optionally, the defect detection device further includes a frame; the mounting plate is arranged on the top of the frame;

[0016] An avoidance groove is formed on the mounting plate; the cartridge box can move along the Z-axis and pass through the avoidance groove into the interior of the frame.

[0017] Optionally, the gripper includes a material table, a second jaw, and a baffle;

[0018] The sliding table of the lifting bracket is connected to the material table; the bottom end of the cartridge box is clamped to the top end of the material table; the second jaw can move along the X-axis so as to be able to abut against the side surface of the material;

[0019] The baffle is connected to the material table; the cartridge box can be clamped between the baffle and the sliding table.

[0020] Optionally, the baffle and the material table are hinged around the Y-axis.

[0021] Optionally, a push block is arranged on the pusher;

[0022] The push block can move along the Y-axis and abut against the side surface of the material.

[0023] Optionally, the transfer mechanism further includes a slide rail, a slider, a lifter, and a connecting plate;

[0024] The slide rail is mounted on the mounting plate; the slider is mounted on the slide rail, and the two are slidably connected along the Y-axis;

[0025] The lifter is mounted on the slider; one end of the connecting plate is connected to the push rod of the lifter, and the other end is connected to the first jaw; the lifter can drive the connecting plate to move along the Z-axis.

[0026] Optionally, the inspection table includes a cross slide, a rotator, an inspection table, and a fixture;

[0027] The cross slide is mounted on the mounting plate; the fixture is mounted on the cross slide, and the cross slide can drive the fixture to move along the X-axis and the Y-axis;

[0028] The rotating shaft of the rotator is connected to the inspection table and can drive the inspection table to rotate;

[0029] The fixture is mounted on the inspection table; a through groove is formed in the inspection table in its thickness direction; the fixture can clamp the material in the through groove.

[0030] Optionally, there is a pair of parallel stepped grooves on the inspection table; the material is suspended and clamped between the pair of stepped grooves;

[0031] An installation groove is formed in the inspection table; the through groove, the stepped groove, and the installation groove communicate with each other; the fixture is embedded in the installation groove; the pressing block of the fixture can abut against the side surface of the material.

[0032] Optionally, the defect detection mechanism includes a 3D camera, a high-magnification camera, and a lifter;

[0033] The lifter is mounted on the mounting plate; the lifter can lift along the Z-axis; both the 3D camera and the high-magnification camera are mounted on the lifter;

[0034] The 3D camera can detect defects in the gold wire of the material;

[0035] The high-magnification camera can detect defects in the appearance of the material.

[0036] (III) Beneficial effects

[0037] The beneficial effects of the present invention are:

[0038] There are multiple materials placed in an array along the Z-axis inside the loading and unloading mechanism. Compared with the placement method where multiple materials are placed on the same horizontal plane, the placement method of arranging in an array along the Z-axis occupies less space.

[0039] The loading and unloading mechanism can drive multiple materials to move synchronously along the Z-axis. After the defect detection and unloading of one material are completed, the multiple materials are moved a set distance along the Z-axis as a whole, and then the next material can be moved to the fixed loading and unloading position of the first gripper, which simplifies the equipment program and improves the loading and unloading accuracy of the first gripper at the loading and unloading mechanism.

[0040] Compared with the method of sucking and adsorbing the link board chip by the suction nozzle, clamping the side of the link board chip by the clamping jaw effectively improves the stability of transporting the link board chip, and improves the adaptability of the defect detection device to transport the link board chip with a larger volume and heavier weight. Moreover, the clamping method of the clamping jaw is not affected by the gold wire layout on the end face of the link board chip, and the clamping is convenient, which can ensure the clamping stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 Schematic structural diagram of the defect detection device for the link board chip of the present invention;

[0042] Figure 2 Top view of the defect detection device for the link board chip of the present invention;

[0043] Figure 3 Schematic structural diagram of the link board chip of the present invention;

[0044] Figure 4 Schematic structural diagram of the loading and unloading mechanism of the present invention;

[0045] Figure 5 Schematic structural diagram of the transfer mechanism of the present invention;

[0046] Figure 6 Schematic structural diagram of the detection table of the present invention;

[0047] Figure 7 Schematic connection diagram of the card board and the fixer of the present invention;

[0048] Figure 8 Schematic structural diagram of the defect detection mechanism of the present invention.

[0049]

DESCRIPTION OF THE REFERENCE NUMERALS

[0050] 1: mounting plate; 11: clearance groove;

[0051] 2: loading and unloading mechanism; 21: lifting bracket; 211: sliding table; 22: gripper; 221: material table; 222: second clamping jaw; 223: baffle; 23: pusher; 231: push block; 24: plug box;

[0052] 3: transfer mechanism; 31: first clamping jaw; 32: slide rail; 33: slider; 34: jacking device; 35: connecting plate;

[0053] 4: detection table; 41: cross slide; 42: rotator; 43: card board; 431: through groove; 432: stepped groove; 433: mounting groove; 44: fixer;

[0054] 5: defect detection mechanism; 51: 3D camera; 52: high-magnification camera; 53: lifter;

[0055] 6: Frame;

[0056] 7: Link Chip. Detailed Implementation Manner

[0057] To better explain the present invention for easy understanding, the present invention will be described in detail below in conjunction with the accompanying drawings through specific implementation manners.

[0058] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If this specific posture changes, the directional indications will also change accordingly.

[0059] In addition, in the present invention, descriptions such as "first" and "second" are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0060] In the present invention, unless otherwise clearly defined and limited, terms such as "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or integrated; "connection" can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and can be the internal communication of two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0061] See Figure 1 , Figure 2 , Figure 3 and Figure 5, the present invention provides a defect detection device for a connecting plate chip. The defect detection device includes a mounting plate 1 and a loading and unloading mechanism 2, a transfer mechanism 3, a detection table 4, and a defect detection mechanism 5 disposed on the mounting plate 1; there are multiple materials arranged in an array along the Z-axis inside the loading and unloading mechanism 2; the loading and unloading mechanism 2 can drive the multiple materials to move synchronously along the Z-axis; a first gripper 31 is provided on the transfer mechanism 3, and the first gripper 31 can grip or release the material; the transfer mechanism 3 can move along the Y-axis and the Z-axis to transfer the material between the loading and unloading mechanism 2 and the detection table 4; the detection table 4 can move along the X-axis and the Y-axis; the defect detection mechanism 5 can move along the Z-axis; the defect detection mechanism 5 can perform defect detection on the material placed on the detection table 4; wherein, after each material's defect detection is completed, the loading and unloading mechanism 2 moves the multiple materials synchronously along the Z-axis in one direction by a set distance, and the set distance is the distance between the top surfaces of adjacent materials.

[0062] In this embodiment, the material is a connecting plate chip 7, and multiple connecting plate chips 7 are arranged in an array inside the loading and unloading mechanism 2. The material can also be a plate-type chip with other structures. The transfer mechanism 3 transports the material through the first gripper 31 to achieve the transfer of the material between the loading and unloading mechanism 2 and the detection table 4. The detection table 4 and the defect detection mechanism 5 cooperate to move. The detection table 4 moves the material to the lower part of the defect detection mechanism 5, and the defect detection mechanism 5 performs defect detection on the material. After the defect detection is completed, the material is transported to the loading and unloading mechanism 2 by the transfer mechanism 3 for unloading. The loading and unloading mechanism 2 moves in one direction along the Z-axis by a set distance, so that the first gripper 31 can pick up the next material at a fixed position at the loading and unloading mechanism 2.

[0063] There are multiple materials arranged in an array along the Z-axis inside the loading and unloading mechanism 2. Compared with the placement method where multiple materials are placed on the same horizontal plane, the placement method along the Z-axis array occupies less space.

[0064] The loading and unloading mechanism 2 can drive the multiple materials to move synchronously along the Z-axis. After the defect detection and unloading of one material are completed, moving the multiple materials as a whole along the Z-axis by a set distance can move the next material to the fixed loading and unloading position of the first gripper 31, simplifying the equipment program and improving the loading and unloading accuracy of the first gripper 31 at the loading and unloading mechanism 2.

[0065] Compared with the method of sucking the connecting plate chip by a suction nozzle, using the gripper to grip the side of the connecting plate chip effectively improves the stability of transporting the connecting plate chip and enhances the adaptability of the defect detection device to transport the connecting plate chip with a larger volume and heavier weight. Moreover, the method of gripping by the gripper is not affected by the gold wire layout on the end face of the connecting plate chip, is convenient to grip, and can ensure the stability of gripping.

[0066] Such as Figure 4As shown in the figure, the loading and unloading mechanism 2 includes a lifting bracket 21, a gripper 22, a pusher 23 and a cartridge box 24; the lifting bracket 21 and the gripper 22 are both arranged on the mounting plate 1; the gripper 22 is mounted on the lifting bracket 21 and the two are slidably connected along the X-axis; the gripper 22 can grip or release the cartridge box 24; a cavity penetrating along the Y-axis is formed inside the cartridge box 24; a plurality of materials are embedded in the wall surface of the cavity and the two are slidably connected along the Y-axis; the pusher 23 is arranged at one end of the cavity and can push the material to move along the Y-axis in the cavity; the first jaw 31 can pick up or unload materials at the other end of the cavity. Specifically, the lifting bracket 21 is used to drive the gripper 22 and the cartridge box 24 to move along the Z-axis. A plurality of materials are embedded inside the cartridge box 24, which is convenient for high-precision positioning and storage of a plurality of materials. The gripper 22, the pusher 23, the lifter 34 and the fixer 44 are all linear propulsion devices, which can be electric push rods, hydraulic cylinders or air cylinders. The gripper 22 is used to grip the cartridge box 24, and by replacing the cartridge box 24 storing the material to be detected, the loading of the material to be detected can be quickly completed, shortening the loading time.

[0067] Compared with the loading and unloading method in which the first jaw 31 extends into the cavity, in this embodiment, a material is pushed out by a set stroke along the Y-axis by the pusher 23. The material moves out a section along the groove where it is embedded in the cavity, but does not completely move out of the cavity, so that the cavity is still in a state of supporting the material. The first jaw 31 can pick up materials outside the cavity, shortening the picking time of the loading and unloading mechanism 2. Optionally, when unloading, the first jaw 31 first moves to the picking station, inserts the material that has completed the defect detection back into the groove of the cavity, and then the first jaw 31 releases the grip and moves away from the material by a set stroke along the Y-axis. After the first jaw 31 closes, it moves along the Y-axis to completely push the material into the cavity, so as to reduce the thickness of the first jaw 31 extending into the cavity, and then the placement spacing between adjacent materials in the cavity can be shortened, so that more materials can be placed in the cartridge box 24 with the same volume, reducing the loading and unloading frequency of the cartridge box 24.

[0068] Further, the defect detection device further includes a frame 6; the mounting plate 1 is arranged on the top of the frame 6; an avoidance groove 11 is formed on the mounting plate 1; the cartridge box 24 can move along the Z-axis and pass through the avoidance groove 11 into the inside of the frame 6. After the avoidance groove 11 is formed, the cartridge box 24 can partially enter or completely enter the inside of the frame 6, so that the size of the cartridge box 24 in the Z-axis direction can be increased, thereby increasing the volume of the cartridge box 24 and further reducing the loading and unloading frequency of the cartridge box 24. In the embodiment where the cartridge box 24 completely enters the inside of the frame 6, the cartridge box 24 can be loaded and unloaded from the inside of the frame 6.

[0069] Secondly, the gripper 22 includes a material platform 221, a second jaw 222, and a baffle 223; the slide 211 of the lifting bracket 21 is connected to the material platform 221; the bottom end of the cartridge 24 is snap-connected to the top end of the material platform 221; the second jaw 222 can move along the X-axis to be able to abut against the side surface of the material; the baffle 223 is connected to the material platform 221; the cartridge 24 can be clamped between the baffle 223 and the slide 211. Specifically, the slide 211 can move along the Z-axis, the end face of the slide 211 is a plane, and the slide 211 and the baffle 223 respectively abut against the two side surfaces of the cartridge 24, improving the stability of the placement of the cartridge 24 on the loading and unloading mechanism 2. A snap groove is provided at the top end of the material platform 221, and the shape of the snap groove is adapted to the bottom end of the cartridge 24 to ensure that the installation position of the next replaced cartridge 24 is the same as that of the previous cartridge 24, thereby improving the positioning accuracy of the material inside the cartridge 24 after loading and unloading.

[0070] In addition, the baffle 223 and the material platform 221 are hinged around the Y-axis. As the size of the cartridge 24 in the Z-axis direction increases, the stability of the snap connection between the bottom end of the cartridge 24 and the top end of the material platform 221 becomes worse. By using the baffle 223 as a temporary fixing member, the adaptability of the cartridge 24 to the vibration generated by the second jaw 222 during the clamping process is improved, thereby improving the stability of the placement of the large-volume cartridge 24 at the top end of the material platform 221, ensuring the positioning accuracy of multiple objects, and cooperating with the first jaw 31 for high-precision material picking.

[0071] Furthermore, a push block 231 is provided on the pusher 23; the push block 231 can move along the Y-axis and abut against the side surface of the material. Specifically, the push block 231 is arranged at a fixed position on the Z-axis. Whenever the cartridge 24 moves a set distance along the Z-axis, the pusher 23 drives the push block 231 to push the tail end of the material to be detected along the Y-axis until the push rod of the pusher 23 extends to the set stroke, and the head end of the material to be detected is pushed out of the cartridge 24, and the loading and unloading mechanism 2 cooperates for material picking. Secondly, the thickness of the push block 231, that is, the dimension in the Z-axis direction, is small, and the contact point of the push block 231 with the material is the side surface of the material. Therefore, the distance between adjacent materials can be correspondingly reduced, the number of materials that can be stored in the cartridge 24 with the same volume can be increased, and the adaptability of the pusher 23 to push the materials in the large-volume cartridge 24 is improved.

[0072] See again Figure 5, the transfer mechanism 3 further includes a slide rail 32, a slider 33, a lifter 34, and a connecting plate 35; the slide rail 32 is installed on the mounting plate 1; the slider 33 is installed on the slide rail 32, and the two are slidably connected along the Y-axis; the lifter 34 is installed on the slider 33; one end of the connecting plate 35 is connected to the push rod of the lifter 34, and the other end is connected to the first jaw 31; the lifter 34 can drive the connecting plate 35 to move along the Z-axis. Among them, the slide rail 32 and the slider 33 can be driven by a linear motor module or by belt drive, as long as the slider 33 can be slid along the Y-axis. The connecting plate 35 is used to adapt to the distance between the lifter 34 and the plug box 24 in the X-axis direction, fix the position of the first jaw 31 on the X-axis, and realize fixed-point material taking. And, the lifter 34 can drive the connecting plate 35 to move along the Z-axis. When the lifter 34 is in the reset state, it cooperates with the loading and unloading mechanism 2 to take materials at a fixed point; when the lifter 34 is in the working state, it cooperates with the inspection table 4 for loading and unloading, realizing gentle handling of materials and avoiding damage to materials due to collision.

[0073] See Figure 6 , the inspection table 4 includes a cross slide 41, a rotator 42, a clamping plate 43, and a fixator 44; the cross slide 41 is installed on the mounting plate 1; the fixator 44 is installed on the cross slide 41, and the cross slide 41 can drive the fixator 44 to move along the X-axis and the Y-axis; the rotating shaft of the rotator 42 is connected to the clamping plate 43 and can drive the clamping plate 43 to rotate; the fixator 44 is installed on the clamping plate 43; a through groove 431 is formed in the thickness direction of the clamping plate 43; the fixator 44 can clamp the material in the through groove 431. In this embodiment, the cross slide 41 is a pair of vertically arranged lead screw motor modules, which respectively realize the movement of the rotator 42 on the X-axis and the movement on the Y-axis. The rotator 42 is a motor or a motor. The clamping plate 43 is used to place the material clamped by the first jaw 31 and cooperate with the defect detection mechanism 5 to detect the defects of the material. The fixator 44 fixes the material in the clamping plate 43 to prevent the material from being displaced due to vibration during the movement of the clamping plate 43, ensuring the detection accuracy of the defect detection mechanism 5 for the material. The rotator 42 can flip the clamping plate 43, so that the front or back of the material on the clamping plate 43 faces up, and cooperate with the defect detection mechanism 5 to perform front defect detection and back defect detection on the material respectively, improving the detection quality of the defect detection equipment.

[0074] Such as Figure 7As shown in the figure, there is a pair of stepped grooves 432 arranged in parallel on the pallet 43; the material is suspended and clamped between the pair of stepped grooves 432; an installation groove 433 is formed on the pallet 43; the through groove 431, the stepped groove 432 and the installation groove 433 are communicated; the fixer 44 is embedded in the installation groove 433; the pressing block of the fixer 44 can abut against the side surface of the material. Specifically, the material is placed on the pair of stepped grooves 432, so that only the edge position of the material contacts the pallet 43, which is convenient for the defect detection mechanism 5 to detect the end faces, that is, the front and back surfaces of the material; the material is clamped between the pair of stepped grooves 432, which can improve the placement accuracy of the material on the pallet 43. At the same time, the arrangement of the stepped grooves 432 makes the bottom end of the material suspended, and the installation groove 433 is communicated with the stepped groove 432, which improves the convenience when the pressing block of the fixer 44 pushes and presses the side surface of the material, and further improves the placement accuracy of the material on the pallet 43. The material is suspended on the pallet 43, which is also convenient for the first jaw 31 to avoid the pallet 43 during loading and unloading, and load and unload the material more smoothly.

[0075] See Figure 8 , the defect detection mechanism 5 includes a 3D camera 51, a high-magnification camera 52 and a lifter 53; the lifter 53 is installed on the mounting plate 1; the lifter 53 can lift along the Z axis; both the 3D camera 51 and the high-magnification camera 52 are installed on the lifter 53; the 3D camera 51 can detect defects in the gold wires of the material; the high-magnification camera 52 can detect defects in the appearance of the material. In this embodiment, the lifter 53 is erected on the mounting plate 1 and driven by a screw motor module. The 3D camera 51 and the high-magnification camera 52 are located above the inspection table 4 to correspondingly detect defects in the gold wires and appearance of the optical module. The 3D camera 51 detects the wire bonding, including missing bonding, wire collapse and welding errors. The high-magnification camera 52 detects dirt and foreign objects on the end face of the material. The pallet 43 is moved to below the 3D camera 51 or the high-magnification camera 52 through the cross slide 41, and the 3D camera 51 and the high-magnification camera 52 are adjusted to the preset shooting position through the lifter 53, realizing the defect detection of the gold wires and appearance of the multi-chip module. The defect detection equipment has a compact structure, high integration, short material turnover time, and high detection quality and detection efficiency.

[0076] It should be understood that the above description of the specific embodiments of the present invention is only for explaining the technical route and features of the present invention, and its purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly. However, the present invention is not limited to the above specific embodiments. Any changes or modifications made within the scope of the claims of the present invention should be covered by the protection scope of the present invention.

Claims

1. A defect detection device for a chip on a board, characterized in that: The defect detection device comprises a mounting plate (1), and a loading and unloading mechanism (2), a transfer mechanism (3), a detection platform (4), and a defect detection mechanism (5) arranged on the mounting plate (1); The loading and unloading mechanism (2) has a plurality of materials arranged in an array along the Z axis inside; the loading and unloading mechanism (2) is capable of driving the plurality of materials to move synchronously along the Z axis; The transfer mechanism (3) is provided with a first clamp (31), and the first clamp (31) is capable of clamping or releasing the material; the transfer mechanism (3) is capable of moving along the Y axis and the Z axis to transfer the material between the loading and unloading mechanism (2) and the detection platform (4); The inspection platform (4) is movable along the X-axis and the Y-axis; the defect detection mechanism (5) is movable along the Z-axis; the defect detection mechanism (5) is capable of performing defect detection on the material placed on the inspection platform (4); Wherein, after completing defect detection of each material, the loading and unloading mechanism (2) synchronously moves the plurality of materials in one direction along the Z axis by a set distance, wherein the set distance is the spacing between the top surfaces of adjacent materials.

2. The defect detection device for connected chips according to claim 1, characterized in that: The loading and unloading mechanism (2) comprises a lifting bracket (21), a clamp (22), a pusher (23) and a plug box (24); The lifting bracket (21) and the clamp (22) are both arranged on the mounting plate (1); the clamp (22) is mounted on the lifting bracket (21), and the two are slidably connected along the X-axis; the clamp (22) can clamp or release the plug box (24); The plug box (24) has a cavity extending through the cavity along the Y-axis; a plurality of materials are embedded in the wall of the cavity, and the two are slidably connected along the Y-axis; the pusher (23) is arranged at one end of the cavity and is capable of pushing the material to move along the Y-axis in the cavity; the first clamp (31) is capable of taking or unloading the material at the other end of the cavity.

3. The defect detection device for connected chips according to claim 2, characterized in that: The defect detection device further comprises a frame (6); the mounting plate (1) is arranged on the top of the frame (6); The mounting plate (1) is provided with a clearance groove (11); the plug box (24) can move along the Z axis and pass through the clearance groove (11) to enter the interior of the frame (6).

4. The defect detection device for connected chips according to claim 2, characterized in that: The clamp (22) comprises a material platform (221), a second clamping claw (222) and a baffle (223); The slide table (211) of the lifting bracket (21) is connected to the material table (221); the bottom end of the plug box (24) is clamped with the top end of the material table (221); the second clamping claw (222) can move along the X-axis so as to abut against the side of the material; The baffle plate (223) is connected to the material platform (221); and the plug box (24) can be engaged between the baffle plate (223) and the slide platform (211).

5. The defect detection device for connected chips according to claim 4, characterized in that: The baffle (223) and the material platform (221) are hinged around the Y-axis.

6. The defect detection device for connected chips according to claim 2, characterized in that: The pusher (23) is provided with a push block (231); The push block (231) is capable of moving along the Y axis and abutting against the side surface of the material.

7. The defect detection device for connected chips according to any one of claims 1 to 6, characterized in that: The transfer mechanism (3) further comprises a slide rail (32), a slide block (33), a lifter (34) and a connecting plate (35); The slide rail (32) is mounted on the mounting plate (1); the slider (33) is mounted on the slide rail (32), and the two are slidably connected along the Y axis; The lifter (34) is installed on the slider (33); one end of the connecting plate (35) is connected to the push rod of the lifter (34), and the other end is connected to the first clamp (31); the lifter (34) can drive the connecting plate (35) to move along the Z axis.

8. The defect detection device for connected chips according to any one of claims 1 to 6, characterized in that: The detection platform (4) comprises a cross slide (41), a rotator (42), a clamping plate (43) and a fixer (44); The cross slide (41) is mounted on the mounting plate (1); the fixer (44) is mounted on the cross slide (41), and the cross slide (41) is capable of driving the fixer (44) to move along the X-axis and the Y-axis; The rotating shaft of the rotator (42) is connected to the clamping plate (43) and can drive the clamping plate (43) to rotate. The fixer (44) is installed on the clamping plate (43); the clamping plate (43) is provided with a through groove (431) in the thickness direction thereof; the fixer (44) can clamp the material in the through groove (431).

9. The defect detection device for connected chips according to claim 8, characterized in that: The clamping plate (43) has a pair of parallel stepped grooves (432); the material is suspended and clamped between the pair of stepped grooves (432); The clamping plate (43) is provided with a mounting groove (433); the through groove (431), the stepped groove (432) and the mounting groove (433) are in communication; the fixer (44) is embedded in the mounting groove (433); and the pressing block of the fixer (44) can abut against the side of the material.

10. The defect detection device for connected chips according to any one of claims 1 to 6, characterized in that: The defect detection mechanism (5) comprises a 3D camera (51), a high-power camera (52) and a lifter (53); The lifter (53) is mounted on the mounting plate (1); the lifter (53) can be lifted and lowered along the Z axis; the 3D camera (51) and the high-magnification camera (52) are both mounted on the lifter (53); The 3D camera (51) is capable of performing defect detection on the gold wire of the material; The high-power camera (52) is capable of performing defect detection on the appearance of the material.

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