High-integration uncooled infrared heterogeneous intelligent processing device

Abstract

The invention provides a high-integration uncooled infrared heterogeneous intelligent processing device, and relates to the technical field of intelligent infrared imaging and processing. The device comprises an infrared assembly used for obtaining an infrared image; the infrared vision chip circuit board comprises an input and output bus; the field programmable gate array system circuit board comprises: a buffer array; a field programmable gate array; a flash memory; and the power interface circuit board comprises a plurality of interface circuits connected with the field programmable gate array, and the plurality of interface circuits are used for receiving and outputting various types of data. The high-integration non-refrigeration infrared heterogeneous intelligent processing device provided by the invention is based on a high-energy-efficiency non-refrigeration infrared visual component and a programmable logic device heterogeneous hardware architecture, does not need operation of an operation system, is small in size, light in weight, high in speed and low in time delay, has in-situ intelligent information processing and storage capability, and is suitable for popularization and application. And the system can be conveniently integrated into an unmanned system with a limited space.

Description

Technical Field

[0001] The present invention relates to the technical field of intelligent infrared imaging and processing, and particularly to a highly integrated uncooled infrared heterogeneous intelligent processing device. Background Art

[0002] Infrared vision devices are widely used in fields such as solar panel detection, drying monitoring of various consumer goods, wafer detection, and drone pods. However, current infrared vision devices are based on discrete device circuits, with large volume, weight, and delay, and lack the ability to intelligently process infrared images. Summary of the Invention

[0003] In view of the above problems, an embodiment of the present invention provides a highly integrated uncooled infrared heterogeneous intelligent processing device.

[0004] One aspect of the present invention provides a highly integrated uncooled infrared heterogeneous intelligent processing device that operates without an operating system. The device includes, connected in sequence: an infrared component for acquiring an infrared image; an infrared vision chip circuit board including an input / output bus; a field-programmable gate array (FPGA) system circuit board including a buffer array for temporarily storing the infrared image; an FPGA connected to the infrared component through the input / output bus for processing the infrared image; a flash memory for storing and transmitting initialization data of the infrared component and the FPGA; and a power interface circuit board including a plurality of interface circuits connected to the FPGA, the plurality of interface circuits being used for receiving and outputting multiple types of data.

[0005] According to an embodiment of the present invention, the highly integrated uncooled infrared heterogeneous intelligent processing device further includes: an infrared vision chip circuit support for supporting the infrared vision chip circuit board.

[0006] According to an embodiment of the present invention, the highly integrated uncooled infrared heterogeneous intelligent processing device further includes: a solid-state memory circuit board disposed on a side of the infrared vision chip circuit support away from the infrared vision chip circuit board, the solid-state memory circuit board including a high-speed memory circuit for storing the infrared image; and a solid-state storage support disposed on a side of the solid-state memory circuit board away from the infrared vision chip circuit support, the solid-state storage support being used for supporting the solid-state memory circuit board.

[0007] According to an embodiment of the present invention, the infrared component is made by heterogeneous integration and three-dimensional stacking. The infrared component includes: a non-cooled infrared focal plane detector for converting infrared radiation emitted by a target object into an electrical signal; a pixel-level readout circuit for reading the electrical signal pixel by pixel, and performing preliminary signal conditioning and digitization to obtain an original infrared image; a lidar circuit for acquiring three-dimensional spatial information of the target object; an infrared pre-processor for optimizing the original infrared image according to the three-dimensional spatial information to obtain an optimized infrared image; and a programmable neural network accelerator for processing the optimized infrared image to obtain an infrared image.

[0008] According to an embodiment of the present invention, the multiple interface circuits include: a display interface circuit for outputting the infrared image and the processing result of the infrared image; a communication interface circuit including: a serial interface circuit for receiving and outputting control instructions of the highly integrated non-cooled infrared heterogeneous intelligent processing device; a gigabit network interface circuit for realizing data transfer through external communication; and a 10-gigabit network interface circuit for outputting the infrared image and high-speed data acquisition.

[0009] According to an embodiment of the present invention, the field programmable gate array includes: a control acquisition and drive module connected to the infrared component for realizing communication between the field programmable gate array and the infrared component; a display drive module connected to the display interface circuit for realizing the output of the infrared image and the processing result of the infrared image; a high-speed data control module connected to the 10-gigabit network interface circuit for realizing the output of the infrared image and high-speed data acquisition, and controlling the field programmable gate array; an accelerator processing module for processing the infrared image; an instruction module connected to the serial interface circuit for analyzing and transmitting control instructions; and a data transmission module connected to the gigabit network interface circuit for realizing data transmission between the field programmable gate array and the flash memory.

[0010] According to an embodiment of the present invention, the accelerator processing module includes: a reconfigurable neural network accelerator for implementing at least one image processing algorithm in target detection, recognition, and tracking.

[0011] According to an embodiment of the present invention, the gigabit network interface circuit, the data transmission module, and the flash memory are connected in sequence to form an initialization data update link for realizing the update of initialization data.

[0012] According to an embodiment of the present invention, the display interface circuit is connected to at least one of a display and a platform video acquisition device.

[0013] According to an embodiment of the present invention, the communication interface circuit realizes interface drive and communication protocol by the field programmable gate array, and the communication interface circuit communicates with at least one of a pan-tilt, a system platform, and an optical lens.

[0014] According to an embodiment of the present invention, the highly integrated uncooled infrared heterogeneous intelligent processing device further includes: a fixed panel, and the infrared component is fixed between the fixed panel and the infrared vision chip circuit board.

[0015] According to an embodiment of the present invention, the infrared vision chip circuit board is fixed on the infrared vision chip circuit support member.

[0016] According to an embodiment of the present invention, the solid-state memory circuit board is fixed on the solid-state storage support member.

[0017] According to an embodiment of the present invention, the highly integrated uncooled infrared heterogeneous intelligent processing device further includes: a field-programmable gate array heat dissipation support frame, and the field-programmable gate array system circuit board is fixed on the field-programmable gate array heat dissipation support frame.

[0018] According to an embodiment of the present invention, the highly integrated uncooled infrared heterogeneous intelligent processing device further includes: an interface panel, and the power interface circuit board is fixed on the interface panel.

[0019] According to an embodiment of the present invention, the functions of the field-programmable gate array system circuit board include at least one of infrared chip drive control, data acquisition, solid-state storage read / write drive, cache control, intelligent image processing, network data transmission, standard display drive, and optical lens control drive.

[0020] According to an embodiment of the present invention, a solid-state memory with a SATA interface or an NVME interface is provided on the solid-state memory circuit board.

[0021] According to an embodiment of the present invention, at least one of a heat dissipation fin and a heat dissipation fan is provided on the fixed panel.

[0022] According to an embodiment of the present invention, the power interface circuit board further includes a power supply circuit for providing power to the highly integrated uncooled infrared heterogeneous intelligent processing device.

[0023] According to an embodiment of the present invention, an optical lens mounting opening is provided on the infrared component.

[0024] The highly integrated uncooled infrared heterogeneous intelligent processing device provided by the present invention is based on an energy-efficient uncooled infrared vision component and a programmable logic device heterogeneous hardware architecture, does not require an operating system to run, is small in size, light in weight, high-speed and low-latency, and has the ability of in-situ intelligent information processing and storage, and can be conveniently integrated into an unmanned system with limited space. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Through the following description of the embodiments of the present invention with reference to the drawings, the above content and other objects, features, and advantages of the present invention will become clearer. In the drawings:

[0026] Figure 1 Schematically shows the structural diagram of a highly integrated uncooled infrared heterogeneous intelligent processing device according to an embodiment of the present invention;

[0027] Figure 2 Schematically shows the schematic diagram of a highly integrated uncooled infrared heterogeneous intelligent processing device according to an embodiment of the present invention.

[0028]

Description of Reference Numerals

[0029] 1 - Fixed panel; 2 - Infrared component; 3 - Infrared vision chip circuit board; 4 - Infrared vision chip circuit support; 5 - Solid - state memory circuit board; 6 - Solid - state memory support; 7 - Field - programmable gate array system circuit board; 8 - Field - programmable gate array heat dissipation support frame; 9 - Power interface circuit board; 10 - Interface panel. Detailed Embodiments

[0030] To make the objectives, technical solutions, and advantages of the present invention clearer and more understandable, the following further details the present invention with reference to specific embodiments and the accompanying drawings.

[0031] It should be noted that in the drawings or the description of the specification, similar or identical parts are denoted by the same reference numerals. The technical features in the various embodiments exemplified in the specification can be freely combined to form new solutions without conflict. Moreover, in the drawings, the shape or thickness of the embodiments can be enlarged, simplified, or conveniently marked. Furthermore, the elements or implementation manners not shown or described in the drawings are in forms known to those of ordinary skill in the art. Additionally, although this text may provide examples with parameters including specific values, it should be understood that the parameters do not necessarily exactly equal the corresponding values, but can approximate the corresponding values within an acceptable error tolerance or design constraint.

[0032] Unless there are technical obstacles or contradictions, the above - mentioned various embodiments of the present invention can be freely combined to form additional embodiments, and these additional embodiments are all within the protection scope of the present invention.

[0033] Although the present invention is described with reference to the accompanying drawings, the embodiments disclosed in the drawings are intended to exemplarily illustrate the preferred embodiments of the present invention and should not be construed as a limitation on the present invention. The dimensional ratios in the drawings are merely schematic and should not be construed as a limitation on the present invention.

[0034] Although some embodiments of the general concept of the present invention have been shown and described, those of ordinary skill in the art will understand that changes can be made to these embodiments without departing from the principles and spirit of the general disclosure of the present invention.

[0035] Figure 1The structural diagram of a highly integrated uncooled infrared heterogeneous intelligent processing device according to an embodiment of the present invention is schematically shown.

[0036] As Figure 1 shown, an embodiment of the present invention provides a highly integrated uncooled infrared heterogeneous intelligent processing device that operates without an operating system. The device includes, connected in sequence: an infrared component 2 for acquiring an infrared image; an infrared vision chip circuit board 3 including an input / output bus; a field programmable gate array system circuit board 7 including: a buffer array for temporarily storing the infrared image; a field programmable gate array connected to the infrared component 2 through the input / output bus for processing the infrared image; a flash memory for storing and transmitting initialization data of the infrared component 2 and the field programmable gate array; and a power interface circuit board 9 including a plurality of interface circuits connected to the field programmable gate array, and the plurality of interface circuits are used for receiving and outputting various types of data.

[0037] Please continue to refer to Figure 1 , the highly integrated uncooled infrared heterogeneous intelligent processing device further includes: a fixed panel 1, and the infrared component 2 is fixed between the fixed panel 1 and the infrared vision chip circuit board 3. For example, the infrared component 2, the infrared vision chip circuit board 3, and the fixed panel 1 can be stacked and fixed together by screws.

[0038] In some embodiments, heat dissipation fins and fan fixing holes can be provided on the fixed panel 1, and a fan can be installed as needed to enhance the heat dissipation performance of the component.

[0039] According to an embodiment of the present invention, the infrared component 2 is made by heterogeneous integration and three-dimensional stacking. The infrared component 2 includes: an uncooled infrared focal plane detector for converting infrared radiation emitted by a target object into an electrical signal; a pixel-level readout circuit for reading the electrical signal pixel by pixel and performing preliminary signal conditioning and digitization to obtain an original infrared image; a lidar circuit for acquiring three-dimensional spatial information of the target object; an infrared preprocessor for optimizing the original infrared image according to the three-dimensional spatial information to obtain an optimized infrared image; and a programmable neural network accelerator for processing the optimized infrared image to obtain an infrared image.

[0040] In some embodiments, the infrared component 2 can be, for example, a component composed of devices such as an infrared vision chip. An intelligent image processing algorithm based on a neural network is deployed on the above-mentioned infrared vision chip, and it can support programmable reconstruction of different task data according to the technical requirements of different scenarios, and can realize high-energy-efficiency intelligent image detection, acquisition, ranging, and visual tasks such as target recognition, detection, and tracking.

[0041] In some embodiments, an optical lens mounting opening can be provided outside the infrared component 2 for mounting a lens.

[0042] According to an embodiment of the present invention, the high-integration uncooled infrared heterogeneous intelligent processing device further includes: an infrared vision chip circuit support 4 for supporting the infrared vision chip circuit board 3.

[0043] In some embodiments, for example, the infrared vision chip circuit board 3 can be fixed to the infrared vision chip circuit support 4 by screws.

[0044] Please continue to refer to Figure 1 , the high-integration uncooled infrared heterogeneous intelligent processing device further includes: a solid-state memory circuit board 5 disposed on a side of the infrared vision chip circuit support 4 away from the infrared vision chip circuit board 3. The solid-state memory circuit board 5 includes a high-speed memory circuit for storing infrared images; a solid-state memory support 6 disposed on a side of the solid-state memory circuit board 5 away from the infrared vision chip circuit support 4 for supporting the solid-state memory circuit board 5.

[0045] In some embodiments, a solid-state memory circuit board 5 can be introduced into the high-integration uncooled infrared heterogeneous intelligent processing device to handle tasks with a large storage requirement and expand the storage capacity of the device. At least one high-speed memory is provided on the solid-state memory circuit board 5, and the high-speed memory can be used to store image data that cannot be stored in a large number of caches for subsequent invocation by other devices.

[0046] In some embodiments, a solid-state memory with an SATA (Serial Advanced Technology Attachment) interface or an NVME (Non-Volatile Memory Express) interface can be provided on the solid-state memory circuit board 5. Among them, the SATA interface and the NVME interface are two different solid-state drive interfaces. The SATA solid-state drive is suitable for scenarios where a large amount of data needs to be stored, such as scenarios for documents, music, movies, and games. They usually have a large capacity and are suitable for application scenarios that require large-capacity storage. The NVMe solid-state drive is suitable for scenarios that require high read and write speeds, such as operating system installation, running large software, and games. Its read and write speeds are extremely fast, which can significantly improve the response speed of the system and software.

[0047] In some embodiments, for example, the solid-state memory circuit board 5 can be fixed to the solid-state memory support 6 by screws.

[0048] According to an embodiment of the present invention, the functions of the field programmable gate array system circuit board 7 include at least one of infrared chip drive control, data acquisition, solid-state storage read / write drive, cache control, intelligent image processing, network data transmission, standard display drive, and optical lens control drive. Through the field programmable gate array system circuit board 7, various intelligent information processing and storage capabilities can be achieved.

[0049] In some embodiments, the field programmable gate array system circuit board 7 may include a buffer array, a field programmable gate array, and a flash memory.

[0050] Please continue to refer to Figure 1 , the high-integration uncooled infrared heterogeneous intelligent processing device further includes: a field programmable gate array heat dissipation support frame 8, and the field programmable gate array system circuit board 7 can be fixed on the field programmable gate array heat dissipation support frame 8 by screws, for example.

[0051] According to an embodiment of the present invention, the power interface circuit board 9 includes a display interface circuit and a communication interface circuit, wherein the communication interface circuit includes a serial interface circuit, a gigabit network interface circuit, and a ten-gigabit network interface circuit.

[0052] In some embodiments, a DP (Display Port) connector, a Type-C connector, and a micro-rectangular connector may be integrated on the power interface circuit board 9.

[0053] Among them, the DP connector can be directly connected to a standard display, the Type-C connector can transmit ten-gigabit network signals, and the micro-rectangular connector can transmit gigabit network and serial signals.

[0054] In some embodiments, the power interface circuit board 9 further includes a power supply circuit for providing power to the high-integration uncooled infrared heterogeneous intelligent processing device.

[0055] Please continue to refer to Figure 1 , the high-integration uncooled infrared heterogeneous intelligent processing device further includes: an interface panel 10, and the power interface circuit board 9 can be fixed on the interface panel 10 by screws, for example.

[0056] The structural members of the embodiment of the present invention include an interface panel 10, a field programmable gate array heat dissipation support frame 8, a solid-state storage support member 6, an infrared vision chip circuit support member 4, and a fixing panel 1. The above structural members are stacked and fixed by screws to form a compact device housing.

[0057] The various circuit boards of the embodiment of the present invention are stacked and fixed through board-to-board connectors, and at the same time, they are stacked and fixed with the adjacent structural members of each circuit board by screws to form a compact overall structural housing of the above device to achieve cooling by conduction.

[0058] The high-integration uncooled infrared heterogeneous intelligent processing device in the embodiments of the present invention is small in size, light in weight and high in integration, and is particularly suitable for the integration of intelligent infrared pods on UAV platforms.

[0059] Figure 2 Schematically shows the schematic diagram of the high-integration uncooled infrared heterogeneous intelligent processing device according to the embodiments of the present invention.

[0060] As Figure 2 shown, the buffer array can be, for example, a DDR3 (Double-Data-Rate-3) memory array, and the buffer array can temporarily store a small amount of infrared images for other devices to extract and process.

[0061] Please continue to refer to Figure 2 , the field programmable gate array may include a control acquisition and drive module, and the control acquisition and drive module is connected to the infrared vision chip in the infrared component 2 and performs general IO (Input Output) communication such as MIPI (Mobile Industry Processor Interface) or DVP (Digital Video Port), and there is no operating system running.

[0062] Please continue to refer to Figure 2 , the field programmable gate array may further include a display drive module, and the display drive module is connected to the DP display circuit as a display interface circuit.

[0063] Among them, the DP display circuit is directly connected to a standard display or a platform video acquisition device, and the display drive module realizes display drive, which is used to output fusion data information such as original infrared images and image processing results in real time.

[0064] Please continue to refer to Figure 2 , the field programmable gate array may further include a high-speed data control module, and the high-speed data control module is connected to the DDR3 array as the buffer array, the SATA memory circuit as the high-speed memory circuit, and the 10 Gigabit network interface circuit, and is used to realize the output of the infrared image and high-speed data acquisition, and control the field programmable gate array.

[0065] Among them, the 10 Gigabit network interface circuit is mainly used for the output of ultra-high-speed infrared images and realizes the acquisition of high-speed data at the back end.

[0066] Please continue to refer to Figure 2 , the field programmable gate array may further include an accelerator processing module for processing the infrared image.

[0067] In some embodiments, a lightweight reconfigurable neural network accelerator may be deployed in the accelerator processing module to implement image processing algorithms such as object detection, recognition, and tracking.

[0068] Please continue to refer to Figure 2 , the field programmable gate array may further include an instruction module, which is connected to an RS232 (Recommended Standard 232) interface circuit serving as a serial interface circuit for analyzing and transmitting control instructions. Among them, the RS232 interface circuit may also be replaced with an RS422 (Recommended Standard 422) interface circuit.

[0069] Among them, the RS232 interface circuit can communicate with the unmanned pan-tilt head to achieve data reception and tracking control of the pan-tilt head, and can also communicate with the optical lens to achieve autofocus control.

[0070] Please continue to refer to Figure 2 , the field programmable gate array may further include a data transmission module, which is connected to the gigabit network interface circuit for implementing data transmission between the field programmable gate array and the flash memory.

[0071] Among them, the gigabit network interface circuit can communicate with the system platform to achieve data transfer such as firmware update, instruction control, images, and processing results of the highly integrated uncooled infrared heterogeneous intelligent processing device in this embodiment.

[0072] Please continue to refer to Figure 2 , the flash memory is connected to the data transmission module and stores initialization data of the infrared component chip and the field programmable gate array internally. For example, it can store the startup programs and algorithm library data of the infrared component chip and the field programmable gate array, and can also store data such as the algorithm pool, model configuration, and working parameters of the lightweight reconfigurable neural network accelerator deployed in the accelerator processing module above. The flash memory is connected to the infrared component chip and the field programmable gate array respectively as a shared memory.

[0073] According to an embodiment of the present invention, the gigabit network interface circuit, the data transmission module, and the flash memory are connected in sequence to form an initialization data update link, and the initialization data update link is used to implement the update of the initialization data.

[0074] In some embodiments, for example, the startup program of the field programmable gate array and its on-chip accelerator working parameters, as well as the startup firmware program and algorithm library data of the infrared vision chip, can all be updated with the initialization data through the above-mentioned initialization data update link.

[0075] In the high-integration uncooled infrared heterogeneous intelligent processing device according to the embodiments of the present invention, based on the heterogeneous hardware architecture of an energy-efficient uncooled infrared vision component and a field programmable gate array, it operates without an operating system and has the advantages of high speed and low latency. Moreover, it has the ability of in-situ and near-sensor intelligent heterogeneous information processing and storage, and can be efficiently integrated into unmanned systems with limited space, especially drone pods, microsatellite platforms, and unmanned monitoring systems.

[0076] It should be understood that the specific order or hierarchy of steps in the disclosed process is an example of an exemplary method. Based on design preferences, it should be understood that the specific order or hierarchy of steps in the process can be rearranged without departing from the scope of the present invention.

[0077] It should also be noted that the directional terms mentioned in the embodiments, such as "up", "down", "front", "back", "left", "right", etc., are only references to the directions in the drawings and are not used to limit the scope of protection of the present invention. Throughout the drawings, the same elements are represented by the same or similar reference numerals. When it may cause confusion in the understanding of the present invention, the conventional structures or configurations will be omitted. And the shapes, sizes, and positional relationships of the components in the drawings do not reflect the true sizes, proportions, and actual positional relationships.

[0078] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Therefore, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined. Regarding the term "comprising" used in the specification, the covering manner of this word is similar to the term "including", as explained when "including," is used as a connecting word.

[0079] The above-described specific embodiments have further elaborated on the purpose, technical solutions, and beneficial effects of the present invention. It should be understood that the above are only specific embodiments of the present invention and are not used to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A highly integrated uncooled infrared heterogeneous intelligent processing device, characterized in that, Operating without an operating system, the device includes, connected in sequence: An infrared component (2) for acquiring an infrared image; An infrared vision chip circuit board (3) including an input / output bus; A field programmable gate array system circuit board (7) including: A buffer array for temporarily storing the infrared image; A field programmable gate array connected to the infrared component (2) through the input / output bus for processing the infrared image; A flash memory for storing and transmitting initialization data of the infrared component (2) and the field programmable gate array; A power interface circuit board (9) including a plurality of interface circuits connected to the field programmable gate array, and the plurality of interface circuits are used for receiving and outputting multiple types of data.

2. The highly integrated uncooled infrared heterogeneous intelligent processing device according to claim 1, wherein It further includes: An infrared vision chip circuit support (4) for supporting the infrared vision chip circuit board (3).

3. The highly integrated uncooled infrared heterogeneous intelligent processing device according to claim 2, wherein, It further includes: A solid-state memory circuit board (5) disposed on a side of the infrared vision chip circuit support (4) away from the infrared vision chip circuit board (3), and the solid-state memory circuit board (5) includes a high-speed memory circuit for storing the infrared image; A solid-state storage support (6) disposed on a side of the solid-state memory circuit board (5) away from the infrared vision chip circuit support (4), and the solid-state storage support (6) is used for supporting the solid-state memory circuit board (5).

4. The highly integrated uncooled infrared heterogeneous intelligent processing device according to claim 1, characterized in that The infrared component (2) is made by heterogeneous integration and three-dimensional stacking, and the infrared component (2) includes: An uncooled infrared focal plane detector for converting infrared radiation emitted by a target object into an electrical signal; A pixel-level readout circuit for reading the electrical signal pixel by pixel, and performing preliminary signal conditioning and digitization to obtain an original infrared image; A lidar circuit for acquiring three-dimensional spatial information of the target object; An infrared preprocessor for optimizing the original infrared image according to the three-dimensional spatial information to obtain an optimized infrared image; A programmable neural network accelerator for processing the optimized infrared image to obtain the infrared image.

5. The highly integrated uncooled infrared heterogeneous intelligent processing device according to claim 1, wherein The plurality of interface circuits include: A display interface circuit for outputting the infrared image and the processing result of the infrared image; A communication interface circuit including: A serial interface circuit for receiving and outputting control instructions of the highly integrated uncooled infrared heterogeneous intelligent processing device; A gigabit network interface circuit for realizing data transfer through external communication; A 10-gigabit network interface circuit for outputting the infrared image and high-speed data acquisition.

6. The highly integrated uncooled infrared heterogeneous intelligent processing device according to claim 5, characterized in that The field programmable gate array includes: A control acquisition and drive module connected to the infrared component (2) for realizing communication between the field programmable gate array and the infrared component (2); A display drive module connected to the display interface circuit for realizing output of the infrared image and the processing result of the infrared image; A high-speed data control module connected to the 10-gigabit network interface circuit for realizing output of the infrared image and high-speed data acquisition, and controlling the field programmable gate array; An accelerator processing module for processing the infrared image; An instruction module connected to the serial interface circuit for analyzing and transmitting the control instruction; A data transmission module connected to the gigabit network interface circuit for realizing data transmission between the field programmable gate array and the flash memory.

7. The highly integrated uncooled infrared heterogeneous intelligent processing device according to claim 6, characterized in that, The accelerator processing module includes: A reconfigurable neural network accelerator for implementing at least one image processing algorithm in target detection, recognition, and tracking.

8. The highly integrated uncooled infrared heterogeneous intelligent processing device according to claim 6, characterized in that The gigabit network interface circuit, the data transmission module, and the flash memory are sequentially connected to form an initialization data update link for updating the initialization data.

9. The highly integrated uncooled infrared heterogeneous intelligent processing device according to claim 5, characterized in that The display interface circuit is connected to at least one of a display and a platform video acquisition device.

10. The highly integrated uncooled infrared heterogeneous intelligent processing device according to claim 5, characterized in that, The communication interface circuit is implemented by the field programmable gate array for interface driving and communication protocol, and communicates with at least one of a pan-tilt, a system platform, and an optical lens.

11. The highly integrated uncooled infrared heterogeneous intelligent processing device according to claim 1, characterized in that, The device further includes: A fixed panel (1), and the infrared component (2) is fixed between the fixed panel (1) and the infrared vision chip circuit board (3).

12. The highly integrated uncooled infrared heterogeneous intelligent processing device according to claim 2, wherein The infrared vision chip circuit board (3) is fixed on the infrared vision chip circuit support member (4).

13. The highly integrated uncooled infrared heterogeneous intelligent processing device according to claim 3, wherein, The solid-state memory circuit board (5) is fixed on the solid-state storage support member (6).

14. The highly integrated uncooled infrared heterogeneous intelligent processing device according to claim 1, characterized in that, The device further includes: A field programmable gate array heat dissipation support frame (8), and the field programmable gate array system circuit board (7) is fixed on the field programmable gate array heat dissipation support frame (8).

15. The highly integrated uncooled infrared heterogeneous intelligent processing device according to claim 1, wherein The device further includes: An interface panel (10), and the power interface circuit board (9) is fixed on the interface panel (10).

16. The highly integrated uncooled infrared heterogeneous intelligent processing device according to claim 1, wherein The functions of the field programmable gate array system circuit board (7) include at least one of infrared chip drive control, data acquisition, solid-state storage read / write drive, cache control, intelligent image processing, network data transmission, standard display drive, and optical lens control drive.

17. The highly integrated uncooled infrared heterogeneous intelligent processing device according to claim 3, wherein, The solid-state memory circuit board (5) is provided with a solid-state memory with an SATA interface or an NVME interface.

18. The highly integrated uncooled infrared heterogeneous intelligent processing device according to claim 11, wherein, The fixed panel (1) is provided with at least one of heat dissipation fins and a heat dissipation fan.

19. The highly integrated uncooled infrared heterogeneous intelligent processing device according to claim 1, wherein The power interface circuit board (9) further includes a power supply circuit for supplying power to the high-integration uncooled infrared heterogeneous intelligent processing device.

20. The highly integrated uncooled infrared heterogeneous intelligent processing device according to claim 1, characterized in that The infrared component (2) is provided with an optical lens mounting opening.

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