Electronic equipment, heat dissipation method and computer readable storage medium

Abstract

The invention discloses an electronic device, a heat dissipation method and a computer readable storage medium, and is applied to the field of electronic device heat dissipation, and the electronic device comprises a case and at least one heat dissipation system arranged in the case; the heat dissipation system comprises cold plates, the cold plates comprise the first cold plate and the second cold plate, the first cold plate is perpendicular to the main board, and the second cold plate is parallel to the main board; a liquid storage component, a flow pump and a liquid cooling pipeline; a liquid outlet of the first cold plate is flush with a liquid inlet of the liquid return manifold assembly in the extending direction of the main plate; the liquid storage part and the liquid inlet of the second cold plate are arranged in the first direction and are arranged on the two sides of the main plate respectively. According to the electronic equipment disclosed by the invention, the internal space of the case can be fully utilized, and the heat dissipation requirement can be met while the miniaturization requirement of the edge server is met.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation of electronic equipment, and in particular to an electronic equipment, a heat dissipation method and a computer-readable storage medium. Background Art

[0002] As edge computing gradually becomes an important way of information processing and data storage, edge servers, as the core facilities of edge computing, are usually deployed on the user side when used indoors, such as workstations. They need to process large amounts of data and respond to user needs in real time.

[0003] Due to the high heat dissipation requirements of edge servers, conventional technologies typically employ cold plate cooling structures. These structures utilize the high thermal capacity and thermal conductivity of the cooling medium to remove heat generated by heat-generating components, addressing the cooling needs of high-power, high-density servers. However, in scenarios where edge servers are deployed on the user side, it is difficult to equip the secondary cooling side of the liquid cooling loop with a large CDU (Cooling Distribution Unit), significantly limiting the application of cold plate cooling systems in edge server cooling systems.

[0004] Therefore, how to improve the heat dissipation effect and reduce noise is a technical problem that those skilled in the art currently need to solve. Summary of the Invention

[0005] The purpose of the present invention is to provide an electronic device, a heat dissipation method and a computer-readable storage medium, which are used to meet the heat dissipation requirements of edge servers, reduce noise, and facilitate the large-scale deployment and use of edge servers on the indoor user side.

[0006] To achieve the above objectives, the present invention provides the following technical solutions.

[0007] An electronic device includes a chassis and at least one heat dissipation system arranged in the chassis; the heat dissipation system includes:

[0008] The cold plate includes a first cold plate and a second cold plate, the first cold plate is arranged perpendicular to the main board, and the second cold plate is arranged parallel to the main board;

[0009] A liquid storage component, a flow pump and a liquid cooling pipeline. The liquid storage component is used to store the cooling medium. The liquid storage component and the flow pump are both connected to the liquid cooling pipeline. The flow pump is used to drive the cooling medium to circulate along the liquid cooling pipeline.

[0010] The liquid return manifold assembly is connected to the liquid cooling pipeline, the liquid outlet of the first cold plate and the liquid inlet of the liquid return manifold assembly are arranged flush with each other in the extension direction of the main board, and the liquid outlet of the liquid return manifold assembly is connected to the liquid inlet of the second cold plate; and the liquid storage component and the liquid inlet of the second cold plate are arranged along the first direction and are arranged on both sides of the main board.

[0011] On the other hand, it also includes:

[0012] The liquid inlet manifold assembly is connected to the liquid cooling pipeline, the liquid outlet of the liquid inlet manifold assembly is connected to the liquid inlet of the first cold plate, and the height of the liquid outlet of the liquid inlet manifold assembly is higher than the height of the liquid inlet of the first cold plate.

[0013] On the other hand, it also includes:

[0014] A heat exchange component is used to cool the cooling medium, and the heat exchange component is connected to the liquid return manifold assembly;

[0015] The fan module, the liquid inlet manifold assembly, the liquid return manifold assembly and the flow pump are all arranged on the side of the heat exchange component close to the cold plate; the fan module and the liquid inlet manifold assembly are arranged longitudinally, and the fan module and the liquid return manifold assembly are arranged transversely; the fan module is located between the heat exchange component and the liquid return manifold assembly, and the airflow direction of the fan module is toward the heat exchange component.

[0016] On the other hand, several heat dissipation areas are provided in the chassis, and the heat dissipation areas correspond one-to-one to the heat dissipation systems; the heat dissipation areas include a cooling area, a confluence area and a liquid storage area, the cooling area and the liquid storage area are arranged along a first direction and are adjacent to each other, the cooling area and the liquid storage area are located on the same side of the confluence area along a second direction, and the first direction is perpendicular to the second direction; and the liquid inlet manifold assembly, the liquid return manifold assembly, the heat exchange component and the fan module are all located in the confluence area, the liquid storage component and the flow pump are located in the liquid storage area, and the first cold plate and the second cold plate are located in the cooling area.

[0017] On the other hand, the heat dissipation area is a square area, the heat dissipation area also includes a power supply area, and the heat dissipation system also includes a power supply compartment, which is located in the power supply area; the power supply area and the liquid storage area are arranged along the second direction, and the liquid storage area is arranged close to the confluence area. The sum of the lengths of the power supply area and the liquid storage area along the second direction is the same as the length of the cooling area along the second direction, and the sum of the widths of the liquid storage area and the cooling area along the first direction is the same as the width of the confluence area along the first direction.

[0018] On the other hand, the first cold plate is used to absorb the heat emitted by the first heating element, and the second cold plate is used to absorb the heat emitted by the second heating element; the liquid outlet of the liquid storage component, the flow pump and the liquid inlet of the liquid inlet manifold assembly are connected in sequence, the liquid outlet of the liquid inlet manifold assembly is connected to the liquid inlet of the first cold plate, the liquid outlet of the first cold plate is connected to the liquid inlet of the return liquid manifold assembly, the liquid outlet of the return liquid manifold assembly is connected to the liquid inlet of the second cold plate, the liquid outlet of the second cold plate is connected to the liquid inlet of the heat exchange component, and the liquid outlet of the heat exchange component is connected to the liquid inlet of the liquid storage component; wherein, the power of the second heating element is less than the power of the first heating element.

[0019] On the other hand, the liquid inlet and liquid outlet of the first cold plate are arranged along the third direction, the liquid inlet of the liquid inlet manifold assembly and the liquid outlet of the return liquid manifold assembly are arranged along the third direction, and the liquid inlet and liquid outlet of the first cold plate, the liquid inlet of the liquid inlet manifold assembly and the liquid outlet of the return liquid manifold assembly are located in the same plane; the first direction, the second direction and the third direction are perpendicular to each other.

[0020] On the other hand, the liquid cooling pipeline includes a liquid cooling main pipe and a plurality of liquid cooling branch pipes. The liquid inlet manifold assembly is arranged between the liquid inlet of each liquid cooling branch pipe and the liquid cooling main pipe. The liquid cooling branch pipes are connected to the first cold plate in a one-to-one correspondence. The liquid storage component and the flow pump are both connected to the liquid cooling main pipe.

[0021] The liquid inlet manifold assembly includes a shell and a flow guide component arranged inside the shell. The shell is provided with an inlet and several outlets on the periphery, and several flow channels are provided inside the shell. The liquid cooling main pipe is connected to the inlet, and the flow channels, outlets and liquid cooling branches are connected one by one; the flow guide component is used to divert the cooling medium so that the cooling medium is diverted to each flow channel.

[0022] On the other hand, a flow rate distribution area is provided in the shell between the inlet and the flow channel, and the flow guide component is arranged in the flow rate distribution area;

[0023] The flow guide component includes an inclined blocking member and a diverter blocking member. The inclined blocking member is arranged close to the inlet, and the diverter blocking member is arranged close to the flow channel. There are at least two inclined blocking members, which are respectively located on both sides of the inlet, and the inclined blocking members are inclined from the side close to the inlet to the side close to the flow channel toward the left and right sides of the flow rate distribution area; there are multiple diverter blocking members, and each diverter blocking member is arranged at intervals, and the extension direction of the diverter blocking member is parallel to the arrangement direction of each flow channel.

[0024] On the other hand, the liquid inlet manifold assembly also includes a number of guide plates, which are located between adjacent flow channels to separate the flow channels, and the guide plates extend from the side close to the inlet to the side away from the inlet; a bending portion is provided on the side of the guide plate away from the inlet; and, from the side close to the inlet to the side away from the inlet, the bending angle of the bending portion of each guide plate decreases successively.

[0025] On the other hand, it also includes a fixed bracket, on which the flow pump, liquid inlet manifold assembly, liquid return manifold assembly, heat exchange component and fan module are all installed. The heat exchange component and the fixed bracket are spaced apart to form a accommodating space for the fan module, flow pump and liquid inlet manifold assembly.

[0026] On the other hand, the liquid storage component is located on the side of the fixed bracket away from the heat exchange component, the flow pump is located on the side of the fixed bracket close to the liquid storage component, and the liquid inlet and outlet of the heat exchange component are both located on the side of the heat exchange component close to the flow pump.

[0027] On the other hand, it also includes:

[0028] A temperature detection component, used to detect the temperature of the heating element;

[0029] The control system is used to adjust the flow rate of the flow pump and the speed of the fan module according to the difference between the temperature of the heating element and the target temperature.

[0030] On the other hand, it also includes a leakage detection component, which is arranged on the liquid cooling pipeline, and the leakage detection component is used to detect whether the liquid cooling pipeline is leaking; the control system is connected to the leakage detection component, and the control system is also used to send a leakage signal when the liquid cooling pipeline leaks; and / or, it also includes a liquid level detection component, which is used to obtain the liquid level value in the liquid storage component; the control system is connected to the liquid level detection component, and the control system is also used to send a liquid replenishment signal when the liquid level value in the liquid storage component is less than the liquid level alarm threshold.

[0031] A heat dissipation method, applied to the above-mentioned electronic device, comprises the following steps:

[0032] Obtaining the temperature of the heating element, and when the temperature of the heating element is less than or equal to the corresponding target temperature, maintaining the flow rate of the flow pump at the target flow rate, and adjusting the speed of the fan module according to the difference between the temperature of the heating element and the target temperature;

[0033] After the temperature of the heating element is greater than the target temperature and remains for a preset time, the flow rate of the flow pump and the speed of the fan module are adjusted according to the difference between the temperature of the heating element and the target temperature.

[0034] On the other hand, it also includes the steps of:

[0035] When the temperature of any heating element is between the corresponding first temperature alarm threshold and the second temperature alarm threshold, an alarm signal is issued;

[0036] When the temperature of any heating element is greater than or equal to the corresponding second temperature alarm threshold, controlling each heating element to stop operating;

[0037] The target temperature corresponding to the same heating element is less than the first temperature alarm threshold and less than the second temperature alarm threshold.

[0038] On the other hand, it also includes the steps of:

[0039] Detecting the liquid level in the liquid storage component and sending a liquid replenishment signal when the liquid level is less than or equal to the liquid level alarm threshold;

[0040] Detect leakage of the liquid cooling pipeline and send out leakage signal when leakage occurs in the liquid cooling pipeline;

[0041] When the liquid level is greater than the liquid level alarm threshold and there is no leakage in the liquid cooling pipeline, each heating element is controlled to start.

[0042] On the other hand, adjusting the flow rate of the flow pump and the speed of the fan module according to the difference between the temperature of the heating element and the target temperature includes:

[0043] Obtain the temperature of the heating element at time t, time t-1, and time t-2;

[0044] Calculate the flow signal value of the flow pump at time t based on the temperatures of the heating element at time t, time t-1, and time t-2, the target temperature, and the flow signal value of the flow pump at time t-1;

[0045] The speed signal value of the fan module at time t is calculated according to the temperatures of the heating element at time t, time t-1 and time t-2, the target temperature and the speed signal value of the fan module at time t-1.

[0046] On the other hand, calculating the flow signal value of the flow pump at time t includes:

[0047] Calculating the flow signal value of the flow pump (220) at time t according to formula (1);

[0048]

[0049] And / or, the calculating the rotation speed signal value of the fan module (700) at time t includes:

[0050] Calculating the speed signal value of the fan module (700) at time t according to formula (2);

[0051]

[0052] in:

[0053] : the speed signal value of the fan module (700) at time t;

[0054] : the speed signal value of the fan module (700) at time t-1;

[0055] : flow signal value of the flow pump (220) at time t;

[0056] : the flow signal value of the flow pump (220) at time t-1;

[0057] : target temperature;

[0058] : the temperature of the heating element (10) at time t;

[0059] : the temperature of the heating element (10) at time t-1;

[0060] : The temperature of the heating element (10) at time t-2;

[0061] 、 、 is a constant.

[0062] A computer-readable storage medium stores a computer program, wherein the computer program implements the steps of the above-mentioned heat dissipation method when executed by a processor.

[0063] The heat dissipation system provided by the present invention has the following beneficial effects: by utilizing the setting of the first cold plate and the second cold plate in two different arrangement modes, heat transfer can be satisfied for heating elements installed in different ways; the liquid storage component and the flow pump are built into the chassis, which is conducive to the integrated design of electronic equipment and the structure is more compact. While meeting the miniaturization requirements of the edge server, it can meet its heat dissipation requirements and achieve the purpose of self-circulation, reducing dependence on external equipment; and the liquid outlet of the first cold plate and the liquid inlet of the return liquid manifold assembly are arranged flush in the extension direction of the mainboard, so that a horizontal plug-in installation method can be achieved during installation, the layout of the liquid cooling pipeline is simple and the assembly is convenient. The liquid storage component and the liquid inlet of the second cold plate are respectively arranged on both sides of the mainboard, which can make full use of the space on both sides of the mainboard, and the structure is more compact, further meeting the miniaturization design of the chassis.

[0064] In one embodiment, the flow guide component includes an inclined blocking member and a diverter blocking member, the inclined blocking member is arranged near the inlet, and the diverter blocking member is arranged near the flow channel, there are at least two inclined blocking members, which are respectively located on both sides of the inlet, and the inclined blocking member is inclined from the side close to the inlet to the side close to the flow channel toward the left and right sides of the flow rate distribution area; the number of diverter blocking members is multiple, each diverter blocking member is arranged at intervals, and the extension direction of the diverter blocking member is parallel to the arrangement direction of each flow channel; the above-mentioned setting utilizes the guidance of the inclined blocking member to make the cooling medium entering the shell flow smoothly to both sides of the shell, and utilizes the blocking of the diverter blocking member to prevent the cooling medium from directly entering the flow channel closest to the inlet, but dispersed to the flow channels located on both sides of the shell; through the setting of the inclined blocking member and the diverter blocking member, the flow direction of the cooling medium can be restricted, and the cooling medium entering the shell can flow evenly to each outlet, thereby ensuring that the flow rate of the cooling medium in each liquid cooling branch is uniform.

[0065] The heat dissipation method provided by the present invention obtains the temperature of the heating element, and when the temperature of the heating element is less than or equal to the corresponding target temperature, maintains the flow rate of the flow pump at the target flow rate, and adjusts the rotational speed of the fan module according to the difference between the temperature of the heating element and the target temperature; with the above setting, when the temperature of the heating element is less than or equal to the corresponding target temperature, there is no need to adjust the flow rate of the flow pump, thereby avoiding the problem that the liquid cooling pipeline cannot be filled with the cooling medium due to the need to reduce the flow rate of the flow pump when the temperature of the heating element is low; this heat dissipation method can not only ensure that the liquid cooling pipeline is filled with the cooling medium, but also achieve a double cooling effect by adjusting the flow rate of the flow pump when the fan module reaches the maximum speed and cannot meet the requirements. Since the flow rate of the flow pump is adjustable, the maximum speed of the fan module does not need to be too large, which makes the noise of the heat dissipation system not too high, effectively reducing noise pollution.

[0066] The electronic device provided in this application can implement the above-mentioned heat dissipation method. Since the heat dissipation method has the above-mentioned technical effects, the electronic device should also have corresponding technical effects.

[0067] The computer-readable storage medium provided in this application can implement the above-mentioned heat dissipation method. Since the heat dissipation method has the above-mentioned technical effects, the computer-readable storage medium should also have corresponding technical effects.

[0068] The computer program product provided in this application can implement the above-mentioned heat dissipation method. Since the heat dissipation method has the above-mentioned technical effects, the computer program product should also have corresponding technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0069] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0070] Figure 1 The figure is a schematic structural diagram of a specific embodiment of the heat dissipation system in the electronic device provided by the present invention.

[0071] Figure 2 for Figure 1 A top view of the cooling system shown when applied to a chassis.

[0072] Figure 3-1 for Figure 1 The diagram shows a partial structural diagram of the heat dissipation system when applied to a chassis.

[0073] Figure 3-2 for Figure 1 The diagram shows a partial structural diagram of the heat dissipation system when applied to a chassis.

[0074] Figure 4-1 for Figure 1 A structural diagram of the heat dissipation system from another perspective is shown.

[0075] Figure 4-2 for Figure 1 Schematic diagram of the location of various areas in the cooling system shown.

[0076] Figure 5 for Figure 1 Schematic diagram of the internal structure of the liquid inlet manifold assembly in the cooling system shown.

[0077] Figure 6 This is a schematic diagram of the working principle of the heat dissipation system provided by the present invention.

[0078] Figure 7 This is a schematic diagram of the connection structure of the control system in the heat dissipation system provided by the present invention.

[0079] Figure 8 The figure is a flow chart of a specific implementation of the heat dissipation method provided by the present invention.

[0080] Figure 9 This is a flow chart of another specific implementation of the heat dissipation method provided by the present invention.

[0081] Reference numerals:

[0082] Heating element 10; first heating element 11; second heating element 12; chassis 20; mainboard 30;

[0083] Cold plate 100; first cold plate 110; second cold plate 120; liquid outlet 121 of second cold plate; liquid inlet 122 of second cold plate; liquid storage component 210; flow pump 220; liquid cooling pipeline 300; liquid cooling main pipe 310; liquid cooling branch pipe 320; quick-release connector 321; first liquid cooling branch pipe 322; second liquid cooling branch pipe 323; liquid inlet manifold assembly 400; housing 410; inlet 411; outlet 412; flow channel 413; flow velocity distribution area A; flow velocity development area B; flow velocity diffusion area C; flow guide Component 420; inclined blocking member 421; diverter blocking member 422; guide plate 423; bend 423-1; liquid return manifold assembly 500; heat exchange component 600; liquid inlet 601 of the heat exchange component; liquid outlet 602 of the heat exchange component; fan module 700; fixing bracket 800; control system 910; temperature detection component 920; liquid leakage detection component 930; liquid level detection component 940; power supply compartment 950; cooling area P1; confluence area P2; liquid storage area P3; power supply area P4. DETAILED DESCRIPTION

[0084] The core of the present invention is to provide an electronic device, a heat dissipation method and a computer-readable storage medium, which can significantly increase the scope of application and meet the heat dissipation requirements of edge servers.

[0085] In order to enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0086] Please refer to Figure 1 and Figure 2 In this embodiment, the electronic device includes a chassis 20 and at least one heat dissipation system arranged in the chassis; multiple heat dissipation systems can be arranged in the chassis, and different heat dissipation systems can be set up separately, or they can also share some structures, such as the liquid storage component 210.

[0087] The cooling system includes:

[0088] The cold plate 100 includes a first cold plate 110 and a second cold plate 120 . The first cold plate 110 is arranged perpendicular to the main board 30 , and the second cold plate 120 is arranged parallel to the main board 30 .

[0089] The liquid storage component 210, the flow pump 220 and the liquid cooling pipeline 300, the liquid storage component 210 is used to store the cooling medium, the liquid storage component 210 and the flow pump 220 are both connected to the liquid cooling pipeline 300, and the flow pump 220 is used to drive the cooling medium to circulate along the liquid cooling pipeline 300;

[0090] The liquid return manifold assembly 500 is connected to the liquid cooling pipeline 300. The liquid outlet of the first cold plate 110 and the liquid inlet of the liquid return manifold assembly 500 are arranged flush with the extension direction of the main board 30. The liquid outlet of the liquid return manifold assembly 500 is connected to the liquid inlet 122 of the second cold plate. In addition, the liquid storage component 210 and the liquid inlet 122 of the second cold plate are arranged along the first direction and are respectively arranged on both sides of the main board 30.

[0091] Specifically, the chassis 20 of the electronic device can be the chassis 20 of the server, the heating element 10 is installed on the motherboard 30 in the chassis 20, and a power supply compartment 950 is also arranged in the chassis 20. The power supply compartment 950 is used to supply power to various components in the chassis 20. The chassis 20 of the electronic device is mainly used to provide physical protection for the internal components of the electronic device, provide a fixed space for each hardware component, ensure the stable installation of components such as the motherboard 30, hard disk, power supply, fan module 700, etc., and design a heat dissipation system inside the chassis 20 to help reduce the operating temperature of the electronic device and avoid the inside of the chassis 20. Overheating causes hardware damage or performance degradation, which improves the operating efficiency of the hardware. The cold plate 100 mainly adopts fluid cooling technology, introducing the cooling medium into the cold plate 100 through the liquid cooling pipe 300, absorbing heat through the cooling medium and dissipating the heat. This method is more efficient than air cooling and is particularly suitable for edge electronic devices with higher computing power. The cold plate 100 can be made of metal materials such as copper or aluminum, and is designed with complex flow channels 413 inside to enhance the heat transfer coefficient. It is fixed to the CPU (Central) inside the electronic device through spring screws and a structural backplate. The liquid cooling pipe 300 mainly provides a flow path for the cooling medium, and is used to connect the cold plate 100, the liquid inlet manifold assembly 400 and the liquid return manifold assembly 500. The flow pump 220 is a micro flow pump 220. The flow path between the liquid storage component 210 and the heat exchange component 600 transfers the heat absorbed from the heating element 10 end to the heat exchange component 600 through the liquid cooling pipe 300, forming a closed-loop cooling medium circulation system. The liquid return manifold assembly 500 is used to collect the cooling medium that has absorbed heat from each cold plate 100 and guide it to the liquid outlet to form a circulation. The material of the liquid cooling pipeline 300 is generally selected from polymer materials such as polyurethane, silicone, fluoroplastics and polytetrafluoroethylene, and the cooling medium can be ethylene glycol cooling medium, which has low corrosiveness; polyurethane can be selected as the material of the liquid cooling pipeline 300, which has good flexibility and bending resistance, and is easy to install and fix inside the complex chassis 20.

[0092] The heat dissipation system utilizes the first cold plate and the second cold plate arranged in two different ways to meet the requirements of heat transfer for heating elements installed in different ways; the liquid storage component 210 and the flow pump 220 are both arranged in the chassis 20 of the electronic device, and no external CDU (Cooling Distribution Unit) is required. Unit, cooling distribution unit equipment), is conducive to the deployment of edge servers on the user side, contributes to the integrated design of electronic equipment and has a more compact structure. While meeting the miniaturization requirements of the edge server, it can meet its heat dissipation requirements, achieve the purpose of self-circulation, and reduce dependence on external equipment; and the liquid outlet of the first cold plate 110 and the liquid inlet of the return liquid manifold assembly 500 are arranged flush in the extension direction of the mainboard 30, so that a horizontal plug-in installation method can be achieved during installation. The layout of the liquid cooling pipeline is simple and the assembly is convenient. The liquid storage component 210 and the liquid inlet 122 of the second cold plate are respectively arranged on both sides of the mainboard 30, which can fully utilize the space on both sides of the mainboard. The structure is more compact, further meeting the miniaturization design of the chassis.

[0093] In some embodiments, further comprising:

[0094] The liquid inlet manifold assembly 400 is connected to the liquid cooling pipeline 300. The liquid outlet of the liquid inlet manifold assembly 400 is connected to the liquid inlet of the first cold plate 110, and the height of the liquid outlet of the liquid inlet manifold assembly 400 is higher than the height of the liquid inlet of the first cold plate 110. The liquid cooling pipeline 300 used to connect the liquid outlet of the liquid inlet manifold assembly 400 and the liquid inlet of the first cold plate 110 can be provided with an arc-shaped transition structure to facilitate connection.

[0095] Specifically, the liquid inlet manifold assembly 400 is used to distribute the cooling medium from the liquid cooling pipeline 300 to each first cold plate 110, ensuring that each first cold plate 110 can obtain sufficient and uniform cooling medium flow, avoiding overheating or insufficient cooling in certain areas; the flow pump 220 can be flush with the upper part of the liquid inlet manifold assembly 400, reducing the additional space occupied by the flow pump 220; the liquid storage component 210 and the flow pump 220 should both be arranged close to the liquid inlet manifold assembly 400 to reduce the length of the liquid cooling pipeline 300.

[0096] In some embodiments, further comprising:

[0097] The heat exchange component 600 is used to cool the cooling medium, and the heat exchange component 600 is connected to the liquid return manifold assembly 500;

[0098] The fan module 700, the fan module 700, the liquid inlet manifold assembly 400, the liquid return manifold assembly 500 and the flow pump 220 are all arranged on the side of the heat exchange component 600 close to the cold plate 100; the fan module 700 and the liquid inlet manifold assembly 400 are arranged longitudinally, and the fan module 700 and the liquid return manifold assembly 500 are arranged transversely; the fan module 700 is located between the heat exchange component 600 and the liquid return manifold assembly 500, and the airflow direction of the fan module 700 is toward the heat exchange component 600.

[0099] Specifically, the heat of the heating element 10 is transferred by the cold plate 100, and the heat of the heating element 10 is transferred to the heat exchange component 600 through the liquid cooling pipe 300, and then the heat exchange component 600 is cooled by the fan module 700, thereby achieving a dual heat dissipation effect of the heat exchange component 600 and the fan module 700, thereby meeting the heat dissipation requirements of the self-circulating heat dissipation system; at the same time, the fan module 700 and the liquid inlet manifold assembly 400 are arranged in the longitudinal direction, and the fan module 700 and the liquid return manifold assembly 500 are arranged in the longitudinal direction. Arranged horizontally, the flow pump 220 can be located above the return liquid manifold assembly 500 and flush with the liquid inlet manifold assembly 400, so that the positions of the fan module 700, the liquid inlet manifold assembly 400, the return liquid manifold assembly 500 and the flow pump 220 are all in line with the heat exchange component 600, so that the cooling system can make full use of the internal space of the chassis 20, while meeting the miniaturization requirements of the edge server, it can meet its heat dissipation effect, achieve the purpose of self-circulation, and reduce dependence on external equipment.

[0100] Furthermore, the heat exchange component 600 can be a radiator, which includes a plurality of fins and a heat pipe. The heat pipe is connected to the liquid cooling pipeline 300. The cooling medium transfers heat to each fin through the heat pipe. There is a gap between adjacent fins. The fan module 700 accelerates the cooling of the fins by providing airflow to the gaps between adjacent fins, thereby cooling the cooling medium in the heat pipe and the liquid cooling pipeline 300. The heat dissipation system combines the cold plate 100, the fan module 700 and the air-liquid radiator heat exchange component 600 to construct a miniaturized internal circulation air-liquid hybrid heat dissipation system. The system can ensure efficient heat dissipation of each heating element 10 of the edge server while minimizing the noise of the fan module 700, which is conducive to the large-scale deployment and use of edge electronic equipment on the indoor user side. The fan module 700 can include multiple fan units, which can be controlled simultaneously or individually. The heat dissipation efficiency of the entire fan module 700 can be changed by adjusting the speed of each fan unit.

[0101] In some embodiments, see Figure 4-2, several heat dissipation areas are provided in the chassis 20, and the heat dissipation areas correspond to the heat dissipation systems one by one; the heat dissipation areas include a cooling area P1, a confluence area P2 and a liquid storage area P3. The cooling area P1 and the liquid storage area P3 are arranged along a first direction and are adjacent to each other. The cooling area P1 and the liquid storage area P3 are located on the same side of the confluence area P2 along a second direction. The first direction is perpendicular to the second direction. By setting the confluence area P2 on one side of the heat dissipation area, it is convenient to cool the confluence area P2, the layout is more reasonable, and the structure is more compact.

[0102] In some embodiments, the liquid inlet manifold assembly 400, the liquid return manifold assembly 500, the heat exchange component 600 and the fan module 700 are all located in the confluence area P2, the liquid storage component 210 and the flow pump 220 are located in the liquid storage area P3, and the first cold plate 110 and the second cold plate 120 are located in the cooling area P1. Through the zoning setting, specific functions can be completed in each area, saving space.

[0103] In some embodiments, the heat dissipation area is a square area, the projection of the heat dissipation area in the third direction is a square area, the heat dissipation area also includes a power supply area P4, and the heat dissipation system also includes a power supply compartment 950, and the power supply compartment 950 is located in the power supply area P4; the power supply area P4 and the liquid storage area P3 are arranged along the second direction, and the liquid storage area P3 is arranged close to the confluence area P2, and the sum of the lengths of the power supply area P4 and the liquid storage area P3 along the second direction is the same as the length of the cooling area P1 along the second direction, and the sum of the widths of the liquid storage area P3 and the cooling area P1 along the first direction is the same as the width of the confluence area P2 along the first direction; through the directional structure of the heat dissipation area setting, the space occupied by the entire heat dissipation system is more reasonable, and the arrangement in the chassis 20 is more convenient.

[0104] In some embodiments, the heating element 10 includes a first heating element 11 and a second heating element 12. The number of the first cold plate 110 and the number of the first heating element 11 are both multiple, and the position of the first cold plate 110 corresponds to the position of the first heating element 11 one by one, ensuring that each first heating element 11 has a corresponding first cold plate 110 for heat dissipation; the first cold plate 110 is used to absorb the heat emitted by the first heating element 11, and the second cold plate 120 is used to absorb the heat emitted by the second heating element 12; the liquid outlet of the liquid storage component 210 and the flow pump 22 0 and the liquid inlet of the liquid inlet manifold assembly 400 are connected in sequence, the liquid outlet of the liquid inlet manifold assembly 400 is connected with the liquid inlet of the first cold plate 110, the liquid outlet of the first cold plate 110 is connected with the liquid inlet of the return liquid manifold assembly 500, the liquid outlet of the return liquid manifold assembly 500 is connected with the liquid inlet 122 of the second cold plate, the liquid outlet 121 of the second cold plate is connected with the liquid inlet 601 of the heat exchange component, and the liquid outlet 602 of the heat exchange component is connected with the liquid inlet of the liquid storage component 210; wherein, the power of the second heating element 12 is less than the power of the first heating element 11.

[0105] Specifically, the second cold plate 120 is located on the liquid cooling main pipe 310 and between the liquid cooling branch pipe 320 and the heat exchange component 600; wherein the power of the second heating element 12 is less than the power of the first heating element 11; specifically, the cooling medium flows from the liquid storage component 210 through the flow pump 220 in the liquid cooling pipeline 300, first enters each first cold plate 110 through the liquid inlet manifold assembly 400, and is heated for the first time, then flows to the liquid return manifold assembly 500, enters the second cold plate 120, and is heated for the second time, and then passes through the heat exchange component 600, and after being cooled by the heat exchange component 600 and the fan module 700, returns to the liquid storage component 210.

[0106] In some embodiments, the liquid inlet of the first cold plate 110 and the liquid outlet of the first cold plate 110 are arranged along the third direction, the liquid inlet of the liquid inlet manifold assembly 400 and the liquid outlet of the return liquid manifold assembly 500 are arranged along the third direction, and the liquid inlet of the first cold plate 110 and the liquid outlet of the first cold plate 110, the liquid inlet of the liquid inlet manifold assembly 400 and the liquid outlet of the return liquid manifold assembly 500 are located in the same plane. This arrangement is to ensure that the liquid inlet of the liquid inlet manifold assembly 400 and the liquid outlet of the return liquid manifold assembly 500 can be simultaneously plugged into the liquid inlet of the first cold plate 110 and the liquid outlet of the first cold plate 110, which is beneficial to the arrangement of the liquid cooling branch pipe 320 and saves the length of the liquid cooling branch pipe 320; the first direction, the second direction and the third direction are perpendicular to each other; the liquid inlet of the first cold plate 110 is located on the side of the liquid outlet of the first cold plate 110 away from the main board 30.

[0107] In some embodiments, as Figure 1 and Figure 6As shown, the liquid cooling pipeline 300 includes a liquid cooling main pipe 310 and several liquid cooling branches 320, each of which is connected to the liquid cooling main pipe 310, and the liquid inlet manifold assembly 400 is arranged between the liquid inlet of each liquid cooling branch pipe 320 and the liquid cooling main pipe 310; the liquid cooling branch pipes 320 are connected to the first cold plates 110 one by one, and the liquid storage component 210, the flow pump 220 and the heat exchange component 600 are all connected to the liquid cooling main pipe 310. The liquid cooling branches 320 are used to flow the cooling medium in the liquid cooling main pipe 310 through each corresponding first cold plate 110 to effectively dissipate heat for the first heating element 11. The liquid cooling branch pipe 320 includes a first liquid cooling branch pipe 322 and a second liquid cooling branch pipe 323. The first liquid cooling branch pipe 322 connects the liquid outlet of the liquid inlet manifold assembly 400 and the liquid inlet of the first cold plate 110. The second liquid cooling branch pipe 323 connects the liquid outlet of the first cold plate 110 and the liquid inlet of the return liquid manifold assembly 500. The second liquid cooling branch pipe 323 is arranged horizontally. The first liquid cooling branch pipe 322 is located at the upper part of the second liquid cooling branch pipe 323 along the first direction; the first liquid cooling branch pipe 322 is close to the side of the first cold plate 110 and is arranged parallel to the side of the second liquid cooling branch pipe 323 close to the first cold plate 110. The first liquid cooling branch pipe 322 is close to the liquid inlet. One side of the manifold assembly 400 is bent in a direction away from the second liquid-cooling branch pipe 323, so as to meet the setting that the height of the liquid outlet of the liquid inlet manifold assembly 400 is higher than the height of the liquid inlet of the first cold plate 110; quick-release joints 321 are provided at both ends of the first liquid-cooling branch pipe 322 and the second liquid-cooling branch pipe 323 to improve the efficiency of disassembly and assembly; a cable tie can be provided between the first liquid-cooling branch pipe 322 and the second liquid-cooling branch pipe 323. Since the first liquid-cooling branch pipe 322 is located close to the second liquid-cooling branch pipe 323, the structure is compact. By providing a cable tie, interference between the liquid cooling pipes 300 can be avoided, further meeting the requirements of miniaturized design.

[0108] In some embodiments, the liquid inlet manifold assembly 400 is disposed between the inlet 411 of each liquid cooling branch pipe 320 and the liquid cooling main pipe 310, and the liquid inlet manifold assembly 400 is used to distribute the flow of the cooling medium entering each liquid cooling branch pipe 320 from the liquid cooling main pipe 310; further, as Figure 5As shown, the liquid inlet manifold assembly 400 includes a shell 410 and a flow guide component 420 disposed in the shell 410. The shell 410 is provided with an inlet 411 and a plurality of outlets 412 on its periphery. The shell 410 is provided with a plurality of flow channels 413 inside. The liquid cooling main pipe 310 is connected to the inlet 411. The flow channels 413, the outlets 412 and the liquid cooling branch pipes 320 are connected one by one. The flow guide component 420 is used to divert the cooling medium so that the cooling medium is diverted to each flow channel 413. Specifically, the flow guide component 420 can be a block structure or a plate structure. , can be fixed in the shell 410 by welding to ensure the connection strength; the number of flow channels 413 is the same as the number of outlets 412, and they correspond one to one, ensuring that the cooling medium entering a single flow channel 413 can smoothly flow out through the outlet 412; further, through the setting of the guide component 420, after entering the shell 410, the cooling medium will encounter the structural feature obstacle of the guide component 420 in the flow distribution area A, and the flow direction of the cooling medium will flow to both sides, and the forward flow velocity will be reduced. Based on this structure, the flow of the cooling medium is distributed to both sides.

[0109] In some embodiments, a flow rate distribution area A is provided within the housing 410 between the inlet 411 and the flow channel 413. A flow guide component 420 is disposed within the flow rate distribution area A. The flow guide component 420 includes an inclined blocking member 421 and a diverter blocking member 422. The inclined blocking member 421 is disposed near the inlet 411, and the diverter blocking member 422 is disposed near the flow channel 413. There are at least two inclined blocking members 421, one located on either side of the inlet 411, and the inclined blocking members 421 are inclined from the side near the inlet 411 to the side near the flow channel 413 toward the left and right sides of the flow rate distribution area A. There are multiple diverter blocking members 422, each of which is spaced apart, and the extension direction of the diverter blocking members 422 is parallel to the arrangement direction of the flow channels 413. Specifically, the left and right sides of the flow rate distribution area A refer to directions perpendicular to the direction of the inlet 411, and the arrangement direction of the flow channels 413 is perpendicular to the direction of the inlet 411. The above-mentioned arrangement utilizes the flow guidance of the inclined blocking member 421 to allow the cooling medium entering the shell 410 to flow smoothly to both sides of the shell 410, and utilizes the blocking of the diverter blocking member 422 to prevent the cooling medium from directly entering the flow channel 413 closest to the inlet 411, but is dispersed to the flow channels 413 located on both sides of the shell 410; through the arrangement of the inclined blocking member 421 and the diverter blocking member 422, the flow direction of the cooling medium can be restricted, and the cooling medium entering the shell 410 can flow evenly to each outlet 412, thereby ensuring that the flow of the cooling medium in each liquid-cooling branch pipe 320 is uniform.

[0110] In some embodiments, the liquid inlet manifold assembly 400 further includes a plurality of guide plates 423, which are located between adjacent flow channels 413 to separate the flow channels 413. The guide plates 423 extend from a side close to the inlet 411 to a side away from the inlet 411. A bend 423-1 is provided on the side of the guide plate 423 away from the inlet 411. Furthermore, the bend angle of the bend 423-1 of each guide plate 423 decreases from the side close to the inlet 411 to the side away from the inlet 411. In other words, the bend angles of the bend 423-1 of different guide plates 423 are different, such as Figure 5 The middle bending angle α varies depending on the position of the outlet 412 . The closer the outlet 412 is to the inlet 411 , the larger the bending angle α of the corresponding bending portion 423 - 1 of the guide plate 423 .

[0111] Specifically, through the above-mentioned setting of the liquid inlet manifold assembly 400, a gradual flow channel 413 structure is designed inside the distribution manifold assembly. First, a flow rate distribution area A is designed at the inlet 411 of the shell 410. The cooling medium flow with a relatively high speed in this area slows down and changes direction after encountering an obstacle and flows to the flow channels 413 on both sides. Such a design can effectively reduce the impact force of the cooling medium at the inlet 411, and avoid excessive speed differences of the cooling medium in the flow channels 413, resulting in uneven distribution; secondly, the liquid inlet manifold assembly 400 adopts a multi-layer flow channel 413 design, and the evenly distributed cooling medium enters the flow rate development area B through each flow channel 413. This design increases the cooling medium flow. The number of channels and layers for the flow of the cooling medium is adjusted to slow down the flow rate of the cooling medium and avoid excessive or insufficient local flow. At the same time, a flow diffusion zone C is designed downstream of the flow channel 413. The bending angles of the guide plates 423 corresponding to each flow channel 413 in this area are different. The bending angle is smaller in the area farther away from the inlet 411. The reason is that the flow velocity development zone B away from the inlet 411 is longer and the fluid is fully developed, requiring a smaller bending radius to reduce flow turbulence. Through this design, the flow direction and speed of the cooling medium in each flow channel 413 are changed, and the flow rate is more uniform. The turbulence of the cooling medium in the flow channel 413 is reduced, thereby ensuring that the cooling medium flow rate obtained by each first cold plate 110 is balanced. Through the above design, a gradually decompressed flow channel 413 structure is formed at the inlet 411 and outlet 412 of the shell 410 of the liquid inlet manifold assembly 400, effectively reducing the impact force and turbulence of the cooling medium, allowing the cooling medium to flow smoothly and ensuring the uniformity of the flow rate.

[0112] In some embodiments, the number of diverter blocks 422 is the same as the number of guide plates 423, and they are arranged in a one-to-one correspondence. The diverter blocks 422 are located on the side of the guide plates 423 near the inlet 411. The side of each guide plate 423 near the inlet 411 is flush with the diverter block 422, and the diverter blocks 422 are spaced apart from the guide plates 423. In other words, the side of each guide plate 423 near the inlet 411 is flush with the side of each guide plate 423 and the diverter blocks 422 are spaced apart from the guide plates 423. This arrangement ensures a stable flow rate of the cooling medium. The spaced-apart flow blocks 422 and guide plates 423 provide ample space for the cooling medium to flow, ensuring that the cooling medium enters the flow channel 413 smoothly.

[0113] In some embodiments, the first cold plate 110 and the first heating element 11 are both arranged perpendicular to the motherboard 30, and the second cold plate 120 and the second heating element 12 are both arranged parallel to the motherboard 30. Specifically, the first heating element 11 can be a card component, such as a CPU. Figure 3-1 As shown, or GPU, as Figure 3-2 As shown, the second heating element 12 can be a switching element, such as a switch element; the first heating element 11 is vertically inserted into the motherboard 30 in the chassis 20 of the electronic device, and the second heating element 12 is horizontally laid on the motherboard 30. By installing the first cold plate 110 perpendicular to the motherboard 30, space can be saved and the heat conduction area with the first heating element 11 is increased, thereby improving the heat conduction efficiency.

[0114] In some embodiments, as Figure 1 As shown, the electronic device chassis 20 further includes a fixing bracket 800. The flow pump 220, the liquid inlet manifold assembly 400, the liquid return manifold assembly 500, the heat exchange component 600, and the fan module 700 are all mounted on the fixing bracket 800. The heat exchange component 600 is spaced apart from the fixing bracket 800 to form a receiving space for the fan module 700, the flow pump 220, and the liquid inlet manifold assembly 400. Specifically, the liquid inlet manifold assembly 400 and the liquid return manifold assembly 500 are both mounted inside the electronic device chassis 20 via screws and the fixing bracket 800. Quick-release connectors 321 are welded to each inlet 411 and outlet 412 of the liquid inlet manifold assembly 400 and the liquid return manifold assembly 500. The quick-release connectors 321 include a quick-connect male connector and a quick-connect female connector. The quick-connect male connector is oriented directly toward the quick-connect female connector of the liquid cooling pipe 300. The quick-connect male connector and the quick-connect female connector can be quickly plugged in and out without leaking, thereby improving assembly efficiency.

[0115] In some embodiments, see Figure 4-1, the liquid storage component 210 is located on the side of the fixed bracket 800 away from the heat exchange component 600, the flow pump 220 is located on the side of the fixed bracket 800 close to the liquid storage component 210, and the liquid inlet 601 and the liquid outlet of the heat exchange component are both located on the side of the heat exchange component 600 close to the flow pump 220; the liquid cooling main pipe 310 includes a main pipe connecting section for communicating with the liquid outlet 121 of the second cold plate, the main pipe connecting section and the liquid storage component 210 are respectively located on the left and right sides of the liquid cooling branch pipe 320 along the first direction, and the liquid storage component 210 is arranged close to the first cold plate 110; such an arrangement can store The liquid component 210 and the main pipe connecting section are respectively located on both sides of the liquid cooling branch pipe 320, that is, respectively located on both sides of the main board 30, which can make more effective use of the space inside the chassis 20 and have a more compact structure; the main pipe connecting section can be a section of the liquid cooling main pipe 310 connected to the inlet of the second cold plate 120, or it can be a section of the liquid cooling main pipe 310 connected to the liquid outlet 121 of the second cold plate; further, the bottom of the fixed bracket 800 is provided with an assembly plate for detachable connection with the chassis 20, and the assembly plate and the chassis 20 can be connected with bolts to ensure the stability of the fixed bracket 800.

[0116] In some embodiments, the flow pump 220 is responsible for driving the circulation of the cooling medium in the liquid cooling pipeline 300, ensuring that the cooling medium can continuously absorb and transfer heat, and can adjust the flow of the cooling medium to adapt to the different heat dissipation requirements of the electronic equipment. Compared with the electronic equipment in the related art, which needs to rely on an external CDU device, the flow pump 220 can be built into the electronic equipment to provide power for the cooling cycle, which helps the integrated design of the electronic equipment and has a more compact structure. The flow pump 220 is installed inside the electronic equipment chassis 20 by screws and a fixing bracket 800. It is located close to the liquid cooling main pipe 310 of the liquid cooling system to minimize the resistance to the flow of the cooling medium and improve the circulation efficiency. The liquid outlet of the flow pump 220 is connected to the liquid inlet of the liquid inlet manifold assembly 400 through a pipeline, and the liquid inlet of the flow pump 220 is connected to the liquid outlet of the liquid storage component 210 through a pipeline.

[0117] In some embodiments, the liquid storage component 210 is used to store the cooling medium required to replenish the cold plate 100, serving as a backup cooling medium source for the liquid cooling pipeline 300, to prevent insufficient cooling medium in the pipeline due to leakage or evaporation of the cooling medium. The liquid storage component 210 can be a liquid storage tank, the liquid inlet of which is designed above the gravity direction of the tank, and is connected to the liquid outlet 602 of the heat exchange component through a pipeline, and the liquid outlet is designed below the gravity direction of the tank, and is connected to the liquid inlet of the flow pump 220 through a pipeline. Under the use of gravity, the flow pump 220 can ensure that sufficient cooling medium is pumped out at all times. At the same time, a liquid level sensor is designed inside the liquid storage component 210, and the liquid level sensor communicates with the control system 910 on the electronic device motherboard 30 to monitor the cooling medium level in the liquid storage component 210 in real time, to ensure that the cooling medium in the liquid storage component 210 is replenished in time, and to avoid the degradation of the system heat dissipation performance due to insufficient cooling medium.

[0118] In some embodiments, the fan module 700 primarily cools the high-temperature cooling medium entering the heat exchange component 600 through forced convection. The cooled low-temperature cooling medium is then pumped back to the various cold plates 100 by the flow pump 220 for heat dissipation. The fan module 700 is mounted within the chassis 20 via screws and a fixing bracket 800, with the air outlet facing the copper tube fin heat exchanger of the heat exchange component 600. Furthermore, the fan module 700 can also provide heat dissipation for heating elements 10 within electronic devices that are too small to fit on a cold plate 100. Aluminum heat sinks are mounted on these smaller heating elements 10, utilizing the excellent thermal conductivity of aluminum to transfer heat generated by the heating elements 10, such as CPUs, LED heating elements 10, and power semiconductors, to the heat exchange component 600. The heat exchange component 600 then increases its contact area with the air, for example, through a fin design, allowing the heat to be dissipated to the environment through natural convection or forced fan airflow, thereby enhancing air cooling and heat dissipation. In order to achieve intelligent control of the fan module 700, the fan module 700 communicates with the control system 910 on the electronic device mainboard 30 through a cable connector to achieve automatic adjustment of the fan module 700 speed and realize intelligent heat dissipation management.

[0119] In some embodiments, the heat exchange component 600 is a key heat dissipation component in the liquid cooling system. It is made of multiple sets of copper tubes and fins distributed horizontally and vertically. After a high-temperature cooling medium flows into the copper tubes, the heat is transferred to the fins welded to them. Under the action of the fan module 700, the heat in the heat dissipation system is dissipated to the external environment through forced convection. The heat exchange component 600 is installed at the air outlet of the electronic device chassis 20 to ensure sufficient air circulation space. Its liquid inlet is connected to the liquid outlet of the liquid return manifold assembly 500 by a pipeline, and the liquid outlet is connected to the liquid inlet of the liquid storage component 210 by a pipeline.

[0120] In some embodiments, as Figure 7 As shown, it also includes a temperature detection component 920 and a control system 910. The temperature detection component 920 is used to detect the temperature of the heating element 10. When the number of the heating elements 10 is multiple, the number of the temperature detection components 920 should also be multiple, and the temperature detection components 920 correspond to the heating elements 10 one by one. The control system 910 is used to adjust the flow rate of the flow pump 220 and the speed of the fan module 700 according to the difference between the temperature of the heating element 10 and the target temperature. Specifically, the control system 910 is used to monitor the temperature of each heating element 10 inside the electronic device in real time, and automatically adjust the operating parameters of the fan module 700 and the flow pump 220 through data analysis to ensure the stable operation and equipment safety of the electronic device under various loads and environmental conditions. The control system 910 may include CPLD (Complex Programmable Logic Device) components and BMC (Baseboard Management Controller, baseboard management controller) components, both of which perform logical judgment after receiving sensor signals and send adjustment instructions to the cooling fan module 700 and the flow pump 220, thereby realizing intelligent control of the entire cooling system. At the same time, they trigger an alarm shutdown when a system abnormality is detected; the temperature sensor is mainly used to monitor the temperature of each heating element 10 of the electronic device in real time and transmit the signal to the latter. The heating element 10 and the temperature sensor are both distributed on the motherboard 30 of the electronic device.

[0121] In some embodiments, a liquid leakage detection component 930, such as a liquid leakage sensor, is further included. The liquid leakage detection component 930 is arranged on the liquid cooling pipeline 300, and the liquid leakage detection component 930 is used to detect whether the liquid cooling pipeline 300 is leaking; the control system 910 is connected to the liquid leakage detection component 930, and the control system 910 is also used to send a leakage signal when the liquid cooling pipeline 300 leaks; the setting of the liquid leakage detection component 930 can ensure the safe operation of the electronic equipment. The liquid leakage detection component 930 can monitor the leakage of the liquid cooling pipeline 300 in real time, and stop the operation of the electronic equipment at any time when the liquid cooling pipeline 300 is detected to avoid damage to the components inside the electronic equipment.

[0122] In some embodiments, a liquid level detection component 940, such as a liquid level sensor, is further included. The liquid level detection component 940 is installed in the liquid storage component 210, and the liquid level detection component 940 is used to obtain the liquid level value in the liquid storage component 210; the control system 910 is connected to the liquid level detection component 940, and the control system 910 is also used to send a liquid replenishment signal when the liquid level value in the liquid storage component 210 is less than the liquid level alarm threshold; specifically, the control system 910 is used to monitor the leakage of the liquid cooling pipeline 300 and the liquid level in the liquid storage component 210 in real time, and trigger an alarm log when the system leakage or the liquid level is too low to ensure the stable operation and equipment safety of the electronic equipment under various load and environmental conditions; the leakage detection component 930 and the liquid level sensor communicate with the mainboard 30 via a cable.

[0123] In some embodiments, the control system 910 includes an acquisition unit, a calculation unit, a judgment unit, and an execution unit; the acquisition unit is connected to the temperature detection component 920 and is used to obtain the temperature of the heating element 10; the calculation unit is used to calculate the difference between the temperature of the heating element 10 and the target temperature; the judgment unit is used to determine whether the temperature of any heating element 10 is between the corresponding first temperature alarm threshold and the second temperature alarm threshold, and is also used to determine whether the temperature of any heating element 10 is greater than or equal to the corresponding second temperature alarm threshold; the execution unit is used to adjust the flow rate of the flow pump 220 and the speed of the fan module 700 according to the difference between the temperature of the heating element 10 and the target temperature, and is also used to determine whether the temperature of any heating element 10 is greater than or equal to the corresponding second temperature alarm threshold. When the temperature of the heating element 10 is between the corresponding first temperature alarm threshold and the second temperature alarm threshold, an alarm signal is issued, and when the temperature of any heating element 10 is greater than or equal to the corresponding second temperature alarm threshold, each heating element 10 is controlled to stop running; further, the acquisition unit is also used to obtain the detection result of the leakage detection component 930 and the detection result of the liquid level detection component 940, and the execution unit is also used to control each heating element 10 to stop running when the liquid cooling pipeline 300 leaks and when the liquid level value in the liquid storage component 210 is less than the liquid level alarm threshold; specifically, each heating element 10 can be stopped by cutting off the power of the electronic equipment to avoid damage to the heating element 10 and the control system 910.

[0124] In some embodiments, the mainboard 30 is provided with a plurality of slots for connecting the first heating element 11, and the number of the first cold plates 110, the number of slots, and the number of the liquid cooling branches 320 are all the same and are arranged in a one-to-one correspondence. Furthermore, a plurality of electrically controlled valves are provided, and the electrically controlled valves are arranged in a one-to-one correspondence with the liquid cooling branches 320. The control system 910 is also used to obtain the target slot connected to the first heating element 11, and determine the target liquid cooling branch 320 according to the position of the target slot, and open the corresponding electrically controlled valve according to the position of the target liquid cooling branch 320. Specifically, not every slot is connected to the first heating element 11, so the control system 910 obtains the target slot connected to the first heating element 11 to determine which first cold plate 110 needs to participate in heat dissipation, and then opens the corresponding electrically controlled valve. For the first cold plate 110 that does not need to be cooled, the corresponding electrically controlled valve does not need to be opened, thereby ensuring that the cooling medium can be fully utilized, avoiding waste, and improving the scope of application.

[0125] In a specific embodiment, during the normal operation of the electronic device, the heat dissipation system will cooperatively drive the heat dissipation fan module 700 and the flow pump 220 through the intelligent control system to dissipate heat efficiently; specifically, the low-temperature cooling medium is extracted from the liquid storage component 210 by the flow pump 220 and transported to the liquid inlet manifold assembly 400 through the liquid cooling pipeline 300; the liquid inlet manifold assembly 400 adopts a precision flow channel 413 design to ensure the uniform distribution of the cooling medium, and then enters the first cold plate 110 corresponding to the CPU heating element 10 and the GPU heating element 10 respectively; in the first cold plate 110, the cooling medium and the first heating element 11 perform efficient heat exchange, absorb the heat generated by the first heating element 11, and the temperature gradually increases to form a high-temperature cooling medium; these high-temperature cooling media are then merged To the return liquid manifold assembly 500, the structure of the return liquid manifold assembly 500 can be the same as that of the liquid inlet manifold assembly 400, or can be set as needed. After reasonable collection, it enters the second cold plate 120 corresponding to the second heating element 12 for secondary heat exchange, further absorbs the heat generated by the second heating element 12, and finally forms a secondary high-temperature cooling medium; the secondary high-temperature cooling medium is then sent to the heat exchange component 600 by the flow pump 220. During this process, the heat is transferred to the copper tube and fins through the efficient heat exchange structure of the heat exchange component 600; the fan module 700 effectively dissipates the heat generated by the heat exchange component 600 to the external environment through the air duct design, thereby converting the secondary high-temperature cooling medium into a low-temperature cooling medium, completing the entire cooling cycle, and returning to the liquid storage component 210 to start the next cycle. Through this liquid cooling cycle, the heat transfer resistance at the end of the heating element 10 is effectively reduced. Compared with the traditional radiator-type air cooling, the heat transfer efficiency between the heat exchange component 600 and the fan module 700 is higher, so the actual speed of the fan module 700 can be significantly reduced. The entire cooling system is not only low-noise and efficient, but also able to meet the needs of the user side. The cooling system adopts a fully enclosed circulation design with high reliability, which can effectively prevent the problem of cooling medium leakage. Through this efficient thermal management solution, not only the heat dissipation performance of electronic equipment is improved, but also the energy efficiency performance of the cooling system provides reliable heat dissipation guarantee for high-density electronic equipment computing platforms. It can ensure the use of edge electronic equipment on the indoor user side and ensure the stable and efficient operation of edge electronic equipment.

[0126] In addition to the above heat dissipation system, the present invention also provides a heat dissipation method, which can be applied to the above heat dissipation system.

[0127] Please refer to Figure 8 , the heat dissipation method comprises the following steps:

[0128] Step S1: Obtain the temperature of the heating element 10, and when the temperature of the heating element 10 is less than or equal to the corresponding target temperature, maintain the flow rate of the flow pump 220 at the target flow rate, and adjust the speed of the fan module 700 according to the difference between the temperature of the heating element 10 and the target temperature; Specifically, the temperature of the heating element 10 can be obtained in real time to improve the control accuracy; Of course, the target flow rate should be set so that the flow rate of the flow pump 220 can fill the liquid cooling pipe 300 with the cooling medium; The above setting does not require adjustment when the temperature of the heating element 10 is less than or equal to the corresponding target temperature. The flow rate of the throttling flow pump 220 is to avoid the problem that the liquid cooling pipe 300 cannot be filled with the cooling medium due to the need to reduce the flow rate of the flow pump 220 when the temperature of the heating element 10 is low; this method can not only ensure that the liquid cooling pipe 300 is filled with the cooling medium, but also achieve a double cooling effect by adjusting the flow rate of the flow pump 220 when the fan module 700 reaches the maximum speed and cannot meet the requirements. Since the flow rate of the flow pump 220 is adjustable, the maximum speed of the fan module 700 does not need to be too large, so that the noise of the cooling system will not be too high, effectively reducing noise pollution.

[0129] Step S2: After the temperature of the heating element 10 is greater than the target temperature and remains at that temperature for a predetermined time, the flow rate of the flow pump 220 and the speed of the fan module 700 are adjusted according to the difference between the temperature of the heating element 10 and the target temperature. Specifically, when the temperature of each heating element 10 is lower than its corresponding target temperature, the fan module 700 is adjusted in a PID (Proportional-Integral-Derivative) mode, and the flow pump 220 maintains the initial flow rate. Run, for example, given When the control system 910 monitors that the temperature of any one of the heating elements 10 exceeds the corresponding target temperature and lasts for a preset time, the preset time can be set as needed, for example, 5 minutes, which means that the maximum fan module 700 air volume and the initial flow rate When the heat dissipated by the heat dissipation system reaches its limit, the flow pump 220 will start the PID adjustment mode to increase the flow rate to further reduce the temperature of the heating element 10 so that it is maintained near the corresponding target temperature.

[0130] In some embodiments, see Figure 9 , further comprising the steps of:

[0131] Step S3: When the temperature of any heating element 10 is between the corresponding first temperature alarm threshold and the second temperature alarm threshold, an alarm signal is issued to remind manual inspection;

[0132] Step S4: When the temperature of any heating element 10 is greater than or equal to the corresponding second temperature alarm threshold, each heating element 10 is controlled to stop running, an alarm log is recorded, and a manual inspection is prompted. At this time, the electronic device enters a high temperature abnormal state; wherein, the target temperature corresponding to the same heating element 10 is less than the first temperature alarm threshold and less than the second temperature alarm threshold.

[0133] It should be noted that different heating elements 10 correspond to different target temperatures, first temperature alarm thresholds, and second temperature alarm thresholds. When it is necessary to adjust the flow rate of the flow pump 220 and the speed of the fan module 700, the maximum value of the flow rate of the flow pump 220 and the speed of the fan module 700 calculated for each heating element 10 should be used as the adjustment value to ensure that the temperature of any heating element 10 does not exceed the corresponding second temperature alarm threshold and can be controlled below the first temperature alarm threshold. Furthermore, it is also possible to issue an early warning of the temperature and predict the temperature of the heating element 10, thereby setting the adjustment range of the flow pump 220 and the fan module 700 in advance; specifically, through adaptive adjustment, the cooling system not only responds when the temperature reaches the alarm threshold, but also performs trend analysis based on historical temperature data, predicts possible high temperature problems in advance, and performs adaptive adjustment. When the temperature of the heating element 10 is greater than the first alarm threshold, the fan module 700 and the flow pump 220 increase the load and activate the alarm mechanism; when the temperature of the heating element 10 is greater than or equal to the first alarm threshold, a high-temperature shutdown is required, and the cooling system will immediately execute the shutdown command to prevent damage to the electronic equipment.

[0134] In a specific embodiment, the target temperature can be the temperature Spec value of the heating element 10 minus 10°C, the first alarm threshold can be the temperature Spec value of the heating element 10 minus 4°C, and the second alarm threshold can be the temperature Spec value of the heating element 10 minus 2°C. The temperature Spec value of the heating element 10 refers to the theoretical operating temperature value of the heating element 10. The heating element 10 should not exceed the temperature Spec value during application. Of course, the settings of the target temperature, the first alarm threshold and the second alarm threshold can also be selected according to needs, so that the target temperature, the first alarm threshold and the second alarm threshold can be increased in sequence.

[0135] In some embodiments, before step S1, the following steps are also included: detecting the liquid level height in the liquid storage component 210, and issuing a liquid replenishment signal when the liquid level height is less than or equal to the liquid level alarm threshold; detecting the leakage of the liquid cooling pipeline 300, and issuing a leakage signal when leakage occurs in the liquid cooling pipeline 300; controlling each heating element 10 to start when the liquid level height is greater than the liquid level alarm threshold and no leakage occurs in the liquid cooling pipeline 300; the flow of the cooling medium not only depends on the temperature signal, but should also be adjusted based on factors such as the liquid level and heat dissipation performance; the liquid level height in the liquid storage component 210 can be detected. When the liquid level height is less than or equal to the liquid level alarm threshold, the system automatically stops working and reminds manual replenishment of the cooling medium.

[0136] In some embodiments, adjusting the flow rate of the flow pump 220 and the speed of the fan module 700 according to the difference between the temperature of the heating element 10 and the target temperature includes:

[0137] Step S21: obtaining the temperature of the heating element 10 at time t, time t-1, and time t-2;

[0138] Step S22: Calculate the flow signal value of the flow pump 220 at time t based on the temperatures of the heating element 10 at time t, time t-1, and time t-2, the target temperature, and the flow signal value of the flow pump 220 at time t-1; specifically, after calculating the flow signal value of the flow pump 220 at time t, the corresponding flow rate of the flow pump 220 at time t can be obtained according to the flow signal value of the flow pump 220 at time t based on the pre-stored data information, and the flow pump 220 is actually regulated and controlled according to the flow rate of the flow pump 220 at time t; of course, the flow signal value of the flow pump 220 at time t-1 is obtained by obtaining the flow rate of the flow pump 220 at time t-1 and determining the flow signal value of the flow pump 220 at time t-1 based on the pre-stored data information;

[0139] Step S23: Calculate the speed signal value of the fan module 700 at time t based on the temperatures of the heating element 10 at time t, time t-1, and time t-2, the target temperature, and the speed signal value of the fan module 700 at time t-1; specifically, after obtaining the speed signal value of the fan module 700 at time t, the corresponding speed of the fan module 700 at time t can be obtained according to the speed signal value of the fan module 700 at time t based on the pre-stored data information, and the fan module 700 is actually adjusted and controlled according to the speed of the fan module 700 at time t; of course, the speed signal value of the fan module 700 at time t-1 is obtained by obtaining the speed of the fan module 700 at time t-1 and determining the speed signal value of the fan module 700 at time t-1 based on the pre-stored data information.

[0140] In some embodiments, calculating the flow signal value of the flow pump 220 at time t includes:

[0141] Calculating the flow signal value of the flow pump (220) at time t according to formula (1);

[0142]

[0143] And / or, the calculating the rotation speed signal value of the fan module (700) at time t includes:

[0144] Calculating the speed signal value of the fan module (700) at time t according to formula (2);

[0145]

[0146] in:

[0147] : the speed signal value of the fan module (700) at time t, dimensionless;

[0148] : the speed signal value of the fan module (700) at time t-1, dimensionless;

[0149] : the flow signal value of the flow pump (220) at time t, dimensionless;

[0150] : the flow signal value of the flow pump (220) at time t-1, dimensionless;

[0151] : target temperature, dimensionless;

[0152] : The temperature of the heating element (10) at time t, dimensionless;

[0153] : The temperature of the heating element (10) at time t-1, dimensionless;

[0154] : The temperature of the heating element (10) at time t-2, dimensionless;

[0155] 、 、 is a constant.

[0156] By using the above formula (1) and formula (2), the flow rate of the flow pump 220 can be adjusted quickly and accurately, and the speed of the fan module 700 can be adjusted. For example, the initial flow rate of the flow pump 220 is 2.1 L / min; K p= 5, K i = 0.1, K d =0.3, and the temperature of the heating element 10 can be obtained and substituted into formula (1) and formula (2).

[0157] Specifically, in one embodiment, after the electronic device is powered on, the CPLD component of the control system 910 first begins operation and controls the fan module 700 and flow pump 220 to operate at approximately 50% power or load. At this point, the electronic device has not yet entered the operating system. The control system 910 obtains signals from the leakage detection component 930 and the liquid level detection component 940 in real time and performs analysis and judgment. If the control system 910 detects a leakage signal, the electronic device must be manually powered off and the leak must be located for repair. After the repair is complete, the electronic device is restarted and the intelligent control system is tested again. If no leakage is detected, a power-on command is issued to start the operating system. If the intelligent control system 910 detects a signal indicating insufficient liquid level in the liquid storage component 210, the electronic device must be manually powered off and the liquid storage component 210 must be refilled. After refilling is complete, the electronic device is restarted and the intelligent control system is tested. After confirming that there is no leakage and the liquid level meets the requirements, the control system 910 sends a power-on command to start the operating system. At this time, the BMC component of the control system 910 will obtain the temperature signals of each heating element 10, the liquid level signal in the liquid storage component 210, the flow signal of the flow pump 220 and the speed signal of the fan module 700 in real time, and perform adaptive PID control based on the above feedback signals. On the premise of meeting the cooling requirements, the speed of the fan module 700 can be reduced as much as possible and the flow of the flow pump 220 can be appropriately increased, thereby maximizing the reduction of noise, saving energy and ensuring the normal operation of electronic equipment.

[0158] For the description of the features in the embodiment corresponding to the heat dissipation method, reference can be made to the relevant description of the embodiment corresponding to the heat dissipation system, which will not be repeated here.

[0159] An embodiment of the present application further provides an electronic device, comprising a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to execute the steps in any of the above-mentioned heat dissipation method embodiments.

[0160] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored. The computer program is configured to execute the steps of any of the above-mentioned heat dissipation method embodiments when running.

[0161] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk, or an optical disk.

[0162] An embodiment of the present application further provides a computer program product, which includes a computer program. When the computer program is executed by a processor, the steps in any of the above-mentioned heat dissipation method embodiments are implemented.

[0163] An embodiment of the present application further provides another computer program product, including a non-volatile computer-readable storage medium, wherein the non-volatile computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in any of the above-mentioned heat dissipation method embodiments are implemented.

[0164] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the components and steps of each example according to their functions. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0165] The electronic device, heat dissipation method and computer-readable storage medium provided by the present invention are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present invention, the present invention can also be improved and modified in several ways, and these improvements and modifications also fall within the scope of protection of the present invention.

Claims

1. An electronic device, characterized in that: It comprises a chassis (20) and at least one heat dissipation system arranged in the chassis; the heat dissipation system comprises: A cold plate (100), the cold plate (100) comprising a first cold plate (110) and a second cold plate (120), the first cold plate (110) being arranged perpendicular to the main board (30), and the second cold plate (120) being arranged parallel to the main board (30); A liquid storage component (210), a flow pump (220) and a liquid cooling pipeline (300), wherein the liquid storage component (210) is used to store a cooling medium, the liquid storage component (210) and the flow pump (220) are both connected to the liquid cooling pipeline (300), and the flow pump (220) is used to drive the cooling medium to circulate along the liquid cooling pipeline (300); A liquid return manifold assembly (500) is connected to the liquid cooling pipeline (300), the liquid outlet of the first cold plate (110) and the liquid inlet of the liquid return manifold assembly (500) are arranged flush with each other in the extension direction of the main board (30), and the liquid outlet of the liquid return manifold assembly (500) is connected to the liquid inlet (122) of the second cold plate; and the liquid storage component (210) and the liquid inlet (122) of the second cold plate are arranged along the first direction and are respectively arranged on both sides of the main board (30).

2. The electronic device according to claim 1, wherein Also includes: A liquid inlet manifold assembly (400) is connected to the liquid cooling pipeline (300), a liquid outlet of the liquid inlet manifold assembly (400) is connected to the liquid inlet of the first cold plate (110), and a height of the liquid outlet of the liquid inlet manifold assembly (400) is higher than a height of the liquid inlet of the first cold plate (110).

3. The electronic device according to claim 2, wherein: Also includes: A heat exchange component (600) is used to cool the cooling medium, and the heat exchange component (600) is in communication with the liquid return manifold assembly (500); A fan module (700), the fan module (700), the liquid inlet manifold assembly (400), the liquid return manifold assembly (500) and the flow pump (220) are all arranged on a side of the heat exchange component (600) close to the cold plate (100); the fan module (700) and the liquid inlet manifold assembly (400) are arranged in the longitudinal direction, and the fan module (700) and the liquid return manifold assembly (500) are arranged in the transverse direction; the fan module (700) is located between the heat exchange component (600) and the liquid return manifold assembly (500), and the airflow direction of the fan module (700) is toward the heat exchange component (600).

4. The electronic device according to claim 3, wherein: The chassis (20) is provided with a plurality of heat dissipation areas, and the heat dissipation areas correspond to the heat dissipation system one by one; the heat dissipation areas include a cooling area (P1), a confluence area (P2), and a liquid storage area (P3); the cooling area (P1) and the liquid storage area (P3) are arranged along a first direction and are adjacent to each other; the cooling area (P1) and the liquid storage area (P3) are located on the same side of the confluence area (P2) along a second direction, and the first direction is perpendicular to the second direction; Furthermore, the liquid inlet manifold assembly (400), the liquid return manifold assembly (500), the heat exchange component (600) and the fan module (700) are all located in the confluence area (P2), the liquid storage component (210) and the flow pump (220) are located in the liquid storage area (P3), and the first cold plate (110) and the second cold plate (120) are located in the cooling area (P1).

5. The electronic device according to claim 4, characterized in that The heat dissipation area is a square area, and the heat dissipation area also includes a power supply area (P4). The heat dissipation system also includes a power supply compartment (950), and the power supply compartment (950) is located in the power supply area (P4); the power supply area (P4) and the liquid storage area (P3) are arranged along the second direction, and the liquid storage area (P3) is arranged close to the confluence area (P2). The sum of the lengths of the power supply area (P4) and the liquid storage area (P3) along the second direction is the same as the length of the cooling area (P1) along the second direction, and the sum of the widths of the liquid storage area (P3) and the cooling area (P1) along the first direction is the same as the width of the confluence area (P2) along the first direction.

6. The electronic device according to claim 3, wherein: The first cold plate (110) is used to absorb the heat emitted by the first heating element (11), and the second cold plate (120) is used to absorb the heat emitted by the second heating element (12); the liquid outlet of the liquid storage component (210), the flow pump (220) and the liquid inlet of the liquid inlet manifold assembly (400) are connected in sequence, the liquid outlet of the liquid inlet manifold assembly (400) is connected to the liquid inlet of the first cold plate (110), and the liquid outlet of the first cold plate (110) is connected to the liquid inlet of the first cold plate (110). The liquid inlet (121) of the heat exchange component is connected to the liquid inlet (601) of the heat exchange component, and the liquid outlet (602) of the heat exchange component is connected to the liquid inlet of the liquid storage component (210); wherein the power of the second heating element (12) is less than the power of the first heating element (11).

7. The electronic device according to claim 3, wherein: The liquid inlet and the liquid outlet of the first cold plate (110) are arranged along a third direction, the liquid inlet of the liquid inlet manifold assembly (400) and the liquid outlet of the liquid return manifold assembly (500) are arranged along the third direction, and the liquid inlet and the liquid outlet of the first cold plate (110), the liquid inlet of the liquid inlet manifold assembly (400) and the liquid outlet of the liquid return manifold assembly (500) are located in the same plane; the first direction, the second direction and the third direction are perpendicular to each other.

8. The electronic device according to claim 3, wherein: The liquid cooling pipeline (300) includes a liquid cooling main pipe (310) and a plurality of liquid cooling branch pipes (320); the liquid inlet manifold assembly (400) is arranged between the liquid inlet of each of the liquid cooling branch pipes (320) and the liquid cooling main pipe (310); the liquid cooling branch pipes (320) are connected to the first cold plate (110) in a one-to-one correspondence; the liquid storage component (210) and the flow pump (220) are both connected to the liquid cooling main pipe (310); The liquid inlet manifold assembly (400) includes a shell (410) and a flow guide component (420) arranged in the shell (410), the shell (410) is provided with an inlet (411) and a plurality of outlets (412) on its periphery, the shell (410) is provided with a plurality of flow channels (413) inside the shell (410), the liquid cooling main pipe (310) is connected to the inlet (411), and the flow channels (413), the outlets (412) and the liquid cooling branch pipes (320) are connected one by one; the flow guide component (420) is used to divert the cooling medium so that the cooling medium is diverted to each of the flow channels (413).

9. The electronic device according to claim 8, wherein: A flow rate distribution area (A) is provided in the housing (410) between the inlet (411) and the flow channel (413), and the flow guide component (420) is provided in the flow rate distribution area (A); The flow guide component (420) includes an inclined blocking member (421) and a diverter blocking member (422), wherein the inclined blocking member (421) is arranged close to the inlet (411), and the diverter blocking member (422) is arranged close to the flow channel (413), and there are at least two inclined blocking members (421), which are respectively located on both sides of the inlet (411), and the inclined blocking members (421) are inclined from the side close to the inlet (411) to the side close to the flow channel (413) toward the left and right sides of the flow rate distribution area (A); there are multiple diverter blocking members (422), each of which is arranged at intervals, and the extension direction of the diverter blocking members (422) is parallel to the arrangement direction of each of the flow channels (413).

10. The electronic device according to claim 9, characterized in that The liquid inlet manifold assembly (400) further comprises a plurality of guide plates (423), wherein the guide plates (423) are located between adjacent flow channels (413) to separate the flow channels (413), and the guide plates (423) extend from a side close to the inlet (411) to a side away from the inlet (411); a bending portion (423-1) is provided on a side of the guide plate (423) away from the inlet (411); and the bending angle of the bending portion (423-1) of each guide plate (423) decreases successively from a side close to the inlet (411) to a side away from the inlet (411).

11. The electronic device according to claim 3, wherein: The invention also includes a fixed bracket (800), on which the flow pump (220), the liquid inlet manifold assembly (400), the liquid return manifold assembly (500), the heat exchange component (600) and the fan module (700) are all mounted. The heat exchange component (600) and the fixed bracket (800) are spaced apart to form a receiving space for the fan module (700), the flow pump (220) and the liquid inlet manifold assembly (400).

12. The electronic device according to claim 11, wherein: The liquid storage component (210) is located on a side of the fixed bracket (800) facing away from the heat exchange component (600), the flow pump (220) is located on a side of the fixed bracket (800) close to the liquid storage component (210), and the liquid inlet (601) and the liquid outlet of the heat exchange component are both located on a side of the heat exchange component (600) close to the flow pump (220).

13. The electronic device according to any one of claims 3 to 12, characterized in that: Also includes: A temperature detection component (920) for detecting the temperature of the heating element (10); A control system (910) is used to adjust the flow rate of the flow pump (220) and the rotation speed of the fan module (700) according to the difference between the temperature of the heating element (10) and the target temperature.

14. The electronic device according to claim 13, wherein: The system further comprises a liquid leakage detection component (930), the liquid leakage detection component (930) being arranged on the liquid cooling pipeline (300), and the liquid leakage detection component (930) being used to detect whether the liquid cooling pipeline (300) is leaking; the control system (910) is connected to the liquid leakage detection component (930), and the control system (910) is further used to send a liquid leakage signal when the liquid cooling pipeline (300) is leaking; And / or, it further includes a liquid level detection component (940), the liquid level detection component (940) being used to obtain the liquid level value in the liquid storage component (210); the control system (910) is connected to the liquid level detection component (940), and the control system (910) is further used to send a liquid replenishment signal when the liquid level value in the liquid storage component (210) is less than a liquid level alarm threshold.

15. A heat dissipation method, applied to the electronic device according to any one of claims 3 to 14, characterized in that: The following steps are involved: Acquiring the temperature of the heating element (10), and when the temperature of the heating element (10) is less than or equal to the corresponding target temperature, maintaining the flow rate of the flow pump (220) at the target flow rate, and adjusting the rotation speed of the fan module (700) according to the difference between the temperature of the heating element (10) and the target temperature; After the temperature of the heating element (10) is greater than the target temperature and remains at this temperature for a preset time, the flow rate of the flow pump (220) and the rotation speed of the fan module (700) are adjusted according to the difference between the temperature of the heating element (10) and the target temperature.

16. The heat dissipation method according to claim 15, characterized in that: Also includes the steps: When the temperature of any of the heating elements (10) is between the corresponding first temperature alarm threshold and the second temperature alarm threshold, an alarm signal is issued; When the temperature of any of the heating elements (10) is greater than or equal to the corresponding second temperature alarm threshold, controlling each of the heating elements (10) to stop operating; The target temperature corresponding to the same heating element (10) is less than the first temperature alarm threshold and less than the second temperature alarm threshold.

17. The heat dissipation method according to claim 15, wherein: Also includes the steps: detecting the liquid level in the liquid storage component (210), and issuing a liquid replenishment signal when the liquid level is less than or equal to a liquid level alarm threshold; detecting a liquid leakage condition of the liquid cooling pipeline (300), and issuing a liquid leakage signal when a liquid leakage condition occurs in the liquid cooling pipeline (300); When the liquid level height is greater than the liquid level alarm threshold and no liquid leakage occurs in the liquid cooling pipeline (300), each heating element (10) is controlled to start.

18. The heat dissipation method according to claim 15, wherein: The adjusting the flow rate of the flow pump (220) and the rotation speed of the fan module (700) according to the difference between the temperature of the heating element (10) and the target temperature includes: Obtaining the temperature of the heating element (10) at time t, time t-1, and time t-2; Calculating the flow signal value of the flow pump (220) at time t based on the temperatures of the heating element (10) at time t, time t-1, and time t-2, the target temperature, and the flow signal value of the flow pump (220) at time t-1; The speed signal value of the fan module (700) at time t is calculated based on the temperatures of the heating element (10) at time t, time t-1 and time t-2, the target temperature and the speed signal value of the fan module (700) at time t-1.

19. The heat dissipation method according to claim 18, wherein: Calculating the flow signal value of the flow pump (220) at time t includes: Calculating the flow signal value of the flow pump (220) at time t according to formula (1); And / or, the calculating the rotation speed signal value of the fan module (700) at time t includes: Calculating the speed signal value of the fan module (700) at time t according to formula (2); in: : the speed signal value of the fan module (700) at time t; : the speed signal value of the fan module (700) at time t-1; : flow signal value of the flow pump (220) at time t; : the flow signal value of the flow pump (220) at time t-1; : target temperature; : the temperature of the heating element (10) at time t; : the temperature of the heating element (10) at time t-1; : The temperature of the heating element (10) at time t-2; 、 、 is a constant.

20. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, wherein the computer program, when executed by a processor, implements the steps of the heat dissipation method according to any one of claims 15 to 19.

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