Terminal, semiconductor device manufacturing system and display method

Abstract

The purpose of the present invention is to provide a technique capable of effectively using a digital instrument panel in a semiconductor device manufacturing apparatus and a semiconductor device manufacturing system. One terminal according to the present invention is connected to a network provided with at least: a first database in which recipe information to be used in a semiconductor manufacturing apparatus for processing a sample is stored; the second database is used for storing an electron microscope image of the sample; and a server capable of directly or indirectly communicating with the first database and the second database, the terminal being characterized by being provided with: a processor for processing a communication protocol with a network; and a user interface (hereinafter referred to as "UI") displaying information stored in the first database or the second database, and displaying a digital instrument panel on the UI, the digital instrument panel displaying the recipe information or the electron microscope image according to a request input from the UI.

Description

Technical Field

[0001] The present invention relates to a terminal, a semiconductor device manufacturing system and a display method. Background Art

[0002] Traditionally, digital dashboards have been used as information analysis tools to display data collected from multiple sources in a unified, real-time format, promoting effective data utilization. Digital dashboards are being used in fields other than marketing and business analysis, as well as manufacturing.

[0003] For example, Patent Document 1 takes "providing a control sequence for a complex machine cluster and a control method for a complex machine cluster for maintaining and optimizing the complex machine cluster using handheld devices such as smartphones or tablet computers" as its subject, and discloses the following content as a control sequence for a complex machine cluster and a control method for a complex machine cluster.

[0004] "A control program for a complex cluster of machines according to an embodiment is executed by a handheld device. The handheld device receives a suggestion or recommendation from a data analysis server that accumulates data on a plurality of complex clusters and generates suggestions or recommendations based on the accumulated data using a machine learning function. The control program causes the handheld device to perform the following steps: displaying a dashboard of a plurality of selection items in a user interface of the handheld device; selecting one of the selection items in the dashboard; displaying the suggestion or recommendation related to the selected selection item in the user interface; and applying the displayed suggestion or recommendation to the complex machine selected from the user interface."

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Laid-Open No. 2021-129295 Summary of the Invention

[0008] -Problems to be solved by the invention-

[0009] Patent Document 1 shows that a digital dashboard is effectively used in a document processing apparatus, but does not envision its effective use in a semiconductor device manufacturing apparatus or a semiconductor device manufacturing system.

[0010] Therefore, an object of the present invention is to provide a technology that can effectively utilize a digital instrument panel in a semiconductor device manufacturing apparatus and a semiconductor device manufacturing system.

[0011] -Methods for solving the problem-

[0012] In order to solve the above-mentioned problems, one of the representative terminals of the present invention is connected to a network, which at least has: a first database, which stores recipe information used in a semiconductor manufacturing device that processes samples; a second database, which stores electron microscope images of the samples; and a server, which can communicate directly or indirectly with the first database and the second database. The terminal is characterized in that it has: a processor, which processes the communication protocol with the network; and a user interface (hereinafter referred to as "UI"), which displays the information stored in the first database or the second database, and displays a digital dashboard on the UI, wherein the digital dashboard displays the recipe information or electron microscope image according to a request input from the UI.

[0013] -Effects of the Invention-

[0014] According to the present invention, a digital instrument panel can be effectively utilized in a semiconductor device manufacturing apparatus and a semiconductor device manufacturing system.

[0015] Other problems, structures, and effects than those described above will become clear from the following description of the specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This diagram shows the configuration of a semiconductor device manufacturing system using an equipment group including semiconductor manufacturing equipment and a platform.

[0017] Figure 2 This is a block diagram showing the structure of a user's personal computer.

[0018] Figure 3 This is a flowchart showing the procedure for creating a report in a semiconductor device manufacturing system.

[0019] Figure 4 This is a diagram showing an example of recipe information input to an etching apparatus.

[0020] Figure 5 A diagram showing a cross-sectional view of a device.

[0021] Figure 6 A diagram showing a microscope image display including a microscope image.

[0022] Figure 7 FIG. 1 is a diagram showing a foreign object information display including information related to a foreign object.

[0023] Figure 8 This is a diagram showing an example of a selection list displayed to a user on an output unit of a personal computer.

[0024] Figure 9 This is a diagram showing an example of a selection list displayed to a user on an output unit of a personal computer.

[0025] Figure 10 This diagram shows the configuration of a semiconductor device manufacturing system using a group of devices including semiconductor device manufacturing equipment and a network. DETAILED DESCRIPTION

[0026] Hereinafter, the embodiment of the present invention will be described with reference to the accompanying drawings. However, the present invention is not limited to the embodiment. In the description of the accompanying drawings, the same reference numerals are used to indicate the same parts.

[0027] When there are multiple components having the same or similar functions, different subscripts may be added to the same reference numerals for description. In addition, when there is no need to distinguish between these multiple components, the subscripts may be omitted for description.

[0028] In addition, in the present disclosure, a “recipe” refers to a processing program that defines the steps and control parameters of a process to be performed in a device.

[0029] [First embodiment]

[0030] (System Structure)

[0031] Reference Figure 1 , the structure of the semiconductor device manufacturing system involved in the first embodiment is described. Figure 1 This diagram shows the configuration of a semiconductor device manufacturing system 1 that utilizes a cluster of equipment including semiconductor manufacturing equipment and a network 117 (hereinafter referred to as "platform 117"). Platform 117 is a network comprising at least a first database storing recipe information used by semiconductor manufacturing equipment that processes samples, a second database storing electron microscope images of the samples, and a server capable of communicating directly or indirectly with the first and second databases.

[0032] The semiconductor device manufacturing system 1 gathers data related to important manufacturing equipment and the like in the manufacture of semiconductor devices, and can analyze the data for evaluating the process in the manufacture of semiconductor devices and maintaining and managing the manufacturing equipment and the like. Figure 1 In FIG, the environment of the application platform 117 is classified into three areas: a device area network, an internal network, and an external network.

[0033] The device area network is a network that connects a control device for a semiconductor manufacturing device (hereinafter referred to as a "PC for a semiconductor manufacturing device") 101, a control device for a semiconductor inspection device (hereinafter referred to as a "PC for a semiconductor inspection device") 102, a control device for a semiconductor analysis device (hereinafter referred to as a "PC for a semiconductor analysis device") 103, a control device for a semiconductor analysis device (hereinafter referred to as a "PC for a semiconductor analysis device") 104, and a relay device (hereinafter referred to as a "relay PC") 105.

[0034] Furthermore, the semiconductor manufacturing equipment PC 101, semiconductor inspection equipment PC 102, semiconductor analysis equipment PC 103, and semiconductor analysis equipment PC 104 are also referred to simply as "equipment PCs 101 to 104." Furthermore, the semiconductor manufacturing equipment and the like controlled by the equipment PCs are also referred to simply as "equipment group 100." In other words, equipment group 100 is a collection of processing equipment that processes samples. Processing equipment performs processes such as manufacturing (etching, etc.), inspection, analysis, and analysis. Processing equipment can also be referred to as semiconductor device manufacturing equipment.

[0035] The internal network is a network that connects a conversion connection device (hereinafter referred to as “gateway PC”) 108 , a user personal computer 114 , a user portable terminal personal computer 115 , and a path setting device (hereinafter referred to as “path setting PC”) 118 .

[0036] The external network connects database server 106, application server 109, web server 110, GPU server 111, and remote monitoring personal computer 116. The internal network and the external network are connected via Internet 113. Furthermore, database server 106, application server 109, web server 110, and GPU server 111 are also referred to simply as "server group 106 and 109-111."

[0037] Platform 117 includes application server 109, GPU server 111, and web server 110. Application server 109 or GPU server 111 is connected to web server 110 via communication means. Platform 117 enables remote access to device PCs 101-104 located in the device area network from user PCs 114 and portable user PCs 115 on the internal network or remote monitoring PCs 116 on the external network. Furthermore, platform 117 includes a network comprising semiconductor manufacturing equipment cluster 100, relay PC 105 for security checks, gateway PC 108 and path setting PC 118 equipped with a data acquisition program, and various databases.

[0038] The configuration of the platform 117 is an example and is not limited to this configuration. For example, the platform may include the application server 109 and the GPU server 111 , and the application server 109 or the GPU server 111 may download data output from the device group 100 .

[0039] (Classification based on security measures)

[0040] Different security measures are implemented for each area of the device area network, internal network, and external network.

[0041] A device area network (DAN) is a network that connects at least semiconductor manufacturing equipment. For example, a DAN comprises manufacturing equipment that constitutes a production line within a semiconductor manufacturing plant. A DAN may also include, for example, equipment that automatically transports components and finished products, and equipment that automatically handles the loading and unloading of components.

[0042] An internal network is, for example, a network connected to servers performing production management. In addition to managing production plans, servers for monitoring production status and acquiring equipment information are also connected to the internal network. Servers collecting information for planning component orders and production plans may also be connected. For example, the internal network may include management departments at headquarters.

[0043] The external network is a network connected to the device area network and the internal network via the Internet. The external network is a network not managed by the semiconductor manufacturing plant or headquarters, and is sometimes connected by the device supplier for remote maintenance, for example.

[0044] Next, we'll explain security measures. For each of the three areas, security measures include preventing intrusion into the communication network, preventing unauthorized intrusion into the area, account management, monitoring of communication and operation logs, and PC and terminal monitoring and alarms. For example, the device area network implements security measures for preventing unauthorized intrusion and restricting the use of PCs and other terminal devices, encompassing a network consisting of devices within a semiconductor manufacturing facility.

[0045] Here, we focus on software updates (particularly OS upgrades) as a security measure. In this case, OS upgrades are expected to eliminate vulnerabilities and prevent unauthorized external access. There are cases where, while OS upgrades are being performed on internal and external networks, there are devices and equipment in the device area network that have not yet undergone the OS upgrade.

[0046] (Structure of each area)

[0047] In the first embodiment, an etching apparatus is used as an example of a processing apparatus. An etching apparatus can also be referred to as a semiconductor manufacturing apparatus that processes semiconductor wafers (hereinafter, simply referred to as "wafers") as samples. The present disclosure is not limited to etching apparatuses and can also be applied to other processing apparatuses. Furthermore, while the following description uses semiconductor wafers, the present disclosure can also be applied to samples other than semiconductor wafers.

[0048] (Device Area Network)

[0049] The semiconductor manufacturing equipment PC 101 is a device that manages the control of devices such as wet etching devices and plasma etching devices (hereinafter also referred to as "etching devices"). The semiconductor inspection equipment PC 102 is a device that controls visual inspection devices such as cameras and microscopes, as well as electrical inspection devices using probes. The semiconductor analysis equipment PC 103 is a device that controls analysis devices such as transmission electron microscopes and atomic force microscopes. For example, the semiconductor analysis equipment PC 104 is a device that controls analysis devices such as TCT gas chromatographs / mass spectrometers and time-of-flight secondary ion mass spectrometers. Furthermore, the semiconductor analysis equipment PC 104 can also control foreign matter detectors such as laser measurement devices that measure foreign matter on wafers after etching. The control devices are categorized according to each function of inspection, analysis, and analysis, but the categorization is not limited to this. Multiple functions can be implemented by a single control device, and can also be appropriately set based on the manufacturing process performed in the semiconductor device manufacturing system 1 of the application platform 117.

[0050] When a process recipe for performing an etching process is input into semiconductor manufacturing equipment PC 101, semiconductor manufacturing equipment PC 101 executes the process recipe. Instructions corresponding to the process recipe are transmitted from semiconductor manufacturing equipment PC 101 to various devices within the etching equipment via the etching equipment, and the etching process is performed within the etching equipment. The executed process recipe is stored in semiconductor manufacturing equipment PC 101.

[0051] The etched wafer is transported to any one of a semiconductor inspection device, a semiconductor analysis device, and a semiconductor analysis device. Upon receiving a measurement recipe for inspection, the semiconductor inspection device PC 102 controls the semiconductor inspection device according to the measurement recipe. The measurement results are stored in the semiconductor inspection device PC 102. Similarly, the semiconductor analysis device PC 103 receives a measurement recipe for analysis and controls the semiconductor analysis device according to the measurement recipe. The measurement results are stored in the semiconductor analysis device PC 103. The semiconductor analysis device PC 104 receives a measurement recipe for analysis and controls the semiconductor analysis device according to the measurement recipe. The measurement results are stored in the semiconductor analysis device PC 104.

[0052] For example, data related to the state of the etching equipment during etching (e.g., pressure, temperature, number of foreign particles, gas type, plasma density, etc.) can be acquired through the equipment cluster 100 and the equipment PCs 101-104. Furthermore, data correlating microscope images of wafers after etching and length measurements of these microscope images can be acquired. Furthermore, data related to the number of foreign particles on the wafers, as measured by a foreign particle counter after etching, can be acquired.

[0053] (Data communication between regions)

[0054] To explain the first embodiment, refer again to Figure 1To explain. In a device area network (DAN) configured with a device cluster 100 including semiconductor manufacturing equipment such as the etching equipment described above, a relay PC 105 is configured, connected to each device cluster 100. The relay PC 105 includes a unit for bidirectionally communicating data between the control devices of each device in the device cluster 100 and the relay PC 105, and a storage unit that stores a program for performing security checks on the data and data that has passed the security checks. Specifically, the relay PC 105 includes a communication unit that enables the collection of data received from the device cluster 100 or the device PCs 101 to 104. The relay PC 105 includes a storage unit that stores data representing results received from the device cluster 100, as well as master data, described later. Access rights are limited to the relay PC 105. For example, using SMB (Server Message Block) communication as a communication protocol, a folder storing the results of each device cluster is created as a shared folder 105a, and access rights are granted to the relay PC 105. This allows the relay PC 105 to collect output data from each device in the device group 100. Furthermore, the relay PC 105 can also transfer (send) data to the device group 100. For example, the relay PC 105 receives a recipe from the gateway PC 108 and inputs it to each device in the device group 100. Furthermore, while the above description illustrates a shared folder 105a, the storage unit is not limited to this. The storage unit can be a storage device within the relay PC 105 or an external storage device such as a hard disk that is independent of the relay PC 105 and connectable to it.

[0055] The relay PC 105 is configured to enable OS upgrades via an external network. Furthermore, the relay PC 105 can also include and execute programs such as antivirus software for data security checks, ensuring that the latest virus definitions are always updated. The shared folder 105a is set as the target for continuous security monitoring within the antivirus software, creating a mechanism for constant security checks on data stored within the shared folder. This shared folder is accessible only from the internal and external networks and serves as a storage location for data such as recipes transferred to the device cluster 100.

[0056] The shared folder 105a manages a device master MA including at least a device ID assigned to each device in the device group 100. The device master MA is also stored in the database server 106 on the external network.

[0057] In addition, although an example of a single shared folder is shown, multiple shared folders may be provided. For example, for a folder storing data in the device PCs 101 to 104 that is to be exported to an external network for effective use, a shared folder may be created between the relay PC 105 and each of the device PCs 101 to 104 using the SMB protocol, for example.

[0058] Furthermore, the device master MA is stored in the database server 106, but may be stored in another server included in the external network.

[0059] (Internal Network)

[0060] An internal network is formed outside the relay PC 105. A gateway PC 108 is located within the internal network. The gateway PC 108 accesses the device master MA based on external network authentication information or platform 117 authentication information, and has a built-in program that retrieves and executes output data permitted by the device master MA from storage. Specifically, the gateway PC 108 can access the shared folder 105a via the relay PC 105, allowing it to collect output data from the device group 100 by referring to the device master MA.

[0061] The path setting PC 118 has a built-in program that allows the output data obtained by the gateway PC 108 accessing the storage unit to be transferred to the internal network, or transfers the output data stored in the storage unit to the device group 100 , and blocks the spontaneous outflow of data from each device in the device group 100 .

[0062] This allows the gateway PC 108 to access the storage unit of the relay PC 105 , while prohibiting data from being transferred from the device area network to the internal network.

[0063] The user personal computer 114 and the user portable terminal personal computer 115 are operated by a user using the platform 117. The semiconductor device manufacturing system 1 is connected to the platform 117, the user personal computer 114, and the user portable terminal personal computer 115 via a communication unit.

[0064] (External Network)

[0065] The database server 106 stores device masters (MAs) and user authentication information. Furthermore, the database server 106 stores output data from each device in the device group (e.g., data representing results obtained by the device group 100, manufacturing data output from each device in the device group 100, and microscope images obtained by microscopes included in the device group 100). The database server 106 may be comprised of multiple database servers, and may include, for example, at least a first database storing recipe information used by semiconductor manufacturing equipment that processes samples and a second database storing electron microscope images of semiconductor wafers.

[0066] Application server 109 receives user requests from web server 110, executes applications, and responds to web server 110. Furthermore, when data retrieval or updates are required, application server 109 makes requests to database server 106, processes the data, and then responds with dynamic content to web server 110. Application server 109 is capable of communicating directly or indirectly with the first and second databases. Direct or indirect communication refers to communication using a wired or wireless communication method and protocol. Application server 109 also includes an editing function for creating reports displayed on the digital dashboard.

[0067] The web server 110 responds to user requests with static web content (HTML pages, files, images, dynamic images, etc.), and also requests processing from the application server 109 when dynamic processing is required, and receives a response of the same dynamic content from the application server 109.

[0068] The database server 106 performs processing according to the request from the application server 109 and transfers the result to the application server 109 .

[0069] When there is a heavy-load request among user requests, the GPU server 111 generates content on behalf of the application server 109 .

[0070] (Structure for obtaining data for use in digital dashboards)

[0071] In this disclosure, a web server 110 shares a digital dashboard with a user's personal computer 114. An application server 109 stores the applications required to create the digital dashboard and executes computational logic within these applications. A database server 106 acquires data on the manufacturing environment, device characteristics, and other data for each recipe. This is described in detail below.

[0072] The database server 106 functions as a DWH (Data Warehouse) and comprehensively stores data used for the digital dashboard. Furthermore, the application server 109 processes data acquired from the processing devices, the first database, and the second database based on templates used in the digital dashboard. Specifically, the application server 109 includes an ETL (Extract, Transform, Load) tool and extracts, transforms, and writes data used for the digital dashboard to the database server 106. The data stored in the database server 106 includes, for example, recipe information related to etching recipes, the status of the etching equipment during etching, the number of foreign matter particles on wafers during etching, microscope images of wafers after etching, and length measurement data. Furthermore, the application server 109 includes a VER application for calculating etching rates, which can calculate etching rates based on length measurement data acquired over time. This data is organized in time series in the database server 106, allowing new data to be stored continuously. Furthermore, data can be arranged in multiple dimensions along axes such as "time," "environmental conditions," and "recipe," enabling analysis of recipe changes, trends within a process over a certain period, and the root causes of changes. Data combinations and visualization methods can be pre-defined, and users can select data and display combinations from templates.

[0073] Furthermore, it is generally assumed that the provider of the digital dashboard service is different from the administrator of the device area network and the internal network. For security reasons, the provider of the digital dashboard service may be subject to restrictions beyond those necessary for processing data within the device area network and the internal network. In the present disclosure, since the database server 106, application server 109, and web server 110 are located in the external network, data processing can be performed without security restrictions, even in the case of the provider of the digital dashboard service. This also provides advantages in service operations such as equipment improvement and maintenance.

[0074] Furthermore, while the database server 106, application server 109, and web server 110 are described as embodiments, this disclosure is not limited to this configuration. For example, a combination of an application server and a database server may be configured for each application. Furthermore, while the web server 110, application server 109, and database server 106 are described as a server configuration, this disclosure is not limited to this configuration; for example, a front-end server and back-end server configuration is also possible. Furthermore, servers are not limited to hardware configurations; servers provided by cloud services may also be used.

[0075] (Structure of the terminal)

[0076] Reference Figure 2 , an example of the structure of the user's personal computer 114 is described. Figure 2 This is a block diagram showing the structure of a user personal computer 114. User personal computer 114 (hereinafter also referred to as a "terminal") includes a processor connected to platform 117 and processing the communication protocol with platform 117; and a user interface (hereinafter referred to as "UI") that displays information stored in the first or second database. A digital dashboard is displayed on the UI, and the digital dashboard displays recipe information or electron microscope images in response to requests input from the UI. This is described in detail below.

[0077] The user personal computer 114 includes a processor 201 , a memory 202 , a storage unit 203 , an input unit 204 , an output unit 205 , and a communication unit 207 , each of which is connected to the processor 201 via a bus 200 .

[0078] The processor 201 controls the various components of the user personal computer 114. Examples of the processor 201 include a CPU (Central Processing Unit), a DSP (Digital Signal Processor), a GPU (Graphics Processing Unit), or an FPGA (Field-Programmable Gate Array). The processor 201 performs processing to enable the functions of the user personal computer 114, such as communication protocols with the platform 117.

[0079] The memory 202 stores programs that realize various functions when executed by the processor 201. The memory 202 is a ROM (Read Only Memory), a RAM (Random Access Memory), or the like.

[0080] The storage unit 203 stores data processed by the processor 201 , data input from the input unit 204 , etc. The storage unit 203 is an HDD (Hard Disk Drive), an SSD (Solid State Drive), or the like.

[0081] The input unit 204 receives a user's request and processes data in the user personal computer 114. The input unit 204 is a mouse, a keyboard, or the like.

[0082] The output unit 205 outputs to the user the result processed by the processor 201. The output unit 205 is, for example, a liquid crystal display or an organic EL (Electro-Luminescence) display.

[0083] The input unit 204 and the output unit 205 share the function of mediating between the user personal computer 114 and the user, and therefore are collectively referred to as an interface (UI). As described later, the UI (particularly the output unit 205) displays a digital dashboard that displays recipe information or an electron microscope image in response to a request input from the UI (particularly the input unit 204).

[0084] The communication unit 207 transmits and receives data with other devices via a network. The communication unit 207 is, for example, a NIC (Network Interface Card), a wireless communication module, a USB (Universal Serial Interface) module, or a serial communication module.

[0085] The above description shows an example of the configuration of the user personal computer 114, and the present invention is not limited to this example.

[0086] In addition, the user portable terminal personal computer 115 has a touch panel display that integrates the input unit 204 and output unit 205 of the user personal computer 114 described above. With respect to other structures, the user portable terminal personal computer 115 and the user personal computer 114 have the same structure. In addition, the remote monitoring personal computer 116 also has the same structure as the user personal computer 114. In the following description, the case of using the user personal computer 114 is described, but the present disclosure can also be applied to the case of using the user portable terminal personal computer 115 and the remote monitoring personal computer 116. However, the operation method and display method of the digital instrument panel do not necessarily have to be shared by the user personal computer 114, the user portable terminal personal computer 115, and the remote monitoring personal computer 116. The operation method and display method can also be changed according to the structure of the personal computer and the user authentication.

[0087] In the following description, a digital dashboard generated by the main application server 109 in the platform 117 is displayed on the output unit 205 of the user's personal computer 114. However, the present disclosure is not limited to this case. For example, the memory 202 of the user's personal computer 114 may store an application for creating a digital dashboard, which is executed by the processor 201.

[0088] How to operate

[0089] When a user utilizes the semiconductor device manufacturing system 1, they register authentication information in order to log in to the platform 117 from the user's personal computer 114. The user's authentication information is stored in the database server 106. When the user enters authentication information such as a user ID and password from the user's personal computer 114, the user's authentication information is compared with the authentication information stored in the database server 106 to authenticate the user. Furthermore, when logging in to the platform 117, the user's authentication information is also applied to the database server 106, the application server 109, the web server 110, and the GPU server 111.

[0090] (Flowchart of control)

[0091] Reference Figure 3 , explaining the process of creating a report. Reports are compiled from information such as indices and device status monitored during the manufacturing phase, and are primarily created when the specifications of devices manufactured using the device cluster 100 are met. In the present disclosure, the digital dashboard can be used to confirm the status of the device cluster 100 and the status of semiconductor wafers during the manufacturing phase, allowing devices to be manufactured to meet specifications while performing various controls such as run-to-run control.

[0092] Figure 3 1 is a flowchart showing the procedure for creating a report in the semiconductor device manufacturing system 1 . Figure 3 (a) represents processing mainly based on a user request inputted from the user using the personal computer 114. Figure 3 (b) and Figure 3 (c) indicates processing mainly performed in the application server 109 included in the platform 117 .

[0093] First, refer to Figure 3 (a) mainly describes the processing performed based on the user's request input from the personal computer 114.

[0094] First, as step S1, the specifications are set. The specifications represent the structure and characteristics of the device to be achieved by the processing performed in the device group 100. For example, in the case of processing using the etching device in the device group 100, the specifications are the shape of the device such as the physical width, etching rate, and depth of the width formed in the device of the wafer. The specifications can also be called the pattern shape after etching, or the etching target, or the size after etching. The specifications are not limited to the numerical values that physically specify the structure, but also include the processing conditions in the manufacturing device and the electrical characteristics of the device. In the case of the etching device, the user inputs the specifications to the semiconductor device manufacturing system 1 using the input unit 204 of the personal computer 114. The device group 100 processes the semiconductor wafer based on the specifications and the recipe set according to the specifications.

[0095] Next, as step S2, a first evaluation is performed. The first evaluation is the initial evaluation of the wafer processed in the equipment group 100. The first evaluation is an evaluation before creating a digital dashboard and a report described later.

[0096] Next, in step S3, the report type (display format) is selected. Selecting a report type refers to choosing how the information in the report will be displayed. For example, if particles (foreign matter) are found to be abnormal at the time of the first evaluation in step S2, a display format suitable for particle analysis (e.g., a line graph showing the number of foreign matter particles during the manufacturing process) can be selected. Report types will be described later.

[0097] Next, in step S4, a second evaluation is performed. A digital dashboard is generated according to the report type selected in step S3, and at the time of the second evaluation, data analysis is performed that effectively utilizes the digital dashboard and specifications. The user can perform data analysis while viewing the digital dashboard displayed on the output unit 205 of the personal computer 114.

[0098] Next, as step S5, the type of data is selected. For example, sometimes it is necessary to analyze the etching rate in the second evaluation in addition to analyzing the particles of interest in the first evaluation. In such a case, the etching rate is selected as the data published on the digital dashboard in addition to the particles. In the second evaluation stage, in addition to collecting the data obtained in the first evaluation stage, in the case of an etching device, information related to the environmental conditions of the processing, such as the pressure and temperature in the chamber, and analytical information such as microscope images of the processed device are also collected. The type of data can be selected from the data related to this information.

[0099] Next, in step S6 , a determination is made as to whether the report is complete. Since a report is generated when the semiconductor device manufacturing system 1 obtains results that meet specifications, the report is generated if the digital dashboard or acquired data confirms that the specifications have been met (Y (Yes) in step S6 ).

[0100] On the other hand, if the specifications are not met (N (No) in step S6), a determination is made in step S7 whether to add a report page. Information related to the added processing is recorded on the added page. If the page is added (Y in step S7), the process returns to step S3 and creates a report related to the added processing performed by the device group 100. The processing is performed again by the device group 100 to meet the specifications.

[0101] If adding pages is not selected (N in step S7), comparison data is added (step S8). If adding comparison data is selected, the process returns to step S5, referencing data obtained during other processing steps for the data currently being processed. A provisional report can then be created (Y in step S6), or the process can be repeated until specifications are met.

[0102] The application server 109 also has the ability to save created reports, read, and retrieve saved reports. Furthermore, the application server 109 has the ability to store reports with a document number (TS-No) attached, and retrieve saved reports using the TS-No as an ID. Reports created by the application server 109 are stored, for example, in the database server 106 with the TS-No attached. When a report is retrieved from the user's personal computer 114, the report is retrieved based on the TS-No and displayed on the output unit 205 of the user's personal computer 114.

[0103] (Selection of report type)

[0104] Reference Figure 3 (b) The selection of the report type in step S3 will be described. First, in step S31, the user's authentication information is confirmed. In step S31, the user enters the authentication information via the input unit 204 of the personal computer 114. The application server 109 compares the authentication information with the authentication information stored in the database server 106. Alternatively, the application server 109 can use the user ID and password entered when the user logged into the platform 117.

[0105] Next, in step S32, a selection list is displayed. The web server 110 displays the selection list on the output unit 205 of the user's personal computer 114. The selection list contains display formats (templates) for reports displayed on the digital dashboard. Examples of these display formats include microscope reports showing information related to microscope images and particle (PA) reports containing information on foreign matter, such as the number of foreign matter particles within the etching equipment and foreign matter particles on the wafer.

[0106] Next, in step S33 , the report format is determined. When the user's selection is received via the input unit 204 of the personal computer 114 , the web server 110 receives the user's selection.

[0107] Next, as step S34, an inquiry is made to the database. The web server 110 inquires the database server 106 for a report corresponding to the determined report type.

[0108] Next, as step S35 , a report display is performed. The web server 110 causes the output unit 205 of the personal computer 114 to display the report of the type selected by the user.

[0109] The process of step S31 is performed to store the user's selection result in association with the user's selection result of the report type. If a report identical to the completed report is to be created, the report type can be selected efficiently by referring to the user and the selected report type information.

[0110] (Selection of data type)

[0111] Reference Figure 3 (c) The selection of the data type in step S5 will be explained. First, in step S51, the user's authentication information is verified. The process for verifying the user's authentication information is the same as in step S31. If the authentication information has an expiration date, step S51 can be omitted if the expiration date in step S31 has expired at the time of step S51.

[0112] Next, in step S52, a selection list is displayed. The web server 110 displays the selection list on the output unit 205 of the user personal computer 114. The selection list lists the types of data used for the report. Examples of these data types include data acquired during processing of each wafer or batch, processing chamber conditions (e.g., vacuum level, temperature, and, in the case of a plasma device, plasma generation status), and captured coordinates in the case of microscope image data.

[0113] Next, in step S53, the data type is determined. When the user's selection is received via the input unit 204 of the personal computer 114, the web server 110 receives the user's selection.

[0114] Next, as step S54, an inquiry is made to the database. The web server 110 inquires the database server 106 about the selected data type.

[0115] Next, in step S35 , data display is performed. The web server 110 causes the user to display a digital dashboard including the data type selected using the output unit 205 of the personal computer 114 .

[0116] When selecting a data type, the user is also stored in association with the result of the data type selection made by the user. This allows efficient selection of the data type in subsequent report creation.

[0117] (Recipe Information)

[0118] Reference Figure 4 , which describes the recipe information input into the device PCs 101 to 104. Figure 4 This diagram shows an example of recipe information input to an etching apparatus. The recipe includes items such as "Step No.", "Processing Time," "Pressure," "Gas Type / Flow Rate," "Microwave Output," "Bias Output," "Temperature," and "Step Name."

[0119] The item "Step No." indicates the process included in the plasma treatment. When the plasma treatment is performed in the etching device, the plasma environment generated in the etching device is realized by the setting conditions set for each step No. "Processing time" indicates the period during which the setting conditions are maintained. "Pressure" indicates the pressure in the etching device where the wafer is placed. "Gas type / flow rate" indicates the type of gas supplied to the etching device and its flow rate. Figure 4 In the example, the case of using three gases is shown. "Microwave output" indicates the output value of the microwave applied to the etching device. "Bias output" indicates the voltage applied to the wafer. "Temperature" indicates the set temperature of the part where the wafer is configured. "Step name" is the search keyword for step No. Figure 4 As shown, enter the given setting value for each item.

[0120] Recipe information is displayed on the digital dashboard in response to a user request input via the user interface of personal computer 114. For example, as described later, when a run number is specified to generate the content of the digital dashboard, the recipe information executed by that run number is displayed on the digital dashboard. Furthermore, when the status of the etching device is specified to generate the content of the digital dashboard, the device driving conditions related to the status of the device are extracted from the recipe information and displayed on the digital dashboard.

[0121] (Specification)

[0122] Next, refer to Figure 5 Describe the specifications. Figure 5 A diagram showing a cross-sectional view of a device. Figure 5 (a) schematically shows the case where the device 120 is etched from the z-axis direction. A resist layer 122 having a given pattern shape is formed on the wafer 121, and the portion of the wafer 121 where the resist layer 122 is not formed is etched to form a groove shape. When determining the groove shape, the width A of the groove portion 121a of the wafer 121, the width B of the convex portion 121b of the wafer 121, the height C of the convex portion 121b, and the thickness D of the resist layer can be used as characteristics of the groove shape. As specifications, such as Figure 5 As shown in (b), given set values are associated with width A to thickness D respectively.

[0123] (Example of report format)

[0124] Next, refer to Figure 6 as well as Figure 7 , explains an example of a report format (how the information published in a report is displayed). Figure 6 as well as Figure 7 This indicates the display format of the information published in the final report and is part of the information displayed on the digital dashboard by the output unit 205 of the user's personal computer 114 during wafer processing. Figure 6 as well as Figure 7 The selection list (equivalent to Figure 2 The digital dashboard includes a microscope report containing a microscope image or a particle report containing foreign matter information. This is described in detail below.

[0125] Figure 6 This figure shows a microscope image display including a microscope image. The microscope image display (microscope report) 300 includes microscope images (SEM. / ER data) 302 and 308. The microscope image 302 corresponds to the data selected from the data selection unit 304. The length measurement table 306 is a table of the device for which the microscope image 302 was obtained, for example, in the specification (equivalent to Figure 2 The length measurement table 306 shows a case where it includes item 1 and item 2, but the number of items may be other than 2.

[0126] The microscope image 308 is obtained by, for example, adding comparative data (equivalent to Figure 2 The microscope image 308 corresponds to the data selected from the data selection unit 310 and is associated with the length measurement table 312 in the same manner as the microscope image 302 .

[0127] The comparison graph (trend graph) 314 shows the values at the time of the microscope image 302 and the values at the time of the microscope image 308 for the length measurement item 1 and the length measurement item 2.

[0128] The microscope image display 300 is set in advance as a template, and displays a microscope image, a length measurement table, and a comparison graph based on the data selected from the data selection unit 304 and the data selection unit 310 .

[0129] In addition, in the above description, the case of including two microscope images is shown, but the present disclosure is not limited to this case. For example, a template including three microscope images may be set.

[0130] Figure 7 This figure shows a foreign matter information display containing information related to foreign matter. Foreign matter information display (particle (PA) report) 400 includes a foreign matter count scatter plot (PA data) 402 showing the temporal variation of foreign matter counts, and a foreign matter distribution graph (PA distribution graph) 406 showing the measurement results of foreign matter on the wafer. Foreign matter count scatter plot 402 corresponds to the data selected by data selection section 404. Foreign matter count scatter plot 402 plots the elapsed time of the etching process on the horizontal axis and the number of foreign matter on the vertical axis. Foreign matter information display 400 updates the information each time the foreign matter count is measured, displaying the measurement results in real time.

[0131] The foreign matter distribution map 406 shows, for example, the distribution of foreign matter on the wafer during the etching process selected from the data selection unit 408. By setting the coordinates of the foreign matter distribution map 406 via the data selection units 410, 414, and 418, the shape and composition of the foreign matter at the set coordinates are displayed in the display fields 412, 416, and 420, respectively.

[0132] (Examples of data types)

[0133] Next, refer to Figure 8 as well as Figure 9 An example of data type is given below. Figure 8 as well as Figure 9 This is a diagram showing an example of a selection list displayed by the user on the output unit 205 of the personal computer 114. The selection list is equivalent to Figure 2 (c) The selection list of step S52.

[0134] Figure 8 (a) shows a selection list 500 displayed when the data selection section 304 for the microscope image 302 is selected in the microscope image display 300. Selection list 500 includes run numbers 001 to 005. A run number is an index corresponding to the wafer being processed, and is added each time a wafer is processed (one time when etching is performed in a batch process). Selection list 500 is displayed on the output section 205 of the user's personal computer 114, and the user selects a run number via the input section 204 of the personal computer 114. The application server 109 has a function for accessing data based on the run number specified by the user through the user interface of the personal computer 114. The application server 109 retrieves a microscope image based on the run number from the database server 106. The microscope image 302 displays a microscope image of the wafer that underwent etching processing in the run number selected by the user.

[0135] Figure 8(b) shows a selection list 502 displayed when the data selection section 404 of the foreign matter count scatter plot 402 is selected in the foreign matter information display 400. Selection list 502 includes states 001 to 005 regarding the conditions within the etching apparatus. Selection list 502 is displayed on the output section 205 of the user's personal computer 114, and the user selects a condition via the input section 204 of the personal computer 114. The foreign matter count scatter plot 402 displays the etching process elapsed time during a given condition as time on the horizontal axis and the number of foreign matter particles within the etching process during that condition as time on the vertical axis.

[0136] Figure 9 (a) shows selection list 504 displayed when data selection section 408 of foreign matter distribution graph 406 is selected in foreign matter information display 400. Selection list 504, like selection list 502, includes discharge times t1 to t5, which represent the elapsed time of discharge during a particular etching process. Selection list 504 is displayed on output section 205 of personal computer 114, and the user selects a discharge time via input section 204 of personal computer 114. Foreign matter distribution graph 406 displays the distribution of foreign matter on the wafer measured at the discharge time selected by the user.

[0137] Figure 9 (b) shows selection list 506 displayed when data selection section 410 is selected in foreign matter information display 400. Selection list 506 includes coordinates 001 to 005 in foreign matter distribution map 406. Selection list 506 is displayed on output section 205 of personal computer 114, and the user selects coordinates via input section 204 of personal computer 114. Display field 412 displays the shape and composition of the foreign matter at the coordinates selected by the user.

[0138] (Action / Effect)

[0139] According to the present invention, a digital dashboard can be effectively utilized in semiconductor device manufacturing equipment and systems. In particular, recipe information and microscope images are unique to semiconductor device manufacturing systems, and this information can be viewed at a glance along with real-time changing information. Furthermore, reports can be created by operating the digital dashboard using templates, reducing the user's burden associated with report creation and improving the efficiency of evaluating the status of semiconductor device manufacturing systems.

[0140] [Second embodiment]

[0141] The second embodiment differs from the first embodiment in that data effectively used in the digital instrument panel is stored in a cache memory.

[0142] Figure 10 This diagram illustrates the configuration of a semiconductor device manufacturing system 1a using a cluster of semiconductor manufacturing equipment and a network 117a (hereinafter referred to as "platform 117a"). In the following description, components identical or equivalent to those in the first embodiment described above are denoted by the same reference numerals, and their descriptions are simplified or omitted.

[0143] Platform 117a includes a cache server 130. Cache server 130 stores data used in the digital dashboard. Cache server 130 can also be composed of multiple cache servers. For example, it can be configured to include a first database storing recipe information used by a processing device for processing samples and a second database storing electron microscope images of the samples. Application server 109 communicates directly or indirectly with the first and second databases and processes data obtained from the processing devices, the first and second databases based on templates used in the digital dashboard.

[0144] Similar to database server 106, cache server 130 also stores data. However, cache server 130 deletes past data from the stored data. For example, as a method for data deletion, a retention period is predetermined for each data type, and data that has been stored for longer than the retention period is deleted. In addition, the data deletion method can be appropriately set according to user requirements.

[0145] Furthermore, although the case of using the cache server 130 has been described, the present disclosure is not limited to this case, and any other configuration may be employed as long as the data effectively used in the digital instrument panel is stored in the cache.

[0146] (Action / Effect)

[0147] Generally speaking, the amount of data involved in wafer processing increases over time, and therefore a storage area needs to have sufficient capacity.

[0148] In contrast, in the second embodiment, cache server 130 deletes past data, ensuring the data required to create the digital dashboard while minimizing storage capacity. Furthermore, when data is requested, cache server 130 reads data faster than a database, reducing the load. This improves the overall performance of semiconductor device manufacturing system 1a when creating digital dashboards and reports.

[0149] As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, Various changes are possible within the range which does not deviate from the summary of this invention.

[0150] The following describes possible embodiments of the present invention, but the present invention is not limited thereto.

[0151] (Method 1)

[0152] A terminal is connected to a network, the network comprising at least: a first database storing recipe information used in a semiconductor manufacturing device that processes a sample; a second database storing an electron microscope image of the sample; and a server capable of communicating directly or indirectly with the first database and the second database, the terminal being characterized in that it comprises: a processor that processes a communication protocol with the network; and a user interface (hereinafter referred to as "UI") that displays information stored in the first database or the second database, a digital dashboard being displayed on the UI, wherein the digital dashboard displays the recipe information or the electron microscope image based on a request input from the UI.

[0153] (Method 2)

[0154] The terminal according to aspect 1, wherein the digital dashboard includes a microscope report including a microscope image or a particle report including foreign matter information.

[0155] (Method 3)

[0156] The terminal according to aspect 1 or 2, wherein the server has an editing function for creating a report based on the display of the digital dashboard.

[0157] (Method 4)

[0158] The terminal according to any one of aspects 1 to 3, wherein the server includes a VER application for calculating an etching rate.

[0159] (Method 5)

[0160] The terminal according to any one of aspects 1 to 4, wherein the server has a function of accessing data using a run number specified from the UI of the terminal.

[0161] (Method 6)

[0162] The terminal according to any one of aspects 1 to 5, wherein the server has functions of storing the report, and reading and retrieving the stored report.

[0163] (Method 7)

[0164] The terminal according to any one of aspects 1 to 6, wherein the server has a function of adding a document number to the report and storing it, and searching the stored report using the document number as an ID.

[0165] (Method 8)

[0166] The terminal according to any one of aspects 1 to 7, wherein the server processes the data acquired from the semiconductor manufacturing equipment, the first database, and the second database based on a template used by the digital dashboard.

[0167] (Method 9)

[0168] The terminal according to aspect 1, wherein the terminal includes a memory, and an application program executed by the processor to create the digital instrument panel is stored in the memory.

[0169] (Method 10)

[0170] A semiconductor device manufacturing system, characterized in that it comprises a network and a terminal, wherein the network comprises at least: a semiconductor manufacturing device for processing samples; a first database for storing recipe information used in the semiconductor manufacturing device; a second database for storing electron microscope images of the samples; and a server capable of communicating directly or indirectly with the first database and the second database, wherein the terminal is directly or indirectly connected to the server in the network, and displays a digital dashboard on a user interface of the terminal according to a request from the terminal, wherein the digital dashboard displays the recipe information or the electron microscope image.

[0171] (Method 11)

[0172] A display method for displaying a digital dashboard in a semiconductor device manufacturing system, wherein the semiconductor device manufacturing system has a network and a terminal, wherein the network has at least: a semiconductor manufacturing device for processing samples; a first database for storing recipe information used in the semiconductor manufacturing device; a second database for storing electron microscope images of the semiconductor wafer; and a server capable of communicating directly or indirectly with the first database and the second database, wherein the terminal has a user interface (hereinafter also referred to as "UI"), which is directly or indirectly connected to the server in the network to display the digital dashboard on the UI, and wherein the display method is characterized in that data obtained from the semiconductor manufacturing device, the first database and the second database are processed based on a template used in the digital dashboard, and the digital dashboard is displayed on the UI according to a request from the terminal via the UI, wherein the digital dashboard displays the recipe information or the electron microscope image.

[0173] -Description of Reference Numerals-

[0174] 1, 1a…Semiconductor device manufacturing system, 101…PC for semiconductor manufacturing equipment, 102…PC for semiconductor inspection equipment, 103…PC for semiconductor analysis equipment, 104…PC for semiconductor analysis equipment, 105…Relay PC, 106…Database server, 108…Gateway PC, 109…Application server, 110…Web server, 111…GPU server, 113…Internet, 114…User personal computer, 115…User portable terminal personal computer, 116…Remote monitoring personal computer, 117, 117a…Platform (network), 118…Path setting PC, 120…Device, 121…Wafer, 122…Resist layer, 130…Cache server, 300…Microscope image display, 400…Foreign matter information display.

Claims

1. A terminal connected to a network comprising at least: a first database storing recipe information used in a semiconductor manufacturing apparatus for processing a sample; a second database storing an electron microscope image of the sample; and a server capable of communicating directly or indirectly with the first database and the second database. The terminal is characterized in that it has: a processor for processing a communication protocol with the network; and A user interface, hereinafter referred to as "UI", displays information stored in the first database or the second database, A digital dashboard is displayed on the UI, wherein: The digital dashboard displays the recipe information or the electron microscope image according to a request input from the UI.

2. The terminal according to claim 1, wherein: The digital dashboard includes a microscope report including a microscope image or a particle report including foreign matter information.

3. The terminal according to claim 1, wherein: The server is provided with an editing function for creating a report based on the display of the digital dashboard. The terminal according to claim 1 , wherein: The server is equipped with a VER application for calculating the etch rate. The terminal according to claim 1 , wherein: The server has a function of accessing data using a run number specified from the UI of the terminal. The terminal according to claim 3 , wherein: The server has the functions of saving the report, reading and retrieving the saved report. The terminal according to claim 6 , wherein: The server has a function of adding a document number to the report and storing it, and searching the stored report using the document number as an ID. The terminal according to claim 1 , wherein: The server processes data acquired from the semiconductor manufacturing equipment, the first database, and the second database based on a template used by the digital dashboard.

9. The terminal according to claim 1, wherein: The terminal has a memory, An application program executed by the processor to create the digital instrument panel is stored in the memory.

10. A semiconductor device manufacturing system, characterized in that: With network and terminal, The network comprises at least: a semiconductor manufacturing device for processing samples; a first database storing recipe information used in the semiconductor manufacturing device; a second database storing electron microscope images of the samples; and a server capable of communicating directly or indirectly with the first database and the second database. The terminal is directly or indirectly connected to the server in the network, In response to a request from the terminal, a digital dashboard is displayed on a user interface provided in the terminal, wherein the digital dashboard displays the recipe information or the electron microscope image.

11. A method for displaying a digital dashboard in a semiconductor device manufacturing system in a user interface, hereinafter also referred to as "UI," The semiconductor device manufacturing system comprises a network and a terminal. in, The network comprises at least: a semiconductor manufacturing device for processing a sample; a first database for storing recipe information used in the semiconductor manufacturing device; a second database for storing an electron microscope image of the sample; and a server capable of communicating directly or indirectly with the first database and the second database. The terminal has the UI and is directly or indirectly connected to the server in the network. The display method is characterized in that processing the data obtained from the semiconductor manufacturing equipment, the first database, and the second database based on the template used in the digital dashboard; The digital dashboard is displayed on the UI according to a request of the terminal via the UI, wherein the digital dashboard displays the recipe information or the electron microscope image.

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