Photoresist resorption device and resorption method

Abstract

The invention relates to a photoresist resorption device and a resorption method, and belongs to the technical field of semiconductor manufacturing, and the photoresist resorption method comprises the following steps: when the photoresist resorption device is in a first resorption working mode, a resorption unit resorbs photoresist, an image acquisition unit acquires a photoresist nozzle image and sends the photoresist nozzle image to a control unit; the control unit calculates the height of an air column in the photoresist nozzle according to the photoresist nozzle image, and controls the adjusting unit to adjust or not adjust the position of photoresist in the photoresist nozzle; when the photoresist resorption device is in a second resorption working mode, the resorption unit resorbs the photoresist, the image acquisition unit acquires a photoresist nozzle image and sends the photoresist nozzle image to the control unit, and the control unit calculates the height of a first air column and the height of a second air column according to the photoresist nozzle image; and the control unit controls the adjusting unit to adjust or not adjust the position of the photoresist in the photoresist nozzle according to the height of the first air column and the height of the second air column. According to the invention, the position of the photoresist in the photoresist nozzle can be controlled.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a photoresist suck-back device and a suck-back method. Background Art

[0002] In the existing photoresist coating process field, the photoresist coating process is an important process link in semiconductor manufacturing, and the photoresist sucking back operation in the photoresist nozzle is an important process link in the photoresist coating process.

[0003] Invention patent application CN14054287A discloses a photoresist suck-back device, a photoresist coating device and a photoresist coating method. The invention discloses that during the photoresist coating process, the photoresist in the photoresist nozzle above the silicon wafer may condense or drip. The condensation may affect the accuracy of the subsequent glue spraying amount or even block the nozzle. The dripping may cause a poor photoresist coating process. The photoresist in the photoresist nozzle may be sucked back. The suck-back operation is as follows: if the glue dripping of the photoresist nozzle is completed, the on-off suck-back mechanism is opened. The on-off suck-back mechanism includes a suck-back component and an adjustment component. The suck-back component sucks back the photoresist. The monitor monitors the photoresist liquid column in the photoresist nozzle and calculates the distance L between the bottom end of the photoresist liquid column and the outlet of the photoresist nozzle. When the distance L is greater than or less than a preset value, the monitor transmits a signal to the controller, and the controller controls the adjustment component (the suck-back valve) to adjust the pressure. The amount of back-absorption of the entire photoresist, when the distance L is equal to the preset value, the controller controls the adjustment component to stop working and adjust the back-absorption amount, thereby forming a certain distance between the photoresist and the end of the photoresist nozzle to prevent the photoresist in the photoresist nozzle from condensing or dripping; the invention patent application CN114624017A discloses a nozzle monitoring and detection system: an image acquisition device, the image acquisition device faces the nozzle fixing part, the backlight source is arranged on the side of the nozzle fixing part away from the image acquisition device, the image acquisition device faces the observation window, and can obtain the image of the side of the nozzle in the nozzle observation hole, and judge whether the nozzle is cleaned by the image algorithm. If it is cleaned, the nozzle is controlled to absorb the photoresist, and the image acquisition device obtains the image of the nozzle again to obtain the glue back-absorption height of the nozzle, thereby judging whether the back-absorption state of the nozzle is normal, and improving the reliability of the photoresist back-absorption process through image monitoring.

[0004] Although invention patent applications CN14054287A and CN114624017A focus on the technical issues and technical solutions for controlling the amount of photoresist suckback in a photoresist nozzle during a photoresist coating process, and have made certain technical progress in controlling photoresist suckback during a photoresist coating process, the photoresist suckback operation in existing photoresist nozzles still has the following deficiencies:

[0005] (1) The photoresist suck-back operation in the photoresist nozzle occurs not only during the photoresist coating process, but also before the photoresist coating equipment is ready to shut down. No control method is given for the two suck-back operations during the photoresist coating process and before the photoresist coating equipment is shut down. The prior art does not provide a technical solution for the above two scenarios, which affects the long-term reliability and stability of the photoresist coating process.

[0006] (2) Limited by the types of photoresists, for example, there are many types of photoresists (such as positive and negative photoresists, with different viscosities, etc.), and the specifications of photoresist nozzles and resucking components can usually be single. Existing photoresist resucking technologies are mostly developed based on specific photoresist materials. After changing the photoresist for coating, it is necessary to use the adjustment component to adjust the resucking amount multiple times, which affects the efficiency of the photoresist coating process. It fails to provide a photoresist resucking control solution based on different photoresist types and resucking components, resulting in a limited scope of application.

[0007] Therefore, while existing photoresist suckback technology has achieved some breakthroughs in coating process optimization, it still hasn't fully resolved the technical challenges of controlling the two suckback operations during the coating process and before equipment shutdown. Nor has it provided a solution for photoresist suckback control that is suitable for a variety of photoresist materials. Therefore, improving photoresist suckback technology has become a pressing technical issue for semiconductor manufacturers. Summary of the Invention

[0008] The purpose of this invention is to provide a photoresist suckback device and method to partially or completely solve the technical problems of controlling the two suckback operations during the coating process and before the equipment is shut down in the existing photoresist coating process, and to provide a universal solution for photoresist suckback control that is suitable for various photoresist materials. To achieve the above objectives, this invention provides the following technical solutions:

[0009] In a first aspect, a photoresist suck-back device comprises:

[0010] An image acquisition unit, a suck-back unit, an adjustment unit, and a control unit. The suck-back unit sucks back the photoresist, or the suck-back unit sucks back the photoresist and the photoresist residue removal liquid. The adjustment unit adjusts the position of the photoresist in the photoresist nozzle, or the adjustment unit adjusts the position of the photoresist and the position of the photoresist residue removal liquid in the photoresist nozzle. The image acquisition unit acquires an image of the photoresist nozzle. The control unit is connected to the suck-back unit, the adjustment unit, and the image acquisition unit. The photoresist suck-back device includes a first suck-back working mode and a second suck-back working mode.

[0011] When the photoresist sucking back device is in the first sucking back working mode, the sucking back unit sucks back the photoresist, the image acquisition unit acquires an image of the photoresist nozzle and sends it to the control unit, the control unit calculates the height of the air column in the photoresist nozzle according to the photoresist nozzle image, and controls the adjustment unit to adjust or not adjust the position of the photoresist in the photoresist nozzle;

[0012] When the photoresist suck-back device is in the second suck-back working mode, the suck-back unit sucks back the photoresist and the photoresist residual removing liquid, the image acquisition unit acquires the photoresist nozzle image and sends it to the control unit, the control unit calculates the first air column height and the second air column height according to the photoresist nozzle image, and the control unit controls the adjustment unit to adjust or not adjust the photoresist position and the photoresist residual removing liquid position in the photoresist nozzle according to the first air column height and the second air column height.

[0013] Optionally, the second back-sucking working mode is located before the photoresist coating equipment is ready to shut down. After the second back-sucking working mode is completed, a first air column, a photoresist residue removal liquid column, a second air column and a second photoresist liquid column are formed in the photoresist nozzle. The first air column, the photoresist residue removal liquid column, the second air column and the second photoresist liquid column are arranged in sequence.

[0014] Optionally, the first suck-back working mode is in operation after the photoresist coating process is completed. After the first suck-back working mode is completed, an air column and a photoresist liquid column are formed in the photoresist nozzle, and the air column and the photoresist liquid column are adjacent to each other.

[0015] Optionally, the suck-back unit includes a suck-back valve. In the first suck-back working mode, the suck-back valve sucks back the photoresist so that an air column is formed in the photoresist nozzle. In a dimensionless case, the suck-back time t and the air column height H of the suck-back valve satisfy:

[0016] H=a1*t 3 +a2*t 2 +a3*t+a4

[0017] Among them, a1 is the first back-suction calibration coefficient, a2 is the second back-suction calibration coefficient, a3 is the third back-suction calibration coefficient, and a4 is the fourth back-suction calibration coefficient.

[0018] Optionally, the resucking unit includes a resucking valve. In the second resucking working mode, the resucking valve resucks the photoresist so that a second air column is formed in the photoresist nozzle. In a dimensionless case, the resucking time t of the resucking valve and the height H2 of the second air column satisfy:

[0019] H2=p1*t 3 +p2*t 2 +p3*t+p4

[0020] Among them, p1 is the first round of calibration parameters, p2 is the second round of calibration parameters, p3 is the third round of calibration parameters, and p4 is the fourth round of calibration parameters;

[0021] The position of the back-suck valve to suck back the photoresist and the photoresist residue removal liquid forms a photoresist residue removal liquid column in the photoresist nozzle. In the dimensionless case, the back-suck time t of the back-suck valve and the height L1 of the photoresist residue removal liquid column satisfy:

[0022] L1=w1*t 3 +w2*t 2 +w3*t+w4

[0023] Among them, w1 is the back-suction calibration coefficient one, w2 is the back-suction calibration coefficient two, w3 is the back-suction calibration coefficient three, and w4 is the back-suction calibration coefficient four;

[0024] The position of the back-suck valve to suck back the photoresist and the residual photoresist removal liquid forms a first air column in the photoresist nozzle. In the dimensionless case, the back-suck time t of the back-suck valve and the height H1 of the first air column satisfy:

[0025] H1=q1*t 3 +q2*t 2 +q3*t+q4

[0026] Among them, q1 is the back-suction calibration parameter one, q2 is the back-suction calibration parameter two, q3 is the back-suction calibration parameter three, and q4 is the back-suction calibration parameter four.

[0027] In a second aspect, a photoresist suckback method is provided, using a photoresist suckback device according to any one of the first aspects, comprising:

[0028] Step S100, when the photoresist suck-back device is in the first suck-back working mode, the suck-back unit sucks back the photoresist, the image acquisition unit captures an image of the photoresist nozzle and sends it to the control unit, the control unit calculates the height of the air column in the photoresist nozzle based on the photoresist nozzle image, and controls the adjustment unit to adjust or not adjust the position of the photoresist in the photoresist nozzle;

[0029] Step S200, when the photoresist suck-back device is in the second suck-back working mode, the suck-back unit sucks back the photoresist and the photoresist residual removing liquid, the image acquisition unit acquires the photoresist nozzle image and sends it to the control unit, the control unit calculates the first air column height and the second air column height according to the photoresist nozzle image, and the control unit controls the adjustment unit to adjust or not adjust the photoresist position and the photoresist residual removing liquid position in the photoresist nozzle according to the first air column height and the second air column height.

[0030] Optionally, in step S100, the first suck-back working mode is in operation after the photoresist coating process is completed. After the first suck-back working mode is completed, an air column and a photoresist liquid column are formed in the photoresist nozzle, and the air column and the photoresist liquid column are adjacent to each other.

[0031] Optionally, in step S200, the second back-sucking working mode is located before the photoresist coating equipment is ready to shut down. After the second back-sucking working mode is completed, a first air column, a photoresist residue removal liquid column, a second air column, and a second photoresist liquid column are formed in the photoresist nozzle. The first air column, the photoresist residue removal liquid column, the second air column, and the second photoresist liquid column are arranged in sequence.

[0032] Optionally, step S200 includes:

[0033] Step S201: The suck-back unit works to suck back the photoresist, and a second air column is formed in the photoresist nozzle;

[0034] Step S202: the photoresist nozzle enters the photoresist residue removal liquid container, and the resucking unit resucks the photoresist and the photoresist residue removal liquid;

[0035] Step S203: the photoresist nozzle leaves the photoresist residue removing liquid container, and the sucking back unit sucks back the photoresist and the photoresist residue removing liquid again, so that a first air column, a photoresist residue removing liquid column, a second air column, and a second photoresist liquid column are formed in the photoresist nozzle;

[0036] Before step S100, the following steps are also included:

[0037] Step SF: The suck-back unit includes a suck-back valve, and the photoresist suck-back device is calibrated.

[0038] Before step S100, the following steps are also included:

[0039] Step SF: The suck-back unit includes a suck-back valve, and the photoresist suck-back device is calibrated.

[0040] Optionally, step SF includes:

[0041] Step SF1: Calibrate the photoresist suck-back device so that in the subsequent photoresist suck-back device, in the first suck-back working mode, under dimensionless conditions, the suck-back time t and the air column height H of the suck-back valve satisfy:

[0042] H=a1*t 3 +a2*t 2 +a3*t+a4

[0043] Among them, a1 is the first back-suction calibration coefficient, a2 is the second back-suction calibration coefficient, a3 is the third back-suction calibration coefficient, and a4 is the fourth back-suction calibration coefficient;

[0044] And / or, step SF2: calibrating the photoresist suck-back device so that in the subsequent second suck-back working mode of the photoresist suck-back device, under a dimensionless condition, the suck-back time t of the suck-back valve and the second air column height H2 satisfy:

[0045] H2=p1*t 3 +p2*t 2 +p3*t+p4

[0046] Among them, p1 is the first round of calibration parameters, p2 is the second round of calibration parameters, p3 is the third round of calibration parameters, and p4 is the fourth round of calibration parameters;

[0047] In the dimensionless case, the suck-back time t of the suck-back valve and the height L1 of the photoresist residual removal liquid column satisfy:

[0048] L1=w1*t 3 +w2*t 2 +w3*t+w4

[0049] Among them, w1 is the back-suction calibration coefficient one, w2 is the back-suction calibration coefficient two, w3 is the back-suction calibration coefficient three, and w4 is the back-suction calibration coefficient four;

[0050] In the dimensionless case, the back-suction time t and the first air column height H1 of the back-suction valve satisfy:

[0051] H1=q1*t 3 +q2*t 2 +q3*t+q4

[0052] Among them, q1 is the back-suction calibration parameter one, q2 is the back-suction calibration parameter two, q3 is the back-suction calibration parameter three, and q4 is the back-suction calibration parameter four.

[0053] In summary, the present invention has the following beneficial technical effects:

[0054] (1) In the present invention application, the photoresist suck-back device can adapt to different types of photoresist nozzles and types of photoresists without relying on specific parameters. The photoresist suck-back device supports a first suck-back working mode and a second suck-back working mode, and can perform suck-back operation control according to different scenarios and precision requirements. The photoresist suck-back device can be formed in the photoresist coating equipment, thereby enhancing the flexibility and practicality of the photoresist coating equipment, improving the long-term reliability and stability of the photoresist coating equipment, improving the automation level of the photoresist coating process, reducing manual intervention, reducing the operational difficulty and error rate of the photoresist suck-back, and improving the production efficiency and product quality of semiconductor manufacturing.

[0055] (2) In the present invention, firstly, by adjusting the back-suction calibration coefficient and back-suction calibration parameters in the formula, it is possible to adapt to different types of photoresists without replacing or adjusting the hardware equipment such as the photoresist nozzle and the back-suction unit. In actual production, it is only necessary to select the corresponding formula and back-suction time according to the type of photoresist used, without the need for a complicated equipment adjustment process, thereby simplifying the operation process. In addition, the traditional process requires frequent use of the adjustment unit to calibrate the position of the photoresist or the photoresist residual removal liquid, while the present invention can obtain the required air column height by controlling the back-suction time, thereby calibrating the photoresist back-suction device or the photoresist coating device including the photoresist back-suction device, reducing the adjustment frequency, greatly improving the process efficiency, reducing the equipment downtime, and reducing the maintenance cost and the economic loss caused by the production interruption. In addition, the back-suction control method based on the mathematical model has high repeatability and accuracy, ensuring the stability of the process and the consistency of product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] Figure 1 This is a simplified structural diagram of the photoresist suck-back device of the present invention;

[0057] Figure 2 It is a partial structural schematic diagram of the photoresist sucking back device applied in the present invention;

[0058] Figure 3 This is a schematic diagram of a photoresist nozzle in the first suck-back working mode of the present invention;

[0059] Figure 4 This is a schematic diagram of a photoresist nozzle in the second suck-back working mode of the present invention;

[0060] Figure 5 It is a structural schematic diagram of the image acquisition unit and multiple photoresist nozzles of the present invention;

[0061] Figure 6 It is a schematic diagram of a photoresist liquid column and an air column after the photoresist nozzle image processing of the present invention;

[0062] Figure 7 It is a schematic diagram of a first air column, a photoresist residue removal liquid column, a second air column, and a second photoresist liquid column after the photoresist nozzle image processing of the present invention;

[0063] Figure 8 It is a schematic flow chart of the photoresist suck-back method applied in the present invention. DETAILED DESCRIPTION

[0064] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments; based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0065] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0066] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means one, two, or more than two, unless otherwise specifically defined.

[0067] In this application, unless otherwise expressly specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood broadly. For example, they may refer to fixed or detachable connections, integral molding, or integration; they may refer to mechanical or electrical connections; they may refer to direct or indirect connections through an intermediate medium; they may refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0068] In order to make the purpose, technical solutions and advantages of the present invention application clearer, the technical solutions in the embodiments of the present invention application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention application. Obviously, the described embodiments are only part of the embodiments of the present invention application, not all the embodiments; based on the embodiments in the present invention application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention application.

[0069] like Figures 1 to 7As shown, in a first aspect, a photoresist suck-back device includes: an image acquisition unit 100, a suck-back unit 200, an adjustment unit 300, and a control unit 400. The suck-back unit 200 sucks back the photoresist, or the suck-back unit 200 sucks back the photoresist and the photoresist residue removal liquid. The adjustment unit 300 adjusts the position of the photoresist in the photoresist nozzle 10, or the adjustment unit 300 adjusts the position of the photoresist and the position of the photoresist residue removal liquid in the photoresist nozzle 10. The image acquisition unit captures an image of the photoresist nozzle. The control unit is connected to the suck-back unit 200, the adjustment unit 300, and the image acquisition unit 100. The photoresist suck-back device includes a first suck-back working mode and a second suck-back working mode.

[0070] When the photoresist sucking back device is in the first sucking back working mode, the sucking back unit 200 sucks back the photoresist, the image acquisition unit acquires an image of the photoresist nozzle and sends it to the control unit, the control unit calculates the air column height H in the photoresist nozzle according to the photoresist nozzle image, and the control unit controls the adjustment unit 300 to adjust or not adjust the photoresist position in the photoresist nozzle according to the air column height H;

[0071] When the photoresist suck-back device is in the second suck-back working mode, the suck-back unit 200 sucks back the photoresist and the photoresist residual removing liquid, the image acquisition unit acquires the photoresist nozzle image and sends it to the control unit, the control unit calculates the first air column height H1 and the second air column height H2 according to the photoresist nozzle image, and the control unit controls the adjustment unit 300 to adjust or not adjust the photoresist position and the photoresist residual removing liquid position in the photoresist nozzle according to the first air column height H1 and the second air column height H2.

[0072] In some embodiments, the photoresist sucking back device includes a plurality of photoresist nozzles 10 and a mounting frame S, the plurality of photoresist nozzles 10 are arranged along a first direction, the plurality of photoresist nozzles 10 are mounted on the mounting frame S, the image acquisition unit includes a camera 20 and a backlight source 30, the camera faces the plurality of photoresist nozzles arranged in sequence, the direction of the camera 20 is perpendicular to the first direction, the backlight source 30 can be rotatably arranged on the mounting frame, and the backlight source 30 is located on the side away from the camera 20, that is, the plurality of photoresist nozzles 10 arranged in sequence are between the backlight source 30 and the camera 20, the backlight source 30 is opposite to the camera 20, and can provide light source for the camera 20 when taking pictures, the brightness of the backlight source 30 is adjustable, the length of the backlight source 30 is greater than the length in the distribution direction of the plurality of photoresist nozzles, and the adjustment unit (for example, using a sucking back valve) adjusts the position of the photoresist in the photoresist nozzle. These may belong to the existing technologies in the existing field of photoresist coating technology.

[0073] In some embodiments, the image acquisition unit, the reabsorption unit 200, the adjustment unit 300 and the control unit 400 are connected through wired communication or wireless communication, and the control unit 400 can use a processor; when the photoresist reabsorption device is working, the image acquisition unit is working, the backlight source 30 is turned on, the reabsorption unit 200 reabsorbs the photoresist, or after the reabsorption unit 200 reabsorbs the photoresist and the photoresist residual removal liquid, the camera 20 takes pictures of multiple photoresist nozzles 10 arranged in sequence, and obtains a photoresist nozzle image including multiple photoresist nozzles 10 arranged in sequence. After completing the photoresist nozzle image acquisition, the backlight source 30 can be turned off, and at the same time, the photoresist nozzle image can be sent to the control unit 400.

[0074] In some embodiments, in the first back-sucking working mode, the first back-sucking working mode can be applicable to the completion of the photoresist coating process. During the completion of the photoresist coating process, after the back-sucking unit 200 back-sucks the photoresist, the image acquisition unit acquires the photoresist nozzle image and sends it to the control unit. The control unit calculates the air column height H in the photoresist nozzle based on the photoresist nozzle image. It can be determined whether the air column height H in the photoresist nozzle meets the preset requirements. If it meets the preset requirements, the control adjustment unit 300 does not adjust the photoresist position in the photoresist nozzle. If it does not meet the preset requirements, the control adjustment unit 300 does not adjust the photoresist position in the photoresist nozzle, thereby always ensuring the accuracy of the photoresist position and preventing the photoresist in the photoresist nozzle from condensing or dripping.

[0075] In some embodiments, in the second back-sucking working mode, the second back-sucking working mode can be applicable to the case where the photoresist coating equipment is about to be shut down. When the photoresist coating equipment is about to be shut down, after the back-sucking unit 200 completes the back-sucking of the photoresist and the photoresist residue removing liquid, the image acquisition unit acquires the photoresist nozzle image and sends it to the control unit. The control unit calculates the first air column height H1 and the second air column height H2 based on the photoresist nozzle image. It can be determined whether the first air column height H1 and the second air column height H2 in the photoresist nozzle meet the preset requirements. If they meet the preset requirements, the control adjustment unit 300 does not adjust the photoresist position and the photoresist residue removing liquid position in the photoresist nozzle. If they do not meet the preset requirements, the control adjustment unit 300 adjusts the photoresist position and the photoresist residue removing liquid position in the photoresist nozzle to ensure that the photoresist position and the photoresist residue removing liquid position are stable, thereby avoiding the photoresist in the photoresist nozzle from solidifying or being contaminated and deteriorated when or after the photoresist coating equipment is shut down.

[0076] In the photoresist sucking back device applied for in the present invention, the photoresist sucking back device can adapt to different types of photoresist nozzles and types of photoresists without relying on specific parameters. The photoresist sucking back device supports the first sucking back working mode and the second sucking back working mode, and can perform sucking back operation control according to different scenarios and precision requirements. The photoresist sucking back device can be formed in the photoresist coating equipment, thereby enhancing the flexibility and practicality of the photoresist coating equipment, improving the long-term reliability and stability of the photoresist coating equipment, improving the automation level of the photoresist coating process, reducing manual intervention, reducing the operational difficulty and error rate of the photoresist sucking back, and improving the production efficiency and product quality of semiconductor manufacturing.

[0077] Optionally, the first back suction working mode is after the photoresist coating process is completed. After the first back suction working mode is completed, an air column and a photoresist liquid column are formed in the photoresist nozzle, and the air column and the photoresist liquid column are adjacent to each other; the second back suction working mode is located before the photoresist coating equipment is ready to shut down. After the second back suction working mode is completed, a first air column, a photoresist residue removal liquid column, a second air column and a second photoresist liquid column are formed in the photoresist nozzle, and the first air column, the photoresist residue removal liquid column, the second air column and the second photoresist liquid column are arranged in sequence.

[0078] In some embodiments, the first back-sucking working mode is usually started after the photoresist coating process is completed. For example, in semiconductor manufacturing, after the wafer is coated with photoresist, the back-sucking unit 200 immediately back-sucks the photoresist. After the first back-sucking working mode is completed, an air column and a photoresist liquid column are formed in the photoresist nozzle. The image acquisition unit can take an image of the photoresist nozzle, and the control unit calculates the air column height H based on the photoresist nozzle image. The control unit can also determine whether the air column height H in the photoresist nozzle meets the preset requirements. If it meets the preset requirements, the control adjustment unit 300 does not adjust the position of the photoresist in the photoresist nozzle. If it does not meet the preset requirements, the control adjustment unit 300 does not adjust the position of the photoresist in the photoresist nozzle, but adjusts the photoresist position to ensure that the photoresist in the photoresist nozzle is in the best state and to avoid condensation or dripping of the photoresist in the photoresist nozzle.

[0079] In some embodiments, the second back-sucking working mode is executed before the photoresist coating equipment is shut down. For example, before the photoresist coating process is completed or the photoresist coating equipment needs to be shut down for maintenance, before the photoresist coating equipment is accurately shut down, the back-sucking unit 200 works, the back-sucking unit 200 back-sucks the photoresist, and a second air column is formed in the photoresist nozzle 10. Multiple photoresist nozzles 10 enter the photoresist residue removal liquid container C. The back-sucking unit 200 back-sucks the photoresist and the photoresist residue removal liquid, and then a photoresist residue removal liquid column, a second air column and a first photoresist liquid column will be formed in the photoresist nozzle. Multiple photoresist nozzles 10 leave the photoresist residue removal liquid container C, and the back-sucking unit 200 back-sucks the photoresist and the photoresist residue removal liquid again. After the second back-sucking working mode is completed, the first air column, the photoresist residue removal liquid column and the first air column will be formed in the photoresist nozzle. Two air columns and a second photoresist liquid column, the height of the first air column is H1, the height of the photoresist residue removing liquid column is L1, the height of the second air column is L2, and the height of the second photoresist liquid column is L2. The image acquisition unit captures the image, and the control unit adjusts according to the first air column height H1 and the second air column height H2. It can be judged whether the first air column height H1 and the second air column height H2 in the photoresist nozzle meet the preset requirements. If the preset requirements are met, the control adjustment unit 300 does not adjust the photoresist position and the photoresist residue removing liquid position in the photoresist nozzle. If the preset requirements are not met, the control adjustment unit 300 adjusts the photoresist position and the photoresist residue removing liquid position in the photoresist nozzle to ensure that the photoresist position and the photoresist residue removing liquid position are stable, so as to avoid the photoresist in the photoresist nozzle from solidifying or being contaminated and deteriorated when or after the photoresist coating equipment is shut down.

[0080] In the present application, firstly, the photoresist sucking back device is not restricted by the type of photoresist, nozzle design or specification of the adjustment component, and can work in the first sucking back working mode and the second sucking back working mode. The photoresist sucking back device can adapt to a variety of photoresists and photoresist coating equipment, providing a universal photoresist sucking back solution to meet the needs of semiconductor manufacturing; in addition, the first sucking back working mode can be automatically started after the photoresist coating is completed, and the second sucking back working mode is executed before the photoresist coating equipment is ready to shut down. The flexible design of the dual sucking back working mode ensures the reliability and stability of the photoresist position management in different scenarios, reduces the need for manual intervention, operation and maintenance, avoids the poor wafer manufacturing due to condensation or dripping of the photoresist, and optimizes the quality and production efficiency of the photoresist coating.

[0081] However, in the actual photoresist coating process, the air column height H or the first air column height H1 and the second air column height H2 formed by the back-sucking unit will be affected by the type of photoresist, the type of photoresist nozzle, and the type of back-sucking unit (for example, using a back-sucking valve). After the different types of photoresist, photoresist nozzle, and back-sucking unit (for example, using a back-sucking valve) are matched, more practically, the type of photoresist nozzle and the type of back-sucking unit can be fixed, and the type of photoresist is variable. The back-sucking unit will obtain different air column heights H or the first air column height H1 and the second air column height H2 at the same back-sucking time, resulting in the need to use the adjustment unit 300 to frequently adjust the position of the photoresist in the photoresist nozzle or adjust the position of the photoresist in the photoresist nozzle and the position of the photoresist residual removal liquid. This will reduce the efficiency of the photoresist coating process and increase the downtime cost of the photoresist coating equipment. The applicant has discovered the above technical problems and proposed corresponding technical solutions.

[0082] Optionally, the suck-back unit includes a suck-back valve; in the first suck-back working mode, the suck-back valve sucks back the photoresist so that an air column is formed in the photoresist nozzle. In a dimensionless case, the suck-back time t and the air column height H of the suck-back valve satisfy:

[0083] H=a1*t 3 +a2*t 2 +a3*t+a4

[0084] Among them, a1 is the first back-suction calibration coefficient, a2 is the second back-suction calibration coefficient, a3 is the third back-suction calibration coefficient, and a4 is the fourth back-suction calibration coefficient.

[0085] In the second back-sucking mode, the back-sucking valve back-sucks the photoresist so that a second air column is formed in the photoresist nozzle. In the dimensionless case, the back-sucking time t of the back-sucking valve and the height H2 of the second air column satisfy:

[0086] H2=p1*t 3 +p2*t 2 +p3*t+p4

[0087] Among them, p1 is the first round of calibration parameters, p2 is the second round of calibration parameters, p3 is the third round of calibration parameters, and p4 is the fourth round of calibration parameters;

[0088] The position of the back-suck valve to suck back the photoresist and the photoresist residue removal liquid forms a photoresist residue removal liquid column in the photoresist nozzle. In the dimensionless case, the back-suck time t of the back-suck valve and the height L1 of the photoresist residue removal liquid column satisfy:

[0089] L1=w1*t 3 +w2*t 2 +w3*t+w4

[0090] Among them, w1 is the back-suction calibration coefficient one, w2 is the back-suction calibration coefficient two, w3 is the back-suction calibration coefficient three, and w4 is the back-suction calibration coefficient four;

[0091] The position of the back-suck valve to suck back the photoresist and the residual photoresist removal liquid forms a first air column in the photoresist nozzle. In the dimensionless case, the back-suck time t of the back-suck valve and the height H1 of the first air column satisfy:

[0092] H1=q1*t 3 +q2*t 2 +q3*t+q4

[0093] Among them, q1 is the back-suction calibration parameter one, q2 is the back-suction calibration parameter two, q3 is the back-suction calibration parameter three, and q4 is the back-suction calibration parameter four.

[0094] In some embodiments, when a certain photoresist is used, in the first back-sucking mode, the back-sucking valve back-sucks the photoresist so that an air column is formed in the photoresist nozzle. In the dimensionless case, the back-sucking time of the back-sucking valve and the height of the air column H satisfy: H = a1 * t 3 +a2*t 2 +a3*t+a4; At the same time, in the second back-sucking working mode, the back-sucking valve back-sucks the photoresist so that a second air column is formed in the photoresist nozzle. In the dimensionless case, the back-sucking time t of the back-sucking valve and the height H2 of the second air column satisfy: H2=p1*t 3 +p2*t 2 Thus, using the above formula, it is only necessary to control the working time of the suck-back valve to obtain the air column with a height H and the second air column with a height H2 in the photoresist nozzle.

[0095] In some embodiments, when another photoresist is used, in the first back-sucking mode, the back-sucking valve back-sucks the photoresist so that an air column is formed in the photoresist nozzle. In the dimensionless case, the above formula is also used and adjusted, and the back-sucking time t of the back-sucking valve and the height of the air column H satisfy: H = a5*t 3 +a6*t 2 +a7*t+a8, where a5, a6, a7, and a8 are the resorption coefficients. Meanwhile, in the second resorption working mode, the resorption valve resorbs the photoresist so that a second air column is formed in the photoresist nozzle. In the dimensionless case, the resorption time t of the resorption valve and the height H2 of the second air column satisfy: H2=p5*t 3 +p6*t 2 +p7*t+p8, where p5, p6, p7, and p8 are the back-suck coefficients. Therefore, by simply modifying the back-suck parameters, the operating time of the back-suck valve can still be controlled to achieve the air column height H and the second air column height H2 in the photoresist nozzle.

[0096] In some embodiments, the type of photoresist residue removal liquid can be fixed or non-fixed. In the dimensionless case, the resucking time t of the resucking valve and the height L1 of the photoresist residue removal liquid column satisfy: L1 = w1*t 3 +w2*t 2 +w3*t+w4, the back-suction time t of the back-suction valve and the height H1 of the first air column satisfy: H1=q1*t 3 +q2*t 2 Therefore, using the above formula, we only need to control the working time of the back-suck valve so that the back-suck valve sucks back the photoresist and the photoresist residue removing liquid at a position such that a first air column and a photoresist residue removing liquid column are formed in the photoresist nozzle. This can achieve the first air column with a height H1 and a photoresist residue removing liquid column with a height L1 in the photoresist nozzle.

[0097] In some embodiments, the above-mentioned formulas of H, H1, L1, and H2 can be used to calibrate the photoresist back-absorption device. In the calibration of the photoresist back-absorption device, the use of dimensionless formulas is necessary. Through dimensionless analysis, similar behaviors under different back-absorption working modes (such as the first back-absorption working mode and the second back-absorption working mode) or different types of photoresists can be identified. The dimensionless formula can play a universal role and ensure that the calibration results can be reused in different devices, different types of photoresists or different operating conditions, thereby enhancing the flexibility and repeatability of the photoresist back-absorption technology. Through the dimensionless mathematical model, only the back-absorption time t can be adjusted to adapt to different types of photoresists or back-absorption requirements without changing the hardware, thereby reducing the adjustment frequency of the photolithography coating equipment and improving production efficiency.

[0098] In the application of the present invention, firstly, the operator only needs to pre-debug to obtain the data of the height of the back-suck valve and the working time of the back-suck valve for different types of photoresists in the first back-suck working mode and the second back-suck working mode before the process starts, and can obtain different formulas for the height of the back-suck valve and the working time of the back-suck valve corresponding to different types of photoresists, that is, the back-suck calibration coefficient (i.e., formula coefficient) and back-suck calibration parameter (i.e., formula coefficient) under different types of photoresists are obtained through pre-debug, and the mathematical formulas of the height of the back-suck valve and the working time of the back-suck valve are obtained; in addition, in the first back-suck working mode and the second back-suck working mode, the back-suck calibration coefficient (i.e., formula coefficient) and the back-suck calibration parameter (i.e., formula coefficient) under different types of photoresists are obtained through pre-debug, and the mathematical formulas of the height of the back-suck valve and the working time of the back-suck valve are obtained. Before the second back-suction working mode works for the first time, it is only necessary to use the above-mentioned multiple formulas to calibrate the photoresist back-suction device or the photoresist coating equipment including the photoresist back-suction device. More specifically, it is only necessary to calibrate the working time of the back-suction valve. Subsequently, it can work in the first back-suction working mode and the second back-suction working mode to complete the acquisition of the air column height H, the first air column height H1, and the second air column height H2 in the photoresist nozzle. There is no need to frequently use the adjustment unit to adjust the photoresist position in the photoresist nozzle or the photoresist position in the photoresist nozzle, or the position of the photoresist residual removal liquid, thereby improving the efficiency of the photoresist coating process.

[0099] like Figure 8 As shown, in a second aspect, the present invention provides a photoresist suck-back method, which uses any of the above-mentioned photoresist suck-back devices, including:

[0100] Step S100, when the photoresist suck-back device is in the first suck-back working mode, the suck-back unit 200 sucks back the photoresist, the image acquisition unit captures an image of the photoresist nozzle and sends it to the control unit, the control unit 400 calculates the air column height H in the photoresist nozzle based on the photoresist nozzle image, and controls the adjustment unit 300 to adjust or not adjust the position of the photoresist in the photoresist nozzle;

[0101] Step S200, when the photoresist suck-back device is in the second suck-back working mode, the suck-back unit 200 sucks back the photoresist and the photoresist residual removing liquid, the image acquisition unit acquires the photoresist nozzle image and sends it to the control unit, the control unit 400 calculates the first air column height H1 and the second air column height H2 according to the photoresist nozzle image, and the control unit 400 controls the adjustment unit 300 to adjust or not adjust the photoresist position and the photoresist residual removing liquid position in the photoresist nozzle according to the first air column height H1 and the second air column height H2.

[0102] In some embodiments, in step S100, when the photoresist suck-back device is in the first suck-back working mode (usually after the photoresist coating process is completed), the suck-back unit 200 starts and sucks back the photoresist. At this time, the image acquisition unit captures an image of the photoresist nozzle and sends the image data to the control unit. The control unit analyzes the image and calculates the air column height H in the photoresist nozzle. Based on the calculated air column height H, the control unit 400 determines whether it is necessary to control the adjustment unit 300 to adjust the position of the photoresist in the nozzle or maintain the current position unchanged to ensure that the photoresist in the nozzle is in the optimal state and to prevent the photoresist in the photoresist nozzle from condensing or dripping.

[0103] In some embodiments, in step S100, when the photoresist suck-back device is in the second suck-back working mode (usually before the photoresist coating equipment is ready to shut down), the suck-back unit 200 sucks the photoresist back again. The image acquisition unit captures the nozzle image and transmits it to the control unit. The control unit calculates the first air column height H1 and the second air column height H2 based on the image analysis. Subsequently, the control unit controls the adjustment unit 300 to adjust the position of the photoresist in the nozzle according to the first air column height H1 and the second air column height H2, or maintains the current position unchanged, to prevent the photoresist from solidifying or causing contamination in the nozzle, thereby ensuring the cleanliness and stability of the equipment when it is shut down.

[0104] In the photoresist back-suction method applied for in the present invention, the position of the photoresist in the photoresist nozzle is controlled and managed based on real-time image data and air column height calculation, ensuring the optimal state of the photoresist in the nozzle and reducing coating defects. The flexible design of the double back-suction working mode adapts to different scenarios, avoids photoresist solidification or contamination, reduces manual intervention, operation and maintenance requirements, improves the quality and production efficiency of photoresist coating, and extends the service life of photoresist coating equipment.

[0105] Optionally, in step S100, the first suck-back working mode is in operation after the photoresist coating process is completed. After the first suck-back working mode is completed, an air column and a photoresist liquid column are formed in the photoresist nozzle, and the air column and the photoresist liquid column are adjacent to each other.

[0106] In the present application, all technical issues, technical solutions, and technical effects of the first re-suction working mode may be the same as all technical issues, technical solutions, and technical effects of the first re-suction working mode recorded in the first aspect. For details, please refer to all technical issues, technical solutions, and technical effects of the first re-suction working mode recorded in the first aspect, and the present application will not repeat them.

[0107] Optionally, in step S200, the second back-sucking working mode is located before the photoresist coating equipment is ready to shut down. After the second back-sucking working mode is completed, a first air column, a photoresist residue removal liquid column, a second air column, and a second photoresist liquid column are formed in the photoresist nozzle. The first air column, the photoresist residue removal liquid column, the second air column, and the second photoresist liquid column are arranged in sequence.

[0108] In the present application, all technical issues, technical solutions, and technical effects of the second back-suction working mode may be the same as all technical issues, technical solutions, and technical effects of the second back-suction working mode recorded in the first aspect. For details, please refer to all technical issues, technical solutions, and technical effects of the second back-suction working mode recorded in the first aspect, and the present application will not repeat them.

[0109] Optionally, step S200 includes:

[0110] Step S201: The suck-back unit 200 works to suck back the photoresist, and a second air column is formed in the photoresist nozzle 10;

[0111] Step S202: the photoresist nozzle 10 enters the photoresist residue removing liquid container C, and the suck-back unit 200 sucks back the photoresist and the photoresist residue removing liquid;

[0112] Step S203: the photoresist nozzle 10 leaves the photoresist residue removing liquid container C, and the sucking back unit 200 sucks back the photoresist and the photoresist residue removing liquid again, forming a first air column, a photoresist residue removing liquid column, a second air column, and a second photoresist liquid column in the photoresist nozzle.

[0113] In the application of the present invention, after step S202, a photoresist residue removal liquid column, a second air column and a first photoresist liquid column will be formed in the photoresist nozzle 10. After step S203, a first air column, a photoresist residue removal liquid column, a second air column and a second photoresist liquid column will be formed in the photoresist nozzle. By forming a photoresist residue removal liquid column in the photoresist nozzle, the inside of the nozzle can be effectively cleaned, and the influence of residual photoresist on subsequent coating can be reduced, which meets the scenario of frequent replacement of photoresist or maintenance of coating quality. The back suction mechanism allows precise control of the amount of liquid in the nozzle to avoid excessive coating or overflow of photoresist, thereby reducing material waste and lowering the cost of photoresist use.

[0114] Optionally, before step S100, the following steps are further included:

[0115] Step SF: The suck-back unit includes a suck-back valve, and the photoresist suck-back device is calibrated.

[0116] Step SF includes:

[0117] Step SF1: Calibrate the photoresist suck-back device so that in the subsequent photoresist suck-back device, in the first suck-back working mode, under dimensionless conditions, the suck-back time t and the air column height H of the suck-back valve satisfy:

[0118] H=a1*t 3 +a2*t 2 +a3*t+a4

[0119] Among them, a1 is the first back-suction calibration coefficient, a2 is the second back-suction calibration coefficient, a3 is the third back-suction calibration coefficient, and a4 is the fourth back-suction calibration coefficient.

[0120] And / or, step SF2: calibrating the photoresist suck-back device so that in the subsequent second suck-back working mode of the photoresist suck-back device, under a dimensionless condition, the suck-back time t of the suck-back valve and the second air column height H2 satisfy:

[0121] H2=p1*t 3 +p2*t 2 +p3*t+p4

[0122] Among them, p1 is the first round of calibration parameters, p2 is the second round of calibration parameters, p3 is the third round of calibration parameters, and p4 is the fourth round of calibration parameters;

[0123] In the dimensionless case, the suck-back time t of the suck-back valve and the height L1 of the photoresist residual removal liquid column satisfy:

[0124] L1=w1*t 3 +w2*t 2 +w3*t+w4

[0125] Among them, w1 is the back-suction calibration coefficient one, w2 is the back-suction calibration coefficient two, w3 is the back-suction calibration coefficient three, and w4 is the back-suction calibration coefficient four;

[0126] In the dimensionless case, the back-suction time t and the first air column height H1 of the back-suction valve satisfy:

[0127] H1=q1*t 3 +q2*t 2 +q3*t+q4

[0128] Among them, q1 is the back-suction calibration parameter one, q2 is the back-suction calibration parameter two, q3 is the back-suction calibration parameter three, and q4 is the back-suction calibration parameter four.

[0129] In the present application, all technical issues, technical solutions and technical effects of the back-suction time t of the back-suction valve, the air column height H, the back-suction time t of the back-suction valve, the second air column height H2, the back-suction time t of the back-suction valve, the photoresist residue removal liquid column height L1 and the first air column height H1 can be the same as all the above-mentioned related technical issues, technical solutions and technical effects recorded in the first aspect. For details, please refer to all the above-mentioned related technical issues, technical solutions and technical effects recorded in the first aspect, and the present application will not repeat them.

[0130] In the present invention application, firstly, by adjusting the back-suction calibration parameters and the back-suction calibration coefficient in the formula, different types of photoresists can be adapted without replacing or adjusting hardware equipment such as the photoresist nozzle and the back-suction unit. In actual production, it is only necessary to select the corresponding formula and back-suction time according to the type of photoresist used, without the need for a complicated equipment adjustment process, thereby simplifying the operation process; in addition, the traditional process requires frequent use of the adjustment unit to correct the position of the photoresist or the photoresist residual removal liquid, while the present invention application can obtain the required air column height by controlling the back-suction time, and can calibrate the photoresist back-suction device or the photoresist coating equipment including the photoresist back-suction device, thereby reducing the adjustment frequency, greatly improving the process efficiency, reducing equipment downtime, and reducing maintenance costs and economic losses caused by production interruptions; in addition, the back-suction control method based on the mathematical model has high repeatability and accuracy, ensuring the stability of the process and the consistency of product quality.

[0131] The technical features of the above embodiments can be combined arbitrarily. To simplify the description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction between the combinations of these technical features, they should be considered to be within the scope of this specification.

[0132] Those skilled in the art will understand that the various operations, methods, steps, measures, and schemes discussed in the present application may be interchanged, modified, combined, or deleted; further, other steps, measures, and schemes in the various operations, methods, and schemes discussed in the present application may also be interchanged, modified, rearranged, decomposed, combined, or deleted; further, the various operations, methods, and steps, measures, and schemes in the prior art that are similar to those disclosed in the present application may also be interchanged, modified, rearranged, decomposed, combined, or deleted;

[0133] The above-described embodiments only express several implementation methods of the embodiments of the present disclosure, and their descriptions are relatively specific and detailed, but they cannot be understood as limiting the patent scope of the embodiments of the present disclosure. It should be pointed out that for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the embodiments of the present disclosure, and these all fall within the scope of protection of the embodiments of the present disclosure. Therefore, the scope of protection of the embodiments of the present disclosure should be based on the attached claims.

Claims

1. A photoresist sucking back device, characterized in that: include: An image acquisition unit, a suck-back unit, an adjustment unit, and a control unit. The suck-back unit sucks back the photoresist, or the suck-back unit sucks back the photoresist and the photoresist residue removal liquid. The adjustment unit adjusts the position of the photoresist in the photoresist nozzle, or the adjustment unit adjusts the position of the photoresist and the position of the photoresist residue removal liquid in the photoresist nozzle. The image acquisition unit acquires an image of the photoresist nozzle. The control unit is connected to the suck-back unit, the adjustment unit, and the image acquisition unit. The photoresist suck-back device includes a first suck-back working mode and a second suck-back working mode. When the photoresist sucking back device is in the first sucking back working mode, the sucking back unit sucks back the photoresist, the image acquisition unit acquires an image of the photoresist nozzle and sends it to the control unit, the control unit calculates the height of the air column in the photoresist nozzle according to the photoresist nozzle image, and controls the adjustment unit to adjust or not adjust the position of the photoresist in the photoresist nozzle; When the photoresist suck-back device is in the second suck-back working mode, the suck-back unit sucks back the photoresist and the photoresist residual removing liquid, the image acquisition unit acquires the photoresist nozzle image and sends it to the control unit, the control unit calculates the first air column height and the second air column height according to the photoresist nozzle image, and the control unit controls the adjustment unit to adjust or not adjust the photoresist position and the photoresist residual removing liquid position in the photoresist nozzle according to the first air column height and the second air column height.

2. A photoresist suck-back device according to claim 1, characterized in that: The second back-sucking working mode is located before the photoresist coating equipment is about to be shut down. After the second back-sucking working mode is completed, a first air column, a photoresist residue removal liquid column, a second air column, and a second photoresist liquid column are formed in the photoresist nozzle. The first air column, the photoresist residue removal liquid column, the second air column, and the second photoresist liquid column are arranged in sequence.

3. A photoresist suck-back device according to claim 2, characterized in that: The first suck-back working mode is after the photoresist coating process is completed. After the first suck-back working mode is completed, an air column and a photoresist liquid column are formed in the photoresist nozzle, and the air column and the photoresist liquid column are adjacent to each other.

4. The photoresist sucking back device according to claim 2, characterized in that: The back-sucking unit includes a back-sucking valve. In the first back-sucking working mode, the back-sucking valve back-sucks the photoresist so that an air column is formed in the photoresist nozzle. In the dimensionless case, the back-sucking time t and the air column height H of the back-sucking valve satisfy: H=a1*t 3 +a2*t 2 +a3*t+a4 Among them, a1 is the first back-suction calibration coefficient, a2 is the second back-suction calibration coefficient, a3 is the third back-suction calibration coefficient, and a4 is the fourth back-suction calibration coefficient.

5. The photoresist sucking back device according to claim 2, characterized in that: The back-sucking unit includes a back-sucking valve. In the second back-sucking working mode, the back-sucking valve back-sucks the photoresist so that a second air column is formed in the photoresist nozzle. In the dimensionless case, the back-sucking time t of the back-sucking valve and the height H2 of the second air column satisfy: H2=p1*t 3 +p2*t 2 +p3*t+p4 Among them, p1 is the first round of calibration parameters, p2 is the second round of calibration parameters, p3 is the third round of calibration parameters, and p4 is the fourth round of calibration parameters; The position of the back-suck valve to suck back the photoresist and the photoresist residue removal liquid forms a photoresist residue removal liquid column in the photoresist nozzle. In the dimensionless case, the back-suck time t of the back-suck valve and the height L1 of the photoresist residue removal liquid column satisfy: L1=w1*t 3 +w2*t 2 +w3*t+w4 Among them, w1 is the back-suction calibration coefficient one, w2 is the back-suction calibration coefficient two, w3 is the back-suction calibration coefficient three, and w4 is the back-suction calibration coefficient four; The position of the back-suck valve to suck back the photoresist and the residual photoresist removal liquid forms a first air column in the photoresist nozzle. In the dimensionless case, the back-suck time t of the back-suck valve and the height H1 of the first air column satisfy: H1=q1*t 3 +q2*t 2 +q3*t+q4 Among them, q1 is the back-suction calibration parameter one, q2 is the back-suction calibration parameter two, q3 is the back-suction calibration parameter three, and q4 is the back-suction calibration parameter four.

6. A photoresist suck-back method, which uses a photoresist suck-back device according to any one of claims 1 to 5, characterized in that: include: Step S100, when the photoresist suck-back device is in the first suck-back working mode, the suck-back unit sucks back the photoresist, the image acquisition unit captures an image of the photoresist nozzle and sends it to the control unit, the control unit calculates the height of the air column in the photoresist nozzle based on the photoresist nozzle image, and controls the adjustment unit to adjust or not adjust the position of the photoresist in the photoresist nozzle; Step S200, when the photoresist suck-back device is in the second suck-back working mode, the suck-back unit sucks back the photoresist and the photoresist residual removing liquid, the image acquisition unit acquires the photoresist nozzle image and sends it to the control unit, the control unit calculates the first air column height and the second air column height according to the photoresist nozzle image, and the control unit controls the adjustment unit to adjust or not adjust the photoresist position and the photoresist residual removing liquid position in the photoresist nozzle according to the first air column height and the second air column height.

7. A photoresist suck-back method according to claim 6, characterized in that: In step S100 , the first suck-back working mode is in effect after the photoresist coating process is completed. After the first suck-back working mode is completed, an air column and a photoresist liquid column are formed in the photoresist nozzle, and the air column and the photoresist liquid column are adjacent to each other.

8. A photoresist suck-back method according to claim 7, characterized in that: In step S200, the second back-sucking working mode is located before the photoresist coating equipment is ready to shut down. After the second back-sucking working mode is completed, a first air column, a photoresist residue removal liquid column, a second air column and a second photoresist liquid column are formed in the photoresist nozzle. The first air column, the photoresist residue removal liquid column, the second air column and the second photoresist liquid column are arranged in sequence.

9. A photoresist suck-back method according to claim 8, characterized in that: Step S200 includes: Step S201: The suck-back unit works to suck back the photoresist, and a second air column is formed in the photoresist nozzle; Step S202: the photoresist nozzle enters the photoresist residue removal liquid container, and the resucking unit resucks the photoresist and the photoresist residue removal liquid; Step S203: the photoresist nozzle leaves the photoresist residue removing liquid container, and the sucking back unit sucks back the photoresist and the photoresist residue removing liquid again, so that a first air column, a photoresist residue removing liquid column, a second air column, and a second photoresist liquid column are formed in the photoresist nozzle; Before step S100, the following steps are also included: Step SF: The suck-back unit includes a suck-back valve, and the photoresist suck-back device is calibrated.

10. A photoresist suck-back method according to claim 9, characterized in that: Step SF includes: Step SF1: Calibrate the photoresist suck-back device so that in the subsequent photoresist suck-back device, in the first suck-back working mode, under dimensionless conditions, the suck-back time t and the air column height H of the suck-back valve satisfy: H=a1*t 3 +a2*t 2 +a3*t+a4 Among them, a1 is the first back-suction calibration coefficient, a2 is the second back-suction calibration coefficient, a3 is the third back-suction calibration coefficient, and a4 is the fourth back-suction calibration coefficient; And / or, step SF2: calibrating the photoresist suck-back device so that in the subsequent second suck-back working mode of the photoresist suck-back device, under a dimensionless condition, the suck-back time t of the suck-back valve and the second air column height H2 satisfy: H2=p1*t 3 +p2*t 2 +p3*t+p4 Among them, p1 is the first round of calibration parameters, p2 is the second round of calibration parameters, p3 is the third round of calibration parameters, and p4 is the fourth round of calibration parameters; In the dimensionless case, the suck-back time t of the suck-back valve and the height L1 of the photoresist residual removal liquid column satisfy: L1=w1*t 3 +w2*t 2 +w3*t+w4 Among them, w1 is the back-suction calibration coefficient one, w2 is the back-suction calibration coefficient two, w3 is the back-suction calibration coefficient three, and w4 is the back-suction calibration coefficient four; In the dimensionless case, the back-suction time t and the first air column height H1 of the back-suction valve satisfy: H1=q1*t 3 +q2*t 2 +q3*t+q4 Among them, q1 is the back-suction calibration parameter one, q2 is the back-suction calibration parameter two, q3 is the back-suction calibration parameter three, and q4 is the back-suction calibration parameter four.

Images