Die bonder and correction method thereof, computer readable storage medium and packaging equipment

Abstract

The invention relates to the technical field of semiconductors, in particular to a die bonder and a correction method thereof, a computer readable storage medium and packaging equipment. The device is applied to a die bonder, and the die bonder comprises a swing arm capable of rotating, a suction nozzle fixedly connected with the swing arm, a die bonding lens and a die taking lens which are located above the swing arm, and a downward-looking flying shooting lens located below the swing arm. When the swing arm rotates, the suction nozzle passes through the visual fields of the three camera lenses, and a calibration jig is arranged on the swing arm; the correction method of the die bonder comprises the following steps: driving a swing arm to swing, and respectively acquiring camera pixel ratios and camera coordinate calibration of three camera lenses based on a calibration jig; the center coordinate of the center point of the suction nozzle is obtained through the down-looking flying shooting lens, the crystal taking coordinate of the suction nozzle is obtained through the crystal taking lens, and the crystal fixing coordinate of the suction nozzle is obtained through the crystal fixing lens; and based on the center coordinate, the die bond coordinate, the die pick-up coordinate, the die bond pixel ratio and the camera pixel ratio, acquiring a die pick-up position offset and a die bond position offset. The position of the suction nozzle can be accurately obtained.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, in particular to a die bonder and its calibration method, a computer-readable storage medium, and a packaging device. Background Art

[0002] A die bonder is a device used in semiconductor chip manufacturing. Its main function is to fix the electronic components on the chip and the chip substrate together. It includes a swing arm with a nozzle for sucking and placing the chip, and also includes a camera for positioning to obtain the real-time position of the nozzle. When positioning the nozzle, a reflector is placed on the workbench of the die bonder. The nozzle is moved above the reflector, and the nozzle is controlled to be finely adjusted so that the center of its bottom is aligned with the center of the reflector. Through the real-time image of the camera, the reflected light spot on the reflector is observed. This reflected light spot corresponds to the position of the nozzle. The position of the nozzle is adjusted so that the reflected light spot is aligned with the cross mark of the camera, thereby ensuring that the center of the nozzle is aligned with the center of the camera. Once the reflected light spot is aligned with the cross mark of the camera, the position parameters of the current nozzle are recorded. These parameters can be used for subsequent die bonding operations to ensure that the nozzle always maintains an accurate center position during chip picking and die bonding.

[0003] For a relatively long nozzle, the corresponding reflected light spot may not be captured by the camera because the length of the nozzle exceeds the field of view of the camera. This makes the traditional reflector method unable to effectively calibrate the center of the nozzle. Summary of the Invention

[0004] The technical problem to be solved by the embodiments of the present invention is to provide a die bonder and its calibration method, a computer-readable storage medium, and a packaging device to solve the problem that the nozzle cannot be accurately positioned in the prior art.

[0005] The present invention discloses a calibration method for a die bonder, which is applied to a die bonder. The die bonder includes a swing arm that can rotate, a nozzle fixedly connected to the swing arm, and three camera lenses. The three camera lenses include a die bonding lens and a chip picking lens located above the swing arm, and a bottom-view flying shot lens located below the swing arm. When the swing arm rotates, the nozzle will pass through the fields of view of the three camera lenses, and a calibration fixture is arranged on the swing arm.

[0006] The calibration method of the die bonder includes:

[0007] Drive the swing arm to swing, and respectively obtain the camera pixel ratio and camera coordinate calibration of the three camera lenses based on the calibration fixture;

[0008] After the nozzle is installed, drive the swing arm to swing, obtain the central coordinates of the center point of the nozzle through the lower vision flying shooting lens, obtain the crystal picking coordinates of the nozzle through the crystal picking lens, and obtain the die bonding coordinates of the nozzle through the die bonding lens;

[0009] Obtain the crystal picking position offset and the die bonding position offset based on the central coordinates, the die bonding coordinates, the crystal picking coordinate ratio, and the camera pixel ratio.

[0010] Optionally, the step of obtaining the camera pixel ratio and the camera coordinate calibration of the three camera lenses respectively based on the calibration jig includes:

[0011] Drive the swing arm to rotate so that the calibration jig is respectively located in the fields of view of the three camera lenses, and record the rotation angles;

[0012] Drive the three camera lenses to collect position information when the calibration jig is in their own fields of view, and perform camera coordinate calibration on the three camera lenses based on the position information and the rotation angles.

[0013] Optionally, the step of obtaining the crystal picking position offset and the die bonding position offset based on the central coordinates, the die bonding offset coordinates, the crystal picking offset coordinates, the die bonding pixel ratio, and the camera pixel ratio includes:

[0014] Obtain the position offset between the calibration jig and the nozzle through the lower vision acquisition position of the lower vision flying shooting lens and the central coordinates;

[0015] Obtain the crystal picking position offset and the die bonding position offset based on the position offset.

[0016] Optionally, the step of obtaining the crystal picking position offset and the die bonding position offset based on the position offset includes:

[0017] Obtain the crystal picking position offset according to the following formula:

[0018] X4 = (X1 + (Y3 - Y2)cosα1)B3 / B1

[0019] Y4 = (Y1 + (X3 - X2)sinα1)B3 / B1

[0020] Obtain the die bonding position offset according to the following formula:

[0021] X6 = (X5 - (Y3 - Y2)cosα2)B3 / B2

[0022] Y6 = (Y5 - (X3 - X2)sinα2)B3 / B2

[0023] Among them, (X4, Y4) are the coordinates of the offset of the crystal picking position, (X6, Y6) are the coordinates of the offset of the die bonding position, (X2, Y2) are the coordinates of the lower vision acquisition position, (X3, Y3) are the central coordinates, (X1, Y1) are the coordinates of the crystal picking acquisition position in the acquisition position information, (X5, Y5) are the coordinates of the crystal picking acquisition position in the acquisition position information, B3 is the camera pixel ratio of the lower vision flying shooting lens, B2 is the camera pixel ratio of the die bonding lens, B1 is the camera pixel ratio of the crystal picking lens, α1 is the rotation angle of the swing arm from the field of view of the lower vision flying shooting lens to the field of view of the crystal picking lens, and α2 is the rotation angle of the swing arm from the field of view of the lower vision flying shooting lens to the field of view of the die bonding lens.

[0024] Optionally, the step of respectively obtaining the camera pixel ratios of the three camera lenses includes:

[0025] For each of the camera lenses, drive the swing arm to rotate within the field of view of the camera lens so that the camera lens can collect at least two position information of the calibration jig, and obtain the camera pixel ratio of the camera lens based on the at least two position information.

[0026] Optionally, the step of obtaining the camera pixel ratio of the camera lens based on the at least two position information includes:

[0027] Respectively obtain the horizontal coordinate pixel ratio and the vertical coordinate pixel ratio based on the horizontal coordinate values and the vertical coordinate values of the at least two position information;

[0028] Obtain the ratio of the horizontal coordinate pixel ratio and the vertical coordinate pixel ratio. If the ratio meets the preset requirements, obtain the camera pixel ratio according to the horizontal coordinate pixel ratio and the vertical coordinate pixel ratio.

[0029] Optionally, the step of respectively obtaining the horizontal coordinate pixel ratio and the vertical coordinate pixel ratio based on the horizontal coordinate values and the vertical coordinate values of the at least two position information includes:

[0030] Obtain the horizontal coordinate pixel ratio and the vertical coordinate pixel ratio according to the following formula:

[0031]

[0032] Among them, R is the rotation radius of the swing arm, is the rotation angle of the swing arm within the field of view of the camera lens, x1 and x2 are the horizontal coordinate values, y1 and y2 are the vertical coordinate values, a is the horizontal coordinate pixel ratio, and b is the vertical coordinate pixel ratio.

[0033] The present invention also discloses a die bonder for implementing the method described above, which includes a swing arm capable of rotational movement, a suction nozzle fixedly connected to the swing arm, and three camera lenses. The three camera lenses include a die bonding lens and a crystal picking lens located above the swing arm, and a bottom-view flying shooting lens located below the swing arm. When the swing arm rotates, the suction nozzle will pass through the fields of view of the three camera lenses, and a calibration fixture is provided on the swing arm.

[0034] The present invention also discloses a computer-readable storage medium storing a computer program, which when executed by a processor causes the processor to execute the steps of the method described above.

[0035] The present invention also discloses a packaging device, including a memory and a processor. The memory stores a computer program, which when executed by the processor causes the processor to execute the steps of the method described above.

[0036] Compared with the prior art, the beneficial effect of the calibration method of the die bonder provided by the embodiment of the present invention is as follows: The suction nozzle is positioned by three camera lenses. First, each lens is calibrated by the calibration fixture on the swing arm, and the camera pixel ratio of each lens is obtained. Then, the coordinate information of the suction nozzle is obtained through each lens. Based on the coordinates obtained by the bottom-view flying shooting lens, the coordinates of the other two lenses are adjusted, thereby eliminating the visual differences between the three lenses, obtaining the actual position of the suction nozzle, and achieving accurate positioning of the suction nozzle. According to this actual position, the swing angle of the swing arm is adjusted so that the actual position reaches the standard position, so that the suction nozzle can accurately pick up the chips to be processed, improving the processing effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The following will further describe the solution of the present invention in detail with reference to the drawings and embodiments. In the drawings:

[0038] Figure 1 is a schematic flowchart of an embodiment of the calibration method of the die bonder provided by the present invention;

[0039] Figure 2 is a schematic structural diagram of an embodiment of the die bonder provided by the present invention;

[0040] Figure 3 is a schematic diagram of an embodiment of calculating the camera pixel ratio provided by the present invention;

[0041] Figure 4 is a schematic diagram of the principle of calculating the offset of the crystal picking position and the offset of the die bonding position provided by the present invention.

[0042] The reference numerals in the drawings are as follows:

[0043] 10. Die bonder; 11. Swing arm; 12. Nozzle; 13. Die bonding lens; 14. Chip picking lens; 15. Bottom vision flying shot lens. Detailed implementation manners

[0044] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments may be combined with each other. Now, in conjunction with the drawings, the preferred embodiments of the present invention will be described in detail.

[0045] Please refer to Figure 1 and Figure 2 , Figure 1 which is a schematic flowchart of an embodiment of the calibration method for the die bonder provided by the present invention, Figure 2 and Figure 2 is a schematic structural diagram of an embodiment of the die bonder provided by the present invention. As shown in , the die bonder 10 is used for the chip packaging process. The swing arm 11 is an important component of the die bonder 10 and is used to implement the chip picking and die bonding operations. The swing arm 11 can perform rotational movement to accurately move the chip from the chip picking position to the die bonding position. The movement of the swing arm 11 is usually driven by a motor and achieves high-precision positioning through precise control algorithms. The nozzle 12 is fixedly connected to one end of the swing arm 11 and is used to pick up and place the chip. The nozzle 12 usually has an adjustable vacuum adsorption function to ensure that the chip will not fall during the movement. The die bonder 10 is equipped with three camera lenses, which are respectively located above and below the swing arm 11. Specifically, the die bonding lens 13 is located above the swing arm 11 and is used to perform precise positioning and alignment before the chip is placed on the substrate. The die bonding lens 13 ensures the accuracy of the chip at the die bonding position through high-resolution image capture and processing. The chip picking lens 14 is also located above the swing arm 11 and is used to identify and position the chip at the chip picking position. The chip picking lens 14 ensures that the nozzle 12 can accurately pick up the chip through image recognition technology. The bottom vision flying shot lens 15 is located below the swing arm 11 and is used to perform real-time monitoring and angle correction during the movement of the chip. The bottom vision flying shot lens 15 can capture the image of the chip during the movement of the swing arm 11 to ensure that the chip maintains the correct angle and position during the movement. In this embodiment, a calibration fixture (not shown in the figure) is installed on the swing arm 11, and the calibration fixture can be made of a transparent material, so as to ensure that the die bonding lens 13, the chip picking lens 14, and the bottom vision flying shot lens 15 can all successfully capture the calibration fixture.

[0046] The calibration method for the die bonder provided by the present invention includes the following steps:

[0047] S101: Based on the calibration fixture, respectively obtain the camera pixel ratio and camera coordinate calibration of the three camera lenses.

[0048] ​In a specific implementation scenario, the camera lens may introduce distortions during the imaging process, such as radial distortion and tangential distortion. Through the camera pixel ratio, these distortions can be obtained, thereby adjusting the pixel coordinates of the camera. It is also possible to perform corresponding adjustments on the pixel coordinates of each camera based on the camera pixel ratio to ensure that the measurement results and coordinate information between different camera lenses or different camera systems are consistent, thus ensuring the stability and accuracy of the entire die bonder system.

[0049] Obtain the camera pixel ratio for each camera lens separately. Drive the swing arm to rotate so that the calibration jig on the swing arm can move within the field of view of the current camera lens. The camera pixel ratio of the current camera can be calculated based on the coordinate values when the calibration jig is at different positions and the included angle between these positions.

[0050] Specifically, obtain the horizontal pixel ratio and the vertical pixel ratio respectively based on the abscissa values and ordinate values of at least two position information. Calculate the ratio of the horizontal and vertical pixel ratios. If the ratio meets the preset requirements (for example, within the range of 1±0.05), it means that the camera pixel ratios in the X direction and Y direction are basically the same, which can ensure that the image ratio and accuracy of the camera lens meet the standards and can be used for subsequent positioning and calibration of the pick-up nozzle. When the ratio meets the preset requirements, obtain the camera pixel ratio based on the horizontal pixel ratio and the vertical pixel ratio. For example, take the vertical pixel ratio as the camera pixel ratio of the die bonding lens because in the optical design of many camera lenses, the imaging in the vertical direction is often more stable than that in the horizontal direction. This is because the optical axis of the lens is usually perpendicular to the imaging plane, and the propagation path of light in the vertical direction is relatively more direct and stable, and is less affected by factors such as optical distortion. The mechanical structure of the camera and the lens is usually more stable in the vertical direction. For example, the support structure and installation method of the camera body and the lens can often better ensure the imaging stability in the vertical direction and reduce the imaging deviation caused by factors such as mechanical vibration and installation error. This makes the vertical pixel ratio more representative to a certain extent. Therefore, the vertical pixel ratio may be more able to accurately reflect the true pixel ratio of the die bonding lens. In other implementation scenarios, it is also possible to take the average of the horizontal pixel ratio and the vertical pixel ratio as the camera pixel ratio of the die bonding lens.

[0051] Please refer to Figure 3 , Figure 3It is a schematic diagram of an embodiment for calculating the pixel ratio of a camera provided by the present invention. Taking the die bonding lens as an example, the principle and method for obtaining the camera pixel ratio of the die bonding lens and the downward vision flying shooting lens are basically the same as those of the die bonding lens, and will not be elaborated here. The driving swing arm is at the first angle. At this time, the calibration jig is within the field of view of the die bonding camera lens. The driving device obtains the position A1(x1, y1) of the calibration jig at this moment. The driving swing arm rotates to the second angle different from the first angle. At this time, the calibration jig is also within the field of view of the die bonding camera lens. The driving device obtains the position A2(x2, y2) of the calibration jig at this moment. The difference between the first angle and the second angle is obtained as the included angle.

[0052] The horizontal pixel ratio and the vertical pixel ratio are obtained according to the following formula:

[0053]

[0054] where R is the rotation radius of the swing arm, is the rotation angle of the swing arm within the field of view of the camera lens, x1 and x2 are the horizontal coordinate values, y1 and y2 are the vertical coordinate values, a is the horizontal pixel ratio, and b is the vertical pixel ratio. The rotation radius of the swing arm and the included angle are both known values, and the values of x1, y1, x2, and y2 can be obtained by reading the imaging data of the die bonding lens.

[0055] In this implementation scenario, coordinate calibration needs to be performed on three camera lenses to help correct the positions and angles of the images formed by the three camera lenses, which helps to avoid errors and achieve accurate positioning of the suction nozzle. The driving swing arm can be rotated so that the calibration jig is respectively within the fields of view of the three camera lenses and record the rotation angles of the swing arm. Specifically, three rotation angles are preset so that when the swing arm rotates each swing angle respectively, the calibration jig can be within the field of view of a camera lens. When the swing arm rotates the first rotation angle relative to the preset initial position, the calibration jig is within the field of view of the die bonding lens, and record the first position information of the calibration jig in the die bonding lens. When the swing arm rotates the second rotation angle relative to the preset initial position, the calibration jig is within the field of view of the crystal picking lens, and record the second position information of the calibration jig in the crystal picking lens. When the swing arm rotates the third rotation angle relative to the preset initial position, the calibration jig is within the field of view of the downward vision flying shooting lens, and record the third position information of the calibration jig in the crystal picking lens.

[0056] Since the rotation angle of the swing arm is known and the rotation radius of the swing arm is known, it is possible to infer the other two position information based on the position information within a camera lens. By comparing the calculated position information with the actually recorded position information, the positioning difference between the cameras can be obtained. Based on this positioning difference, correction can be performed to ensure that the coordinate systems between different cameras are aligned, guaranteeing that their measurement results in the same scenario are consistent and avoiding the problem of low accuracy caused by inconsistent coordinate systems. By adjusting the camera coordinate system, a unified calibration standard can be established, facilitating calibration operations.

[0057] S102: Obtain the central coordinates of the nozzle center point through the downward-looking flying shooting lens, obtain the crystal picking coordinates of the nozzle through the crystal picking lens, and obtain the die bonding coordinates of the nozzle through the die bonding lens.

[0058] In a specific implementation scenario, after the nozzle is installed, obtain the central coordinates of the nozzle center point through the downward-looking flying shooting lens, and infer the crystal picking position offset of the crystal picking lens and the die bonding position offset of the die bonding lens based on the central coordinates. The downward-looking flying shooting lens usually has higher precision and resolution and is suitable as a calibration benchmark. Therefore, in this embodiment, the downward-looking flying shooting lens is used as the benchmark. The swing arm can be first driven to operate so that the nozzle is located within the field of view of the downward-looking flying shooting lens, record the position of the swing arm at this time, or obtain the first shooting angle by which the swing arm rotates compared to the initial angle.

[0059] Obtain the first included angle through the difference between the second rotation angle and the third rotation angle during camera calibration. When the swing arm rotates the first included angle, the calibration jig can be moved from the field of view of the downward-looking flying shooting lens to the field of view of the crystal picking lens. Therefore, after the first shooting angle deflects the first included angle, the nozzle can also be moved from the field of view of the downward-looking flying shooting lens to the field of view of the crystal picking lens. Locate the nozzle through the crystal picking lens, and use the coordinates of the nozzle obtained in the crystal picking lens as the crystal picking coordinates.

[0060] Obtain the second included angle through the difference between the first rotation angle and the third rotation angle during camera calibration. When the swing arm rotates the first included angle, the calibration jig can be moved from the field of view of the downward-looking flying shooting lens to the field of view of the die bonding lens. Therefore, after the first shooting angle deflects the second included angle, the nozzle can also be moved from the field of view of the downward-looking flying shooting lens to the field of view of the die picking lens. Locate the nozzle through the die bonding lens, and use the coordinates of the nozzle obtained in the die bonding lens as the die bonding coordinates.

[0061] S103: Obtain the crystal picking position offset and the die bonding position offset based on the central coordinates, die bonding coordinates, crystal picking coordinates, and camera pixel ratio.

[0062] In a specific implementation scenario, based on the central coordinates and the third position information during calibration, the position offset of the nozzle relative to the calibration jig can be obtained. Based on this position offset, the crystal picking coordinates and die bonding coordinates are adjusted to obtain the corresponding crystal picking position offset and die bonding position offset. The crystal picking position offset and die bonding position offset are the standard coordinate values of the nozzle. The swing arm is driven to swing according to the crystal picking position offset and die bonding position offset, so that the standard coordinate value of the nozzle is the target coordinate value, and thus the nozzle can accurately pick up the chip to be processed from the work station.

[0063] Please refer to Figure 4 , Figure 4 which is a schematic diagram of the principle for calculating the crystal picking position offset and die bonding position offset provided by the present invention.

[0064] Specifically, the crystal picking position offset is obtained according to the following formula:

[0065] X4 = (X1 + (Y3 - Y2)cosα1)B3 / B1

[0066] Y4 = (Y1 + (X3 - X2)sinα1)B3 / B1

[0067] The die bonding position offset is obtained according to the following formula:

[0068] X6 = (X5 - (Y3 - Y2)cosα2)B3 / B2

[0069] Y6 = (Y5 - (X3 - X2)sinα2)B3 / B2

[0070] Among them, (X4, Y4) are the coordinates of the crystal picking position offset, (X6, Y6) are the coordinates of the die bonding position offset, (X2, Y2) are the coordinates of the lower vision acquisition position, (X3, Y3) are the central coordinates, (X1, Y1) are the crystal picking acquisition position coordinates in the acquisition position information, (X5, Y5) are the die bonding acquisition position coordinates in the acquisition position information, B3 is the camera pixel ratio of the lower vision flying shot lens, B2 is the camera pixel ratio of the die bonding lens, B1 is the camera pixel ratio of the crystal picking lens, α1 is the rotation angle (the first included angle) of the swing arm from the lower vision flying shot lens field of view to the crystal picking lens field of view, and α2 is the rotation angle (the second included angle) of the swing arm from the lower vision flying shot lens field of view to the die bonding lens field of view.

[0071] When the rotation angles are both 90 degrees, that is, α1 and α2 are 90 degrees, cosα1 = 0, sinα1 = 1, cosα2 = 0, sinα2 = 1, then the above formula can be simplified as:

[0072] X4 = (X1 + (Y3 - Y2))B3 / B1

[0073] Y4 = (Y1+(X3-X2))B3 / B1

[0074] X6 = (X5-(Y3-Y2))B3 / B2

[0075] Y6 = (Y5-(X3-X2))B3 / B2

[0076] As can be seen from the above description, in this embodiment, the nozzle is positioned by three camera lenses. First, the calibration fixtures on the swing arm are used to calibrate each lens and obtain the camera pixel ratio of each lens. Then, the coordinate information of the nozzle is obtained through each lens. Based on the coordinates obtained by the bottom vision flying shooting lens, the coordinates of the other two lenses are adjusted, thereby eliminating the visual differences between the three lenses, obtaining the actual position of the nozzle, and achieving accurate positioning of the nozzle. According to this actual position, the swing angle of the swing arm is adjusted to make the actual position reach the standard position, so that the nozzle can accurately pick up the chip to be processed, improving the processing effect.

[0077] The present invention also provides a packaging device. The packaging device includes a processor and a memory. The processor is coupled to the memory. A computer program is stored in the memory, and the processor executes the computer program during operation to implement the above method. For detailed steps, reference can be made to the above, and details will not be elaborated here.

[0078] The present invention also provides a computer-readable storage medium. At least one computer program is stored in the computer-readable storage medium, and the computer program is used to be executed by the processor to implement the above method. For detailed steps, reference can be made to the above, and details will not be elaborated here. In one embodiment, the computer-readable storage medium can be a storage chip, a hard disk, a mobile hard disk, a USB flash drive, an optical disc, or other readable and writable storage tools in a terminal, or a server, etc.

[0079] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The program can be stored in a non-volatile computer-readable storage medium. When the program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, storage, database, or other medium used in the various embodiments provided in the present application can include non-volatile and / or volatile memories. Non-volatile memories can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memories can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and Rambus dynamic RAM (RDRAM), etc.

[0080] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0081] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. For those skilled in the art, the technical solutions described in the above embodiments can be modified, or some of the technical features can be equivalently replaced; and all such modifications and replacements should fall within the protection scope of the appended claims of the present invention.

Claims

1. A calibration method for a die bonder, characterized in that, Applied to a die bonder, the die bonder includes a swing arm that can rotate, a suction nozzle fixedly connected to the swing arm, and three camera lenses. The three camera lenses include a die bonding lens located above the swing arm, a crystal picking lens, and a bottom-view flying shot lens located below the swing arm. When the swing arm rotates, the suction nozzle will pass through the fields of view of the three camera lenses, and a calibration fixture is provided on the swing arm. The calibration method of the die bonder includes: Driving the swing arm to swing, and respectively obtaining the camera pixel ratios and camera coordinate calibrations of the three camera lenses based on the calibration fixture. After the suction nozzle is installed, driving the swing arm to swing, obtaining the center coordinates of the center point of the suction nozzle through the bottom-view flying shot lens, obtaining the crystal picking coordinates of the suction nozzle through the crystal picking lens, and obtaining the die bonding coordinates of the suction nozzle through the die bonding lens. Obtaining the crystal picking position offset and die bonding position offset based on the center coordinates, the die bonding coordinates, the crystal picking coordinates, and the camera pixel ratios.

2. The calibration method of the die bonder according to claim 1, wherein The step of respectively obtaining the camera pixel ratios and camera coordinate calibrations of the three camera lenses based on the calibration fixture includes: Driving the swing arm to rotate so that the calibration fixture is respectively located in the fields of view of the three camera lenses, and recording the rotation angles. Driving the three camera lenses to collect position information when the calibration fixture is in their own fields of view, and performing camera coordinate calibration on the three camera lenses based on the position information and the rotation angles.

3. The calibration method of the die bonder according to claim 2, wherein The step of obtaining the crystal picking position offset and die bonding position offset based on the center coordinates, the die bonding offset coordinates, the crystal picking offset coordinates, the die bonding pixel ratio, and the camera pixel ratio includes: Obtaining the position offset between the calibration fixture and the suction nozzle through the bottom-view acquisition position of the bottom-view flying shot lens and the center coordinates. Obtaining the crystal picking position offset and die bonding position offset based on the position offset.

4. The calibration method of the die bonder according to claim 3, characterized in that, The step of obtaining the crystal picking position offset and die bonding position offset based on the position offset includes: Obtaining the crystal picking position offset according to the following formula: X4 = (X1 + (Y3 - Y2)cosα1)B3 / B1 Y4 = (Y1 + (X3 - X2)sinα1)B3 / B1 Obtaining the die bonding position offset according to the following formula: X6 = (X5 - (Y3 - Y2)cosα2)B3 / B2 Y6 = (Y5 - (X3 - X2)sinα2)B3 / B2 Among them, (X4, Y4) are the coordinates of the offset of the crystal picking position, (X6, Y6) are the coordinates of the offset of the die bonding position, (X2, Y2) are the coordinates of the lower vision acquisition position, (X3, Y3) are the central coordinates, (X1, Y1) are the coordinates of the crystal picking acquisition position in the acquisition position information, (X5, Y5) are the coordinates of the crystal picking acquisition position in the acquisition position information, B3 is the camera pixel ratio of the lower vision flying shooting lens, B2 is the camera pixel ratio of the die bonding lens, B1 is the camera pixel ratio of the crystal picking lens, α1 is the rotation angle of the swing arm from the field of view of the lower vision flying shooting lens to the field of view of the crystal picking lens, and α2 is the rotation angle of the swing arm from the field of view of the lower vision flying shooting lens to the field of view of the die bonding lens.

5. The calibration method of the die bonder according to claim 1, wherein The step of respectively obtaining the camera pixel ratios of the three camera lenses includes: For each of the camera lenses, drive the swing arm to rotate within the field of view of the camera lens so that the camera lens can collect at least two position information of the calibration jig, and obtain the camera pixel ratio of the camera lens based on the at least two position information.

6. The calibration method of the die bonder according to claim 5, wherein The step of obtaining the camera pixel ratio of the camera lens based on the at least two position information includes: Respectively obtain the horizontal coordinate pixel ratio and the vertical coordinate pixel ratio based on the horizontal coordinate values and the vertical coordinate values of the at least two position information; Obtain the ratio of the horizontal coordinate pixel ratio and the vertical coordinate pixel ratio. If the ratio meets the preset requirements, obtain the camera pixel ratio according to the horizontal coordinate pixel ratio and the vertical coordinate pixel ratio.

7. The calibration method of the die bonder according to claim 6, wherein, The step of respectively obtaining the horizontal coordinate pixel ratio and the vertical coordinate pixel ratio based on the horizontal coordinate values and the vertical coordinate values of the at least two position information includes: Obtain the horizontal coordinate pixel ratio and the vertical coordinate pixel ratio according to the following formula: where R is the rotation radius of the swing arm, is the rotation angle of the swing arm within the field of view of the camera lens, x1 and x2 are the abscissa values, y1 and y2 are the ordinate values, a is the abscissa pixel ratio, and b is the ordinate pixel ratio.

8. A die bonder, characterized in that, A method for implementing any one of claims 1-7 includes a swing arm capable of rotational movement, a suction nozzle fixedly connected to the swing arm, and three camera lenses. The three camera lenses include a die bonding lens, a crystal picking lens located above the swing arm, and a lower vision flying shooting lens located below the swing arm; when the swing arm rotates, the suction nozzle will pass through the fields of view of the three camera lenses, and a calibration jig is provided on the swing arm.

9. A computer-readable storage medium, characterized in that, A computer program is stored, and when the computer program is executed by a processor, the processor is caused to execute the steps of the method according to any one of claims 1 to 7.

10. An encapsulation device, characterized in that, It includes a memory and a processor. The memory stores a computer program, and when the computer program is executed by the processor, the processor is caused to execute the steps of the method according to any one of claims 1 to 7.

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