Gas laser device and method for manufacturing electronic device

Abstract

This gas laser device is provided with: a chamber device which is provided with a pair of electrodes in an internal space filled with a laser gas, and which emits light, which is generated from the laser gas by applying a voltage to the electrodes, to the outside via a window; an optical shutter disposed outside the chamber device and capable of blocking light; a movement mechanism capable of linearly moving the shutter between an optical path of the light and a first retracted position outside the optical path of the light; and a connection unit that can connect an optical member capable of receiving light to the shutter, and when the optical member is connected to the connection unit, the optical member is positioned on the optical path in a state in which the shutter is positioned at the first retracted position.

Description

Technical Field

[0001] The present disclosure relates to a gas laser device and a method for manufacturing an electronic device. Background Art

[0002] In recent years, semiconductor exposure equipment has been required to achieve higher resolution as semiconductor integrated circuits become increasingly miniaturized and highly integrated. Consequently, there has been a trend toward shorter wavelengths of light emitted from exposure light sources. For example, gas laser devices used for exposure include KrF excimer lasers, which output laser light with a wavelength of approximately 248.0 nm, and ArF excimer lasers, which output laser light with a wavelength of approximately 193.4 nm.

[0003] The spectral line width of the natural oscillation light of the KrF excimer laser device and the ArF excimer laser device is as wide as 350pm to 400pm. Therefore, if the projection lens is composed of a material that transmits ultraviolet rays such as KrF and ArF lasers, chromatic aberration may occur. As a result, the resolution may be reduced. Therefore, it is necessary to narrow the spectral line width of the laser output from the gas laser device to a level where chromatic aberration can be ignored. Therefore, in order to narrow the spectral line width, a narrowing module (Line Narrowing Module: LNM) containing narrowing elements (interferometer, grating, etc.) is sometimes provided in the laser resonator of the gas laser device. Hereinafter, the gas laser device with a narrowed spectral line width is referred to as a narrowed gas laser device.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 8-174260

[0007] Patent Document 2: Japanese Patent No. 4243686

[0008] Patent Document 3: Japanese Patent Application Laid-Open No. 2021-41429 Summary of the Invention

[0009] A gas laser device according to one embodiment of the present invention may also include: a chamber device having a pair of electrodes in an internal space filled with laser gas, which emits light generated from the laser gas by applying voltage to the electrodes to the outside through a window; a light shutter, which is arranged outside the chamber device and can block light; a moving mechanism, which can move the light shutter in a straight line between an optical path of the light and a first retreat position outside the optical path of the light; and a connecting portion, which can connect an optical component capable of receiving light to the light shutter, and when the optical component is connected to the connecting portion, when the light shutter is in the first retreat position, the optical component is located on the optical path.

[0010] A method for manufacturing an electronic device according to one embodiment of the present invention may also be to generate laser light using a gas laser device, output the laser light to an exposure device, and expose the laser light on a photosensitive substrate in the exposure device in order to manufacture the electronic device, wherein the gas laser device is configured as follows: a chamber device having a pair of electrodes in an internal space filled with laser gas, and emitting light generated from the laser gas by applying a voltage to the electrodes to the outside through a window; a light shutter arranged outside the chamber device and capable of blocking light; a moving mechanism capable of moving the light shutter linearly between an optical path of the light and a first retreat position outside the optical path of the light; and a connecting portion that can connect an optical component capable of receiving light to the light shutter, wherein when the optical component is connected to the connecting portion, the optical component is located on the optical path when the light shutter is in the first retreat position. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Hereinafter, several embodiments of the present disclosure will be described as simple examples with reference to the accompanying drawings.

[0012] Figure 1 It is a schematic diagram showing an example of the overall schematic configuration of an electronic device manufacturing apparatus.

[0013] Figure 2 It is a schematic diagram showing an overall schematic configuration example of a gas laser device according to a comparative example.

[0014] Figure 3 Observed from the top Figure 2 Diagram of a gas laser device.

[0015] Figure 4 This is a front view of the shutter unit as viewed from the chamber side.

[0016] Figure 5 So with Figure 2 Figure 2 shows the shutter unit viewed from the same viewpoint.

[0017] Figure 6 It is a diagram showing the open state of the shutter.

[0018] Figure 7 This is a diagram showing the maintenance situation as viewed from the outside of the gas laser device.

[0019] Figure 8 This figure shows, from the top, a state where a power monitor is arranged during maintenance.

[0020] Figure 9 This is a front view of the shutter unit according to the first embodiment as viewed from the chamber side.

[0021] Figure 10 This is an enlarged view of the vicinity of the connection portion.

[0022] Figure 11This is a diagram showing a state where a power meter is connected to an optical shutter.

[0023] Figure 12 This is a diagram showing a situation where a light shutter is located on the optical path of a laser beam during maintenance.

[0024] Figure 13 This diagram shows a case where a power meter is connected.

[0025] Figure 14 This diagram shows a situation where a power meter is located on the optical path.

[0026] Figure 15 This is an enlarged view of the vicinity of the connection portion in a modified example of the first embodiment.

[0027] Figure 16 So with Figure 9 FIG. 1 is a diagram showing the shutter unit in the gas laser device according to the second embodiment as viewed from the same viewpoint. DETAILED DESCRIPTION

[0028] 1. Description of the electronic device manufacturing apparatus used in the exposure process of the electronic device

[0029] 2. Description of Comparative Examples

[0030] 2.1 Structure

[0031] 2.2 Action

[0032] 2.3 Topics

[0033] 3. Description of Implementation Method 1

[0034] 3.1 Structure

[0035] 3.2 Maintenance steps

[0036] 3.3 Function and Effect

[0037] 3.4 Variations

[0038] 4. Description of Implementation Method 2

[0039] 4.1 Structure

[0040] 4.2 Function and Effect

[0041] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The embodiments described below represent several examples of the present disclosure and do not limit the content of the present disclosure. In addition, the structures and actions described in each embodiment are not necessarily required as the structures and actions of the present disclosure. In addition, the same reference numerals are given to the same structural elements, and repeated descriptions are omitted.

[0042] 1. Description of the electronic device manufacturing apparatus used in the exposure process of the electronic device

[0043] Figure 1 Schematic diagram showing an overall schematic configuration example of an electronic device manufacturing apparatus used in an exposure process of an electronic device. Figure 1 As shown, the manufacturing apparatus used in the exposure process includes a gas laser device 100 and an exposure device 200. The exposure device 200 includes a projection optical system 220 and an illumination optical system 210 having a plurality of mirrors 211, 212, and 213. The illumination optical system 210 illuminates the mask pattern on the mask stage RT using the laser light incident from the gas laser device 100. The projection optical system 220 performs a reduced projection of the laser light transmitted through the mask so that it is imaged on a workpiece (not shown) arranged on the work stage WT. The workpiece is a photosensitive substrate such as a semiconductor wafer coated with a photoresist. The exposure device 200 exposes the workpiece to the laser light reflecting the mask pattern by moving the mask stage RT and the work stage WT in parallel in synchronization. By transferring the device pattern to the semiconductor wafer using the above-mentioned exposure process, a semiconductor device as an electronic device can be manufactured.

[0044] 2. Description of Comparative Examples

[0045] 2.1 Structure

[0046] A gas laser device of a comparative example will be described. Note that the comparative examples disclosed herein are known only to the applicant and are not publicly known examples recognized by the applicant.

[0047] Figure 2 1 is a schematic diagram showing an overall schematic configuration example of the gas laser device 100 of this example. Figure 3 Observed from the top Figure 2 FIG1 is a diagram of a gas laser device 100. The gas laser device 100 is, for example, an ArF excimer laser device that uses a mixed gas containing argon (Ar), fluorine (F2), and neon (Ne). The gas laser device 100 outputs laser light LB having a central wavelength of approximately 193.4 nm. In addition, the gas laser device 100 may be a gas laser device other than the ArF excimer laser device, for example, a KrF excimer laser device that uses a mixed gas containing krypton (Kr), F2, and Ne. In this case, the gas laser device 100 emits laser light LB having a central wavelength of approximately 248.0 nm. A mixed gas containing Ar, F2, and Ne as a laser medium, or a mixed gas containing Kr, F2, and Ne as a laser medium is sometimes referred to as a laser gas. In addition, helium (He) may be used instead of Ne in the mixed gases used in the ArF excimer laser device and the KrF excimer laser device, respectively.

[0048] The gas laser device 100 of this example includes a housing 10 , a laser oscillator 20 , a monitor module 70 , a beam performance monitor 80 , a shutter unit 300 , a support member 90 , and a processor 190 as main components.

[0049] The laser oscillator 20 is a device for oscillating the laser light LB, and includes a chamber device 30 , a charger 41 , a pulse power module 43 , a bandwidth narrowing module 60 , and an output coupling mirror 50 as main components.

[0050] exist Figure 2 , the internal structure of the chamber device 30 as viewed from a direction substantially perpendicular to the traveling direction of the laser beam LB is shown. The chamber device 30 includes a chamber 35, a pair of windows 31a, 31b, a pair of electrodes 32a, 32b, an insulating portion 33, a feedthrough 34, and an electrode holder 36 as main components.

[0051] Chamber 35 is a housing filled with laser gas. Laser gas is supplied to the interior of chamber 35 via piping from a laser gas supply device (not shown). The interior of chamber 35 is where light is generated by the excitation of the laser medium in the laser gas. This light travels toward windows 31a and 31b.

[0052] Window 31a is disposed on the front wall of chamber 35 in the direction of travel of laser light LB, and window 31b is disposed on the rear wall of chamber 35 in the direction of travel. Windows 31a and 31b may be tilted to form a Brewster angle with respect to the direction of travel of laser light LB to suppress reflection of P-polarized light of laser light LB.

[0053] Electrodes 32a and 32b are discharge electrodes used to excite the laser medium through glow discharge caused by a high voltage applied between them. Electrodes 32a and 32b are arranged facing each other within chamber 35. In this example, electrode 32a serves as the cathode, and electrode 32b serves as the anode. The lengths of electrodes 32a and 32b are aligned with the direction of travel of laser light LB. The space between electrodes 32a and 32b in chamber 35 is sandwiched between windows 31a and 31b.

[0054] Electrode 32a is supported by an insulating portion 33 composed of an insulator. Insulating portion 33 blocks the opening formed in chamber 35. Furthermore, a feedthrough 34 composed of a conductive member is disposed on insulating portion 33. Feedthrough 34 applies the voltage supplied from pulse power module 43 to electrode 32a. Electrode 32b is supported by and electrically connected to electrode holder 36. Electrode holder 36 is electrically connected to chamber 35 via wiring (not shown), and chamber 35 is electrically connected to ground. Therefore, electrode 32b is electrically connected to ground.

[0055] The charger 41 is a DC power supply device that charges a capacitor (not shown) located inside the pulse power module 43 at a specified voltage. The charger 41 is located outside the chamber 35 and is connected to the pulse power module 43. The pulse power module 43 includes a switch (not shown) controlled by the processor 190. The pulse power module 43 is a voltage application circuit that, when the switch is switched from off to on, boosts the voltage applied from the charger 41 to generate a pulsed high voltage, which is then applied to the electrode 32a. When the high voltage is applied to the electrode 32a, the aforementioned glow discharge occurs between the electrodes 32a and 32b, exciting the laser medium. Light generated by the excitation of the laser medium is emitted from the windows 31a and 31b to the outside of the chamber 35.

[0056] The narrowband module 60 mainly includes a housing 65, prisms 61 and 62, and a grating 63. The prisms 61 and 62 and the grating 63 are disposed within the interior of the housing 65. An opening is formed in the housing 65 at a position opposite the window 31b. Light emitted from the window 31b of the chamber 35 propagates into the housing 65 through this opening.

[0057] The prisms 61 and 62 expand the beam width of the light emitted from the window 31b and make the light incident on the grating 63. In addition, the prisms 61 and 62 return the reflected light from the grating 63 to the internal space of the chamber 35 via the window 31b. At least one of the prisms 61 and 62 is supported on a rotating table not shown in the figure and rotates by the rotation of the rotating table. The rotation of the prisms 61 and 62 changes the incident angle of the light relative to the grating 63. Therefore, by rotating the prisms 61 and 62, the wavelength of the light returned from the grating 63 via the prisms 61 and 62 to the chamber 35 can be selected. Figure 2 In FIG. 5 , an example is shown in which two prisms 61 are arranged, but one prism may be arranged, or three or more prisms may be arranged. In this example, the prism 61 is arranged on the cavity 35 side, and the prism 62 is arranged on the grating side.

[0058] The surface of grating 63 is made of a high-reflectivity material and has multiple grooves arranged at predetermined intervals. Grating 63 is a dispersive optical element. The cross-sectional shape of each groove is, for example, a right triangle. Light incident on grating 63 from prism 62 is reflected by these grooves and diffracted in a direction corresponding to the wavelength of the light. Grating 63 is configured in a Littrow configuration so that the angle of incidence of light incident on grating 63 from prism 61 matches the diffraction angle of diffracted light of the desired wavelength. As a result, light of the desired wavelength is returned to chamber 35 via prisms 61 and 62.

[0059] The output coupling mirror 50 faces the window 31a, transmits part of the laser light LB emitted from the window 31a, and reflects the other part to return to the interior of the chamber 35 via the window 31a. The output coupling mirror 50 is disposed in the interior of the housing 10.

[0060] The grating 63 and the output coupling mirror 50 provided with the cavity 35 interposed therebetween constitute a Fabry-Perot type resonator, and the cavity 35 is arranged on the optical path of the resonator.

[0061] Monitor module 70 is positioned on the optical path of laser light LB transmitted through output coupling mirror 50. Monitor module 70 includes a beam splitter (not shown) and a light sensor such as a photodiode. The beam splitter transmits laser light LB transmitted through output coupling mirror 50 with high transmittance and reflects a portion of laser light LB toward the light sensor. The light sensor measures the pulse energy of the incident laser light LB. The light sensor is electrically connected to processor 190 and outputs a signal representing the measured pulse energy to processor 190. Based on this signal, processor 190 controls the voltage applied to electrodes 32a and 32b.

[0062] A beam performance monitor 80 is located on the optical path of the monitor module 70 on the side opposite the output coupling mirror 50. The beam performance monitor 80 includes at least one optical measuring device (not shown), such as a beam splitter, a beam profiler, a directivity meter, and a polarization meter. The beam splitter of the beam performance monitor 80 transmits the laser light LB transmitted through the monitor module 70 beam splitter with high transmittance and reflects a portion of the laser light LB toward the optical measuring device. The optical measuring device measures the characteristics of the incident laser light LB and outputs a signal related to the characteristics. This signal is transmitted to, for example, an external monitor, which displays information related to the laser light LB.

[0063] A shutter unit 300 is provided in the optical path on the side of the beam performance monitor 80 opposite the monitor module 70. The shutter unit 300 is supported by the housing 10. Laser light LB transmitted through the beam splitter of the beam performance monitor 80 enters the shutter unit 300. The shutter unit 300 is electrically connected to the processor 190 and is controlled by the processor 190 to switch between a closed state, which blocks the laser light LB, and an open state, which transmits the laser light LB. Details of the shutter unit 300 will be described later.

[0064] An exit window 11 is provided on the optical path of the laser light LB in the housing 10 at a position overlapping the shutter unit 300. The light passing through the shutter unit 300 is emitted from the exit window 11 to the outside of the housing 10. The laser light LB is, for example, a pulsed laser with a central wavelength of 193.4 nm.

[0065] The support member 90 includes a bottom plate member 91, a chamber support portion 92, a narrowing module support portion 93, an output coupling mirror support portion 94, and an optical plate support portion 95. The bottom plate member 91 fixes one end and the other end of the housing 10 along the direction of travel of the laser light LB. The chamber support portion 92, the narrowing module support portion 93, the output coupling mirror support portion 94, and the optical plate support portion 95 are arranged on the bottom plate member 91. The chamber support portion 92 supports the chamber 35. The narrowing module support portion 93 supports the narrowing module 60. An opening indicated by a dotted line is provided at a position of the narrowing module support portion 93 opposite to the window 31b, allowing light emitted from the window 31b to pass through. The output coupling mirror support portion 94 supports the output coupling mirror 50. An opening indicated by a dotted line is provided at a position of the output coupling mirror support portion 94 opposite to the window 31a, allowing light emitted from the window 31a to pass through. The optical plate support portion 95 supports the optical plate 96. The optical plate 96 is a plate-shaped member, and the monitor module 70 and the beam performance monitor 80 are arranged on the optical plate 96 .

[0066] The processor 190 of the present disclosure is a processing device comprising a storage device that stores a control program and a CPU (Central Processing Unit) that executes the control program. Processor 190 is specifically configured or programmed to perform the various processes included in the present disclosure and controls the entire gas laser apparatus 100. Furthermore, processor 190 is electrically connected to an exposure processor (not shown) of exposure apparatus 200 and transmits and receives various signals to and from the exposure processor.

[0067] Next, the shutter unit 300 will be described.

[0068] Figure 4 is a front view of the shutter unit 300 as viewed from the chamber 35 side. Figure 5 So with Figure 2 The shutter unit 300 is viewed from the same viewpoint. The shutter unit 300 includes a shutter 310, a cylinder 320, a guide 330, and a collector 340 as main structures.

[0069] The shutter 310 is a component that can block the laser light LB that passes through the light beam display monitor 80. The shutter 310 includes a shutter body 311 and a mirror 312 as main structures. The shutter body 311 is a frame-shaped component that holds the mirror 312. In addition, a plate-shaped extension portion 313 extending downward is connected to the shutter body 311. The mirror 312 is a component that fully reflects the incident laser light LB. The reflecting surface of the mirror 312 is tilted 45 degrees upward, as shown in FIG. Figure 5 As shown, laser light LB is reflected upward when incident on mirror 312 from beam performance monitor 80. Collector 340 is provided above exit window 11 and absorbs laser light LB reflected upward by mirror 312 and converts it into heat.

[0070] The guide member 330 is composed of a pair of linear rails 331 whose lengthwise directions extend horizontally, and each rail 331 is fixed to the housing 10. A sliding member (not shown) provided on the shutter body 311 is movably engaged with each rail 331. Therefore, the shutter 310 can move linearly along the rails 331. In this embodiment, the rails 331 are provided at a position where they sandwich the exit window 11 when viewed from the front.

[0071] The cylinder 320 includes a driving portion 321 and a rod 322 as its main structure. The driving portion 321 is electrically connected to the processor 190. One side of the rod 322 is inserted into the driving portion 321. The driving portion 321 adjusts the internal air pressure under the control of the processor 190, thereby enabling the rod 322 to move along its length. The cylinder 320 is fixed to the housing 10 in such a manner that the length of the rod 322 is along the length of the track 331 of the guide member 330. A connecting portion 323 is provided at the end of the other side of the rod 322, and the connecting portion 323 is fixed to the extension portion 313 of the light shutter 310. Therefore, by moving the rod 322, the light shutter 310 moves along the length of the track 331.

[0072] Figure 4 1 is a diagram showing a closed state in which the shutter 310 blocks the exit window 11 and shields the laser light LB. In this state, the shutter 310 is located on the optical path of the laser light LB. Figure 4 In FIG, the dotted line indicates the laser beam LB irradiated on the shutter 310. The position of the shutter 310 at this time is set to the shielding position MP indicated by the dotted line. Figure 6 The figure shows the open state of shutter 310, which does not block exit window 11. In this state, shutter 310 is located outside the optical path of laser light LB. If this location outside the optical path is designated as a first retracted position EP1, as indicated by the dotted line, then cylinder 320 is a moving mechanism capable of linearly moving shutter 310 between the shielding position MP and the first retracted position EP1, which is outside the optical path of laser light LB.

[0073] 2.2 Action

[0074] Next, the operation of the gas laser device 100 according to the comparative example will be described.

[0075] Before the gas laser device 100 emits laser light LB, laser gas is supplied from a laser gas supply device (not shown) to the interior space of the chamber 35. At this time, the processor 190 may control the shutter unit 300 so that the shutter 310 is located at the shielding position MP.

[0076] When the gas laser device 100 emits laser light LB, the processor 190 receives a signal indicating target energy Et and a light emission trigger signal from an exposure processor (not shown) of the exposure device 200. At this time, the processor 190 controls the shutter unit 300 so that the shutter 310 is located at the first retreat position EP1. The target energy Et is the target value of the energy E of the laser light LB used in the exposure process. The processor 190 sets a predetermined charging voltage for the charger 41 so that the energy E of the laser light LB reaches the target energy Et, and turns on the switch of the pulse power module 43 in synchronization with the light emission trigger signal. As a result, the pulse power module 43 generates a pulsed high voltage based on the electrical energy maintained in the charger 41, and applies the high voltage between the electrode 32a and the electrode 32b. When the high voltage is applied, a glow discharge is generated between the electrode 32a and the electrode 32b, and the laser medium contained in the laser gas between the electrode 32a and the electrode 32b becomes excited, and emits light when the laser medium returns to the ground state. The emitted light resonates between the grating 63 and the output coupling mirror 50, and is amplified each time it passes through the discharge space within the interior of the chamber 35, causing laser oscillation. A portion of the laser light LB passes through the output coupling mirror 50. Most of the laser light LB that has passed through the output coupling mirror 50 passes through the monitor module 70 and the beam performance monitor 80 and enters the shutter unit 300. When the shutter 310 is in the first retracted position EP1, the laser light LB that has entered the shutter unit 300 passes through the exit window 11 and exits the gas laser device 100. The laser light LB emitted from the gas laser device 100 enters the exposure device 200.

[0077] At this time, as described above, monitor module 70 measures energy E of laser light LB and outputs a signal indicating the measured energy E of laser light LB to processor 190. Based on this signal, processor 190 performs feedback control on the charging voltage of charger 41 so that the difference ΔE between energy E and target energy Et falls within an acceptable range.

[0078] 2.3 Topics

[0079] Maintenance such as adjustment or replacement of the monitor module 70 may be performed. Figure 7This is a diagram showing the maintenance situation as viewed from the outside of the gas laser device 100. When maintaining the monitor module 70, the maintenance panel 12 in the housing 10 of the gas laser device 100 is removed. As a result, the maintenance opening 13 appears. The monitor module 70 is maintained from this maintenance opening 13. When maintaining the monitor module 70, the measurement value of the monitor module 70 is sometimes corrected. In this case, the correction is performed based on the power of the light passing through the monitor module 70. Therefore, it is necessary to configure a power meter for measuring the power of the laser LB on the optical path of the laser LB passing through the monitor module 70. However, a beam performance monitor 80 is configured on the downstream side of the laser LB of the monitor module 70, so it is difficult to configure a power meter. Therefore, as Figure 8 As shown, the beam performance monitor 80 is removed, and the power meter 400 is arranged at the position where the beam performance monitor 80 was arranged.

[0080] However, removing the beam performance monitor 80 during maintenance of the monitor module 70 requires time. Furthermore, when reinstalling the beam performance monitor 80 after maintenance of the monitor module 70, fine-tuning the position of the beam performance monitor 80 may require time. This downtime for maintenance may reduce the operating efficiency of the gas laser device 100. Furthermore, even if the beam performance monitor 80 is removed to install optical components other than the power meter 400 for receiving the laser beam LB, the operating efficiency of the gas laser device 100 may still be reduced.

[0081] Therefore, in the following embodiment, a gas laser device is exemplified in which an optical component for receiving laser light LB can be arranged with reduced downtime.

[0082] 3. Description of Implementation Method 1

[0083] Next, the gas laser device 100 according to Embodiment 1 will be described. The same components as those described above are denoted by the same reference numerals, and duplicate descriptions will be omitted unless otherwise specified. In some drawings, some components are omitted or simplified for easier viewing.

[0084] 3.1 Structure

[0085] Figure 9 This is a front view of the shutter unit 300 of this embodiment as viewed from the chamber 35 side. The main difference between the gas laser device 100 of this embodiment and the gas laser device 100 of the comparative example is that the shutter unit 300 includes a connecting portion 350. Figure 9 , the shutter 310 is shown to be located at the shielding position MP.

[0086] The connecting portion 350 is a component that connects the power meter 400 to the optical shutter 310. The power meter 400 is an optical component that receives the laser light LB and is a light measuring device that can measure the power of the received laser light LB. In this embodiment, the connecting portion 350 is provided on the extension portion 313 of the optical shutter 310. When connected to the optical shutter 310 via the connecting portion 350, the power meter 400 moves together with the optical shutter 310.

[0087] In this embodiment, the shutter unit 300 includes an optical component support portion 360 fixed to the housing 10. The optical component support portion 360 is a member that supports the power meter 400. The optical component support portion 360 may be in a plate shape.

[0088] The power meter 400 mainly comprises a light receiving portion 410 for receiving laser light LB, an arm portion 420, and a ball wheel 430. When the light receiving portion 410 receives laser light LB, the power meter 400 outputs a signal related to the power of the laser light LB. The ball wheel 430 rolls on the optical component support portion 360. This reduces frictional resistance during movement of the power meter 400. A groove for the ball wheel 430 to roll may also be provided in the optical component support portion 360. The arm portion 420 extends horizontally from below the power meter 400, and its distal end is connected to the connecting portion 350.

[0089] Figure 10 It is an enlarged view of the vicinity of the connecting portion 350. Figure 10 As shown, a protrusion 421 protruding upward is provided at the end of the arm portion 420. In the present embodiment, the protrusion 421 is roughly spherical in shape. The connecting portion 350 includes a hook member 351 and a base portion 353 as main structures. The hook member 351 is fixed to the shaft member 352 in a rotatable manner. In addition, an inclined portion 351S is provided at the end of the hook member 351 on the side opposite to the shaft member 352, and a recess 351D is formed between the shaft member 352 and the inclined portion 351S of the hook member 351. The hook member 351 is urged by a spring not shown in the figure so that the inclined portion 351S faces downward when no particular force is applied to the hook member 351. The base portion 353 is a member that extends horizontally at a predetermined interval from the hook member 351 below the hook member 351 to a position overlapping with the inclined portion 351S. As shown Figure 10 As shown, in a state where the power meter 400 is connected to the shutter 310 via the connecting portion 350 , the base portion 353 supports the lower surface of the arm portion 420 , and the protrusion 421 enters the recess 351D.

[0090] Figure 11 FIG. 4 is a diagram showing a state where the power meter 400 is connected to the optical shutter 310. Figure 11As shown, when the power meter 400 is connected to the optical shutter 310, the power meter 400 is pressed toward the connecting portion 350. By this pressing, the protrusion 421 slides on the inclined portion 351S of the hook part 351, the hook part 351 rotates around the shaft part 352, and the end of the hook part 351 is lifted. At this time, as described above, the protrusion 421 has a roughly spherical shape, so the protrusion 421 is easier to slide on the inclined portion 351S than when the protrusion 421 is columnar. In addition, at this time, since the base part 353 supports the arm part 420, the arm part 420 is suppressed from descending, and the protrusion 421 appropriately pushes the hook part 351 upward. When the power meter 400 is further pressed toward the connecting portion 350, the protrusion 421 enters the recess 351D, and the hook part 351 returns to its original position, as shown in FIG. Figure 10 As shown, the power meter 400 is coupled to the optical shutter 310 .

[0091] 3.2 Maintenance steps

[0092] Next, the maintenance steps are explained. Figure 7 As shown, the maintenance panel 12 is removed to expose the maintenance opening 13. In this state, the laser oscillator 20 generally stops emitting the laser beam LB. Figure 12 As shown, the processor 190 controls the cylinder 320 of the shutter unit 300 so that the shutter 310 is located at the shielding position MP. In this state, the connection portion 350 can be attached and detached to the power meter 400. Therefore, through the maintenance opening 13, as shown in FIG. Figure 11 As described above, the protrusion 421 is hooked on the hook member 351 of the connecting portion 350, as shown in FIG. Figure 13 As shown, the power meter 400 is connected to the shutter 310. Figure 14 As shown, the processor 190 controls the cylinder 320 to move the shutter 310 to the first retreat position EP1. At this time, the power meter 400 connected to the shutter 310 via the connecting portion 350 moves together with the shutter 310 to the shielding position MP located on the optical path of the laser LB. Figure 14 In FIG, the irradiation position of the laser LB is indicated by a dotted line.

[0093] With the power meter 400 in the shielding position MP, the processor 190 emits laser light LB from the laser oscillator 20. Most of this laser light LB passes through the beam splitters of the monitor module 70 and the beam performance monitor 80 and is received by the light receiving unit 410 of the power meter 400. When the light receiving unit 410 receives the laser light LB, the power meter 400 outputs a signal containing data related to the power of the received laser light LB. At this time, the monitor module 70 also measures the power of the portion of the laser light LB reflected by the internal beam splitter and outputs a signal containing this measurement result. Therefore, the monitor module 70 can be calibrated based on the signals from the power meter 400 and the monitor module 70.

[0094] After the maintenance is completed, the processor 190 controls the cylinder 320 of the shutter unit 300 to make the shutter 310 be located at the shielding position MP again. Figure 13 In this state, remove the power meter 400 and become Figure 12 After that, the maintenance panel 12 is installed to complete the maintenance.

[0095] 3.3 Function and Effect

[0096] The gas laser device 100 of this embodiment includes a connecting portion 350 that allows the power meter 400 to be connected to the shutter 310. When the power meter 400 is connected to the connecting portion 350 and the shutter 310 is in the first retracted position EP1, the power meter 400 is located in the optical path of the laser light LB. Therefore, the power meter 400 can receive the laser light LB and measure its power without removing the beam performance monitor 80, thus facilitating maintenance. Therefore, maintenance of the monitor module 70 does not require the time to remove the beam performance monitor 80, nor does it require the time to reinstall the beam performance monitor 80 after maintenance. Therefore, according to the gas laser device 100 of this embodiment, it is possible to reduce downtime while installing the power meter 400 to receive the laser light LB and measure the laser light LB.

[0097] Furthermore, the coupling portion 350 allows the power meter 400 to be attached and detached while the shutter 310 is positioned on the optical path. This configuration allows the power meter 400 to be attached and detached even if the shutter 310 is not moved to a position other than the shielding position MP and the first retracted position EP1. Consequently, the processor 190 can simplify control of the air cylinder 320 compared to a case where the shutter 310 is moved to a position other than the shielding position MP and the first retracted position EP1 during attachment and detachment of the power meter 400.

[0098] 3.4 Variations

[0099] Next, a modification of this embodiment will be described. Figure 15 This is an enlarged view of the vicinity of the connecting portion 350 in this modification. Figure 15 As shown, the gas laser device 100 of this modification example mainly differs from the gas laser device 100 of the above embodiment in that the connecting portion 350 does not include the base portion 353 .

[0100] In this embodiment, the gap between the optical component support portion 360 and the arm portion 420 is substantially zero. Therefore, in this variation, the ball wheel 430 is almost entirely hidden within the main body of the power meter 400. Therefore, even without the base portion 353, the optical component support portion 360 can still support the arm portion 420.

[0101] According to this modification, since the connection portion 350 does not include the base portion 353 , the structure can be simplified compared to the gas laser device 100 according to the first embodiment.

[0102] 4. Description of Implementation Method 2

[0103] Next, a gas laser device 100 according to Embodiment 2 will be described. The same reference numerals are used for components identical to those described above, and duplicate descriptions will be omitted unless otherwise specified. In the drawings, some components are omitted or simplified for easier viewing.

[0104] 4.1 Structure

[0105] Figure 16 So with Figure 9 The shutter unit 300 in the gas laser device 100 of this embodiment is viewed from the same viewpoint. Figure 16 As shown, the gas laser device 100 of this embodiment differs primarily from the gas laser device 100 of Embodiment 1 in that the rails 331 of the guide 330 and the optical component support portion 360 extend longer toward the side opposite to the first retracted position EP1 relative to the optical path, compared to the rails 331 and optical component support portion 360 of Embodiment 1. In this embodiment, the air cylinder 320 can move the shutter 310 to a second retracted position EP2, opposite to the first retracted position EP1 relative to the optical path. Therefore, in this embodiment, the movable range of the rod 322 of the air cylinder 320 is greater than that of the rod 322 of the first embodiment.

[0106] In the present embodiment, during maintenance, the power meter 400 can be attached or detached while the shutter 310 is located at the second retracted position EP2.

[0107] 4.2 Function and Effect

[0108] According to the gas laser device 100 of this embodiment, compared with the first embodiment, the power meter 400 can be attached and detached while the shutter 310 is away from the optical path, so the power meter 400 can be attached and detached easily.

[0109] The present invention has been described above based on Embodiment 1, its variations, and Embodiment 2, but the present invention is not limited thereto. For example, the power meter 400 has been used as an example of a light measuring device connected to the shutter 310 via the connection portion 350. However, the light measuring device is not limited to a power meter; any other light measuring device may be used as long as it can measure the laser light LB. Another example of such a light measuring device is a dual-plane system that measures the pulse width of the laser light LB. Furthermore, the optical component connected to the shutter 310 via the connection portion 350 is not limited to a light measuring device as long as it can receive the laser light LB. An example of such an optical component is an optical fiber component equipped with an optical fiber. This optical fiber is connected to, for example, a spectrometer located outside the gas laser device 100 that measures the spectrum of the laser light LB. Furthermore, the optical fiber component may be equipped with a focusing device that reduces the diameter of the laser light LB and propagates the laser light LB toward the core of the optical fiber.

[0110] In addition, although the example in which the connection portion 350 includes the hook member 351 for hooking the protrusion 421 provided on the optical measuring device such as the power meter 400 has been described, the connection portion 350 is not limited to this example. For example, the connection portion 350 may be a screw that is screwed into a threaded hole provided on the optical measuring device.

[0111] Furthermore, while the example in which the connecting portion 350 is provided on the shutter 310 has been described, the connecting portion 350 need not be provided on the shutter 310 as long as it can connect an optical component such as a light measuring device, such as the power meter 400, to the shutter 310. For example, the connecting portion 350 may be provided on the rod 322 or the connecting portion 323 of the cylinder 320. In this case, the light measuring device is also connected to the shutter 310 via the rod 322 and the connecting portion 323.

[0112] The above description is not limiting but simply illustrative. Therefore, it is obvious to those skilled in the art that the embodiments of the present disclosure can be changed without departing from the scope of the claims. In addition, it is also obvious to those skilled in the art that the embodiments of the present disclosure can be used in combination. Unless otherwise specified, the terms used in this specification and claims should be interpreted as "non-restrictive" terms. For example, terms such as "including", "having", "equipped", etc. should be interpreted as "not excluding the presence of structural elements other than the structural elements described". In addition, the modifier "one" should be interpreted as meaning "at least one" or "one or more". In addition, the term "at least one of A, B and C" should be interpreted as "A", "B", "C", "A+B", "A+C", "B+C" or "A+B+C", and should be interpreted as also including combinations of them with structures other than "A", "B", "C".

Claims

1. A gas laser device comprising: A chamber device having a pair of electrodes in an internal space filled with laser gas, and emitting light generated from the laser gas by applying a voltage to the electrodes to the outside through a window; a light shutter, which is arranged outside the chamber device and can block the light; a moving mechanism capable of linearly moving the shutter between an optical path of the light and a first retracted position outside the optical path of the light; as well as a connecting portion that can connect an optical component capable of receiving the light to the optical shutter, When the optical component is connected to the connecting portion, the optical component is located on the optical path when the shutter is located at the first retracted position.

2. The gas laser device according to claim 1, wherein The connecting portion is capable of attaching and detaching the optical component in a state where the shutter is located on the optical path.

3. The gas laser device according to claim 1, wherein The optical component is a light measuring device capable of measuring received light.

4. The gas laser device according to claim 3, wherein The light measuring device is a power meter that measures the power of the light.

5. The gas laser device according to claim 1, wherein The connecting portion includes a hook member that hooks a protrusion provided on the optical member.

6. The gas laser device according to claim 1, wherein The moving mechanism can further move the shutter to a second retracted position on the opposite side of the first retracted position with respect to the optical path.

7. The gas laser device according to claim 6, wherein: The connecting portion is capable of attaching and detaching the optical component when the shutter is located at the second retracted position.

8. A method for manufacturing an electronic device, wherein the method comprises generating laser light by using a gas laser device. Outputting the laser to an exposure device, and exposing the laser light on a photosensitive substrate in the exposure device for manufacturing an electronic device, wherein, The gas laser device is composed of: The gas laser device comprises: A chamber device having a pair of electrodes in an internal space filled with laser gas, and emitting light generated from the laser gas by applying a voltage to the electrodes to the outside through a window; a light shutter, which is arranged outside the chamber device and can block the light; a moving mechanism capable of linearly moving the shutter between an optical path of the light and a first retracted position outside the optical path of the light; as well as a connecting portion that can connect an optical component capable of receiving the light to the optical shutter, When the optical component is connected to the connecting portion, the optical component is located on the optical path when the shutter is located at the first retracted position.

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