Heat pump type thermostatic container technology based on semiconductor thermoelectric effect

Abstract

The invention relates to the technical field of heat preservation containers, and discloses a heat pump type constant-temperature container technology based on the semiconductor thermoelectric effect. The container sealing cover is arranged at the opening of the heat preservation container and used for sealing the heat preservation container, and a ventilation balance hole is formed in the container sealing cover; the semiconductor chip is arranged in the heat preservation container and is used for refrigerating or heating a medium in the heat preservation container; the NTC thermistor is arranged in the heat preservation container and used for detecting the temperature in the heat preservation container; and the MCU main control circuit is connected with the NTC thermistor. By adopting the temperature adjusting mode that the semiconductor thermoelectric effect is combined with the reverse voltage driving module, conversion of the refrigerating function or the heating function can be accurately and rapidly achieved according to the difference between the set temperature and the actual temperature in the container, the temperature adjusting range is effectively expanded, and due to the fact that the energy storage power supply unit is added, portability is achieved when multiple functions are achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of thermal insulation containers, in particular to a heat pump type constant temperature container technology based on semiconductor thermoelectric effect. Background Art

[0002] Thermal insulation containers, as a common everyday item, play an important role in a variety of fields, including household, medical, transportation, and scientific research. Their development can be traced back to the original Dewar flask, which employed a vacuum structure that effectively reduced heat conduction and convection, thereby achieving excellent thermal insulation. Subsequently, technological advancements led to stainless steel replacing glass liner, a refinement that significantly enhanced the practicality and durability of thermal insulation containers. Furthermore, coating technology was introduced to further reduce the effects of thermal radiation, further optimizing thermal insulation and heat preservation properties.

[0003] However, most portable small thermal containers currently on the market, such as thermos cups, electric lunch boxes, and small coolers, only offer basic insulation capabilities. Some products have electric heating capabilities, but generally lack cooling and precise temperature control capabilities, not to mention real-time monitoring, intelligent display systems, and portability. These existing products are struggling to meet diverse user needs.

[0004] Specifically, the existing thermal insulation containers mainly have the following deficiencies:

[0005] Single Functionality: Traditional insulated containers only provide insulation or simple heating functions, failing to meet users' diverse temperature needs in different scenarios. For example, in the hot summer, people may need to quickly cool their drinks; in the cold winter, they may want to efficiently heat their food or drinks. Existing products often lack the flexibility to adapt to these changing needs.

[0006] Inability to maintain a constant temperature: Existing thermal insulation containers cannot maintain a constant temperature during the insulation process as the temperature inside the container naturally dissipates or rises. This greatly limits their application in scenarios requiring precise temperature control, such as pharmaceutical transportation and special laboratory environments.

[0007] Lack of water quality monitoring and disinfection: For some insulated containers used to store beverages, users cannot directly monitor the water quality inside, making it difficult to ensure drinking water safety. Furthermore, prolonged use of insulated containers can easily breed bacteria, and existing products generally lack effective disinfection features, posing potential health risks to users.

[0008] Limited battery life: Some thermal containers with electric heating functions, such as electric lunch boxes, typically rely on being plugged in, significantly limiting their portability. While some portable thermal containers are equipped with batteries, they utilize traditional electric heating wires, which are inefficient and lead to rapid power consumption and insufficient battery life, making them incapable of long-term use in scenarios such as outdoor travel.

[0009] To this end, those skilled in the art have proposed a heat pump type constant temperature container technology based on semiconductor thermoelectric effect to solve the above problems. Summary of the Invention

[0010] In view of the shortcomings of the existing technology, the present invention provides a heat pump type constant temperature container technology based on semiconductor thermoelectric effect, which solves the problems raised in the above background technology.

[0011] To achieve the above objectives, the present invention is implemented through the following technical solutions: A temperature control system for a hot and cold dual-purpose constant temperature container, comprising:

[0012] A heat-insulating container having a vacuum layer;

[0013] A container sealing cover is provided at the opening of the thermal insulation container and is used to seal the thermal insulation container. The container sealing cover is provided with a ventilation balance hole;

[0014] a semiconductor chip, disposed in the heat-insulating container, for cooling or heating the medium in the heat-insulating container;

[0015] An NTC thermistor, disposed in the thermal insulation container, for detecting the temperature in the thermal insulation container;

[0016] An MCU main control circuit is connected to the NTC thermistor and is used to receive a temperature signal detected by the NTC thermistor and generate a control signal according to a preset control logic;

[0017] A first power MOS switch tube and a second power MOS switch tube are both connected to the MCU main control circuit and are used to be turned on or off according to a control signal generated by the MCU main control circuit;

[0018] A lithium battery pack is connected to a balanced charging protection circuit and a battery temperature monitoring NTC thermistor to form a power supply unit for storing electrical energy, achieving temperature protection of the energy storage power supply unit and balanced management of the lithium battery pack, and powering the system when no external power supply is available;

[0019] A reverse voltage driving module, connected to the MCU main control circuit, for changing the voltage direction across the semiconductor chip according to a control signal generated by the MCU main control circuit, so as to realize the switching of the cooling or heating function of the semiconductor chip;

[0020] A display circuit module is connected to the MCU main control circuit and is used to display information such as the temperature and working mode in the thermal insulation container;

[0021] A button unit is connected to the MCU main control circuit and is used to input set temperature and working mode instructions;

[0022] A fan is provided in the heat-insulating container and is connected to the MCU main control circuit, and is used to assist the semiconductor chip in dissipating or absorbing heat;

[0023] a heat exchanger, disposed in the heat-insulating container and connected to the semiconductor chip, for performing heat exchange with the semiconductor chip;

[0024] The inlet grille and air inlet module are provided on the heat preservation container shell, and are used to guide the outside air in and provide an air inlet channel for the fan and to exchange heat with the heat exchanger;

[0025] A fan drive motor is connected to the fan and is used to drive the fan to operate and provide air flow;

[0026] An exhaust port and an outlet grille are provided on the heat preservation container shell and are used to discharge the air guided by the fan;

[0027] A motor control MOS tube is connected to the MCU main control circuit and the fan drive motor, and is used to control the operation of the fan drive motor;

[0028] A power management circuit, connected to the second power MOS switch tube, for supplying power to the semiconductor chip when an external power supply is connected;

[0029] a voltage adaptation circuit module, connected to the power supply unit, and configured to adapt the voltage of the power supply unit;

[0030] A discharge management circuit module, connected to the lithium battery pack, for managing the discharge process of the lithium battery pack;

[0031] A charging interface, used to connect an external power source to power the system or charge the lithium battery pack. The charging interface is not limited to Type-C;

[0032] A charge and discharge management circuit, connected to the charging interface and the lithium battery pack, for charging the lithium battery pack;

[0033] The protector module is connected to the important circuits of the system and is used to protect the important circuits of the system.

[0034] Preferably, it also includes a TDS water quality detection probe, which is arranged in the thermal insulation container and is used to detect the TDS value of the water quality in the thermal insulation container. The TDS water quality detection probe is connected to the MCU main control circuit, and the display circuit module is used to display the TDS value.

[0035] Preferably, it also includes a battery temperature monitoring NTC thermistor and a balanced charge and discharge protection circuit module. The battery temperature monitoring NTC thermistor is arranged near the lithium battery pack and is used to monitor the temperature of the lithium battery pack. The battery temperature monitoring NTC thermistor is connected to the balanced charge and discharge protection circuit module. The balanced charge and discharge protection circuit module is connected to the lithium battery pack and is used to perform balanced charge and discharge protection on the lithium battery pack.

[0036] Preferably, it also includes a power management unit, which is connected to the charging interface and the power supply unit respectively, and is used to control the charge and discharge management circuit to charge the lithium battery pack when there is an external power supply, and distribute the power of the charging interface to supply the various parts of the system for operation; when there is no external power supply, it controls the lithium battery pack to supply power to the various parts of the system.

[0037] A method for controlling the temperature of a hot and cold dual-purpose constant temperature container, comprising the following steps:

[0038] S1: Detects the temperature inside the thermal insulation container in real time through the NTC thermistor and transmits the detected temperature signal to the MCU main control circuit;

[0039] S2: inputting a set temperature and an operating mode command through the key unit, and the MCU main control circuit judging whether the temperature of the medium in the thermal insulation container needs to be adjusted according to the temperature signal, the set temperature and the operating mode command;

[0040] S3: If adjustment is required, the MCU main control circuit generates a corresponding control signal to control the first power MOS switch tube or the second power MOS switch tube to be turned on, and controls the reverse voltage driving module to change the voltage direction at both ends of the semiconductor chip, so that the semiconductor chip enters the cooling or heating working state, and cools or heats the medium in the thermal insulation container until the temperature of the medium in the thermal insulation container reaches the set temperature;

[0041] S4: The MCU main control circuit controls the display circuit module to display the real-time temperature and working status information in the thermal insulation container.

[0042] Preferably, in step S2, the working modes include constant temperature mode, temperature adjustment mode, disinfection mode and TDS water quality monitoring mode, etc.

[0043] Preferably, the MCU main control circuit monitors the medium temperature in the thermal insulation container. If the absolute value of the difference between the medium temperature and the set temperature is less than a certain range, a constant temperature adjustment state is performed. If the medium temperature in the thermal insulation container is higher than the set temperature, the semiconductor chip is controlled to enter a cooling working state. Otherwise, it enters a heating working state. The purpose of the constant temperature mode is to maintain the temperature in the thermal insulation container at a constant temperature when it reaches near the set temperature.

[0044] Preferably, in the temperature adjustment mode, the MCU main control circuit controls the semiconductor chip to cool or heat according to the difference between the set temperature and the current temperature of the medium in the insulation container, and automatically jumps to the constant temperature mode after reaching the set temperature.

[0045] Preferably, the MCU main control circuit controls the semiconductor chip to be heated to a sterilization temperature and cuts off the power supply after maintaining the temperature for a period of time.

[0046] Preferably, one end of the semiconductor chip is connected to the insulation container and the other end is connected to the radiator. The radiator exchanges heat through forced air driven by a fan. The temperature control system forms a generalized semiconductor air source heat pump system. The heat pump absorbs heat energy from the air source or discharges heat energy to achieve rapid cooling when the temperature of the insulation container medium is high and rapid heating when the temperature is low.

[0047] The present invention provides a heat pump constant temperature container technology based on the semiconductor thermoelectric effect. It has the following beneficial effects:

[0048] 1. The temperature control method for a hot and cold dual-purpose constant temperature container of the present invention integrates multiple functions such as constant temperature, temperature adjustment, disinfection, and TDS water quality monitoring. Switching between different modes can be done through simple button operations. Whether it is to quickly cool or heat the beverage to a suitable temperature, or to monitor the water quality in the container to ensure drinking water safety, or to regularly disinfect the container, it can all be easily achieved. This greatly improves the user's convenience in various scenarios, whether it is daily household use, outdoor travel, or refrigeration of medicines in specific scenarios, it can meet diverse needs and provide users with a comprehensive convenient experience.

[0049] 2. This invention utilizes a thermoelectric effect semiconductor coupled with a reverse voltage drive module for temperature control. This allows for precise and rapid switching between cooling and heating based on the difference between the set temperature and the actual temperature within the container, effectively improving temperature control efficiency. Furthermore, due to the application of heat pump technology, heat is absorbed from the air during the heating process. Compared to traditional heating methods using electric heating wires, this significantly reduces power consumption, significantly improves the battery life of portable thermal containers, extends usage time, and enhances the user experience. This addresses the key issues of existing portable thermal containers, such as insufficient battery life and limited application scenarios.

[0050] 3. This invention leverages the MCU main control circuit to intelligently control the entire system, monitoring key parameters such as temperature and water quality within the insulated container in real time. It automatically adjusts the operating state of the semiconductor chip according to preset control logic to ensure accurate and stable temperature of the medium within the container. Furthermore, through the synergistic effects of the battery temperature monitoring NTC thermistor, the balanced charge and discharge protection circuit module, and the power management unit, the charging and discharging process of the lithium battery pack is strictly managed and protected, effectively preventing problems such as battery overheating and overcharging. This not only extends the battery life but also provides a strong guarantee for the safe operation of the system.

[0051] 4. This invention utilizes a power management unit to achieve a dual-source power supply mode, combining an external charging port and a built-in lithium battery pack. By rationally allocating power between the external power source and the lithium battery pack, it achieves efficient energy utilization. It also supports simultaneous charging and wireless battery life while plugged in, greatly enhancing ease of use. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Figure 1 It is a plan view of the present invention.

[0053] Among them, 1. Container sealing cover; 2. Ventilation balance hole; 3. TDS water quality detection probe; 4. NTC thermistor; 5. MCU main control circuit; 6. First power MOS switch tube; 7. Lithium battery pack; 8. Battery temperature monitoring NTC thermistor; 9. Balanced charge and discharge protection circuit module; 10. Power supply unit; 11. Second power MOS switch tube; 12. Voltage adaptation circuit module; 13. Power management unit; 14. Discharge management circuit module; 15. Plug-in management circuit; 16. Charging interface; 17. Charge and discharge management circuit; 18. Reverse voltage drive module; 19. Protector module; 20. Motor control MOS tube; 21. Display circuit module; 22. Key unit; 23. Inlet grille and air intake module; 24. Fan drive motor; 25. Exhaust port and outlet grille; 26. Fan; 27. Heat exchanger; 28. Semiconductor chip; 29. ​​Insulation container; 30. Vacuum layer. DETAILED DESCRIPTION

[0054] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the present specification. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0055] Please see the attached Figure 1 An embodiment of the present invention provides a temperature control system for a dual-purpose hot and cold constant temperature container, comprising:

[0056] a heat-insulating container 29 having a vacuum layer 30;

[0057] The container sealing cover 1 is provided at the opening of the heat-insulating container 29 and is used to seal the heat-insulating container 29. The container sealing cover 1 is provided with a ventilation balance hole 2;

[0058] The semiconductor chip 28 is disposed in the heat-insulating container 29 and is used to cool or heat the medium in the heat-insulating container 29;

[0059] Specifically, the thermal insulation container 29 is the core component of the system, and a vacuum layer 30 is provided inside the thermal insulation container 29, which can effectively reduce heat conduction and convection, thereby achieving a good thermal insulation effect and maintaining the temperature of the medium in the container stable. The container sealing cover 1 is installed at the opening of the thermal insulation container 29, which can tightly seal the thermal insulation container 29 to prevent external heat and air from entering, further improving the thermal insulation effect. At the same time, a ventilation balance hole 2 is provided on the container sealing cover 1, which can balance the air pressure inside and outside the container when necessary, avoiding the difficulty in opening or closing the container due to the pressure difference, and the splashing of liquid that is easily caused during the heating process, thereby ensuring the convenience and safety of the use process. The semiconductor chip 28 is placed inside the thermal insulation container 29. As a key temperature control element, it can cool or heat the medium in the thermal insulation container 29 by changing its working state to meet the temperature requirements in different scenarios.

[0060] NTC thermistor 4, disposed in the heat preservation container 29, for detecting the temperature in the heat preservation container 29;

[0061] The MCU main control circuit 5 is connected to the NTC thermistor 4 and is used to receive the temperature signal detected by the NTC thermistor 4 and generate a control signal according to a preset control logic;

[0062] The first power MOS switch tube 6 and the second power MOS switch tube 11 are both connected to the MCU main control circuit 5 and are used to be turned on or off according to the control signal generated by the MCU main control circuit 5;

[0063] The lithium battery pack 7 is connected to the balanced charging protection circuit 9 and the battery temperature monitoring NTC thermistor 8 to form a power supply unit 10 for storing electrical energy, achieving temperature protection of the energy storage power supply unit 10 and balanced management of the lithium battery pack 7, and powering the system when no external power supply is available;

[0064] The reverse voltage driving module 18 is connected to the MCU main control circuit 5 and is used to change the voltage direction of both ends of the semiconductor chip 28 according to the control signal generated by the MCU main control circuit 5 to realize the cooling or heating function conversion of the semiconductor chip 28;

[0065] The display circuit module 21 is connected to the MCU main control circuit 5 and is used to display information such as the temperature and working mode in the thermal insulation container 29;

[0066] Specifically, the reverse voltage driver module 18 is responsible for instantly changing the voltage direction across the semiconductor chip 28 based on precise control signals from the MCU main control circuit 5. This voltage change directly determines the operating mode of the semiconductor chip 28, enabling it to quickly and accurately switch between cooling and heating functions to meet user temperature control needs. When the temperature of the medium in the container needs to be lowered, the MCU main control circuit 5 sends a corresponding signal. Upon receiving the signal, the reverse voltage driver module 18 immediately adjusts the voltage direction across the semiconductor chip 28 to enter cooling mode. Conversely, when the temperature needs to be increased, it switches to heating mode.

[0067] At the same time, the display circuit module 21 is also connected to the MCU main control circuit 5 and plays the role of information display in the system. This module can display the temperature inside the thermal insulation container 29 in real time, allowing the user to understand the temperature changes inside the container at any time. In addition, it can clearly display the current operating mode of the system, such as cooling mode, heating mode, and constant temperature mode, ensuring that the user can clearly understand the operating status of the device, thereby achieving more convenient operation and use.

[0068] The key unit 22 is connected to the MCU main control circuit 5 and is used to input the set temperature and working mode instructions;

[0069] The fan 26 is provided in the heat preservation container 29 and is connected to the MCU main control circuit 5 to assist the semiconductor chip 28 in dissipating or absorbing heat;

[0070] The heat exchanger 27 is disposed in the heat preservation container 29 and is connected to the semiconductor chip 28 for performing heat exchange with the medium in the heat preservation container 29;

[0071] The inlet grille and air inlet module 23 is provided in the shell of the heat preservation container 29, and is used to guide the outside air in and provide an air inlet channel for the fan 26 and heat exchange in the heat exchanger;

[0072] The fan drive motor 24 is connected to the fan 26 and is used to drive the fan 26 to operate and provide air flow;

[0073] The exhaust port and outlet grille 25 is provided in the heat-insulating container 29 and is used to discharge the air guided by the fan 26;

[0074] The motor control MOS tube 20 is connected to the MCU main control circuit 5 and the fan drive motor 24 to control the operation of the fan drive motor 24;

[0075] The power management circuit 15 is connected to the second power MOS switch tube 11 and is used to supply power to the semiconductor chip 28 when an external power source is connected;

[0076] The voltage adaptation circuit module 12 is connected to the power supply unit 10 and is used to adapt the voltage of the power supply unit 10;

[0077] Specifically, the motor control MOS tube 20, the plug-in management circuit 15 and the voltage adaptation circuit module 12 respectively play the key roles of controlling the fan drive motor 24, managing the external power supply and adapting the power supply voltage in the system. The motor control MOS tube 20 connects the MCU main control circuit 5 and the fan drive motor 24, and accurately controls the start and stop and speed of the fan drive motor 24 according to the instructions of the MCU main control circuit 5, thereby flexibly controlling the heat dissipation or heat absorption intensity to meet the temperature regulation requirements under different working conditions; the plug-in management circuit 15 is connected to the second power MOS switch tube 11. When plugged in, it supplies power to the semiconductor chip 28 and adjusts the appropriate supply voltage. At the same time, it supplies low-power power to the voltage adaptation circuit, providing different power systems for the fan drive motor 24, the display circuit module 21 and the MCU main control circuit 5, ensuring the stability and safety of the power input, and coordinating the power distribution within the system; the voltage adaptation circuit module 12 is also connected to the power supply unit 10. Its core responsibility is to adjust and convert the voltage of low-power electrical devices to ensure the efficient operation of the circuit management unit. The voltage adaptation circuit module 12 can simultaneously receive power from the power supply unit 10 and the charging interface 16. It is a dual power input system that can ensure the stability of the power supply to the system and the reliable operation of the entire temperature control system. The three work together to ensure the accuracy and stability of the system's power supply and regulation from control, access to adaptation.

[0078] The discharge management circuit module 14 is connected to the lithium battery pack 7 and is used to manage the discharge process of the lithium battery pack 7;

[0079] The charging interface 16 is connected to the lithium battery pack 7 through the charge and discharge management circuit 17 and is used to connect to an external power source to control the charging of the lithium battery pack 7;

[0080] The protector module 19 is connected to the important circuits of the system and is used to protect the important circuits of the system.

[0081] The system also includes a TDS water quality detection probe 3, which is disposed within the heat-insulating container 29 and is used to detect the TDS value of the water in the heat-insulating container 29. The TDS water quality detection probe 3 is connected to the MCU main control circuit 5, and the display circuit module 21 is used to display the TDS value. The system also includes a battery temperature monitoring NTC thermistor 8 and a balanced charge and discharge protection circuit module 9. The battery temperature monitoring NTC thermistor 8 is disposed near the lithium battery pack 7 and is used to monitor the temperature of the lithium battery pack 7. The battery temperature monitoring NTC thermistor 8 is connected to the balanced charge and discharge protection circuit module 9, which is connected to the lithium battery pack 7 to provide balanced charge and discharge protection for the lithium battery pack 7.

[0082] Specifically, the battery temperature monitoring NTC thermistor 8 and the balanced charge and discharge protection circuit module 9 ensure the safe use of the lithium battery pack 7 and extend its service life. The battery temperature monitoring NTC thermistor 8 is installed near the lithium battery pack 7 to monitor the battery pack temperature in real time and feed this temperature information back to the balanced charge and discharge protection circuit module 9. The balanced charge and discharge protection circuit module 9 is connected to the lithium battery pack 7 and is responsible for balanced charge and discharge management of the lithium battery pack 7, preventing overcharge, overdischarge, or overheating during the charge and discharge process, ensuring stable and safe operation of the battery pack. It also improves the battery pack's charge and discharge efficiency and overall performance, providing reliable energy support for the system's continued stable operation.

[0083] It also includes a power management unit 13, which is connected to the charging interface 16 and the power supply unit 10 respectively, and is used to control the charge and discharge management circuit 17 to charge the lithium battery pack 7 when there is an external power supply, and distribute the power of the charging interface 16 to supply the various parts of the system; when there is no external power supply, the power management unit 13 controls the lithium battery pack 7 to supply power to the various parts of the system.

[0084] A method for controlling the temperature of a hot and cold dual-purpose constant temperature container, comprising the following steps:

[0085] S1: Detect the temperature in the heat preservation container 29 in real time through the NTC thermistor 4, and transmit the detected temperature signal to the MCU main control circuit 5;

[0086] S2: The set temperature and working mode instructions are input through the key unit 22. The MCU main control circuit 5 determines whether the medium temperature in the insulation container 29 needs to be adjusted based on the temperature signal, the set temperature and the working mode instructions; the working modes include constant temperature mode, temperature adjustment mode, disinfection mode and TDS water quality monitoring mode.

[0087] S3: If adjustment is required, the MCU main control circuit 5 generates a corresponding control signal to control the first power MOS switch tube 6 or the second power MOS switch tube 11 to be turned on, and controls the reverse voltage driving module 18 to change the voltage direction across the semiconductor chip 28, so that the semiconductor chip 28 enters the cooling or heating working state, and cools or heats the medium in the thermal insulation container 29 until the temperature of the medium in the thermal insulation container 29 reaches the set temperature;

[0088] S4: The MCU main control circuit 5 controls the display circuit module 21 to display the real-time temperature and working status information in the heat preservation container 29.

[0089] In constant temperature mode, the MCU main control circuit 5 monitors the temperature of the medium in the thermal container 29. If the absolute difference between the medium temperature and the set temperature is less than a certain range, the constant temperature adjustment state is entered. If the temperature of the medium in the thermal container 29 is higher than the set temperature, the semiconductor chip 28 is controlled to enter the cooling state. Otherwise, it enters the heating state. The purpose of the constant temperature mode is to maintain the temperature in the thermal container 29 at a constant temperature when it reaches the set temperature. In the temperature adjustment mode, the MCU main control circuit 5 controls the semiconductor chip 28 to cool or heat according to the difference between the set temperature and the current temperature of the medium in the thermal container 29 until the set temperature is reached and the device automatically switches to the constant temperature mode.

[0090] The MCU main control circuit 5 controls the semiconductor chip 28 to heat to the disinfection temperature and maintains the temperature for a period of time before cutting off the power supply. In the TDS water quality monitoring mode, the TDS water quality detection probe 3 detects the TDS value of the water in the thermal container 29 and transmits the detection result to the MCU main control circuit 5. The MCU main control circuit 5 controls the display circuit module 21 to display the TDS value.

[0091] Specifically, the MCU main control circuit 5 precisely controls the semiconductor chip 28 according to different modes and requirements to achieve a variety of temperature regulation and monitoring functions. In constant temperature mode, the MCU main control circuit 5 monitors the temperature of the medium in the insulation container 29. If the absolute value of the difference between the medium temperature and the set temperature is less than a certain range, the constant temperature adjustment state is entered. If the temperature of the medium in the insulation container 29 is higher than the set temperature, the semiconductor chip 28 is controlled to enter the cooling working state. Otherwise, it enters the heating working state. The purpose of the constant temperature mode is to maintain the temperature in the insulation container 29 at a constant temperature when it reaches the set temperature, thereby ensuring the temperature stability of the environment in the container. In the temperature adjustment mode, the MCU main control circuit 5 controls the semiconductor chip 28 to cool or heat according to the difference between the set temperature and the current temperature of the medium in the insulation container 29, so as to quickly adjust the temperature to the set value, and automatically switch to the constant temperature mode after reaching the set temperature, achieving precise temperature control. In addition, the MCU main control circuit 5 can also control the semiconductor chip 28 to heat to the disinfection temperature and cut off the power supply after maintaining it for a period of time to achieve the disinfection function of the insulation container 29 and ensure the hygiene and safety of the container. In the TDS water quality monitoring mode, the TDS water quality detection probe 3 detects the TDS value of the water in the insulation container 29 and transmits the detection result to the MCU main control circuit 5. The MCU main control circuit 5 then controls the display circuit module 21 to display the TDS value, so that the user can intuitively understand the purity of the water in the container and ensure the safety of drinking water.

[0092] One end of the semiconductor chip 28 is connected to the insulation container 29, and the other end is connected to the radiator 27. The radiator 27 exchanges heat through forced air driven by the fan 26. The temperature control system forms a generalized semiconductor air source heat pump system. The heat pump absorbs heat energy from the air source or discharges heat energy to achieve rapid cooling when the temperature of the medium in the insulation container 29 is high and rapid heating when the temperature is low.

[0093] Specifically, radiator 27 forms the core of the temperature control system by exchanging heat with the forced air driven by fan 26, forming a broadly defined semiconductor air-source heat pump system. When the temperature of the medium in thermal container 29 is high, the heat pump system efficiently absorbs heat energy from the air source and discharges it, achieving rapid cooling. When the temperature of the medium in thermal container 29 is low, the heat pump system absorbs heat energy from the air source and transfers it to thermal container 29, achieving rapid heating. This design allows thermal container 29 to quickly reach the desired temperature under varying temperature conditions, meeting user demands for rapid and efficient temperature regulation.

[0094] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A temperature control system for a hot and cold dual-purpose constant temperature container, characterized in that: include: a heat-insulating container (29) having a vacuum layer (30); A container sealing cover (1) is provided at the opening of the heat-insulating container (29) and is used to seal the heat-insulating container (29). A ventilation balancing hole (2) is provided on the container sealing cover (1); A semiconductor chip (28) is disposed in the heat-insulating container (29) and is used to cool or heat the medium in the heat-insulating container (29); An NTC thermistor (4) is disposed in the heat-insulating container (29) and is used to detect the temperature in the heat-insulating container (29); An MCU main control circuit (5) is connected to the NTC thermistor (4) and is used to receive a temperature signal detected by the NTC thermistor (4) and generate a control signal according to a preset control logic; A first power MOS switch tube (6) and a second power MOS switch tube (11), both connected to the MCU main control circuit (5), and used to be turned on or off according to a control signal generated by the MCU main control circuit (5); The lithium battery pack (7) is connected to the balanced charging protection circuit (9) and the battery temperature monitoring NTC thermistor (8) to form a power supply unit (10) for storing electric energy, realizing temperature protection of the energy storage power supply unit (10) and balanced management of the lithium battery pack (7), and supplying power to the system when there is no external power supply; a reverse voltage driving module (18), connected to the MCU main control circuit (5), and configured to change the voltage direction across the semiconductor chip (28) according to a control signal generated by the MCU main control circuit (5), so as to achieve a switching between a cooling and a heating function of the semiconductor chip (28); A display circuit module (21), connected to the MCU main control circuit (5), for displaying information such as the temperature and operating mode in the thermal insulation container (29); A button unit (22) is connected to the MCU main control circuit (5) and is used to input set temperature and working mode instructions; A fan (26) is disposed in the heat-insulating container (29), connected to the MCU main control circuit (5), and is used to assist the semiconductor chip (28) in dissipating or absorbing heat; a heat exchanger (27), disposed in the heat-insulating container (29), connected to the semiconductor chip (28), and configured to perform heat exchange with the semiconductor chip (28); An inlet grille and air inlet module (23) is provided on the housing of the heat-insulating container (29) and is used to guide the outside air in and provide an air inlet channel for the fan (26) and to exchange heat with the heat exchanger; A fan drive motor (24) is connected to the fan (26) and is used to drive the fan (26) to operate and provide air flow; An exhaust port and an outlet grille (25) are provided on the housing of the heat-insulating container (29) and are used to discharge the air guided by the fan (26); A motor control MOS tube (20) is connected to the MCU main control circuit (5) and the fan drive motor (24) and is used to control whether the fan drive motor (24) is running; A power management circuit (15) is connected to the second power MOS switch tube (11) and is used to supply power to the semiconductor chip (28) when an external power source is connected; a voltage adaptation circuit module (12), connected to the power supply unit (10), and configured to adapt the voltage of the power supply unit (10); a discharge management circuit module (14), connected to the lithium battery pack (7), and used to manage the discharge process of the lithium battery pack (7); A charging interface (16) for connecting to an external power source to power the system or charge the lithium battery pack (7), and the charging interface (16) is not limited to a Type-C form; a charge and discharge management circuit (17), connected to the charging interface (16) and the lithium battery pack (7), and used for charging the lithium battery pack (7); A protector module (19) is connected to the important circuits of the system and is used to protect the important circuits of the system.

2. A temperature control system for a hot and cold dual-purpose constant temperature container according to claim 1, characterized in that: It also includes a TDS water quality detection probe (3) disposed in the heat-insulating container (29) for detecting the TDS value of the water quality in the heat-insulating container (29); the TDS water quality detection probe (3) is connected to the MCU main control circuit (5); and the display circuit module (21) is used to display the TDS value.

3. The temperature control system for a hot and cold dual-purpose constant temperature container according to claim 1, characterized in that: The invention also includes a battery temperature monitoring NTC thermistor (8) and a balanced charge and discharge protection circuit module (9). The battery temperature monitoring NTC thermistor (8) is arranged near the lithium battery pack (7) and is used to monitor the temperature of the lithium battery pack (7). The battery temperature monitoring NTC thermistor (8) is connected to the balanced charge and discharge protection circuit module (9). The balanced charge and discharge protection circuit module (9) is connected to the lithium battery pack (7) and is used to perform balanced charge and discharge protection on the lithium battery pack (7).

4. The temperature control system for a hot and cold dual-purpose constant temperature container according to claim 1, characterized in that: The system further comprises an electric energy management unit (13), which is connected to the charging interface (16) and the power supply unit (10) respectively, and is used to control the charge and discharge management circuit (17) to charge the lithium battery pack (7) and distribute the electric energy of the charging interface (16) to supply the various parts of the system when an external power supply is available; and to control the lithium battery pack (7) to supply power to the various parts of the system when no external power supply is available.

5. A method for controlling the temperature of a hot and cold dual-purpose constant temperature container, according to a temperature control system for a hot and cold dual-purpose constant temperature container according to any one of claims 1 to 4, characterized in that: The following steps are involved: S1: Detect the temperature in the heat preservation container (29) in real time through the NTC thermistor (4), and transmit the detected temperature signal to the MCU main control circuit (5); S2: A set temperature and a working mode command are inputted through the key unit (22), and the MCU main control circuit (5) determines whether the temperature of the medium in the heat-insulating container (29) needs to be adjusted according to the temperature signal, the set temperature and the working mode command; S3: If adjustment is required, the MCU main control circuit (5) generates a corresponding control signal to control the first power MOS switch tube (6) or the second power MOS switch tube (11) to be turned on, and controls the reverse voltage driving module (18) to change the voltage direction at both ends of the semiconductor chip (28), so that the semiconductor chip (28) enters a cooling or heating working state, and performs cooling or heating adjustment on the medium in the thermal insulation container (29) until the temperature of the medium in the thermal insulation container (29) reaches the set temperature; S4: The MCU main control circuit (5) controls the display circuit module (21) to display the real-time temperature and working status information in the heat-insulating container (29).

6. A method for controlling the temperature of a hot and cold dual-purpose constant temperature container according to claim 5, characterized in that: In step S2, the working modes include constant temperature mode, temperature adjustment mode, disinfection mode and TDS water quality monitoring mode.

7. The method for controlling the temperature of a hot and cold dual-purpose constant temperature container according to claim 5, characterized in that: In the constant temperature mode, the MCU main control circuit (5) monitors the medium temperature in the heat preservation container (29). If the absolute value of the difference between the medium temperature and the set temperature is less than a certain range, the constant temperature adjustment state is performed. If the medium temperature in the heat preservation container (29) is higher than the set temperature, the semiconductor chip (28) is controlled to enter the cooling working state. Otherwise, it enters the heating working state. The purpose of the constant temperature mode is to maintain the temperature in the heat preservation container (29) at a constant temperature when it reaches near the set temperature.

8. The method for controlling the temperature of a hot and cold dual-purpose constant temperature container according to claim 5, characterized in that: In the temperature adjustment mode, the MCU main control circuit (5) controls the semiconductor chip (28) to cool or heat according to the difference between the set temperature and the current temperature of the medium in the heat preservation container (29), and automatically switches to the constant temperature mode after the set temperature is reached.

9. The method for controlling the temperature of a hot and cold dual-purpose constant temperature container according to claim 5, characterized in that: The MCU main control circuit (5) controls the semiconductor chip (28) to be heated to a sterilization temperature, and then cuts off the power supply after maintaining the temperature for a period of time.

10. The temperature control system for a hot and cold dual-purpose constant temperature container according to claim 1, characterized in that: One end of the semiconductor chip (28) is connected to the heat preservation container (29), and the other end is connected to the radiator (27). The radiator (27) exchanges heat through forced air driven by the fan (26). The temperature control system forms a generalized semiconductor air source heat pump system. The heat pump absorbs heat energy from the air source or discharges heat energy, so that the medium of the heat preservation container (29) is cooled quickly when the temperature is high and heated quickly when the temperature is low.

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