Wafer carrier dimension laser measuring device

Abstract

The invention discloses a wafer carrier size laser measurement device, and relates to the technical field of laser measurement, the wafer carrier size laser measurement device comprises a measurement platform mechanism, the measurement platform mechanism comprises a mounting table, the front surface of the mounting table is provided with a control terminal, and the top of the inner cavity of the mounting table is fixedly connected with a mounting rack; and the surface of the mounting frame is fixedly connected with a first motor. According to the invention, through the arrangement of the horizontally distributed self-adaptive nodes, flexible deployment is realized by utilizing a magnetic attraction structure, and the electric telescopic rod and the silica gel contact head are matched, so that complex curved surfaces such as a three-dimensional buckle and a deep groove of a carrier can be attached in a self-adaptive manner; a vertical plane and a concave structure which are difficult to detect by a traditional device can be subjected to multi-angle scanning, a measurement blind area is thoroughly eliminated, the coverage rate of three-dimensional size detection is remarkably increased, meanwhile, a temperature and vibration compensation model is built in an intelligent compensation algorithm module integrated by a control terminal, and the influence of environmental factors on a measurement result is corrected in real time.

Description

Technical Field

[0001] The present invention relates to the field of laser measurement technology, and in particular to a wafer carrier size laser measurement device. Background Art

[0002] In the semiconductor wafer manufacturing and packaging industry, the dimensional accuracy of wafer carriers directly impacts wafer positioning accuracy and automated transport safety. Therefore, high-precision dimensional measurement is a critical step in the production process. Traditional laser measurement devices, through the collaboration of a laser transmitter and receiver, enable non-contact measurement of carrier surface features. These devices are widely used to inspect carrier parameters such as flatness, aperture, and edge profile, providing fundamental technical support for quality control in semiconductor production.

[0003] However, when faced with complex wafer carriers with three-dimensional buckles, deep groove structures or micro-nanoscale textures, the single laser beam scanning used by traditional measurement devices is difficult to cover three-dimensional complex surfaces, and the measurement angle needs to be adjusted frequently, resulting in low detection efficiency and measurement blind spots; at the same time, environmental vibrations and temperature fluctuations will cause laser focus drift, resulting in edge feature extraction errors. In addition, traditional devices rely on fixed template matching and lack the adaptive recognition capability of multiple models of carriers, making it difficult to adapt to the production needs of the semiconductor industry for rapid switching of multiple specifications of carriers. Summary of the Invention

[0004] The present invention provides a wafer carrier size laser measurement device to solve the problem raised in the above background technology that when faced with complex wafer carriers with three-dimensional buckles, deep groove structures or micro-nanoscale textures, the single laser beam scanning used by traditional measurement devices is difficult to cover the three-dimensional complex curved surface, and the measurement angle needs to be adjusted frequently, resulting in low detection efficiency and the existence of measurement blind spots; at the same time, environmental vibrations and temperature fluctuations will cause laser focus drift, resulting in edge feature extraction errors. In addition, traditional devices rely on fixed template matching, and have insufficient adaptive recognition capabilities for multiple models of carriers, making it difficult to adapt to the production needs of rapid switching of multiple specifications of carriers in the semiconductor industry.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is: A wafer carrier size laser measurement device includes a measuring platform mechanism, the measuring platform mechanism includes a mounting table, a control terminal is provided on the front of the mounting table, the top of the inner cavity of the mounting table is fixedly connected to a mounting frame, and the surface of the mounting frame is fixedly connected to a first motor; a bidirectional movement mechanism, the bidirectional movement mechanism includes a second motor, one end of the second motor shaft is fixedly connected to a second screw, and the surface of the second screw is threadedly connected to a second drive block; a vertical laser measurement mechanism, the vertical laser measurement mechanism includes a fixed block, the bottom of the fixed block is fixedly connected to a mounting plate, and the bottom of the mounting plate is fixedly connected to a first laser emitter and a first laser receiver; a horizontal distributed adaptive node, the horizontal distributed adaptive node includes a socket, the surface of the socket is provided with a positioning bump, one side of the socket is provided with a connection contact, and the side of the socket close to the connection contact is provided with a magnetic suction groove.

[0006] A further improvement of the technical solution of the present invention is that the measuring platform mechanism further includes a first screw, one end of which is fixedly connected to one end of the first motor shaft, and a first driving block is threadedly connected to the surface of the first screw.

[0007] A further improvement of the technical solution of the present invention is that the internal sliding connection of the first driving block is connected to the first guide rod, the top of the first driving block is fixedly connected to the gantry, and the surface of the mounting table is provided with a detection table.

[0008] A further improvement of the technical solution of the present invention is that: the bidirectional moving mechanism also includes a first slide rail, the surface of the first slide rail is slidably connected to the interior of the second drive block, one side of the first slide rail is fixedly connected to the inner wall of the gantry, the surface of the second motor is fixedly connected to the inner wall of the gantry, and one side of the second drive block is fixedly connected to an installation box.

[0009] A further improvement of the technical solution of the present invention is that: a third motor is fixedly connected to the inner wall of the installation box, one end of the third motor shaft is fixedly connected to a third screw, the surface of the third screw is threadedly connected to a third driving block, the interior of the third driving block is slidingly connected to a second slide rail, one side of the second slide rail is fixedly connected to the inner wall of the installation box, and one side of the third driving block is fixedly connected to the surface of the fixed block.

[0010] A further improvement of the technical solution of the present invention is that the vertical laser measurement mechanism also includes a mounting plate, and the mounting plates are provided in six groups, evenly distributed at the bottom of the mounting plate, and the surface of the mounting plate is provided with an array-type node mounting groove, and the bottom of the inner cavity of the array-type node mounting groove is fixedly connected with a magnetic block, and the surface of the magnetic block is engaged with the interior of the magnetic groove.

[0011] A further improvement of the technical solution of the present invention is that: a spring is fixedly connected to the inner wall of the array node mounting groove, a connecting contact is fixedly connected to one end of the spring, a guide column is fixedly connected to the side of the connecting contact close to the spring, the surface of the guide column is slidingly connected to the inner wall of the array node mounting groove, the surface of the connecting contact is against the connecting contact point, and the suction force of the magnetic block is greater than the elastic force of the spring.

[0012] A further improvement of the technical solution of the present invention is that: the horizontal distributed adaptive node also includes an electric telescopic rod, one end of the electric telescopic rod is fixedly connected to the surface of the socket, the output end of the electric telescopic rod is fixedly connected to a pressure sensor, the surface of the pressure sensor is fixedly connected to a silicone contact head, the surface of the silicone contact head is provided with a second laser transmitter and a second laser receiver, and the interior of the silicone contact head is provided with a micro-capacitive sensor, a micro-spectrometer and an IMU inertial measurement unit.

[0013] Further improvements to the technical solution of the present invention are: the control terminal has a built-in industrial-grade ARM processor and an FPGA co-processing unit, which are internally integrated; a central control module, the central control module is used to receive and parse measurement instructions, generate drive signals for the first motor, the second motor, the third motor and the electric telescopic rod, and support multi-axis motion collaborative control algorithms; a laser data processing unit, the laser data processing unit is connected to the measurement signals of the first laser transmitter, the first laser receiver, the second laser transmitter, and the second laser receiver, and uses a triangulation algorithm and point cloud fitting technology to calculate the three-dimensional size parameters of the wafer carrier; an adaptive node management module, the adaptive node management module monitors the presence of horizontally distributed adaptive nodes through the coupling state of the magnetic suction groove and the magnetic suction block, and dynamically adjusts the node measurement parameters based on the data of the micro-capacitance sensor and the micro-spectrometer; a human-computer interaction module, the human-computer interaction module is used to support measurement program presets, real-time data display, laser signal abnormality and motor overload abnormality alarms, and measurement result export.

[0014] A further improvement of the technical solution of the present invention is that the control terminal also includes: an intelligent compensation algorithm module, which has a built-in temperature compensation model based on the temperature sensor data built into the mounting platform and a vibration compensation algorithm that identifies vibration interference through contact force fluctuations fed back by the pressure sensor, so as to eliminate the influence of environmental factors on measurement accuracy; a data fusion and calibration unit, which uses Zhang's calibration method to calibrate the spatial coordinate relationship between the first laser emitter and the first laser receiver, and combines the IMU inertial measurement unit data to achieve coordinate unification of the vertical laser measurement mechanism and the horizontal distributed adaptive node; a remote operation and maintenance interface, which is configured with Ethernet and WiFi communication modules, supports real-time monitoring of the measurement process through PC software or mobile APP, remote modification of measurement parameters, and synchronization of measurement data to the cloud database for SPC statistical process control analysis; a safety protection module, which is used to detect the displacement of the second drive block and the third drive block and the power of the laser emitter. When the preset stroke is exceeded and there is abnormal fluctuation, the emergency stop mechanism is automatically triggered and the motor drive power is locked.

[0015] Due to the adoption of the above technical solution, the present invention has the following technical advancements compared to the prior art: The present invention provides a wafer carrier size laser measurement device. Through the arrangement of horizontal distributed adaptive nodes, the device utilizes a magnetic structure to achieve flexible deployment. In conjunction with an electric telescopic rod and a silicone contact head, the device can adaptively fit the carrier's three-dimensional buckles, deep grooves and other complex curved surfaces. The horizontal laser module is combined with a micro-capacitive sensor to perform multi-angle scanning on vertical surfaces and concave structures that are difficult to detect with traditional devices, completely eliminating measurement blind spots and significantly improving the three-dimensional size detection coverage. At the same time, the intelligent compensation algorithm module integrated in the control terminal has a built-in temperature and vibration compensation model to correct the influence of environmental factors on the measurement results in real time. The edge feature extraction error is significantly reduced compared with traditional devices. The bidirectional moving mechanism realizes the precise movement of the gantry, mounting box and fixing block through multi-axis collaborative control, greatly shortening the full-size scanning time of a single carrier. The adaptive node management module automatically identifies the carrier material based on the micro-spectrometer data, dynamically adjusts the measurement parameters, supports the rapid switching of multiple models of carriers, and significantly improves the measurement efficiency of the semiconductor production line. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the main structure of the present invention; Figure 2 It is a bottom view structural schematic diagram of the present invention; Figure 3 This is a schematic diagram of the internal structure of the mounting platform of the present invention; Figure 4 It is a schematic diagram of the structure of the measuring platform of the present invention; Figure 5 This is a schematic diagram of the internal structure of the gantry of the present invention; Figure 6 It is a schematic diagram of the side structure of the vertical laser measurement mechanism of the present invention; Figure 7 It is a schematic diagram of the partial exploded structure of the bidirectional moving mechanism of the present invention; Figure 8 This is a schematic diagram of the vertical laser measurement mechanism of the present invention when viewed from above; Figure 9 Schematic diagram of the horizontal distributed adaptive node structure of the present invention; Figure 10 This is a schematic diagram of the horizontal distributed adaptive node end structure of the present invention; Figure 11 This is a schematic cross-sectional view of the array node installation slot of the present invention; Figure 12 This is a structural block diagram of the control system of the present invention.

[0017] In the figure: 11, mounting platform; 12, control terminal; 13, mounting frame; 14, first motor; 15, first screw; 16, first drive block; 17, first guide rod; 18, gantry; 19, inspection platform; 21, second motor; 22, second screw; 23, second drive block; 24, first slide rail; 25, mounting box; 26, third motor; 27, third screw; 28, third drive block; 29, second slide rail; 31, fixing block; 3 2. Mounting plate; 33. First laser transmitter; 34. First laser receiver; 35. Mounting plate; 36. Array node mounting slot; 37. Magnetic block; 38. Spring; 39. Connecting contact; 310. Guide post; 41. Socket; 42. Positioning bump; 43. Connecting contact; 44. Magnetic slot; 45. Electric telescopic rod; 46. Pressure sensor; 47. Silicone contact head; 48. Second laser transmitter; 49. Second laser receiver. DETAILED DESCRIPTION

[0018] The present invention is described in further detail below in conjunction with the embodiments: Example 1

[0019] like Figure 1-12As shown, the present invention provides a wafer carrier size laser measurement device, including a measuring platform mechanism, the measuring platform mechanism includes a mounting table 11, a control terminal 12 is provided on the front of the mounting table 11, a mounting frame 13 is fixedly connected to the top of the inner cavity of the mounting table 11, and a first motor 14 is fixedly connected to the surface of the mounting frame 13; a bidirectional moving mechanism, the bidirectional moving mechanism includes a second motor 21, one end of the rotating shaft of the second motor 21 is fixedly connected to a second screw 22, and the surface of the second screw 22 is threadedly connected to a second driving block 23; a vertical laser measurement mechanism, the vertical laser measurement mechanism includes a fixed block 31, the bottom of the fixed block 31 is fixedly connected to a mounting plate 32, and the bottom of the mounting plate 32 is fixedly connected to a first laser emitter 33 and a first laser receiver 34; a horizontal distributed adaptive node, the horizontal distributed adaptive node includes a socket 41, a positioning protrusion 42 is provided on the surface of the socket 41, a connection contact 43 is provided on one side of the socket 41, and a magnetic suction groove 44 is provided on the side of the socket 41 close to the connection contact.

[0020] In this embodiment, the wafer carrier to be measured is placed on the detection table 19, and the corresponding measurement program is selected through the control terminal 12. The central control module built into the control terminal 12 drives the first motor 14 to rotate, and drives the first drive block 16 to move laterally along the first guide rod 17 through the first screw 15, so that the gantry 18 is positioned directly above the carrier. At the same time, the horizontal distributed adaptive node is coupled with the magnetic block 37 of the vertical laser measurement mechanism through the magnetic groove 44 of the socket 41, and the connecting contact block 39 contacts the connecting contact 43 to realize the electrical signal connection between the node and the control terminal, completing the hardware initialization. Subsequently, the third motor 26 drives the third screw 27 to rotate, driving the third drive block 28 to feed vertically along the second slide rail 29, so that the first laser emitter 3 at the bottom of the mounting plate 32 is mounted. 3 and the first laser receiver 34 descend to a safe distance above the vehicle. The laser data processing unit uses a triangulation algorithm to perform a rough scan of the top surface of the vehicle to obtain initial contour data. Combined with the IMU inertial measurement unit data, the vertical laser module's spatial coordinate system is calibrated using the Zhang calibration method to determine the vehicle's overall position and posture. The second motor 21 drives the second screw 22 to rotate, driving the second drive block 23 to slide longitudinally along the first slide rail 24, moving the vertical laser measurement mechanism carried by the mounting box 25 to the edge feature area of ​​the vehicle. The control terminal generates a path plan based on the rough scan data. The third motor 26 cooperates to adjust the vertical height of the fixed block 31 to ensure that the first laser beam is projected onto the vehicle surface at the optimal angle, completing high-precision measurement of basic parameters such as edge contour and flatness. Example 2

[0021] like Figure 1-12As shown, on the basis of Example 1, the present invention provides a technical solution: preferably, the measuring platform mechanism also includes a first screw 15, one end of the first screw 15 is fixedly connected to one end of the rotating shaft of the first motor 14, the surface of the first screw 15 is threadedly connected to a first driving block 16, the internal sliding connection of the first driving block 16 is connected to a first guide rod 17, the top of the first driving block 16 is fixedly connected to a gantry 18, the surface of the mounting table 11 is provided with a detection table 19, the bidirectional moving mechanism also includes a first slide rail 24, the surface of the first slide rail 24 is slidably connected to the inside of the second driving block 23, the first slide One side of the rail 24 is fixedly connected to the inner wall of the gantry 18, the surface of the second motor 21 is fixedly connected to the inner wall of the gantry 18, one side of the second driving block 23 is fixedly connected to the mounting box 25, the inner wall of the mounting box 25 is fixedly connected to the third motor 26, one end of the rotating shaft of the third motor 26 is fixedly connected to the third screw 27, the surface of the third screw 27 is threadedly connected to the third driving block 28, the interior of the third driving block 28 is slidably connected to the second slide rail 29, one side of the second slide rail 29 is fixedly connected to the inner wall of the mounting box 25, one side of the third driving block 28 is fixedly connected to the surface of the fixed block 31, and the vertical excitation The optical measurement mechanism also includes a mounting plate 35, which is provided with six groups of mounting plates 35, which are evenly distributed at the bottom of the mounting plate 32. The surface of the mounting plate 35 is provided with an array node mounting groove 36, and the bottom of the inner cavity of the array node mounting groove 36 is fixedly connected with a magnetic block 37. The surface of the magnetic block 37 engages with the interior of the magnetic groove 44. The inner wall of the array node mounting groove 36 is fixedly connected with a spring 38, and one end of the spring 38 is fixedly connected with a connecting contact block 39. The connecting contact block 39 is fixedly connected with a guide column 310 on the side close to the spring 38. The surface of the guide column 310 slides with the inner wall of the array node mounting groove 36. The surface of the connecting contact block 39 is against the connecting contact 43, the suction force of the magnetic block 37 is greater than the elastic force of the spring 38, and the horizontal distributed adaptive node also includes an electric telescopic rod 45. One end of the electric telescopic rod 45 is fixedly connected to the surface of the socket 41, and the output end of the electric telescopic rod 45 is fixedly connected to a pressure sensor 46. The surface of the pressure sensor 46 is fixedly connected to a silicone contact head 47. The surface of the silicone contact head 47 is provided with a second laser emitter 48 and a second laser receiver 49. The interior of the silicone contact head 47 is provided with a micro-capacitive sensor, a micro-spectrometer and an IMU inertial measurement unit.

[0022] In this embodiment, the silicone contact head 47 is driven to move by the electric telescopic rod 45, and the pressure sensor 46 feeds back the contact force to the control terminal, so that the contact head can adaptively fit the curved surface. The second laser emitter 48 and the second laser receiver 49 cooperate with the micro-capacitive sensor to perform multi-angle scanning on the vertical surface and the concave area. The micro-spectrometer identifies the material and dynamically adjusts the laser power to avoid reflection interference. At the same time, the IMU inertial measurement unit monitors the node posture in real time to ensure that the spatial coordinates of the scanning data are consistent with the vertical laser module. The laser data processing unit fits the point cloud data of the vertical and horizontal laser modules to generate a three-dimensional model of the vehicle. The intelligent compensation algorithm module compensates for the thermal expansion and contraction of the material caused by temperature changes based on the temperature sensor data built into the mounting platform 11. Example 3

[0023] like Figure 1-12As shown, on the basis of Example 1, the present invention provides a technical solution: preferably, the control terminal 12 has a built-in industrial-grade ARM processor and an FPGA coprocessing unit, which are internally integrated; a central control module, the central control module is used to receive and parse measurement instructions, generate drive signals for the first motor 14, the second motor 21, the third motor 26 and the electric telescopic rod 45, and support a multi-axis motion collaborative control algorithm; a laser data processing unit, the laser data processing unit is connected to the measurement signals of the first laser emitter 33, the first laser receiver 34, the second laser emitter 48, and the second laser receiver 49, and uses a triangulation algorithm and a point cloud fitting technology to calculate the three-dimensional size parameters of the wafer carrier; an adaptive node management module, the adaptive node management module monitors the presence of the horizontally distributed adaptive node through the coupling state of the magnetic suction groove 44 and the magnetic suction block 37, and dynamically adjusts the node measurement parameters based on the data of the micro-capacitive sensor and the micro-spectrometer; a human-computer interaction module, the human-computer interaction module is used to support measurement program preset, real-time data display, laser signal abnormality and motor overload abnormality alarm, and measurement result export, The control terminal 12 also includes: an intelligent compensation algorithm module, which has a built-in temperature compensation model based on the temperature sensor data built into the mounting platform 11 and a vibration compensation algorithm that identifies vibration interference based on the contact force fluctuation feedback from the pressure sensor 46, so as to eliminate the influence of environmental factors on measurement accuracy; a data fusion and calibration unit, which uses Zhang's calibration method to calibrate the spatial coordinate relationship between the first laser emitter 33 and the first laser receiver 34, and combines the IMU inertial measurement unit data to achieve coordinate unification of the vertical laser measurement mechanism and the horizontal distributed adaptive node; a remote operation and maintenance interface, which is equipped with Ethernet and WiFi communication modules, supports real-time monitoring of the measurement process through PC software or mobile APP, remote modification of measurement parameters, and synchronization of measurement data to a cloud database for SPC statistical process control analysis; a safety protection module, which is used to detect the displacement of the second drive block 23 and the third drive block 28 and the laser emitter power. When the preset travel is exceeded or there is abnormal fluctuation, the emergency stop mechanism is automatically triggered and the motor drive power is locked.

[0024] In this embodiment, vibration interference is identified through the contact force fluctuation of the pressure sensor 46, and the vibration compensation algorithm is triggered to correct the measurement deviation. After the final data is verified by the adaptive node management module, the measurement results are displayed by the human-computer interaction module, and STL model and CSV data export are supported. During the measurement process, the safety protection module monitors in real time whether the displacement of the second drive block 23 and the third drive block 28 exceeds the preset stroke, and whether the power of the laser transmitter fluctuates abnormally. Once an abnormality is detected, the emergency stop mechanism is immediately triggered and the motor drive power supply is locked. The remote operation and maintenance interface synchronizes the measurement data to the cloud database via Ethernet or WiFi, supports real-time monitoring by PC software or mobile APP, and combines SPC statistical process control analysis to achieve full-cycle traceability and quality control of the measurement process.

[0025] The following is a detailed description of the working principle of the wafer carrier size laser measurement device.

[0026] like Figure 1-12As shown, the wafer carrier to be measured is placed on the detection table 19, and the corresponding measurement program is selected through the control terminal 12. The central control module built into the control terminal 12 drives the first motor 14 to rotate, and the first drive block 16 is driven to move laterally along the first guide rod 17 through the first screw 15, so that the gantry 18 is positioned directly above the carrier. At the same time, the horizontal distributed adaptive node is coupled with the magnetic block 37 of the vertical laser measurement mechanism through the magnetic groove 44 of the socket 41, and the connecting contact block 39 is in contact with the connecting contact 43, so that the electrical signal connection between the node and the control terminal is realized, and the hardware initialization is completed. Then, the third motor 26 drives the third screw 27 to rotate, driving the third drive block 28 to feed vertically along the second slide rail 29, so that the first laser emitter 33 and the first laser receiver 34 at the bottom of the mounting plate 32 are lowered to a safe distance above the vehicle. The laser data processing unit uses a triangulation algorithm to perform a rough scan of the top surface of the vehicle to obtain initial contour data. Combined with the IMU inertial measurement unit data, the spatial coordinate system of the vertical laser module is calibrated by the Zhang calibration method to determine the overall position and posture of the vehicle. The second motor 21 drives the second screw 22 to rotate, driving the second drive block 2 3 slides longitudinally along the first slide rail 24, moving the vertical laser measurement mechanism carried by the mounting box 25 to the edge feature area of ​​the vehicle. The control terminal generates a path plan based on the rough scan data. The third motor 26 cooperates to adjust the vertical height of the fixed block 31 to ensure that the first laser beam is projected onto the vehicle surface at the optimal angle, completing high-precision measurement of basic parameters such as edge profile and flatness. For complex structures such as three-dimensional buckles and deep grooves of the vehicle, the electric telescopic rod 45 drives the silicone contact head 47 to move. The pressure sensor 46 feedbacks the contact force to the control terminal, allowing the contact head to adaptively conform to the curved surface. The second laser emitter 48 and the second laser receiver 49 cooperate with the micro-capacitive sensor to perform multi-angle scanning of vertical surfaces and concave areas. The micro-spectrometer identifies the material and dynamically adjusts the laser power to avoid reflection interference. At the same time, the IMU inertial measurement unit monitors the node posture in real time to ensure that the spatial coordinates of the scan data are consistent with the vertical laser module. The laser data processing unit fits the point cloud data of the vertical and horizontal laser modules to generate a three-dimensional model of the vehicle. The intelligent compensation algorithm module compensates for the thermal expansion and contraction of the material caused by temperature changes based on the temperature sensor data built into the mounting platform 11.Vibration interference is detected by contact force fluctuations detected by the pressure sensor 46, triggering a vibration compensation algorithm to correct measurement deviations. Final data is verified by the adaptive node management module, and the human-computer interaction module displays the measurement results. STL models and CSV data export are also supported. During measurement, the safety protection module monitors in real time whether the displacement of the second and third drive blocks 23 and 28 exceeds the preset travel range, as well as any abnormal fluctuations in the laser transmitter power. Upon detection of an anomaly, an emergency stop mechanism is immediately triggered and the motor drive power supply is locked. A remote operation and maintenance interface synchronizes measurement data to a cloud database via Ethernet or WiFi. This supports real-time monitoring via PC software or mobile apps. Combined with SPC statistical process control analysis, this enables full-cycle traceability and quality control of the measurement process.

[0027] While the present invention has been generally described above, modifications and improvements are readily apparent to those skilled in the art. Therefore, modifications and improvements that do not depart from the spirit of the present invention are intended to be within the scope of the present invention.

Claims

1. A wafer carrier size laser measurement device, characterized by: include A measuring platform mechanism, comprising a mounting platform (11), a control terminal (12) being provided on the front of the mounting platform (11), a mounting frame (13) being fixedly connected to the top of the inner cavity of the mounting platform (11), and a first motor (14) being fixedly connected to the surface of the mounting frame (13); A bidirectional moving mechanism, comprising a second motor (21), one end of a rotating shaft of the second motor (21) being fixedly connected to a second screw (22), and a surface of the second screw (22) being threadedly connected to a second driving block (23); A vertical laser measuring mechanism, the vertical laser measuring mechanism comprising a fixed block (31), a mounting plate (32) fixedly connected to the bottom of the fixed block (31), and a first laser emitter (33) and a first laser receiver (34) fixedly connected to the bottom of the mounting plate (32); A horizontally distributed adaptive node comprises a socket (41), a surface of the socket (41) is provided with a positioning protrusion (42), a side of the socket (41) is provided with a connection contact (43), and a side of the socket (41) close to the connection contact is provided with a magnetic suction groove (44).

2. The wafer carrier size laser measurement device according to claim 1, characterized in that: The measuring platform mechanism further comprises a first screw (15), one end of the first screw (15) is fixedly connected to one end of the rotating shaft of the first motor (14), and a first driving block (16) is threadedly connected to the surface of the first screw (15).

3. The wafer carrier size laser measurement device according to claim 2, characterized in that: The first driving block (16) is internally slidably connected to a first guide rod (17), the top of the first driving block (16) is fixedly connected to a gantry (18), and a detection platform (19) is provided on the surface of the mounting platform (11).

4. The wafer carrier size laser measurement device according to claim 1, characterized in that: The bidirectional moving mechanism further comprises a first slide rail (24), the surface of the first slide rail (24) being slidably connected to the interior of the second driving block (23), one side of the first slide rail (24) being fixedly connected to the inner wall of the gantry (18), the surface of the second motor (21) being fixedly connected to the inner wall of the gantry (18), and one side of the second driving block (23) being fixedly connected to a mounting box (25).

5. The wafer carrier size laser measuring device according to claim 4, characterized in that: The inner wall of the installation box (25) is fixedly connected to a third motor (26), one end of the rotating shaft of the third motor (26) is fixedly connected to a third screw (27), the surface of the third screw (27) is threadedly connected to a third driving block (28), the interior of the third driving block (28) is slidably connected to a second slide rail (29), one side of the second slide rail (29) is fixedly connected to the inner wall of the installation box (25), and one side of the third driving block (28) is fixedly connected to the surface of the fixed block (31).

6. The wafer carrier size laser measurement device according to claim 1, characterized in that: The vertical laser measurement mechanism further includes a mounting plate (35), six groups of the mounting plates (35) are provided and are evenly distributed on the bottom of the mounting plate (32), the surface of the mounting plate (35) is provided with an array node mounting groove (36), the bottom of the inner cavity of the array node mounting groove (36) is fixedly connected with a magnetic block (37), and the surface of the magnetic block (37) is engaged with the inside of the magnetic groove (44).

7. The wafer carrier size laser measurement device according to claim 6, characterized in that: The inner wall of the array node mounting groove (36) is fixedly connected with a spring (38), one end of the spring (38) is fixedly connected with a connecting contact (39), and the connecting contact (39) is fixedly connected with a guide column (310) on the side close to the spring (38). The surface of the guide column (310) is slidably connected to the inner wall of the array node mounting groove (36), the surface of the connecting contact (39) is against the connecting contact (43), and the suction force of the magnetic block (37) is greater than the elastic force of the spring (38).

8. The wafer carrier size laser measurement device according to claim 1, characterized in that: The horizontal distributed adaptive node also includes an electric telescopic rod (45), one end of the electric telescopic rod (45) is fixedly connected to the surface of the socket (41), the output end of the electric telescopic rod (45) is fixedly connected to a pressure sensor (46), the surface of the pressure sensor (46) is fixedly connected to a silicone contact head (47), the surface of the silicone contact head (47) is provided with a second laser transmitter (48) and a second laser receiver (49), and the interior of the silicone contact head (47) is provided with a micro-capacitive sensor, a micro-spectrometer and an IMU inertial measurement unit.

9. The wafer carrier size laser measurement device according to claim 1, characterized in that: The control terminal (12) has an internally integrated industrial-grade ARM processor and an FPGA co-processing unit; A central control module, the central control module is used to receive and analyze measurement instructions, generate drive signals for the first motor (14), the second motor (21), the third motor (26) and the electric telescopic rod (45), and support a multi-axis motion coordinated control algorithm; A laser data processing unit, wherein the laser data processing unit receives measurement signals from the first laser transmitter (33), the first laser receiver (34), the second laser transmitter (48), and the second laser receiver (49), and calculates three-dimensional size parameters of the wafer carrier using a triangulation algorithm and a point cloud fitting technique; An adaptive node management module, wherein the adaptive node management module monitors the presence of the horizontally distributed adaptive node through the coupling state of the magnetic suction groove (44) and the magnetic suction block (37), and dynamically adjusts the node measurement parameters based on the data of the micro-capacitive sensor and the micro-spectrometer; The human-computer interaction module is used to support measurement program presets, real-time data display, laser signal anomaly and motor overload anomaly alarms, and measurement result export.

10. The wafer carrier size laser measuring device according to claim 1, characterized in that: The control terminal (12) further includes: An intelligent compensation algorithm module, wherein the intelligent compensation algorithm module has a built-in temperature compensation model based on the temperature sensor data built into the mounting table (11) and a vibration compensation algorithm for identifying vibration interference through contact force fluctuations fed back by the pressure sensor (46), and is used to eliminate the influence of environmental factors on measurement accuracy; A data fusion and calibration unit, wherein the data fusion and calibration unit uses Zhang's calibration method to calibrate the spatial coordinate relationship between the first laser transmitter (33) and the first laser receiver (34), and combines IMU inertial measurement unit data to achieve coordinate unification of the vertical laser measurement mechanism and the horizontal distributed adaptive node; Remote operation and maintenance interface, which is equipped with Ethernet and WiFi communication modules, supports real-time monitoring of the measurement process through PC software or mobile app, remote modification of measurement parameters, and synchronization of measurement data to a cloud database for SPC statistical process control analysis; A safety protection module is used to detect the displacement of the second drive block (23) and the third drive block (28) and the power of the laser transmitter, and automatically trigger the emergency stop mechanism and lock the motor drive power supply when the preset stroke is exceeded or abnormal fluctuations exist.

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