Laser grinding control system for diamond composite sheets

Through a combined system of partition module and monitoring module, precise control of the laser grinding process of diamond composite sheets is achieved, solving the problem that minor abnormalities cannot be found in the prior art, and improving the grinding quality and efficiency.

CN120306820BActive Publication Date: 2025-08-08TIANJIN YUANDONG HENGJIA NEW MATERIAL CO LTD
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Patent Information

Application Number
CN202510804318.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-06-17
Publication Date
2025-08-08
Estimated Expiration
2045-06-17

AI Technical Summary

Technical Problem

In the prior art, simple image measurement cannot detect subtle abnormalities in the laser grinding process, resulting in insufficient grinding quality and lack of effective correlation control.

Method used

A combined system of partition module, monitoring module, control module and data feedback module is adopted. The altitude probe divides the grinding surface into a concentric annular area, monitors the spark image and analyzes abnormalities, and dynamically adjusts the removal amount to achieve accurate control of the grinding process.

Benefits of technology

The laser grinding quality is improved, spark abnormalities can be detected and dealt with in a timely manner, ensuring the grinding quality, and is suitable for processing of flat or special-shaped diamond composite sheets.

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Abstract

The present invention relates to the technical field of laser grinding of diamond composite sheets in superhard material processing, and in particular to a laser grinding control system for diamond composite sheets, wherein a partitioning module is provided to divide a processing surface into concentric ring-shaped high, low and slope grinding zones based on data from a height measuring probe; a monitoring module synchronizes laser pulses to capture spark images, quantifies the projected area ratio, the maximum spark cluster diameter and the discreteness, and binds the polar coordinate position and the grinding zone number; a control module performs the first grinding with an initial removal amount, and dynamically adjusts the subsequent removal amount of each ring zone according to the abnormal distribution of sparks; a data feedback module determines that the abnormal points are concentrated in a single grinding zone and exceed a threshold value and provides feedback, which can effectively improve the grinding quality and provide effective data feedback to relevant technical personnel to facilitate timely tracing of quality problems, and can adapt to the processing control of flat or special-shaped diamond composite sheets.
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Description

Technical Field

[0001] The present invention relates to the technical field of laser grinding of diamond composite sheets in superhard material processing, and in particular to a laser grinding control system for diamond composite sheets. Background Art

[0002] Effective control of the removal volume during laser grinding is one of the key factors. Too much removal volume will cause damage to the grinding workpiece, while too little removal volume cannot guarantee grinding efficiency. Therefore, in order to ensure the accuracy of the removal volume, the grinding process needs to be continuously monitored and collected.

[0003] For example, in the prior art, Chinese Patent Publication No. CN117961303A discloses a laser grinding device and grinding method. The laser grinding device includes: a frame, a working chamber configured within the frame, a grinding assembly configured within the working chamber, and a gantry arm fixed to a gantry base. A first drive component is provided on one side of the top of the gantry arm, the first drive component is connected to a side plate, and the side plate is moved in the Z direction based on the drive of the first drive component. An image acquisition device is provided on the side plate, the image acquisition device is electrically connected to a control module, and the camera portion of the image acquisition device is facing the side wall of the workpiece. The image acquisition device takes a picture of the workpiece based on the instructions of the control module and feeds the image information back to the control module. In this way, the control module can identify layer information based on the side wall information of the workpiece, achieving rapid measurement and rapid grinding of the workpiece.

[0004] However, the above technology has the following technical problems: simply using images for measurement cannot detect subtle anomalies in the laser grinding process, and there is a lack of effective correlation control over the grinding process, which leads to poor grinding quality. Summary of the Invention

[0005] To this end, the present invention provides a laser grinding control system for diamond composite sheets, which is used to solve the problem that the above-mentioned existing technology simply uses images for measurement, cannot detect subtle abnormalities in the laser grinding process, and lacks effective correlation control of the grinding process, which leads to poor grinding quality. Through further spark analysis and control correlation of the image, the role of image acquisition in the control process is improved, which can effectively improve the grinding quality and provide effective data feedback to relevant technical personnel to facilitate timely tracing of quality problems, and can adapt to the processing control of flat or special-shaped diamond composite sheets.

[0006] To achieve the above objectives, the present invention provides a laser grinding control system for diamond composite sheets, comprising a circular sheet-shaped grinding piece, a rotating processing platform on which the grinding piece is placed, a laser head and a height measuring probe located above the rotating processing platform, wherein the rotating processing platform rotates during laser grinding to adjust the grinding position, and the laser grinding control system for diamond composite sheets further comprises a partitioning module, a monitoring module, a control module, and a data feedback module; wherein the partitioning module is electrically connected to the height measuring probe and is used to divide the processing surface of the grinding piece into a plurality of annular grinding zones based on height distribution data collected by the height measuring probe;

[0007] The monitoring module collects spark images during grinding of the processing surface, and records the collection position and collection time; the control module is connected to the partitioning module and the monitoring module respectively, and the control module controls the laser head to perform the initial laser grinding with the initial removal amount, and determines the removal amount of each grinding area in the subsequent laser grinding processes based on the collected data of the monitoring module during the initial laser grinding process; the data feedback module is connected to the monitoring module and the partitioning module respectively, and the data feedback module determines whether the spark abnormality during grinding is caused by height difference based on the collected data of the monitoring module, and records and feeds back the determination result and the corresponding collected data.

[0008] As a preferred technical solution for a laser grinding control system for diamond compacts, the partitioning module specifically performs the following processes to complete the division of the grinding area:

[0009] Acquire height distribution data of the machining surface of the grinding workpiece by the height measuring probe, wherein the height distribution data includes height values of a plurality of measuring points based on the center of the grinding workpiece;

[0010] A number of continuous concentric rings are generated by expanding outward from the center of the circle, and all the concentric rings cover the effective processing area of the processing surface of the grinding part;

[0011] Calculate the average height of the measurement points in each concentric ring as the ring height value of the ring;

[0012] Perform gradient determination on the ring height values of continuous rings:

[0013] If the ring height values of N consecutive rings are all higher than the preset high threshold, the continuous ring area is marked as a high-abrasive area;

[0014] If the ring height values of M consecutive rings are all lower than the preset low threshold, the continuous ring area is marked as a low grinding area;

[0015] The continuous circular area between the high grinding area and the low grinding area is marked as the slope grinding area.

[0016] As an optimal technical solution for the laser grinding control system of diamond composite sheets, the monitoring module captures the spark flying image in real time during the laser grinding process through a high-speed industrial camera at a sampling rate synchronized with the laser pulse frequency, and associates and records the processing timestamp corresponding to the image, the polar coordinate position of the laser focus on the grinding workpiece, and the grinding zone number to which it belongs.

[0017] As a preferred technical solution for the laser grinding control system for diamond composite sheets, the monitoring module is also configured to identify whether the spark is abnormal. The specific identification process includes:

[0018] Perform grayscale processing and background noise filtering on a single-frame spark image to extract the effective spark area;

[0019] The vertical projection area ratio of the spark region, the maximum spark cluster diameter, and the spark distribution dispersion σ are determined respectively. If any of the three parameters exceeds the corresponding standard range, it is judged as a spark abnormality.

[0020] As a preferred technical solution for the laser grinding control system for diamond composite sheets, the monitoring module specifically determines the vertical projection area ratio of the spark region and the maximum spark cluster diameter by:

[0021] Determine the projected area S1 of the spark on the vertical plane;

[0022] Determine the minimum circumscribed circle area S2 of the spark pixel group, take the ratio of S1 to S2 as the vertical projection area ratio of the spark area, and take the diameter of the minimum circumscribed circle as the maximum spark cluster diameter.

[0023] As a preferred technical solution for the laser grinding control system for diamond composite sheets, the monitoring module determines the spark distribution dispersion σ based on the following calculation method:

[0024] , where N represents the total number of spark particles in a single frame image, di represents the distance from the i-th spark particle to the center of the spark pixel group, and d represents the average distance from all spark particles to the center of the spark pixel group.

[0025] As a preferred technical solution for the laser grinding control system for diamond composite sheets, after the control module performs the initial laser grinding with the initial removal amount, in response to the absence of spark anomalies in each grinding area, the control module performs subsequent grindings in sequence with a preset standard removal amount. In response to the presence of spark anomalies in each grinding area, the preset standard removal amount for each subsequent grinding is reduced, and the reduction amount is determined based on the collected data of the grinding area with the greatest degree of anomaly.

[0026] As an optimal technical solution for the laser grinding control system of diamond composite sheets, the data feedback module responds to the presence of spark anomalies, counts the distribution of spark anomalies in the grinding area during the initial laser grinding, and responds to the fact that the number of polar coordinate positions corresponding to the spark anomalies is greater than the preset number of positions and only exists in any one of the high grinding area, low grinding area or slope grinding area, determines that it is caused by height difference and records and feeds back the corresponding judgment results and corresponding collected data.

[0027] As a preferred technical solution for a laser grinding control system for diamond composite sheets, the control module sets an initial removal amount in the first laser grinding to be greater than a preset standard removal amount in each subsequent grinding.

[0028] As a preferred technical solution for the laser grinding control system for diamond composite sheets, the control module sets the initial removal amount to 0.1 mm.

[0029] Compared with the prior art, the beneficial effect of the present invention is that, through the circular partitioning mode of the partitioning module, the subsequent control and data feedback process can be optimized. First, the partitioning based on elevation can make each type of partition have its own unique characteristics, namely the elevation characteristics, and this characteristic is a feature that can cause differences in grinding quality and is easy to find during the laser grinding process. Through the recognition and analysis of the monitoring module after the feature partitioning, and the control optimization based on the recognition and analysis results, the removal amount can be more effectively optimized based on the short board in the partition. On this basis, the data feedback module can detect whether the spark anomaly is caused by elevation difference in time, which can effectively improve the grinding quality and provide effective data feedback to relevant technical personnel to facilitate the timely tracing of quality problems, and can adapt to the processing control of flat or special-shaped diamond composite sheets.

[0030] Furthermore, the present invention realizes the fine quantification of spark parameters and abnormality analysis through the spark collection and abnormality identification of the monitoring module, converts the stability of laser grinding into the stability of sparks for collection and analysis, and improves the timeliness and effectiveness of discovery. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a structural block diagram of a laser grinding control system for diamond composite sheets according to an embodiment of the present invention;

[0032] Figure 2 This is a partition diagram of a partition module according to an embodiment of the present invention;

[0033] In the figure: 1. High grinding area; 2. Low grinding area; 3. Slope grinding area. DETAILED DESCRIPTION

[0034] In order to make the objects and advantages of the present invention more clearly understood, the present invention is further described below in conjunction with embodiments; it should be understood that the specific embodiments described herein are merely used to explain the present invention and are not intended to limit the present invention.

[0035] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0036] It should be noted that, in the description of the present invention, terms such as "up", "down", "left", "right", "inside", and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. This is only for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0037] Furthermore, it should be noted that, in the description of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0038] See also Figure 1 As shown, they are respectively structural block diagrams of a laser grinding control system for a diamond composite sheet in an embodiment of the present invention. The laser grinding control system for a diamond composite sheet includes a circular sheet-shaped grinding piece, a rotating processing platform on which the grinding piece is placed, a laser head and a height measuring probe located above the rotating processing platform. The rotating processing platform rotates during laser grinding to adjust the grinding position. The laser grinding control system for a diamond composite sheet also includes a partitioning module, a monitoring module, a control module and a data feedback module; wherein the partitioning module is electrically connected to the height measuring probe, and is used to divide the processing surface of the grinding piece into a plurality of annular grinding zones based on the height distribution data collected by the height measuring probe;

[0039] The monitoring module collects spark images during grinding of the processing surface, and records the collection position and collection time; the control module is respectively connected to the partitioning module and the monitoring module, and the control module controls the laser head to perform the initial laser grinding with the initial removal amount, and determines the removal amount of each grinding area in each subsequent laser grinding process based on the collected data of the monitoring module during the initial laser grinding process (in this embodiment, the grinding surface of the diamond composite sheet is close to a plane after the initial diamond grinding, so in each subsequent laser grinding, the removal amount of each grinding area is the same for each laser grinding, and the removal amount is determined only for each time, and is not determined separately for each grinding area); the data feedback module is respectively connected to the monitoring module and the partitioning module, and the data feedback module determines whether the spark abnormality during grinding is caused by height difference based on the collected data of the monitoring module, and records and feeds back the determination result and the corresponding collected data.

[0040] In the above embodiment, the circular partitioning mode of the partitioning module can be used to optimize the subsequent control and data feedback process. First, the partitioning based on elevation can make each type of partition have its own unique characteristics, namely the elevation characteristics, and this characteristic is a characteristic that can lead to differences in grinding quality and is easy to find during the laser grinding process. Through the recognition and analysis of the monitoring module after the partitioning based on this characteristic, and the control optimization based on the recognition and analysis results, the removal amount can be optimized more effectively based on the short board in the partition. On this basis, the data feedback module can detect whether the spark anomaly is caused by elevation difference in time, which can effectively improve the grinding quality and provide effective data feedback to relevant technical personnel to facilitate timely tracing of quality problems, and can adapt to the processing control of flat or special-shaped diamond composite sheets.

[0041] On the basis of the above effects, the spark collection and anomaly identification of the monitoring module are used to realize the fine quantification of spark parameters and anomaly analysis, and the stability of laser grinding is converted into the stability of sparks for collection and analysis, thereby improving the timeliness and effectiveness of discovery.

[0042] See also Figure 2 As shown, the partitioning module specifically performs the following processes to complete the division of the grinding area:

[0043] Acquire height distribution data of the machining surface of the grinding workpiece by the height measuring probe, wherein the height distribution data includes height values of a plurality of measuring points based on the center of the grinding workpiece;

[0044] A number of continuous concentric rings are generated by expanding outward from the center of the circle, and all the concentric rings cover the effective processing area of the processing surface of the grinding part;

[0045] Calculate the average height of the measurement points in each concentric ring as the ring height value of the ring;

[0046] Perform gradient determination on the ring height values of continuous rings:

[0047] If the ring height values of N consecutive rings are all higher than the preset high threshold, the continuous ring area is marked as high grinding area 1;

[0048] If the ring height values of M consecutive rings are all lower than the preset low threshold, the continuous ring area is marked as low grinding area 2;

[0049] The continuous circular area between the high and low grinding areas is labeled as slope grinding area 3. The partitioning module uses height distribution data acquired by the height measuring probe to divide the workpiece's surface into continuous concentric ring-shaped grinding zones (high, low, and slope zones). While maintaining the overall rotational processing mode, this design uses the data feedback module to calculate the distribution density of spark anomalies within the grinding area. If the anomalies are concentrated in a single type of grinding area, they are directly attributed to elevation differences; otherwise, elevation interference is eliminated, improving fault diagnosis efficiency. Specifically, during the laser grinding process, parameter switching between high and low positions, as well as laser grinding of sloped surfaces, can easily lead to differences in cutting depth. By partitioning the cutting parameters, this characteristic can be identified through the spark effect parameters, allowing for further parameter optimization. In this embodiment, the height collected represents the thickness of the diamond compact. The preset high and low thresholds are determined based on the size of the diamond compact. In this implementation, the preset high threshold is 8 mm, and the preset low threshold is 5 mm.

[0050] Specifically, during the laser grinding process, the monitoring module uses a high-speed industrial camera to capture spark flying images in real time at a sampling rate synchronized with the laser pulse frequency, and associates and records the processing timestamp corresponding to the image, the polar coordinate position of the laser focus on the grinding workpiece, and the grinding area number to which it belongs.

[0051] Specifically, the monitoring module is further configured to identify whether the spark is abnormal, and the specific identification process includes:

[0052] Perform grayscale processing and background noise filtering on a single-frame spark image to extract the effective spark area;

[0053] The vertical projection area percentage of the spark region, the maximum spark cluster diameter, and the spark distribution dispersion σ are determined separately. If any of these three parameters exceeds the corresponding standard range (based on a limited number of statistical tests of these parameters on standard diamond compacts), a spark anomaly is determined. Specifically, in this embodiment (the thickness of the diamond compact in this embodiment is 5mm), the standard ranges for the projected area percentage obtained through experimental calibration are (70.5%, 80.2%), the standard range for the maximum spark cluster diameter is (1.25mm, 2.02mm), and the standard range for the distribution dispersion is (0.62mm, 1.33mm).

[0054] Specifically, the monitoring module determines the vertical projection area ratio of the spark region and the maximum spark cluster diameter by:

[0055] Determine the projected area S1 of the spark on the vertical plane;

[0056] Determine the minimum circumscribed circle area S2 of the spark pixel group, take the ratio of S1 to S2 as the vertical projection area ratio of the spark area, and take the diameter of the minimum circumscribed circle as the maximum spark cluster diameter.

[0057] Specifically, the monitoring module determines the spark distribution dispersion σ based on the following calculation method:

[0058] , where N represents the total number of spark particles in a single frame image, di represents the distance from the i-th spark particle to the center of the spark pixel group, and d represents the average distance from all spark particles to the center of the spark pixel group.

[0059] Specifically, the high-speed camera is strictly synchronized with the laser pulse, and combined with polar coordinate position and grinding zone numbering, each spark image frame is accurately mapped to the physical location of the machined surface. This mechanism provides a spatial benchmark for analyzing the correlation between spark anomalies and elevation differences. The projected area ratio reflects the concentration of spark energy; exceeding the threshold indicates local energy overload; the maximum spark cluster diameter locates the abnormal sputtering range and identifies material unevenness or impurity interference; the discreteness σ quantifies the uniformity of spark distribution; a low σ value indicates spark aggregation (corresponding to surface protrusions), while a high value indicates spark diffusion (corresponding to material defects). These three factors work together to overcome the limitations of traditional visual inspection and transform spark status into programmable quantitative parameters.

[0060] Specifically, after performing an initial laser polishing with an initial removal amount, the control module, in response to the absence of spark anomalies in each polishing zone, sequentially performs subsequent polishing with a preset standard removal amount. In response to the presence of spark anomalies in each polishing zone, the preset standard removal amount for each subsequent polishing is reduced. The reduction amount is determined based on the collected data of the polishing zone with the greatest degree of anomaly (corresponding to the degree of deviation of the projected area ratio, the maximum spark cluster diameter, and the overall degree of dispersion of the spark distribution σ). Specifically, the reduction operation includes three reductions: 0.1mm (large deviation), 0.05mm (moderate deviation), and 0.02mm (small deviation), corresponding to different degrees of deviation of the projected area ratio, the maximum spark cluster diameter, and the overall degree of dispersion of the spark distribution σ. The degree of deviation should be divided into three equal ranges based on historical data. This is a prior art statistical technique and will not be further described in this embodiment.

[0061] Specifically, in response to the presence of spark anomalies, the data feedback module counts the distribution of spark anomalies in the grinding area during the initial laser grinding. In response to the number of polar coordinate positions corresponding to the spark anomalies being greater than a preset number of positions (4 in this embodiment, which can be adjusted according to actual working conditions) and existing only in any one of the high grinding area, low grinding area, or slope grinding area, it is determined to be caused by height difference and the corresponding determination result and the corresponding collected data are recorded and fed back.

[0062] Specifically, the initial removal amount in the initial laser grinding set by the control module is greater than the preset standard removal amount in each subsequent grinding.

[0063] Specifically, the initial removal amount set by the control module in this embodiment is 0.1 mm.

[0064] In detail, in the above embodiment, the dynamic removal amount is controlled:

[0065] The initial removal of 0.1 mm quickly exposes the elevation anomaly area during the initial grinding;

[0066] The mechanism of reducing the removal amount in abnormal areas prevents micro cracks caused by spark overload, while maintaining the standard removal amount in non-abnormal areas to ensure processing efficiency.

[0067] Elevation attribution determination:

[0068] When spark anomalies are concentrated in a single grinding area and exceed a preset number of locations, they are determined to be caused by height differences. This rule accurately distinguishes height anomalies from random interference, reducing the risk of misjudgment.

[0069] The flowchart or block diagram in the accompanying drawings illustrates the possible implementation architecture, functions and operations of the device, method and computer program product according to various embodiments of the present application. In this regard, each box in the flowchart or block diagram can represent a module, program segment or part of code, and the module, program segment or part of code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order than that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flowchart, and the combination of the boxes in the block diagram and / or flowchart can be implemented with a dedicated hardware-based device that performs the specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0070] Thus far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art may make equivalent changes or substitutions to the relevant technical features, and the technical solutions after such changes or substitutions will fall within the scope of protection of the present invention.

[0071] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A laser grinding control system for diamond composite sheets, comprising a circular grinding piece, a rotating processing platform on which the grinding piece is placed, a laser head and a height measuring probe located above the rotating processing platform, wherein the rotating processing platform rotates during laser grinding to adjust the grinding position, characterized in that: The laser grinding control system for diamond composite sheets includes: a partitioning module, electrically connected to the height measuring probe, for dividing the machining surface of the grinding workpiece into a plurality of annular grinding zones based on the height distribution data collected by the height measuring probe; The monitoring module collects spark images during grinding of the machined surface, and records the collection position and time; a control module, connected to the partitioning module and the monitoring module, respectively, the control module controlling the laser head to perform initial laser polishing with an initial removal amount, and determining a removal amount for each polishing zone in subsequent laser polishing processes based on data collected by the monitoring module during the initial laser polishing process; The data feedback module is connected to the monitoring module and the partitioning module respectively. The data feedback module determines whether the spark abnormality during grinding is caused by the height difference based on the collected data of the monitoring module, and records and feeds back the determination result and the corresponding collected data.

2. The laser grinding control system for diamond composite sheets according to claim 1, characterized in that: The partitioning module specifically performs the following processes to complete the division of the grinding area: Acquire height distribution data of the machining surface of the grinding workpiece by the height measuring probe, wherein the height distribution data includes height values of a plurality of measuring points based on the center of the grinding workpiece; A number of continuous concentric rings are generated by expanding outward from the center of the circle, and all the concentric rings cover the effective processing area of the processing surface of the grinding part; Calculate the average height of the measurement points in each concentric ring as the ring height value of the ring; Perform gradient determination on the ring height values of continuous rings: If the ring height values of N consecutive rings are all higher than the preset high threshold, the continuous ring area is marked as a high-abrasive area; If the ring height values of M consecutive rings are all lower than the preset low threshold, the continuous ring area is marked as a low grinding area; The continuous circular area between the high grinding area and the low grinding area is marked as the slope grinding area.

3. The laser grinding control system for diamond composite sheets according to claim 1, characterized in that: During the laser grinding process, the monitoring module uses a high-speed industrial camera to capture spark flying images in real time at a sampling rate synchronized with the laser pulse frequency, and associates and records the processing timestamp corresponding to the image, the polar coordinate position of the laser focus on the grinding workpiece, and the grinding zone number to which it belongs.

4. The laser grinding control system for diamond composite sheets according to claim 1, characterized in that: The monitoring module is further configured to identify whether the spark is abnormal, and the specific identification process includes: Perform grayscale processing and background noise filtering on a single-frame spark image to extract the effective spark area; The vertical projection area ratio of the spark region, the maximum spark cluster diameter, and the spark distribution dispersion σ are determined respectively. If any of the three parameters exceeds the corresponding standard range, it is judged as a spark abnormality.

5. The laser grinding control system for diamond composite sheets according to claim 4, characterized in that: The monitoring module determines the vertical projection area ratio of the spark region and the maximum spark cluster diameter in the following steps: Determine the projected area S1 of the spark on the vertical plane; Determine the minimum circumscribed circle area S2 of the spark pixel group, take the ratio of S1 to S2 as the vertical projection area ratio of the spark area, and take the diameter of the minimum circumscribed circle as the maximum spark cluster diameter.

6. The laser grinding control system for diamond composite sheets according to claim 5, characterized in that: The monitoring module determines the spark distribution dispersion σ based on the following calculation method: , where N represents the total number of spark particles in a single frame image, di represents the distance from the i-th spark particle to the center of the spark pixel group, and d represents the average distance from all spark particles to the center of the spark pixel group.

7. The laser grinding control system for diamond composite sheets according to claim 4, characterized in that: After the control module performs the initial laser grinding with the initial removal amount, in response to the absence of spark anomalies in each grinding area, the control module performs subsequent grindings with a preset standard removal amount in sequence. In response to the presence of spark anomalies in each grinding area, the control module performs a reduction operation on the preset standard removal amount for each subsequent grinding, and the reduction amount is determined based on the collected data of the grinding area with the greatest degree of anomaly.

8. The laser grinding control system for diamond composite sheets according to claim 1, characterized in that: In response to the presence of spark anomalies, the data feedback module counts the distribution of spark anomalies in the grinding area during the initial laser grinding. In response to the number of polar coordinate positions corresponding to the spark anomalies being greater than a preset number of positions and existing only in any one of the high grinding area, the low grinding area, and the slope grinding area, it is determined that the spark anomaly is caused by a height difference, and the corresponding determination result and the corresponding collected data are recorded and fed back.

9. The laser grinding control system for diamond composite sheets according to claim 7, characterized in that: The control module sets an initial removal amount in the first laser grinding that is greater than a preset standard removal amount in each subsequent grinding.

10. The laser grinding control system for diamond composite sheets according to claim 9, characterized in that: The initial removal amount set by the control module is 0.1 mm.

Citation Information

Patent Citations

  • Laser grinding device and grinding method

    CN117961303A

  • Aircraft skin chemical auxiliary wet-type laser depainting method

    CN113523578A

  • Intelligent grinding system for transmission shaft

    CN118595910A