Optical-mechanical splicing modularization device for photocuring ceramic forming

Abstract

The invention discloses an optical-mechanical splicing modular device for photocuring ceramic molding, which specifically comprises a main body substrate and a protective cover arranged on the main body substrate, a plurality of groups of light source assembly modules are fixedly mounted in the main body substrate, a plurality of light source assemblies are mounted and arranged according to molding breadth requirements and are mounted on the same high-precision substrate, and the light source assemblies are mounted on the same high-precision substrate. The position of each independent light source assembly can be finely adjusted, so that errors caused by processing of the light machine assembly mounting plate are made up, an integrated light source optical unit is formed, the connection space and signal transmission paths among the assemblies are greatly reduced, the integration level and the working efficiency of the light machine are improved, and moreover, the light machine assembly mounting plate is convenient to mount and dismount. When a certain light source assembly breaks down, only the fault assembly needs to be disassembled for maintenance or replacement, the whole light machine does not need to be processed, the maintenance cost is greatly reduced, the maintenance time is greatly shortened, and the production efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of light-curing ceramic molding equipment, and is aimed at the in-depth optimization design of optical machines in terms of integration, structural stability and heat dissipation performance. In particular, it relates to a light-machine splicing modular device for light-curing ceramic molding. Background Art

[0002] Photocuring ceramic molding technology is an advanced manufacturing technique that uses a photoinitiator to absorb light of a specific wavelength, triggering a polymerization reaction in the resin system, thereby achieving layer-by-layer solidification of the ceramic slurry. Due to its advantages such as high precision and the ability to form complex structures, it has been widely used in a wide range of fields, including aerospace, electronics, and medicine. In this technology, the optical engine, as a core component, plays a key role in providing precise light to trigger the polymerization and curing of the photosensitive resin in the ceramic slurry.

[0003] However, there are many problems with the current optical machines used for photocuring ceramic molding. On the one hand, most of the existing optical machines are of integral structure and fixed size. For the molding of large ceramic products, due to the large illumination area required, a single integral optical machine is difficult to meet the requirements. If a large optical machine is to be manufactured, not only will there be huge challenges in optical system design and light source integration, which will greatly increase the difficulty of manufacturing, but it will also be costly, including the procurement costs of core components such as high-precision optical lenses and high-power light sources, as well as the production costs brought about by complex manufacturing processes. Moreover, once a component of the integral optical machine fails, such as aging of the light source, damage to the optical lens, or failure of the control system, the entire optical machine will need to be repaired or replaced. Not only is the repair cost high, as it may involve the replacement of multiple expensive components, but the repair time is also long, requiring professional technicians to conduct a comprehensive inspection and repair of the complex overall structure, which seriously affects the production schedule and increases the company's downtime losses.

[0004] On the other hand, if traditional optical machines are spliced, the structural stability of the simply spliced ​​optical machine is poor, and the splicing points are prone to loosening, causing light offset, resulting in reduced molding accuracy and poor surface quality of ceramic products; in terms of heat dissipation, when the optical machine is working, the light source components will generate a lot of heat, which will cause a lot of heat accumulation after splicing. Traditional heat dissipation methods have poor heat dissipation effects. The heat accumulation reduces the luminous efficiency of the light source and deforms the optical lens, greatly shortening the service life of the optical machine, increasing equipment maintenance costs, and also affecting the accuracy and quality of ceramic molding.

[0005] Furthermore, with the continuous development of light-curing ceramic molding technology, molding tasks involving different materials and varying precision requirements require optical machines with diverse capabilities. However, the relatively limited functionality of integrated optical machines makes it difficult to flexibly adjust and expand them based on actual needs, limiting their use in more complex application scenarios.

[0006] Therefore, there is an urgent need for a modular structure for light-machine splicing for light-curing ceramic molding that is optimized and improved in terms of integration, structure and heat dissipation. Summary of the Invention

[0007] The purpose of the present invention is to provide a modular optical machine splicing device for photocuring ceramic molding, so as to overcome the problems of the existing integrated optical machine in the art, such as the difficulty in meeting large-scale molding requirements, high maintenance costs and single functions. The present invention realizes flexible splicing of optical machines through innovative integrated design, enhanced structural stability, and optimized heat dissipation system, thereby improving the quality and efficiency of photocuring ceramic molding, extending the service life of the optical machine, and enhancing the reliability and durability of the equipment.

[0008] To achieve the above object, the technical solution adopted by the present invention is as follows: A modular optical-mechanical splicing device for photocurable ceramic molding includes a main substrate and a protective cover arranged on the main substrate. Multiple groups of light source component modules are fixedly installed in the main substrate. The light source component modules are provided with heat pipe radiators for heat dissipation. The heat pipe heat dissipation connection of the multiple light source component modules is connected to a water cooling head. A cooling fan is provided on the protective cover. A control circuit for controlling the light source component modules, the heat pipe radiator and the cooling fan is integrated in the main substrate.

[0009] Preferably, a fin-type condenser is provided at the lower end of the heat dissipation fan in the protective cover, and the fin-type condenser is connected to the water-cooling head.

[0010] Preferably, the light source assembly module adopts a three-dimensional integrated structure, and the light source assembly module includes a light source assembly and a lens, and the driving circuit of the light source assembly module is integrated into the control circuit board.

[0011] Preferably, the light source assembly module is fixedly mounted on the main substrate by screws or bolts.

[0012] Preferably, it also includes an integrated power management circuit, a light source driving circuit and a communication control circuit.

[0013] Preferably, the main substrate is made of a high-strength aluminum alloy plate, and the surface of the main substrate is anodized.

[0014] Preferably, the bottom of the main substrate is processed with mounting holes and adjustment holes for fixing and adjusting each light source assembly module.

[0015] Preferably, the protective cover is made of a bent aluminum alloy plate, vent holes are provided on the protective cover, and the protective cover is connected to the main base plate by high-strength screws.

[0016] Preferably, a sealing strip is filled between the protective cover and the main substrate.

[0017] Preferably, thermal grease is applied between the heat pipe radiator and the water cooling head for heat exchange with the heat pipe radiator.

[0018] Compared with the prior art, the present invention has the following beneficial technical effects: The present invention provides an optical-mechanical splicing modular device for photocuring ceramic molding, specifically including a main substrate and a protective cover arranged on the main substrate, wherein multiple groups of light source component modules are fixedly installed in the main substrate, and a heat pipe radiator for heat dissipation is provided on the light source component module, and the heat pipe radiator connected to the multiple light source component modules is connected to a water cooling head, and a cooling fan is provided on the protective cover, and the cooling fan is used to dissipate heat from the circulating coolant in the water cooling head, and the main substrate is integrated with a control circuit for controlling the light source component module, the heat pipe radiator and the cooling fan. The present application adopts multiple groups of light source component modules arranged in a module, and cools the condenser by active air cooling. All liquid-cooled heat dissipation elements are filled with coolant, and the coolant is driven by a micro water pump to realize internal circulation. During operation, the heat pipe radiator first absorbs the heat generated by the light source component and conducts it to the water cooling head. The coolant inside the water cooling head absorbs the heat and circulates to the fin-type condenser driven by the water pump. The condenser is cooled by the fan and the heat is removed from the module.

[0019] Preferably, multiple light source components are installed and arranged according to the molding format requirements and installed on the same high-precision substrate, and the position of each individual light source component can be fine-tuned to compensate for the errors caused by the processing of the optical machine component mounting plate, forming an integrated light source optical unit, which greatly reduces the connection space and signal transmission path between the components, improves the integration and working efficiency of the optical machine, and when a light source component fails, only the faulty component needs to be disassembled for repair or replacement, without the need to process the entire optical machine, which greatly reduces the maintenance cost and time and improves production efficiency.

[0020] Preferably, sealing strips are filled in all the connection gaps between the protective cover and the main substrate to effectively prevent the entry of external dust and moisture, protect the electronic components, and further improve the reliability and service life of the shutdown module. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 Schematic diagram of the structure of a modular optical-mechanical splicing device for photocuring ceramic molding in an embodiment of the present invention.

[0022] In the figure, 1. Main substrate; 2. Light source component module; 3. Heat pipe radiator; 4. Water cooling head; 5. Fin-type condenser; 6. Cooling fan; 7. Protective cover; 8. Control circuit board. DETAILED DESCRIPTION

[0023] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0024] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0025] like Figure 1 As shown, the present invention provides an optical-mechanical splicing modular device for photocurable ceramic molding, specifically including a main substrate 1 and a protective cover 7 arranged on the main substrate 1. Multiple groups of light source component modules 2 are fixedly installed in the main substrate 1. The light source component module 2 is provided with a heat pipe radiator 3 for heat dissipation. The heat pipe radiator 3 connected to the multiple light source component modules 2 is connected to the water cooling head 4. A cooling fan 6 is provided on the protective cover 7. The cooling fan 6 is used to dissipate heat from the circulating coolant in the water cooling head 4. The main substrate 1 is integrated with a control circuit 8 for controlling the light source component module 2, the heat pipe radiator 3 and the cooling fan 6. The present application adopts multiple groups of light source component modules 2 arranged in a modular manner to cool the condenser by active air cooling. All liquid-cooled heat dissipation elements are filled with coolant, and the coolant is driven by a micro water pump to realize internal circulation. During operation, the heat pipe radiator 3 first absorbs the heat generated by the light source assembly and conducts it to the water cooling head. The coolant inside the water cooling head absorbs the heat and circulates to the finned condenser driven by the water pump. The condenser is cooled by the fan and the heat is removed from the module.

[0026] In a specific embodiment of the present application, a plurality of light source component modules 2 are installed on the main substrate 1, and the arrangement of the light source component modules 2 is determined according to the molding requirements. A heat pipe radiator 3 is installed at the high heating point of each light source component module 2 to uniformly lead the heat to the middle area. A water cooling head 4 is provided in the middle area to centrally exchange the heat derived from each light source component module 2, and the coolant inside the water cooling head 4 is connected to the fin-type condenser 5 installed on the top through a pump to realize internal circulation. The fin-type condenser 5 is centrally cooled by a cooling fan 6. A protective cover 7 is installed on the main substrate 1 to prevent dust from entering all light source component modules 2. At the same time, the control circuit boards 8 of all light source component modules 2 are integrated into a large circuit board, which is arranged on the inner side of the protective cover 7 for easy wiring and maintenance. The module is designed around integration, structure and heat dissipation.

[0027] In a specific embodiment of the present application, the light source component module 2 adopts a three-dimensional integrated structure. The light source component module 2 includes a light source component and a lens. The driving circuit of the light source component module 2 is integrated into the control circuit board 8 and connected using a quick-plug connector. The heat pipe radiator 3 is integrated into the upper end of the light source component module 2 to form an integrated three-dimensional frame. Specifically, multiple light source components are installed and arranged according to the molding format requirements and installed on the same high-precision substrate. Each individual light source component can be fine-tuned in position to compensate for the error caused by the processing of the optical machine component mounting plate, forming an integrated light source optical unit, which greatly reduces the connection space and signal transmission path between the components, improves the integration and working efficiency of the optical machine, and when a light source component fails, only the faulty component needs to be disassembled for repair or replacement, without the need to process the entire optical machine, which greatly reduces the maintenance cost and time and improves production efficiency. In the present application, it includes an integrated power management circuit, a light source driving circuit and a communication control circuit. The power management circuit, light source drive circuit, and communication control circuit are integrated on the same circuit board and connected to the integrated light source assembly through a flexible cable to achieve efficient transmission of signals and power. The entire circuit board is installed on the side of the module shield, which is convenient for installation and debugging of the light source assembly and also for inspection and maintenance in the event of a fault.

[0028] In a specific embodiment of the present application, the main substrate 1 is made of high-strength aluminum alloy plate, and the surface of the main substrate 1 is anodized to ensure good flatness and rigidity, while also reducing the weight of the entire module. The bottom of the main substrate 1 is processed with mounting holes and adjustment holes for fixing and adjusting each light source component module 2, and it is also convenient to adjust the level and height of the light source component module 2 in different working environments, thereby ensuring the overall accuracy of the optical machine after splicing.

[0029] The protective cover 7 is made of a bent aluminum alloy plate, and a vent is provided on the protective cover 7. The protective cover 7 is connected to the main substrate 1 by high-strength screws to ensure that it will not loosen during long-term use and is convenient for later maintenance and disassembly. Sealing strips are filled in all connecting gaps between the protective cover 7 and the main substrate 1 to effectively prevent external dust and moisture from entering, protect electronic components, and further improve the reliability and service life of the shutdown module.

[0030] In a specific embodiment of the present application, a finned condenser 5 is provided at the lower end of the protective cover 7 located at the cooling fan 6. The finned condenser 5 is connected to the water-cooled head 4. The coolant in the water-cooled head 4 circulates in the water-cooled head 4 and the finned condenser 5. The finned condenser 5 can accelerate the cooling of the coolant, thereby improving the cooling effect. In terms of heat dissipation, the present invention adopts a liquid-cooling-air-cooling composite heat dissipation system. Since a single light source component will generate a large amount of heat when working, and after integrated installation, the heat is concentrated and difficult to remove. However, if the heat is not dissipated in time, it will lead to problems such as shortened light source life and decreased optical lens performance. Therefore, this application installs a heat pipe radiator 3 at the heating point of a single light source component to quickly extract the heat. The other end of the heat pipe radiator 3 of all light source components is concentrated on a water-cooled head in the middle idle area. Thermal conductive silicone grease is applied between the heat pipe radiator 3 and the water-cooled head to exchange heat with the heat pipe radiator 3. The two ends of the water-cooled head are connected to a finned condenser through a pipe. A cooling fan is installed on the finned condenser to cool the finned condenser by active air cooling. All liquid-cooled heat dissipation components are filled with coolant, and the coolant is driven by a micro water pump to achieve internal circulation.

[0031] During operation, the heat pipe radiator 3 first absorbs the heat generated by the light source assembly and conducts it to the water-cooled head. The coolant inside the water-cooled head absorbs the heat and circulates through the water pump to the fin-type condenser. The condenser cools down by blowing air through the fan, and the heat is removed from the module. In addition, there are vents on the protective cover, and the vents are covered with a dust cover. When the cooling fan is running, fresh cold air is ensured to enter the module through the vents and take away the heat generated by the circuit board. At the same time, the cooling fan is electrically connected to the control circuit board, and the control circuit board can automatically adjust the speed of the cooling fan according to the real-time temperature of the optical-mechanical module. When the temperature of the optical-mechanical module is low, the cooling fan runs at a low speed or stops; when the temperature rises, the cooling fan automatically accelerates to speed up the air flow, improve the heat dissipation efficiency, and ensure that the optical-mechanical module works stably within an appropriate temperature range.

[0032] Specifically, the light source assembly module 2 is fixed on the main substrate 1 by screws or bolts.

[0033] In practical applications, according to the specific size and process requirements of the light-curing ceramic molding, an appropriate number of light source modules are selected for splicing. First, each light source module is pre-installed one by one according to the processed position on the substrate, and then the light machine is opened through the software to make fine adjustments to the light machine position to achieve a good splicing effect; at the same time, each light source module is fixed with screws. After the light source module is fixed, the heat pipe radiator 3 of each light source module is installed. The heat pipe radiator 3 is fixed in shape according to the layout plan on the outside, and all heat pipe radiators 3 are fixed to the water cooling head. Note that thermal grease must be evenly applied to each heat dissipation contact area. Then, the water cooling head and the finned condenser are connected and fixed through copper pipes. The corresponding cooling fan is installed on the finned condenser, and then the protective cover is installed and fixed to the substrate with screws. Finally, the light source module is connected to the control circuit board through a communication cable to realize data transmission and collaborative control. The integrated circuit board has a separate mounting plate, which is installed on the protective cover for easy maintenance and inspection.

[0034] During the photocuring ceramic molding process, the control circuit board controls the integrated light source assembly according to a pre-set program. Light from the light source assembly is processed sequentially by collimating, homogenizing, and focusing lenses, forming a uniform, focused beam that illuminates the surface of the ceramic slurry, triggering the photocuring reaction. Simultaneously, the control circuit board monitors the temperature of the optomechanical module in real time. When the temperature rises, it automatically adjusts the speed of the cooling fan to enhance heat dissipation.

[0035] When a light source module fails, simply unscrew the connecting screws and remove the faulty light source module from the splicing structure for repair or replacement. After the repair is completed, follow the above steps to re-splice it back into the light machine system without affecting the normal operation of the entire light-curing ceramic molding equipment. Through the above implementation methods, the modular structure of the optical machine splicing for photocuring ceramic molding of the present invention can effectively solve the problems of low integration, structural instability and poor heat dissipation existing in existing optical machines, improve the quality and efficiency of photocuring ceramic molding, and has good application prospects and promotion value.

Claims

1. A modular optical-mechanical splicing device for light-cured ceramic molding, characterized in that: The invention comprises a main substrate (1) and a protective cover (7) arranged on the main substrate (1), wherein a plurality of light source component modules (2) are fixedly mounted in the main substrate (1), a heat pipe radiator (3) for heat dissipation is arranged on the light source component module (2), the heat pipe radiator (3) connected to the plurality of light source component modules (2) is connected to a water cooling head (4), a cooling fan (6) is arranged on the protective cover (7), and a control circuit (8) for controlling the light source component modules (2), the heat pipe radiator (3) and the cooling fan (6) is integrated in the main substrate (1).

2. The optical-mechanical modular splicing device for light-cured ceramic molding according to claim 1, characterized in that: A finned condenser (5) is provided at the lower end of the heat dissipation fan (6) in the protective cover (7), and the finned condenser (5) is communicated with the water cooling head (4).

3. The optical-mechanical modular splicing device for light-cured ceramic molding according to claim 1, characterized in that: The light source component module (2) adopts a three-dimensional integrated structure, and comprises a light source component and a lens. The driving circuit of the light source component module (2) is integrated onto a control circuit board (8).

4. The optical-mechanical modular splicing device for light-cured ceramic molding according to claim 1, characterized in that: The light source assembly module (2) is fixedly mounted on the main base plate (1) by means of screws or bolts.

5. The optical-mechanical modular splicing device for light-cured ceramic molding according to claim 1, characterized in that: It also includes an integrated power management circuit, a light source driving circuit and a communication control circuit.

6. The optical-mechanical modular splicing device for light-cured ceramic molding according to claim 1, characterized in that: The main substrate (1) is made of a high-strength aluminum alloy plate, and the surface of the main substrate (1) is anodized.

7. The optical-mechanical modular splicing device for light-cured ceramic molding according to claim 1, characterized in that: The bottom of the main substrate (1) is processed with mounting holes and adjustment holes for fixing and adjusting each light source component module (2).

8. The optical-mechanical modular splicing device for light-cured ceramic molding according to claim 1, characterized in that: The protective cover (7) is made of an aluminum alloy plate by bending, and a vent hole is provided on the protective cover (7). The protective cover (7) is connected to the main base plate (1) by high-strength screws.

9. The optical-mechanical modular splicing device for light-cured ceramic molding according to claim 1, characterized in that: A sealing strip is filled between the protective cover (7) and the main substrate (1).

10. The optical-mechanical modular splicing device for light-cured ceramic molding according to claim 1, characterized in that: Thermal conductive silicone grease is applied between the heat pipe radiator (3) and the water cooling head (4) for heat exchange with the heat pipe radiator (3).

Images