Display device

Abstract

A display device is provided. The display device includes: a substrate including a display area and a non-display area configured to surround the display area; a package substrate including a base portion disposed opposite to the substrate, and a protruding portion protruding from the base portion toward the substrate and disposed in the non-display area; and a bonding layer provided between the substrate and the package substrate and in a region other than a region in which the protruding portion is provided. Accordingly, moisture penetration through a side surface of the display device may be minimized or reduced.

Description

Technical Field

[0001] This specification relates to a display device, and more particularly, for example but not limited to, a display device in which lateral moisture penetration is reduced or minimized. Background Art

[0002] A display device that displays various information on a screen is a key technology in the information and communication era. Display devices are gradually evolving to be thinner, lighter, and more portable, and have higher performance. Therefore, an organic light-emitting display (OLED) device that displays an image by controlling the amount of light emitted from an organic light-emitting layer has received much attention.

[0003] An organic light-emitting display device is a self-luminous element using a thin light-emitting layer between electrodes, and has the advantage of being implemented as a thin-film display device. A general organic light-emitting display device has the following structure: wherein, a pixel driving circuit and an organic light-emitting element are formed on a substrate, and the light emitted from the organic light-emitting element passes through the substrate or a barrier layer, thereby displaying an image.

[0004] The descriptions provided in the background art section should not be assumed to be prior art merely because they are mentioned in or associated with the background art section. The background art section may include information describing one or more aspects of the subject technology. Summary of the Invention

[0005] The inventors of the present application have found that an organic light-emitting element is likely to deteriorate due to internal factors such as deterioration of the electrode and the light-emitting layer caused by, for example, oxygen, or deterioration caused by a reaction between the light-emitting layer and the interface. In addition, an organic light-emitting element is likely to deteriorate due to external factors such as external moisture, oxygen, ultraviolet rays, and the manufacturing conditions of the element. In particular, since external oxygen and moisture have a significant impact on the service life of the element, the technology for encapsulating an organic light-emitting display device is very important.

[0006] An object to be achieved by this specification is to provide a display device in which lateral moisture penetration is minimized or reduced.

[0007] Another object to be achieved by this specification is to provide a display device capable of achieving a narrow bezel.

[0008] Still another object to be achieved by this specification is to provide a display device having improved reliability and display quality.

[0009] The objects of the present disclosure are not limited to the above objects, and those skilled in the art can clearly understand other objects not mentioned above through the following description.

[0010] One aspect of the present specification provides a display device, the display device including: a substrate including a display area and a non-display area configured to surround the display area; a package substrate including a base portion disposed opposite to the substrate, and a protruding portion protruding from the base portion toward the substrate and disposed in the non-display area; and a bonding layer disposed between the substrate and the package substrate and disposed in an area other than the area where the protruding portion is provided. Accordingly, moisture penetration through a side surface of the display device can be minimized or reduced.

[0011] Other details of the exemplary embodiments are included in the detailed description section and the drawings.

[0012] According to an embodiment of the present specification, the package substrate includes a protruding portion disposed in the non-display area, and the protruding portion can minimize or reduce moisture penetration through a side surface of the display device.

[0013] According to an embodiment of the present specification, a spacer having a groove structure is disposed on the substrate, and the spacer can mitigate an impact occurring during the process of bonding the package portion to the substrate.

[0014] According to an embodiment of the present specification, reliability and display quality can be improved.

[0015] The effects according to the present disclosure are not limited to the contents of the above examples, and more various effects are included in the present specification.

[0016] It should be understood that the above general description and the following detailed description are both exemplary and explanatory, and are intended to provide further explanation of the claimed inventive concept. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this application. The drawings illustrate embodiments of the present disclosure and, together with the description, are used to explain the principles of the present disclosure.

[0018] From the following detailed description taken in conjunction with the drawings, the above and other aspects, features, and other advantages of the present disclosure will be more clearly understood. In the drawings:

[0019] Figure 1 is a schematic top view of a display device according to an exemplary embodiment of the present specification;

[0020] Figure 2 is a cross-sectional view showing a sub-pixel of a display device according to an exemplary embodiment of the present specification;

[0021] Figure 3is a rear view of an encapsulation part of a display device according to an exemplary embodiment of the present specification;

[0022] Figure 4 is a top view showing a substrate and a spacer of a display device according to an exemplary embodiment of the present specification;

[0023] Figure 5 is a view schematically showing a process of combining an encapsulation part and a substrate of a display device according to an exemplary embodiment of the present specification;

[0024] Figure 6 is a schematic cross-sectional view according to an exemplary embodiment of the present specification; and

[0025] Figure 7 is a schematic cross-sectional view according to another exemplary embodiment of the present specification.

[0026] Throughout the drawings and the detailed description section, unless otherwise described, the same reference numerals should be understood to refer to the same elements, features, and structures. For clarity, illustration, and convenience, the relative dimensions of these elements may be exaggerated and depicted. Detailed Description

[0027] Advantages and features of the present disclosure and methods for achieving these advantages and features will become clear by referring to the exemplary embodiments and the drawings described in detail below. However, the present disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. The exemplary embodiments are provided only by way of example so that those of ordinary skill in the art can fully understand the disclosure content and the scope of the present disclosure.

[0028] The shapes, sizes, ratios, angles, quantities, etc. illustrated in the drawings for describing the exemplary embodiments of the present disclosure are merely examples, and the present disclosure is not limited thereto. The same reference numerals generally denote the same elements throughout the specification. Further, in the following description of the present disclosure, for the purpose of avoiding unnecessarily obscuring the subject matter of the present disclosure, detailed descriptions of known related technologies may be omitted. Terms such as "including", "having", and "consisting of" used herein generally intend to allow the addition of other components, unless the term is used together with the term "only". Any reference to the singular may include the plural unless otherwise explicitly indicated.

[0029] Even if not explicitly stated, components are interpreted to include an ordinary error range.

[0030] When terms such as "on", "above", "below", and "adjacent to" are used to describe the positional relationship between two components, unless these terms are used together with the terms "immediately" or "directly", one or more components may be located between the two components.

[0031] This document may use terms such as "below", "lower", "above", "upper", etc. to describe the relationship between elements as shown in the accompanying drawings. It should be understood that the terms are spatially relative and based on the orientation depicted in the drawings.

[0032] The term "at least one" should be understood to include any and all combinations of one or more of the related listed items. For example, the meaning of "at least one of the first element, the second element, and the third element" includes the combination of all three listed elements, the combination of any two of the three elements, and each individual element (the first element, the second element, or the third element).

[0033] When an element or layer is disposed "on" another element or layer, the element or layer may be directly on the other element or layer, or another layer or another element may be interposed therebetween.

[0034] Although terms such as "first", "second", "A", "B", "(a)", and "(b)" are used to describe various components, these components are not restricted by these terms. These terms are only used to distinguish one component from other components. Thus, the first component mentioned below may be the second component in the technical concept of the present disclosure.

[0035] The same reference numerals generally denote the same elements throughout the specification.

[0036] For the sake of convenience in description, the dimensions and thicknesses of each component shown in the drawings are illustrated, and the present disclosure is not limited to the dimensions and thicknesses of the components shown.

[0037] The features of various embodiments of the present disclosure may be partially or wholly combined or combined with each other, and may be interlocked and operated in various ways technically, and these embodiments may be executed independently of each other or executed in association with each other.

[0038] Hereinafter, a display device according to an exemplary embodiment of the present disclosure will be described in detail with reference to the accompanying drawings.

[0039] Figure 1 is a schematic top view of a display device according to an exemplary embodiment of the present specification.

[0040] Refer to Figure 1, the display device 100 may include a display area AA and a non-display area NA, which is configured to be adjacent to the display area AA or partially or completely surround the display area AA.

[0041] The display area AA is an area of the display device 100 where an image is displayed. The display area AA may include a plurality of sub-pixels SP that constitute a plurality of pixels, and a circuit configured to operate the plurality of sub-pixels SP. The plurality of sub-pixels SP are the smallest units that constitute the display area AA. As an example, n sub-pixels SP may constitute a single pixel, where n may be a natural number greater than 1. A light-emitting element, a thin-film transistor for operating the light-emitting element, etc. may be provided in each of the plurality of sub-pixels SP. The plurality of light-emitting elements may be defined differently according to the type of the display panel. For example, in the case where the display panel is an organic light-emitting display panel, the light-emitting element may be an organic light-emitting diode (OLED). As an example, in the case where the display panel is a micro-LED display panel, the light-emitting element may be a micro-LED. The embodiments are not limited thereto.

[0042] A plurality of lines for sending various types of signals to the plurality of sub-pixels SP may be provided in the display area AA. For example, the plurality of lines may include a plurality of data lines for providing a data voltage to the plurality of sub-pixels SP, and a plurality of scan lines for providing a scan signal to the plurality of sub-pixels SP. The plurality of scan lines may extend in one direction in the display area AA and be connected to the plurality of sub-pixels SP. The plurality of data lines may extend in a direction different from the above-mentioned one direction in the display area AA and be connected to the plurality of sub-pixels SP. In addition, a low-potential power supply line, a high-potential power supply line, a reference line, a sense line, etc. may be further provided in the display area AA. However, this specification is not limited thereto.

[0043] The non-display area NA may be defined as an area where no image is displayed, that is, an area extending from the display area AA. The non-display area NA may include link lines and pad electrodes for sending signals to the sub-pixels SP in the display area AA. Alternatively, the non-display area NA may include driving ICs such as a gate driver IC and a data driver IC.

[0044] However, as an example, the non-display area NA may be located on the rear surface of the display panel, that is, the surface where no sub-pixels SP exist. As an example, the non-display area NA may be at least partially located on the rear surface of the display panel by bending from the display area AA, but is not limited thereto. Alternatively, the non-display area NA may not be included. However, this specification is not limited to the configuration shown in the drawings.

[0045] Figure 2 is a cross-sectional view of a sub-pixel of a display device according to an exemplary embodiment of the present specification. Specifically,Figure 2 FIG. 1 is a cross-sectional view showing a sub-pixel SP of a display device 100 according to an exemplary embodiment of the present specification.

[0046] Referring to Figure 2 , the substrate 110 may be a substrate that supports components disposed above the display device, such as an insulating substrate. The substrate 110 may be made of glass, resin, ceramic, metal foil, etc. In addition, the substrate 110 may be made of a material including a polymer or plastic. As an example, the substrate 110 may be a rigid substrate or a flexible substrate. As an example, the substrate 110 may be a transparent substrate or an opaque substrate. As an example, the substrate 110 may be formed of a single layer or multiple layers of the same material or different materials. However, the present specification is not limited thereto.

[0047] A buffer layer 111 may be disposed on the substrate 110. The buffer layer 111 may reduce the penetration of moisture or impurities through the substrate 110. For example, the buffer layer 111 may be configured as a single layer or multiple layers made of silicon oxide (SiOx) or silicon nitride (SiNx). However, the present specification is not limited thereto. As an example, depending on the type of the substrate 110 or the type of the transistor DT, the buffer layer 111 may be excluded. However, the present specification is not limited thereto.

[0048] A transistor DT including an active layer ACT, a gate electrode GE, a source electrode SE, and a drain electrode DE may be disposed on the buffer layer 111.

[0049] First, the active layer ACT of the transistor DT may be disposed on the buffer layer 111. The active layer ACT may be made of a semiconductor material such as an oxide semiconductor, amorphous silicon, polysilicon, compound semiconductor, or organic semiconductor. However, the present specification is not limited thereto. In addition, although not shown in the drawings, other transistors such as a switching transistor, a sensing transistor, and / or a light-emitting control transistor may be additionally disposed in addition to the transistor DT. The active layers of these transistors may be made of a semiconductor material such as an oxide semiconductor, amorphous silicon, polysilicon, compound semiconductor, or organic semiconductor. However, the present specification is not limited thereto. In addition, the active layers of the transistors such as the transistor DT, the switching transistor, the sensing transistor, and the light-emitting control transistor included in the pixel circuit may be made of the same material or different materials.

[0050] A gate insulating layer 112 may be disposed on the active layer ACT. The gate insulating layer 112 may be an insulating layer that electrically insulates the active layer ACT and the gate electrode GE. The gate insulating layer 112 may be configured as a single layer or multiple layers made of silicon oxide (SiOx) or silicon nitride (SiNx). However, the present specification is not limited thereto.

[0051] The gate electrode GE may be disposed on the gate insulating layer 112. The gate electrode GE may be made of a conductive material such as, for example, copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or an alloy thereof. However, the present specification is not limited thereto.

[0052] An interlayer insulating layer 113 may be disposed on the gate electrode GE. Contact holes may be formed in the interlayer insulating layer 113, through which the source electrode SE and the drain electrode DE are connected to the active layer ACT. The interlayer insulating layer 113 may be an insulating layer for protecting components disposed below the interlayer insulating layer 113. The interlayer insulating layer 113 may be configured as a single layer or multiple layers made of silicon oxide (SiOx) or silicon nitride (SiNx). However, the present specification is not limited thereto.

[0053] The source electrode SE and the drain electrode DE electrically connected to the active layer ACT may be disposed on the interlayer insulating layer 113. The drain electrode DE may be connected to the first electrode 121 of the light-emitting element 120. As an example, the drain electrode DE may be connected to the first electrode 121 of the light-emitting element 120 through a connection electrode CE, but is not limited thereto. As an example, the connection electrode CE may be omitted, and the drain electrode DE may be directly connected to the first electrode 121 of the light-emitting element 120. The source electrode SE and the drain electrode DE may each be made of a conductive material such as, for example, copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or an alloy thereof. However, the present specification is not limited thereto.

[0054] A first planarization layer 114 may be disposed on the source electrode SE and the drain electrode DE. The first planarization layer 114 may planarize the upper part of the pixel circuit including the transistor DT. The first planarization layer 114 may be configured as a single layer or multiple layers and may be made of, for example, benzocyclobutene (BCB) or an acrylic-based organic material. However, the present specification is not limited thereto. Meanwhile, contact holes may be formed in the first planarization layer 114, through which the drain electrode DE is connected to the first electrode 121 of the light-emitting element 120 or the connection electrode CE.

[0055] The connection electrode CE may be disposed on the first planarization layer 114. The connection electrode CE may electrically connect the drain electrode DE to the first electrode 121 of the light-emitting element 120 through a contact hole formed in the first planarization layer 114.

[0056] A second planarization layer 115 may be disposed on the first planarization layer 114 and the connection electrode CE. Similar to the first planarization layer 114, the second planarization layer 115 may planarize the upper part of the pixel circuit including the transistor DT. The second planarization layer 115 may be configured as a single layer or multiple layers and may be made of, for example, benzocyclobutene (BCB) or an acrylic-based organic material. However, the present specification is not limited thereto.

[0057] The light-emitting element 120 may be disposed on the second planarization layer 115. The light-emitting element 120 may include a first electrode 121, a light-emitting layer 122, and a second electrode 123 which are stacked in sequence.

[0058] The first electrode 121 may be disposed on the second planarization layer 115. The first electrode 121 may be a layer, that is, an anode for providing positive holes to the light-emitting layer 122. In this case, since the first electrode 121 is a layer for providing positive holes to the light-emitting layer 122, as an example, the first electrode 121 may be made of a conductive material having a high work function, but is not limited thereto. The first electrode 121 may be made of a conductive material, such as a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO), or an opaque conductive material such as titanium (Ti), gold (Au), silver (Ag), copper (Cu), or an alloy thereof. However, this specification is not limited thereto.

[0059] A bank 116 may be disposed on the first electrode 121 and the second planarization layer 115. As an example, the bank 116 may cover the edge of the first electrode 121 of the light-emitting element 120 and define a light-emitting region. That is, the bank 116 may separate a plurality of sub-pixels SP. The embodiment is not limited thereto. As an example, the bank 116 may not cover the edge of the first electrode 121 and may be in contact with the edge of the first electrode 121, but is not limited thereto. As an example, the bank 116 may be made of an insulating material to insulate the first electrodes 121 of adjacent sub-pixels SP. In addition, as an example, the bank 116 may be configured as a black bank having a high optical absorption rate or a high reflectivity to suppress color mixing between adjacent sub-pixels SP. For example, the bank 116 may be made of a polyimide resin, an acrylic resin, or a benzocyclobutene (BCB) resin. However, this specification is not limited thereto. As an example, the bank 116 may also be formed of a transparent material or a translucent material, but is not limited thereto.

[0060] The light-emitting layer 122 may be disposed on the first electrode 121. The light-emitting layer 122 is a layer that emits light by combining electrons and positive holes.

[0061] As an example, the light-emitting element 120 may further include a hole injection layer, a hole transport layer, an electron transport layer, an electron injection layer, etc., to improve the light-emitting efficiency of the light-emitting element 120. For example, the hole injection layer and the hole transport layer may be provided between the first electrode 121 and the light-emitting layer 122, and the electron transport layer and the electron injection layer may be provided between the light-emitting layer 122 and the second electrode 123. In addition, as an example, a hole blocking layer or an electron blocking layer may be provided on the light-emitting layer 122 to further improve the efficiency of the recombination of positive holes and electrons. The embodiments are not limited thereto. As an example, at least one of the hole injection layer, the hole transport layer, the electron transport layer, the electron injection layer, the hole blocking layer, and the electron blocking layer may be omitted.

[0062] The second electrode 123 may be provided on the light-emitting layer 122. The second electrode 123 may be a layer, that is, a cathode for smoothly supplying electrons to the light-emitting layer 122. Therefore, as an example, the second electrode 123 may be made of a metal material having a low work function, but is not limited thereto. For example, the second electrode 123 may be made of a metal material selected from calcium (Ca), barium (Ba), aluminum (Al), silver (Ag), and an alloy containing one or more of the above elements. However, this specification is not limited thereto.

[0063] A protective layer 130 may be provided on the light-emitting element 120. The protective layer 130 may protect the light-emitting element 120 from the influence of external oxygen, moisture, etc. The protective layer 130 may be made of one or more materials selected from the group consisting of various inorganic insulating materials, such as silicon nitride (SiNx), silicon oxide (SiOx), aluminum oxide (AlOx), and silicon oxynitride (SiON). However, this specification is not limited thereto. As an example, the protective layer 130 may be omitted according to the design.

[0064] An encapsulation part EN may be provided on the protective layer 130. As an example, the encapsulation part EN may include a bonding layer 140 and an encapsulation substrate 150, but is not limited thereto.

[0065] First, the bonding layer 140 may be disposed on the protective layer 130. The bonding layer 140 may be disposed between the encapsulation substrate 150 and the substrate 110 on which the transistor DT and the light-emitting element 120 are disposed. Together with the encapsulation substrate 150, the bonding layer 140 can protect the light-emitting element 120 from external moisture, oxygen, etc. At the same time, as an example, the bonding layer 140 may first be applied on the encapsulation substrate 150 and then set opposite to the substrate 110 to fix the substrate 110 and the encapsulation substrate 150. For example, the bonding layer 140 may be a face-sealing adhesive (FSA) configured as multiple layers. However, the present specification is not limited thereto. As another example, the bonding layer 140 may first be applied on the protective layer 130 and then the encapsulation substrate 150 is set opposite to the substrate 110 to fix the substrate 110 and the encapsulation substrate 150, but is not limited thereto.

[0066] Referring to Figure 2 , as an example, the bonding layer 140 may include a first bonding layer 141 and a second bonding layer 142. The embodiments are not limited thereto. As an example, the bonding layer 140 may include a single bonding layer or more than two bonding layers.

[0067] The first bonding layer 141 may be bonded to one surface of the encapsulation substrate 150. For example, the first bonding layer 141 may be adjacent to the bottom surface of the encapsulation substrate 150. The first bonding layer 141 may include a curable resin 141b and a moisture absorbent 141a dispersed in the curable resin 141b. The moisture absorbent 141a of the first bonding layer 141 may utilize physical or chemical reactions, etc., and absorb or remove moisture or oxygen introduced from the outside. For example, the curable resin 141b may be made of a polymer material such as an epoxy-based material or an olefin-based material. However, the present specification is not limited thereto. The first bonding layer 141 may also be referred to as a barrier layer (B layer).

[0068] The second bonding layer 142 may be disposed under the first bonding layer 141 and bonded to the substrate 110 on which the light-emitting element 120 is disposed. Specifically, as described below, the second bonding layer 142 may be bonded to the side surface of the protruding portion 150b of the encapsulation substrate 150. For example, the second bonding layer 142 may be made of a thermosetting resin or a photocurable resin. However, the present specification is not limited thereto. The second bonding layer 142 may also be referred to as a transparent layer (T layer).

[0069] The encapsulation substrate 150 may be disposed on the bonding layer 140. The encapsulation substrate 150 may be disposed opposite to the substrate 110 and, together with the bonding layer 140, protect the light-emitting element from external moisture, oxygen, etc. For example, the encapsulation substrate 150 may be made of a material such as glass, plastic, or metal, but is not limited thereto. The material of the encapsulation substrate 150 may be determined according to the light-emitting direction of the display device 100. As an example, the display device 100 according to an exemplary embodiment of the present specification may be a bottom-emitting type display device, and the encapsulation substrate 150 may be made of metal. However, the present specification is not limited thereto. As another example, the display device 100 according to an exemplary embodiment of the present specification may be a top-emitting type display device or a dual-emitting type display device.

[0070] Reference will be made to the following Figures 3 to 6 to describe the encapsulation unit EN in detail.

[0071] Figure 3 is a rear view of the encapsulation unit of the display device according to an exemplary embodiment of the present specification. Figure 4 is a top view showing the substrate and the spacer of the display device according to an exemplary embodiment of the present specification. Figure 5 is a view schematically showing the process of combining the encapsulation unit and the substrate of the display device according to an exemplary embodiment of the present specification. Figure 6 is a schematic cross-sectional view according to an exemplary embodiment of the present specification. Meanwhile, for ease of description, Figure 5 and Figure 6 show the structure defined from the upper side of the substrate 110 to the protective layer 130 as the display unit DP.

[0072] First, referring to Figure 3 , Figure 5 and Figure 6 , the encapsulation unit EN may include a bonding layer 140 and an encapsulation substrate 150.

[0073] The encapsulation substrate 150 may include a base portion 150a and a protruding portion 150b. The base portion 150a may be a portion that is disposed opposite to the substrate 110 and has a plate shape. The protruding portion 150b may have a shape that extends from the base portion 150a and protrudes toward the substrate 110. For example, the protruding portion 150b may be disposed substantially perpendicular to the substrate 110, but is not limited thereto. As an example, the protruding portion 150b may be disposed to intersect the substrate 110 at an angle. As an example, the protruding portion 150b may be disposed in the non-display area NA. As an example, the protruding portion 150b may protect the display device 100 from the penetration of external moisture, so that the moisture introduced from the side surface does not penetrate into the display area AA. At the same time, as an example, after the encapsulation portion EN is combined with the substrate 110, the end of the protruding portion 150b of the encapsulation substrate 150 may be disposed in the groove of the spacer 160. That is, the protruding portion 150b of the encapsulation substrate 150 may be disposed to occupy the entire groove of the spacer 160. The embodiment is not limited thereto. As an example, the protruding portion 150b of the encapsulation substrate 150 may be disposed to occupy at least a part of the groove of the spacer 160. As an example, the protruding portion 150b of the encapsulation substrate 150 may be disposed to contact the bottom surface of the groove of the spacer 160. As an example, the protruding portion 150b of the encapsulation substrate 150 may be disposed to be spaced apart from the bottom surface of the groove of the spacer 160. As an example, the spacer 160 may not have a groove. As an example, the protruding portion 150b of the encapsulation substrate 150 may be disposed to contact the spacer 160. As an example, the protruding portion 150b of the encapsulation substrate 150 may be disposed to contact the substrate 110. As an example, the protruding portion 150b of the encapsulation substrate 150 may be disposed to be spaced apart from the substrate 110 or the spacer 160. As an example, the protruding portion 150b of the encapsulation substrate 150 may be disposed to overlap at least a part of the display portion DP in the lateral direction. As an example, the protruding portion 150b of the encapsulation substrate 150 may be disposed to completely or partially surround the display area AA. The embodiment is not limited thereto.

[0074] Referring to Figure 5 and Figure 6 , the first bonding layer 141 of the bonding layer 140 may be adjacent to the bottom surface of the base portion 150a of the encapsulation substrate 150 and adjacent to the side surface of the protruding portion 150b of the encapsulation substrate 150. The second bonding layer 142 may be disposed below the first bonding layer 141 and adjacent to the side surface of the protruding portion 150b of the encapsulation substrate 150.

[0075] Referring to Figures 4 to 6, the spacer 160 may be disposed on the substrate 110, but is not limited thereto. The spacer 160 can protect the substrate 110 from impacts that may occur during the process of bonding the encapsulation part EN and the substrate 110 on which the display part DP is disposed. That is, since the encapsulation substrate 150 includes the protruding part 150b, when the protruding part 150b is directly adjacent to the substrate 110, the substrate 110 may be damaged due to the depression of the substrate 110. Therefore, the spacer 160 may be set to correspond to the area where the protruding part 150b is provided. As an example, the spacer 160 may be disposed in the non-display area NA. As an example, the spacer 160 may partially or completely surround the display area AA. As an example, the spacer 160 may be omitted according to the design.

[0076] In addition, as an example, a groove may be provided on the top surface of the spacer 160. As an example, the end of the protruding part 150b of the encapsulation substrate 150 is disposed in the groove of the spacer 160 instead of on the substrate 110, so that the spacer 160 can protect the substrate 110. Therefore, the width t2 of the groove of the spacer 160 may be equal to or greater than the width t1 of the protruding part 150b of the encapsulation substrate 150.

[0077] Referring to Figure 5 and Figure 6 , as an example, the spacer 160 may include an organic pattern 161 and a metal layer 162. The embodiment is not limited thereto. As an example, the spacer 160 may be made of any inorganic or organic material as long as it can protect the substrate 110.

[0078] First, as an example, the organic pattern 161 may include a first organic pattern 161a and a second organic pattern 161b. The first organic pattern 161a may be disposed in the non-display area NA and on the substrate 110 while partially or completely surrounding the display area AA. The second organic pattern 161b may be disposed on the substrate 110, outside the first organic pattern 161a, and disposed to partially or completely surround the display area AA and the first organic pattern 161a. The first organic pattern 161a and the second organic pattern 161b may be disposed to be spaced apart from each other to define a groove. That is, the first organic pattern 161a and the second organic pattern 161b may be disposed such that the substrate 110 is exposed between the first organic pattern 161a and the second organic pattern 161b. The organic pattern 161 may be made of an organic insulating material instead of an inorganic insulating material to define a groove. For example, the organic pattern 161 may be made of the same material as the first planarization layer 114, the second planarization layer 115, or the bank 116. However, this specification is not limited thereto. As an example, the organic pattern 161 may also be made of an inorganic insulating material.

[0079] Similar to the organic pattern 161, the metal layer 162 can be disposed in the non-display area NA while partially or completely surrounding the display area AA. Specifically, the metal layer 162 can be disposed on the first organic pattern 161a and the second organic pattern 161b to partially or completely cover the surfaces of the first organic pattern 161a and the second organic pattern 161b. Thus, by way of example, the metal layer 162 can be disposed between the first organic pattern 161a and the second organic pattern 161b and adjacent to the substrate 110. Accordingly, after the encapsulation unit EN is bonded to the substrate 110, the end of the protruding portion 150b of the encapsulation substrate 150 can be disposed in the groove and adjacent to the metal layer 162, rather than adjacent to the substrate 110. The embodiments are not limited thereto. By way of example, another organic or inorganic pattern may exist between the metal layer 162 and the substrate 110, but is not limited thereto. By way of example, the end of the protruding portion 150b of the encapsulation substrate 150 can be disposed in the groove while not adjacent to the metal layer 162 (e.g., spaced apart from the metal layer 162).

[0080] Meanwhile, the metal layer 162 can be made of a metal material having low reactivity to minimize or reduce moisture penetration into the display area AA. For example, the metal layer 162 can be configured as a bilayer made of copper (Cu) and molybdenum-titanium (Mo-Ti) alloy. However, the present specification is not limited thereto. By way of example, the metal layer 162 can be configured as a single layer or multiple layers. By way of example, the metal layer 162 can be formed of an organic layer or an inorganic layer other than a metal.

[0081] Referring Figure 5 and Figure 6 , the encapsulation unit EN and the substrate 110 can be disposed opposite to each other so as to be bonded to each other. In this case, in order to minimize or reduce damage to the substrate 110 caused by the protruding portion 150b of the encapsulation substrate 150 during the bonding process, the protruding portion 150b of the encapsulation substrate 150 and the groove of the spacer 160 disposed on the substrate 110 can be disposed to correspond to each other. In addition, the width t2 of the groove of the spacer 160 can be equal to or greater than the width t1 of the protruding portion of the encapsulation substrate 150 so that the protruding portion 150b of the encapsulation substrate 150 can be assembled into the groove of the spacer 160.

[0082] When the encapsulation unit EN is bonded to the substrate 110, the second bonding layer 142 can be adjacent to the substrate 110. The second bonding layer 142 can be disposed to cover the top surface of the substrate 110, the top surface and side surfaces of the display unit DP, and the top surface and side surfaces of the spacer 160, and protect the display unit DP while fixing the substrate 110 and the encapsulation substrate 150.

[0083] Meanwhile, the protruding portion 150b of the encapsulation substrate 150 can be assembled into the groove of the spacer 160 and is set to occupy the entire groove, but is not limited thereto. Therefore, even if moisture penetrates into the interface between the second bonding layer 142 and the spacer 160, the moisture penetration can be blocked by the protruding portion 150b of the encapsulation substrate 150. In addition, since the end of the protruding portion 150b of the encapsulation substrate 150 abuts the metal layer 162 of the spacer 160 made of a material with low reactivity, the moisture penetration through the interface between the metal layer 162 and the protruding portion 150b can be effectively blocked.

[0084] The narrow bezel is implemented in various ways so that users can visually recognize the non-display area to the minimum extent. However, as the bezel area decreases, the moisture penetration path to the display area also decreases, and the moisture introduced from the side surface of the display device may quickly spread to the display area. Therefore, the reliability of the display device may be reduced.

[0085] For example, as one of the encapsulation methods for protecting the display device from external moisture and the like, there is a method of encapsulating the light-emitting element with a surface encapsulant. The surface encapsulant can be used as a bonding layer and includes a moisture absorbent so that the surface encapsulant can absorb the moisture introduced from the outside of the display device. In this case, after the surface encapsulant is applied to one surface of the encapsulation substrate, the encapsulation substrate can be bonded to the substrate on which the transistor and the light-emitting element are provided. When the pressure is removed after the surface encapsulant provided between the two bonded substrates is cured, the display device can have a surface-encapsulated structure. In this case, the encapsulation substrate can be made of glass, plastic, metal, etc. In particular, when the encapsulation substrate is made of metal, the moisture penetration can be effectively suppressed.

[0086] Meanwhile, for example, a moisture absorbent can be further added to the surface encapsulant to improve the effect of suppressing moisture penetration. However, when the surface encapsulant includes a predetermined amount or more of the moisture absorbent, the stress caused by the expansion of the moisture absorbent may increase. When the increased stress is transmitted to the display panel, the stress may also affect the display quality. Therefore, there are limitations in improving the effect of suppressing moisture penetration by adding a moisture absorbent.

[0087] Therefore, in the display device 100 according to the exemplary embodiment of the present specification, the encapsulation substrate 150 made of metal may include a base portion 150a disposed opposite to the substrate 110 and a protruding portion 150b protruding from the base portion 150a toward the substrate 110. In this case, the protruding portion 150b may be disposed in the non-display area NA. That is, the base portion 150a may protect the display device 100 from moisture introduced from above the display device 100. The protruding portion 150b may be disposed perpendicular to the substrate 110 and block moisture introduced from the side surface of the display device 100, thereby protecting the display device 100.

[0088] In this case, the spacer 160 may be disposed on the substrate 110 and absorb the impact that may occur during the process of bonding the encapsulation substrate 150 and the substrate 110. The spacer 160 may be disposed on the substrate 110 and in the non-display area NA, while corresponding to the area where the protruding portion 150b of the encapsulation substrate 150 is disposed. In addition, the spacer 160 may include a groove structure provided in its top surface. Therefore, during the process of bonding the encapsulation substrate 150 to the substrate 110, the end of the protruding portion 150b of the encapsulation substrate 150 may not directly contact the substrate 110. That is, the spacer 160 may include a metal layer 162 disposed on organic patterns 161 that are arranged to be spaced apart from each other. In this case, the metal layer 162 may be disposed between the organic patterns 161 and adjacent to the substrate 110. Therefore, the end of the protruding portion 150b of the encapsulation substrate 150 may be adjacent to the metal layer 162 of the spacer 160, rather than adjacent to the substrate 110. Therefore, the spacer 160 may minimize or reduce the impact that may be exerted on the substrate 110 by the protruding portion 150b of the encapsulation substrate 150.

[0089] In addition, in the display device 100 according to the exemplary embodiment of the present specification, the metal layer 162 of the spacer 160 may be made of a material having low reactivity. Therefore, the penetration of moisture through the interface between the protruding portion 150b of the encapsulation substrate 150 and the metal layer 162 of the spacer 160 can be effectively blocked.

[0090] That is, in the display device 100 according to the exemplary embodiment of the present specification, the encapsulation substrate 150 includes a protruding portion 150b that can inhibit lateral moisture penetration. In addition, the spacer 160 is disposed on the substrate 110, which can minimize or reduce the impact caused by the protruding portion 150b of the encapsulation substrate 150. Therefore, the reliability of the display device 100 can be improved.

[0091] Figure 7 is a schematic cross-sectional view according to another exemplary embodiment of the present specification. Except for the presence or absence of the auxiliary bonding layer 270,Figure 7 The display device 200 in Figures 1 to 6 is basically the same as the display device 100 in

[0092] Referring to Figure 7 , the auxiliary bonding layer 270 may be disposed in the groove of the spacer 160 and between the spacer 160 and the protruding portion 150b of the encapsulation substrate 150. The auxiliary bonding layer 270 may be disposed on the bottom surface of the protruding portion 150b of the encapsulation substrate 150 and fix the encapsulation substrate 150 and the substrate 110 more effectively. For example, the encapsulation substrate 150 may be bonded to the substrate 110 with the auxiliary bonding layer 270 disposed on the bottom surface of the protruding portion 150b of the encapsulation substrate 150. However, the present specification is not limited thereto. As an example, the encapsulation substrate 150 may be bonded to the substrate 110 with the auxiliary bonding layer 270 disposed on the bottom surface of the groove.

[0093] Meanwhile, the auxiliary bonding layer 270 may be disposed to be spaced apart from the bonding layer 140 to block the moisture penetration path leading to the display area AA. However, the present specification is not limited thereto.

[0094] For example, the auxiliary bonding layer 270 may be made of the same material as the first bonding layer 141 or the second bonding layer 142. In particular, when the auxiliary bonding layer 270 is made of the same material as the first bonding layer 141 and includes the moisture absorbent 141a, the auxiliary bonding layer 270 may absorb or remove the moisture introduced through the interface between the spacer 160 and the auxiliary bonding layer 270 or the interface between the auxiliary bonding layer 270 and the protruding portion 150b of the encapsulation substrate 150, so that the lateral moisture penetration can be effectively suppressed. The embodiments are not limited thereto. As an example, the auxiliary bonding layer 270 may be made of a material different from that of the first bonding layer 141. As an example, the auxiliary bonding layer 270 may be made of a material different from that of the first bonding layer 141 and include a moisture absorbent the same as or different from the moisture absorbent 141a.

[0095] That is, in the display device 200 according to another exemplary embodiment of the present specification, the encapsulation substrate 150 may include a base portion 150a disposed opposite to the substrate 110 and a protruding portion 150b protruding from the base portion 150a toward the substrate 110. In this case, the protruding portion 150b may be disposed in the non-display area NA. That is, the base portion 150a may protect the display device 200 from moisture introduced from above the display device 200. The protruding portion 150b may be disposed perpendicular to the substrate 110 and protect the display device 200 from moisture introduced from the side surface of the display device 200.

[0096] In this case, the spacer 160 may be disposed on the substrate 110 and absorb the impact that may occur during the process of bonding the package substrate 150 and the substrate 110. The spacer 160 may be disposed on the substrate 110 and in the non-display area NA, corresponding to the area where the protruding portion 150b of the package substrate 150 is provided. In addition, the spacer 160 may include a groove structure provided in its top surface. The spacer 160 may include a metal layer 162 provided on organic patterns 161 that are arranged to be spaced apart from each other. In this case, the metal layer 162 may be disposed between the organic patterns 161 and adjacent to the substrate 110. Accordingly, the end of the protruding portion 150b of the package substrate 150 may be adjacent to the metal layer 162 of the spacer 160, rather than adjacent to the substrate 110. Thus, the spacer 160 may minimize or reduce the impact that may be exerted on the substrate 110 by the protruding portion 150b of the package substrate 150.

[0097] In addition, in the display device 200 according to another exemplary embodiment of the present specification, the metal layer 162 of the spacer 160 may be made of a material having low reactivity. Accordingly, the penetration of moisture through the interface between the protruding portion 150b of the package substrate 150 and the metal layer 162 of the spacer 160 may be effectively blocked.

[0098] Particularly, in the display device 200 according to another exemplary embodiment of the present specification, an auxiliary bonding layer 270 may be additionally provided between the protruding portion 150b of the package substrate 150 and the groove of the spacer 160. Accordingly, the fixing force between the substrate 110 and the package substrate 150 may be increased, which may improve the encapsulation effect.

[0099] In addition, in the display device 200 according to another exemplary embodiment of the present specification, the auxiliary bonding layer 270 may be made of the same material as the first bonding layer 141. That is, since the auxiliary bonding layer 270 includes a moisture absorbent 141a, the auxiliary bonding layer 270 may absorb or remove moisture introduced through the interface between the auxiliary bonding layer 270 and the spacer 160 or the interface between the auxiliary bonding layer 270 and the protruding portion 150b, thereby more effectively suppressing lateral moisture penetration.

[0100] The exemplary embodiments of the present disclosure can also be described as follows:

[0101] According to one aspect of the present disclosure, a display device is provided. The display device includes: a substrate including a display area and a non-display area extending from the display area; a package substrate including a base portion disposed opposite to the substrate and a protruding portion protruding from the base portion toward the substrate and disposed in the non-display area; and a bonding layer disposed between the substrate and the package substrate and disposed in an area other than the area where the protruding portion is provided.

[0102] The display device may further include a spacer disposed on the substrate in the non-display area between the protruding portion and the substrate.

[0103] The spacer has a groove provided in a top surface of the spacer, and an end of the protruding portion may be disposed in the groove of the spacer.

[0104] The bonding layer may include a first bonding layer and a second bonding layer disposed below the first bonding layer. The first bonding layer may include a moisture absorbent.

[0105] The first bonding layer is adjacent to a bottom surface of the base portion. The second bonding layer is adjacent to a top surface of the substrate.

[0106] A width of the groove of the spacer may be equal to or greater than a width of the protruding portion.

[0107] The spacer may include a first pattern disposed on the substrate, a second pattern disposed on the substrate and outside the first pattern, and a covering layer disposed to cover surfaces of the first pattern and the second pattern.

[0108] The covering layer may be disposed between the first pattern and the second pattern and adjacent to the substrate.

[0109] An end of the protruding portion may be disposed in the groove of the spacer and adjacent to the covering layer.

[0110] The covering layer may be a metal layer.

[0111] The metal layer may include copper (Cu) and molybdenum titanium (Mo-Ti).

[0112] The first pattern, the second pattern, and the covering layer may be disposed to surround the display area.

[0113] The display device may further include an auxiliary bonding layer disposed in the groove of the spacer and between the protruding portion and the spacer.

[0114] The bonding layer may include a first bonding layer and a second bonding layer disposed below the first bonding layer. The auxiliary bonding layer may be made of the same material as one of the first bonding layer and the second bonding layer.

[0115] The first bonding layer may include a moisture absorbent.

[0116] The auxiliary bonding layer may include a moisture absorbent.

[0117] The first pattern and the second pattern may be organic patterns.

[0118] The first pattern and the second pattern may be made of the same material as a planarization layer configured to planarize an upper portion of the pixel circuit or a bank portion configured to define a light-emitting region.

[0119] The protruding portion may be disposed perpendicular to the substrate.

[0120] The protruding portion may be disposed to overlap a display portion disposed on the substrate in a lateral direction.

[0121] The protruding portion may be disposed to surround the display region.

[0122] The bonding layer may be adjacent to a bottom surface of the base portion, a top surface of the substrate, a top surface and a side surface of a display portion disposed on the substrate, and a side surface of the protruding portion.

[0123] Although the exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and can be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all respects and do not limit the present disclosure. All technical concepts within the equivalent scope of the present disclosure should be construed as falling within the scope of the present disclosure.

[0124] Cross - reference to related applications

[0125] This application claims the priority and benefits of Korean Patent Application No. 10 - 2023 - 0195533, filed with the Korean Intellectual Property Office on December 28, 2023, the disclosure of which is incorporated herein by reference in its entirety for all purposes as if fully set forth herein.

Claims

1. A display device, comprising: a substrate, the substrate comprising a display area and a non-display area extending from the display area; a packaging substrate including a base portion disposed opposite to the substrate, and a protruding portion protruding from the base portion toward the substrate and disposed in the non-display area; as well as A bonding layer is provided between the substrate and the packaging substrate and is provided in a region other than a region where the protruding portion is provided.

2. The display device according to claim 1, further comprising: A spacer is provided on the substrate in the non-display area between the protruding portion and the substrate.

3. The display device according to claim 2, wherein: The spacer has a groove provided in a top surface of the spacer, and an end portion of the protruding portion is provided in the groove of the spacer.

4. The display device according to claim 1, wherein: The bonding layer comprises: a first bonding layer; and a second bonding layer, the second bonding layer being disposed below the first bonding layer, Wherein, the first bonding layer includes a moisture absorbent.

5. The display device according to claim 4, wherein: The first bonding layer abuts a bottom surface of the base portion, and Wherein, the second bonding layer is adjacent to the top surface of the substrate.

6. The display device according to claim 3, wherein: The width of the groove of the spacer is equal to or greater than the width of the protruding portion.

7. The display device according to claim 3, wherein: The spacer comprises: a first pattern, wherein the first pattern is arranged on the substrate; a second pattern disposed on the substrate and disposed outside the first pattern to be spaced apart from the first pattern; and A covering layer is configured to cover a surface of the first pattern and a surface of the second pattern.

8. The display device according to claim 7, wherein: The cover layer is disposed between the first pattern and the second pattern and adjoins the substrate.

9. The display device according to claim 7, wherein: An end of the protruding portion is disposed in the groove of the spacer and abuts the cover layer.

10. The display device according to claim 7, wherein: The cover layer is a metal layer.

11. The display device according to claim 10, wherein: The metal layer includes copper (Cu) and molybdenum-titanium (Mo—Ti).

12. The display device according to claim 7, wherein: The first pattern, the second pattern, and the covering layer are arranged to surround the display area.

13. The display device according to claim 3, further comprising: An auxiliary bonding layer is disposed in the groove of the spacer and between the protruding portion and the spacer.

14. The display device according to claim 13, wherein: The bonding layer comprises: a first bonding layer; and a second bonding layer, the second bonding layer being disposed below the first bonding layer, and The auxiliary bonding layer is made of the same material as one of the first bonding layer and the second bonding layer.

15. The display device according to claim 14, wherein: The first bonding layer includes a moisture absorbent.

16. The display device according to claim 13, wherein: The auxiliary bonding layer includes a moisture absorbent.

17. The display device according to claim 7, wherein: The first pattern and the second pattern are organic patterns.

18. The display device according to claim 7, wherein: The first pattern and the second pattern are made of the same material as a planarization layer configured to planarize an upper portion of the pixel circuit or a bank configured to define a light emitting region.

19. The display device according to claim 1, wherein: The protruding portion is disposed perpendicular to the substrate.

20. The display device according to claim 1, wherein: The protruding portion is disposed to overlap with a display portion disposed on the substrate in a lateral direction.

21. The display device according to claim 1, wherein: The protruding portion is configured to surround the display area.

22. The display device according to claim 1, wherein: The bonding layer abuts on a bottom surface of the base portion, a top surface of the substrate, a top surface and a side surface of a display portion provided on the substrate, and a side surface of the protruding portion.

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