IGCT power module unit heat dissipation device and method

Abstract

The invention provides an IGCT power module unit heat dissipation device and method, and belongs to the technical field of semiconductor devices.The device comprises a GCT device heat dissipation mechanism, a control module and a liquid cooling machine, and the method comprises the steps that when the real-time temperature of a GCT device reaches a threshold value L, the control module controls the liquid cooling machine to be started, and the flow speed of cooling liquid of the liquid cooling machine is adjusted according to the real-time temperature; when the real-time temperature of the GCT device reaches a threshold value M, the control module controls the liquid cooling machine to conduct refrigeration, and the heat dissipation power of the liquid cooling machine is adjusted according to the real-time temperature. By arranging the liquid cooling machine and the cooling water channel, cooling liquid is used for absorbing and taking away heat of the GCT device, and it is ensured that the GCT device operates within a reasonable temperature range; the control module dynamically adjusts operation parameters of the liquid cooling machine according to a preset control strategy, temperature control over the IGCT power module unit is achieved, the stability and reliability of the whole device are improved through a staged and multi-layer heat dissipation method, and a reliable heat dissipation mode is provided for a high-power application scene.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and particularly to a heat dissipation device and method for an IGCT power module unit. Background Art

[0002] GCT (Gate Commutated Turn-off Thyristor) is a gate-commutated turn-off thyristor, which is a semiconductor device applicable to power electronic converters and generates a large amount of heat during operation; IGCT (Integrated Gate-Commutated Thyristor) is an integrated gate-commutated thyristor, and usually connects a GCT chip to its gate drive circuit through a printed circuit board; an IGCT power module unit is a modular device integrating IGCT devices and is often applied to fields such as power, metallurgy, and railways.

[0003] In the single-module application of the prior art, the heat dissipation method of GCT is mainly natural heat dissipation or natural air cooling, which is applicable to equipment or components with low temperature control requirements and low device heat generation power. However, the above heat dissipation methods have insufficient heat dissipation capacity and limited heat dissipation effect in high-power application scenarios, and are prone to overheating and damage of GCT devices during operation, thereby affecting the service life and reliability of the equipment. Summary of the Invention

[0004] To overcome the problems existing in the related art, one of the purposes of the present invention is to provide a heat dissipation device for an IGCT power module unit. The liquid cooler of the device quickly takes away the heat of the GCT device through the coolant, has a stronger heat dissipation capacity than the traditional heat dissipation method, avoids damage of the GCT device due to overheating, and real-time monitors the temperature of the GCT device through a temperature sensing element and transmits the data to a control module. The control module dynamically adjusts the real-time temperature of the heat dissipation mechanism of the GCT device by adjusting the device parameters of the liquid cooler, thereby improving the service life and reliability of the IGCT power module unit.

[0005] A heat dissipation device for an IGCT power module unit includes a heat dissipation mechanism for a GCT device, a control module, and a liquid cooler. An installation position for placing the GCT device is provided in the heat dissipation mechanism for the GCT device, and a temperature sensing element is arranged on the installation position. The temperature sensing element is used to detect the real-time temperature of the heat dissipation mechanism for the GCT device;

[0006] The heat dissipation mechanism for the GCT device includes a cooling member, and a liquid cooling cavity is arranged in the cooling member. The liquid cooling cavity is externally connected to the liquid cooler, and the liquid cooler adjusts the flow rate and speed of the coolant delivered to the liquid cooling cavity in real time;

[0007] The liquid chiller and the temperature sensing element are both electrically connected to the control module, and the control module is configured to control the liquid chiller to dissipate heat from the GCT device heat dissipation mechanism when the real-time temperature exceeds a preset threshold.

[0008] Since the natural heat dissipation and natural air cooling methods commonly used in the prior art cannot meet the heat dissipation requirements of high-power application scenarios, the present invention combines a liquid chiller, a temperature sensing element, and a control module to achieve an efficient heat dissipation effect; the liquid chiller quickly removes the heat of the GCT device through the coolant, and has a stronger heat dissipation ability than traditional heat dissipation methods, avoiding damage to the GCT device due to overheating; the temperature sensing element monitors the real-time temperature of the GCT device in real time and transmits the data to the control module, and the control module dynamically adjusts the temperature of the GCT device heat dissipation mechanism by adjusting the device parameters of the liquid chiller, ensuring that the GCT device always operates within a safe temperature range, and improving the life and reliability of the IGCT power module unit.

[0009] In a preferred technical solution of the present invention, the cooling member is connected to the GCT device, and the contact surfaces between the cooling member and the GCT device are mutually matched.

[0010] The cooling member can quickly remove the heat of the GCT device, and the mutually matched contact surface design ensures that the heat can be evenly transferred from the GCT device to the cooling member, neither wasting space nor avoiding local overheating, and improving the heat dissipation performance.

[0011] In a preferred technical solution of the present invention, the cooling member includes an upper cover plate and a lower cover plate connected to each other, the upper cover plate is disposed on the top of the GCT device, and the lower cover plate is disposed on the bottom of the GCT device.

[0012] By respectively arranging the upper cover plate and the lower cover plate on the top and bottom of the GCT device, the heat dissipation area is significantly increased, and the upper cover plate and the lower cover plate can provide stable mechanical support for the GCT device.

[0013] In a preferred technical solution of the present invention, a heat conduction member is further disposed between the cooling member and the GCT device, and the side wall of the heat conduction member is in contact with the GCT device;

[0014] Two heat conduction members are provided, one is disposed between the upper cover plate and the GCT device, and the other is disposed between the lower cover plate and the GCT device.

[0015] The heat conduction component is connected to the GCT device so that the heat in the GCT device can be evenly and quickly transferred to the cooling component through the heat conduction component, avoiding local overheating of the GCT device. The design of the two heat conduction components can more effectively manage the heat generated by the GCT device during operation, ensure that the GCT device operates within an appropriate temperature range, and at the same time, the heat conduction component can also serve as an additional support structure for the cooling component.

[0016] In a preferred technical solution of the present invention, the liquid cooling cavity includes a cooling water channel, the cooling water channel is arranged in an S shape in the upper cover plate and the lower cover plate, and water channel cover plates matching the cooling water channel are provided on the upper surface of the upper cover plate and the lower surface of the lower cover plate;

[0017] The cooling water channel of the upper cover plate and the cooling water channel of the lower cover plate are connected by a connecting pipe;

[0018] The cooling water channel is connected to the liquid cooler through a delivery pipe, and a control valve is arranged on the delivery pipe.

[0019] The arrangement of the cooling water channel enables the coolant to flow through the cooling component and take away the heat in the heat conduction component arranged closely to the cooling component, avoiding the accumulation of heat in the GCT device. The S-shaped design of the cooling water channel in the upper cover plate and the lower cover plate helps to achieve more efficient heat exchange and more uniform heat distribution; the water channel cover plate facilitates the subsequent rapid maintenance and repair of the cooling water channel, and at the same time strictly controls the airtightness between the cooling water channel and the water channel cover plate to prevent coolant leakage. The upper cover plate and the lower cover plate are connected by a connecting pipe, and the cooling water channel is connected to the liquid cooler through a delivery pipe, ensuring that the flow path of the coolant is from the liquid cooler to the cooling component and then back to the liquid cooler, and at the same time does not limit the flow direction of the coolant between the upper cover plate and the lower cover plate, and only adjusts the flow direction according to the actual temperature conditions on the upper surface and the lower surface of the GCT device.

[0020] In a preferred technical solution of the present invention, the upper cover plate and the lower cover plate are connected by spring bolts, the spring bolts include bolts, the bolts penetrate through the upper cover plate and are threadedly connected to the lower cover plate, and springs are sleeved on the bolts, and the opposite ends of the springs are respectively abutted against the upper cover plate and the lower cover plate.

[0021] The upper cover plate and the lower cover plate are connected by spring bolts, so that the cooling component, the heat conduction component and the GCT device are fastened together; the use of spring bolts for connection enables the overall structure to remain stable and reduce structural deformation when facing external impacts or vibrations.

[0022] The second object of the present invention is to provide a heat dissipation method for an IGCT power module unit, including the following steps:

[0023] The temperature sensing element collects the real-time temperature of the GCT device and feeds it back to the control module;

[0024] When the real-time temperature of the GCT device reaches the threshold L, the control module controls the liquid chiller to start and adjusts the coolant flow rate of the liquid chiller according to the real-time temperature;

[0025] When the real-time temperature of the GCT device reaches the threshold M, the control module controls the liquid chiller to refrigerate and adjusts the heat dissipation power of the liquid chiller according to the real-time temperature;

[0026] When the real-time temperature of the GCT device reaches the threshold N, the operating power of the GCT device is reduced by a preset reduction amount through the control module;

[0027] Where L < M < N.

[0028] When the temperature reaches the threshold L, the control module controls the liquid chiller to start and adjusts the coolant flow rate according to the real-time temperature. The strategy of adjusting the heat dissipation method as needed not only improves the heat dissipation efficiency but also avoids unnecessary energy consumption to achieve an energy-saving effect. Further, when the temperature rises to the threshold M, the liquid chiller enters the refrigeration mode and dynamically adjusts the heat dissipation power to further enhance the heat dissipation ability, ensuring that the GCT device can operate stably in a high-temperature environment and effectively preventing performance degradation or hardware damage caused by overheating. In addition, when the temperature reaches the higher threshold N, the operating power of the GCT device is reduced by a preset reduction amount to provide an additional protection mechanism to avoid irreversible damage to the GCT device due to excessive temperature and extend the service life of the device; through the phased and multi-level heat dissipation method, not only the flexibility and adaptability of the heat dissipation device are improved, but also the entire heat dissipation process is optimized by reasonably allocating resources, enabling the IGCT power module unit to maintain good heat dissipation performance under different working conditions, thereby improving the stability and reliability of the overall device and providing a reliable heat dissipation method for high-power application scenarios.

[0029] In a preferred technical solution of the present invention, the cooling member includes an upper cover plate and a lower cover plate connected to each other. The upper cover plate is disposed on the top of the GCT device, and the lower cover plate is disposed on the bottom of the GCT device;

[0030] The liquid cooling cavity includes cooling water channels, and the cooling water channels are formed in an S shape in the upper cover plate and the lower cover plate. Water channel cover plates matching the cooling water channels are provided on the upper surface of the upper cover plate and the lower surface of the lower cover plate;

[0031] The cooling water channels of the upper cover plate and the cooling water channels of the lower cover plate are connected by a connecting pipe;

[0032] The cooling water channels are connected to the liquid chiller through a delivery pipe, and a control valve is provided on the delivery pipe;

[0033] The method further includes:

[0034] When the control module controls the operation of the liquid chiller, the upper surface temperature and the lower surface temperature of the GCT device are collected;

[0035] When the upper surface temperature of the GCT device is higher than the lower surface temperature, the control module makes the coolant of the liquid chiller flow in from the upper cover plate and flow out from the lower cover plate;

[0036] When the lower surface temperature of the GCT device is higher than the upper surface temperature, the control module makes the coolant of the liquid chiller flow in from the lower cover plate and flow out from the upper cover plate.

[0037] The intelligent flow control strategy not only improves the pertinence and efficiency of heat dissipation, but also further optimizes the heat dissipation effect, ensuring that the GCT device always operates stably within the safe temperature range, thereby prolonging the service life of the device.

[0038] In a preferred technical solution of the present invention, when the real-time temperature of the GCT device is lower than the threshold value L, the GCT device dissipates heat naturally;

[0039] When the real-time temperature of the GCT device is higher than the limit threshold value U, the control module controls the GCT device to terminate operation;

[0040] Where L < M < N < U.

[0041] By setting reasonable temperature thresholds and control strategies, the heat dissipation efficiency and energy consumption are effectively balanced, and at the same time, the safe operation of the equipment is ensured. When the real-time temperature of the GCT device is lower than the threshold value L, only natural heat dissipation is required to meet the heat dissipation requirements, making full use of the low-cost advantage of natural heat dissipation and avoiding unnecessary startup of the liquid chiller to achieve energy-saving effects; when the temperature exceeds the limit threshold value U, the control module controls the GCT device to terminate operation, ensuring that the equipment will not cause safety accidents due to continuous operation in case of abnormal high temperature, and maximizing the safety of the equipment.

[0042] In a preferred technical solution of the present invention, when the real-time temperature of the GCT device reaches the threshold value L, the control module controls the liquid chiller to start, and after adjusting the coolant flow rate of the liquid chiller according to the real-time temperature, if the real-time temperature drops to the threshold value H, the control module controls the liquid chiller to suspend operation;

[0043] When the real-time temperature of the GCT device reaches the threshold value M, the control module controls the liquid chiller to refrigerate, and after adjusting the heat dissipation power of the liquid chiller according to the real-time temperature, if the real-time temperature drops to the threshold value L, the control module controls the liquid chiller to suspend refrigeration;

[0044] When the real-time temperature of the GCT device reaches the threshold value N, the control module reduces the operating power of the GCT device by a preset reduction amount, specifically including:

[0045] When the real-time temperature of the GCT device reaches a threshold value N, the operating power of the GCT device is reduced by a first preset reduction amount through the control module;

[0046] When the real-time temperature of the GCT device reaches a threshold value R, the operating power of the GCT device is reduced by a second preset reduction amount through the control module until the real-time temperature of the GCT device drops to a threshold value L;

[0047] When the real-time temperature of the GCT device is higher than the limit threshold U, the control module controls the GCT device to stop running, then controls the GCT device to start running again, and controls the operating power of the GCT device to reduce a first preset reduction amount;

[0048] Among them, H<L<M<N<R<U, and the first preset reduction amount is smaller than the second preset reduction amount.

[0049] When the temperature reaches a threshold value N, the operating power of the GCT device is reduced by a first preset reduction amount through the control module. When the temperature further rises to a threshold value R, the operating power of the GCT device is reduced by a second preset reduction amount until the temperature drops to a threshold value L. The strategy of reducing power in stages provides multi-level protection for the device, avoiding irreversible damage to the GCT device due to excessive temperature, thereby extending the service life of the device. In addition, the first preset reduction amount is smaller than the second preset reduction amount, so that the GCT device can gradually reduce power when the temperature rises, rather than reducing it significantly all at once, thereby avoiding excessive impact on the operation of the GCT device.

[0050] The beneficial effects of the present invention are:

[0051] The present application provides an IGCT power module unit heat dissipation device, which realizes efficient heat dissipation effect by interconnecting a GCT device heat dissipation mechanism, a temperature sensing element, a control module and a liquid cooler; by arranging a heat conduction member, the heat of the GCT device is transferred and evenly dispersed, thereby effectively avoiding the risk of local overheating damage of the GCT device; the liquid cooler and the cooling water channel use the coolant to absorb and take away the heat of the heat conduction member and the GCT device, thereby ensuring that the GCT device operates stably within a reasonable temperature range; the cooling water channel has an S-shaped design and flexible flow direction adjustment, thereby ensuring uniformity of heat distribution and high efficiency of heat exchange; the temperature sensing element monitors the temperature change of the GCT device in real time, and converts the temperature signal into an electrical signal and transmits it to the control module, and the control module dynamically adjusts the operating parameters of the liquid cooler according to a preset control strategy to realize temperature control of the heat dissipation mechanism of the GCT device, thereby ensuring that the IGCT device is always in the best working state in high-voltage and high-power application scenarios, thereby improving the life and reliability of the equipment.

[0052] When the temperature reaches the threshold L, a heat dissipation method for an IGCT power module unit provided by this application controls the start of a liquid chiller through a control module and adjusts the coolant flow rate according to the real-time temperature. The strategy of adjusting the heat dissipation method as needed not only improves the heat dissipation efficiency but also avoids unnecessary energy consumption to achieve an energy-saving effect. Further, when the temperature rises to the threshold M, the liquid chiller enters the refrigeration mode and dynamically adjusts the heat dissipation power to enhance the heat dissipation capacity, ensuring that the GCT device can operate stably in a high-temperature environment and effectively preventing performance degradation or hardware damage caused by overheating. In addition, when the temperature reaches a higher threshold N, the operating power of the GCT device is reduced using a preset reduction amount to provide an additional protection mechanism to avoid irreversible damage to the GCT device due to excessive temperature, extend the service life of the device, improve the stability and reliability of the overall device, and provide a reliable heat dissipation method for high-power application scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] Figure 1 is one of the exploded views of a heat dissipation device for an IGCT power module unit in an embodiment of the present invention;

[0054] Figure 2 is a schematic structural diagram of a heat dissipation device for an IGCT power module unit in an embodiment of the present invention;

[0055] Figure 3 is a structural relationship diagram of a heat dissipation device for an IGCT power module unit in an embodiment of the present invention;

[0056] Figure 4 is another exploded view of a heat dissipation device for an IGCT power module unit in an embodiment of the present invention;

[0057] Figure 5 is the front view of a heat dissipation device for an IGCT power module unit in an embodiment of the present invention;

[0058] Figure 6 is the top view of a heat dissipation device for an IGCT power module unit in an embodiment of the present invention;

[0059] Figure 7 is the bottom view of a heat dissipation device for an IGCT power module unit in an embodiment of the present invention;

[0060] Figure 8 is the left view of a heat dissipation device for an IGCT power module unit in an embodiment of the present invention;

[0061] Figure 9 is the right view of a heat dissipation device for an IGCT power module unit in an embodiment of the present invention;

[0062] Figure 10It is a sectional view taken along line A-A of a heat dissipation device for an IGCT power module unit in an embodiment of the present invention;

[0063] Figure 11 It is a schematic diagram of the steps of a heat dissipation method for an IGCT power module unit in an embodiment of the present invention.

[0064] Reference numerals:

[0065] 1. Temperature sensing element; 2. GCT device; 3. Heat sink plate; 4. Upper cover plate; 5. Lower cover plate; 6. Cooling water channel; 7. Connecting pipe; 8. Delivery pipe; 9. Spring bolt; 10. Water channel cover plate. Detailed implementation manners

[0066] Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings. Although the preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that the present invention will be more thorough and complete, and can fully convey the scope of the present invention to those skilled in the art.

[0067] GCT (Gate Commutated Turn-off Thyristor), namely gate-commutated turn-off thyristor, is a semiconductor device applicable to power electronic converters, which generates a large amount of heat during operation; IGCT (Integrated Gate-Commutated Thyristor) is an integrated gate-commutated thyristor, and usually connects the GCT chip with its gate drive circuit through a printed circuit board; the IGCT power module unit is a modular device integrating IGCT devices, and is often applied in fields such as power, metallurgy, and railway.

[0068] In the single-module application of the prior art, the heat dissipation method of GCT is mainly natural heat dissipation or natural air cooling, which is applicable to equipment or components with low requirements for temperature control and low device heat generation power. However, the above heat dissipation methods have insufficient heat dissipation capacity and limited heat dissipation effect in high-power application scenarios, and are prone to overheating and damage of GCT devices during operation, thus affecting the equipment life and reliability.

[0069] Based on this, the present application provides a heat dissipation device and method for an IGCT power module unit.

[0070] Embodiment 1

[0071] See Figures 1 - 3, a heat dissipation device for an IGCT power module unit provided in this embodiment includes a heat dissipation mechanism for a GCT device 2, a control module, and a liquid chiller. An installation position for placing the GCT device 2 is provided in the heat dissipation mechanism for the GCT device 2. The GCT device 2 is the core component of the IGCT power module unit. A temperature sensing element 1 is provided on the installation position, and the temperature sensing element 1 is used to detect the real-time temperature of the heat dissipation mechanism for the GCT device 2;

[0072] The heat dissipation mechanism for the GCT device 2 includes a cooling component. A liquid cooling cavity is provided in the cooling component. The liquid cooling cavity is externally connected to the liquid chiller, and the liquid chiller adjusts the flow rate and speed of the coolant delivered to the liquid cooling cavity in real time;

[0073] The liquid chiller, the temperature sensing element 1, and the GCT device 2 are all electrically connected to the control module. The control module is used to control the liquid chiller to dissipate heat from the heat dissipation mechanism for the GCT device 2 when the real-time temperature exceeds a preset threshold; when the real-time temperature exceeds the preset threshold, the control module adjusts the flow rate and liquid cooling temperature of the liquid chiller correspondingly according to the preset temperature range and the real-time temperature, and simultaneously adjusts the operating power of the GCT device 2.

[0074] The cooling component is connected to the liquid chiller, and heat is carried away by the coolant. The cooling component is connected to the GCT device 2, and the contact surface between the cooling component and the GCT device 2 matches each other. The cooling component includes an upper cover plate 4 and a lower cover plate 5 that are connected to each other. The upper cover plate 4 is arranged on the top of the GCT device 2, and the lower cover plate 5 is arranged on the bottom of the GCT device 2. Both the upper cover plate 4 and the lower cover plate 5 provide a stable mechanical support structure for the heat dissipation mechanism of the GCT device 2.

[0075] The liquid cooling cavity includes a cooling water channel 6. The cooling water channel 6 is used for the circulation of the coolant to carry away heat. The cooling water channel 6 is arranged in an S shape in the upper cover plate 4 and the lower cover plate 5. The S-shaped design helps to achieve more efficient heat exchange and more uniform heat distribution. Water channel cover plates 10 that match the cooling water channel 6 are provided on the upper surface of the upper cover plate 4 and the lower surface of the lower cover plate 5. The water channel cover plates 10 cover the surface of the cooling water channel 6, which is convenient for subsequent rapid maintenance and repair of the cooling water channel 6, and at the same time strictly controls the airtightness between the cooling water channel 6 and the water channel cover plates 10 to prevent coolant leakage.

[0076] Specifically, both the upper cover plate 4 and the lower cover plate 5 are formed with two notches by the cooling water channels 6; the notches of the cooling water channels 6 of the upper cover plate 4 and the lower cover plate 5 are communicated through a connecting pipe 7, and the notches of the upper cover plate 4 and the lower cover plate 5 communicated through the connecting pipe 7 are located on the same side, and the two notches on the other side of the upper cover plate 4 and the lower cover plate 5 are respectively connected to the liquid cooler through a conveying pipe 8. This connection method ensures that the flow path of the coolant is from the liquid cooler to the cooling component and then back to the liquid cooler. At the same time, it does not limit the flow direction of the coolant between the upper cover plate 4 and the lower cover plate 5, and only adjusts the flow direction according to the actual temperature conditions of the upper surface and the lower surface of the GCT device 2.

[0077] More specifically, the upper cover plate 4 and the lower cover plate 5 are connected by spring bolts 9, so that the upper cover plate 4, the lower cover plate 5 and the GCT device 2 are fastened together. The spring bolt 9 includes a bolt that penetrates through the upper cover plate 4 and is threadedly connected to the lower cover plate 5. A spring is sleeved on the bolt, and the opposite ends of the spring are respectively abutted against the upper cover plate 4 and the lower cover plate 5; the connection by the spring bolts 9 enables the overall structure to remain stable and reduce structural deformation when facing external impacts or vibrations; at the same time, the structure between the cooling component and the GCT device 2 is compact, which is more conducive to the layer-by-layer transfer of heat from the inside to the outside and improves the heat dissipation efficiency; the elasticity of the spring improves the plane adaptability of the cooling component and the GCT device 2 to adjacent components, enabling this device to be applied in more different specifications of structures.

[0078] In actual applications, the temperature sensing element 1 is a temperature sensor, which is connected to the control module and monitors the temperature of the GCT device 2 in real time. The temperature sensing element 1 penetrates through the cooling component and is installed on the upper surface and the lower surface of the GCT device 2 to respectively detect the upper surface temperature and the lower surface temperature of the GCT device 2. The temperature sensing element 1 can be installed by threading, and small-sized temperature sensing elements 1 can be directly installed with fixing glue.

[0079] The working process of this embodiment is as follows:

[0080] The liquid cooler transports the coolant into the upper cover plate 4 and the lower cover plate 5. The heat generated by the GCT device 2 during operation is conducted into the cooling water channels 6 of the upper cover plate 4 and the lower cover plate 5 and absorbed by the coolant in the cooling water channels 6. Driven by the liquid cooler, the coolant that has absorbed heat flows back to the liquid cooler through the connecting pipe 7 and the conveying pipe 8 for cooling, forming a circulating heat dissipation path; at the same time, the temperature sensing element 1 monitors the temperature change of the GCT device 2 in real time and transmits the temperature data to the control module, and the control module adjusts the operating parameters of the liquid cooler in real time according to the preset data.

[0081] In the present invention, a liquid chiller and a cooling water channel 6 are used to absorb and carry away the heat of the GCT device 2 by means of a coolant, ensuring the stable operation of the GCT device 2 within a reasonable temperature range; the S-shaped design and flexible flow direction adjustment of the cooling water channel 6 ensure the high efficiency of heat exchange and the uniformity of heat distribution; the temperature sensing element 1 monitors the real-time temperature change of the heat dissipation mechanism of the GCT device 2 in real time, converts the temperature signal into an electrical signal and transmits it to the control module, and the control module dynamically adjusts the operating parameters of the liquid chiller according to the preset control strategy to achieve temperature control of the GCT device 2, ensuring that the IGCT power module unit is always in the best working state, thereby improving the service life and reliability of the equipment.

[0082] Embodiment 2

[0083] See Figures 2 - 4 , a heat dissipation device for an IGCT power module unit provided in this embodiment includes a heat dissipation mechanism for the GCT device 2, a control module, and a liquid chiller. An installation position for placing the GCT device 2 is provided in the heat dissipation mechanism of the GCT device 2. The GCT device 2 is a core component of the IGCT power module unit. A temperature sensing element 1 is provided on the installation position, and the temperature sensing element 1 is used to detect the real-time temperature of the heat dissipation mechanism of the GCT device 2;

[0084] The heat dissipation mechanism of the GCT device 2 includes a cooling member. A liquid cooling cavity is provided in the cooling member, and the liquid cooling cavity is externally connected to the liquid chiller. The liquid chiller adjusts the flow rate and speed of the coolant delivered to the liquid cooling cavity in real time;

[0085] The liquid chiller, the temperature sensing element 1, and the GCT device 2 are all electrically connected to the control module. The control module is used to control the liquid chiller to dissipate heat from the heat dissipation mechanism of the GCT device 2 when the real-time temperature exceeds a preset threshold; when the real-time temperature exceeds the preset threshold, the control module adjusts the flow rate and liquid cooling temperature of the liquid chiller correspondingly according to the preset temperature range and the real-time temperature, and simultaneously adjusts the operating power of the GCT device 2.

[0086] The cooling member is connected to the liquid chiller, and the heat is carried away by the coolant. The cooling member is connected to the GCT device 2, and the contact surface between the cooling member and the GCT device 2 matches each other. The cooling member includes an upper cover plate 4 and a lower cover plate 5 that are connected to each other. The upper cover plate 4 is arranged on the top of the GCT device 2, and the lower cover plate 5 is arranged on the bottom of the GCT device 2. Both the upper cover plate 4 and the lower cover plate 5 provide a stable mechanical support structure for the heat dissipation mechanism of the GCT device 2.

[0087] The liquid cooling cavity includes a cooling water channel 6 for the circulation of a coolant to carry away heat. The cooling water channel 6 is arranged in an S shape in the upper cover plate 4 and the lower cover plate 5. The S-shaped design helps to achieve more efficient heat exchange and more uniform heat distribution. Water channel cover plates 10 matching the cooling water channel 6 are provided on the upper surface of the upper cover plate 4 and the lower surface of the lower cover plate 5. The water channel cover plates 10 cover the surface of the cooling water channel 6, facilitating subsequent rapid maintenance and repair of the cooling water channel 6. At the same time, the airtightness between the cooling water channel 6 and the water channel cover plates 10 is strictly controlled to prevent coolant leakage.

[0088] Specifically, two notches are formed in both the upper cover plate 4 and the lower cover plate 5 by the cooling water channel 6. The notches of the cooling water channel 6 in the upper cover plate 4 and the lower cover plate 5 are connected by a connecting pipe 7. The notches of the upper cover plate 4 and the lower cover plate 5 connected by the connecting pipe 7 are on the same side. The two notches on the other side of the upper cover plate 4 and the lower cover plate 5 are respectively connected to the liquid cooler through a delivery pipe 8. This connection method ensures that the flow path of the coolant is from the liquid cooler to the cooling component and then back to the liquid cooler. At the same time, it does not limit the flow direction of the coolant between the upper cover plate 4 and the lower cover plate 5, and only adjusts the flow direction according to the actual temperature conditions on the upper and lower surfaces of the GCT device 2.

[0089] In this embodiment, a heat conduction component is further arranged between the cooling component and the GCT device 2. The side wall of the heat conduction component is in contact with the GCT device 2. The heat conduction component can be a heat pipe 3. The heat pipe 3 can quickly transfer the heat of the GCT device 2 to the cooling component through itself. It is optimal to set two heat pipes 3, one is arranged between the upper cover plate 4 and the GCT device 2, and the other is arranged between the lower cover plate 5 and the GCT device 2. The design of the two heat pipes 3 can more effectively manage the heat generated by the GCT device 2 during operation. At the same time, it can also serve as an additional support structure for the cooling component.

[0090] More specifically, the upper cover plate 4 and the lower cover 5 are connected by spring bolts 9 to fasten the cooling component, the heat pipe 3 and the GCT device 2 together. The spring bolt 9 includes a bolt that passes through the upper cover plate 4 and is threadedly connected to the lower cover plate 5. A spring is sleeved on the bolt, and the opposite ends of the spring are respectively in contact with the upper cover plate 4 and the lower cover plate 5. Connecting through the spring bolts 9 enables the overall structure to remain stable and reduce structural deformation when facing external impacts or vibrations. At the same time, it makes the cooling component, the heat pipe 3 and the GCT device 2 have a compact structure, which is more conducive to the gradual transfer of heat from the inside to the outside and improves the heat dissipation efficiency. The elasticity of the spring enhances the plane adaptability of the cooling component, the heat pipe 3 and the GCT device 2 to adjacent components, enabling this device to be applied in more different specifications of structures.

[0091] In practical applications, the temperature sensing element 1 is a temperature sensor. The temperature sensor is connected to the control module and monitors the upper and lower surfaces of the GCT device 2 in real time, respectively detecting the upper surface temperature and the lower surface temperature of the GCT device 2. The temperature sensing element 1 penetrates through the cooling member and is installed on the GCT device 2. The temperature sensing element 1 can be installed by threading, and a small-sized temperature sensing element 1 can be directly installed using fixing glue.

[0092] The working process of this embodiment is as follows:

[0093] Start the liquid cooler to deliver the coolant to the upper cover plate 4 and the lower cover plate 5. The heat generated by the GCT device 2 during operation is conducted to the heat sink plate 3, and then the heat sink plate 3 conducts the heat to the cooling water channels 6 of the upper cover plate 4 and the lower cover plate 5, which is absorbed by the coolant in the cooling water channels 6. Driven by the liquid cooler, the coolant that has absorbed heat flows back to the liquid cooler through the connecting pipe 7 and the delivery pipe 8 for cooling, forming a circulating heat dissipation path; at the same time, the temperature sensing element 1 monitors the temperature change of the GCT device 2 in real time and transmits the temperature data to the control module, and the control module adjusts the operating parameters of the liquid cooler in real time according to the preset data.

[0094] The present invention realizes an efficient heat dissipation effect through the mutual connection of the GCT device 2 heat dissipation mechanism, the temperature sensing element 1, the control module, and the liquid cooler; by setting the heat sink plate 3 to transfer and evenly disperse the heat of the GCT device 2, the risk of local overheating and damage of the GCT device 2 is effectively avoided; the liquid cooler and the cooling water channels 6 use the coolant to absorb and carry away the heat of the heat sink plate 3 and the GCT device 2, ensuring that the GCT device 2 operates stably within a reasonable temperature range; the S-shaped design of the cooling water channels 6 and the flexible adjustment of the flow direction ensure the high efficiency of heat exchange and the uniformity of heat distribution; the temperature sensing element 1 monitors the real-time temperature change of the GCT device 2 heat dissipation mechanism in real time, converts the temperature signal into an electrical signal and transmits it to the control module, and the control module dynamically adjusts the operating parameters of the liquid cooler according to the preset control strategy to realize the real-time temperature control of the GCT device 2 heat dissipation mechanism, ensuring that the IGCT power module unit is always in the best working state, thereby improving the equipment life and reliability.

[0095] Embodiment 3

[0096] See Figures 2 - 10 , a heat dissipation device for an IGCT power module unit provided in this embodiment includes a GCT device 2 heat dissipation mechanism, a control module, and a liquid cooler. An installation position for placing the GCT device 2 is provided in the GCT device 2 heat dissipation mechanism. The GCT device 2 is the core component of the IGCT power module unit. A temperature sensing element 1 is provided on the installation position, and the temperature sensing element 1 is used to detect the real-time temperature of the GCT device 2 heat dissipation mechanism;

[0097] The heat dissipation mechanism of the GCT device 2 includes a cooling member, a liquid cooling cavity is provided in the cooling member, the liquid cooling cavity is externally connected to the liquid chiller, and the liquid chiller adjusts the flow rate and speed of the coolant delivered to the liquid cooling cavity in real time;

[0098] The liquid chiller, the temperature sensing element 1, and the GCT device 2 are all electrically connected to the control module. The control module is used to control the liquid chiller to dissipate heat from the heat dissipation mechanism of the GCT device 2 when the real-time temperature exceeds a preset threshold; when the real-time temperature exceeds the preset threshold, the control module adjusts the flow rate and liquid cooling temperature of the liquid chiller correspondingly according to the preset temperature range and the real-time temperature, and at the same time adjusts the operating power of the GCT device 2.

[0099] The cooling member is connected to the liquid chiller, and the heat is carried away by the coolant. The cooling member is connected to the GCT device 2, and the contact surfaces of the cooling member and the GCT device 2 match each other. The cooling member includes an upper cover plate 4 and a lower cover plate 5 which are connected to each other. The upper cover plate 4 is arranged on the top of the GCT device 2, and the lower cover plate 5 is arranged on the bottom of the GCT device 2. Both the upper cover plate 4 and the lower cover plate 5 provide a stable mechanical support structure for the heat dissipation mechanism of the GCT device 2.

[0100] The liquid cooling cavity includes a cooling water channel 6, which is used for the circulation of the coolant to carry away heat. The cooling water channel 6 is arranged in an S shape in the upper cover plate 4 and the lower cover plate 5. The S-shaped design helps to achieve more efficient heat exchange and more uniform heat distribution. Water channel cover plates 10 matching the cooling water channel 6 are provided on the upper surface of the upper cover plate 4 and the lower surface of the lower cover plate 5, and the water channel cover plates 10 cover the surface of the cooling water channel 6.

[0101] Specifically, the upper cover plate 4 and the lower cover plate 5 are connected through a connecting pipe 7, the cooling water channel 6 is connected to the liquid chiller through a delivery pipe 8, and a control valve for controlling the coolant flow rate is arranged on the delivery pipe 8. This connection method ensures that the flow path of the coolant is from the liquid chiller to the cooling member and then back to the liquid chiller, and at the same time does not limit the flow direction of the coolant between the upper cover plate 4 and the lower cover plate 5, and only adjusts the flow direction according to the actual temperature conditions of the upper surface and the lower surface of the GCT device 2.

[0102] A heat conduction member is further disposed between the cooling member and the GCT device 2. The side wall of the heat conduction member is in contact with the GCT device 2. The heat conduction member is a heat pipe 3. As a heat conduction element, the heat pipe 3 can quickly transfer the heat of the GCT device 2 to the cooling member through itself; two heat pipes 3 are provided, one is disposed between the upper cover plate 4 and the GCT device 2, and the other is disposed between the lower cover plate 5 and the GCT device 2. The two heat pipes 3 have different shapes to adapt to GCT devices 2 with different specific structures.

[0103] More specifically, the upper cover plate 4 and the lower cover plate 5 are connected by spring bolts 9 to fasten the cooling member, the heat pipe 3 and the GCT device 2 together; the spring bolts 9 include bolts, the bolts penetrate through the upper cover plate 4 and are threadedly connected to the lower cover plate 5, and springs are sleeved on the bolts. The opposite ends of the springs are respectively abutted against the upper cover plate 4 and the lower cover plate 5; the connection by the spring bolts 9 enables the overall structure to remain stable and reduce structural deformation when facing external impacts or vibrations.

[0104] In actual applications, the temperature sensing element 1 is connected to the control module and monitors the temperature of the GCT device 2 in real time. The temperature sensing element 1 penetrates through the cooling member and is installed on the upper surface and the lower surface of the GCT device 2 to respectively detect the upper surface temperature and the lower surface temperature of the GCT device 2. The temperature sensing element 1 can be installed by threading, and small-sized temperature sensing elements 1 can be directly installed using fixing glue.

[0105] In this embodiment, multiple groups of temperature sensing elements 1 are provided, which are respectively fixed to the top and the bottom of the GCT device 2 to respectively monitor and feedback the upper surface temperature and the lower surface temperature of the GCT device 2 in real time to adjust the flow direction of the coolant; when the upper surface temperature of the GCT device 2 is higher than the lower surface temperature, the flow direction of the coolant is adjusted as follows: flowing from the liquid cooler to the upper cover plate 4, flowing from the upper cover plate 4 to the lower cover plate 5, and flowing from the lower cover plate 5 to the liquid cooler; when the lower surface temperature of the GCT device 2 is higher than the upper surface temperature, the flow direction of the coolant is adjusted as follows: flowing from the liquid cooler to the lower cover plate 5, flowing from the lower cover plate 5 to the upper cover plate 4, and flowing from the upper cover plate 4 to the liquid cooler.

[0106] Temperature sensors, flow sensors, pressure sensors, valves, etc. are installed in the liquid cooler to respectively monitor and adjust parameters such as the flow rate, hydraulic pressure, and temperature of the coolant, so as to achieve a better adjustment effect on the overall temperature of the IGCT power module.

[0107] The liquid cooler and the control module are in two-way communication. The control module sends control signals such as flow rate, pressure, and temperature to the liquid cooler, and the liquid cooler feeds back the temperature to the control module in real time.

[0108] The working process of this embodiment is as follows:

[0109] Start the liquid chiller to transport the coolant into the upper cover plate 4 and the lower cover plate 5. The heat generated by the GCT device 2 during operation is conducted into the heat pipe 3, and then the heat pipe 3 conducts the heat into the cooling water channels 6 of the upper cover plate 4 and the lower cover plate 5, which is absorbed by the coolant in the cooling water channels 6. Driven by the liquid chiller, the coolant that has absorbed heat flows back to the liquid chiller through the hose and the connecting pipe for cooling, forming a circulating heat dissipation path; at the same time, the temperature sensing element 1 monitors the temperature change of the GCT device 2 in real time and transmits the temperature data to the control module, and the control module adjusts the operating parameters of the liquid chiller in real time according to the preset data.

[0110] Through the interconnection of the GCT device 2 heat dissipation mechanism, the temperature sensing element 1, the control module, and the liquid chiller, the present invention realizes an efficient heat dissipation effect; by setting the heat pipe 3 to transfer and evenly disperse the heat of the GCT device 2, the risk of local overheating and damage of the GCT device 2 is effectively avoided; the liquid chiller and the cooling water channels 6 use the coolant to absorb and take away the heat of the heat pipe 3 and the GCT device 2 to ensure that the GCT device 2 operates stably within a reasonable temperature range; the S-shaped design of the cooling water channels 6 and the flexible adjustment of the flow direction ensure the high efficiency of heat exchange and the uniformity of heat distribution; the temperature sensing element 1 monitors the temperature change of the GCT device 2 in real time, converts the temperature signal into an electrical signal and transmits it to the control module, and the control module dynamically adjusts the operating parameters of the liquid chiller according to the preset control strategy to realize the temperature control of the GCT device 2, ensuring that the IGCT power module unit is always in the best working state, thereby improving the equipment life and reliability.

[0111] Embodiment 4

[0112] See Figures 2 - 11 , this embodiment provides a heat dissipation method for applying the heat dissipation device in Embodiment 3, including the following steps:

[0113] The temperature sensing element 1 collects the real-time temperature of the GCT device 2 and feeds it back to the control module;

[0114] When the real-time temperature of the GCT device 2 reaches the threshold value L, the control module controls the liquid chiller to start and adjusts the coolant flow rate of the liquid chiller according to the real-time temperature;

[0115] When the real-time temperature of the GCT device 2 reaches the threshold value M, the control module controls the liquid chiller to refrigerate and adjusts the heat dissipation power of the liquid chiller according to the real-time temperature;

[0116] When the real-time temperature of the GCT device 2 reaches the threshold value N, the operating power of the GCT device 2 is reduced by a preset reduction amount through the control module;

[0117] Where L < M < N, in practical applications, L can be set to 70°, M can be set to 85°, and N can be set to 95°.

[0118] Further, the cooling member includes an upper cover plate 4 and a lower cover plate 5 which are connected to each other. The upper cover plate 4 is disposed on the top of the GCT device 2, and the lower cover plate 5 is disposed on the bottom of the GCT device 2; the liquid cooling cavity includes a cooling water channel 6 which is formed in an S shape in the upper cover plate 4 and the lower cover plate 5. Water channel cover plates 10 matching the cooling water channel 6 are provided on the upper surface of the upper cover plate 4 and the lower surface of the lower cover plate 5; the cooling water channel 6 of the upper cover plate 4 and the cooling water channel 6 of the lower cover plate 5 are connected by a connecting pipe 7; the cooling water channel 6 is connected to the liquid cooler through a delivery pipe 8;

[0119] Control valves, two-way pumps, flow sensors, pressure sensors, etc. are provided on both the delivery pipe 8 and the connecting pipe 7. The control valve is used to control the flow rate and flow direction of the coolant. The two-way pump can change the flow direction of the coolant of the liquid cooler according to the control signal sent by the control module. The flow sensor monitors the flow rate of the coolant in real time, and the pressure sensor monitors the pressure of the coolant in real time;

[0120] The method further includes: when the control module controls the operation of the liquid cooler, collecting the temperature of the upper surface and the lower surface of the GCT device 2; when the temperature of the upper surface of the GCT device 2 is higher than the temperature of the lower surface, the control module sends an instruction to make the two-way pump of the liquid cooler adjust the flow direction of the coolant to flow in from the upper cover plate 4 and flow out from the lower cover plate 5; when the temperature of the lower surface of the GCT device 2 is higher than the temperature of the upper surface, the control module sends an instruction to make the two-way pump of the liquid cooler adjust the flow direction of the coolant to flow in from the lower cover plate 5 and flow out from the upper cover plate 4.

[0121] Furthermore, when the real-time temperature of the GCT device 2 is lower than the threshold value L, the GCT device 2 dissipates heat naturally; when the real-time temperature of the GCT device 2 is higher than the limit threshold value U, the control module controls the GCT device 2 to terminate operation; where L < M < N < U, in a specific application, U can be set to 100°.

[0122] Specifically, when the real-time temperature of the GCT device 2 reaches the threshold value L, the control module controls the liquid cooler to start, and after adjusting the flow rate of the coolant of the liquid cooler according to the real-time temperature, if the real-time temperature drops to the threshold value H, the control module controls the liquid cooler to suspend operation;

[0123] When the real-time temperature of the GCT device 2 reaches the threshold value M, the control module controls the liquid cooler to refrigerate, and after adjusting the heat dissipation power of the liquid cooler according to the real-time temperature, if the real-time temperature drops to the threshold value L, the control module controls the liquid cooler to suspend refrigeration;

[0124] When the real-time temperature of the GCT device 2 reaches the threshold N, the control module reduces the operating power of the GCT device 2 by a preset reduction amount, specifically including: when the real-time temperature of the GCT device 2 reaches the threshold N, the control module reduces the operating power of the GCT device 2 by a first preset reduction amount; when the real-time temperature of the GCT device 2 reaches the threshold R, the control module reduces the operating power of the GCT device 2 by a second preset reduction amount until the real-time temperature of the GCT device 2 drops to the threshold L;

[0125] When the real-time temperature of the GCT device 2 is higher than the limit threshold U, after the control module controls the GCT device 2 to terminate operation, the control module controls the GCT device 2 to start running again and controls the operating power of the GCT device 2 to be reduced by the first preset reduction amount;

[0126] Where H < L < M < N < R < U, the first preset reduction amount is less than the second preset reduction amount. In this embodiment, H is set to 60°, R is set to 98°, the first preset reduction amount is set to 10%, and the second preset reduction amount is set to 30%.

[0127] In this embodiment, the calculation formula for the heat dissipation power is:

[0128] Q = K × A × ΔT / l;

[0129] Where,

[0130] Q is the heat flux, unit: W;

[0131] K is the thermal conductivity, unit: W / (m·K);

[0132] A is the cross-sectional area of the cooling water channel 6, unit: m 2 , in this embodiment, A = πr 2 ;

[0133] ΔT is the temperature difference between the upper surface and the lower surface of the GCT device 2;

[0134] l is the length of the heat transfer path, unit: m;

[0135] The calculation formula for the refrigerating capacity Q is:

[0136] Q = Cp × F × ΔT / 60;

[0137] Where,

[0138] Cp is the specific heat capacity of the coolant. In this embodiment, the coolant is water and the specific heat capacity is 4.18 kJ / (kg·℃);

[0139] ρ is the density of the coolant. In this embodiment, the coolant is water and the density is 1000 kg / m 3 or 1 kg / L;

[0140] F is the coolant flow rate, unit: m 3 / h or L / min.

[0141] A heat dissipation method for an IGCT power module unit provided by the present application, when the temperature reaches the threshold L, controls the liquid chiller to start through a control module and adjusts the coolant flow rate according to the real-time temperature. The strategy of adjusting the heat dissipation method as needed not only improves the heat dissipation efficiency but also avoids unnecessary energy consumption to achieve an energy-saving effect. Further, when the temperature rises to the threshold M, the liquid chiller enters the refrigeration mode and dynamically adjusts the heat dissipation power to enhance the heat dissipation capacity, ensuring that the GCT device 2 can operate stably in a high-temperature environment, effectively preventing performance degradation or hardware damage caused by overheating. In addition, when the temperature reaches a higher threshold N, the operating power of the GCT device 2 is reduced using a preset reduction amount to provide an additional protection mechanism to avoid irreversible damage to the GCT device 2 due to excessive temperature, extend the service life of the device, improve the stability and reliability of the overall device, and provide a reliable heat dissipation method for high-power application scenarios.

[0142] For ease of description, spatial relative terms such as "above", "over", "on the upper surface", "upper" etc. can be used here to describe the spatial position relationship of a device or feature shown in the figure with other devices or features. It should be understood that the spatial relative terms are intended to cover different orientations in use or operation in addition to the orientation described in the figure for the device. For example, if the device in the figure is inverted, the device described as "above" or "over" other devices or structures will then be positioned "below" or "beneath" other devices or structures. Thus, the exemplary term "above" can include both the orientations of "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the corresponding explanations are made for the spatial relative descriptions used here.

[0143] In addition, it should be noted that using words such as "first", "second" etc. to limit components is only for the convenience of differentiating the corresponding components. Without additional declaration, the above words have no special meaning, so they cannot be understood as limiting the protection scope of the present application.

[0144] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A heat dissipation device for an IGCT power module unit, characterized in that: It includes a heat dissipation mechanism for the GCT device (2), a control module and a liquid chiller. An installation position for placing the GCT device (2) is provided in the heat dissipation mechanism of the GCT device (2), and a temperature sensing element (1) is arranged on the installation position. The temperature sensing element (1) is used to detect the real-time temperature of the heat dissipation mechanism of the GCT device (2); The heat dissipation mechanism of the GCT device (2) includes a cooling member, a liquid cooling cavity is arranged in the cooling member, the liquid cooling cavity is externally connected to the liquid chiller, and the liquid chiller adjusts the flow rate and speed of the coolant delivered to the liquid cooling cavity in real time; Both the liquid chiller and the temperature sensing element (1) are electrically connected to the control module, and the control module is used to control the liquid chiller to dissipate heat from the heat dissipation mechanism of the GCT device (2) when the real-time temperature exceeds a preset threshold.

2. The heat dissipation device for an IGCT power module unit according to claim 1, characterized in that: The cooling member is connected to the GCT device (2), and the contact surface between the cooling member and the GCT device (2) matches each other.

3. The heat dissipation device for an IGCT power module unit according to claim 1, characterized in that: The cooling member includes an upper cover plate (4) and a lower cover plate (5) which are connected to each other. The upper cover plate (4) is arranged on the top of the GCT device (2), and the lower cover plate (5) is arranged on the bottom of the GCT device (2).

4. The heat dissipation device for an IGCT power module unit according to claim 2 or 3, characterized in that: A heat conduction member is further arranged between the cooling member and the GCT device (2), and the side wall of the heat conduction member is in contact with the GCT device (2); Two heat conduction members are provided, one is arranged between the upper cover plate (4) and the GCT device (2), and the other is arranged between the lower cover plate (5) and the GCT device (2).

5. The heat dissipation device for an IGCT power module unit according to claim 3, characterized in that: The liquid cooling cavity includes a cooling water channel (6), and the cooling water channel (6) is arranged in an S shape in the upper cover plate (4) and the lower cover plate (5). Water channel cover plates (10) matching the cooling water channel (6) are arranged on the upper surface of the upper cover plate (4) and the lower surface of the lower cover plate (5); The cooling water channel (6) of the upper cover plate (4) and the cooling water channel (6) of the lower cover plate (5) are connected by a connecting pipe (7); The cooling water channel (6) is connected to the liquid chiller through a delivery pipe (8), and a control valve is arranged on the delivery pipe (8).

6. The heat dissipation device for an IGCT power module unit according to claim 3, characterized in that: The upper cover plate (4) and the lower cover plate (5) are connected by a spring bolt (9). The spring bolt (9) includes a bolt that penetrates through the upper cover plate (4) and is threadedly connected to the lower cover plate (5). A spring is sleeved on the bolt, and the opposite ends of the spring are respectively abutted against the upper cover plate (4) and the lower cover plate (5).

7. A heat dissipation method for an IGCT power module unit, characterized in that: Applied to a heat dissipation device for an I GCT power module unit according to any one of claims 1-6, it includes the following steps: The temperature sensing element (1) collects the real-time temperature of the GCT device (2) and feeds it back to the control module; When the real-time temperature of the GCT device (2) reaches the threshold value L, the control module controls the liquid chiller to start and adjusts the coolant flow rate of the liquid chiller according to the real-time temperature; When the real-time temperature of the GCT device (2) reaches the threshold value M, the control module controls the liquid chiller to refrigerate and adjusts the heat dissipation power of the liquid chiller according to the real-time temperature; When the real-time temperature of the GCT device (2) reaches the threshold value N, the operating power of the GCT device (2) is reduced by a preset reduction amount through the control module; Where L < M < N.

8. A heat dissipation method for an I GCT power module unit according to claim 7, characterized in that: The cooling member includes an upper cover plate (4) and a lower cover plate (5) connected to each other. The upper cover plate (4) is arranged on the top of the GCT device (2), and the lower cover plate (5) is arranged on the bottom of the GCT device (2); The liquid cooling cavity includes a cooling water channel (6). The cooling water channel (6) is arranged in an S shape in the upper cover plate (4) and the lower cover plate (5). Water channel cover plates (10) matching the cooling water channel (6) are provided on the upper surface of the upper cover plate (4) and the lower surface of the lower cover plate (5); The cooling water channel (6) of the upper cover plate (4) and the cooling water channel (6) of the lower cover plate (5) are connected by a connecting pipe (7); The cooling water channel (6) is connected to the liquid chiller through a delivery pipe (8), and a control valve is arranged on the delivery pipe (8); The method further includes: When the control module controls the operation of the liquid chiller, the upper surface temperature and the lower surface temperature of the GCT device (2) are collected; When the upper surface temperature of the GCT device (2) is higher than the lower surface temperature, the control module makes the coolant of the liquid chiller flow in from the upper cover plate (4) and flow out from the lower cover plate (5); When the lower surface temperature of the GCT device (2) is higher than the upper surface temperature, the control module makes the coolant of the liquid chiller flow in from the lower cover plate (5) and flow out from the upper cover plate (4).

9. A heat dissipation method for an I GCT power module unit according to claim 7, characterized in that: When the real-time temperature of the GCT device (2) is lower than the threshold value L, the GCT device (2) dissipates heat naturally; When the real-time temperature of the GCT device (2) is higher than the limit threshold value U, the control module controls the GCT device (2) to terminate operation; Where L < M < N < U.

10. A heat dissipation method for an I GCT power module unit according to claim 9, characterized in that: When the real-time temperature of the GCT device (2) reaches the threshold L, the control module controls the liquid chiller to start and adjusts the coolant flow rate of the liquid chiller according to the real-time temperature. After that, if the real-time temperature drops to the threshold H, the control module controls the liquid chiller to suspend operation; When the real-time temperature of the GCT device (2) reaches the threshold M, the control module controls the liquid chiller to refrigerate and adjusts the heat dissipation power of the liquid chiller according to the real-time temperature. After that, if the real-time temperature drops to the threshold L, the control module controls the liquid chiller to suspend refrigeration; When the real-time temperature of the GCT device (2) reaches the threshold N, the control module reduces the operating power of the GCT device (2) by a preset reduction amount, specifically including: When the real-time temperature of the GCT device (2) reaches the threshold N, the control module reduces the operating power of the GCT device (2) by the first preset reduction amount; When the real-time temperature of the GCT device (2) reaches the threshold R, the control module reduces the operating power of the GCT device (2) by the second preset reduction amount until the real-time temperature of the GCT device (2) drops to the threshold L; When the real-time temperature of the GCT device (2) is higher than the limit threshold U, the control module controls the GCT device (2) to terminate operation. After that, the control module controls the GCT device (2) to start running again and controls the operating power of the GCT device (2) to be reduced by the first preset reduction amount; Where H < L < M < N < R < U, and the first preset reduction amount is less than the second preset reduction amount.

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