Device for electrical performance test and high-temperature aging test of high-power density module product

Abstract

The invention provides a device for electrical performance test and high-temperature aging test of a high-power-density module product, and relates to the technical field of electronic product test and aging. A large-current clamping structure is arranged, so that the reliability requirement of long-time repeated clamping of a large-current pin in the electrical performance test and high-temperature aging test process of the high-power density module is met; a vertical pressing structure and a double-sided heat dissipation structure are arranged, so that the heat dissipation requirement of a high-power density module in an electrical performance test and a high-temperature aging test when a product works in a high heating state is met; and a double-sided temperature measurement structure is arranged, so that real-time temperature measurement and monitoring can be carried out on the upper surface and the lower surface of the high-power density module product in the electrical performance test and high-temperature aging test processes.

Description

Technical Field

[0001] The present application relates to the field of electronic product testing and aging technology, and in particular to a device for electrical performance testing and high-temperature aging testing of high-power density module products. Background Art

[0002] Module products usually need to undergo electrical performance testing and high-temperature aging tests before leaving the factory. For high-power density module products, due to their large output current and high power density, heat dissipation is usually required during the product electrical performance testing and high-temperature aging test. In existing technologies, the product is mainly tested by mounting a heat sink on the top of the product (the non-pin-out side of the product) and connecting a test board to the bottom (the pin-out side of the product). Figure 1 As shown, Figure 1 The figure is a schematic diagram of the structure of a typical electrical performance test and high-temperature aging test device for a module product in the prior art. A heat sink 01 is fixed on the top of the module product 02, and the module product pins 03 on the bottom are inserted into the pin sockets 04 of the test board 05. In the heat dissipation method of the prior art, since the bottom of the product is not in contact with the heat sink, the heat dissipation performance of the bottom of this type of product during the electrical performance test is relatively poor, and the corresponding temperature will be higher than that of the top of the product. At the same time, since the bottom and top of the product are respectively blocked by the bottom test tooling and the top heat sink, only the side of the product is exposed, and the surface temperature of the product is difficult to monitor. Therefore, the devices for electrical performance testing and high-temperature aging testing of high-power density module products in the prior art usually have the problem of limited heat dissipation capacity at the bottom, and the actual temperature rise of the upper and lower surfaces of the product is difficult to measure and monitor.

[0003] As electronic products continue to advance in performance and miniaturization, their power density is increasing. With the emergence of new-generation high-power-density modules, products generate even greater heat. Existing electrical performance testing and high-temperature aging testing methods are no longer able to meet the demands for heat dissipation and precise temperature control. If excessive loads or ambient temperature fluctuations occur during full-power testing or high-temperature aging, products are prone to over-temperature failure or quality risks.

[0004] In addition, since the pin sleeve 04 of the prior art usually contains a reed structure, the reed's rebound force will decrease after prolonged plugging and unplugging, and the contact between the module product pin 03 and the reed inside the pin sleeve 04 will deteriorate, resulting in a loose connection between the pin and the tooling. And since a large current needs to flow through the pins of this type of product, once a loose connection occurs between the product pin and the tooling, it may cause the product to burn or introduce a quality risk of current burns. At the same time, the pin sleeve 04 is prone to deformation after repeated plugging and unplugging for a long time. Once the pin sleeve 04 is deformed, it is easy to cause the product pin to deform. Therefore, the electrical performance testing and high-temperature aging test methods of the prior art still have the problem that the pin sleeve 04 is prone to loose connection and deformation after long-term use.

[0005] In summary, due to the significant increase in heat generation of the new generation of high-power density module products, the existing electrical performance testing and high-temperature aging test equipment can no longer meet actual needs. It is necessary to improve the capabilities in heat dissipation, temperature measurement and control, and the reliability of long-term repeated clamping of the product's high-current pins. Summary of the Invention

[0006] In view of the above problems, this application provides a device for electrical performance testing and high-temperature aging testing of high-power density module products, which meets the needs of high-current clamping, heat dissipation, and temperature measurement and control of the pins of the new generation of high-power density module products during electrical performance testing and high-temperature aging testing. The specific solution is as follows:

[0007] In a first aspect, the present application provides a device for electrical performance testing and high-temperature aging testing of high-power density module products, the device comprising: a high-power density module, a high-current clamping structure, a vertical pressing structure, a double-sided heat dissipation structure, a double-sided temperature measurement structure, and a product testing unit;

[0008] The high-current clamping structure includes a clamping structure movable seat, a clamping structure fixed seat, a clamping structure slide rail, and a clamping structure pull rod; the clamping structure movable seat and the clamping structure fixed seat are respectively provided with a movable seat elastic component and a fixed seat elastic component, and when the clamping structure pull rod is pulled, the module lead pins of the high-power density module are elastically clamped;

[0009] The vertical pressing structure includes a device base, a pressing structure column, a pressing structure pull rod, a pressing structure pressure plate, an upper heat dissipation block, the clamping structure fixing seat, a lower heat dissipation block, a pressing structure elastic component and a device pillar; the upper heat dissipation block is suspended on the pressing structure pressure plate through the pressing structure elastic component, the pressing structure pressure plate is fixed on the pressing structure column, the pressing structure column is fixed on the device base, the lower heat dissipation block is fixed on the clamping structure fixing seat, and the clamping structure fixing seat is fixed to the device base through the device pillar; after the pressing structure pull rod is pulled down, the upper heat dissipation block and the lower heat dissipation block respectively form elastic extrusion contact with the upper and lower surfaces of the high power density module;

[0010] The double-sided heat dissipation structure includes the upper heat dissipation block, the lower heat dissipation block, an upper heat dissipation fan, a lower heat dissipation fan, and fan fixing screws; the upper heat dissipation fan and the lower heat dissipation fan are respectively fixed to the upper heat dissipation block and the lower heat dissipation block by the fan fixing screws; a lower heat dissipation block boss is provided on the lower heat dissipation block, the upper heat dissipation block contacts the upper surface of the high power density module, and the lower heat dissipation block boss contacts the lower surface of the high power density module;

[0011] The double-sided temperature measurement structure includes an upper temperature measuring component, a lower temperature measuring component, an upper temperature measuring line, a lower temperature measuring line, an upper thermostat, a lower temperature controller, a thermostat fixing screw, the device base, the upper heat sink and the lower heat sink; the upper thermostat and the lower thermostat are respectively fixed to the upper heat sink and the device base by the thermostat fixing screws; the upper temperature measuring component and the lower temperature measuring component respectively form elastic contact with the upper and lower surfaces of the high power density module, and are then connected to the upper thermostat and the lower thermostat via the upper temperature measuring line and the lower temperature measuring line respectively;

[0012] The product testing unit includes module lead-out pins, a movable seat clamping copper sheet, a fixed seat clamping copper sheet, a test board and a test board terminal; the module lead-out pins are clamped and connected by the movable seat clamping copper sheet and the fixed seat clamping copper sheet, and are welded to the test board and led out from the test board terminal.

[0013] Preferably, in the above-mentioned device for electrical performance testing and high-temperature aging testing of high-power density module products, the movable seat elastic component includes the movable seat clamping copper sheet, the fixed seat elastic component includes the fixed seat clamping copper sheet, and the movable seat elastic component and the fixed seat elastic component further include: a spring, a clamping structure front baffle, and a clamping structure rear baffle;

[0014] After the front baffle of the clamping structure and the rear baffle of the clamping structure are fixed by screws, the movable seat clamping copper sheet and the fixed seat clamping copper sheet are limited and fixed; the spring is located between the movable seat clamping copper sheet and the rear baffle of the clamping structure in the movable seat elastic component, and is also located between the fixed seat clamping copper sheet and the rear baffle of the clamping structure in the fixed seat elastic component.

[0015] Preferably, in the above-mentioned device for electrical performance testing and high temperature aging testing of high power density module products, the compression structure elastic component includes a spring and an elastic component screw;

[0016] The elastic component screw passes through the elastic component screw through hole of the pressing structure pressure plate and is fixedly connected to the upper heat dissipation block; the spring is located between the pressing structure pressure plate and the upper heat dissipation block.

[0017] Preferably, in the above-mentioned device for electrical performance testing and high-temperature aging testing of high-power density module products, the upper temperature measuring component and the lower temperature measuring component include a temperature measuring structure limit platform, a temperature measuring structure through hole, a temperature measuring probe, a spring, a temperature measuring structure pressure plate, and a temperature measuring structure pressure plate fixing screw;

[0018] The temperature measuring probe is located in the through hole of the temperature measuring structure, one end of which is used for temperature testing is limited based on the temperature measuring structure limit platform, the other end of the temperature measuring probe in the upper temperature measuring component is connected to the upper temperature measuring line, and the other end of the temperature measuring probe in the lower temperature measuring component is connected to the lower temperature measuring line;

[0019] The spring is provided between the temperature measuring probe and the temperature measuring structure pressure plate;

[0020] The temperature measuring structure pressing plate is fixed by the temperature measuring structure pressing plate fixing screws.

[0021] Preferably, in the above-mentioned device for electrical performance testing and high-temperature aging testing of high-power density module products, the upper temperature measuring line and the lower temperature measuring line are flexible test lines.

[0022] Preferably, in the above-mentioned device for electrical performance testing and high temperature aging testing of high power density module products, the lower temperature measuring line is an L-shaped temperature measuring line, and the lower temperature controller is arranged in an area outside the lower heat dissipation block through a bending connection of the L-shaped temperature measuring line.

[0023] Preferably, in the above-mentioned device for electrical performance testing and high temperature aging testing of high power density module products, a pressure plate opening is provided on the pressure plate of the compression structure, and data of the upper temperature controller located below is read through the pressure plate opening.

[0024] Preferably, in the above-mentioned device for electrical performance testing and high temperature aging testing of high power density module products, a lower heat dissipation block slot is provided on the lower heat dissipation block, and the fixing seat clamping copper sheet passes through the lower heat dissipation block slot.

[0025] Preferably, in the above-mentioned device for electrical performance testing and high-temperature aging testing of high-power density module products, a copper sheet insulating sleeve is provided on the outside of the copper sheet clamped by the fixing seat.

[0026] Preferably, in the above-mentioned device for electrical performance testing and high-temperature aging testing of high-power density module products, the test board is fixed on the device base, and a test board limiting column is provided between the test board and the device base.

[0027] With the help of the above technical solution, the present application provides a device for electrical performance testing and high-temperature aging testing of high-power density module products, including a high-power density module, a high-current clamping structure, a vertical pressing structure, a double-sided heat dissipation structure, a double-sided temperature measurement structure and a product testing unit; it can meet the reliability requirements of the new generation of high-power density module products for long-term repeated high-current clamping during electrical performance testing and high-temperature aging testing, and at the same time meet the requirements of product heat dissipation, temperature measurement and control during electrical performance testing and high-temperature aging testing of the new generation of high-power density module products.

[0028] The apparatus for electrical performance testing and high-temperature aging testing of high-power density module products provided herein incorporates a high-current clamping structure, meeting the reliability requirements for long-term, repeated clamping of high-current pins during electrical performance testing and high-temperature aging testing of next-generation high-power density module products. The high-current clamping structure comprises a movable seat and a fixed seat, both of which contain elastic clamping components (the movable seat elastic component and the fixed seat elastic component, respectively). In the clamped state, it forms a large-area elastic, compressive contact with the module lead pins of the high-power density module (specifically, the clamping copper sheet in the elastic component forms a large-area elastic, compressive contact with the pins), meeting the high-current overcurrent requirements of the high-power density module products. The clamping force of the elastic component is generated by an internal spring. Because the spring operates in a linear elastic region, the clamping force generated by the spring is controllable and stable, allowing for long-term, repeated clamping without significant attenuation. This meets the reliability requirements for long-term, repeated clamping of high-current pins during electrical performance testing and high-temperature aging testing of next-generation high-power density module products.

[0029] The device for electrical performance testing and high-temperature aging testing of high-power density module products provided by the present application is provided with a vertical pressing structure and a double-sided heat dissipation structure, which can meet the heat dissipation requirements of the new generation of high-power density module products when the products are working in a high-heat state during electrical performance testing and high-temperature aging testing, and play a role in stabilizing the shell temperature of the product. In the double-sided heat dissipation structure of the present application, the upper heat dissipation block and the lower heat dissipation block boss respectively form a contact heat dissipation structure with the upper and lower surfaces of the high-power density module. During the process of electrical performance testing or high-temperature aging testing of the product, the double-sided heat dissipation structure can promptly transfer the heat released by the product to the heat dissipation block, thereby stabilizing the shell temperature of the product. At the same time, the vertical pressing structure of the present application is provided with a pressing structure elastic component. When the pressing structure pull rod is pulled down, the elastic force of the pressing structure elastic component can ensure that a close elastic contact is formed between the high-power density module and the upper heat dissipation block and the lower heat dissipation block boss. Based on the elastic force of the spring inside the elastic component, the pressure applied to the module by the vertical clamping structure is controllable, which can ensure that the heat sink forms a close heat dissipation contact with the module surface, while not damaging the module squeezed between the upper and lower heat sinks due to excessive pressure.

[0030] The device for electrical performance testing and high-temperature aging testing of high-power density module products provided by the present application is provided with a double-sided temperature measurement structure, which can perform real-time temperature measurement and monitoring of the upper and lower surfaces of the product during the electrical performance testing and high-temperature aging testing of the new generation of high-power density module products, and the shell temperature of the product can be accurately adjusted and set based on the test data. In the double-sided temperature measurement structure of the present application, the upper temperature measuring component and the lower temperature measuring component respectively form a close elastic contact with the upper and lower surfaces of the high-power density module, and then are connected to the upper temperature controller and the lower temperature controller via the upper temperature measuring line and the lower temperature measuring line respectively. The spring structure inside the temperature measuring component can ensure that the temperature measuring probe forms a close elastic extrusion contact with the module surface after the vertical pressing structure of the present device is pressed together, completing the accurate collection of the upper and lower surface temperatures of the module, and can also ensure that the vertical pressing process will not cause damage to the module and the probe, thereby meeting the reliability requirements of the temperature measuring structure for long-term repeated use. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The above and other features, advantages, and aspects of the various embodiments of the present disclosure will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. Throughout the drawings, the same or similar reference numerals represent the same or similar elements. It should be understood that the drawings are schematic and that the originals and elements are not necessarily drawn to scale.

[0032] Figure 1 A schematic diagram of the structure of a typical electrical performance test and high-temperature aging test device for a conventional module product;

[0033] Figure 2 A schematic structural diagram of a device for electrical performance testing and high-temperature aging testing of high-power density module products provided by an embodiment of the present invention;

[0034] Figure 3 A schematic structural diagram of a high power density module product provided by an embodiment of the present invention;

[0035] Figure 4 A schematic structural diagram of a high current clamping structure provided by an embodiment of the present invention;

[0036] Figure 5 A schematic cross-sectional view of an elastic component in an unclamped state in a clamping structure provided by an embodiment of the present invention;

[0037] Figure 6 A schematic cross-sectional view of an elastic component in a clamping structure provided by an embodiment of the present invention in a clamping state;

[0038] Figure 7 A schematic structural diagram of a vertical compression structure provided by an embodiment of the present invention in an uncompressed state;

[0039] Figure 8A schematic diagram of the structure of a vertical compression structure in a compressed state provided by an embodiment of the present invention;

[0040] Figure 9 A schematic diagram of the structure of an elastic component of a compression structure provided by an embodiment of the present invention in an uncompressed state;

[0041] Figure 10 A schematic diagram of the structure of an elastic component of a compression structure provided by an embodiment of the present invention in a compressed state;

[0042] Figure 11 A schematic structural diagram of a double-sided heat dissipation structure provided by an embodiment of the present invention;

[0043] Figure 12 A schematic structural diagram of an upper heat dissipation block provided in an embodiment of the present invention;

[0044] Figure 13 A schematic structural diagram of a lower heat dissipation block provided by an embodiment of the present invention;

[0045] Figure 14 A schematic structural diagram of a double-sided temperature measurement structure provided by an embodiment of the present invention;

[0046] Figure 15 A schematic structural diagram of a temperature measuring component provided by an embodiment of the present invention;

[0047] Figure 16 A schematic structural diagram of a product testing unit provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0048] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application. The terms used in the implementation methods of the present application are only used to explain the specific embodiments of the present application and are not intended to limit the present application. It is known to those skilled in the art that with the development of technology and the emergence of new scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0049] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0050] It should be noted that the directional words appearing in the present invention are based on the relative position relationship shown in the drawings and cannot be used as an absolute limitation to the present application.

[0051] refer to Figure 2 , Figure 2 A schematic diagram of a device for electrical performance testing and high temperature aging testing of a high power density module product provided by an embodiment of the present invention, with reference to Figure 3 , Figure 3A schematic diagram of the structure of a high-power density module product provided by an embodiment of the present invention. The apparatus for electrical performance testing and high-temperature aging testing of a high-power density module product provided by an embodiment of the present invention includes: a high-power density module 30, a high-current clamping structure, a vertical compression structure, a double-sided heat dissipation structure, a double-sided temperature measurement structure, and a product testing unit.

[0052] like Figure 3 As shown, the high power density module 30 in the embodiment of the present application is a module product with a dual in-line pin structure, and the high power density module 30 includes module lead pins 31, which are located at the edges of the two opposite sides of the bottom surface of the product.

[0053] refer to Figure 4 , Figure 4 This is a schematic diagram of a high-current clamping structure provided by an embodiment of the present invention. The high-current clamping structure includes a movable clamping seat 22, a fixed clamping seat 23, a clamping slide rail 21, and a clamping rod 20. The movable clamping seat 22 and the fixed clamping seat 23 are respectively provided with a movable seat elastic component 32 and a fixed seat elastic component 33. When the clamping rod 20 is pulled or closed, it elastically clamps the module lead pins 31 of the high-power density module 30.

[0054] like Figure 4 As shown, the clamping structure slide rail 21 is fixed to the clamping structure fixed seat 23. One end of the clamping structure movable seat 22 is fixed to the clamping structure pull rod 20, and the other end is fixed to the slider on the clamping structure slide rail 21. As the clamping structure pull rod 20 is pushed or pulled, the clamping structure movable seat 22 is driven to move, completing the clamping between the clamping structure movable seat 22 and the clamping structure fixed seat 23.

[0055] in, Figure 4 The middle reference numeral 34 represents a fixing screw of the movable seat.

[0056] refer to Figure 5 , Figure 5 This is a cross-sectional diagram of an elastic component in a clamping structure provided by an embodiment of the present invention in an unclamped state, with reference to Figure 6 , Figure 6 This is a schematic cross-sectional view of the elastic components of a clamping structure in an embodiment of the present invention in a clamped state. The movable seat elastic component 32 includes a movable seat clamping copper sheet 37, and the fixed seat elastic component 33 includes a fixed seat clamping copper sheet 38. The movable seat elastic component 32 and the fixed seat elastic component 33 also include a spring 42, a clamping structure front baffle 40, and a clamping structure rear baffle 41.

[0057] After the front baffle plate 40 of the clamping structure and the rear baffle plate 41 of the clamping structure are fixed by screws, the movable seat clamping copper sheet 37 and the fixed seat clamping copper sheet 38 are limited and fixed; the spring 42 is located between the movable seat clamping copper sheet 37 and the clamping structure rear baffle plate 41 in the movable seat elastic component 32, and is also located between the fixed seat clamping copper sheet 38 and the clamping structure rear baffle plate 41 in the fixed seat elastic component 33, so that the movable seat clamping copper sheet 37 or the fixed seat clamping copper sheet 38 has elastic force when squeezed.

[0058] like Figure 5 and Figure 6 As shown, after the clamping structure front baffle 40 and the clamping structure rear baffle 41 are fixed with screws, the copper sheet (including the movable seat clamping copper sheet 37 and the fixed seat clamping copper sheet 38) and the spring 42 structure are fixed in the area between the front and rear baffles. When the clamping elastic component is used to clamp the module lead pin 31, the copper sheet of the clamping elastic component is squeezed to a position flush with the surface of the clamping structure front baffle 40. At this time, under the elastic thrust of the internal spring 42, the clamping copper sheet forms a tight elastic extrusion contact with the module lead pin 31, achieving the elastic extrusion clamping of the module lead pin 31 in the high-power density module product of this application.

[0059] In addition, the two clamping copper plates (the movable seat clamping copper plate 37 and the fixed seat clamping copper plate 38) of the large current clamping structure in the embodiment of the present application are both planar. After clamping the module lead-out pin 31, they can form a large-area contact with the module lead-out pin 31, meeting the requirements of large current transmission of the module lead-out pin 31.

[0060] refer to Figure 7 , Figure 7 This is a schematic diagram of a vertical compression structure in an uncompressed state provided by an embodiment of the present invention, with reference to Figure 8 , Figure 8A schematic diagram of a structure of a vertical clamping structure in a compressed state provided by an embodiment of the present invention. The vertical clamping structure includes a device base 11, a clamping structure column 12, a clamping structure pull rod 13, a clamping structure pressure plate 14, an upper heat dissipation block 17, the clamping structure fixing seat 23, a lower heat dissipation block 24, a clamping structure elastic component 15 and a device pillar 29; the upper heat dissipation block 17 is suspended on the clamping structure pressure plate 14 through the clamping structure elastic component 15, the clamping structure pressure plate 14 is fixed on the clamping structure column 12, the clamping structure column 12 is fixed on the device base 11, the lower heat dissipation block 24 is fixed on the clamping structure fixing seat 23, and the clamping structure fixing seat 23 is fixed on the device base 11 through the device pillar 29; after the clamping structure pull rod 13 is pulled down, the upper heat dissipation block 17 and the lower heat dissipation block 24 respectively form a tight elastic extrusion contact with the upper and lower surfaces of the high power density module 30.

[0061] like Figure 7 and Figure 8 As shown, the lower heat sink 24 is fixed to the clamping structure fixing seat 23 via lower heat sink fixing screws 35. The clamping structure fixing seat 23 is fixed to the device pillar 29 via fixing seat screws 36, and the device pillar 29 is then fixed to the device base 11. The compression structure pressure plate 14 is fixed to the slider on the compression structure column 12. When the compression structure pull rod 13 is compressed and pulled, the compression structure pressure plate 14 can move up and down along the slide rail on the compression structure column 12.

[0062] refer to Figure 9 , Figure 9 This is a schematic diagram of a structure of a compression structure elastic component in an uncompressed state provided by an embodiment of the present invention, with reference to Figure 10 , Figure 10 This is a schematic diagram of the structure of a compression structure elastic component in a compressed state according to an embodiment of the present invention. The compression structure elastic component 15 includes a spring 42 and an elastic component screw 43. The elastic component screw 43 passes through the elastic component screw through hole 44 of the compression structure pressure plate 14 and is fixedly connected to the upper heat sink 17. The spring 42 is located between the compression structure pressure plate 14 and the upper heat sink 17, providing elastic support.

[0063] like Figure 9 and Figure 10As shown, the top of the elastic component screw 43 has a nut structure. In the unpressed state, the upper heat sink 17 is suspended on the compression structure pressure plate 14 by the nut structure at the top of the elastic component screw 43. In this state, the spring 42 between the compression structure pressure plate 14 and the upper heat sink 17 is in a slightly compressed state. Its elastic force is only used to stabilize the structure and prevent the suspended upper heat sink 17 from shaking. During the pressing process, the upper heat sink 17 moves downward under the control of the compression structure pull rod 13. After contacting the upper surface of the high power density module 30, the upper heat sink 17 stops moving downward, while the compression structure pressure plate 14 continues to move downward for a distance. After the pressing is completed, the spring 42 is in a significant elastic compression state. At this time, the elastic force of the spring 42 is applied downward to the upper heat sink 17, which can ensure close elastic contact between the high power density module 30 and the upper heat sink 17 and the lower heat sink boss 25. At the same time, based on the elastic force of the spring 42 inside the elastic component 15 of the clamping structure, the pressure applied to the high power density module 30 by the vertical clamping structure is controllable, which can ensure that the heat dissipation block forms a close heat dissipation contact with the surface of the high power density module 30, and will not damage the high power density module 30 squeezed between the upper and lower heat dissipation blocks due to excessive pressure.

[0064] refer to Figure 11 , Figure 11 A schematic diagram of a double-sided heat dissipation structure provided by an embodiment of the present invention, referring to Figure 12 , Figure 12 A schematic diagram of the structure of an upper heat dissipation block provided by an embodiment of the present invention, referring to Figure 13 , Figure 13 A schematic diagram of the structure of a lower heat sink provided in an embodiment of the present invention. The double-sided heat sink structure includes an upper heat sink 17, a lower heat sink 24, an upper heat sink fan 18, a lower heat sink fan 26, and fan fixing screws 46. The upper heat sink fan 18 and the lower heat sink fan 26 are respectively fixed to the upper heat sink 17 and the lower heat sink 24 via the fan fixing screws 46. A lower heat sink boss 25 is provided on the lower heat sink 24. The upper heat sink 17 contacts the upper surface of the high-power density module 30, and the lower heat sink boss 25 contacts the lower surface of the high-power density module 30, and the two together form a heat sink structure.

[0065] in, Figure 12 The middle reference numeral 45 indicates a screw hole for fixing the elastic component, the reference numeral 49 indicates a screw hole for fixing the thermostat, and the reference numeral 50 indicates a screw hole for fixing the pressure plate of the temperature measuring structure.

[0066] Figure 13 The middle reference numeral 51 indicates the fixing screw hole of the lower heat sink.

[0067] like Figure 11-13As shown, the lower heat sink 24 is provided with a lower heat sink boss 25. When the vertical compression structure is tightened, the lower heat sink 24 dissipates heat through contact between the lower surface of the high-power density module 30 (i.e., the lead-out surface of the module lead-out pins 31) via the lower heat sink boss 25. In this embodiment of the present application, the boss design of the lower heat sink 24 avoids the high-current clamping area of ​​the device, allowing the device of the present application to simultaneously complete the power-on operation of the high-power density module product and the heat dissipation operation of the product bottom.

[0068] In a specific application example, in order to achieve better heat dissipation performance, thermal grease can be applied between the contact surface of the heat sink and the high power density module 30. The thermal grease can fill the tiny gap between the high power density module product and the heat sink, further reducing the interface thermal resistance and improving the heat dissipation performance of the high power density module product in the embodiment of the present application.

[0069] In order to improve the heat dissipation performance of the heat sink, a heat dissipation tooth 47 structure is provided on the heat sink (including the upper heat sink 17 and the lower heat sink 24) in the embodiment of the present application, and a heat dissipation fan is also provided at one end of the heat sink. When the heat generated by the high-power density module product is transferred to the heat sink, the forced convection air formed by the heat dissipation fan can promptly transfer the heat on the heat sink to the surrounding air, thereby improving the heat dissipation capacity of the entire device.

[0070] It should be noted that larger heat sinks improve heat dissipation performance. In practical applications, heat sinks of varying sizes can be configured based on the varying heat output of high-power density modules. By adjusting heat dissipation capacity for different product models, precise control of product case temperature can be achieved during electrical performance testing and high-temperature aging tests.

[0071] refer to Figure 14 , Figure 14A schematic diagram of a double-sided temperature measurement structure provided in an embodiment of the present invention. The double-sided temperature measurement structure includes an upper temperature measurement component 53, a lower temperature measurement component 54, an upper temperature measurement line 56, a lower temperature measurement line 57, an upper thermostat 19, a lower temperature controller 27, a thermostat fixing screw 55, the device base 11, the upper heat sink 17, and the lower heat sink 24. The upper thermostat 19 and the lower thermostat 27 are fixed to the upper heat sink 17 and the device base 11, respectively, via the thermostat fixing screw 55. The upper temperature measurement component 53 and the lower temperature measurement component 54 respectively form close elastic contact with the upper and lower surfaces of the high power density module 30, and are then connected to the upper thermostat 19 and the lower thermostat 27, respectively, via the upper temperature measurement line 56 and the lower temperature measurement line 57. Among them, the temperature measuring probes 58 in the upper temperature measuring component 53 and the lower temperature measuring component 54 respectively form close elastic contact with the upper and lower surfaces of the high power density module 30, and are then connected to the upper temperature controller 19 and the lower temperature controller 27 through the upper temperature measuring line 56 and the lower temperature measuring line 57 respectively.

[0072] like Figure 14 As shown, combined Figure 2 As can be seen from the structure of the device shown, in order to be able to directly observe and read the data of the temperature controller in the double-sided temperature measurement structure, the embodiment of the present application adopts a targeted structural design scheme. First, a pressure plate opening 16 is set on the compression structure pressure plate 14. The pressure plate opening 16 exposes the upper temperature controller 19 located directly below it, so that the test data on the surface of the upper temperature controller 19 can be easily observed and read through the pressure plate opening 16. The lower temperature measuring line 57 is designed to be an L-shaped temperature measuring line. The lower temperature controller 27 is set in the area outside the lower part of the lower heat dissipation block 24 through the bending connection of the L-shaped temperature measuring line. In this way, the test data on the surface of the lower temperature controller 27 can be easily observed and read. In other words, through the bending connection of the L-shaped temperature measuring line, the lower temperature controller 27 connected to it is set outside the shielding area below the lower heat dissipation block 24, so that the test data on the surface of the lower temperature controller 27 can be easily observed and read.

[0073] It should be noted that the setting of the pressure plate opening 16 on the compression structure pressure plate 14 and the design of the lower temperature measuring line 57 as an L-shaped temperature measuring line are both for setting the upper and lower temperature controllers to areas that can be directly observed, facilitating direct observation and data reading of the temperature controllers.

[0074] The dual-sided temperature measurement structure provided in the embodiments of this application enables real-time temperature measurement and monitoring of the upper and lower surfaces of next-generation high-power density module products during electrical performance testing and high-temperature aging tests. Based on this test data, the product housing temperature can be precisely adjusted and configured. More specifically, based on the real-time temperature data collected by the dual-sided temperature measurement structure, heat dissipation capacity can be adjusted for different product models by configuring heat sinks of different sizes. By adjusting the heat dissipation capacity of the heat sinks, precise control of the product housing temperature can be achieved during electrical performance testing and high-temperature aging tests.

[0075] In the embodiment of the present application, an upper temperature measuring component 53 is provided below the upper temperature controller 19. To avoid interference between the two, two bosses are provided below the upper temperature controller 19 so that a certain safety gap is formed between the fixed upper temperature controller 19 and the upper temperature measuring component 53.

[0076] refer to Figure 15 , Figure 15 Schematic diagram of the structure of a temperature measuring component provided in an embodiment of the present invention. The upper temperature measuring component 53 and the lower temperature measuring component 54 include a temperature measuring structure limiter 61, a temperature measuring structure through hole 48, a temperature measuring probe 58, a spring 42, a temperature measuring structure pressure plate 59, a temperature measuring structure pressure plate fixing screw 60, an upper temperature measuring line 56, and a lower temperature measuring line 57.

[0077] The temperature measuring probe 58 is located in the through hole 48 of the temperature measuring structure, and one end used for temperature testing is limited based on the temperature measuring structure limit platform 61. The other end of the temperature measuring probe 58 in the upper temperature measuring component 53 is connected to the upper temperature measuring line 56, and the other end of the temperature measuring probe 58 in the lower temperature measuring component 54 is connected to the lower temperature measuring line 57.

[0078] The spring is provided between the temperature measuring probe 58 and the temperature measuring structure pressure plate 59 so that the temperature measuring probe 58 can maintain a certain elasticity when subjected to a squeezing force.

[0079] The temperature measuring structure pressing plate 59 is fixed by the temperature measuring structure pressing plate fixing screws 60 .

[0080] like Figure 15As shown, the temperature measuring component includes a spring 42 structure. After the vertical compression structure of this device is pressed, the temperature measuring probe 58 is squeezed to a position flush with the surface of the heat sink (including the upper heat sink 17 and the lower heat sink boss 25). At this time, under the outward elastic thrust of the internal spring 42, the temperature measuring probe 58 can ensure that the temperature measuring probe 58 forms a close elastic compression contact with the surface of the high-power density module 30, completing the accurate acquisition of the upper and lower surface temperatures of the high-power density module 30. It also ensures that the vertical compression process does not cause damage to the temperature measuring probe 58, meeting the reliability requirements of the temperature measuring component for long-term repeated use. When the vertical compression structure is released, the elastic force of the spring 42 returns the temperature measuring probe 58 to its original initial position.

[0081] Optionally, the upper temperature measuring line 56 and the lower temperature measuring line 57 are flexible test lines.

[0082] It can be seen from the working process of the aforementioned temperature measuring component that during the compression process of the vertical compression structure of this device, the temperature measuring probe 58 will be squeezed and move up and down. Selecting a flexible test line can ensure that the temperature measuring probe 58 can move up and down without restriction.

[0083] refer to Figure 16 , Figure 16 This is a schematic diagram of the structure of a product testing unit provided in an embodiment of the present invention. The product testing unit includes module lead pins 31, a movable base clamping copper plate 37, a fixed base clamping copper plate 38, a test board 28, and test board wiring terminals 62. The module lead pins 31 are clamped and connected by the movable base clamping copper plate 37 and the fixed base clamping copper plate 38, then welded to the test board 28 and led out through the test board wiring terminals 62.

[0084] like Figure 16 As shown, since the device structure in the embodiment of the present application adopts a double-sided heat dissipation structure, heat dissipation blocks are provided on both the front and back sides of the high-power density module product. The fixed seat clamping copper sheet 38 of the product test unit needs to pass through the lower heat dissipation block 24 provided at the bottom of the product. To this end, the present application provides a lower heat dissipation block slot 52 on the lower heat dissipation block 24. After being clamped and connected by the movable seat clamping copper sheet 37 and the fixed seat clamping copper sheet 38, the module lead pin 31 passes through the lower heat dissipation block slot 52 provided on the lower heat dissipation block 24 and is welded to the test board 28 located at the bottom of the lower heat dissipation block 24 via solder joints 66. In addition, to ensure the electrical isolation and insulation performance of the test unit, a copper sheet insulation sleeve 39 is provided on the outside of the fixed seat clamping copper sheet 38 that passes through the lower heat dissipation block slot 52.

[0085] The test board 28 also includes test circuit components 65 and test board terminals 62 for further connection to external devices. Since the fixing seat clamping copper sheet 38 and the test board terminals 62 are both soldered to the test board 28 by through-hole insertion, a certain distance must be reserved between the test board 28 and the device base 11 when the test board 28 is fixed. To this end, in the fixing structure of the test board 28 of the present application, a test board limiting column 64 is provided between the test board 28 and the device base 11. After fixing, a gap equal to the height of the test board limiting column 64 is formed between the test board 28 and the device base 11.

[0086] in, Figure 16 The number 63 in the middle represents the test plate fixing screw.

[0087] In summary, the present application provides a device for electrical performance testing and high-temperature aging testing of high-power density module products, including a high-power density module 30, a high-current clamping structure, a vertical pressing structure, a double-sided heat dissipation structure, a double-sided temperature measurement structure and a product testing unit; it can meet the reliability requirements of long-term repeated high-current clamping of the new generation of high-power density module products during electrical performance testing and high-temperature aging testing, and at the same time meet the requirements of product heat dissipation, temperature measurement and control of the new generation of high-power density module products during electrical performance testing and high-temperature aging testing.

[0088] The apparatus for electrical performance testing and high-temperature aging testing of high-power density module products provided herein incorporates a high-current clamping structure, meeting the reliability requirements for long-term, repeated clamping of high-current pins during electrical performance testing and high-temperature aging testing of next-generation high-power density module products. The high-current clamping structure comprises a movable seat and a fixed seat, both of which contain elastic clamping components (movable seat elastic component 32 and fixed seat elastic component 33, respectively). In the clamped state, it forms a large-area elastic, compressive contact with the module lead pins 31 of the high-power density module 30 of the present application (specifically, the clamping copper sheet in the elastic component forms a large-area elastic, compressive contact with the pins), meeting the high-current overcurrent requirements of the present high-power density module products. The clamping force of the elastic component is generated by an internal spring 42. Because the spring 42 operates in a linear elastic region, the clamping force generated by the spring 42 is controllable and stable, allowing for long-term, repeated clamping without significant attenuation. This meets the reliability requirements for long-term, repeated clamping of high-current pins of next-generation high-power density module products during electrical performance testing and high-temperature aging testing.

[0089] The apparatus for electrical performance testing and high-temperature aging testing of high-power density module products provided in this application is equipped with a vertical compression structure and a double-sided heat dissipation structure. This structure can meet the heat dissipation requirements of the new generation of high-power density module products operating in high-heat conditions during electrical performance testing and high-temperature aging testing, and stabilize the product shell temperature. In this double-sided heat dissipation structure, the upper heat dissipation block 17 and the lower heat dissipation block boss 25 respectively form a contact heat dissipation structure with the upper and lower surfaces of the high-power density module 30. During the product's electrical performance testing or high-temperature aging test, the double-sided heat dissipation structure can promptly transfer the heat released by the product to the heat dissipation block, thereby stabilizing the product shell temperature. Furthermore, the vertical compression structure of this application is equipped with a compression structure elastic component 15. When the compression structure pull rod 13 is pulled downward, the elastic force of the compression structure elastic component 15 ensures close elastic contact between the high-power density module 30 and the upper heat dissipation block 17 and the lower heat dissipation block boss 25. Based on the elastic force of the spring 42 in the elastic component, the pressure applied to the module by the vertical clamping structure is controllable, which can ensure that the heat sink forms a close heat dissipation contact with the module surface, while not damaging the module squeezed between the upper and lower heat sinks due to excessive pressure.

[0090] The device for electrical performance testing and high-temperature aging testing of high-power density module products provided by the present application is equipped with a double-sided temperature measurement structure, which can measure and monitor the temperature of the upper and lower surfaces of the new generation of high-power density module products in real time during the electrical performance testing and high-temperature aging testing. Based on the test data, the shell temperature of the product can be accurately adjusted and set. In the double-sided temperature measurement structure of the present application, the upper temperature measuring component 53 and the lower temperature measuring component 54 respectively form a close elastic contact with the upper and lower surfaces of the high-power density module 30, and then are connected to the upper temperature controller 19 and the lower temperature controller 27 via the upper temperature measuring line 56 and the lower temperature measuring line 57 respectively. The spring structure inside the temperature measuring component can ensure that the temperature measuring probe 58 forms a close elastic extrusion contact with the module surface after the vertical compression structure of the present device is pressed together, completing the accurate collection of the upper and lower surface temperatures of the module, and can also ensure that the vertical compression process will not cause damage to the module and the temperature measuring probe 58, meeting the reliability requirements of the temperature measuring structure for long-term repeated use.

[0091] The above is a detailed introduction to the device for electrical performance testing and high-temperature aging testing of a high-power density module product provided by the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

[0092] It should be noted that each embodiment in this specification focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referenced to each other.

[0093] It should also be noted that the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that the process, method, article, or apparatus comprising a series of elements inherent to, or also including elements inherent to, such processes, methods, articles, or apparatuses. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of additional identical elements in the process, method, article, or apparatus comprising the element.

[0094] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A device for electrical performance testing and high temperature aging testing of high power density module products, characterized in that: The device for electrical performance testing and high-temperature aging testing of high-power density module products includes: a high-power density module, a high-current clamping structure, a vertical pressing structure, a double-sided heat dissipation structure, a double-sided temperature measurement structure, and a product testing unit; The high-current clamping structure includes a clamping structure movable seat, a clamping structure fixed seat, a clamping structure slide rail, and a clamping structure pull rod; the clamping structure movable seat and the clamping structure fixed seat are respectively provided with a movable seat elastic component and a fixed seat elastic component, and when the clamping structure pull rod is pulled, the module lead pins of the high-power density module are elastically clamped; The vertical pressing structure includes a device base, a pressing structure column, a pressing structure pull rod, a pressing structure pressure plate, an upper heat dissipation block, the clamping structure fixing seat, a lower heat dissipation block, a pressing structure elastic component and a device pillar; the upper heat dissipation block is suspended on the pressing structure pressure plate through the pressing structure elastic component, the pressing structure pressure plate is fixed on the pressing structure column, the pressing structure column is fixed on the device base, the lower heat dissipation block is fixed on the clamping structure fixing seat, and the clamping structure fixing seat is fixed to the device base through the device pillar; after the pressing structure pull rod is pulled down, the upper heat dissipation block and the lower heat dissipation block respectively form elastic extrusion contact with the upper and lower surfaces of the high power density module; The double-sided heat dissipation structure includes the upper heat dissipation block, the lower heat dissipation block, an upper heat dissipation fan, a lower heat dissipation fan, and fan fixing screws; the upper heat dissipation fan and the lower heat dissipation fan are respectively fixed to the upper heat dissipation block and the lower heat dissipation block by the fan fixing screws; a lower heat dissipation block boss is provided on the lower heat dissipation block, the upper heat dissipation block contacts the upper surface of the high power density module, and the lower heat dissipation block boss contacts the lower surface of the high power density module; The double-sided temperature measurement structure includes an upper temperature measuring component, a lower temperature measuring component, an upper temperature measuring line, a lower temperature measuring line, an upper thermostat, a lower temperature controller, a thermostat fixing screw, the device base, the upper heat sink and the lower heat sink; the upper thermostat and the lower thermostat are respectively fixed to the upper heat sink and the device base by the thermostat fixing screws; the upper temperature measuring component and the lower temperature measuring component respectively form elastic contact with the upper and lower surfaces of the high power density module, and are then connected to the upper thermostat and the lower thermostat via the upper temperature measuring line and the lower temperature measuring line respectively; The product testing unit includes module lead-out pins, a movable seat clamping copper sheet, a fixed seat clamping copper sheet, a test board and a test board terminal; the module lead-out pins are clamped and connected by the movable seat clamping copper sheet and the fixed seat clamping copper sheet, and are welded to the test board and led out from the test board terminal.

2. The device for electrical performance testing and high temperature aging testing of high power density module products according to claim 1, characterized in that: The movable seat elastic component includes the movable seat clamping copper sheet, the fixed seat elastic component includes the fixed seat clamping copper sheet, and the movable seat elastic component and the fixed seat elastic component further include: a spring, a clamping structure front baffle and a clamping structure rear baffle; After the front baffle of the clamping structure and the rear baffle of the clamping structure are fixed by screws, the movable seat clamping copper sheet and the fixed seat clamping copper sheet are limited and fixed; the spring is located between the movable seat clamping copper sheet and the rear baffle of the clamping structure in the movable seat elastic component, and is also located between the fixed seat clamping copper sheet and the rear baffle of the clamping structure in the fixed seat elastic component.

3. The device for electrical performance testing and high temperature aging testing of high power density module products according to claim 1, characterized in that: The compression structure elastic component includes a spring and an elastic component screw; The elastic component screw passes through the elastic component screw through hole of the pressing structure pressure plate and is fixedly connected to the upper heat dissipation block; the spring is located between the pressing structure pressure plate and the upper heat dissipation block.

4. The device for electrical performance testing and high temperature aging testing of high power density module products according to claim 1, characterized in that: The upper temperature measuring component and the lower temperature measuring component include a temperature measuring structure limit platform, a temperature measuring structure through hole, a temperature measuring probe, a spring, a temperature measuring structure pressure plate, and a temperature measuring structure pressure plate fixing screw; The temperature measuring probe is located in the through hole of the temperature measuring structure, one end of which is used for temperature testing is limited based on the temperature measuring structure limit platform, the other end of the temperature measuring probe in the upper temperature measuring component is connected to the upper temperature measuring line, and the other end of the temperature measuring probe in the lower temperature measuring component is connected to the lower temperature measuring line; The spring is provided between the temperature measuring probe and the temperature measuring structure pressure plate; The temperature measuring structure pressing plate is fixed by the temperature measuring structure pressing plate fixing screws.

5. The device for electrical performance testing and high temperature aging testing of high power density module products according to claim 1, characterized in that: The upper temperature measuring line and the lower temperature measuring line are flexible testing lines.

6. The device for electrical performance testing and high temperature aging testing of high power density module products according to claim 1, characterized in that: The lower temperature measuring line is an L-shaped temperature measuring line, and the lower temperature controller is arranged in an area outside the lower part of the lower heat dissipation block through a bending connection of the L-shaped temperature measuring line.

7. The device for electrical performance testing and high temperature aging testing of high power density module products according to claim 1, characterized in that: The pressing plate of the clamping structure is provided with a pressing plate opening, through which data of the upper temperature controller located below is read.

8. The device for electrical performance testing and high temperature aging testing of high power density module products according to claim 1, characterized in that: The lower heat dissipation block is provided with a lower heat dissipation block slot, and the fixing seat clamps the copper sheet through the lower heat dissipation block slot.

9. The device for electrical performance testing and high temperature aging testing of high power density module products according to claim 1, characterized in that: The outside of the fixing seat that clamps the copper sheet is provided with a copper sheet insulating sleeve.

10. The device for electrical performance testing and high temperature aging testing of high power density module products according to claim 1, characterized in that: The test board is fixed on the device base, and a test board limiting column is provided between the test board and the device base.

Images