Method for processing single-layer multi-point capacitive screen based on laser etching mixed process

Abstract

The invention relates to the technical field of capacitive screen processing, and discloses a method for processing a single-layer multi-point capacitive screen based on a laser etching mixed process, which comprises the following steps: executing a heat distribution modeling strategy on each position on the capacitive screen, calculating a heat source distribution function of each position, and calculating heat accumulation of each rectangular area; a correlation function of the area and heat accumulation of the rectangular area is established, division of the capacitive screen is optimized based on the correlation function, and the rectangular area is updated; for the pin on any rectangular area, triple design optimization is executed on the pin, and specifically, the position, connected with the rectangular area, of each pin is obtained; executing a first optimization strategy, and optimizing the connection position of the pin on the rectangular area; executing a second optimization strategy according to the width and the length of the cross section of the pin; and a third optimization strategy is executed on the rectangular area, so that the arrangement of the pins is optimized, the coupling effect is reduced, and the performance and the stability of the capacitive screen are remarkably improved.

Description

Technical Field

[0001] The present invention relates to the technical field of capacitive touch screen processing, and specifically to a method for processing a single-layer multi-point capacitive touch screen based on a laser etching hybrid process. Background Art

[0002] The technology of processing a single-layer multi-point capacitive touch screen based on a laser etching hybrid process has significant advantages. The laser etching technology can precisely process complex circuit patterns, especially suitable for processing fine and complex patterns. Through the laser etching process, the conductive layer of the capacitive touch screen can achieve high-precision processing without damaging the substrate, significantly improving the performance and sensitivity of the capacitive touch screen. At the same time, the laser etching technology can reduce the common material waste in traditional processes during processing, reducing production costs. In addition, the use of the laser etching hybrid process can also combine the advantages of different materials to improve the overall performance of the capacitive touch screen. For example, by introducing the hybrid process, the current transmission ability of the capacitive touch screen can be optimized, signal crosstalk can be reduced, and the anti-interference ability of the screen can be enhanced. This process is particularly suitable for the production of multi-point touch screens, and can precisely control the position of each touch point, improving touch accuracy and sensitivity, and enhancing the user experience.

[0003] There are some defects in the existing technology in the manufacture of multi-point capacitive touch screens. Traditional capacitive touch screen processing methods usually rely on printing or etching processes, but these technologies often face problems of low processing accuracy and high costs. The printing process is not as precise as laser etching in detail processing, especially when dealing with complex patterns and fine spacings, signal crosstalk and uneven conductivity are likely to occur. In addition, in large-scale production, it is difficult to achieve consistency and high-quality control with the existing processes, which easily leads to different performances of each screen, affecting the stability and reliability of the product. At the same time, the design of traditional capacitive touch screens usually cannot flexibly adapt to different functional requirements, restricting their application in high-precision and multi-functional scenarios. Although the existing technology has been optimized many times, there is still much room for improvement in terms of accuracy, stability, and anti-interference, especially when dealing with high-precision touch and touch experience in complex environments, there are still obvious deficiencies.

[0004] This solution proposes an optimized capacitive touch screen design and manufacturing solution, which significantly improves the performance and stability of the capacitive touch screen by introducing a laser etching hybrid process and a heat management strategy. Summary of the Invention

[0005] The present invention provides a method for processing a single-layer multi-point capacitive touch screen based on a laser etching hybrid process, which helps to solve the problems mentioned in the above background art.

[0006] In a first aspect, the present application provides a method for processing a single-layer multi-point capacitive screen based on a laser etching hybrid process, adopting the following technical solutions: A method for processing a single-layer multi-point capacitive screen based on a laser etching hybrid process, comprising: Select any point on the capacitive screen as the coordinate origin to establish a two-dimensional coordinate system; Divide the capacitive screen into a number of rectangular regions with equal areas by meshing; Execute a heat distribution modeling strategy for each position on the capacitive screen, calculate the heat source distribution function for each position, and calculate the heat accumulation in each rectangular region; Establish a correlation function between the area of the rectangular region and the heat accumulation, and optimize the division of the capacitive screen based on the correlation function to update the rectangular regions; For the pins on any one rectangular region, perform triple design optimization on the pins, specifically: Obtain the positions where each pin connects to the rectangular region; Set the minimum and maximum intervals between adjacent pins; Execute the first optimization strategy to optimize the connection positions of the pins on the rectangular region; Assume that the cross-sectional shape of each pin is rectangular, and obtain the width and length of the pin cross-section; According to the width and length of the pin cross-section, execute the second optimization strategy to minimize the contact impedance by optimizing the cross-sectional shape; perform the third optimization strategy on the rectangular region to optimize the arrangement of the pins and reduce the coupling effect between the signals transmitted to the pins.

[0007] By meshing the capacitive screen and executing the heat distribution modeling, the heat source distribution in each region can be accurately calculated, which helps to accurately predict and adjust the temperature change of the capacitive screen during the design phase. This method enables the heat accumulation to be monitored and optimized in real time, thus ensuring that the device does not fail due to excessive temperature rise during high-load operation. In particular, the arrangement of the pins through the triple optimization strategy - including position optimization, cross-sectional shape optimization, and staggered arrangement optimization - greatly reduces the signal coupling effect between the pins of the capacitive screen, thereby effectively improving the quality and accuracy of signal transmission. By considering the minimum and maximum distances between the pins, it can be ensured that the signal transmission is not affected by crosstalk, which is crucial for improving the performance of the capacitive screen. In addition, the cross-sectional optimization of the pins reduces the contact impedance, thereby reducing the signal loss. This comprehensive optimization method not only improves the signal processing ability of the capacitive screen but also extends the service life of the device, ensuring its stability and reliability.

[0008] Preferably, the executing a heat distribution modeling strategy for each position on the capacitive screen, calculating the heat source distribution function for each position, and calculating the heat accumulation in each rectangular region includes: For any position (x, y) on the capacitive screen, where x and y are the horizontal and vertical coordinates of the position in the two-dimensional coordinate system respectively; Calculate the heat source distribution function of the position (x, y) where α is the heat source intensity and β is a constant related to the heat source attenuation degree; For any rectangular region, represent the rectangular region as [x1, x2] × [y1, y2], where (x1, y1) and (x2, y2) are the two vertices on any diagonal of the rectangular region, and [x1, x2] and [y1, y2] are the length and width of the rectangular region respectively; Calculate the heat accumulation of the i-th rectangular region by integrating the heat sources at each position in the rectangular region: where Q i is the heat accumulation of the i-th rectangular region.

[0009] Optimize the thermal management of the capacitive screen by modeling the heat accumulation in the rectangular region. By combining the calculation of the heat source attenuation degree and the heat accumulation, this method can predict the temperature of each area of the capacitive screen in detail, so as to achieve refined temperature control. Through the correlation between the heat source distribution function and the area of the region, the division of the capacitive screen can be dynamically adjusted to make the heat evenly distributed, thus preventing the occurrence of local overheating or overcooling phenomena. The heat accumulation in the rectangular region not only considers the intensity of the heat source, but also is closely related to the geometric shape and size of each region, which makes the heat management more scientific and efficient. Finally, accurately calculating the heat accumulation of each rectangular region provides a solid data basis for subsequent optimization. By closely combining temperature management with region division, this method helps to avoid failures caused by excessive temperature in practical applications and improves the working stability and service life of the capacitive screen.

[0010] Preferably, establishing the correlation function between the area of the rectangular region and the heat accumulation, and optimizing the division of the capacitive screen based on the correlation function includes: Establish the correlation function between the area of the rectangular region and the heat accumulation: where A i is the area of the i-th rectangular region, χ1 is the region characteristic coefficient used to describe the characteristics of the i-th rectangular region, χ2 is the temperature influence factor indicating the influence of the temperature on the heat accumulation in the i-th rectangular region, and χ3 is a constant representing the influence degree of the heat accumulation on the area; Calculate the temperature change of the rectangular region where κ i is the thermal conductivity of the i-th rectangular region, ΔT i represents the temperature change corresponding to the heat accumulation Q i ; Calculation optimization objective, which is used to minimize the temperature change of each rectangular area: where φ is the Lagrange coefficient, which is used to ensure that the temperature rise does not exceed the maximum temperature rise T max , is the mean value of the temperature changes of all rectangular areas, and Γ is the temperature change.

[0011] By establishing the correlation function between the area of the rectangular area and the heat accumulation, the heat distribution and temperature control model are further improved. The key point of this optimization scheme is to reduce the temperature rise and optimize the division of the capacitive screen by correlating the temperature change with the heat accumulation. This method not only considers the physical characteristics of each rectangular area, but also introduces the temperature influence factor, so that the thermal management of each area can be adjusted according to the specific environmental changes, improving the adaptability of the capacitive screen. By introducing the Lagrange coefficient, it can ensure that the temperature rise does not exceed the maximum value, thus avoiding the performance degradation of the capacitive screen caused by overheating. This method is particularly suitable for use in devices that need to work stably for a long time, because it can effectively control the temperature fluctuation and ensure the continuous stability of the device. By calculating the optimization objective and minimizing the temperature change, it ensures that the heat of each area is reasonably distributed, thus achieving the purpose of improving the overall system efficiency and reducing the energy loss. Through this meticulous optimization, the thermal management of the capacitive screen can be more efficient and accurate, avoiding equipment failure caused by local overheating, and greatly improving the reliability of the equipment.

[0012] Preferably, establishing the correlation function between the area of the rectangular area and the heat accumulation, and optimizing the division of the capacitive screen based on the correlation function, includes: Calculating the heat conduction equation, which is used to optimize the division of the capacitive screen: where ρ is the density of the material, c is the specific heat capacity, represents the reciprocal of the temperature change of the i-th rectangular area with time, ▽×(κ i ▽T i ) represents the heat diffusion effect in the non-uniform temperature field, and P(x,y) is the heat source distribution function; is the heat radiation effect, χ4 is a constant, ε is the emissivity of the material, T i is the surface temperature of the rectangular area, T env is the ambient temperature; χ5×(T i -T env ) is the heat convection term, χ5 is the convective heat transfer coefficient, which represents the heat exchange efficiency between the fluid and the solid; Defining the capacitive screen boundary conditions of the heat conduction equation: For the position on any boundary of the capacitive screen, it is specified that the temperature of the boundary is constant at any time T(x, y, t) = T0, where T0 is a temperature constant and T(x, y, t) is the temperature at any point on the boundary; It is specified that the temperature gradient along the normal direction of the boundary is constant where, is the normal direction perpendicular to the boundary surface, is the temperature gradient along the normal direction, χ6 is a temperature gradient constant, is the average value of the thermal conductivities of all rectangular regions; Obtain the temperature changes of any two optimized rectangular regions and calculate the difference Set a difference threshold ξ; If then stop the division of the capacitive screen to obtain the optimized rectangular regions; If then continue to execute the optimization objective until the difference is less than or equal to the difference threshold, and stop the optimization of the division of the capacitive screen.

[0013] By introducing the heat conduction equation and the heat source distribution function, the thermal management optimization of the capacitive screen is further deepened. The application of the heat conduction equation can consider the heat diffusion effect of the capacitive screen in a non-uniform temperature field, thus providing a more accurate prediction of the temperature distribution. This optimization method comprehensively considers heat conduction, heat radiation, and heat convection, enabling a comprehensive description of the heat conduction process and avoiding the loss of accuracy caused by simplified models. By strictly defining the boundary conditions of the capacitive screen, it can ensure that the thermal management system of the entire capacitive screen can operate efficiently during actual operation, without the overall system's temperature control failing due to fluctuations in the boundary conditions. The advantage of this method is that it can handle more complex heat conduction processes and ensure that the capacitive screen always maintains the best working state in actual applications by accurately calculating the temperature changes at the boundary conditions. In addition, setting the difference threshold can effectively control the convergence of the optimization process and ensure that the final capacitive screen division scheme meets all thermal management requirements. This optimization method can significantly improve the thermal efficiency and working stability of the capacitive screen, avoid the impact of temperature fluctuations on the system performance, and thus enhance the overall reliability of the device.

[0014] Preferably, the implementation of the first optimization strategy to optimize the connection position of the pins on the rectangular region includes: Represent the position where each pin is connected to the rectangular region as (k j , l j ), where k j , l j respectively represent the abscissa and ordinate of the position in the two-dimensional coordinate system; The interval between any two adjacent pins where, (kr , l r ) is the pin position coordinate adjacent to (k j , l j ) and d min is the minimum spacing, and d max is the maximum spacing; Calculate the first objective function to optimize the pin layout to minimize signal crosstalk; Among them, represents the process constraint, η2 is the process constraint weight, and d jr is the distance between the connection positions of any two pins, and w is used to control the penalty degree; represents signal crosstalk, η1 is the signal crosstalk minimization weight, is the coupling coefficient, and d * is the maximum crosstalk influence distance.

[0015] Improve the performance of the capacitive screen by optimizing signal crosstalk. A reasonable layout between pins is the key to improving the performance of the capacitive screen. The optimization objective function proposed in this section can accurately regulate the pin layout through process constraints and signal crosstalk minimization weights to ensure the clarity and stability of signal transmission. Optimizing the pin layout to minimize signal crosstalk can effectively avoid signal interference caused by too close distances or unreasonable layouts between pins, thereby improving the response speed and accuracy of the capacitive screen. The minimum and maximum spacings between pins can be finely adjusted according to process requirements, enabling the capacitive screen to meet the requirements of the actual manufacturing process while ensuring signal quality. Through this optimization scheme, the signal coupling effect can be greatly reduced, and the anti-interference ability of the system can be improved. Considering the pin layout and signal transmission problems comprehensively helps the capacitive screen to maintain high-efficiency and stable working performance in a complex usage environment.

[0016] Preferably, according to the width and length of the pin cross-section, a second optimization strategy is executed to minimize the contact impedance and maximize the current efficiency by optimizing the cross-sectional shape, including: Obtain the width w(j) and length h(j) of the j-th pin cross-section; When current passes through the pin, calculate the contact impedance of the pin Among them, ρ * is the resistivity of the conductive material; optimize the contact impedance of the rectangular area Among them, m is the number of pins on the rectangular area, ζ is the weight parameter, and A min is the minimum cross-sectional area.

[0017] Improve the signal transmission ability of the capacitive screen by reducing the contact impedance. The optimization of contact impedance is crucial for the performance of the capacitive screen because a higher contact impedance will cause signal attenuation and energy loss. By optimizing the cross-sectional shape of the pins on the rectangular area, not only can the signal transmission efficiency be improved, but also the electrical faults caused by poor contact can be reduced. Cross-sectional optimization can reduce signal loss by improving the conductivity of the pins, ensuring that the capacitive screen can still maintain good performance during long-term use. This method is particularly suitable for capacitive screen designs that require high electrical performance, and can effectively improve the stability and reliability of electrical contact. In addition, optimizing the contact impedance of the pins helps to reduce the energy consumption in the system, improve the energy efficiency of the capacitive screen, and adapt to a wider range of application scenarios.

[0018] Preferably, the third optimization strategy is performed on the rectangular area to optimize the arrangement of the pins and reduce the coupling effect between the signals delivered to the pins, including: For any two pins (k j , l j ) and (k r , l r ); Calculate the signal crosstalk of the pins η1 is the weight for minimizing signal crosstalk, is the coupling coefficient, d * is the maximum crosstalk influence distance; Calculate the optimization objective function: where, is the adjustment coefficient. is the weight coefficient, used to control the influence of the angle difference on the crosstalk intensity, θ j , θ r are the angles of pin j and pin r respectively.

[0019] By introducing the influence of the angle difference on signal crosstalk and optimizing the layout of the pins to further reduce signal interference. By considering the angle difference of the pins, the pin arrangement can be further refined to reduce the crosstalk problem caused by unreasonable pin directions. This method can accurately adjust the layout of the pins by calculating the relationship between signal crosstalk and angle difference to minimize the crosstalk caused by the angle difference. This is crucial for improving the signal stability and anti-interference ability of the capacitive screen, especially in high-precision applications. In addition, an adjustment coefficient and a weight coefficient are introduced to balance the relationship between the angle difference and crosstalk minimization, making the optimization process more flexible and precise. The advantage of this method is that it can further consider the minor influences during the signal transmission process based on the pin layout, thus achieving a higher-precision optimization effect.

[0020] The present invention has the following beneficial effects: 1. The method for processing a single-layer multi-point capacitive screen based on the laser etching hybrid process significantly improves the performance and stability of the capacitive screen by introducing heat distribution modeling and pin layout optimization. First, the capacitive screen is gridified and heat distribution modeling is performed for each area, enabling accurate temperature prediction, thus avoiding equipment failures due to overheating under high load conditions. By calculating the heat source distribution in each area and accumulating heat, the area division of the capacitive screen can be dynamically adjusted to ensure uniform heat distribution and prevent local overheating. Further pin optimization strategies, including pin position, cross-sectional shape, and layout, provide systematic improvements. Through the triple optimization strategy, the connection position of the pins is optimized to ensure that signal transmission is not affected by crosstalk. At the same time, by optimizing the cross-sectional shape, the contact impedance is reduced, and the signal conduction efficiency is improved. The setting of the minimum and maximum distances between pins avoids signal interference caused by pins being too close, further ensuring signal stability. In particular, the staggered pin layout can effectively reduce the coupling effect between pins and improve the response accuracy and signal transmission ability of the capacitive screen. Through these optimization measures, the capacitive screen can not only maintain high performance under different working conditions but also significantly reduce the potential failure risks caused by heat accumulation and improper pin layout.

[0021] 2. The method for processing a single-layer multi-point capacitive screen based on the laser etching hybrid process improves the performance of the capacitive screen through fine heat management. By calculating the heat source distribution function at any position on the capacitive screen, the temperature change in each area can be accurately predicted, thus effectively managing heat. This method uses the relationship between heat source intensity and attenuation degree, combined with the size of the area, to help allocate heat on the capacitive screen more scientifically and avoid excessive local temperature rise. For each rectangular area, by calculating the heat accumulation, the area division of the capacitive screen can be further optimized to make the heat distribution more uniform, which is crucial for the long-term stable operation of the equipment. This method can dynamically adjust the area division to effectively respond to temperature changes under different loads, ensuring that the thermal management system of the capacitive screen can still operate efficiently in complex environments. In addition, through the correlation function between heat accumulation and area, the capacitive screen can perform customized heat distribution according to the characteristics of each area. This method effectively avoids heat concentration in a certain part of the area, thereby improving the working efficiency of the equipment and reducing the risk of system failures caused by local overheating. Generally speaking, the optimization scheme in this paragraph provides a more refined thermal management mechanism for the capacitive screen, ensuring its continuous stability in different usage environments.

[0022] 3. The method for processing a single-layer multi-point capacitive screen based on the laser etching hybrid process not only improves the rationality of region division but also further optimizes the temperature control strategy by establishing the functional relationship between the region area and heat accumulation. This method combines the relationship between temperature change and heat accumulation and introduces the temperature rise limit through the Lagrange coefficient, ensuring that the temperature changes in each rectangular region are controlled within a predetermined range and avoiding equipment damage caused by excessive temperature. Especially under high load conditions, temperature changes directly affect the performance of the capacitive screen, so it is crucial to control the temperature rise in each region. By calculating and optimizing the temperature changes in each region, potential temperature rise problems can be predicted during the design stage, and measures can be taken in a timely manner for adjustment to ensure the stable operation of the equipment during long-term use. In addition, the relationship between the region area and heat accumulation enables more flexible and efficient thermal management, which can be adjusted according to the characteristics and temperature requirements of each region, avoiding temperature concentration in certain regions and thus improving the overall thermal efficiency. Through this method, the thermal management of the capacitive screen is comprehensively optimized, ensuring the continuous stability of the equipment under high-temperature conditions and providing a scientific basis for subsequent optimization design.

[0023] 4. The method for processing a single-layer multi-point capacitive screen based on the laser etching hybrid process provides a more comprehensive and detailed calculation model for the thermal optimization of the capacitive screen by introducing the heat conduction equation and the heat source distribution function. By considering the effects of heat conduction, heat radiation, and heat convection, the thermal diffusion effect of the capacitive screen in a non-uniform temperature field can be comprehensively described, making heat management more scientific and accurate. Especially by strictly defining the boundary conditions of the capacitive screen, it can be ensured that the temperature management system of the equipment always remains efficient during actual operation, avoiding temperature control failure caused by unstable boundary conditions. The application of the heat conduction equation enables the temperature changes of the capacitive screen to be predicted and adjusted more accurately, thereby ensuring that the temperatures in each region are reasonably controlled. The advantage of this method lies in its ability to comprehensively consider the heat transfer and dissipation processes, enabling the capacitive screen to effectively manage the heat distribution during actual application. By accurately calculating the temperature changes in each region, the division method can be adjusted during the optimization process to avoid local overheating and improve the overall thermal efficiency of the system. Finally, by setting a difference threshold to control the convergence of the optimization, the division of the capacitive screen can achieve the best effect under the requirements of temperature control and heat distribution. This method effectively improves the working stability of the capacitive screen and avoids equipment failures caused by improper heat management.

[0024] 5. The method of processing a single-layer multi-point capacitive screen based on a laser etching hybrid process significantly improves the signal transmission quality of the capacitive screen by adjusting the spacing between pins and signal crosstalk. The optimization of the pin layout not only involves minimizing the crosstalk between pins, but also takes into account the process constraints and the stability of signal transmission. By optimizing the minimum and maximum spacing between pins, the stability of signal transmission is ensured, and the crosstalk problem caused by the close distance between pins or unreasonable layout is reduced. The minimization of signal crosstalk directly affects the performance of the capacitive screen. Optimizing the pin layout can effectively improve the quality and transmission speed of the signal and avoid performance degradation caused by signal interference. This optimization method can accurately control the crosstalk intensity according to the coupling coefficient of the signal, and reduce the signal loss by adjusting the distance between the pins. This method is particularly suitable for occasions where high-precision and high-stability signal transmission is required, which helps to improve the performance of the capacitive screen in high-precision applications. By comprehensively considering the pin layout and signal crosstalk, it can ensure that the capacitive screen can still maintain good performance in a complex working environment, thereby improving the overall stability and anti-interference ability of the device.

[0025] 6. The method for processing a single-layer multi-point capacitive screen based on a laser etching hybrid process reduces the contact impedance by introducing a pin cross-section optimization strategy, thereby improving the electrical performance of the capacitive screen. The optimization of contact impedance is crucial to the performance of the capacitive screen, because higher contact impedance will lead to signal attenuation and energy loss, which in turn affects the stability and reliability of the device. By optimizing the cross-sectional shape of the pin, not only can the signal conduction efficiency be improved, but also electrical failures caused by poor contact can be reduced. In addition, optimizing the cross-sectional shape can improve the conductivity of the pin and reduce the contact resistance, thereby effectively improving the energy efficiency of the capacitive screen and reducing energy loss. This optimization method helps to improve the working stability of the capacitive screen and avoid failures caused by poor contact, especially in high load or long-term operation environments. By optimizing the contact impedance of the pin, it is possible to reduce energy consumption in the system while ensuring electrical performance, improve the energy efficiency of the capacitive screen, and adapt to a wider range of application scenarios. This method improves the reliability of the capacitive screen in complex applications and ensures the stability and efficiency of signal transmission.

[0026] 7. The method for processing a single-layer multi-point capacitive screen based on a laser etching hybrid process can minimize the crosstalk problem caused by angles by precisely adjusting the angular differences between pins, thereby improving the clarity and stability of signals. The optimization of signal crosstalk not only depends on the distance between pins but also takes into account the angular differences between pins, which is often overlooked but crucial for high-precision applications. By optimizing the angles of the pins, signal interference can be reduced, and the response accuracy and anti-interference ability of the capacitive screen can be improved. This method can further refine the pin arrangement and avoid interference caused by angular differences, especially in situations where precise control of signal transmission is required. In addition, adjustment coefficients and weight coefficients are used to balance the relationship between angular differences and signal crosstalk minimization, making the optimization process more flexible and precise. Through this method, the capacitive screen can maintain efficient and stable working performance in complex usage environments, reduce performance degradation caused by signal crosstalk, and thus improve the overall reliability and accuracy of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic flow chart of the method of the present invention.

[0028] Figure 2 It is a schematic flow chart of the optimization area division of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0029] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0030] Example 1. Refer to Figure 1 , the method for processing a single-layer multi-point capacitive screen based on a laser etching hybrid process includes: establishing a two-dimensional coordinate system by arbitrarily selecting a point on the capacitive screen as the coordinate origin; Dividing the capacitive screen into a number of rectangular areas with equal areas by grid; Executing a heat distribution modeling strategy for each position on the capacitive screen, calculating the heat source distribution function for each position, and calculating the heat accumulation for each rectangular area; Establishing a correlation function between the area of the rectangular area and the heat accumulation, and optimizing the division of the capacitive screen based on the correlation function to update the rectangular area; For the pins on any one rectangular area, performing triple design optimization on the pins, specifically: Obtaining the positions of each pin connecting the rectangular area; Setting the minimum and maximum intervals between adjacent pins; Execute the first optimization strategy to optimize the connection positions of pins on the rectangular area; Assume that the cross-sectional shape of each pin is rectangular, and obtain the width and length of the pin cross-section; According to the width and length of the pin cross-section, execute the second optimization strategy to minimize the contact impedance by optimizing the cross-sectional shape; execute the third optimization strategy on the rectangular area to optimize the pin arrangement and reduce the coupling effect between the signals delivered to the pins.

[0031] By accurately dividing the capacitive touch screen area and introducing heat distribution modeling, the stability and performance of the capacitive touch screen have been effectively improved. By dividing the area into grids and calculating the heat accumulation, the heat sources in each area can be analyzed in detail, avoiding equipment failures caused by overheating. In particular, optimizing the rectangular area division makes the heat distribution more uniform and improves the working efficiency of the capacitive touch screen. In addition, the introduction of the pin optimization strategy, by adjusting the pin positions, cross-sectional shapes, and arrangements, reduces signal crosstalk, optimizes the signal transmission quality, and ensures the stable operation of the device under high load. The application of the staggered pin arrangement effectively reduces the coupling effect between the pins and improves the signal stability. Through these optimizations, the capacitive touch screen can not only operate stably continuously under high load, but also improve the signal transmission efficiency, reduce potential failure risks, and thus extend the service life of the device.

[0032] The heat distribution modeling strategy is executed for each position on the capacitive touch screen, the heat source distribution function of each position is calculated, and the heat accumulation of each rectangular area is calculated, including: For any position (x, y) on the capacitive touch screen, where x and y are the horizontal and vertical coordinates of the position in the two-dimensional coordinate system respectively; Calculate the heat source distribution function of the position (x, y) where α is the heat source intensity and β is a constant related to the heat source attenuation degree; For any one rectangular area, represent the rectangular area as [x1, x2] × [y1, y2], where (x1, y1) and (x2, y2) are the two vertices on any diagonal of the rectangular area, and [x1, x2] and [y1, y2] are the length and width of the rectangular area respectively; Calculate the heat accumulation of the i-th rectangular area through the integration of the heat sources at each position in the rectangular area: where Q i is the heat accumulation of the i-th rectangular area.

[0033] By calculating the heat source distribution function and heat accumulation in detail, the accuracy of heat management is improved. Modeling based on the heat source distribution at different positions of the capacitive screen and combining with the area of the region for heat accumulation calculation can distribute heat more precisely, ensuring that the temperature changes in each region are effectively controlled. This method avoids heat concentration in a certain part of the region, ensures a uniform temperature distribution of the capacitive screen during long-term use, and reduces the risk of overheating. Through the correlation calculation of heat and region area, the heat management of the capacitive screen is more flexible, can be adjusted according to the characteristics of different regions, and improves the overall thermal efficiency. In addition, this optimization strategy can ensure the continuous and stable operation of the capacitive screen under high load or complex environments, improving the reliability of the device.

[0034] Establishing the correlation function between the area of the rectangular region and heat accumulation, and optimizing the division of the capacitive screen based on the correlation function, includes: Establishing the correlation function between the area of the rectangular region and heat accumulation: where, A i is the area of the i-th rectangular region, χ1 is the region characteristic coefficient used to describe the characteristics of the i-th rectangular region, χ2 is the temperature influence factor representing the influence of the temperature on the i-th rectangular region on heat accumulation, and χ3 is a constant representing the influence degree of heat accumulation on the area; Calculating the temperature change of the rectangular region where, κ i is the thermal conductivity of the i-th rectangular region, ΔT i represents the temperature change corresponding to the heat accumulation Q i ; Calculating the optimization objective, where the optimization objective is used to minimize the temperature change of each rectangular region: where, φ is the Lagrange coefficient used to ensure that the temperature rise does not exceed the maximum temperature rise T max , is the average value of the temperature changes of all rectangular regions, and Γ is the temperature change.

[0035] By introducing the correlation function between heat accumulation and region area, the rationality and accuracy of heat distribution are further improved. By establishing the relationship between temperature change and heat accumulation and introducing the Lagrange coefficient to control the temperature rise, it is ensured that the temperature changes in each region are within a reasonable range. The optimized temperature management can avoid local overheating problems, improve the overall performance and stability of the capacitive screen. In addition, by minimizing the temperature change with the optimization objective, the heat management of the capacitive screen is more accurate and can work efficiently in complex environments. This method effectively avoids performance degradation caused by overheating and provides guarantee for the long-term stable operation of the device.

[0036] Establishing a correlation function between the area of the rectangular region and heat accumulation, and optimizing the division of the capacitive screen based on the correlation function, including: Calculating the heat conduction equation for optimizing the division of the capacitive screen: where ρ is the density of the material, c is the specific heat capacity, represents the reciprocal of the temperature change of the i-th rectangular region with time, ▽×(κ i ▽T i ) represents the heat diffusion effect in a non-uniform temperature field, and P(x, y) is the heat source distribution function; is the heat radiation effect, χ4 is a constant, ε is the emissivity of the material, T i is the surface temperature of the rectangular region, T env is the ambient temperature; χ5×(T i -T env ) is the heat convection term, χ5 is the convective heat transfer coefficient, representing the heat exchange efficiency between the fluid and the solid; Defining the boundary conditions of the capacitive screen for the heat conduction equation: For any position on any boundary of the capacitive screen, it is defined that the temperature of the boundary is constant at T(x, y, t) = T0 at any time, where T0 is the temperature constant and T(x, y, t) is the temperature at any point on the boundary; Defining that the temperature gradient along the normal direction of the boundary is constant where, is the normal direction perpendicular to the boundary surface, is the temperature gradient along the normal direction, χ6 is the temperature gradient constant, is the average value of the thermal conductivities of all rectangular regions; Obtaining the temperature changes of any two optimized rectangular regions and calculating the difference Setting a difference threshold ξ; If then stop the division of the capacitive screen to obtain the optimized rectangular region; If then continue to execute the optimization objective until the difference is less than or equal to the difference threshold, and stop optimizing the division of the capacitive screen.

[0037] In this embodiment, refer to Figure 2 .

[0038] The calculation of the heat conduction equation and heat source distribution makes the optimization of the capacitive touch screen in thermal management more comprehensive. By considering the combined effects of heat conduction, radiation, and convection, the thermal diffusion effect of the device can be accurately simulated, further improving the accuracy of heat management. In particular, the strict control of boundary conditions ensures the stability of temperature changes during the operation of the capacitive touch screen. Through the optimization of the heat conduction equation, the temperature changes can be accurately predicted, preventing local overheating and ensuring the long-term efficient operation of the device. By optimizing the convergence through the difference threshold control, while ensuring the temperature control effect, the partitioning structure of the capacitive touch screen can be optimized, improving the overall performance.

[0039] Execute the first optimization strategy to optimize the connection positions of pins on the rectangular area, including: Represent the position where each pin is connected to the rectangular area as (k j , l j ), where k j , l j represent the abscissa and ordinate of the position in the two-dimensional coordinate system respectively; The interval between any two adjacent pins where (k r , l r ) is the pin position coordinates adjacent to (k j , l j ), d min is the minimum interval, and d max is the maximum interval; Calculate the first objective function to optimize the pin layout to minimize signal crosstalk; where, represents the process constraint, η2 is the process constraint weight, d jr is the distance between the connection positions of any two pins, and w is used to control the penalty degree; represents signal crosstalk, η1 is the signal crosstalk minimization weight, is the coupling coefficient, and d * is the maximum crosstalk influence distance.

[0040] The pin layout optimization improves the signal transmission quality by precisely adjusting the pin spacing and signal crosstalk. The minimum and maximum intervals between pins are optimized, reducing crosstalk and ensuring signal stability. This optimization method effectively improves the working efficiency of the capacitive touch screen by finely controlling the signal transmission path, especially in high-precision application scenarios, ensuring the stability and clarity of signal transmission.

[0041] Execute the second optimization strategy according to the width and length of the pin cross-section, minimizing the contact impedance and maximizing the current efficiency by optimizing the cross-sectional shape, including: Obtain the width w(j) and length h(j) of the cross-section of the j-th pin; When current passes through the pin, calculate the contact impedance of the pin where ρ * is the resistivity of the conductive material; Optimize the contact impedance of the rectangular area where m is the number of pins on the rectangular area, ζ is the weight parameter, A min is the minimum cross-sectional area.

[0042] By optimizing the pin cross-sectional shape, the contact impedance is reduced, thereby improving the electrical performance of the gen'j capacitive screen. Optimizing the contact impedance not only reduces energy loss but also improves signal conduction efficiency, ensuring the stability of the device during long-term use. By adjusting the cross-sectional shape of the pins, the contact resistance is reduced, the energy efficiency of the device is improved, and it adapts to more complex application scenarios.

[0043] Perform the third optimization strategy on the rectangular area to optimize the arrangement of the pins and reduce the coupling effect between the signals transmitted to the pins, including: For any two pins (k j , l j ) and (k r , l r ); Calculate the signal crosstalk of the pins η1 is the weight for minimizing signal crosstalk, is the coupling coefficient, d * is the maximum crosstalk influence distance; Calculate the optimization objective function: where is the adjustment coefficient. is the weight coefficient used to control the influence of the angle difference on the crosstalk intensity, θ j , θ r are the angles of pin j and pin r respectively.

[0044] The optimization of the pin angle difference further reduces signal crosstalk and improves the signal transmission stability of the capacitive screen. By adjusting the pin angle difference, the crosstalk problem caused by the angle can be minimized, thereby improving the signal transmission quality. By finely adjusting the relationship between crosstalk and angle difference, the stable performance of the capacitive screen in high-load and complex application environments can be ensured, enhancing the anti-interference ability and accuracy of the device.

[0045] It should be noted that in this text, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device.

[0046] The above are only the preferred embodiments of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the technical principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A method for processing a single-layer multi-point capacitive touch screen based on a laser etching hybrid process, characterized in that, Including: Arbitrarily select a point on the capacitive screen as the coordinate origin to establish a two-dimensional coordinate system; Divide the capacitive screen into a number of rectangular regions with equal areas through grid division; Execute a heat distribution modeling strategy for each position on the capacitive screen, calculate the heat source distribution function for each position, and calculate the heat accumulation in each rectangular region; Establish a correlation function between the area of the rectangular region and the heat accumulation, and optimize the division of the capacitive screen based on the correlation function to update the rectangular regions; For the pins on any one rectangular region, perform triple design optimization on the pins, specifically: Obtain the positions where each pin is connected to the rectangular region; Set the minimum and maximum intervals between adjacent pins; Execute the first optimization strategy to optimize the connection positions of the pins on the rectangular region; Assume that the cross-sectional shape of each pin is rectangular, and obtain the width and length of the pin cross-section; According to the width and length of the pin cross-section, execute the second optimization strategy to minimize the contact impedance by optimizing the cross-sectional shape; Perform the third optimization strategy on the rectangular region to optimize the arrangement of the pins and reduce the coupling effect between the signals transmitted to the pins.

2. The method for processing a single-layer multi-point capacitive touch screen based on a laser etching hybrid process according to claim 1, wherein The step of executing a heat distribution modeling strategy for each position on the capacitive screen, calculating the heat source distribution function for each position, and calculating the heat accumulation in each rectangular region includes: For any position (x, y) on the capacitive screen, where x and y are the horizontal and vertical coordinates of the position in the two-dimensional coordinate system respectively; Heat source distribution function for calculating the position (x, y) where α is the heat source intensity and β is a constant related to the degree of heat source attenuation; For any one rectangular region, represent the rectangular region as [x1, x2]×[y1, y2], where (x1, y1) and (x2, y2) are the two vertices on any diagonal of the rectangular region, and [x1, x2] and [y1, y2] are the length and width of the rectangular region respectively; Calculate the heat accumulation of the i-th rectangular region by integrating the heat sources at each position in the rectangular region: where Q i is the heat accumulation of the i-th rectangular region.

3. The method for processing a single-layer multi-point capacitive touch screen based on a laser etching hybrid process according to claim 2, wherein The step of establishing a correlation function between the area of the rectangular region and the heat accumulation, and optimizing the division of the capacitive screen based on the correlation function includes: Establish a correlation function between the area of a rectangular region and heat accumulation: where A i is the area of the i-th rectangular region, χ1 is the region characteristic coefficient used to describe the characteristics of the i-th rectangular region, χ2 is the temperature influence factor representing the influence of temperature on heat accumulation in the i-th rectangular region, and χ3 is a constant representing the degree of influence of heat accumulation on the area; Calculate the temperature change of the rectangular area where κ i is the thermal conductivity of the i-th rectangular area, and ΔT i represents the temperature change corresponding to the heat accumulation Q i ; Calculate the optimization objective, which is used to minimize the temperature change in each rectangular region: where φ is the Lagrange coefficient, which is used to ensure that the temperature rise does not exceed the maximum temperature rise T max , is the mean value of the temperature changes in all rectangular regions, and Γ is the temperature change.

4. A method for processing a single-layer multi-point capacitive touch screen based on a laser etching hybrid process according to claim 3, wherein, The step of establishing a correlation function between the area of the rectangular region and the heat accumulation, and optimizing the division of the capacitive screen based on the correlation function includes: Calculate the heat conduction equation for optimizing the division of the capacitive screen: where ρ is the density of the material, c is the specific heat capacity, represents the reciprocal of the temperature change of the i-th rectangular region with time, represents the thermal diffusion effect under a non-uniform temperature field, and P(x, y) is the heat source distribution function; is the thermal radiation effect, χ4 is a constant, ε is the emissivity of the material, T i is the surface temperature of the rectangular area, T env is the ambient temperature; χ5×(T i -T env ) is the heat convection term, and χ5 is the convective heat transfer coefficient, representing the heat exchange efficiency between the fluid and the solid; Define the boundary conditions of the capacitive screen for the heat conduction equation: For the positions on any one boundary of the capacitive screen, define that the temperature of the boundary is constant at any time T(x, y, t) = T0, where T0 is a temperature constant and T(x, y, t) is the temperature of any point on the boundary; The temperature gradient along the normal direction of the defined boundary is constant wherein is the normal direction perpendicular to the boundary surface, is the temperature gradient along the normal direction, χ6 is the temperature gradient constant, is the average value of the thermal conductivities of all rectangular regions; Obtain the temperature changes of any two optimized rectangular regions and calculate the difference Set a difference threshold ξ; If then stop dividing the capacitive screen to obtain the optimized rectangular area; If then continue to execute the optimization objective until the difference is less than or equal to the difference threshold, and stop optimizing the division of the capacitive screen.

5. The method for processing a single-layer multi-point capacitive touch screen based on a laser etching hybrid process according to claim 1, characterized in that The step of executing the first optimization strategy to optimize the connection positions of the pins on the rectangular region includes: The position of each pin connection rectangular area is represented as (k j , l j ), where k j , l j represent the abscissa and ordinate of the position in the two-dimensional coordinate system, respectively; The interval between any two adjacent pins where (k r , l r ) are the pin position coordinates adjacent to (k j , l j ), d min is the minimum interval, and d max is the maximum interval; Calculate the first objective function to optimize the layout of the pins to minimize signal crosstalk; Among them, represents process constraints, η2 is the process constraint weight, d jr is the distance between the connection positions of any two pins, and w is used to control the degree of penalty; Indicates signal crosstalk, where η1 is the weight for minimizing signal crosstalk, is the coupling coefficient, and d * is the maximum crosstalk influence distance.

6. The method for processing a single-layer multi-point capacitive touch screen based on a laser etching hybrid process according to claim 1, wherein The step of executing the second optimization strategy according to the width and length of the pin cross-section to minimize the contact impedance and maximize the current efficiency by optimizing the cross-sectional shape includes: Obtain the width w(j) and length h(j) of the cross-section of the j-th pin; Calculate the contact impedance of the pin when current passes through the pin where ρ * is the resistivity of the conductive material; optimize the contact impedance of the rectangular region where m is the number of pins on the rectangular region, ζ is the weight parameter, and A min is the minimum cross-sectional area.

7. The method for processing a single-layer multi-point capacitive touch screen based on a laser etching hybrid process according to claim 5, wherein The step of performing the third optimization strategy on the rectangular region to optimize the arrangement of the pins and reduce the coupling effect between the signals transmitted to the pins includes: For any two pins (k j , l j ) and (k r , l r ); Calculating the signal crosstalk of the computing pin η1 is the signal crosstalk minimization weight, is the coupling coefficient, d * is the maximum crosstalk influence distance; Calculate the optimization objective function: Among them, is an adjustment coefficient, is a weight coefficient, used to control the influence of the angle difference on the crosstalk intensity, θ j , θ r are the angles of pin j and pin r respectively.

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