Automatic board splitting production line applied to PCBs
Through the design of an automated panel separation production line, the automatic panel separation and assembly of PCB boards are achieved by using magnetic adsorption and cylinder lifting, which solves the problems of traditional panel separation methods such as messy materials, high costs, large space and frequent manual intervention, and realizes efficient and low-cost automated production.
Patent Information
- Application Number
- CN202510938608.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-08
- Publication Date
- 2025-09-12
AI Technical Summary
The traditional PCB depaneling method has messy materials, requires manual re-sorting, is costly, occupies a large area of equipment, requires secondary assembly, and requires a lot of manual intervention.
An automated panel separation production line is used, including a synchronous belt jig line, jig handling grippers, a PCB jig positioning table, and a PCB cap adsorption component. Magnet adsorption and cylinder lifting are used to achieve automatic panel separation and assembly, reducing manual intervention.
It realizes direct assembly after automated panel separation, reduces costs, saves manpower, discharges materials in an orderly manner, simplifies processes, and reduces equipment footprint.
Smart Images

Figure CN120640539A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of PCB production equipment, and in particular to an automatic panel separation production line applied to PCB boards. Background Art
[0002] The traditional PCB depaneling method results in a messy material after depaneling, and the materials need to be re-sorted before assembly. The traditional method is costly, the equipment occupies a large area, requires manual intervention, and requires secondary assembly and re-sorting. Summary of the Invention
[0003] In view of the above problems, the present invention provides an automated production line for PCB boards. Not only is the solution simple, easy to implement, low-cost, and easy to integrate into highly automated equipment, but it can also be assembled directly after the boards are separated. It also reduces manual intervention and saves manpower. After the boards are separated, the remaining PCB boards can be discharged as waste in an orderly manner.
[0004] In order to achieve the above-mentioned and other related purposes, the present invention provides the following technical solutions: An automated panel separation production line for PCB boards comprises a synchronous belt jig line, a jig handling clamp and a PCB jig positioning platform, wherein the PCB jig positioning platform is provided on one side of the synchronous belt jig line, the jig handling clamp is provided above the PCB jig positioning platform, the jig handling clamp is provided with a PCB cap adsorption assembly, the PCB cap adsorption assembly comprises an adsorption head and an adsorption column, the adsorption head is connected to the adsorption column via a rotating pin, a PCB cap adsorption magnet is provided inside the adsorption head, an adaptive lower magnet of the adsorption head is provided above the PCB cap adsorption magnet, an adaptive upper magnet of the adsorption head is provided inside the adsorption column, a pressure plate is provided on one side of the adsorption column, the pressure plate is connected to a spring pressure seat, a compression spring is provided on the spring pressure seat, and the spring pressure seat is slidably connected to the jig handling clamp.
[0005] Furthermore, a bottom stamping mechanism is provided under the PCB jig positioning platform, and the bottom stamping mechanism includes a first lifting cylinder and a second lifting cylinder. The output shaft of the first lifting cylinder is connected to the lifting platform, and a lifting column is provided on the top of the lifting platform, and one side of the lifting column is in contact with the output shaft of the second lifting cylinder.
[0006] Furthermore, the bottom of the jacking column is hinged to the jacking platform.
[0007] Furthermore, the jacking column is in an "L" shape and is integrally cast.
[0008] Furthermore, a transfer platform is provided on one side of the PCB fixture positioning platform.
[0009] Furthermore, a clamping cylinder is provided above the transfer platform.
[0010] Furthermore, a jig offline belt line is provided on one side of the PCB jig positioning table.
[0011] Furthermore, the rotating pin is located between the adaptive lower magnet of the adsorption head and the PCB cap adsorption magnet.
[0012] Furthermore, the first lifting cylinder is a servo motor, and the second lifting cylinder is a servo motor.
[0013] Furthermore, the self-adaptive upper magnet of the adsorption head and the self-adaptive lower magnet of the adsorption head repel each other with the same polarity, and the self-adaptive lower magnet of the adsorption head and the PCB cap adsorption magnet repel each other with the same polarity.
[0014] The present invention has the following positive effects: 1. The present invention can effectively and quickly separate PCB boards through the interaction between the PCB fixture positioning table, PCB cap adsorption assembly, bottom stamping mechanism and fixture handling clamps. Not only is the solution simple, easy to implement, low-cost, and easy to integrate into highly automated equipment, but it can also be directly assembled after separation. It also reduces manual intervention and saves manpower. After separation, the remaining PCB boards can be discharged as waste in an orderly manner.
[0015] 2. The adsorption head of the present invention floats up and down along the rotating pin, and can also float left and right along the rotating pin. After the folding plate is completed, the upper and lower adaptive magnets can correct the adsorption head under the action of magnetic force, making it convenient for the gripper cylinder to remove the cap on the adsorption head. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a structural schematic diagram of the production line of the present invention; Figure 2 This is a schematic diagram of the working of the bottom stamping mechanism and the PCB cap adsorption assembly of the present invention; Figure 3 It is a structural schematic diagram of the PCB cap adsorption assembly of the present invention.
[0017] Explanation of the numbers in the figure: 1- synchronous belt fixture line, 2- fixture handling clamp, 3- PCB fixture positioning platform, 4- PCB cap adsorption assembly, 401- adsorption head, 402- pressure plate, 403- compression spring, 404- spring pressure seat, 405- adsorption head adaptive upper magnet, 406- adsorption head adaptive lower magnet, 407- PCB cap adsorption magnet, 408- rotating pin, 409- adsorption column, 5- bottom stamping mechanism, 501- lifting column, 502- first lifting cylinder, 503- second lifting cylinder, 504- lifting platform, 6- transfer platform, 7- clamp cylinder, 8- fixture lower belt line, 9- PCB fixture. DETAILED DESCRIPTION
[0018] The following description of exemplary embodiments of the present disclosure is made in conjunction with the accompanying drawings, including various details of the embodiments of the present disclosure to facilitate understanding. These details should be considered as merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the present disclosure. Similarly, for the sake of clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.
[0019] Example: Figure 1 or Figure 2 or Figure 3 As shown, an automated panel separation production line for PCB boards includes a synchronous belt jig line 1, a jig handling clamp 2, and a PCB jig positioning platform 3. The PCB jig positioning platform 3 is provided on one side of the synchronous belt jig line 1. The jig handling clamp 2 is provided above the PCB jig positioning platform 3. The jig handling clamp 2 is provided with a PCB cap adsorption component 4. The PCB cap adsorption component 4 includes an adsorption head 401 and an adsorption column 409. The adsorption head 401 is connected to the adsorption column by a rotating pin 408. 409 is connected, the interior of the adsorption head 401 is provided with a PCB cap adsorption magnet 407, the upper part of the adsorption PCB cap adsorption magnet 407 is provided with an adsorption head adaptive lower magnet 406, the interior of the adsorption column 409 is provided with an adsorption head adaptive upper magnet 405, one side of the adsorption column 409 is provided with a pressure plate 402, the pressure plate 402 is connected to the spring pressure seat 404, the spring pressure seat 404 is provided with a clamping spring 403, and the spring pressure seat 404 is slidably connected to the jig carrying clamp 2.
[0020] In this embodiment, a bottom stamping mechanism 5 is provided below the PCB jig positioning platform 3, and the bottom stamping mechanism 5 includes a first lifting cylinder 502 and a second lifting cylinder 503. The output shaft of the first lifting cylinder 502 is connected to the lifting platform 504, and a lifting column 501 is provided on the top of the lifting platform 504. One side of the lifting column 501 is in contact with the output shaft of the second lifting cylinder 503.
[0021] In this embodiment, the bottom of the jacking column 501 is hinged to the jacking platform 504 .
[0022] In this embodiment, the jacking column 501 is in an "L" shape, and the jacking column 501 is integrally cast.
[0023] In this embodiment, a transfer platform 6 is provided on one side of the PCB fixture positioning platform 3 .
[0024] In this embodiment, a clamping cylinder 7 is provided above the transfer platform 6 .
[0025] In this embodiment, a jig lowering belt line 8 is provided on one side of the PCB jig positioning platform 3 .
[0026] In this embodiment, the rotating pin 408 is located between the adsorption head adaptive lower magnet 406 and the PCB cap adsorption magnet 407 .
[0027] In this embodiment, the first lifting cylinder 502 is a servo motor, and the second lifting cylinder 503 is a servo motor.
[0028] In this embodiment, the adsorption head adaptive upper magnet 405 and the adsorption head adaptive lower magnet 406 repel each other with the same polarity, and the adsorption head adaptive lower magnet 406 and the PCB cap adsorption magnet 407 repel each other with the same polarity.
[0029] The present invention operates as follows: The PCB cap suction assembly 4 descends, a spring-loaded mechanism compresses the base of the PCB, and the PCB cap suction magnet 407 attracts the metal cap on the PCB. The bottom punch mechanism 5 moves below the cap, and the cylinder of the bottom punch mechanism 5 rises. Due to the compression at the base of the cap PCB, the PCB cap is lifted and its angle changes, breaking the cutout at the base of the PCB cap. The steel sheet on the cap is then attracted to the suction head under the action of the magnet. During the cylinder lifting process, the front suction head can rise and float within the waist groove of the rotating pin under the action of the cylinder, and can also rotate left and right with the rotating shaft to adaptively absorb the cap. After the cap is removed, the upper and lower adaptive magnets on the suction head interact with the PCB cap suction magnets, and the same polar repulsive energy aligns the suction head, aligning the cap with the ground. After the cap is corrected, the suction head moves to the transfer platform. The gripper cylinder on the transfer platform clamps the cap, removes it from the suction head, and moves it to the next workstation for assembly.
[0030] In summary, the present invention is not only simple in solution, easy to implement, low in cost, and easy to integrate into highly automated equipment, but also can be assembled directly after depaneling. It also reduces manual intervention and saves manpower. The remaining PCB boards after depaneling can be discharged as waste in an orderly manner.
[0031] The above specific embodiments do not constitute a limitation on the scope of protection of this disclosure. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this disclosure shall be included within the scope of protection of this disclosure.
Claims
1. An automated panel separation production line for PCB boards, comprising a synchronous belt jig line (1), a jig handling clamp (2) and a PCB jig positioning platform (3), wherein the PCB jig positioning platform (3) is provided on one side of the synchronous belt jig line (1), and the jig handling clamp (2) is provided above the PCB jig positioning platform (3), and is characterized in that: The jig handling clamp (2) is provided with a PCB cap adsorption assembly (4), the PCB cap adsorption assembly (4) comprising an adsorption head (401) and an adsorption column (409), the adsorption head (401) being connected to the adsorption column (409) via a rotating pin (408), the adsorption head (401) being provided with a PCB cap adsorption magnet (407), the upper portion of the PCB cap adsorption magnet (407) being provided with an adsorption head adaptive lower magnet (406), the inner portion of the adsorption column (409) being provided with an adsorption head adaptive upper magnet (405), a pressing plate (402) being provided on one side of the adsorption column (409), the pressing plate (402) being connected to a spring pressure seat (404), the spring pressure seat (404) being provided with a compression spring (403), the spring pressure seat (404) being slidably connected to the jig handling clamp (2).
2. The automated panel separation production line for PCB boards according to claim 1, characterized in that: A bottom punching mechanism (5) is provided below the PCB fixture positioning platform (3), and the bottom punching mechanism (5) comprises a first lifting cylinder (502) and a second lifting cylinder (503), wherein the output shaft of the first lifting cylinder (502) is connected to the lifting platform (504), and a lifting column (501) is provided on the top of the lifting platform (504), and one side of the lifting column (501) is in contact with the output shaft of the second lifting cylinder (503).
3. The automated panel separation production line for PCB boards according to claim 2, characterized in that: The bottom of the jacking column (501) is hinged to the jacking platform (504).
4. The automated panel separation production line for PCB boards according to claim 3, characterized in that: The jacking column (501) is in an "L" shape, and the jacking column (501) is integrally cast.
5. The automated panel separation production line for PCB boards according to claim 1, characterized in that: A transfer platform (6) is provided on one side of the PCB fixture positioning platform (3).
6. The automated panel separation production line for PCB boards according to claim 1, characterized in that: A clamping claw cylinder (7) is provided above the transfer platform (6).
7. The automated panel separation production line for PCB boards according to claim 1, characterized in that: A jig lowering belt line (8) is provided on one side of the PCB jig positioning platform (3).
8. The automated panel separation production line for PCB boards according to claim 1, characterized in that: The rotating pin (408) is located between the adsorption head adaptive lower magnet (406) and the PCB cap adsorption magnet (405).
9. The automated panel separation production line for PCB boards according to claim 2, characterized in that: The first lifting cylinder (502) is a servo motor, and the second lifting cylinder (503) is a servo motor.
10. The automated panel separation production line for PCB boards according to claim 1, characterized in that: The adsorption head adaptive upper magnet (405) and the adsorption head adaptive lower magnet (406) repel each other with the same polarity, and the adsorption head adaptive lower magnet (406) and the PCB cap adsorption magnet (407) repel each other with the same polarity.
Citation Information
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