Cutting device and method for manufacturing cutted article

Abstract

The cutting device includes an imaging unit, a first processing unit, and a second processing unit. The photographing unit generates a photographed image by photographing some or all of the plurality of cut articles. The first processing unit sets a plurality of inspection regions in a captured image. The second processing unit inspects the appearance of each cut product included in the captured image on the basis of images included in each of the plurality of inspection regions in the captured image. The first processing unit executes a determination process for determining whether or not a portion of any side of a plurality of cut products is included in a predetermined number of pixels on the basis of the pixel values of the predetermined number of pixels continuously located in a first direction in a captured image. The first processing unit sets at least a part of the plurality of inspection regions by repeatedly moving positions of a predetermined number of pixels and executing determination processing.

Description

Technical Field

[0001] The present invention relates to a cutting device and a method for manufacturing a cut product. Background Art

[0002] Japanese Patent Application Laid-Open Publication No. 2010-125488 (Patent Document 1) discloses a cutting device for cutting a workpiece. In this cutting device, a plurality of single-piece workpieces are manufactured by cutting the workpiece, and an appearance inspection of each single-piece workpiece is performed (see Patent Document 1).

[0003] Patent Document 1: Japanese Patent Application Laid-Open Publication No. 2010-125488

[0004] For example, the appearance of a cut product (e.g., a single-piece workpiece) manufactured by cutting a substrate is inspected based on a captured image of the cut product. In this case, an inspection area is set in the captured image of the cut product, and the appearance of the cut product is inspected based on the image within the inspection area. That is, in order to perform an appearance inspection of a cut product based on a captured image of the cut product, it is necessary to set an inspection area in the captured image of the cut product. However, in the above Patent Document 1, a specific method for setting the inspection area is not disclosed. Summary of the Invention

[0005] The present invention has been completed to solve such problems, and an object thereof is to provide a cutting device and a method for manufacturing a cut product, which can automatically set an inspection area in a captured image of a cut product relatively efficiently.

[0006] A cutting device according to an aspect of the present invention manufactures a plurality of cut products by cutting a substrate. The cutting device includes an imaging unit, a first processing unit, and a second processing unit. The imaging unit generates a captured image by imaging a part or all of the plurality of cut products. The first processing unit sets a plurality of inspection areas in the captured image. The second processing unit inspects the appearance of each cut product included in the captured image based on the images included in the plurality of inspection areas in the captured image. The shapes of the plurality of inspection areas are rectangles. The shape of each cut product is a rectangle. The first processing unit performs a determination process of determining whether any side of the plurality of cut products is included in a part of a specified number of pixels continuously located in a first direction in the captured image. The specified number is less than the number of pixels in the entire captured image. The first processing unit sets at least a part of the plurality of inspection areas by repeatedly moving the position of the specified number of pixels and performing the determination process.

[0007] Further, a method for manufacturing a cut product according to another aspect of the present invention is a method for manufacturing a cut product using the above-described cutting device. The cutting device includes: a cutting workbench and a cutting unit. A substrate is disposed on the cutting workbench. The cutting unit cuts the substrate disposed on the cutting workbench. The manufacturing method includes: a step of disposing the substrate on the cutting workbench and a step of cutting the substrate disposed on the cutting workbench.

[0008] Advantages of the Invention

[0009] According to the present invention, a cutting device and a method for manufacturing a cut product can be provided, and the cutting device and the method for manufacturing a cut product can automatically set an inspection area in a captured image of the cut product relatively efficiently. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a schematic top view showing the cutting device.

[0011] Figure 2 is a diagram schematically showing a case where an electronic component is photographed by a second optical inspection camera.

[0012] Figure 3 is a diagram schematically showing the hardware configuration of a computer.

[0013] Figure 4 is a diagram schematically showing an example of a captured image generated by the second optical inspection camera.

[0014] Figure 5 is a flowchart showing the process of the appearance inspection of the electronic component.

[0015] Figure 6 is a flowchart showing the process of the setting process of the inspection area.

[0016] Figure 7 is a flowchart showing the process of the setting process of the first inspection area.

[0017] Figure 8 is a diagram for explaining the process of determining a part of the left side of the first electronic component in the captured image.

[0018] Figure 9 is a diagram for explaining how the positions of a specified number of pixels that are the objects of the left side determination process are changed.

[0019] Figure 10 is a diagram for explaining the generation of an approximate curve in the left side determination process.

[0020] Figure 11 is a diagram schematically showing a curve that is the result of differentiating the approximate curve.

[0021] Figure 12 This is a diagram for explaining the process of determining other parts on the left side.

[0022] Figure 13 This is a diagram for explaining the process of determining the left side based on each pixel position corresponding to each maximum value (maximum value > first specified value) of the differential values obtained through the left side determination process.

[0023] Figure 14 This is a flowchart showing the process of determining the left side in the first electronic component.

[0024] Figure 15 This is a flowchart showing the process of determining the upper end and the lower end of the left side respectively.

[0025] Figure 16 This is a diagram for explaining the process of determining the right side of the first electronic component.

[0026] Figure 17 This is a flowchart showing the process of determining the right side in the first electronic component.

[0027] Figure 18 This is a diagram for explaining the process of respectively determining the upper side and the lower side of the first electronic component.

[0028] Figure 19 This is a flowchart showing the process of determining the upper side in the first electronic component.

[0029] Figure 20 This is a flowchart showing the process of determining the lower side in the first electronic component.

[0030] Figure 21 This is a diagram for explaining the process of setting other inspection areas at positions after moving in the row direction or the column direction relative to the first inspection area.

[0031] Figure 22 This is a flowchart showing the process of setting other inspection areas at positions after moving in the row direction relative to the first inspection area.

[0032] Figure 23 This is a flowchart showing the process of setting other inspection areas at positions after moving in the column direction relative to the first inspection area.

[0033] Explanation of reference numerals

[0034] 1 Cutting device, 3 Substrate supply unit, 4 Positioning unit, 4a Rail unit, 5 Cutting table, 5a Holding member, 5b Rotating mechanism, 5c Moving mechanism, 5d First position confirmation camera, 5e First cleaner, 6 Spindle unit, 6a Blade, 6b Second position confirmation camera, 6c Rotating shaft, 7 Conveying unit, 7a Second cleaner, 11 Inspection table, 11a Inspection table main body, 11b Holding member, 12 First optical inspection camera, 13 Second optical inspection camera, 14 Arrangement unit, 15 Extraction unit, 15a Good product tray, 15b Defective product tray, 20 Monitor, 50 Computer, 70 Control unit, 72 CPU, 74 RAM, 76 ROM, 80 Storage unit, 81 Control program, 90 Input / output I / F, 95 Reception unit, A1 Cutting module, B1 Inspection and storage module, BA1 Sphere part, EB1, IB1 Lower side, EL1, IL1 Left side, ER1, IR1 Right side, ET1, IT1 Upper side, IM1 Captured image, L1 Approximation curve, L2 Curve, M1 Magazine, P1 Encapsulated substrate, P01 Differential maximum position, PX1 Pixel, S1 Electronic component, T1 Inspection area, T1B1, T1B2, T1B3, T1C1, T1C2, T1C3 Temporary inspection area. Detailed implementation mode

[0035] Next, an implementation mode according to one aspect of the present invention (hereinafter also referred to as "this implementation mode") will be described in detail with reference to the accompanying drawings. In addition, the same or corresponding parts in the drawings are denoted by the same reference numerals and their descriptions will not be repeated. In addition, for the sake of easy understanding, each drawing schematically depicts the object with appropriate omissions or exaggerations.

[0036] [1. Configuration]

[0037] <1-1. Structure of the cutting device>

[0038] FIG. 1 is a schematic top view showing a cutting device 1 according to this implementation mode. The cutting device 1 is configured to cut an encapsulated substrate (an example of an object to be cut) into a plurality of electronic components (an example of cut products) one by one. In the encapsulated substrate, a substrate or a lead frame on which a semiconductor chip is fixed is resin-sealed. In addition, the object to be cut does not necessarily have to be an encapsulated substrate, and for example, it may also be a substrate (including a wafer) that is not resin-sealed.

[0039] As an example of a packaging substrate, a BGA (Ball Grid Array) packaging substrate, an LGA (Land Grid Array) packaging substrate, a CSP (Chip Size Package) packaging substrate, an LED (Light Emitting Diode) packaging substrate, and a QFN (Quad Flat No-leaded) packaging substrate can be cited.

[0040] In addition, the cutting device 1 is configured to inspect each of the plurality of electronic components after singulation. In the cutting device 1, each electronic component is photographed, and the inspection of each electronic component is performed based on the photographed image. Inspection data is generated through this inspection, and each electronic component is classified as "good product" or "defective product".

[0041] In this example, the packaging substrate P1 is used as the object to be cut, and the packaging substrate P1 is singulated into a plurality of electronic components S1 by the cutting device 1. Hereinafter, the surface of the packaging substrate P1 that is resin-sealed among the two surfaces is referred to as the molded surface, and the surface opposite to the molded surface is referred to as the ball / pin surface. In addition, when the object to be cut is a substrate that is not resin-sealed, the surface facing upward (cutting surface) during cutting corresponds to the ball / pin surface in the present embodiment, and the surface opposite to the cutting surface corresponds to the molded surface in the present embodiment.

[0042] As Figure 1 shown, the cutting device 1 includes a cutting module A1 and an inspection and storage module B1 as components. The cutting module A1 is configured to manufacture a plurality of electronic components S1 by cutting the packaging substrate P1. The inspection and storage module B1 is configured to inspect each of the plurality of manufactured electronic components S1 and then store the electronic components S1 in a tray. In the cutting device 1, each component can be disassembled and replaced relative to other components.

[0043] The cutting module A1 mainly includes a substrate supply unit 3, a positioning unit 4, a cutting table 5, a mandrel unit 6, and a conveying unit 7.

[0044] The substrate supply unit 3 supplies the packaging substrate P1 to the positioning unit 4 one by one by pushing out the packaging substrate P1 one by one from the cassette M1 that houses a plurality of packaging substrates P1. At this time, the packaging substrate P1 is arranged in a state where the ball / pin surface faces upward.

[0045] The positioning unit 4 positions the packaging substrate P1 pushed out from the substrate supply unit 3 by arranging it on the rail unit 4a. Then, the positioning unit 4 conveys the positioned packaging substrate P1 to the cutting table 5.

[0046] The cutting table 5 holds the package substrate P to be cut. Here, a cutting device 1 with a dual cutting table structure having two cutting tables 5 is illustrated. The cutting table 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c. The holding member 5a holds the package substrate P1 by adsorbing it from below the package substrate P1 conveyed by the positioning unit 4. The rotating mechanism 5b can rotate the holding member 5a in the horizontal plane around the direction of θ1 in the figure. The moving mechanism 5c can move the holding member 5a along the Y-axis in the figure.

[0047] The mandrel portion 6 slices the package substrate P1 into a plurality of electronic components S1 by cutting the package substrate P1. Here, a cutting device 1 with a dual mandrel structure having two mandrel portions 6 is illustrated. The mandrel portion 6 can move along the X-axis and the Z-axis in the figure. Additionally, the cutting device 1 may also be a single mandrel structure having one mandrel portion 6.

[0048] The mandrel portion 6 includes a rotating shaft 6c. A blade 6a is fixed to the rotating shaft 6c of the mandrel portion 6. The blade 6a cuts the package substrate P1 by rotating at high speed, thereby slicing the package substrate P1 into a plurality of electronic components S1. The blade 6a is mounted on the rotating shaft 6c in a state of being clamped by a first flange and a second flange (not shown). The first flange and the second flange are fixed to the rotating shaft 6c by fastening members (not shown) such as nuts.

[0049] In the cutting module A1, there are provided nozzles for cutting water, cooling water, and end material splash water, etc. (not shown). The nozzle for cutting water sprays cutting water onto the blade 6a rotating at high speed. The nozzle for cooling water sprays cooling water toward the vicinity of the cutting portion of the package substrate P1. The nozzle for end material splash water sprays end material splash water that splashes chips, etc.

[0050] After the cutting table 5 adsorbs the package substrate P1, the package substrate P1 is photographed by the first position confirmation camera 5d to confirm the position of the package substrate P1. The confirmation using the first position confirmation camera 5d is, for example, the confirmation of the position of the alignment mark AL1 provided on the package substrate P1. The position information of the alignment mark is used, for example, to determine the cutting line of the package substrate P1.

[0051] After that, the cutting table 5 moves along the Y-axis in the figure toward the mandrel portion 6. After the cutting table 5 moves below the blade 6a, the package substrate P1 is cut by relatively moving the cutting table 5 and the mandrel portion 6. Then, if necessary, the package substrate P1 is photographed by the second position confirmation camera 6b provided in the cutting module A1 to confirm the position, etc. of the package substrate P1. The confirmation using the second position confirmation camera 6b is, for example, the confirmation of the cutting position and the cutting width of the package substrate P1.

[0052] After the cutting of the encapsulation substrate P1 is completed on the cutting table 5, while adsorbing the plurality of singulated electronic components S1, it moves in the direction away from the mandrel portion 6 along the Y axis in the figure. During this movement, the upper surface (ball / pin surface) of the electronic component S1 is cleaned and dried by the first cleaner 5e. This cleaning can be performed, for example, by directly spraying cleaning water onto the upper surface of the electronic component S1, or by supplying cleaning water to the upper surface of the electronic component S1 via a brush or the like. In addition, in the cutting device 1, two first cleaners 5e are arranged along the X axis in the figure, but the number of the first cleaners 5e is not limited to this.

[0053] The conveying unit 7 adsorbs and holds the electronic component S1 on the cutting table 5 from above, and conveys the electronic component S1 to the inspection table 11 of the inspection and storage module B1. During this conveyance, the lower surface (molded surface) of the electronic component S1 is cleaned and dried by the second cleaner 7a. This cleaning can be performed, for example, by directly spraying cleaning water onto the lower surface of the electronic component S1, or by supplying cleaning water to the lower surface of the electronic component S1 via a brush or the like.

[0054] The inspection and storage module B1 mainly includes an inspection table 11, a first optical inspection camera 12, a second optical inspection camera 13, a configuration unit 14, and an extraction unit 15. In addition, the first optical inspection camera 12 can also be provided in the cutting module A1.

[0055] The inspection table 11 holds the electronic component S1 for the optical inspection of the electronic component S1. The inspection table 11 can move along the X axis in the figure. In addition, the inspection table 11 can be turned over up and down. A holding member for holding the electronic component S1 by adsorbing the electronic component S1 is provided on the inspection table 11.

[0056] The first optical inspection camera 12 and the second optical inspection camera 13 respectively photograph the molded surface and the ball / pin surface of the electronic component S1. Based on the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13, various inspections related to the appearance of the electronic component S1 (appearance inspection) are performed. As an example of the appearance inspection, there can be cited the inspection of the size of the electronic component S1, the inspection of the size of the ball portion BA1, and the inspection of the length between adjacent ball portions BA1. The first optical inspection camera 12 and the second optical inspection camera 13 are respectively arranged to photograph upward in the vicinity of the inspection table 11.

[0057] The first optical inspection camera 12 photographs the molded surface of the electronic component S1 conveyed by the conveying unit 7 to the inspection workbench 11. Then, the conveying unit 7 places the electronic component S1 on the holding member of the inspection workbench 11. After the holding member adsorbs the electronic component S1, the inspection workbench 11 is turned upside down. The inspection workbench 11 moves above the second optical inspection camera 13, and the ball / pin surface of the electronic component S1 is photographed by the second optical inspection camera 13.

[0058] Figure 2 FIG. is a diagram schematically showing the situation where the electronic component S1 is photographed by the second optical inspection camera 13. The inspection workbench 11 includes an inspection workbench main body 11a and a holding member 11b. The holding member 11b is provided below the inspection workbench main body 11a. In the holding member 11b, the surface for holding the electronic component S1 is made of, for example, black rubber. In addition, the color of the rubber does not need to be black, and it can also be white or the like, for example. A plurality of electronic components S1 adsorbed and held by the holding member 11b are photographed by the second optical inspection camera 13. Based on the image data or the photographed image (hereinafter, also simply referred to as "photographed image") representing the photographed image generated by the second optical inspection camera 13, an inspection related to the appearance of the ball / lead surface of each electronic component S1 is performed. The process of the inspection related to the appearance of the ball / lead surface of each electronic component S1 will be described in detail later.

[0059] Refer again to Figure 1 , the inspected electronic component S1 is arranged in the arranging unit 14. The arranging unit 14 can move along the Y-axis of the figure. The inspection workbench 11 arranges the inspected electronic component S1 on the arranging unit 14.

[0060] The extracting unit 15 transfers the electronic component S1 arranged on the arranging unit 14 to a tray. Based on the inspection results using the first optical inspection camera 12 and the second optical inspection camera 13, the electronic component S1 is classified as "good product" or "defective product". The extracting unit 15 transfers each electronic device S1 to a good-product tray 15a or a defective-product tray 15b based on the classification result. That is, good products are stored in the good-product tray 15a, and defective products are stored in the defective-product tray 15b. When the good-product tray 15a and the defective-product tray 15b are each filled with electronic components S1, they are replaced with new trays.

[0061] The cutting device 1 further includes a computer 50 and a monitor 20. The monitor 20 is configured to display images. The monitor 20 is composed of a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence) monitor, for example.

[0062] The computer 50 controls the operations of the components of the cutting module A1 and the inspection and storage module B1, for example. For example, the operations of components such as the substrate supply unit 3, the positioning unit 4, the cutting table 5, the mandrel unit 6, the conveying unit 7, the inspection table 11, the first optical inspection camera 12, the second optical inspection camera 13, the configuration unit 14, the extraction unit 15, and the monitor 20 are controlled by the computer 50.

[0063] In addition, the computer 50 performs various inspections of the electronic component S1 based on the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13, for example. Next, the computer 50 will be described in detail.

[0064] <1-2. Structure of the computer>

[0065] Figure 3 is a diagram schematically showing the hardware structure of the computer 50. As Figure 3 shown, the computer 50 includes a control unit 70, an input / output I / F (interface) 90, and a storage unit 80, and each component is electrically connected via a bus.

[0066] The control unit 70 includes a CPU (Central Processing Unit) 72, a RAM (Random Access Memory) 74, a ROM (Read Only Memory) 76, etc. The control unit 70 is configured to control each component element within the computer 50 and each component element within the cutting device 1 in response to information processing.

[0067] The input / output I / F 90 is configured to communicate with each component element included in the cutting device 1 via signal lines. The input / output I / F 90 is used to send data from the computer 50 to each component element within the cutting device 1 and receive data sent from each component element within the cutting device 1 to the computer 50. The reception unit 95 is configured to receive instructions from the user. The reception unit 95 is composed of, for example, part or all of a touch panel, a keyboard, a mouse, and a microphone.

[0068] The storage unit 80 is composed of an auxiliary storage device such as a hard disk drive or a solid state drive, for example. The storage unit 80 is configured to store a control program 81, for example. By the control unit 70 executing the control program 81, various operations in the cutting device 1 are realized. When the control unit 70 executes the control program 81, the control program 81 is expanded into the RAM 74. Thus, the control unit 70 controls each component element by the CPU 72 interpreting and executing the control program 81 expanded in the RAM 74.

[0069] [2. Necessity of automatically setting the inspection area]

[0070] As described above, in the cutting device 1, based on the captured images generated by the first optical inspection camera 12 and the second optical inspection camera 13, the appearance inspection of the electronic component S1 is performed.

[0071] Figure 4 It is a diagram schematically showing an example of the captured image IM1 generated by the second optical inspection camera 13. Refer to Figure 4 , in the captured image IM1, a plurality of electronic components S1 are shown, for example, electronic components S1A, S1B, S1C, and S1D are shown. In the captured image IM1, the plurality of electronic components S1 are arranged in a grid pattern. Since the captured image IM1 is an image of the ball / lead surface of each electronic component S1, a plurality of ball portions BA1 of each electronic component S1 are shown in the captured image IM1. In addition, between two adjacent electronic components S1, the holding member 11b of the inspection workbench 11 is shown.

[0072] The captured image IM1 is an image of gray scale (256 gray levels). In this example, the color of each electronic component S1 is brighter than the color of the holding member 11b. For example, each electronic component S1 is represented by gray, and the holding member 11b is represented by black. In addition, in the captured image, "showing" the object to be captured is also referred to as "including" the object to be captured in the captured image.

[0073] The shape of the captured image IM1 is rectangular, and the shape of each electronic component S1 is rectangular. In addition, in this specification, "rectangle" refers to a rectangle (a quadrilateral with all four angles equal), and can also refer to a square. The left side IL1, the right side IR1, the upper side IT1, and the lower side IB1 of the captured image IM1 are parallel to the left side EL1, the right side ER1, the upper side ET1, and the lower side EB1 of each electronic component S1, respectively. Here, parallel includes not only the strict meaning but also the substantial meaning. That is, even when the angle formed by the two sides is not 0, when the angle formed by the two sides is a value within the error range, the two sides are parallel.

[0074] In the case of performing the appearance inspection of the electronic component S1 based on the captured image IM1, first, a plurality of inspection regions T1 in the captured image IM1 are set. Each inspection region T1 corresponds to any one of the electronic components S1 included in the captured image IM1. For example, the inspection regions T1A, T1B, T1C, and T1D correspond to the electronic components S1A, S1B, S1C, and S1D, respectively. In the cutting device 1, based on the images included in the plurality of inspection regions T1 in the captured image IM1, the appearance of each electronic component S1 included in the captured image IM1 is inspected.

[0075] As a method for setting each inspection area T1, for example, a method of manual setting by an operator is considered. However, when the operator manually sets each inspection area T1, for example, there are problems such as the need for a long time to set the inspection area T1, deviation in the setting accuracy of the inspection area T1 due to each operator, and a relatively high occurrence frequency of setting errors in the inspection area T1.

[0076] In the cutting device 1 of the present embodiment, each inspection area T1 is automatically set. Therefore, according to the cutting device 1, the occurrence of various problems that may occur when the operator manually sets each inspection area T1 can be suppressed. In addition, as will be described later in detail, various efforts have been made in the algorithm related to the automatic setting of each inspection area T1 in the cutting device 1. Therefore, according to the cutting device 1, the automatic setting of each inspection area T1 can be performed relatively efficiently.

[0077] [3. Appearance inspection process of electronic components (cut products)]

[0078] Figure 5 It is a flowchart showing the process of the appearance inspection of the electronic component S1. In the cutting device 1 of the present embodiment, only a part of the electronic components S1 arranged on the inspection workbench 11 is photographed at one time by the second optical inspection camera 13, and the appearance of each electronic component S1 is inspected in units of the photographed images. By repeatedly adjusting the positional relationship between the second optical inspection camera 13 and the inspection workbench 11 and the photographing of the second optical inspection camera 13, the appearance of all the electronic components S1 arranged on the inspection workbench 11 is inspected.

[0079] Figure 5 The process shown in the flowchart is executed by the control unit 70 of the computer 50, for example, in the case of performing the first photographing in multiple photographings for the appearance inspection of all the electronic components S1 arranged in the inspection workbench 11.

[0080] Refer to Figure 5 , the control unit 70 controls the second optical inspection camera 13 to photograph a plurality of electronic components S1 arranged on the inspection workbench 11 (step S100). The control unit 70 executes the setting process of each inspection area T1 in the photographed image IM1 generated by the second optical inspection camera 13 (step S110). The process in step S110 will be described in detail later.

[0081] The control unit 70 performs various appearance inspection processes on each electronic component S1 included in the captured image IM1 based on the images included in each inspection area T1 (step S120). In the case of performing an appearance inspection during a second and subsequent shooting among multiple shootings for the appearance inspection of all the electronic components S1 arranged on the inspection workbench 11, for example, the process of step S110 is omitted by using each inspection area T1 set for the appearance inspection during the first shooting.

[0082] Figure 6 is a flowchart of a process of setting an inspection area ( Figure 5 step S110). The process shown in this flowchart is executed by the control unit 70 of the computer 50.

[0083] Refer to Figure 6 , the control unit 70 executes the setting process (step S200) of the inspection area T1 corresponding to the first electronic component S1 among the multiple electronic components S1 included in the captured image IM1 (for example, Figure 4 the inspection area T1A in

[0084] The control unit 70 executes the setting process (step S210) of the inspection area T1 corresponding to the electronic component S1 existing at the position after moving in the row direction with the inspection area T1 set in step S200 as a reference (for example, Figure 4 the inspection area T1B in

[0085] The control unit 70 executes the setting process (step S220) of the inspection area T1 corresponding to the electronic component S1 existing at the position after moving in the column direction with the inspection area T1 set in step S200 as a reference (for example, Figure 4 the inspection area T1C in

[0086] Based on each inspection area T1 set through the processes in steps S200, S210, and S220, the control unit 70 determines the number of inspection areas T1 in the row direction and the number of inspection areas T1 in the column direction, and sets other inspection areas T1 based on the result (for example, Figure 4 the inspection area T1D in Figure 4 In the example shown in

[0087] Figure 7 is a flowchart of a process showing the setting process ( Figure 6 step S200) of the first inspection area T1. The process shown in this flowchart is executed by the control unit 70 of the computer 50.

[0088] Referring to Figure 7 , the control unit 70 executes a process (step S300) for determining the left side EL1 of the first electronic component (hereinafter also simply referred to as "the first electronic component") S1 among the plurality of electronic components S1 included in the captured image IM1. The process in step S300 will be described in detail later. Based on the determined left side EL1, the control unit 70 executes a process (step S310) for determining the right side ER1 of the first electronic component S1. The process in step S310 will be described in detail later.

[0089] Based on the determined left side EL1 and right side ER1, the control unit 70 executes a process (step S320) for determining the upper side ET1 of the first electronic component S1. The process in step S320 will be described in detail later. Based on the determined left side EL1 and right side ER1, the control unit 70 executes a process (step S330) for determining the lower side EB1 of the first electronic component S1. The process in step S330 will be described in detail later. Based on the determined left side EL1, right side ER1, upper side ET1, and lower side EB1, the control unit 70 sets the inspection area T1 corresponding to the first electronic component S1 (step S340).

[0090] Figure 8 is a diagram for explaining a part of the process of determining the left side EL1 of the first electronic component S1 in the captured image IM1. Referring to Figure 8 , the left side determination process is executed in the cutting device 1. The left side determination process is as follows: Based on the pixel values of a specified number of pixels (hereinafter also simply referred to as "the specified number of pixels") continuously located in the row direction, it is determined whether a part of the left side EL1 is included in the specified number of pixels. In the left side determination process, based on the pixel values of the specified number of pixels, the boundary between the holding member 11b and the electronic component S1 is determined. For example, from the left side to the right side in the figure, the part where pixels with small pixel values (pixels corresponding to the holding member 11b (dark pixels)) and pixels with large pixel values (pixels corresponding to the electronic component S1 (bright pixels)) are arranged adjacent to each other in this order is determined.

[0091] When it is determined through the left-side determination process that a part of the left-side EL1 is not included in a specified number of pixels, the positions of the specified number of pixels determined are, for example, changed to the lower right, and the left-side determination process is performed on the changed specified number of pixels. By repeatedly performing the change of the positions of the determined specified number of pixels and the left-side determination process, the position of a part of the left-side EL1 is determined.

[0092] Figure 9 FIG. is a diagram for explaining how the positions of a specified number of pixels that are the objects of the left-side determination process are changed. In the captured image IM1 shown in this figure, for ease of explanation, the images of the respective electronic components S1 and the like are omitted.

[0093] Refer to Figure 9 , the captured image IM1 is composed of a plurality of pixels PX1. In the cutting device 1, first, five pixels (an example of a specified number of pixels) are selected from the left-upper pixel PX1 toward the right in the row direction, and the left-side determination process is performed on the selected five pixels. When it is determined that a part of the left-side EL1 is not included in the selected five pixels, the positions of the five pixels are each changed by one pixel in the right direction of the row and the lower direction of the column. Then, the left-side determination process is performed on the changed five pixels. The change of the positions of the five pixels and the left-side determination process are repeatedly performed until a part of the left-side EL1 is determined.

[0094] Figure 10 FIG. is a diagram for explaining the generation of the approximate curve L1 in the left-side determination process. Refer to Figure 10 , the horizontal axis represents the respective positions of a specified number of pixels, and the vertical axis represents the pixel values. In the left-side determination process, an approximate curve L1 is generated that represents how the pixel values of a specified number of pixels change from the left side to the right side in the captured image IM1. For the generation of the approximate curve L1, for example, various well-known techniques are applied.

[0095] Figure 11 FIG. is a diagram schematically showing the curve L2 that is the result of differentiating the approximate curve L1. Refer to Figure 11 , the horizontal axis represents the respective positions of a specified number of pixels, and the vertical axis represents the differential values. In the left-side determination process, the generated approximate curve L1 is differentiated. In the left-side determination process, when the maximum value of the differential values exceeds a threshold (a first specified value), it is determined that a part of the left-side EL1 exists in the specified number of pixels. When it is determined that a part of the left-side EL1 exists in the specified number of pixels, the other part of the left-side EL1 is determined based on the determined part of the left-side EL1.

[0096] Figure 12 FIG. is a diagram for explaining the process of determining the other part of the left-side EL1. Refer to Figure 12, the pixel PX1A is an example of the pixel PX1 corresponding to the maximum value of the differential value obtained by the left-side determination process (the maximum value > the first specified value). In the process of determining the other part of the left side EL1, first, the process of determining the upper end of the left side EL1 is executed, and then the process of determining the lower end of the left side EL1 is executed.

[0097] Specifically, five pixels including the pixel PX1A, two pixels on the left side of the pixel PX1A, and two pixels on the right side of the pixel PX1A are selected as the pixels to be judged. The process of moving the positions of the five pixels to be judged one pixel upward in the column direction and the left-side determination process are repeatedly executed until it is determined that a part of the left side EL1 is not included in the five selected pixels. When the five selected pixels respectively represent the holding member 11b (refer to Figure 4 ), the process of moving the positions of the five pixels to be judged one pixel upward in the column direction is stopped, and the upper end of the left side EL1 is determined. In addition, the pixels to be judged are not necessarily five pixels including the pixel PX1A, two pixels on the left side of the pixel PX1A, and two pixels on the right side of the pixel PX1A. For example, the pixels to be judged can also be three pixels including the pixel PX1A, one pixel on the left side of the pixel PX1A, and one pixel on the right side of the pixel PX1A, or four pixels including the pixel PX1A, two pixels on the left side of the pixel PX1A, and one pixel on the right side of the pixel PX1A, or four pixels including the pixel PX1A, one pixel on the left side of the pixel PX1A, and two pixels on the right side of the pixel PX1A.

[0098] If the upper end of the left side EL1 is determined, the process of moving the positions of the five pixels to be judged one pixel downward in the column direction and the left-side determination process are repeatedly executed until it is determined that a part of the left side EL1 is not included in the five pixels including the pixel PX1A, two pixels on the left side of the pixel PX1A, and two pixels on the right side of the pixel PX1A. By making the five selected pixels respectively correspond to the holding member 11b (refer to Figure 4 ), the process of moving the positions of the five pixels to be judged one pixel downward in the column direction is stopped, and the lower end of the left side EL1 is determined.

[0099] Figure 13This is a diagram for explaining the process of determining the left edge EL1 based on each pixel position corresponding to each maximum value (maximum value > first specified value) of the differential values obtained through the left edge determination process. In this example, multiple pixels PX1 are arranged in the column direction, and the multiple pixels PX1 include pixel positions (differential maximum positions PO1) corresponding to the maximum values (maximum value > first specified value) of the differential values respectively. In this case, for example, the left edge EL1 is determined by applying a specified algorithm to each differential maximum position PO1. Examples of the specified algorithm include RANSAC (Random Sample Consensus). Thus, the left edge of the first electronic component S1 is determined.

[0100] Figure 14 This is a flowchart of the process of the determination process ([ Figure 7 step S300) of the left edge EL1 in the first electronic component S1. The process shown in this flowchart is executed by the control unit 70 of the computer 50.

[0101] Refer to Figure 14 , the control unit 70 determines the positions of a specified number of pixels to be the object of the left edge determination process (step S400). For example, the control unit 70 determines 5 pixels as the object of the left edge determination process from the pixel PX1 at the upper left end of the captured image IM1 towards the right.

[0102] The control unit 70 generates an approximation curve based on the pixel values of the determined 5 pixels (step S410). The control unit 70 performs differentiation of the generated approximation curve (step S420). The control unit 70 determines whether the maximum value of the differential value is greater than the first specified value (step S430). If it is determined that the maximum value of the differential value is less than or equal to the first specified value (″No″ in step S430), the control unit 70 moves the positions of the 5 pixels to be the object of the left edge determination process diagonally downward to the right (step S440), and executes steps S410, S420, and S430 (left edge determination process) again.

[0103] On the other hand, if it is determined that the maximum value of the differential value is greater than the first specified value (″Yes″ in step S430), the control unit 70 executes the process of respectively determining the upper end and the lower end of the left edge EL1 (step S450). The process of respectively determining the upper end and the lower end of the left edge EL1 will be described in detail later.

[0104] If the upper end and the lower end of the left EL1 are determined respectively, the control unit 70 determines whether the difference between the length between the upper end and the lower end and the first specified length is less than the second specified value (step S460). The first specified length is, for example, a length corresponding to the specification value of the length between the upper end and the lower end of the electronic component S1. The second specified value can also be, for example, a length corresponding to 0.5%-5% of the specification value of the length between the upper end and the lower end of the electronic component S1.

[0105] If it is determined that the difference between the length between the upper end and the lower end and the first specified length is greater than or equal to the second specified value (″No″ in step S460), the control unit 70 performs the process of step S440 based on the maximum value of the differential values determined in step S430 being greater than the first specified value by 5 pixels. For example, this may occur when the spherical portion BA1 (refer to Figure 4 ) is included in the specified number of pixels that are the object of the left side determination process.

[0106] On the other hand, if it is determined that the difference between the length between the upper end and the lower end and the first specified length is less than the second specified value (″Yes″ in step S460), the control unit 70 determines the left EL1 based on each pixel position corresponding to each maximum value (maximum value > the first specified value) of the differential values obtained through the left side determination process (step S470).

[0107] Figure 15 is a flowchart of the process of the determination process ([[]] Figure 14 of step S450) of the upper end and the lower end of the left EL1. The process shown in this flowchart is executed by the control unit 70 of the computer 50.

[0108] Refer to Figure 15 , the control unit 70 moves the position of the specified number of pixels that are the object of the left side determination process 1 pixel upward in the column direction based on the position of the specified number of pixels (5 pixels) including the pixel PX1 corresponding to the maximum value (maximum value > the first specified value) of the differential value calculated in step S420 of [[[]] Figure 14 (step S500).

[0109] The control unit 70 generates an approximate curve based on the pixel values of the 5 pixels after the position change (step S510). The control unit 70 differentiates the generated approximate curve (step S520). The control unit 70 determines whether the maximum value of the differential value is greater than the first specified value (step S530). If it is determined that the maximum value of the differential value is greater than the first specified value (″Yes″ in step S530), the control unit 70 executes the process of step S500 again. On the other hand, if it is determined that the maximum value of the differential value is less than or equal to the first specified value (″No″ in step S530), the control unit 70 determines the upper end of the left EL1 (step S540).

[0110] The control unit 70 uses the positions of a specified number of pixels (5 pixels) including the pixel PX1 corresponding to the maximum value of the differential value calculated in Figure 14 step S420 (the maximum value > the first specified value) as a reference, and moves the positions of the specified number of pixels to be the object of the left-side determination process downward by 1 pixel in the column direction (step S550).

[0111] The control unit 70 generates an approximation curve based on the pixel values of the 5 pixels after the position change (step S560). The control unit 70 differentiates the generated approximation curve (step S570). The control unit 70 determines whether the maximum value of the differential value is greater than the first specified value (step S580). If it is determined that the maximum value of the differential value is greater than the first specified value (″Yes″ in step S580), the control unit 70 executes the process of step S550 again. On the other hand, if it is determined that the maximum value of the differential value is less than or equal to the first specified value (″No″ in step S580), the control unit 70 determines the lower end of the left side EL1 (step S590). Thus, the upper end and the lower end of the left side EL1 are determined.

[0112] In this way, in the cutting device 1 of the present embodiment, by repeatedly moving the positions of the specified number of pixels and performing the left-side determination process, at least a part of the plurality of inspection regions T1 is set. Therefore, according to the cutting device 1, for example, compared with the case where the inspection region T1 is set based on the pixel values of each pixel PX1 included in the entire captured image IM1, the inspection region T1 can be automatically set efficiently.

[0113] In addition, according to the cutting device 1, the positions of the specified number of pixels gradually move obliquely, and a part of any side (for example, the left side EL1) of the plurality of electronic components S1 intersects with the specified number of pixels at an earlier stage. Therefore, a part of any side of the plurality of electronic components S1 can be determined relatively efficiently.

[0114] In addition, according to the cutting device 1, since the other part of the left side EL1 is determined based on a part of the determined left side EL1, the entire left side EL1 can be determined relatively efficiently.

[0115] Figure 16 This is a diagram for explaining the process of determining the right side ER1 of the first electronic component S1. Refer to Figure 16 , after the left side EL1 is determined, the right side ER1 of the first electronic component S1 is determined based on the left side EL1.

[0116] Based on each pixel at a position that has been shifted by a plurality of pixels to the right in the row direction from the position of each pixel included in the left side EL1, a specified number of pixels (5 pixels) are selected toward the right in the row direction to generate a set of 5 pixels. For each set of 5 pixels included in the set of 5 pixels, a right side determination process is performed. The position of each pixel located on the leftmost side among the initially selected 5 pixels for determining the right side ER1 becomes a position that has been shifted by a plurality of pixels to the right in the row direction from the position of the left side EL1. The number of pixels shifted from the position of the left side EL1 is determined in advance, for example, based on the specification value of the length of the electronic component S1 in the left-right direction.

[0117] The right side determination process is a process of determining whether a part of the right side ER1 is included in the specified number of pixels based on the pixel values of the specified number of pixels. In the right side determination process, based on the pixel values of the specified number of pixels, the boundary between the holding member 11b and the electronic component S1 is determined. For example, from the right side to the left side in the figure, the part where pixels with a small pixel value (pixels corresponding to the holding member 11b (dark pixels)) and pixels with a large pixel value (pixels corresponding to the electronic component S1 (bright pixels)) are arranged adjacent to each other in this order is determined.

[0118] In the above left side determination process, for the 5 pixels that are the object of the left side determination process, based on how the pixel values change from the left side to the right side in the figure, it is determined whether a part of the left side EL1 is included in the specified number of pixels. On the other hand, in the right side determination process, for the 5 pixels that are the object of the right side determination process, based on how the pixel values change from the right side to the left side in the figure, it is determined whether a part of the right side ER1 is included in the specified number of pixels. This is because among the 5 pixels including the left side EL1, the pixel values increase (become brighter) from the left side to the right side, while among the 5 pixels including the right side ER1, the pixel values increase from the right side to the left side. In other respects, the content of the left side determination process is the same as the content of the right side determination process.

[0119] In the case where it is determined through the right side determination process that there are a specified number of pixels in the set of the specified number of pixels (the selected 5 pixels) that do not include a part of the right side ER1, the position of the set of the specified number of pixels is shifted 1 pixel to the right in the row direction. After that, the right side determination process is performed on the changed set of the specified number of pixels. By repeatedly performing the change of the position of the set of the specified number of pixels and the right side determination process, the position of the right side ER1 is determined.

[0120] Figure 17 It is a flowchart of the process representing the determination process of the right side ER1 in the first electronic component S1 ( Figure 7 step S310). The process shown in this flowchart is executed by the control unit 70 of the computer 50.

[0121] Reference Figure 17 Figure 17 , the control unit 70 determines the position of a set of a specified number of pixels to be the object of the right-side determination process (step S600). For example, with each pixel PX1 at a position obtained by moving a plurality of pixels to the right in the row direction from the position of each pixel PX1 included in the left edge EL1 as a reference, the control unit 70 determines, toward the right in the row direction, the position of a set of a specified number of pixels (five pixels) to be the object of the right-side determination process.

[0122] The control unit 70 generates a plurality of approximate curves based on the pixel values of each set of five pixels determined (step S610). The control unit 70 differentiates each of the generated plurality of approximate curves (step S620). The control unit 70 determines whether each maximum value of the differential values is greater than a first specified value (step S630). If it is determined that a part of the maximum value of the differential value is equal to or less than the first specified value (″No″ in step S630), the control unit 70 moves the position of the set of five pixels to be the object of the right-side determination process one pixel to the right (step S640).

[0123] The control unit 70 determines whether an error has occurred based on the position of the set of five pixels to be the object of the right-side determination process after the change (step S650). For example, when the length between the positions of the pixels at the left end of the set of five pixels to be the object of the right-side determination process after the change and the position of the left edge EL1 is longer than the specified value of the left-right direction length of the electronic component S1 and the difference is equal to or greater than a predetermined length, it is determined that an error has occurred.

[0124] If it is determined that an error has occurred (″Yes″ in step S650), the control unit 70 uses the five pixels that were finally determined in Figure 14 step S430 to have a maximum differential value greater than the first specified value as a reference and executes the process of step S440 again. On the other hand, if it is determined that no error has occurred (″No″ in step S650), the control unit 70 executes steps S610, S620, and S630 (right-side determination process) again.

[0125] On the other hand, if it is determined that each maximum value of the differential values is greater than the first specified value (″Yes″ in step S630), the control unit 70 determines the right edge ER1 based on the respective pixel positions corresponding to each maximum value of the differential values obtained through the right-side determination process (maximum value > first specified value) (step S650).

[0126] Figure 18 is a diagram for explaining the process of separately determining the upper edge ET1 and the lower edge EB1 of the first electronic component S1. Refer to Figure 18, after determining the left side EL1 and the right side ER1, the upper side ET1 and the lower side EB1 of the first electronic component S1 are determined based on the left side EL1 and the right side ER1 respectively.

[0127] Specifically, a set of a specified number of pixels (5 pixels) that are orthogonal to the straight line connecting the upper ends of the left side EL1 and the right side ER1 respectively and arranged in the column direction is selected, and the specified number of pixels located at the left end in the selected set of 5 pixels are used to perform the upper side determination process. The upper side determination process is as follows: Based on the pixel values of the specified number of pixels respectively, it is determined whether a part of the upper side ET1 is included in the specified number of pixels. In the upper side determination process, based on the pixel values of the specified number of pixels respectively, the boundary between the holding component 11b and the electronic component S1 is determined. For example, from the upper side to the lower side in the figure, the part where the pixels with smaller pixel values (pixels corresponding to the holding component 11b (dark pixels)) and the pixels with larger pixel values (pixels corresponding to the electronic component S1 (bright pixels)) are adjacent to each other in this order is determined.

[0128] In the above left side determination process, for the 5 pixels that are the objects of the left side determination process, based on how the pixel values change from the left side to the right side in the figure, it is determined whether a part of the left side EL1 is included in the specified number of pixels. On the other hand, in the upper side determination process, for the 5 pixels that are the objects of the upper side determination process, based on how the pixel values change from the upper side to the lower side in the figure, it is determined whether a part of the upper side ET1 is included in the specified number of pixels. This is because in the 5 pixels including the left side EL1, the pixel values increase (become brighter) from the left side to the right side, while in contrast, in the 5 pixels including the upper side ET1, the pixel values increase from the upper side to the lower side. In other respects, the content of the left side determination process is the same as the content of the upper side determination process.

[0129] The change of the position of the determined specified number of pixels to the right in the row direction and the upper side determination process are repeatedly executed until it is determined by the upper side determination process that a part of the upper side ET1 is not included in the specified number of pixels. By determining that a part of the upper side ET1 is not included in the specified number of pixels through the upper side determination process, the left end and the right end of the upper side ET1 are respectively determined, and the upper side ET1 is determined.

[0130] In addition, a predetermined number of pixels (five pixels) that are orthogonal to the straight line connecting the lower ends of the left side EL1 and the right side ER1 respectively and are arranged in the column direction are selected, and the predetermined number of pixels located at the left end in the set of the five pixels are used to perform a lower side determination process on the selected five pixels. The lower side determination process is as follows: Based on the pixel values of the predetermined number of pixels, it is determined whether a part of the lower side EB1 is included in the predetermined number of pixels. In the lower side determination process, based on the pixel values of the predetermined number of pixels, the boundary between the holding member 11b and the electronic component S1 is determined. For example, from the lower side to the upper side in the figure, the part where the pixels with smaller pixel values (pixels corresponding to the holding member 11b (dark pixels)) and the pixels with larger pixel values (pixels corresponding to the electronic component S1 (bright pixels)) are arranged in this order is determined.

[0131] In the above-mentioned left side determination process, for the five pixels that are the objects of the left side determination process, based on how the pixel values change from the left side to the right side in the figure, it is determined whether a part of the left side EL1 is included in the predetermined number of pixels. On the other hand, in the lower side determination process, for the five pixels that are the objects of the lower side determination process, based on how the pixel values change from the lower side to the upper side in the figure, it is determined whether a part of the lower side EB1 is included in the predetermined number of pixels. This is because in the five pixels including the left side EL1, the pixel values increase (become brighter) from the left side to the right side, while in contrast, in the five pixels including the lower side EB1, the pixel values increase from the lower side to the upper side. In other respects, the content of the left side determination process is the same as the content of the lower side determination process.

[0132] The change of the position of the determined predetermined number of pixels to the right in the row direction and the lower side determination process are repeatedly executed until it is determined by the lower side determination process that a part of the lower side EB1 is not included in the predetermined number of pixels. By determining that a part of the lower side EB1 is not included in the predetermined number of pixels through the lower side determination process, the left end and the right end of the lower side EB1 are respectively determined, and the lower side EB1 is determined.

[0133] Figure 19 It is a flowchart of the process representing the determination process of the upper side ET1 in the first electronic component S1 ( Figure 7 step S320). The process shown in this flowchart is executed by the control unit 70 of the computer 50.

[0134] Refer to Figure 19 and the control unit 70 determines the position of the predetermined number of pixels that are the objects of the upper side determination process (step S700). For example, the control unit 70 determines the predetermined number of pixels located at the left end in the set of the predetermined number of pixels (five pixels) that are orthogonal to the straight line connecting the upper ends of the left side EL1 and the right side ERl respectively and are arranged in the column direction as the objects of the upper side determination process.

[0135] The control unit 70 generates an approximation curve based on the pixel values of the five pixels determined (step S710). The control unit 70 differentiates the generated approximation curve (step S720). The control unit 70 determines whether the maximum value of the differential value is greater than a first specified value (step S730). If it is determined that the maximum value of the differential value is greater than the first specified value (″Yes″ in step S730), the control unit 70 moves the positions of the five pixels that are the objects of the upper edge determination process one pixel to the right in the row direction (step S740), and executes steps S710, S720, and S730 again (upper edge determination process).

[0136] On the other hand, if it is determined that the maximum value of the differential value is less than or equal to the first specified value (″No″ in step S730), the control unit 70 determines whether the difference between the length (left - right length) between the position of the upper end of the left side EL1 and the positions of a specified number of pixels for which it is determined that the maximum value of the differential value is less than or equal to the first specified value and a second specified length is less than a third specified value (step S750). The second specified length is, for example, a length corresponding to the specification value of the left - right direction length of the electronic component S1. The third specified value can also be, for example, a length corresponding to 0.5% - 5% of the specification value of the left - right direction length of the electronic component S1.

[0137] If it is determined that the difference between the left - right length and the second specified length is greater than or equal to the third specified value (″No″ in step S750), the control unit 70 uses the five pixels for which it was finally determined in Figure 14 step S430 that the maximum value of the differential value is greater than the first specified value as a reference, and executes the process of step S440 again.

[0138] On the other hand, if it is determined that the difference between the left - right length and the second specified length is less than the third specified value (″Yes″ in step S750), the control unit 70 determines the upper edge ET1 based on the respective pixel positions corresponding to the respective maximum values (maximum value > first specified value) of the differential values obtained through the upper edge determination process (step S760).

[0139] Figure 20 is a flowchart showing the process of the determination process of the lower edge EB1 in the first electronic component S1 ( Figure 7 step S330) of. The process shown in this flowchart is executed by the control unit 70 of the computer 50.

[0140] Refer to Figure 20 and the control unit 70 determines the positions of a specified number of pixels that are the objects of the lower edge determination process (step S800). For example, the control unit 70 determines, as the objects of the lower edge determination process, the specified number of pixels at the left end in a set of a specified number of pixels (five pixels) arranged in the column direction and orthogonal to the straight line connecting the lower ends of the left side EL1 and the right side ER1 respectively.

[0141] The control unit 70 generates an approximation curve based on the pixel values of the five determined pixels (step S810). The control unit 70 differentiates the generated approximation curve (step S820). The control unit 70 determines whether the maximum value of the differential value is greater than a first specified value (step S830). If it is determined that the maximum value of the differential value is greater than the first specified value (″Yes″ in step S830), the control unit 70 moves the positions of the five pixels that are the objects of the lower edge determination process one pixel to the right in the row direction (step S840), and steps S810, S820, and S830 are executed again (lower edge determination process).

[0142] On the other hand, if it is determined that the maximum value of the differential value is less than or equal to the first specified value (″No″ in step S830), the control unit 70 determines whether the difference between the length (left - right length) between the position of the lower end of the left - hand side EL1 and the positions of a specified number of pixels for which it is determined that the maximum value of the differential value is less than or equal to the first specified value and a second specified length is less than a third specified value (step S850).

[0143] If it is determined that the difference between the left - right length and the second specified length is greater than or equal to the third specified value (″No″ in step S850), the control unit 70 uses the five pixels that were finally determined in step S430 to have a maximum differential value greater than the first specified value as a reference and executes the process of step S440 again. Figure 14

[0144] On the other hand, if it is determined that the difference between the left - right length and the second specified length is less than the third specified value (″Yes″ in step S850), the control unit 70 determines the lower edge EB1 based on the respective pixel positions corresponding to the respective maximum values (maximum value > first specified value) of the differential values obtained through the lower edge determination process (step S860). Then, an inspection area T1 is set based on the determined left - hand side EL1, right - hand side ER1, upper edge ET1, and lower edge EB1.

[0145] Thus, according to the cutting device 1 of the present embodiment, since the other three sides of the electronic component S1 including the left - hand side EL1 are determined based on the determined left - hand side EL1, the inspection area T1 can be set relatively efficiently.

[0146] ​In addition, according to the cutting device 1, when exploring the right side ER1 opposite to the left side EL1, the left side EL1 has been determined, and the approximate positions of both ends (upper end and lower end) of the right side ER1 have been grasped. Therefore, the right side ER1 can be determined relatively efficiently. In addition, according to the cutting device 1, when exploring the other two sides (upper side ET1 and lower side EB1) other than the left side EL1 and the right side ER1, the left side EL1 and the right side ER1 have been determined, and the approximate positions of both ends of each of the other two sides other than the left side EL1 and the right side ER1 have been grasped. Therefore, the other two sides other than the left side EL1 and the right side ER1 can be determined relatively efficiently.

[0147] Figure 21 This is a diagram for explaining the process of setting other inspection regions T1 at positions after moving in the row direction or column direction relative to the first inspection region T1. Refer to Figure 21 , for example, based on the inspection region T1A, the inspection region T1B at a position moved in the row direction relative to the inspection region T1A and the inspection region T1C at a position moved in the column direction relative to the inspection region T1A are respectively set.

[0148] To set the inspection region T1 at a position moved in the row direction relative to the inspection region T1A, for example, a temporary inspection region T1B1 having the same shape as the inspection region T1A is selected. The shape of the temporary inspection region T1B1 is the same as that of the inspection region T1A. That is, the lengths of the left side, right side, upper side, and lower side of the temporary inspection region T1B1 are respectively the same as the lengths of the left side, right side, upper side, and lower side of the inspection region T1A.

[0149] The position of the temporary inspection region T1B1 is a position moved by a plurality of pixels in the row direction relative to the position of the inspection region T1A. The number of pixels moved from the position of the inspection region T1A is, for example, predetermined based on the specification value of the length of the electronic component S1 in the left-right direction.

[0150] If a temporary inspection region T1 (for example, the temporary inspection region T1B1) is selected, then a determination process (hereinafter, also referred to as "each side determination process") for determining whether the left side, right side, upper side, and lower side of the temporary inspection region T1 (for example, the temporary inspection region T1B1) respectively correspond to the left side, right side, upper side, and lower side of the electronic component S1 (for example, the electronic component S1B) is executed. In the each side determination process, the left side determination process is repeatedly executed along the left side of the temporary inspection region T1, and the right side determination process is repeatedly executed along the right side of the temporary inspection region T1. In addition, the upper side determination process is repeatedly executed along the upper side of the temporary inspection region T1, and the lower side determination process is repeatedly executed along the lower side of the temporary inspection region T1. Thereby, it is determined whether each side of the temporary inspection region T1 corresponds to the side of the electronic component S1.

[0151] If it is determined that any side of the temporary inspection area T1 does not correspond to the side of the electronic component S1, a new temporary inspection area T1 (for example, temporary inspection area T1B2) is selected at a position shifted by 1 pixel in the row direction. Thereafter, the side determination process is performed on the newly selected temporary inspection area T1. The process of shifting the position of the temporary inspection area T1 in the row direction and the side determination process are repeatedly executed until it is determined that each side of the temporary inspection area T1 corresponds to the side of the electronic component S1. Thus, other inspection areas T1 are set at positions shifted in the row direction with respect to the first inspection area T1. By repeating the same process, inspection areas T1 corresponding to each electronic component S1 existing at positions shifted in the row direction with respect to the first set inspection area T1 are set.

[0152] In order to set an inspection area T1 at a position shifted in the column direction with respect to the inspection area T1A, for example, a temporary inspection area T1C1 having the same shape as the inspection area T1A is selected. The shape of the temporary inspection area T1C1 is the same as the shape of the inspection area T1A. That is, the lengths of the left side, right side, upper side, and lower side of the temporary inspection area T1C1 are respectively the same as the lengths of the left side, right side, upper side, and lower side of the inspection area T1A.

[0153] The position of the temporary inspection area T1C1 is a position shifted by a plurality of pixels in the column direction with respect to the position of the inspection area T1A. The number of pixels shifted from the position of the inspection area T1A is, for example, determined in advance based on a specification value of the length of the electronic component S1 in the vertical direction.

[0154] If a temporary inspection area T1 (for example, temporary inspection area T1C1) is selected, the side determination process is performed. If it is determined that any side of the temporary inspection area T1 does not correspond to the side of the electronic component S1, a new temporary inspection area T1 (for example, temporary inspection area T1C2) is selected at a position shifted by 1 pixel in the column direction. Thereafter, the side determination process is performed on the newly selected temporary inspection area T1. The process of shifting the position of the temporary inspection area T1 in the column direction and the side determination process are repeatedly executed until it is determined that each side of the temporary inspection area T1 corresponds to the side of the electronic component S1. Thus, other inspection areas Tl are set at positions shifted in the column direction with respect to the first inspection area T1. By repeating the same process, inspection areas T1 corresponding to each electronic component S1 existing at positions shifted in the column direction with respect to the first set inspection area T1 are set.

[0155] Figure 22 is a flowchart of a process for setting other inspection areas T1 at positions shifted in the row direction with respect to the first inspection area T1 ( Figure 6 step S210). The process shown in this flowchart is executed by the control unit 70 of the computer 50.

[0156] Refer to Figure 22 , based on the set inspection area T1, the control unit 70 selects a temporary inspection area T1 at a position where it has moved a plurality of pixels in the row direction from the set inspection area T1 (step S900). The control unit 70 performs an edge determination process on the selected temporary inspection area T1 (step S910). The control unit 70 determines whether each edge of the temporary inspection area T1 corresponds to an edge of the electronic component S1 (step S920).

[0157] If it is determined that any edge of the temporary inspection area T1 does not correspond to an edge of the electronic component S1 (″No″ in step S920), the control unit 70 changes the position of the temporary inspection area T1 by moving it 1 pixel in the row direction (step S930). Then, the control unit 70 performs the processes of steps S910 and S920 again.

[0158] On the other hand, if it is determined that each edge of the temporary inspection area T1 corresponds to an edge of the electronic component S1 (″Yes″ in step S920), the control unit 70 sets the currently selected temporary inspection area T1 as the inspection area T1 (step S940). Then, the control unit 70 determines whether the inspection area T1 corresponding to all the electronic components S1 existing in the row direction has been set (step S950). If it is determined that the setting of the inspection area T1 corresponding to all the electronic components S1 existing in the row direction is not completed (″No″ in step S950), the control unit 70 performs the process of step S900 again. On the other hand, if it is determined that the inspection area T1 corresponding to all the electronic components S1 existing in the row direction has been set (″Yes″ in step S950), the processing shown in this flowchart ends.

[0159] Figure 23 It is a flowchart of the process of setting the other inspection area T1 at the position after moving the first inspection area T1 in the column direction ( Figure 6 step S220). The processing shown in this flowchart is executed by the control unit 70 of the computer 50.

[0160] Refer to Figure 23 , based on the set inspection area T1, the control unit 70 selects a temporary inspection area T1 at a position where it has moved a plurality of pixels in the column direction from the set inspection area T1 (step S1000). The control unit 70 performs an edge determination process on the selected temporary inspection area T1 (step S1010). The control unit 70 determines whether each edge of the temporary inspection area T1 corresponds to an edge of the electronic component S1 (step S1020).

[0161] If it is determined that any side of the temporary inspection area T1 does not correspond to the side of the electronic component S1 (″No″ in step S1020), the control unit 70 changes the position of the temporary inspection area T1 by moving it 1 pixel in the column direction (step S1030). Then, the control unit 70 executes the processes of steps S1010 and S1020 again.

[0162] On the other hand, if it is determined that each side of the temporary inspection area T1 corresponds to the side of the electronic component S1 (″Yes″ in step S1020), the control unit 70 sets the currently selected temporary inspection area T1 as the inspection area T1 (step S1040). Then, the control unit 70 determines whether the inspection area T1 corresponding to all the electronic components S1 existing in the column direction is set (step S1050). If it is determined that the setting of the inspection area T1 corresponding to all the electronic components S1 existing in the column direction is not completed (″No″ in step S1050), the control unit 70 executes the process of step S1000 again. On the other hand, if it is determined that the inspection area T1 corresponding to all the electronic components S1 existing in the column direction is set (″Yes″ in step S1050), the processing shown in this flowchart ends.

[0163] Thus, according to the cutting device 1 of the present embodiment, since other inspection areas T1 are determined based on the initially determined inspection area T1, a plurality of inspection areas T1 can be determined relatively efficiently.

[0164] [4. Features]

[0165] As described above, in the cutting device 1 of the present embodiment, by repeatedly moving the position of a specified number of pixels PXl and executing a determination process (for example, a left side determination process), at least a part of a plurality of inspection areas T1 is set. Therefore, according to the cutting device 1, for example, compared with the case where the inspection area Tl is set based on the pixel values of each pixel PX1 included in the entire captured image IM1, the inspection area T1 can be automatically set efficiently.

[0166] In addition, the cutting device 1 is an example of the ″cutting device″ in the present invention. The electronic component S1 is an example of the ″cut product″ in the present invention. The first optical inspection camera 12 and the second optical inspection camera 13 are examples of the ″imaging unit″ in the present invention. The control unit 70 is an example of the ″first processing unit″ in the present invention and is also an example of the ″second processing unit″. The captured image IMl is an example of the ″captured image″ in the present invention.

[0167] [5. Other Embodiments]

[0168] The concept of the above-described embodiments is not limited to the embodiments described above. For example, the structures of at least a part of any one embodiment and the structures of at least a part of any other embodiment can be combined. Hereinafter, an example of other embodiments to which the concept of the above-described embodiments can be applied will be described.

[0169] <5-1>

[0170] In the above-described embodiment, the cutting device 1 is controlled by the computer 50. However, the cutting device 1 does not need to be controlled by a single computer 50 and can also be controlled by multiple computers.

[0171] <5-2>

[0172] In addition, in the above-described embodiment, the color of the holding member 11b of the inspection workbench 11 is black. However, as described above, the color of the holding member 11b can also be white. When the color of the holding member 11b is white, the pixel value on the left side of the electronic component S1 decreases from left to right, and the pixel value on the right side decreases from right to left. In addition, the pixel value on the upper side of the electronic component S1 decreases from top to bottom, and the pixel value on the lower side decreases from bottom to top. Therefore, in the left determination process, when the minimum value of the differential value of the approximate curve representing the change of the pixel value from left to right is less than the threshold value, it can also be determined that a part of the left side is included in a specified number of pixels. In addition, in the left determination process, when the maximum value of the differential value of the approximate curve representing the change of the pixel value from right to left is greater than the threshold value, it can also be determined that a part of the left side is included in a specified number of pixels. It can be said that the same applies to the right determination process, the upper determination process, and the lower determination process.

[0173] <5-3>

[0174] In addition, in the above-described embodiment, in order to set the initial inspection area T1, the left side EL1 was first determined. However, the initially determined side is not limited to the left side EL1. The right side ER1 can be initially determined, the upper side ET1 can be initially determined, or the lower side EB1 can be initially determined.

[0175] <5-4>

[0176] In addition, in the process of separately determining the left side EL1, the right side ER1, the upper side ET1, and the lower side EB1, the pixel unit when moving a specified number of pixels does not have to be 1 pixel. It is also possible to move the position of a specified number of pixels in units of multiple pixels. In addition, the specified number of pixels does not have to be 5 pixels. The specified number of pixels can be any number of pixels of 2 or more. In addition, in the process of setting the inspection regions T1 after the second one, the pixel unit when moving the temporary inspection region T1 does not have to be 1 pixel either. It is also possible to move the position of the temporary inspection region T1 in units of multiple pixels.

[0177] <5-5>

[0178] In addition, in the above-described embodiment, each side of the electronic component S1 in the captured image IM1 is determined based on the differential value of the approximate curve generated from the pixel values of the respective specified number of pixels. However, when determining each side of the electronic component S1 in the captured image IM1, it is not necessary to use this differential value.

[0179] <5-6>

[0180] In addition, in the above-described embodiment, only a part of the multiple electronic components S1 arranged on the inspection workbench 11 is captured at once by the second optical inspection camera 13. However, the imaging area of the second optical inspection camera 13 is not limited to this, and it is also possible to capture all of the multiple electronic components S1 arranged on the inspection workbench 11 at once by the second optical inspection camera 13.

[0181] <5-7>

[0182] In addition, in the above-described embodiment, a part of the inspection region T1 (for example Figure 4 the inspection region T1D) in the inspection regions T1 set after the second one is set without going through the respective side determination process. However, the setting method of the inspection regions T1 set after the second one is not limited to this. For example, it is also possible to set all of the inspection regions T1 set after the second one in the captured image IM1 via the respective side determination process.

[0183] <5-8>

[0184] In addition, in the above-described embodiment, after setting the first inspection region T1, the inspection region T1 at the position moved in the row direction is set, and then, the inspection region T1 at the position moved in the column direction is set. However, the setting order of the respective inspection regions T1 is not limited to this. For example, after setting the first inspection region T1, the inspection region T1 at the position moved in the column direction can be set first, and then, the inspection region T1 at the position moved in the row direction can be set.

[0185] <5-9>

[0186] In addition, in the above-described embodiment, in order to set the first inspection area T1, the left side EL1, the right side ER1, the upper side ET1, and the lower side EB1 were determined in sequence. However, the order of determining each side is not limited to this.

[0187] <5-10>

[0188] In addition, in the above-described embodiment, the setting of the inspection area T1 in the captured image IM1 captured by the second optical inspection camera 13 was mainly described, but the same processing may also be performed in the setting of the inspection area in the captured image captured by the first optical inspection camera 12.

[0189] <5-ll>

[0190] In addition, in the above-described embodiment, when determining a part of the left side ELl and determining another part of the left side ELl, the upper end of the left side EL1 is first determined, and then the lower end of the left side ELl is determined. However, the order of determining the upper end and the lower end is not limited to this. For example, when determining a part of the left side ELl and determining another part of the left side EL1, the lower end of the left side EL1 may also be first determined, and then the upper end of the left side ELl may be determined.

[0191] The embodiments of the present invention have been described by way of example above. That is, for the purpose of exemplary illustration, detailed descriptions and drawings have been disclosed. Therefore, among the components described in the detailed description and the drawings, there may be components that are not necessary for solving the problems. Therefore, these non-necessary components should not be directly recognized as necessary just because they are described in the detailed description and the drawings.

[0192] In addition, the above-described embodiments are merely examples of the present invention in all aspects. Various improvements and changes can be made within the scope of the present invention. For example, at least a part of the structure of any one embodiment can be combined with at least a part of the structure of any other embodiment. That is, when implementing the present invention, a specific structure can be appropriately adopted according to the embodiment.

[0193] [6. Addendum]

[0194] <Technology 1>

[0195] (Configuration)

[0196] A cutting device for manufacturing a plurality of cut products by cutting a substrate, comprising:

[0197] A photographing unit that generates a photographed image by photographing a part or all of the plurality of cut products;

[0198] A first processing unit that sets a plurality of inspection regions in the captured image; and

[0199] A second processing unit that inspects the appearance of each cut product included in the captured image based on the images included in the plurality of inspection regions in the captured image,

[0200] The shapes of the plurality of inspection regions are each rectangular,

[0201] The shape of each cut product is rectangular,

[0202] The first processing unit performs a determination process of determining whether a part of any side of the plurality of cut products is included in the specified number of pixels that are continuously located in the first direction in the captured image, based on the pixel values of the specified number of pixels respectively.

[0203] The specified number is less than the number of pixels in the entire captured image,

[0204] The first processing unit sets at least a part of the plurality of inspection regions by repeatedly moving the position of the specified number of pixels and performing the determination process.

[0205] (Effect, etc.)

[0206] In this cutting device, at least a part of the plurality of inspection regions is set by repeatedly moving the position of the specified number of pixels and performing the above determination process. Therefore, according to this cutting device, for example, compared with the case of setting the inspection regions based on the pixel values of each pixel included in the entire captured image, the inspection regions can be automatically set efficiently.

[0207] <Technology 2>

[0208] (Configuration)

[0209] The cutting device according to Technology 1, wherein

[0210] The left side, right side, upper side, and lower side of the captured image are respectively parallel to the left side, right side, upper side, and lower side of each cut product.

[0211] <Technology 3>

[0212] (Configuration)

[0213] The cutting device according to Technology 1 or Technology 2, wherein

[0214] The first processing unit sets at least a part of the plurality of inspection regions by repeatedly moving the position of the specified number of pixels in the second direction and performing the determination process,

[0215] The second direction is a direction inclined with respect to the first direction.

[0216] (Effect, etc.)

[0217] According to this cutting device, since the positions of a specified number of pixels gradually move obliquely, a part of any side of multiple cut products crosses a specified number of pixels at an earlier stage, so it is possible to determine a part of any side of multiple cut products relatively efficiently.

[0218] <Technology 4>

[0219] (Configuration)

[0220] The cutting device according to any one of Technologies 1 to 3, wherein

[0221] The first direction is the row direction or the column direction.

[0222] <Technology 5>

[0223] (Configuration)

[0224] The cutting device according to Technology 3 or Technology 4, wherein

[0225] The first processing unit moves the positions of the specified number of pixels by one pixel or more in the row direction and by one pixel or more in the column direction, and moves the positions of the specified number of pixels in the second direction.

[0226] (Effect, etc.)

[0227] According to this cutting device, the positions of a specified number of pixels gradually move in units of one pixel or more in the row direction and in units of one pixel or more in the column direction, and a part of any side of multiple cut products crosses a specified number of pixels at an earlier stage, so it is possible to determine a part of any side of multiple cut products relatively efficiently.

[0228] <Technology 6>

[0229] (Configuration)

[0230] The cutting device according to any one of Technologies 1 to 5, wherein

[0231] When the first processing unit determines, through the determination process, that a part of the first side, which is any side of the multiple cut products, is included in the specified number of pixels, the first side is determined by determining other parts of the first side based on at least a part of the specified number of pixels determined to include the part of the first side.

[0232] (Effect, etc.)

[0233] According to this cutting device, since other parts of the first side are determined based on a part of the determined first side, the entire first side can be determined relatively efficiently.

[0234] <Technology 7>

[0235] (Composition)

[0236] For the cutting device according to Technology 6, wherein

[0237] The first processing unit determines the other three sides of the cut product including the first side based on the determined first side, and sets any one of the plurality of inspection areas based on the determined four sides.

[0238] (Effects, etc.)

[0239] According to this cutting device, since the other three sides of the cut product including the first side are determined based on the determined first side, the inspection area can be set relatively efficiently.

[0240] <Technology 8>

[0241] (Composition)

[0242] For the cutting device according to Technology 7, wherein

[0243] The first processing unit determines the second side opposite to the first side among the other three sides based on the determined first side, and then determines the two sides other than the first side and the second side.

[0244] (Effects, etc.)

[0245] According to this cutting device, when exploring the second side opposite to the first side, the first side has been determined and the approximate positions of both ends of the second side have been grasped, so the second side can be determined relatively efficiently. In addition, according to this cutting device, when exploring the two sides other than the first side and the second side, the first side and the second side have been determined and the approximate positions of both ends of each of the two sides other than the first side and the second side have been grasped, so the two sides other than the first side and the second side can be determined relatively efficiently.

[0246] <Technology 9>

[0247] (Composition)

[0248] For the cutting device according to any one of Technologies 1 to 8, wherein

[0249] The first processing unit sets the other inspection areas among the plurality of inspection areas based on the initially set inspection area among the plurality of inspection areas.

[0250] (Effects, etc.)

[0251] According to this cutting device, since other inspection areas are determined based on the initially determined inspection area, multiple inspection areas can be determined relatively efficiently.

[0252] <Technology 10>

[0253] (Constitution)

[0254] A method for manufacturing a cut product, using the cutting device according to any one of Technologies 1 to 9,

[0255] The cutting device includes:

[0256] A cutting workbench for arranging the substrate; and

[0257] A cutting unit for cutting the substrate arranged on the cutting workbench,

[0258] The manufacturing method includes:

[0259] The step of arranging the substrate on the cutting workbench;

[0260] The step of manufacturing the multiple cut products by cutting the substrate arranged on the cutting workbench;

[0261] The step of generating the captured image by photographing a part or all of the multiple cut products;

[0262] The step of setting the multiple inspection areas in the captured image; and

[0263] The step of inspecting the appearance of each cut product included in the captured image based on the images included in the multiple inspection areas in the captured image.

[0264] (Effects, etc.)

[0265] In this method for manufacturing a cut product, at least a part of the multiple inspection areas is set by repeatedly moving the position of a specified number of pixels and performing the above determination process. Therefore, according to this method for manufacturing a cut product, for example, compared with the case of setting inspection areas based on the pixel values of each pixel included in the entire captured image, inspection areas can be automatically set efficiently.

Claims

1. A cutting device for manufacturing a plurality of cut products by cutting a substrate, comprising: An imaging unit that generates an imaging image by imaging a part or all of the plurality of cut products; A first processing unit that sets a plurality of inspection regions in the imaging image; And A second processing unit that inspects the appearance of each cut product included in the imaging image based on the images included in the plurality of inspection regions in the imaging image, The shapes of the plurality of inspection regions are each rectangular, The shape of each cut product is rectangular, The first processing unit performs a determination process of determining whether a part of any side of the plurality of cut products is included in the specified number of pixels that are continuously located in the first direction in the imaging image, based on the pixel values of the specified number of pixels; The specified number is less than the number of pixels in the entire imaging image, The first processing unit sets at least a part of the plurality of inspection regions by repeatedly moving the positions of the specified number of pixels and performing the determination process.

2. The cutting device according to claim 1, wherein The left side, right side, upper side, and lower side of the imaging image are respectively parallel to the left side, right side, upper side, and lower side of each cut product.

3. The cutting device according to claim 1 or 2, wherein The first processing unit sets at least a part of the plurality of inspection regions by repeatedly moving the positions of the specified number of pixels in a second direction and performing the determination process, The second direction is a direction inclined with respect to the first direction.

4. The cutting device according to any one of claims 1 to 3, wherein The first direction is a row direction or a column direction.

5. The cutting device according to claim 3 or 4, wherein The first processing unit moves the positions of the specified number of pixels by one pixel or more in the row direction and one pixel or more in the column direction, to move the positions of the specified number of pixels in the second direction.

6. The cutting device according to any one of claims 1 to 5, wherein When the first processing unit determines, through the determination process, that a part of a first side, which is any side of the plurality of cut products, is included in the specified number of pixels, the first processing unit determines the other part of the first side based on at least a part of the specified number of pixels determined to include the part of the first side, and determines the first side.

7. The cutting device according to claim 6, wherein The first processing unit determines the other three sides of the cut product including the first side based on the determined first side, and sets any one of the plurality of inspection regions based on the determined four sides.

8. The cutting device according to claim 7, wherein The first processing unit determines a second side opposite to the first side among the other three sides based on the determined first side, and then determines the two sides other than the first side and the second side.

9. The cutting device according to any one of claims 1 to 8, wherein The first processing unit sets other inspection regions among the plurality of inspection regions based on the initially set inspection region among the plurality of inspection regions.

10. A method for manufacturing a cut product, using the cutting device according to any one of claims 1 to 9, The cutting device includes: Cutting workbench, configured with the substrate; and a cutting unit that cuts the substrate disposed on the cutting table, The manufacturing method includes: a step of disposing the substrate on the cutting table; a step of manufacturing the plurality of cut products by cutting the substrate disposed on the cutting table; a step of generating the captured image by capturing part or all of the plurality of cut products; a step of setting the plurality of inspection regions in the captured image; and a step of inspecting the appearance of each cut product included in the captured image based on the images included in the respective inspection regions in the captured image.

Images