Data transmission method based on optical communication, electronic device, vehicle and readable storage medium

Abstract

The invention discloses a data transmission method based on optical communication, an electronic device, a vehicle and a computer readable storage medium, and the method comprises the steps: receiving first electric signal data transmitted by a central processing subsystem, and determining target equipment identification information according to the first electric signal data and mapping relation data, and carrying out photoelectric conversion and signal transmission on the target equipment identification information and the first electric signal data so as to send the first electric signal data to the target vehicle terminal equipment. Thus, the central processing subsystem and the vehicle terminal equipment can interact through the optical signal, the data transmission time delay, the data transmission efficiency and the data transmission reliability between the central processing subsystem and the vehicle terminal equipment are guaranteed, application scenes with high real-time requirements are supported, and based on the target equipment identification information, the real-time performance of the vehicle terminal equipment is improved. And the electric signal data can be reliably sent to the target vehicle terminal equipment.

Description

Technical Field

[0001] This application relates to the technical field of vehicles, and particularly to a data transmission method based on optical communication, an electronic device, a vehicle, and a computer-readable storage medium. Background Art

[0002] In the related art, to ensure the stable operation of each in-vehicle function and the reliable control of each in-vehicle component, a vehicle may be equipped with a chip with high computing power to quickly process the information reported by each in-vehicle component and send control instructions to each component. However, limited by the transmission delay and transmission speed of electrical signals, the transmission efficiency of control instructions in the form of electrical signals is low, resulting in in-vehicle components being difficult to receive the control instructions issued by the chip in a timely manner, thereby affecting the operation of in-vehicle components and the use of in-vehicle functions to a certain extent. Summary of the Invention

[0003] This application provides a data transmission method based on optical communication, an electronic device, a vehicle, and a computer-readable storage medium.

[0004] An embodiment of this application provides a data transmission method based on optical communication for an optical communication component in a vehicle-mounted system. The system further includes a central processing subsystem and multiple vehicle terminal devices connected to the optical communication component. The method includes:

[0005] Receiving first electrical signal data sent by the central processing subsystem;

[0006] Determining target device identification information according to the first electrical signal data and pre-determined mapping relationship data between electrical signal data and device identification information, where the target device identification information is used to identify the target vehicle terminal device that receives the first electrical signal data among the multiple vehicle terminal devices;

[0007] Performing optoelectronic conversion and signal transmission on the target device identification information and the first electrical signal data to send the first electrical signal data to the target vehicle terminal device.

[0008] Thus, in the embodiments of the present application, the central processing subsystem and the vehicle terminal device in the vehicle system can convert electrical signal data and optical signal data through the optical communication component, and transmit the optical signal data, so that the central processing subsystem and the vehicle terminal device can interact through optical signals, thereby avoiding problems such as high time delay, low transmission rate, and susceptibility to electromagnetic interference during the transmission of electrical signal data to a certain extent. Therefore, the data transmission time delay, data transmission efficiency, and data transmission reliability between the central processing subsystem and the vehicle terminal device can be guaranteed, so as to better support application scenarios with high real-time requirements such as vehicle information collection and analysis, and data interaction between the vehicle and the cloud platform, and the user experience of using the vehicle is guaranteed. In addition, before converting the electrical signal data into optical signal data and transmitting the optical signal data, first determine the target device identification information of the receiving party of the first electrical signal data according to the mapping relationship data between the electrical signal data and the device identification information determined in advance, and then, after converting the electrical signal into optical signal data and transmitting the optical signal data, based on the target device identification information, ensure that the first electrical signal data can be reliably sent to the target vehicle terminal device.

[0009] In some embodiments of the present application, the mapping relationship data is used to associate the electrical signal frame header data with the device identification information. The determining of the target device identification information according to the first electrical signal data and the mapping relationship data between the electrical signal data and the device identification information determined in advance includes:

[0010] Analyze and process the first electrical signal data to obtain the first electrical signal frame header data;

[0011] Determine the target device identification information according to the first electrical signal frame header data and the mapping relationship data.

[0012] Thus, in the embodiments of the present application, the first electrical signal data can be parsed to obtain the first electrical signal frame header data, and the target device identification information can be determined according to the first electrical signal frame header data and the mapping relationship data.

[0013] In some embodiments of the present application, the first electrical signal frame header data includes an address field at a target position.

[0014] In some embodiments of the present application, the first electrical signal frame header data includes at least one of a bus number field, a function number field, and a device number field.

[0015] In some embodiments of the present application, the mapping relationship data includes first mapping relationship sub-data and multiple second mapping relationship sub-data. The determining of the target device identification information according to the first electrical signal frame header data and the mapping relationship data includes:

[0016] Determine the target second mapping relationship sub-data associated with the target attribute among the multiple second mapping relationship sub-data according to the target attribute of the target field in the first mapping sub-data and the first electrical signal frame header data, where the first mapping sub-data is used to associate the second mapping relationship sub-data with the attribute of the target field;

[0017] Determine the target device identification information according to the target second mapping relationship sub-data and the value of the target field, where the second mapping relationship sub-data is used to associate the device identification information with the value of the target field.

[0018] In this way, in the embodiment of the present application, the target second mapping relationship sub-data among the multiple second mapping relationship sub-data can be determined through the first mapping relationship sub-data and the target attribute of the target field in the first electrical signal frame header data, and the target device identification information can be determined through the second mapping relationship sub-data and the value of the target field in the first electrical signal frame header data, so that the determination of the target device identification information can be realized based on a two-level mapping method.

[0019] In some embodiments of the present application, the determining the target second mapping relationship sub-data associated with the target attribute among the multiple second mapping relationship sub-data according to the first mapping sub-data and the target attribute of the target field in the first electrical signal frame header data includes:

[0020] Determine the target second mapping relationship sub-data associated with the target attribute and associated with the current transmission mode among the multiple second mapping relationship sub-data according to the first mapping sub-data, the target attribute, and the current transmission mode of the first electrical signal data, where the first mapping sub-data is used to associate the second mapping relationship sub-data with the attribute of the target field and the transmission mode of the first electrical signal data, and the current transmission mode is the first mode or the second mode.

[0021] In this way, in the embodiment of the present application, the target second mapping relationship sub-data among the multiple second mapping relationship sub-data can be determined through the first mapping relationship sub-data, the target attribute of the target field in the first electrical signal frame header data, and the current transmission mode of the first electrical signal data.

[0022] In some embodiments of the present application, the optical communication component includes at least one master optical module, at least one optical splitter, and multiple slave optical modules that are sequentially connected by optical fibers. The central processing subsystem is electrically connected to the master optical module, and the slave optical module is electrically connected to the vehicle terminal device.

[0023] In some embodiments of the present application, the master optical module is configured to: determine first optical signal data according to the target device identification information and the first electrical signal data, and send the first optical signal data to the optical splitter; the optical splitter is configured to: forward the first optical signal data to the multiple slave optical modules; the slave optical module is configured to: analyze the received first optical signal data to obtain the target device identification information, and when the target device identification information matches the pre-stored device identification information, determine the first electrical signal data according to the first optical signal data, and send the first electrical signal data to the target vehicle terminal device.

[0024] Thus, in the embodiments of the present application, the first optical signal data can be analyzed to obtain the target device identification information, and when it is determined that the target device identification information matches the pre-stored device identification information, the first optical signal data is subjected to optoelectronic conversion to obtain the first electrical signal data for sending to the target vehicle terminal device, thereby avoiding the invalid conversion of the first optical signal data to the first electrical signal data.

[0025] In some embodiments of the present application, the master optical module is configured to: determine the first electrical signal data as the first payload data, configure first frame header data according to the first payload data and the target device identification information, encapsulate the first payload data and the first frame header data, determine the first optical signal data, and send the first optical signal data to the optical splitter.

[0026] Thus, in the embodiments of the present application, the first payload data can be determined according to the first electrical signal data, the first frame header data can be configured through the target device identification information, and then the first payload data and the first frame header data are packaged and encapsulated as the first optical signal data to realize the transparent transmission of the first electrical signal data.

[0027] In some embodiments of the present application, the slave optical module is configured to: when receiving the second electrical signal data sent by the vehicle terminal device, determine the second electrical signal data as the second payload data, configure second frame header data according to the second payload data, encapsulate the second payload data and the second frame header data, determine the second optical signal data, and send the second optical signal data to the master optical module through the optical splitter.

[0028] Thus, in the embodiments of the present application, when the second electrical signal data sent by the vehicle terminal device is received, the second electrical signal data can be determined as the second payload data, and the second payload data and the configured second frame header data are encapsulated to determine the second optical signal data, and the second optical signal data is sent to the master optical module through an optical splitter, so that the master optical module sends the second optical signal data to the central processing subsystem, thereby completing the transparent transmission of the second electrical signal data between the vehicle terminal device and the central processing subsystem.

[0029] In some embodiments of the present application, both the first electrical signal data and the second electrical signal data include all types of data frames in the data link layer and all types of data streams in the physical layer.

[0030] In some embodiments of the present application, both the first frame header data and the second frame header data include a first parameter, and the first parameter is used to identify the number of payload data in the optical signal data.

[0031] In some embodiments of the present application, both the first frame header data and the second frame header data include a second parameter, and the second parameter is used to identify the fragmentation state of the payload data.

[0032] In some embodiments of the present application, both the first frame header data and the second frame header data include a third parameter, and the third parameter is used to identify the fragmentation sequence number corresponding to each piece after the payload data is fragmented.

[0033] In some embodiments of the present application, both the first frame header data and the second frame header data include a fourth parameter, and the fourth parameter is used to identify the source of the payload data.

[0034] In some embodiments of the present application, both the first frame header data and the second frame header data include a fifth parameter, and the fifth parameter is used to store device identification information.

[0035] In some embodiments of the present application, the master optical module includes an electrical signal interface, and the receiving of the first electrical signal data sent by the central processing subsystem includes:

[0036] Receiving the first electrical signal data according to the electrical signal interface of the master optical module.

[0037] Thus, in the embodiments of the present application, the master optical module can receive the first electrical signal data sent by the central processing subsystem through the electrical signal interface, and then can perform processing such as optoelectronic conversion on the first electrical signal data sent by the central processing subsystem.

[0038] In some embodiments of the present application, the master optical module includes a signal processing chip, and performing optoelectronic conversion and signal transmission on the target device identification information and the first electrical signal data to send the first electrical signal data to the target vehicle terminal device includes:

[0039] Packaging and encapsulating the target device identification information and the first electrical signal data to obtain a first downlink physical frame, and performing differential signal conversion on the first downlink physical frame to obtain the first downlink electrical signal.

[0040] Thus, in some embodiments of the present application, the master optical module can, through the signal processing chip, perform packaging and encapsulation processing on the first electrical signal data and the target device identification information received by the electrical signal to obtain a first downlink physical frame, perform differential signal conversion on the first downlink physical frame to obtain a first downlink electrical signal, and complete data distribution from the central processing subsystem to the vehicle terminal device through the first downlink electrical signal.

[0041] In some embodiments of the present application, the signal processing chip of the master optical module includes a storage unit for storing the mapping relation data.

[0042] In some embodiments of the present application, the master optical module includes a driver, and performing optoelectronic conversion and signal transmission on the target device identification information and the first electrical signal data to send the first electrical signal data to the target vehicle terminal device includes:

[0043] Amplifying the first downlink electrical signal according to the driver of the master optical module to obtain a first amplified electrical signal.

[0044] Thus, in the embodiments of the present application, the driver of the master optical module can amplify the first downlink electrical signal output by the signal processing signal to obtain a first amplified electrical signal to meet the subsequent signal processing requirements.

[0045] In some embodiments of the present application, the master optical module includes a laser, and performing optoelectronic conversion and signal transmission on the target device identification information and the first electrical signal data to send the first electrical signal data to the target vehicle terminal device includes:

[0046] Performing optoelectronic conversion processing on the first amplified electrical signal according to the laser of the master optical module to obtain a downlink optical signal.

[0047] Thus, in the embodiments of the present application, the master optical module can, through the laser, perform optoelectronic conversion processing on the first amplified electrical signal output by the driver to convert the first amplified electrical signal into a downlink optical signal, thereby completing the conversion from electrical signal to optical signal.

[0048] In some embodiments of the present application, the master optical module includes a demultiplexer and an optical signal interface. The photoelectric conversion and signal transmission of the target device identification information and the first electrical signal data to send the first electrical signal data to the target vehicle terminal device includes:

[0049] Send the downstream optical signal to the optical splitter according to the demultiplexer and the optical signal interface of the master optical module.

[0050] In this way, in the embodiments of the present application, the master optical module can send the downstream optical signal to the optical splitter through the internal demultiplexer and optical signal interface to complete the transmission of the optical signal.

[0051] In some embodiments of the present application, the photoelectric conversion and signal transmission of the target device identification information and the first electrical signal data to send the first electrical signal data to the target vehicle terminal device includes:

[0052] Forward the downstream optical signal to the slave optical module according to the optical splitter.

[0053] In this way, in the embodiments of the present application, the downstream optical signal can be forwarded to the slave optical module through the optical splitter, making the transmission of the downstream optical signal proceed steadily.

[0054] In some embodiments of the present application, the slave optical module includes an optical signal interface. The photoelectric conversion and signal transmission of the target device identification information and the first electrical signal data to send the first electrical signal data to the target vehicle terminal device includes:

[0055] Receive the downstream optical signal according to the optical signal interface of the slave optical module.

[0056] In this way, in the embodiments of the present application, the slave optical module can receive the downstream optical signal forwarded by the optical splitter through its own optical signal interface.

[0057] In some embodiments of the present application, the slave optical module includes a demultiplexer and a photodetector. The photoelectric conversion and signal transmission of the target device identification information and the first electrical signal data to send the first electrical signal data to the target vehicle terminal device includes:

[0058] Forward the downstream optical signal to the photodetector of the slave optical module according to the demultiplexer of the slave optical module.

[0059] In this way, in the embodiments of the present application, the photodetector inside the slave optical module can receive the downstream optical signal forwarded by the demultiplexer, and then can perform corresponding processing on the downstream optical signal.

[0060] In some embodiments of the present application, the optoelectronic conversion and signal transmission of the target device identification information and the first electrical signal data to send the first electrical signal data to the target vehicle terminal device include:

[0061] According to the photodetector of the slave optical module, perform optoelectronic conversion processing on the downlink optical signal to obtain a second downlink electrical signal.

[0062] In this way, in the embodiments of the present application, the slave optical module can perform optoelectronic conversion processing on the downlink optical signal forwarded by the demultiplexer through the internal photodetector to obtain a second downlink electrical signal, thereby completing the conversion from optical signal to electrical signal.

[0063] In some embodiments of the present application, the slave optical module includes an amplifier. The optoelectronic conversion and signal transmission of the target device identification information and the first electrical signal data to send the first electrical signal data to the target vehicle terminal device include:

[0064] According to the amplifier of the slave optical module, amplify the transimpedance and limiting of the second downlink electrical signal to obtain a second downlink physical frame in differential signal form.

[0065] In this way, in the embodiments of the present application, the slave optical module can perform transimpedance and limiting amplification on the second downlink electrical signal output by the photodetector through the internal amplifier, thereby obtaining a second downlink physical frame in differential signal form.

[0066] In some embodiments of the present application, the slave optical module includes a signal processing chip. The optoelectronic conversion and signal transmission of the target device identification information and the first electrical signal data to send the first electrical signal data to the target vehicle terminal device include:

[0067] According to the signal processing chip of the slave optical module, when the target device identification information matches the pre-stored device identification information, perform unpacking processing on the second downlink physical frame in differential signal form to obtain the first electrical signal data, and send the first electrical signal data to the target vehicle terminal device.

[0068] In this way, in the embodiments of the present application, the slave optical module can perform unpacking processing on the second downlink physical frame in differential signal form to obtain the first electrical signal data through the internal signal processing chip when the target device identification information matches the pre-stored device identification information, and send the first electrical signal data to the target vehicle terminal device, thereby completing the data downlink between the central processing subsystem and the vehicle terminal device.

[0069] In some embodiments of the present application, the slave optical module includes an electrical signal interface, and the method further includes:

[0070] Receiving second electrical signal data sent by the vehicle terminal device according to the electrical signal interface of the slave optical module.

[0071] In this way, in the embodiments of the present application, the slave optical module can receive the second electrical signal data sent by the vehicle terminal device based on the internal electrical signal interface for subsequent processing.

[0072] In some embodiments of the present application, the slave optical module includes a signal processing chip, and the method further includes:

[0073] Packaging and encapsulating the second electrical signal data according to the signal processing chip of the slave optical module to obtain a first uplink physical burst frame, and performing differential signal conversion on the first uplink physical burst frame to obtain a first uplink electrical signal.

[0074] In this way, in the embodiments of the present application, the slave optical module can, through the internal signal processing chip, perform packaging and encapsulation processing on the second electrical signal data received by the electrical signal interface to obtain a first uplink physical burst frame, and perform differential signal conversion on the first uplink physical burst frame to obtain a first uplink electrical signal.

[0075] In some embodiments of the present application, the slave optical module includes a driver, and the method further includes:

[0076] Amplifying the first uplink electrical signal according to the driver of the slave optical module to obtain a second amplified electrical signal.

[0077] In this way, in the embodiments of the present application, the slave optical module can, through the internal driver, amplify the first uplink electrical signal output by the signal processing chip, thereby obtaining a second amplified electrical signal.

[0078] In some embodiments of the present application, the slave optical module includes a laser, and the method further includes:

[0079] Performing optoelectronic conversion processing on the second amplified electrical signal according to the laser of the slave optical module to obtain an uplink optical signal.

[0080] In this way, in the embodiments of the present application, the slave optical module can, through the internal laser, perform optoelectronic conversion processing on the second amplified electrical signal output by the driver, thereby obtaining an uplink optical signal.

[0081] In some embodiments of the present application, the slave optical module includes a demultiplexer and an optical signal interface, and the method further includes:

[0082] Send the uplink optical signal to the optical splitter according to the optical splitter and the optical signal interface of the slave optical module.

[0083] Thus, in the embodiment of the present application, the slave optical module can send the uplink optical signal output by the laser to the optical splitter based on its own optical splitter and optical signal interface for signal transmission of the uplink optical signal.

[0084] In some embodiments of the present application, the method further includes:

[0085] Forward the uplink optical signal to the master optical module according to the optical splitter.

[0086] Thus, in the embodiment of the present application, the uplink optical signal can be forwarded to the master optical module through the optical splitter, thereby completing the signal transmission of the uplink optical signal.

[0087] In some embodiments of the present application, the master optical module includes an optical signal interface, and the method further includes:

[0088] Receive the uplink optical signal according to the optical signal interface of the master optical module.

[0089] Thus, in the embodiment of the present application, the master optical module can receive the uplink optical signal forwarded by the optical splitter through its own optical signal interface to perform subsequent processing on the uplink optical signal.

[0090] In some embodiments of the present application, the master optical module includes an optical splitter and a photodetector, and the method further includes:

[0091] Forward the uplink optical signal to the photodetector of the master optical module according to the optical splitter of the master optical module.

[0092] Thus, in the embodiment of the present application, the photodetector inside the master optical module can receive the uplink optical signal based on the optical splitter, so as to perform corresponding processing on the uplink optical signal.

[0093] In some embodiments of the present application, the method further includes:

[0094] Perform photoelectric conversion processing on the uplink optical signal according to the photodetector of the master optical module to obtain a second uplink electrical signal.

[0095] Thus, in the embodiment of the present application, the master optical module can perform photoelectric conversion processing on the uplink optical signal forwarded by the optical splitter through the internal photodetector to obtain a second uplink electrical signal, thereby completing the conversion from optical signal to electrical signal.

[0096] In some embodiments of the present application, the master optical module includes an amplifier, and the method further includes:

[0097] According to the amplifier of the master optical module, amplify the transimpedance and limiting of the second upstream electrical signal to obtain a second upstream physical frame in the form of a differential signal.

[0098] In this way, in the embodiment of the present application, the master optical module can amplify the transimpedance and limiting of the second upstream electrical signal output by the photodetector through the internal amplifier, thereby obtaining a second upstream physical frame in the form of a differential signal.

[0099] In some embodiments of the present application, the master optical module includes a signal processing chip, and the method further includes:

[0100] According to the signal processing chip of the master optical module, unpack the second upstream physical frame in the form of a differential signal to obtain the second electrical signal data, and send the second electrical signal data to the central processing subsystem.

[0101] In this way, in the embodiment of the present application, the master optical module can unpack the second upstream physical frame in the form of a differential signal output by the amplifier through the internal signal processing chip to obtain the second electrical signal data of the central processing subsystem, and can send the second electrical signal data to the central processing subsystem, thereby completing the data uplink between the vehicle terminal device and the central processing subsystem.

[0102] In some embodiments of the present application, the central processing subsystem includes a processing chip and a root bridge device connected to the processing chip. The central processing chip can send the electrical signal data to the optical communication component through the root bridge device and receive the electrical signal data sent by the optical communication component through the root bridge device.

[0103] In some embodiments of the present application, the vehicle system further includes a switch, and the central processing subsystem is connected to the optical communication component through the switch.

[0104] The embodiment of the present application provides a control device, including a transceiver unit and a processing unit;

[0105] The transceiver unit is configured to receive the first electrical signal data sent by the central processing subsystem;

[0106] The processing unit is configured to determine the target device identification information according to the first electrical signal data and the mapping relationship data between the electrical signal data and the device identification information determined in advance, and perform optoelectronic conversion and signal transmission on the target device identification information and the first electrical signal data to send the first electrical signal data to the target vehicle terminal device, where the target device identification information is used to identify the target vehicle terminal device that receives the first electrical signal data among multiple vehicle terminal devices.

[0107] An embodiment of the present application provides an electronic device, and the electronic device includes the above control device.

[0108] An embodiment of the present application provides a vehicle, including the above electronic device or the above control device.

[0109] An embodiment of the present application provides a computer-readable storage medium. The computer-readable storage medium stores a computer program. When the computer program is executed by one or more processors, the flowchart of the above data transmission method based on optical communication is implemented.

[0110] The control device, electronic device, vehicle, and computer-readable storage medium provided by the embodiments of the present application enable the central processing subsystem and vehicle terminal devices in the vehicle system to perform conversion between electrical signal data and optical signal data and transmission of optical signal data through an optical communication component, so that the central processing subsystem and vehicle terminal devices can interact through optical signals. Thus, problems such as high time delay, low transmission rate, and susceptibility to electromagnetic interference during electrical signal data transmission can be avoided to a certain extent. Therefore, the data transmission time delay, data transmission efficiency, and data transmission reliability between the central processing subsystem and vehicle terminal devices can be ensured, and thus real-time application scenarios with high requirements such as vehicle information collection and analysis and data interaction between the vehicle and the cloud platform can be better supported, and the user experience of the vehicle is guaranteed. Moreover, before performing the conversion from electrical signal data to optical signal and optical signal transmission, the target device identification information of the receiving party of the first electrical signal data is determined according to the mapping relationship data between the electrical signal data and the device identification information determined in advance. Furthermore, after the conversion from electrical signal to optical signal and optical signal transmission, based on the target device identification information, it can be ensured that the first electrical signal data can be reliably sent to the target vehicle terminal device.

[0111] Additional aspects and advantages of the embodiments of the present application will be given in part in the following description, become apparent in part from the following description, or be understood through the practice of the embodiments of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0112] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the following description of the embodiments in conjunction with the accompanying drawings, where:

[0113] Figure 1 is a flowchart of the data transmission method based on optical communication in some embodiments of the present application;

[0114] Figure 2 is a schematic diagram of a vehicle system in some embodiments of the present application;

[0115] Figure 3Schematic diagram of an application scenario in some embodiments of the present application;

[0116] Figure 4 Schematic diagram of an application scenario in some embodiments of the present application;

[0117] Figure 5 Schematic diagram of an application scenario in some embodiments of the present application;

[0118] Figure 6 Schematic diagram of an application scenario in some embodiments of the present application;

[0119] Figure 7 Schematic diagram of an application scenario in some embodiments of the present application;

[0120] Figure 8 Schematic flowchart of a data transmission method based on optical communication in some embodiments of the present application;

[0121] Figure 9 Schematic flowchart of a data transmission method based on optical communication in some embodiments of the present application;

[0122] Figure 10 Schematic diagram of an application scenario in some embodiments of the present application;

[0123] Figure 11 Schematic diagram of an application scenario in some embodiments of the present application;

[0124] Figure 12 Schematic diagram of an application scenario in some embodiments of the present application;

[0125] Figure 13 Schematic diagram of an application scenario in some embodiments of the present application;

[0126] Figure 14 Schematic diagram of an application scenario in some embodiments of the present application;

[0127] Figure 15 Schematic diagram of an application scenario in some embodiments of the present application;

[0128] Figure 16 Schematic diagram of an application scenario in some embodiments of the present application;

[0129] Figure 17 Schematic diagram of an application scenario in some embodiments of the present application;

[0130] Figure 18 Schematic diagram of an application scenario in some embodiments of the present application;

[0131] Figure 19 Schematic diagram of an application scenario in some embodiments of the present application;

[0132] Figure 20 Schematic diagram of an application scenario in some embodiments of the present application;

[0133] Figure 21 Schematic diagram of an application scenario in some embodiments of the present application;

[0134] Figure 22 Schematic diagram of an application scenario in some embodiments of the present application;

[0135] Figure 23 Schematic diagram of an application scenario in some embodiments of the present application;

[0136] Figure 24 Schematic diagram of an application scenario in some embodiments of the present application;

[0137] Figure 25 Schematic diagram of an application scenario in some embodiments of the present application;

[0138] Figure 26 Schematic diagram of an application scenario in some embodiments of the present application;

[0139] Figure 27 Schematic diagram of an application scenario in some embodiments of the present application. Detailed implementation manners

[0140] The following details the implementation manners of the present application. Examples of the implementation manners are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The implementation manners described below with reference to the accompanying drawings are exemplary and are only used to explain the implementation manners of the present application, and should not be construed as a limitation on the implementation manners of the present application.

[0141] In the related art, a whole vehicle can be divided into five control systems, namely a body control system, a power control system, a chassis control system, an intelligent cockpit control system, and an autonomous driving control system. Each control system is respectively controlled by its own domain controller, and the computing power of the domain controller is determined by its core processor chip.

[0142] It can be understood that in the case where a whole vehicle is divided into multiple control systems (such as the above five control systems), since the functions executed by one control system may depend on the data of another or multiple control systems, and there is data interaction between multiple control systems. However, when a control system executes a certain function, the execution efficiency of this function may not only be limited by the computing power of this control system and the data transmission efficiency within the vehicle, but also be limited by the data interaction efficiency between this control system and other control systems.

[0143] Furthermore, most of the data in vehicles in the related art are in the form of electrical signals such as CAN (Controller Area Network) bus signals, LIN (Local Interconnect Network), PCIe (Peripheral Component Interconnect express) signals, and Ethernet signals.

[0144] With the introduction of high-computing power chips, the computing power has been further increased, and domain integration has continued to advance. The automotive electronic and electrical architecture has also evolved from a domain architecture to a central computing unit, forming a central platform architecture that integrates domains.

[0145] However, limited by the transmission delay, transmission efficiency, and other aspects of electrical signals, the data processing efficiency within the in-vehicle system is correspondingly limited. At the same time, the electrical signal transmission harness in the vehicle is usually a copper cable, and the weight and layout difficulty of such a copper cable harness are relatively high. Therefore, the data transmission method based on electrical signals will also affect the weight of the entire vehicle and the layout of the in-vehicle harness to a certain extent.

[0146] In addition, if there is electromagnetic interference between the interfaces of the in-vehicle processing chips, it will further increase the wiring difficulty of the vehicle and further reduce the efficiency of the in-vehicle system for receiving and transmitting information and executing functions. Moreover, even though the computing power of the in-vehicle processing chips is high, due to the constraints during the transmission of electrical signals, the computing power of the central processing subsystem chips based on the central platform architecture may not be fully utilized.

[0147] Based on the above possible problems, please refer to Figure 1 , an embodiment of the present application provides an optical communication-based data transmission method for an optical communication component in an in-vehicle system. The system further includes a central processing subsystem and multiple vehicle terminal devices connected to the optical communication component. The method includes:

[0148] 01: Receiving first electrical signal data sent by the central processing subsystem;

[0149] 02: Determining target device identification information according to the first electrical signal data and the pre-determined mapping relationship data between the electrical signal data and the device identification information, where the target device identification information is used to identify the target vehicle terminal device that receives the first electrical signal data among the multiple vehicle terminal devices;

[0150] 03: Performing optoelectronic conversion and signal transmission on the target device identification information and the first electrical signal data to send the first electrical signal data to the target vehicle terminal device.

[0151] The embodiments of the present application also provide a control device. The data transmission method based on optical communication provided by the embodiments of the present application can be implemented by the control device in the embodiments of the present application. Specifically, the control device includes a transceiver unit and a processing unit. Among them, the transceiver unit is configured to receive the first electrical signal data sent by the central processing subsystem. The processing unit is configured to determine the target device identification information according to the first electrical signal data and the mapping relationship data between the electrical signal data and the device identification information determined in advance, and perform optoelectronic conversion and signal transmission on the target device identification information and the first electrical signal data to send the first electrical signal data to the target vehicle terminal device. The target device identification information is used to identify the target vehicle terminal device that receives the first electrical signal data among multiple vehicle terminal devices.

[0152] For a clearer illustration of the embodiments of the present application, please refer to Figure 2 , Figure 2 which is a schematic diagram of the vehicle system 100 in some embodiments of the present application. That is, in the embodiments of the present application, when the optical communication component 101 in the vehicle-mounted system receives the first electrical signal data sent by the central processing subsystem 102, it can determine the target device identification information corresponding to the first electrical signal data in combination with the mapping relationship data between the electrical signal data and the device identification information determined in advance, so as to determine the recipient of the first electrical signal data, that is, the target vehicle terminal device among multiple vehicle terminal devices 103 in the vehicle-mounted system. Then, through the optoelectronic conversion of the target device identification information and the first electrical signal data together, the target device identification information and the first electrical signal data are combined as an optical signal, so that the electrical signal can be converted into an optical signal for transmission. Finally, after the transmission is completed, the optical signal is restored to an electrical signal and sent to the target vehicle terminal device, thereby completing the data (such as control instructions) distribution of the central processing subsystem 102 to the vehicle terminal device 103.

[0153] It should be noted that, in the embodiments of the present application, during the generation of the first electrical signal data by the central processing subsystem, the "pointing information" for characterizing the data recipient (i.e., the target vehicle terminal device) can be written into the electrical signal, and the mapping relationship data in the embodiments of the present application can record the "device identification information" of different vehicle terminal devices corresponding to different "pointing information". Furthermore, the optical communication component in the embodiments of the present application can determine the identification information of the recipient of the first electrical signal data, that is, the target device identification information, according to the mapping relationship data and the first electrical signal data.

[0154] It should also be noted that in the embodiments of the present application, the vehicle terminal device can be understood as an ONU (Optical Network Unit), and the device identification information of the vehicle terminal device can be understood as an ONU ID (Optical Network Unit Identity Document).

[0155] In this way, in the embodiments of the present application, the central processing subsystem and the vehicle terminal device in the vehicle system can convert electrical signal data and optical signal data through the optical communication component, and transmit the optical signal data, so that the central processing subsystem and the vehicle terminal device can interact through optical signals. Thus, problems such as high latency, low transmission rate, and susceptibility to electromagnetic interference during the transmission of electrical signal data can be avoided to a certain extent. Therefore, the data transmission latency, data transmission efficiency, and data transmission reliability between the central processing subsystem and the vehicle terminal device can be guaranteed, so as to better support application scenarios with high real-time requirements such as vehicle information collection and analysis, and data interaction between the vehicle and the cloud platform, and the user experience of using the vehicle can be guaranteed. In addition, before converting electrical signal data to optical signal data and transmitting the optical signal data, the target device identification information of the receiving party of the first electrical signal data is determined according to the mapping relationship data between the electrical signal data and the device identification information determined in advance. Furthermore, after the electrical signal to optical signal conversion and optical signal transmission, based on the target device identification information, it can be ensured that the first electrical signal data can be reliably sent to the target vehicle terminal device.

[0156] In addition, it can be understood that the central processing subsystem in the embodiments of the present application can send electrical signal data to the vehicle terminal device through the optical communication component to implement the issuance of control instructions. Correspondingly, the vehicle terminal device in the embodiments of the present application can send electrical signal data to the vehicle terminal device through the optical communication component to implement data reporting. Furthermore, since the central processing subsystem and the vehicle terminal device can directly interact through optical signal data, some electrical signal data transmission harnesses in the vehicle are replaced by optical signal data transmission harnesses. For example, copper cables are replaced by optical fibers. Compared with copper cables, optical fibers have a low weight, strong EMC (Electromagnetic Compatibility) performance, and support high-bandwidth and low-latency data transmission.

[0157] It can also be understood that Ethernet requires a specially defined management protocol, while the XGS-PON technology has a complete built-in management protocol (OMCI), which is convenient for centralized management. In addition, Ethernet technology has a symmetric rate, while the upstream and downstream rates of XGS-PON can be different and can be designed according to demand, supporting flexible rate adaptation to the requirements of service scenarios.

[0158] It can be understood that the specific structure and specific functions of the central processing subsystem in the embodiments of the present application can be set according to actual situations. For example, in one example, the central processing subsystem may include a processor with relatively high computing power and is responsible for the autonomous driving, intelligent cockpit, body control, power control, and chassis control of the entire vehicle, and is also responsible for data interaction and data processing between the vehicle and the cloud platform. In another example, the central processing subsystem includes a processing chip and a root complex device (Root Complex) connected to the processing chip. The central processing chip can send electrical signal data to the optical communication component through the root complex device and receive electrical signal data sent by the optical communication component through the root complex device.

[0159] Furthermore, the processing chip can be set according to actual situations. For example, in one example, the CPU (Central Processing Unit) computing power of the processing chip is 220KD MIPS, the GPU (Graphics Processing Unit) computing power is 3.1T FLOPS, and the NPU (Neural Processing Unit) computing power is 30TOPS. In another example, the processing chip refers to a chipset composed of two sub-chips cascaded, and the AI (Artificial Intelligence) computing power of each sub-chip is 254TOPS.

[0160] In addition, in the embodiments of the present application, the optical communication component can be used for the mutual conversion of optical signals and electrical signals and can be used for the transmission of optical signal data. Furthermore, it can be understood that the optical communication component in the embodiments of the present application can be set according to actual situations. For example, in some embodiments of the present application, the optical communication component includes at least one main-end optical module, an optical splitter, and multiple slave-end optical modules connected in sequence through optical fibers. The central processing subsystem is electrically connected to the main-end optical module, and the slave-end optical module is electrically connected to the vehicle terminal device.

[0161] For a clearer illustration of the embodiments of the present application, please refer to Figure 3 、 Figure 4 、 Figure 5 and Figure 6 , Figure 3 、 Figure 4 、 Figure 5 and Figure 6 are all schematic diagrams of application scenarios in some embodiments of the present application. That is, in the embodiments of the present application, the optical communication component is based on a 1×N structure design or an M×N structure design, where N refers to the number of slave-end optical modules and M refers to the number of main-end optical modules. Specifically, Figure 3 and Figure 4The optical communication component is based on a 1×N structure and consists of a main-end optical module, a splitter, and two slave-end optical modules. Figure 5 and Figure 6 The optical communication component is based on an M×N structure and consists of two main-end optical modules, a splitter, and two slave-end optical modules. It can be understood that both M and N can be set according to actual situations. Figure 3 、 Figure 4 、 Figure 5 and Figure 6 are only examples. Additionally, Figure 3 、 Figure 4 、 Figure 5 and Figure 6 the SOC in 、、、 refers to the central processing subsystem.

[0162] It should be noted that in the embodiments of the present application, the main-end optical module and the slave-end optical module are jointly used to perform optoelectronic conversion and optical signal data transmission on the received electrical signal data, so that the first electrical signal data sent by the central processing subsystem can be transmitted in the form of an optical signal, and the optical signal data can be restored to the first electrical signal data when the transmission is completed for the vehicle terminal device to receive.

[0163] In addition, in the embodiments of the present application, the vehicle terminal device can also be set according to actual situations. For example, in one example, the vehicle terminal device can be at least one of devices such as a high-definition central control screen, a high-definition instrument panel, pixel lights, a high-definition camera, a lidar, a millimeter-wave radar, a TCU (Telematic Control Unit), a T-BOX (Telematics-BOX), etc.

[0164] Furthermore, in the embodiments of the present application, the central processing subsystem, the vehicle terminal device, the main-end optical module, and the slave-end optical module can all include built-in signal ports to ensure the reasonable transceiver of optoelectronic signals. For example, please refer to Figure 3 and Figure 5 again. That is, in the example where the electrical signal data is a PCIe data frame, the optical signal data is an XGS-PON data frame, and the vehicle terminal device includes a Telematics-BOX (T-BOX), the Telematics-BOX can send a PCIe data frame to the slave-end optical module through its own PCIe interface.

[0165] Next, the slave optical module receives a PCIe data frame according to its own PCIe interface, and performs optoelectronic conversion processing on the PCIe data frame to encapsulate the PCIe data frame into an XGS-PON upstream physical burst frame, and sends the XGS-PON upstream physical burst frame to the optical splitter through its own XGS-PON interface, so that the optical splitter forwards the XGS-PON upstream physical burst frame to the master optical module.

[0166] Then, after receiving the XGS-PON upstream physical burst frame according to its own XGS-PON interface, the master optical module performs optoelectronic conversion on the XGS-PON upstream physical burst frame to convert the XGS-PON upstream physical burst frame into a PCIe data frame, and sends the PCIe data frame to the central processing subsystem through its own PCIe interface.

[0167] Finally, the central processing subsystem receives the PCIe data frame according to its own PCIe interface for corresponding processing, and the process of the remote information processor reporting data to the central processing subsystem ends.

[0168] In addition, considering the adaptation problem of the vehicle terminal device for the transceiver of electrical signal data, in the embodiment of the present application, when the format of the electrical signal that the vehicle terminal device body can receive and send cannot match the format of the electrical signal that the slave optical module can receive and send, the vehicle terminal device can be connected to the slave optical module through one or more external signal transfer units.

[0169] For example, please refer to again Figure 4 and Figure 6 . That is, in the example where the electrical signal data is a PCIe data frame, the optical signal data is an XGS-PON data frame, and the vehicle terminal device includes a panoramic camera / display / central control screen, the central processing subsystem can send a PCIe data frame to the master optical module through its own PCIe interface.

[0170] Next, the master optical module will perform optoelectronic conversion on the received PCIe data frame to encapsulate the PCIe data frame into an XGS-PON downstream physical frame, and send the XGS-PON downstream physical frame to the slave optical module through its own XGS-PON interface and the optical splitter.

[0171] Then, after receiving the XGS-PON downstream physical frame through the optical splitter, the slave optical module performs optoelectronic conversion on the XGS-PON downstream physical frame to convert the XGS-PON downstream physical frame into a PCIe data frame.

[0172] Further, since the panoramic camera / display / central control screen has the ability to receive and transmit GMSL (Gigabit Multimedia Serial Link) 2 signals but does not have the ability to receive and transmit PCIe data frames, the panoramic camera / display / central control screen is connected to the slave optical module through an external GMSL2 deserializer and an adapter. Thus, after the slave optical module unpacks the PCIe data frame in the XGS-PON downstream physical frame, it sends the PCIe data frame to the adapter through its own PCIe interface and the PCIe interface of the adapter.

[0173] Then, the PCIe data frame is converted by the adapter to be converted into an intermediate format signal, such as any one of MIPI CSI (Mobile Industry Processor Interface Camera Serial Interface) signal, DP signal, eDP signal, DSI signal.

[0174] Then, via the MIPI CSI interface of the adapter itself and the MIPI CSI interface of the GMSL2 deserializer, the intermediate format signal is transmitted to the GMSL2 deserializer, and the GMSL2 deserializer converts it into a GMSL2 signal.

[0175] Finally, based on its own GMSL2 interface and the GMSL2 interface of the panoramic camera / display / central control screen, the GMSL2 deserializer transmits the GMSL2 signal to the panoramic camera / display / central control screen. Thus, the process of data distribution from the central processing subsystem to the vehicle terminal device ends.

[0176] In addition, to further improve the information interaction efficiency within the vehicle system, or rather, to improve the control instruction distribution efficiency of the central processing subsystem for each vehicle terminal device in the vehicle system and the reporting efficiency of the data information sent by each vehicle terminal device to the central processing subsystem, in one example, the vehicle system further includes a switch. The central processing subsystem sends electrical signal data to the optical communication component through the switch and receives the electrical signal data sent by the optical communication component through the switch.

[0177] For a clearer illustration of the embodiments of the present application, please refer to Figure 7 , Figure 7These are schematic diagrams of application scenarios in some embodiments of the present application. That is, in the embodiments of the present application, the central processing subsystem can be connected to multiple optical communication components through a switch (Switch). Therefore, the central processing subsystem can send electrical signal data to one or more of these multiple optical communication components through the switch, so that the optical communication component that receives the electrical signal data sends the electrical signal data to the corresponding vehicle terminal device. Conversely, when the optical communication component is connected to the switch, the optical communication component can send the data information reported by the vehicle terminal device to the switch. Furthermore, the central processing subsystem can receive the data information reported by multiple vehicle terminal devices through the switch and the multiple optical communication components connected to the switch.

[0178] Please refer to Figure 8 , in some embodiments of the present application, the mapping relationship data is used to associate the electrical signal header data with the device identification information. Furthermore, the above step 02 includes:

[0179] 020: Analyze and process the first electrical signal data to obtain the first electrical signal header data;

[0180] 021: Determine the target device identification information according to the first electrical signal header data and the mapping relationship data.

[0181] The processing unit of the embodiment of the present application is configured to analyze and process the first electrical signal data to obtain the first electrical signal header data, and determine the target device identification information according to the first electrical signal header data and the mapping relationship data.

[0182] It should be noted that in the embodiments of the present application, during the process of generating the first electrical signal data, the central processing subsystem can write the "pointing information" for characterizing the data receiving party (i.e., the target vehicle terminal device) into the electrical signal header, and then package and encapsulate the electrical signal header, the electrical signal data part, and the electrical signal tail to form the complete first electrical signal data. Therefore, in the embodiments of the present application, the first electrical signal data can be analyzed and processed to obtain the header part of the first electrical signal data, that is, the above-mentioned first electrical signal header data, and determine the signal receiving party according to the first electrical signal header data.

[0183] It should also be noted that in the embodiments of the present application, the mapping relationship data records the "device identification information" of the "vehicle terminal device" corresponding to different "pointing information". Furthermore, the optical communication component of the embodiment of the present application can determine the identification information of the receiving party of the first electrical signal data, that is, the target device identification information, according to the mapping relationship data and the first electrical signal header data.

[0184] Thus, in the embodiments of the present application, the first electrical signal data can be parsed to obtain the first electrical signal frame header data, and the target device identification information can be determined according to the first electrical signal frame header data and the mapping relationship data.

[0185] In addition, it can be understood that the above "pointing information" can be set according to actual situations. For example, in some embodiments, the first electrical signal frame header data includes an address field at the target position. In other words, the "address field at the target position" is the above "pointing information". For example, in one example, the above "address field at the target position" refers to the field from the 2nd bit to the 63rd bit, a total of 62 bits, in the first electrical signal frame header data in the Non-Flit mode. In another example, the above "address field at the target position" refers to the field from the 2nd bit to the 31st bit, a total of 30 bits, in the first electrical signal frame header data.

[0186] For another example, in some other embodiments of the present application, the first electrical signal frame header data includes at least one of a bus number (BusNumber) field, a function number (Function Number) field, and a device number (Device Number) field. In other words, "at least one of the bus number field, the function number field, and the device number field" is the above "pointing information".

[0187] Please refer to Figure 9 , in some embodiments of the present application, the mapping relationship data includes first mapping relationship sub-data and multiple second mapping relationship sub-data. Further, the above step 021 includes:

[0188] 0210: Determine, according to the first mapping sub-data and the target attribute of the target field in the first electrical signal frame header data, the target second mapping relationship sub-data associated with the target attribute among the multiple second mapping relationship sub-data, where the first mapping sub-data is used to associate the second mapping relationship sub-data with the attribute of the target field;

[0189] 0211: Determine the target device identification information according to the target second mapping relationship sub-data and the value of the target field, where the second mapping relationship sub-data is used to associate the device identification information with the value of the target field.

[0190] The processing unit in the embodiments of the present application is configured to determine, according to the first mapping sub-data and the target attribute of the target field in the first electrical signal frame header data, the target second mapping relationship sub-data associated with the target attribute among the multiple second mapping relationship sub-data, and to determine the target device identification information according to the target second mapping relationship sub-data and the value of the target field. The first mapping sub-data is used to associate the second mapping relationship sub-data with the attribute of the target field, and the second mapping relationship sub-data is used to associate the device identification information with the value of the target field.

[0191] Specifically, in the embodiments of the present application, the target device identification information can be determined based on a two-level mapping method. That is, the mapping relationship data in the embodiments of the present application can be divided into two types. One is the first mapping relationship sub-data, and the other is the second mapping relationship sub-data. Among them, there can be multiple copies of the second mapping relationship sub-data.

[0192] Furthermore, the first mapping relationship sub-data is used to indicate a copy of the second mapping relationship sub-data corresponding to the first electrical signal data, or in other words, to indicate "the second mapping relationship sub-data among multiple copies of the second mapping relationship sub-data that 'can be used to confirm the recipient of the first electrical signal data'", that is, the above-mentioned target second mapping relationship sub-data.

[0193] Even further, the first mapping relationship sub-data can be understood as a mapping table with the "target attribute of the target field in the first electrical signal frame header data" as the key and the second mapping relationship sub-data as the value, and the second mapping relationship sub-data can be understood as a mapping table with the "value of the target field in the first electrical signal frame header data" as the key and the device identification information as the value.

[0194] In one example, the attributes of the target field include two attributes, namely the field length and the field type. Therefore, the target attribute of the target field is the field length and / or the field type.

[0195] In this way, in the embodiments of the present application, the target second mapping relationship sub-data among multiple second mapping relationship sub-data can be determined through the first mapping relationship sub-data and the target attribute of the target field in the first electrical signal frame header data, and the target device identification information can be determined through the second mapping relationship sub-data and the value of the target field in the first electrical signal frame header data, so that the determination of the target device identification information can be realized based on a two-level mapping method.

[0196] In some embodiments of the present application, the above step 0210 includes:

[0197] According to the first mapping sub-data, the target attribute, and the current transmission mode of the first electrical signal data, determine the target second mapping relationship sub-data among multiple second mapping relationship sub-data that is associated with the target attribute and associated with the current transmission mode, where the first mapping sub-data is used to associate the second mapping relationship sub-data with the attribute of the target field and the transmission mode of the first electrical signal data, and the current transmission mode is the first mode or the second mode.

[0198] The processing unit according to the embodiment of the present application is configured to determine, according to the first mapping sub-data, the target attribute, and the current transmission mode of the first electrical signal data, among multiple second mapping relationship sub-data, the target second mapping relationship sub-data associated with the target attribute and associated with the current transmission mode. The first mapping sub-data is used to associate the second mapping relationship sub-data with the attributes of the target field and the transmission mode of the first electrical signal data. The current transmission mode is the first mode or the second mode.

[0199] Specifically, in the embodiment of the present application, the first mapping relationship sub-data can be understood as a mapping table that takes the "target attribute of the target field in the first electrical signal frame header data" and the "current transmission mode of the first electrical signal data" as keys and takes the second mapping relationship sub-data as values.

[0200] In an example, the first electrical signal data can be transmitted through two transmission modes. One is the Flit mode, which is the aforementioned first mode. The other is the Non-Flit mode, which is the aforementioned second mode.

[0201] In this way, in the embodiment of the present application, the target second mapping relationship sub-data among multiple second mapping relationship sub-data can be determined through the first mapping relationship sub-data, the target attribute of the target field in the first electrical signal frame header data, and the current transmission mode of the first electrical signal data.

[0202] To clearly illustrate the determination process of the target second mapping relationship sub-data and the determination process of the target device identification information in the embodiment of the present application, the target field, field attributes, and mapping sub-data in the embodiment of the present application will be described below. Specifically, in the embodiment of the present application, the fields can be divided according to the length attribute and type attribute. Therefore, based on different setting methods of length and category, the target fields in the embodiment of the present application can be set according to the actual situation. For example, in an example, the target field is a field in the first electrical signal frame header data, from the 2nd bit to the 63rd bit, with a length of 62 bytes. For the convenience of description, this field is hereinafter referred to as the first address field.

[0203] In an example, the target field is a field in the first electrical signal frame header data, from the 2nd bit to the 31st bit, with a length of 30 bytes. For the convenience of description, this field is hereinafter referred to as the second address field.

[0204] In an example, the target field is a combined field in the first electrical signal frame header data, composed of an 8-bit Bus Number, a 5-bit Device Number, and a 3-bit FCN NUM, with a length of 16 bytes. For the convenience of description, this field is hereinafter referred to as the first combined field.

[0205] In one example, the target field is a combined field in the first electrical signal frame header data, which is composed of an 8-bit Bus Number and an 8-bit Function Number, with a length of 16 bytes. For ease of explanation, this field is hereinafter referred to as the second combined field.

[0206] It can be understood that in the embodiments of the present application, the length attribute of the target field can be divided into three types, namely 62 bytes, 30 bytes, and 16 bytes, and the type attribute of the target field can be divided into three types, namely an address field (referring to the first address field and the second address field), a first function field, and a second function field. The current transmission mode of the first electrical signal can be divided into two types, namely Non-Flit mode and Flit mode.

[0207] For a clearer illustration of the mapping relationship between the terminal device or the adapter address where the mapping relationship data is stored and the ONU-ID in the embodiments of the present application, as well as the storage space location of the mapping relationship data, please refer to Figures 10 to 25 , Figures 10 to 25 which are all schematic diagrams of application scenarios in some embodiments of the present application.

[0208] In the No-Flit mode, in the TLP (Transaction Layer Packet) data frame generated by the transaction layer, the header of the TLP data frame is as Figure 11 shown. While in the Flit mode, the header of the TLP data frame is as Figure 12 shown. Further, the routing and addressing rules for the TLP data frame are divided into "addressing using the address" and "ID routing". Among them, "addressing using the address" is applicable to Memory and I / O requests, and "ID routing" is applicable to configuration requests and message sending.

[0209] Further, in the Non-Filt mode, "addressing using the address" includes addressing based on a 62-bit address and addressing based on a 30-bit address. The addressing based on a 62-bit address in the Non-Filt mode is applicable to the header of the TLP data frame as Figure 13 shown, and the addressing based on a 30-bit address in the Non-Filt mode is applicable to the header of the TLP data frame as Figure 14 shown.

[0210] While in the Filt mode, "addressing using the address" also includes addressing based on a 62-bit address and addressing based on a 30-bit address. Among them, the addressing based on a 62-bit address in the Filt mode is applicable to the header of the TLP data frame as Figure 15 shown, and the addressing based on a 30-bit address in the Filt mode is applicable to the header of the TLP data frame as Figure 16The header of the TLP data frame shown.

[0211] Also, in the No-Flit mode, it can also be addressed by bus and device number (Non-ARI ID Routing). For ARI (Alternative Routing-ID), refer to, for example, Figure 17 and Figure 18 shown. In the No-Flit mode, the ARI-ID Routing considering alternative routes can be as shown in Figure 19 and Figure 20 shown. The "using ID routing" in the Flit mode can be as shown in Figure 21 and Figure 22 shown.

[0212] It can be understood that the headers of the above different TLP data frames may have five cases: 62-bit address, 30-bit address, one kind of 16-bit address (8-bit Bus Number + 5-bit Device Number + 3-bit FCN NUM), another kind of 16-bit address (8-bit BusNumber + 8-bit Function Number), and 16-bit Destination. According to these five cases, the mapping table can have multiple storage methods.

[0213] Specifically, in one example, there is only one mapping table. In other words, whether the frame header of the PCIe data frame is a 62-bit address or a 30-bit address, whether it is "addressing using the address" or "using ID routing", the PCIe address of the terminal device and its corresponding ONU-ID are stored in one mapping table.

[0214] In another example, a two-level mapping method is used to store the PCIe address of the terminal device and its corresponding ONU-ID. That is, in the embodiment of the present application, one first-level mapping table and multiple second-level mapping tables are stored. Among them, the first-level mapping table is used to indicate the addressing method.

[0215] Specifically, when the number of second-level mapping tables is 3, the first of these 3 mapping tables can be used to store the mapping relationship between the 62-bit address and the ONU-ID, such as Figure 15 addressing using the address in the Flit mode in Figure 13 addressing using the address in the Non-Flit mode in Figure 16 addressing using the address in the Flit mode in Figure 14 addressing using the address in the Non-Flit mode in. The second mapping table stores the mapping relationship between the 30-bit address and the ONU-ID, such asFigure 17 As shown by the 16-bit address composed of the Bus Number, Device Num, and FunctionNum of Figure 18 or, as shown by the 16-bit address composed of the Bus Number and Function Number of Figure 19 and Figure 20 or, as shown by the Destination BDF / BF (ARI) of Figure 21 and Figure 22 .

[0216] Furthermore, the first-level mapping table is used to store the above three types of mapping tables and the specific addresses of the mapping tables. In an example as shown in Figure 25 , the reserved bit Reserved in the type0 registration table of the PCIe device can be enabled as the first-level mapping table address.

[0217] In another example, the mapping table of the device address and the corresponding ONU-ID can be stored according to the routing and addressing modes of the Flit mode and the Non-Flit mode. Specifically, there are 2 second-level mapping tables. The first mapping table of these 2 stores the addresses based on 62-bit addressing, 30-bit addressing, and the bus and device numbers in the Flit mode. Similarly, the second table stores the addresses based on 62-bit addressing, 30-bit addressing, and the bus and device numbers in the Non-Flit mode. For details, refer to Figure 15 , Figure 16 , Figure 21 and Figure 22 .

[0218] Furthermore, the first-level mapping table can be used to store the above two types of mapping tables and the specific addresses of the mapping tables.

[0219] In another example, the mapping table can be stored according to the routing and addressing rules of the TLP data frame. Specifically, there are a total of 10 different address bit types for "addressing using the address" and "using ID routing" in different Flit and Non-Flit modes. Each mapping table stores the mapping relationship between one address bit type and the ONU-ID corresponding to the device, for a total of 10 mapping tables.

[0220] Furthermore, the first-level mapping table can be used to store the above 10 types of mapping tables and the specific addresses of the mapping tables. Optionally, as shown in Figure 25 , the reserved bit Reserved in the type0 registration table of the PCIe device can be enabled as the first-level mapping table address.

[0221] In some embodiments of the present application, the master optical module is configured to: determine first optical signal data according to target device identification information and first electrical signal data, and send the first optical signal data to a splitter; the splitter is configured to: forward the first optical signal data to multiple slave optical modules; the slave optical module is configured to: parse the received first optical signal data to obtain the target device identification information, and when the target device identification information matches the pre-stored device identification information, determine first electrical signal data according to the first optical signal data, and send the first electrical signal data to the target vehicle terminal device.

[0222] Specifically, in the embodiment of the present application, after the master optical module completes the optoelectronic conversion of the first electrical signal data to obtain the first optical signal data, the master optical module can broadcast the first optical signal to each slave optical module in the optical communication component through the splitter.

[0223] Correspondingly, after any slave optical module in the optical communication component receives the first optical signal data, it can parse the first optical signal data to obtain the target device identification information carried by the first optical signal data, and determine whether the target device identification information matches any one of the multiple pre-stored device identification information of itself. If it matches, perform optoelectronic conversion processing on the first optical signal data to obtain the first electrical signal data and send it to the target vehicle terminal device. If it does not match, ignore the first optical signal data.

[0224] In this way, in the embodiment of the present application, the first optical signal data can be parsed to obtain the target device identification information, and when it is determined that the target device identification information matches the pre-stored device identification information, optoelectronic conversion is performed on the first optical signal data to obtain the first electrical signal data and send it to the target vehicle terminal device, thereby avoiding the invalid conversion of the first optical signal data to the first electrical signal data.

[0225] In some embodiments of the present application, the master optical module is configured to: determine the first electrical signal data as the first payload data, configure first frame header data according to the first payload data and the target device identification information, encapsulate the first payload data and the first frame header data, determine the first optical signal data, and send the first optical signal data to the splitter.

[0226] Specifically, in the embodiment of the present application, the master optical module can use the first electrical signal data as the payload, and configure the frame header data according to the payload and the previously determined target device identification information. Finally, the configured frame header data and the first electrical signal data as the payload are combined for packaging, thereby obtaining the first optical signal data to be transmitted.

[0227] It can be understood that since the first electrical signal data is transmitted as the payload of the first optical signal data, the slave optical module can unpack the first optical signal data to obtain the payload in the first optical signal data, that is, the original first electrical signal data without data processing can be obtained.

[0228] It can also be understood that since the target device identification information is written into the frame header, the slave optical module can read the target device identification information in the frame header of the first optical signal data to determine whether the target device identification information matches any one of the multiple device identification information pre-stored by itself, and unpack the first optical signal data in the case of a match.

[0229] For example, in an example where the device identification information is ONU-ID and the first optical signal data is an XGEM data frame, the device identification information (ONU-ID) can be assigned to the XGEM port-ID field of the XGEM frame header.

[0230] In this way, in the embodiment of the present application, the first payload data can be determined according to the first electrical signal data, the first frame header data can be configured through the target device identification information, and then the first payload data and the first frame header data are packaged and encapsulated into the first optical signal data to achieve transparent transmission of the first electrical signal data.

[0231] Furthermore, since the transparent transmission of the electrical signal data is achieved, the consistency between the electrical signal data sent by the central processing subsystem and the electrical signal data received by the vehicle terminal device can be further ensured, the stability and reliability of data transmission can be enhanced, and data processing operations such as compression, encryption, and decryption during data transmission can be reduced. Therefore, the occurrence of data loss or damage during data transmission can be reduced, the load during data transmission and the delay during data transmission can be reduced, the data transmission efficiency and data transmission throughput can be improved, and thus real-time application scenarios with high requirements such as vehicle information collection and analysis, and data interaction between the vehicle and the cloud platform can be better supported, and the user experience of using the vehicle can be guaranteed.

[0232] In some embodiments of the present application, the slave optical module is configured to: in the case of receiving the second electrical signal data sent by the vehicle terminal device, determine the second electrical signal data as the second payload data, configure the second frame header data according to the second payload data, encapsulate the second payload data and the second frame header data, determine the second optical signal data, and send the second optical signal data to the master optical module through the optical splitter.

[0233] Specifically, in the embodiment of the present application, the slave optical module can use the second electrical signal data sent by the vehicle terminal device as a payload, and merge and encapsulate the payload with the pre-configured frame header to obtain the second optical signal data and send the second optical signal data to the master optical module through an optical splitter.

[0234] In this way, in the embodiment of the present application, when receiving the second electrical signal data sent by the vehicle terminal device, the second electrical signal data can be determined as the second payload data, and the second payload data and the configured second frame header data are encapsulated to determine the second optical signal data, and the second optical signal data is sent to the master optical module through an optical splitter, so that the master optical module sends the second optical signal data to the central processing subsystem, thereby completing the transparent transmission of the second electrical signal data between the vehicle terminal device and the central processing subsystem.

[0235] In addition, it can be understood that in the embodiment of the present application, the specific content of the electrical signal data can be set according to the actual situation. For example, in one example, both the first electrical signal data and the second electrical signal data include all types of data frames in the data link layer and all types of data streams in the physical layer.

[0236] Specifically, in one example, the electrical signal data includes data link layer packets (DLLP) in the data link layer, transaction layer packets (TLP) with a frame header and a frame tail added in the data link layer, data link layer payloads (DLLP) with a frame header and a frame tail added in the physical layer logical sub-block, data link layer packets with a frame header and a frame tail added in the non-flit mode in the physical layer logical sub-block, and flit data frames in the physical layer logical sub-block.

[0237] More specifically, when the first payload data is the XGEM Payload in the XGEM frame, there are five types of the first payload data in total. One is the DLLP in the data link layer. The second is the TLP in the data link layer, that is, the data packet obtained by adding the frame headers and trailers of the data link layer to the TLP in the Transaction Layer. The third is the TLP with different frame headers and trailers added in the Physical Layer in the 8b / 10b or 128b / 130b encoding form in the Non-Flit mode. The fourth is the DLLP with different frame headers and trailers added in the Physical Layer in the 8b / 10b or 128b / 130b encoding form in the Non-Flit mode. The fifth is the flit data frame of the physical layer logic sub-block in the 8b / 10b, 128b / 130b, or 1b / 1b encoding mode in the Flit mode. In the structure of this frame, the TLP and DLP have fixed positions, where the TLP is the data frame of the transaction layer, and the DLP (In Flit Mode, the Data Link Layer Payload within a Flit) is the DLLP in the Flit mode.

[0238] In addition, it can be understood that in the embodiments of the present application, the configurable parameters of the frame header data can also be set according to the actual situation.

[0239] In some embodiments of the present application, both the first frame header data and the second frame header data include a first parameter, and the first parameter is used to identify the number of payload data in the optical signal data.

[0240] In some embodiments of the present application, both the first frame header data and the second frame header data include a second parameter, and the second parameter is used to identify the fragmentation state of the payload data.

[0241] In some embodiments of the present application, both the first frame header data and the second frame header data include a third parameter, and the third parameter is used to identify the corresponding fragmentation sequence number of each piece after the payload data is fragmented.

[0242] In some embodiments of the present application, both the first frame header data and the second frame header data include a fourth parameter, and the fourth parameter is used to identify the source of the payload data.

[0243] In some embodiments of the present application, both the first frame header data and the second frame header data include a fifth parameter, and the fifth parameter is used to store device identification information.

[0244] In one example, both the first frame header data and the second frame header data are at least one of the above-mentioned first parameter, second parameter, third parameter, fourth parameter, and fifth parameter.

[0245] In one example, specifically refer to Figure 26 , Figure 26 which is a schematic diagram of an application scenario in some embodiments of the present application. That is, when the first payload data is the XGEM Payload in the XGEM frame, the configurable parameters in the frame header data include the PLI field (i.e., the first parameter), the FF field (i.e., the second parameter), the FSN field (i.e., the third parameter), the MSN field (i.e., the fourth parameter), and the XGEM port-ID field (i.e., the fifth parameter).

[0246] Among them, the size of the PLI field is 14 bits, which can be used to indicate the payload length and the number of control frames, accurate to bytes. It should be noted that in the Flit mode, the PLI bit can be set to a fixed value to control the number of physical layer logical sub-block data streams in an XGEM frame, that is, the number of the first payload data. It can be understood that in the embodiments of the present application, multiple physical layer logical sub-block data streams (each 256 Bytes) can be placed in the payload of an XGEM frame for transmission together, and the specific number of the transmitted physical layer logical sub-blocks can be controlled by the PLI. When the PLI field is used as a parameter for frame number control, the bit value of the PLI field should be a multiple of decimal 256 after being converted to a decimal value. For example, if n physical layer logical sub-block data streams are to be transmitted, the PLI bit value is set to n×256 in binary, where n is less than or equal to 529.

[0247] The size of the FF field is 2 bits, which is used to indicate the fragmentation status of the first payload data, that is, whether the first payload data is fragmented.

[0248] The size of the FSN field is 6 bits, which is used to indicate the fragmentation sequence number corresponding to the first payload data.

[0249] The size of the MSN field is 2 bits, which is used to indicate the data source, that is, the source of the first payload data or the electrical signal data.

[0250] It can be understood that the unpacking process of the optical signal data can be performed according to the respective parameters in the frame header data. Therefore, based on the configuration of the respective parameters in the frame header data, the robust execution of unpacking the optical signal data to obtain the electrical signal data can be ensured to a certain extent.

[0251] In some embodiments of the present application, the master optical module includes an electrical signal interface, and the above step 01 includes:

[0252] Receiving the first electrical signal data according to the electrical signal interface of the master optical module.

[0253] The processing unit according to the embodiment of the present application is configured to receive the first electrical signal data according to the electrical signal interface of the master optical module.

[0254] To illustrate the embodiments of the present application more clearly, please refer to Figure 27 , Figure 27 which is a schematic diagram of an application scenario in some embodiments of the present application. Specifically, in an example as shown in Figure 27 , both the master optical module and the slave optical module include an electrical signal interface 210, a signal processing chip 220, a driver 230, a laser 240, a demultiplexer 250, a photodetector 260, an amplifier 270, a clock recovery chip 280, and an optical signal interface 290.

[0255] Furthermore, the electrical signal interface can be used for receiving and transmitting electrical signal data. Therefore, for the master optical module, the master optical module can receive the first electrical signal data sent by the central processing subsystem through the signal interface, and perform photoelectric conversion and other processing on the received first electrical signal data.

[0256] Thus, in the embodiments of the present application, the master optical module can receive the first electrical signal data sent by the central processing subsystem through the electrical signal interface, and further perform photoelectric conversion and other processing on the first electrical signal data sent by the central processing subsystem.

[0257] In some embodiments of the present application, the master optical module includes a signal processing chip. Furthermore, the above step 03 includes:

[0258] Packaging and encapsulating the target device identification information and the first electrical signal data to obtain a first downlink physical frame, and performing differential signal conversion on the first downlink physical frame to obtain a first downlink electrical signal.

[0259] The processing unit in the embodiments of the present application is configured to package and encapsulate the target device identification information and the first electrical signal data to obtain a first downlink physical frame, and perform differential signal conversion on the first downlink physical frame to obtain a first downlink electrical signal.

[0260] To clearly illustrate the embodiments of the present application, please refer to Figure 27 again. That is, as shown in Figure 27As shown, after the central processing subsystem sends the first electrical signal data to the master optical module, the first electrical signal data is transmitted to the signal processing chip of the master optical module via the electrical signal interface of the master optical module. After determining the target device identification information corresponding to the first electrical signal data based on the first electrical signal data, the signal processing chip of the master optical module can jointly package and frame the first electrical signal data and the target device identification information to obtain an XGS-PON downstream physical frame (Downstream PHY frame) carrying the first electrical signal data and the target device identification information, that is, the first downstream physical frame. Then, the signal processing chip of the master optical module can also perform differential signal conversion on the first downstream physical frame to obtain the first downstream physical frame in the form of a differential electrical signal, that is, the above-mentioned first downstream electrical signal, so as to complete the data download from the central processing subsystem to the vehicle terminal device through the first downstream electrical signal in subsequent steps.

[0261] In one example, the signal processing chip of the master optical module includes a storage unit for storing mapping relationship data. Therefore, in the embodiment of the present application, when receiving the first electrical signal data, the signal processing signal of the master optical module can also determine the pre-stored mapping relationship data, and determine the above-mentioned target device identification information through the mapping relationship data and the first electrical signal data, and after obtaining the target device identification information, jointly package and frame the first electrical signal data and the target device identification information to obtain the above-mentioned first downstream physical frame.

[0262] Thus, in some embodiments of the present application, the master optical module can perform packaging and encapsulation processing on the first electrical signal data received by the electrical signal and the target device identification information through the signal processing chip to obtain the first downstream physical frame, perform differential signal conversion on the first downstream physical frame to obtain the first downstream electrical signal, and complete the data download from the central processing subsystem to the vehicle terminal device through the first downstream electrical signal.

[0263] In some embodiments of the present application, the master optical module includes a driver, and thus step 03 above includes:

[0264] Amplify the first downstream electrical signal according to the driver of the master optical module to obtain the first amplified electrical signal.

[0265] The processing unit in the embodiment of the present application is configured to amplify the first downstream electrical signal according to the driver of the master optical module to obtain the first amplified electrical signal.

[0266] Specifically, in the embodiment of the present application, after the master optical module converts the first electrical signal data sent by the central processing subsystem into the first downlink electrical signal through the signal processing chip, the first downlink electrical signal will be transmitted to the driver of the master optical module. After receiving the first downlink electrical signal, the driver of the master optical module can amplify the first downlink electrical signal to obtain the amplified first downlink electrical signal, that is, the above-mentioned first amplified electrical signal, to meet the subsequent signal processing requirements.

[0267] Thus, in the embodiment of the present application, the driver of the master optical module can amplify the first downlink electrical signal output by the signal processing signal to obtain the first amplified electrical signal to meet the subsequent signal processing requirements.

[0268] In some embodiments of the present application, the master optical module includes a laser. Furthermore, the above step 03 includes:

[0269] Perform optoelectronic conversion processing on the first amplified electrical signal according to the laser of the master optical module to obtain a downlink optical signal.

[0270] The processing unit in the embodiment of the present application is configured to perform optoelectronic conversion processing on the first amplified electrical signal according to the laser of the master optical module to obtain a downlink optical signal.

[0271] Specifically, in the embodiment of the present application, when the master optical module amplifies the first downlink electrical signal based on the driver to obtain the first amplified electrical signal that can match the requirements of the input electrical signal interface of the laser, the first amplified electrical signal can be transmitted to the laser of the master optical module. Then, the master optical module can perform optoelectronic conversion processing on the first amplified electrical signal through the laser to convert the first amplified electrical signal into optical signal data, that is, the above-mentioned downlink optical signal.

[0272] Thus, in the embodiment of the present application, the master optical module can perform optoelectronic conversion processing on the first amplified electrical signal output by the driver through the laser to convert the first amplified electrical signal into a downlink optical signal, thereby completing the conversion from electrical signal to optical signal.

[0273] In some embodiments of the present application, the master optical module includes a demultiplexer and an optical signal interface. The above step 03 includes:

[0274] Send the downlink optical signal to the optical splitter according to the demultiplexer and the optical signal interface of the master optical module.

[0275] The processing unit in the embodiment of the present application is configured to send the downlink optical signal to the optical splitter according to the demultiplexer and the optical signal interface of the master optical module.

[0276] Specifically, in the embodiments of the present application, after the master optical module completes the optoelectronic conversion of the first amplified electrical signal to obtain the downstream optical signal, the downstream optical signal can be sent to the optical splitter through the internal optical demultiplexer and optical signal interface for optical signal transmission.

[0277] Thus, in the embodiments of the present application, the master optical module can send the downstream optical signal to the optical splitter through the internal optical demultiplexer and optical signal interface to complete the optical signal transmission.

[0278] In some embodiments of the present application, step 03 includes:

[0279] Forward the downstream optical signal to the slave optical module according to the optical splitter.

[0280] The processing unit in the embodiments of the present application is configured to forward the downstream optical signal to the slave optical module according to the optical splitter.

[0281] Specifically, in the embodiments of the present application, when the optical splitter in the optical communication component receives the optical signal sent by the master optical module, that is, the downstream optical signal, the optical splitter can broadcast the downstream optical signal to each slave optical module, so that each slave optical module can process or ignore the received downstream optical signal according to its needs.

[0282] Thus, in the embodiments of the present application, the downstream optical signal can be forwarded to the slave optical module through the optical splitter, making the transmission of the downstream optical signal proceed steadily.

[0283] In some embodiments of the present application, the slave optical module includes an optical signal interface. Furthermore, the above step 03 includes:

[0284] Receive the downstream optical signal according to the optical signal interface of the slave optical module.

[0285] The processing unit in the embodiments of the present application is configured to receive the downstream optical signal according to the optical signal interface of the slave optical module.

[0286] Specifically, in the embodiments of the present application, the slave optical module can receive the downstream optical signal forwarded by the optical splitter based on the internal optical signal interface. It can be understood that when the slave optical module receives the downstream optical signal, it indicates that the transmission process of the downstream optical signal ends. Therefore, in the subsequent process, the slave optical module can process the downstream optical signal according to the pre-set policy to gradually restore it to the first electrical signal data, or ignore the downstream optical signal.

[0287] Thus, in the embodiments of the present application, the slave optical module can receive the downstream optical signal forwarded by the optical splitter through its own optical signal interface.

[0288] In some embodiments of the present application, the slave optical module includes a demultiplexer and a photodetector. Furthermore, step 03 described above includes:

[0289] Forward the downstream optical signal to the photodetector of the slave optical module according to the demultiplexer of the slave optical module.

[0290] The processing unit according to the embodiment of the present application is configured to forward the downstream optical signal to the photodetector of the slave optical module according to the demultiplexer of the slave optical module.

[0291] Specifically, in the embodiment of the present application, when the optical signal interface of the slave optical module receives the input of the downstream optical signal, the downstream optical signal is transmitted through the optical signal interface to the demultiplexer inside the slave optical module, and then is demultiplexed by the demultiplexer and transmitted to the photodetector inside the slave optical module.

[0292] In this way, in the embodiment of the present application, the photodetector inside the slave optical module can receive the downstream optical signal forwarded by the demultiplexer, and then can perform corresponding processing on the downstream optical signal.

[0293] In some embodiments of the present application, step 03 described above includes:

[0294] Perform photoelectric conversion processing on the downstream optical signal according to the photodetector of the slave optical module to obtain a second downstream electrical signal.

[0295] The processing unit according to the embodiment of the present application is configured to perform photoelectric conversion processing on the downstream optical signal according to the photodetector of the slave optical module to obtain a second downstream electrical signal.

[0296] Specifically, in the embodiment of the present application, after the photodetector inside the slave optical module receives the downstream optical signal, it can perform photoelectric conversion processing on the downstream optical signal to convert the downstream optical signal into an electrical signal, that is, the above-mentioned second downstream electrical signal.

[0297] In one example, the second downstream electrical signal is the same as the above-mentioned first downstream electrical signal.

[0298] In this way, in the embodiment of the present application, the slave optical module can perform photoelectric conversion processing on the downstream optical signal forwarded by the demultiplexer through the internal photodetector to obtain a second downstream electrical signal, thereby completing the conversion of the optical signal to the electrical signal.

[0299] In some embodiments of the present application, the slave optical module includes an amplifier. Furthermore, step 03 described above includes:

[0300] Amplify the transimpedance and limiting of the second downstream electrical signal according to the amplifier of the slave optical module to obtain a second amplified electrical signal.

[0301] The processing unit according to the embodiment of the present application is configured to amplify the transimpedance and limiting of the second downlink electrical signal according to the amplifier of the slave optical module to obtain a second amplified electrical signal.

[0302] Specifically, in the embodiment of the present application, after the photodetector converts the downlink optical signal into a second downlink electrical signal, the second downlink electrical signal can be input to the amplifier. When the amplifier receives the second downlink electrical signal, it can amplify the second downlink electrical signal by transimpedance and limiting to obtain the above-mentioned second amplified electrical signal.

[0303] In Figure 27 In an example as shown, the amplifiers of the slave optical module and the master optical module both include a transimpedance amplifier and a limiting amplifier. Furthermore, during the data downlink process, the second downlink electrical signal can first be transimpedance amplified by the transimpedance amplifier of the slave optical module, and then limited amplified by the limiting amplifier of the slave optical module, thereby obtaining the second downlink physical frame in the form of a differential signal as described above.

[0304] It can be understood that the signal processing chip of the master optical module outputs the first downlink physical frame in the form of a differential electrical signal, that is, after outputting the above-mentioned first downlink electrical signal, the first downlink electrical signal is converted into an optical signal. Therefore, in the embodiment of the present application, when the downlink optical signal is restored to an electrical signal, the restored electrical signal can exist in the form of a differential signal, that is, the second downlink physical frame in the form of a differential signal.

[0305] In this way, in the embodiment of the present application, the slave optical module can amplify the second downlink electrical signal output by the photodetector by transimpedance and limiting through the internal amplifier, thereby obtaining the second downlink physical frame in the form of a differential signal.

[0306] In some embodiments of the present application, the slave optical module includes a signal processing chip. Furthermore, the above step 03 includes:

[0307] According to the signal processing chip of the slave optical module, when the target device identification information matches the pre-stored device identification information, the second downlink physical frame in the form of a differential signal is unpacked to obtain the first electrical signal data, and the first electrical signal data is sent to the target vehicle terminal device.

[0308] The processing unit according to the embodiment of the present application is configured to, according to the signal processing chip of the slave optical module, when the target device identification information matches the pre-stored device identification information, unpack the second downlink physical frame in the form of a differential signal to obtain the first electrical signal data, and send the first electrical signal data to the target vehicle terminal device.

[0309] Specifically, in the embodiment of the present application, after the slave optical module amplifies the second downlink electrical signal through an internal amplifier to obtain a second downlink physical frame in differential signal form (such as an XGS-PON downlink physical frame), the second downlink physical frame in differential signal form can be transmitted to the signal processing chip of the slave optical module.

[0310] Then, the signal processing chip reads the frame header in the second downlink physical frame in differential signal form to obtain the target device identification information therein.

[0311] Then, the signal processing chip compares the read target device identification information with each device identification information pre-stored in itself to determine whether the target device identification information matches any of the device identification information pre-stored in itself.

[0312] If it does not match any of the device identification information, the signal processing chip can discard the second downlink physical frame in differential signal form. Conversely, if it matches at least one device identification information, the signal processing chip can unpack the second downlink physical frame in differential signal form to obtain the payload unpacked therefrom (i.e., the PCIe data frame), and use the payload data as the first electrical signal data generated by the central processing subsystem. Finally, the signal processing chip of the slave optical module can send the first electrical signal data to the vehicle terminal device through the electrical signal interface.

[0313] In one example, the device identification information of the vehicle terminal device connected to the slave optical module is stored in the signal processing chip of the slave optical module.

[0314] In this way, in the embodiment of the present application, the slave optical module can unpack the second downlink physical frame in differential signal form to obtain the first electrical signal data when the target device identification information matches the pre-stored device identification information through the internal signal processing chip, and send the first electrical signal data to the target vehicle terminal device, thereby completing the data downlink between the central processing subsystem and the vehicle terminal device.

[0315] In some embodiments of the present application, the slave optical module includes an electrical signal interface. Furthermore, the method further includes:

[0316] Receiving the second electrical signal data sent by the vehicle terminal device according to the electrical signal interface of the slave optical module.

[0317] The processing unit in the embodiment of the present application is configured to receive the second electrical signal data sent by the vehicle terminal device according to the electrical signal interface of the slave optical module.

[0318] Specifically, in the process of data uplink (i.e., the process in which the vehicle terminal device reports information to the central processing subsystem), the vehicle terminal device can generate second electrical signal data and send the second electrical signal data to the slave optical module. Correspondingly, the slave optical module can receive the second electrical signal data based on the electrical signal interface inside itself to perform corresponding processing such as optoelectronic conversion processing, etc.

[0319] In this way, in the embodiment of the present application, the slave optical module can receive the second electrical signal data sent by the vehicle terminal device based on the internal electrical signal interface for subsequent processing.

[0320] In some embodiments of the present application, the slave optical module includes a signal processing chip. Furthermore, the method further includes:

[0321] According to the signal processing chip of the slave optical module, the second electrical signal data is packetized and encapsulated to obtain a first uplink physical burst frame, and the first uplink physical burst frame is subjected to differential signal conversion to obtain a first uplink electrical signal.

[0322] The processing unit in the embodiment of the present application is configured to, according to the signal processing chip of the slave optical module, packetize and encapsulate the second electrical signal data to obtain a first uplink physical burst frame, and perform differential signal conversion on the first uplink physical burst frame to obtain a first uplink electrical signal.

[0323] Specifically, in the embodiment of the present application, after the optical signal interface of the slave optical module receives the second electrical signal data sent by the vehicle terminal device, the second electrical signal data is transmitted through the optical signal interface to the signal processing chip of the slave optical module for the signal processing chip of the slave optical module to process.

[0324] Correspondingly, the second electrical signal data is packetized and framed to obtain an XGS-PON upstream physical burst frame (Upstream FS burst frame) carrying the second electrical signal data packet, that is, the first uplink physical frame.

[0325] In addition, the signal processing chip of the slave optical module can also perform differential signal conversion on the first uplink physical frame to obtain a first uplink physical frame in the form of a differential electrical signal, that is, the above-mentioned first uplink electrical signal, and then subsequent processing is performed through the first uplink electrical signal.

[0326] In this way, in the embodiment of the present application, the slave optical module can, through the internal signal processing chip, packetize and encapsulate the second electrical signal data received by the electrical signal interface to obtain a first uplink physical burst frame, and perform differential signal conversion on the first uplink physical burst frame to obtain a first uplink electrical signal.

[0327] In some embodiments of the present application, the slave optical module includes a driver. Furthermore, the method further includes:

[0328] Amplify the first upstream electrical signal according to the driver of the slave optical module to obtain a second amplified electrical signal.

[0329] The processing unit according to the embodiment of the present application is configured to amplify the first upstream electrical signal according to the driver of the slave optical module to obtain a second amplified electrical signal.

[0330] Specifically, in the embodiment of the present application, after the slave optical module converts the second electrical signal data into the above-mentioned first upstream electrical signal based on the internal signal processing chip, the first upstream electrical signal can be transmitted to the driver inside the slave optical module. Then, the driver inside the slave optical module can amplify the first upstream electrical signal to make the first upstream electrical signal meet the subsequent signal processing requirements and obtain a second amplified electrical signal.

[0331] In this way, in the embodiment of the present application, the slave optical module can amplify the first upstream electrical signal output by the signal processing chip through the internal driver, thereby obtaining a second amplified electrical signal.

[0332] In some embodiments of the present application, the slave optical module includes a laser. Furthermore, the method further includes:

[0333] Perform optoelectronic conversion processing on the second amplified electrical signal according to the laser of the slave optical module to obtain an upstream optical signal.

[0334] The processing unit according to the embodiment of the present application is configured to perform optoelectronic conversion processing on the second amplified electrical signal according to the laser of the slave optical module to obtain an upstream optical signal.

[0335] Specifically, after the driver inside the slave optical module amplifies the first upstream electrical signal to obtain a second amplified electrical signal that can match the input electrical signal interface requirements of the laser, the second amplified electrical signal will be transmitted to the laser of the slave optical module. Correspondingly, the laser can perform optoelectronic conversion processing on the second amplified electrical signal to convert the second amplified electrical signal into an optical signal, that is, the above-mentioned upstream optical signal.

[0336] In this way, in the embodiment of the present application, the laser inside the slave optical module can perform optoelectronic conversion processing on the second amplified electrical signal output by the driver, thereby obtaining an upstream optical signal.

[0337] In some embodiments of the present application, the slave optical module includes a demultiplexer and an optical signal interface. Furthermore, the method further includes:

[0338] Send an upstream optical signal to the optical splitter according to the optical demultiplexer and the optical signal interface of the slave optical module.

[0339] The processing unit according to the embodiment of the present application is configured to send an upstream optical signal to the optical splitter according to the optical demultiplexer and the optical signal interface of the slave optical module.

[0340] Specifically, in the embodiment of the present application, after the slave optical module converts the second amplified electrical signal into the above-mentioned upstream optical signal based on the internal laser, the slave optical module can send the upstream optical signal to the optical splitter based on its own optical demultiplexer and optical signal interface for the transmission of the upstream optical signal.

[0341] In this way, in the embodiment of the present application, the slave optical module can send the upstream optical signal output by the laser to the optical splitter based on its own optical demultiplexer and optical signal interface for the signal transmission of the upstream optical signal.

[0342] In some embodiments of the present application, the method further includes:

[0343] Forward the upstream optical signal to the master optical module according to the optical splitter.

[0344] The processing unit according to the embodiment of the present application is configured to forward the upstream optical signal to the master optical module according to the optical splitter.

[0345] Specifically, in the embodiment of the present application, the optical splitter in the optical communication component can forward the upstream optical signal to the master optical module to complete the transmission of the upstream optical signal when receiving the upstream optical signal sent by the slave optical module.

[0346] In this way, in the embodiment of the present application, the upstream optical signal can be forwarded to the master optical module through the optical splitter, thereby completing the signal transmission of the upstream optical signal.

[0347] In some embodiments of the present application, the master optical module includes an optical signal interface. Furthermore, the method further includes:

[0348] Receive the upstream optical signal according to the optical signal interface of the master optical module.

[0349] The processing unit according to the embodiment of the present application is configured to receive the upstream optical signal according to the optical signal interface of the master optical module.

[0350] Specifically, in the embodiment of the present application, the master optical module can receive the upstream optical signal forwarded by the optical splitter based on its own optical signal interface, and then can perform corresponding processing on the upstream optical signal, such as photoelectric conversion or signal amplification.

[0351] It can be understood that when the master optical module receives the upstream optical signal based on the optical signal interface, it indicates that the signal transmission process of the upstream optical signal ends. Therefore, in the subsequent process, the upstream optical signal will be gradually restored to the second electrical signal data by the processing of the master optical module.

[0352] Thus, in the embodiment of the present application, the master optical module can receive the upstream optical signal forwarded by the optical splitter through its own optical signal interface to perform subsequent processing on the upstream optical signal.

[0353] In some embodiments of the present application, the master optical module includes a demultiplexer and a photodetector. Furthermore, the method further includes:

[0354] Forward the upstream optical signal to the photodetector of the slave optical module according to the demultiplexer of the slave optical module.

[0355] The processing unit in the embodiment of the present application is configured to forward the upstream optical signal to the photodetector of the slave optical module according to the demultiplexer of the slave optical module.

[0356] Specifically, in the embodiment of the present application, after the optical signal interface of the master optical module receives the input of the upstream optical signal, the upstream optical signal is transmitted through the optical signal interface to the demultiplexer inside the master optical module, and then is demultiplexed by the demultiplexer and transmitted to the photodetector inside the master optical module.

[0357] Thus, in the embodiment of the present application, the photodetector inside the master optical module can receive the upstream optical signal based on the demultiplexer, so as to perform corresponding processing on the upstream optical signal.

[0358] In some embodiments of the present application, the master optical module includes a photodetector. Furthermore, the method further includes:

[0359] Perform photoelectric conversion processing on the upstream optical signal according to the photodetector of the master optical module to obtain a second upstream electrical signal.

[0360] The processing unit in the embodiment of the present application is configured to perform photoelectric conversion processing on the upstream optical signal according to the photodetector of the master optical module to obtain a second upstream electrical signal.

[0361] Specifically, in the embodiment of the present application, after the photodetector inside the master optical module receives the upstream optical signal, it can perform photoelectric conversion processing on the upstream optical signal to convert the upstream optical signal into an electrical signal, that is, the above-mentioned second upstream electrical signal.

[0362] In one example, the second upstream electrical signal is the same as the above-mentioned first upstream electrical signal.

[0363] Thus, in the embodiments of the present application, the master optical module can perform photoelectric conversion processing on the upstream optical signal forwarded by the demultiplexer through the internal photodetector to obtain a second upstream electrical signal, thereby completing the conversion of the optical signal to the electrical signal.

[0364] In some embodiments of the present application, the master optical module includes an amplifier. Furthermore, the method further includes:

[0365] According to the amplifier of the master optical module, amplify the transimpedance and limiting of the second upstream electrical signal to obtain a second upstream physical frame in the form of a differential signal.

[0366] The processing unit in the embodiments of the present application is configured to amplify the transimpedance and limiting of the second upstream electrical signal according to the amplifier of the master optical module to obtain a second upstream physical frame in the form of a differential signal.

[0367] Specifically, in the embodiments of the present application, after the photodetector converts the upstream optical signal into a second upstream electrical signal, the second upstream electrical signal will be input to the amplifier. When the amplifier receives the second upstream electrical signal, it can amplify the transimpedance and limiting of the second upstream electrical signal to obtain a second upstream physical frame in the form of a differential signal.

[0368] In Figure 27 In an example as shown, both the amplifier of the master optical module and the amplifier of the master optical module include a transimpedance amplifier and a limiting amplifier. Furthermore, during the data upstream process, the second upstream electrical signal can first be subjected to transimpedance amplification by the transimpedance amplifier of the master optical module, and then subjected to limiting amplification by the limiting amplifier of the master optical module.

[0369] Thus, in the embodiments of the present application, the master optical module can amplify the transimpedance and limiting of the second upstream electrical signal output by the photodetector through the internal amplifier, thereby obtaining a second upstream physical frame in the form of a differential signal.

[0370] In some embodiments of the present application, the master optical module includes a signal processing chip. Furthermore, the method further includes:

[0371] According to the signal processing chip of the master optical module, perform unpacking processing on the second upstream physical frame in the form of a differential signal to obtain second electrical signal data, and send the second electrical signal data to the central processing subsystem.

[0372] The processing unit in the embodiments of the present application is configured to perform unpacking processing on the second upstream physical frame in the form of a differential signal according to the signal processing chip of the master optical module to obtain second electrical signal data, and send the second electrical signal data to the central processing subsystem.

[0373] Specifically, in the embodiment of the present application, after the master optical module amplifies the second upstream electrical signal through an internal amplifier to obtain a second upstream physical frame in the form of a differential signal, the second upstream physical frame in the form of a differential signal can be transmitted to the signal processing chip of the master optical module.

[0374] Next, the signal processing chip unpacks the second upstream physical frame in the form of a differential signal to unpack the payload data therein, that is, to obtain the second electrical signal data of the vehicle terminal device. Furthermore, the signal processing chip of the master optical module can send the second electrical signal data to the central processing subsystem through an electrical signal interface.

[0375] In this way, in the embodiment of the present application, the master optical module can unpack the second upstream physical frame in the form of a differential signal output by the amplifier through the internal signal processing chip to obtain the second electrical signal data of the central processing subsystem and can send the second electrical signal data to the central processing subsystem, thereby completing the data upstream between the vehicle terminal device and the central processing subsystem.

[0376] It can be understood that in the embodiment of the present application, the functions, models, etc. of the electrical signal interfaces, signal processing chips, drivers, lasers, demultiplexers, photodetectors, amplifiers, and optical signal interfaces in the master optical module and the slave optical module can all be set according to actual situations. Therefore, to clearly illustrate the electrical signal interfaces, signal processing chips, drivers, lasers, demultiplexers, photodetectors, amplifiers, and optical signal interfaces in the embodiment of the present application, next, Figure 27 Taking... as an example, the above-mentioned electrical signal interfaces, signal processing chips, drivers, lasers, demultiplexers, photodetectors, amplifiers, and optical signal interfaces are used to illustrate these components.

[0377] In one example, the signal processing chip 220 is a Media Access Control (MAC) chip.

[0378] In one example, the driver 230 in the master optical module 1201 is a VCSEL (Vertical Cavity Surface Emitting Laser) Driver.

[0379] In one example, the laser 240 in the master optical module 1201 is a single-mode laser such as a Distributed Feedback Laser (DFB), which only supports single-mode optical signals.

[0380] In another example, the laser 240 is a VCSEL laser. It can be understood that the performance of single-mode lasers such as DFB deteriorates severely at high temperatures, with a relatively high risk of failure, and the cost of single-mode lasers and the single-mode optical fibers used in the associated network is relatively high. Therefore, when a VCSEL laser is used as a light source, it can support multimode optical signal transmission, has better high-temperature performance, and lower networking costs.

[0381] In an example such as Figure 27 shown, the amplifier 270 includes a transimpedance amplifier 271 and a limiting amplifier 272.

[0382] More specifically, in one example, the master optical module 1201 includes a burst-mode transimpedance amplifier (BM-TIA), and the slave optical module 1203 includes a transimpedance amplifier (TIA).

[0383] Similarly, in an example such as Figure 27 shown, the master optical module includes a burst-mode limiting amplifier (BM-LA), and the slave optical module includes a limiting amplifier (LA).

[0384] In one example, the optical signal interface 290 supports optical signal communication with single-fiber bidirectional transmission.

[0385] In one example, the wavelength division multiplexer 250 is used to separate the upstream / downstream wavelengths to support single-fiber bidirectional transmission of optical signals.

[0386] In one example, the clock recovery chip 280 in the master optical module is a burst-mode clock and data recovery chip (BM-CDR), and the clock recovery chip 280 in the slave optical module 1203 is a clock and data recovery chip (CDR).

[0387] In one example, the photodetector 260 (Photodetector, PD) includes a P-type semiconductor - intrinsic semiconductor - N-type semiconductor photodiode (Positive-Intrinsic-Negative Photodiode, PIN-photodetector). In another example, the photodetector 260 includes an avalanche photodiode (Avalanche Photodiode, APD-photodetector).

[0388] It can also be understood that, in the embodiments of the present application, the signal processing chips 220 of the master optical module and the slave optical module can both be used for receiving, packing, unpacking, and transmitting electrical signals. Among them, the signal processing chip 220 of the master end can also be used for data communication control of the master optical module, including but not limited to adapting to network delay and bandwidth allocation, etc. The communication between the master optical module and external devices is also carried out through the signal processing chip 220. As Figure 27 shown, the signal processing chip 220 is connected to the electrical signal interface 210 and can be further connected to external devices such as a central processing subsystem.

[0389] In addition, in the embodiments of the present application, the output end of the signal processing chip 220 is connected to the driver 230, and the output end of the driver 230 is connected to the laser 240. The signal processing chip 220 packs and converts the data and then issues the electrical signal carrying the first payload data in the form of a differential electrical signal. The driver 230 receives the electrical signal and amplifies it to match the requirements of the input electrical signal interface 210 of the laser 240. The laser 240 converts the drive electrical signal into an optical signal. The optical signal is coupled to the outside through the demultiplexer 250 and the optical signal interface 290.

[0390] Furthermore, in the embodiments of the present application, the optical signal interface 290 is connected to the demultiplexer 250, the demultiplexer 250 is connected to the photodetector 260, the photodetector 260 is connected to the amplifier 270, and the amplifier 270 is connected to the signal processing chip 220 via the clock recovery chip 280. After receiving the optical signal, the optical signal interface 290 transmits it to the photodetector 260 through the demultiplexer 250. The photodetector converts the optical signal into a differential electrical signal form and transmits it to the amplifier 270. The transimpedance amplifier 271 performs transimpedance amplification on the differential electrical signal, and the limiting amplifier 272 performs limiting amplification on the differential electrical signal. The differential electrical signal is transmitted to the signal processing chip 220 via the clock recovery chip 280. The signal processing chip 220 unpacks the data, and the decoded electrical signal is transmitted to the outside from the electrical signal interface 210.

[0391] It can also be understood that both the master optical module and the slave optical module support the reception and transmission of upstream burst data. Specifically, the input end of the photodetector 260 is connected to the demultiplexer 250, and the output end is connected to the transimpedance amplifier 271. Subsequently, it is sequentially connected to the limiting amplifier 272, the clock recovery chip 280, and the signal processing chip 220. The upstream burst optical signal is coupled into the optical signal interface 290 through the multimode optical fiber, and then input into the photodetector 260 through the demultiplexer 250. The photodetector 260 performs optoelectronic signal conversion, converting the burst optical signal into a burst electrical signal. The transimpedance amplifier 271 is used to transimpedance amplify the burst electrical signal converted by the photodetector 260, the limiting amplifier 272 is used to limit-amplify the burst electrical signal, the clock recovery chip 280 is used to recover the data clock of the burst electrical signal, and the upstream signal is introduced into the signal processing chip 220.

[0392] In the process of receiving and transmitting the downstream signal data frame, the input end of the photodetector 260 is connected to the demultiplexer 250, and the output end is connected to the transimpedance amplifier 271. Subsequently, it is sequentially connected to the limiting amplifier 272, the clock recovery chip 280, and the signal processing chip 220. The downstream optical signal is coupled into the optical signal interface 290 through the multimode optical fiber, and then input into the photodetector 260 through the demultiplexer 250. The photodetector 260 performs optoelectronic signal conversion, converting the optical signal into an electrical signal. The transimpedance amplifier 271 is used to transimpedance amplify the electrical signal converted by the photodetector 260, the limiting amplifier 272 is used to limit-amplify the electrical signal, the clock recovery chip 280 is used to recover the data clock of the electrical signal, and the downstream signal is introduced into the signal processing chip 220. The signal processing chip 220 processes the downstream signal and forwards it to the vehicle terminal device connected thereto.

[0393] Optionally, in some embodiments of the present application, the signal processing chip of the master optical module includes a storage unit for storing mapping relationship data. That is, the mapping relationship data can all be stored in the memory of the signal processing chip of the master optical module, such as Nor Flash.

[0394] Furthermore, when the PCIe data frame arrives at the signal processing chip of the master optical module, the signal processing chip will perform corresponding operations according to the currently stored mapping table type. Specifically, if only the first-level mapping table is stored in the memory, the MAC chip directly looks up the corresponding ONU-UD in the mapping table after parsing the address bits of the PCIe data frame, and assigns it to the XGEM port-ID field of the XGEM frame header.

[0395] If the memory stores a first-level and a second-level mapping table, the signal processing chip first parses the PCIe data frame address, looks up the corresponding second-level mapping table address according to the classification mode of the second-level mapping table in the first-level mapping table, and then queries the corresponding ONU-ID in the second-level mapping table and assigns it to the XGEM port-ID field of the XGEM frame header.

[0396] An embodiment of the present application also provides an electronic device. The electronic device includes the above control device.

[0397] An embodiment of the present application also provides a vehicle. The vehicle includes the above control device, or includes the above electronic device.

[0398] In the description of this specification, the descriptions with reference to terms such as "specifically", "further", "specially", "understandably", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiments or examples. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples.

[0399] Any process or method description shown in the flowchart or described in other ways herein can be understood as representing a module, segment or part of code including one or more executable instructions for implementing a specific logical function or process, and the scope of the preferred embodiments of the present application includes additional implementations, where the functions can be executed in a manner that is not shown or discussed in sequence, including in a substantially simultaneous manner or in a reverse order according to the functions involved, which should be understood by those skilled in the art of the embodiments of the present application.

[0400] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those of ordinary skill in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present application.

Claims

1. A data transmission method based on optical communication, characterized in that, An optical communication component for a vehicle-mounted system, the system further including a central processing subsystem and a plurality of vehicle terminal devices connected to the optical communication component, the method comprising: Receiving first electrical signal data sent by the central processing subsystem; Determining target device identification information according to the first electrical signal data and pre-determined mapping relationship data between electrical signal data and device identification information, wherein the target device identification information is used to identify a target vehicle terminal device among the plurality of vehicle terminal devices that receives the first electrical signal data; Performing optoelectronic conversion and signal transmission on the target device identification information and the first electrical signal data to send the first electrical signal data to the target vehicle terminal device.

2. The method according to claim 1, wherein The mapping relationship data is used to associate electrical signal frame header data with device identification information. The determining of the target device identification information according to the first electrical signal data and the pre-determined mapping relationship data between electrical signal data and device identification information includes: Performing parsing processing on the first electrical signal data to obtain first electrical signal frame header data; Determining the target device identification information according to the first electrical signal frame header data and the mapping relationship data.

3. The method according to claim 2, wherein The first electrical signal frame header data includes an address field at a target position.

4. The method according to claim 2, wherein The first electrical signal frame header data includes at least one of a bus number field, a function number field, and a device number field.

5. The method according to claim 2, wherein The mapping relationship data includes first mapping relationship sub-data and a plurality of second mapping relationship sub-data. The determining of the target device identification information according to the first electrical signal frame header data and the mapping relationship data includes: Determining, according to the first mapping sub-data and the target attribute of a target field in the first electrical signal frame header data, a target second mapping relationship sub-data among the plurality of second mapping relationship sub-data that is associated with the target attribute, wherein the first mapping sub-data is used to associate the second mapping relationship sub-data with the attribute of the target field; Determining the target device identification information according to the target second mapping relationship sub-data and the value of the target field, wherein the second mapping relationship sub-data is used to associate the device identification information with the value of the target field.

6. The method according to claim 5, wherein The determining, according to the first mapping sub-data and the target attribute of a target field in the first electrical signal frame header data, a target second mapping relationship sub-data among the plurality of second mapping relationship sub-data that is associated with the target attribute includes: Determining, according to the first mapping sub-data, the target attribute, and the current transmission mode of the first electrical signal data, a target second mapping relationship sub-data among the plurality of second mapping relationship sub-data that is associated with the target attribute and associated with the current transmission mode, wherein the first mapping sub-data is used to associate the second mapping relationship sub-data with the attribute of the target field and the transmission mode of the first electrical signal data, and the current transmission mode is a first mode or a second mode.

7. The method according to claim 1, wherein The optical communication component includes at least one master optical module, at least one optical splitter, and multiple slave optical modules that are sequentially connected by optical fibers. The central processing subsystem is electrically connected to the master optical module, and the slave optical module is electrically connected to the vehicle terminal device.

8. The method according to claim 7, wherein The master optical module is configured to: determine first optical signal data according to the target device identification information and the first electrical signal data, and send the first optical signal data to the optical splitter; The optical splitter is configured to: forward the first optical signal data to the multiple slave optical modules; The slave optical module is configured to: parse the received first optical signal data to obtain the target device identification information, and in the case where the target device identification information matches the pre-stored device identification information, determine the first electrical signal data according to the first optical signal data, and send the first electrical signal data to the target vehicle terminal device.

9. The method according to claim 8, wherein The master optical module is configured to: determine the first electrical signal data as first payload data, configure first frame header data according to the first payload data and the target device identification information, encapsulate the first payload data and the first frame header data, determine the first optical signal data, and send the first optical signal data to the optical splitter.

10. The method according to claim 9, characterized in that, The slave optical module is configured to: in the case of receiving the second electrical signal data sent by the vehicle terminal device, determine the second electrical signal data as second payload data, configure second frame header data according to the second payload data, encapsulate the second payload data and the second frame header data, determine second optical signal data, and send the second optical signal data to the master optical module through the optical splitter.

11. The method according to claim 10, characterized in that, Both the first electrical signal data and the second electrical signal data include all types of data frames in the data link layer and all types of data streams in the physical layer.

12. The method according to claim 10, wherein Both the first frame header data and the second frame header data include a first parameter, and the first parameter is used to identify the number of payload data in the optical signal data.

13. The method according to claim 10, wherein Both the first frame header data and the second frame header data include a second parameter, and the second parameter is used to identify the fragmentation state of the payload data.

14. The method according to claim 10, characterized in that, Both the first frame header data and the second frame header data include a third parameter, and the third parameter is used to identify the fragmentation sequence number corresponding to each piece after the payload data is fragmented.

15. The method according to claim 10, characterized in that, Both the first frame header data and the second frame header data include a fourth parameter, and the fourth parameter is used to identify the source of the payload data.

16. The method according to claim 10, wherein Both the first frame header data and the second frame header data include a fifth parameter, and the fifth parameter is used to store device identification information.

17. The method according to claim 7, wherein The master optical module includes an electrical signal interface, and receiving the first electrical signal data sent by the central processing subsystem includes: Receiving the first electrical signal data according to the electrical signal interface of the master optical module.

18. The method according to claim 17, wherein The master optical module includes a signal processing chip, and performing optoelectronic conversion and signal transmission on the target device identification information and the first electrical signal data to send the first electrical signal data to the target vehicle terminal device includes: Package and encapsulate the target device identification information and the first electrical signal data to obtain a first downlink physical frame, and perform differential signal conversion on the first downlink physical frame to obtain the first downlink electrical signal.

19. The method according to claim 18, characterized in that, The signal processing chip of the master optical module includes a storage unit for storing the mapping relationship data.

20. The method according to claim 18, wherein The master optical module includes a driver. The optoelectronic conversion and signal transmission of the target device identification information and the first electrical signal data to send the first electrical signal data to the target vehicle terminal device includes: According to the driver of the master optical module, amplify the first downlink electrical signal to obtain a first amplified electrical signal.

21. The method according to claim 20, wherein The master optical module includes a laser. The optoelectronic conversion and signal transmission of the target device identification information and the first electrical signal data to send the first electrical signal data to the target vehicle terminal device includes: According to the laser of the master optical module, perform optoelectronic conversion processing on the first amplified electrical signal to obtain a downlink optical signal.

22. The method according to claim 21, wherein, The master optical module includes a demultiplexer and an optical signal interface. The optoelectronic conversion and signal transmission of the target device identification information and the first electrical signal data to send the first electrical signal data to the target vehicle terminal device includes: According to the demultiplexer and the optical signal interface of the master optical module, send the downlink optical signal to the optical splitter.

23. The method according to claim 22, wherein The optoelectronic conversion and signal transmission of the target device identification information and the first electrical signal data to send the first electrical signal data to the target vehicle terminal device includes: According to the optical splitter, forward the downlink optical signal to the slave optical module.

24. The method according to claim 23, wherein The slave optical module includes an optical signal interface. The optoelectronic conversion and signal transmission of the target device identification information and the first electrical signal data to send the first electrical signal data to the target vehicle terminal device includes: According to the optical signal interface of the slave optical module, receive the downlink optical signal.

25. The method according to claim 24, wherein The slave optical module includes a demultiplexer and a photodetector. The optoelectronic conversion and signal transmission of the target device identification information and the first electrical signal data to send the first electrical signal data to the target vehicle terminal device includes: According to the demultiplexer of the slave optical module, forward the downlink optical signal to the photodetector of the slave optical module.

26. The method according to claim 25, wherein The optoelectronic conversion and signal transmission of the target device identification information and the first electrical signal data to send the first electrical signal data to the target vehicle terminal device includes: According to the photodetector of the slave optical module, perform optoelectronic conversion processing on the downlink optical signal to obtain a second downlink electrical signal.

27. The method according to claim 26, wherein, The slave optical module includes an amplifier. The optoelectronic conversion and signal transmission of the target device identification information and the first electrical signal data to send the first electrical signal data to the target vehicle terminal device includes: According to the amplifier of the slave optical module, the transimpedance and limiting of the second downlink electrical signal are amplified to obtain a second downlink physical frame in the form of a differential signal.

28. The method according to claim 27, wherein The slave optical module includes a signal processing chip. The photoelectric conversion and signal transmission of the target device identification information and the first electrical signal data to send the first electrical signal data to the target vehicle terminal device include: According to the signal processing chip of the slave optical module, when the target device identification information matches the pre-stored device identification information, the second downlink physical frame in the form of a differential signal is unpacked to obtain the first electrical signal data, and the first electrical signal data is sent to the target vehicle terminal device.

29. The method according to claim 7, wherein The slave optical module includes an electrical signal interface. The method further includes: According to the electrical signal interface of the slave optical module, the second electrical signal data sent by the vehicle terminal device is received.

30. The method according to claim 29, wherein The slave optical module includes a signal processing chip. The method further includes: According to the signal processing chip of the slave optical module, the second electrical signal data is packetized and encapsulated to obtain a first uplink physical burst frame, and the first uplink physical burst frame is subjected to differential signal conversion to obtain a first uplink electrical signal.

31. The method according to claim 30, characterized in that, The slave optical module includes a driver. The method further includes: According to the driver of the slave optical module, the first uplink electrical signal is amplified to obtain a second amplified electrical signal.

32. The method according to claim 31, wherein The slave optical module includes a laser. The method further includes: According to the laser of the slave optical module, the second amplified electrical signal is subjected to photoelectric conversion processing to obtain an uplink optical signal.

33. The method according to claim 32, characterized in that, The slave optical module includes a demultiplexer and an optical signal interface. The method further includes: According to the demultiplexer and the optical signal interface of the slave optical module, the uplink optical signal is sent to the optical splitter.

34. The method according to claim 33, wherein The method further includes: According to the optical splitter, the uplink optical signal is forwarded to the master optical module.

35. The method according to claim 34, wherein The master optical module includes an optical signal interface. The method further includes: According to the optical signal interface of the master optical module, the uplink optical signal is received.

36. The method according to claim 35, wherein The master optical module includes a demultiplexer and a photodetector. The method further includes: According to the demultiplexer of the master optical module, the uplink optical signal is forwarded to the photodetector of the master optical module.

37. The method according to claim 36, wherein The method further includes: According to the photodetector of the master optical module, the uplink optical signal is subjected to photoelectric conversion processing to obtain a second uplink electrical signal.

38. The method according to claim 37, wherein The master optical module includes an amplifier. The method further includes: According to the amplifier of the master optical module, the transimpedance and limiting of the second uplink electrical signal are amplified to obtain a second uplink physical frame in the form of a differential signal.

39. The method according to claim 38, characterized in that, The master optical module includes a signal processing chip. The method further includes: According to the signal processing chip of the master optical module, the second uplink physical frame in the form of a differential signal is unpacked to obtain the second electrical signal data, and the second electrical signal data is sent to the central processing subsystem.

40. The method according to claim 1, wherein The central processing subsystem includes a processing chip and a root bridge device connected to the processing chip. The central processing chip can send the electrical signal data to the optical communication component through the root bridge device and receive the electrical signal data sent by the optical communication component through the root bridge device.

41. The method according to claim 1, characterized in that, The vehicle system further includes a switch, and the central processing subsystem is connected to the optical communication component through the switch.

42. An electronic device, characterized in that, The data transmission method according to any one of claims 1 to 41 can be run.

43. A vehicle, characterized in that, It includes the electronic device described in claim 42.

44. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program, and when the computer program is executed by one or more processors, the method described in any one of claims 1-41 is implemented.

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