Combined heat dissipation device of server

By using multi-point temperature detection and intelligent control of the combined heat dissipation device, the problems of vertical temperature gradient and local hot spots in traditional server heat dissipation are solved, realizing an efficient and precise heat dissipation strategy, improving overall heat dissipation efficiency and energy efficiency, adapting to dynamic load changes, and ensuring equipment safety.

CN120812903APending Publication Date: 2025-10-17BEIJING HUITONG ZHIYUN INFORMATION TECH CO LTD
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Patent Information

Application Number
CN202510959471.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-07-11
Publication Date
2025-10-17

AI Technical Summary

Technical Problem

Traditional server cooling technologies suffer from vertical temperature gradient problems, difficulty in eliminating local hot spots, poor energy efficiency, strong dependence on ambient temperature, insufficient flexibility of cooling structures, and the risk of condensation, making it difficult to achieve efficient and precise adjustments to cooling strategies.

Method used

It adopts a combined heat dissipation device, including a circulating air duct, a circulating fan, a support layer, an auxiliary fan, an electronic cooling chip, and a temperature sensor. Through multi-point temperature detection and intelligent control, airflow is made from bottom to top. Combined with the dynamic adjustment of the auxiliary fan and the electronic cooling chip, precise cooling is achieved.

Benefits of technology

It effectively solves the problem of vertical temperature gradient, achieves efficient heat dissipation with large-area coverage, provides precise and targeted services to local hot spots, improves overall heat dissipation efficiency and energy efficiency, has intelligent control capabilities, adapts to dynamic load changes, and ensures safe and reliable operation of equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the technical field of server heat dissipation, in particular to a combined heat dissipation device of a server, which comprises a cabinet body with a mounting space, and a circulating air duct, a first air inlet of the circulating air duct and a first air outlet of the circulating air duct are arranged on one side in the mounting space; the circulating fan is lower than the first air inlet; the supporting layers are arranged in the mounting space in the height direction, each supporting layer is provided with a supporting face, the supporting faces are provided with air passing holes, auxiliary fans are arranged below the supporting layers, radiators are arranged on the upper sides of the auxiliary fans, and electronic refrigeration pieces are arranged on the radiators; and a plurality of first temperature sensors are arranged on each supporting layer. The heat dissipation device has the advantages that a new heat dissipation means is applied to heat dissipation of server equipment, and the defects that traditional server heat dissipation mainly depends on a forced air cooling technology or cold air is forcibly manufactured for cooling by matching the forced air cooling technology with an air conditioning refrigeration technology are overcome.
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Description

TECHNICAL FIELD

[0001] The application relates to the technical field of server heat dissipation, in particular to a combined heat dissipation device of a server. BACKGROUND

[0002] With the rapid development of technologies such as cloud computing, artificial intelligence and big data, the computing load borne by data centers (such as enterprise field industrial data centers applied by physical enterprise digital transformation and upgrading) as the core infrastructure thereof presents an explosive growth. As the core equipment of the data center, the power density of the server continuously increases, and the heat dissipation challenge is increasingly severe. A high-power-density server generates a large amount of heat in a limited space, and if the heat is not dissipated in time or uniformly, the temperature of the key electronic components (such as CPU, GPU, memory and power module) inside the server is likely to be too high, which may trigger frequency reduction protection to affect the computing performance, or even cause a malfunction, thereby seriously affecting the stability, reliability and power usage effectiveness (PUE) of the data center.

[0003] Traditional server heat dissipation mainly relies on forced air cooling technology or forced air cooling technology combined with air conditioning refrigeration technology to forcibly generate cold air for cooling.

[0004] A common scheme of traditional forced air cooling technology is to install a fan inside a server cabinet or case to drive air to flow through the heat dissipation fins (heat dissipation fins) on the surface of the heat generating elements to carry away the heat. However, with the increase of the stacking density of the internal equipment of the server and the intensification of the single-point heat flux (Hot Spot), the traditional air cooling scheme exposes many bottlenecks: Significant vertical temperature gradient problem: The stacked servers or components in the height direction are prone to "hot recirculation" due to the natural upward effect of hot air and the air duct design, in which the hot air discharged by the lower equipment is easily sucked into the upper equipment, resulting in a temperature in the upper region of the cabinet / case being significantly higher than that in the lower region, i.e., "chimney effect". This not only causes uneven heat dissipation, making the upper equipment long-term overheat, but also limits the improvement of the overall heat dissipation efficiency.

[0005] Local hot spots are difficult to effectively eliminate: The concentrated heat generated in the regions of high-power processors (such as CPU and AI accelerator card) far exceeds that in ordinary regions. The traditional uniform air supply method cannot accurately and efficiently deliver sufficient cold air to these hot spot regions, resulting in uncontrolled local temperature. Although increasing the fan speed or number can partially alleviate the problem, it is accompanied by a sharp increase in noise, energy consumption and a shortened fan life.

[0006] Strong dependence on ambient temperature and poor energy efficiency: Conventional air cooling is highly dependent on the external ambient temperature. In high-temperature seasons or in poor heat dissipation conditions, the fan speed needs to be greatly increased or air conditioning refrigeration needs to be introduced to maintain a safe temperature, resulting in a sharp increase in energy consumption.

[0007] And the traditional forced air cooling technology is very noisy when high power heat dissipation.

[0008] The air conditioning refrigeration technology of forced air cooling technology can provide low temperature heat source, but the energy consumption is huge, and the mixing efficiency of cold and hot air flow is low, which is not conducive to precise refrigeration.

[0009] In particular, it is necessary to pay attention to the heat dissipation of servers or components, which is not simply to provide a low temperature environment, but to fully and efficiently form heat exchange between the heat generating part and the heat dissipation medium.

[0010] In addition, there is a lack of flexibility in the heat dissipation structure: in the face of different power density equipment or dynamic load, the traditional fixed air duct and fan layout is difficult to adjust the heat dissipation strategy quickly and intelligently, and lacks the ability to supply precise heat dissipation on demand.

[0011] Condensation risk: under the condition of forced high strength low temperature refrigeration technology of air conditioning refrigeration technology, if the heat dissipation environment of the cold end surface is not properly controlled, there is a risk of condensation, which is also a fatal threat to electronic equipment.

[0012] In summary, there is an urgent need for an innovative heat dissipation method in the field of server heat dissipation. SUMMARY

[0013] The purpose of the present application is to provide a combined heat dissipation device for a server, which applies a new heat dissipation method to server equipment heat dissipation, and overcomes some of the shortcomings of the traditional server heat dissipation which mainly relies on forced air cooling technology or uses forced air cooling technology to cooperate with air conditioning refrigeration technology to forcibly produce cold air cooling.

[0014] In order to achieve the above purpose, the present application adopts the following technical scheme: The combined heat dissipation device of a server comprises: a cabinet body, which is internally provided with a mounting space, one side of the mounting space is provided with a circulating air duct along the height direction, the upper end of the circulating air duct is provided with a first air inlet communicating with the mounting space, and the circulating air duct is provided with a first air outlet communicating with the circulating air duct and the outside of the cabinet body; a circulating fan is arranged in the upper part of the mounting space, the installation height of the circulating fan is lower than that of the first air inlet, and the circulating fan is used for blowing air upward; a plurality of support layers are arranged in the mounting space, the plurality of support layers are arranged along the height direction, each support layer has a support surface, the support surface is provided with a plurality of hollow air passing holes, a plurality of auxiliary fans blowing air upward are arranged below the support layers, and a radiator is arranged on the upper side of each auxiliary fan, the first heat dissipation fins of the radiator extend to the upper side of the air outlet of the auxiliary fan, and an electronic refrigeration sheet is arranged on the radiator to refrigerate the radiator; a first temperature sensor is arranged on each support layer, the first temperature sensor is an infrared remote sensing temperature detection device, and the detection point of the first temperature sensor points to the upper side of the auxiliary fan arrangement area.

[0015] As a preferred scheme of the above scheme and on the basis of the above scheme: one side of the mounting space is provided with a side plate, the side wall of the mounting space adjacent to the side plate is a first side wall, the two sides of the side plate in the width direction have fold edges folded towards the first side wall, the fold edges are fixedly connected with the first side wall, and the first side wall, the two fold edges and the side plate jointly form the circulating air duct.

[0016] As a preferred scheme of the above scheme and on the basis of the above scheme: the first air inlet is arranged at the top end of the side plate; the first air outlet is arranged at the bottom end of the first side wall, and a first switch device capable of closing or opening the first air outlet is further arranged on the first air outlet; the bottom end of the side plate is provided with a second air outlet communicating with the circulating air duct and the mounting space, and a second switch device capable of closing or opening the second air outlet is further arranged on the second air outlet; the outside of the cabinet body is provided with a second temperature sensor for detecting the ambient temperature outside the cabinet body; and the lower end of the circulating air duct is provided with a third temperature sensor for detecting the temperature in the circulating air duct.

[0017] As a preferred scheme of the above scheme and on the basis of the above scheme: among the other side walls of the cabinet body except the first side wall, one side wall is provided with a second air inlet communicating with the mounting space and the outside of the cabinet body, and a third switch device capable of closing or opening the second air inlet is further arranged on the second air inlet.

[0018] On the basis of the above scheme and as a preferred scheme of the above scheme: the heat sink comprises a first heat-conducting base body, the first array of heat dissipation fins is arranged on the first heat-conducting base body, and the gap between adjacent first heat dissipation fins penetrates along the height direction of the mounting space; and the refrigeration surface of the electronic refrigeration sheet is attached to the first heat-conducting base body.

[0019] On the basis of the above scheme and as a preferred scheme of the above scheme: the heat-conducting device is arranged on the heat-generating surface of the electronic refrigeration sheet and is used for dissipating heat from the heat-generating surface of the electronic refrigeration sheet.

[0020] On the basis of the above scheme and as a preferred scheme of the above scheme: the heat-conducting device comprises a heat-conducting device, one end of the heat-conducting device is in heat-conducting contact with the heat-generating surface of the electronic refrigeration sheet, and the other end of the heat-conducting device extends to the outside of the cabinet body.

[0021] On the basis of the above scheme and as a preferred scheme of the above scheme: the heat-conducting device comprises a heat-conducting main body, the heat-conducting main body is made of metal, the heat-conducting main body is in a hollow structure, and a phase-change heat-conducting material is filled in the hollow structure; the side surface of one end of the heat-conducting main body is attached to the heat-generating surface of the electronic refrigeration sheet, and the other end of the heat-conducting main body extends to the outside of the cabinet body; and the heat-conducting main body is provided with a second heat-conducting base body at one end in the circulating air duct, and a second array of heat dissipation fins is arranged on the second heat-conducting base body.

[0022] On the basis of the above scheme and as a preferred scheme of the above scheme: a heat insulation layer is arranged on the heat-conducting main body in the mounting space.

[0023] On the basis of the above scheme and as a preferred scheme of the above scheme: further comprising a controller, the controller is connected to the circulating fan, the auxiliary fan, the first temperature sensor, and the electronic refrigeration sheet.

[0024] In order to overcome some deficiencies of the conventional server heat dissipation mainly relying on forced air cooling technology or using forced air cooling technology to forcibly generate cold air for cooling, the present application has the following beneficial effects: The combined heat dissipation device of the server provides a new heat dissipation means that can be applied to server equipment heat dissipation.

[0025] The combined heat dissipation device of the server of the present application is arranged in the height direction by multiple support layers, and then the support layers support and install the server or components (such as switches). The installation space inside the cabinet body is in a relatively closed state. In the case that the ambient temperature is low and the server is in a low-power and low-heat state, the circulating fan can work naturally. The circulating fan blows air to form a flowing air current flowing from the bottom to the top inside the installation space. The flowing air current passes through the server and carries away the heat of the server to reduce the temperature. Then the hot air current is sent from the first air outlet at the top of the installation space into the circulating air duct and excluded to the outside.

[0026] Since the airflow inside the installation cavity flows from the bottom to the top, the airflow will rise in temperature when flowing upwards due to the heat generated by the server. When the temperature at a certain height inside the installation space is relatively high and the airflow driven by the circulating fan cannot further reduce the temperature, the auxiliary fan and the electronic cooling fin at the corresponding height position start to work to reduce the temperature of the airflow at the current height position and achieve temperature reduction at the height level.

[0027] The first temperature sensor detects points on the server to achieve multi-point distributed detection. Through the detection of the temperature response, the temperature at the current height level of the single support layer can be reflected, and the temperature of a certain local server detected by the corresponding first temperature sensor can also be reflected and judged. The first temperature sensor is used to control whether the auxiliary fan or the electronic cooling fin needs to be involved.

[0028] In addition to the purposes, features and advantages described above, the present application has other purposes, features and advantages. The present application will be described in further detail below with reference to the drawings. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0030] Figure 1 The schematic diagram of the combined heat dissipation device of the server of the present application; Figure 2 The application schematic diagram of the combined heat dissipation device of the server of the present application (the cabinet door is hidden in the figure); Figure 3 Another perspective view of the combined heat dissipation device of the server of the present application; Figure 4This is a schematic diagram of the combined heat dissipation device for the server after the cabinet door is hidden; Figure 5 This is a schematic diagram of the circulating air duct after the first side wall of the present application is cut away; Figure 6 This is a schematic diagram of the support layer of this application; Figure 7 This is a schematic diagram of the support layer of the present application from another perspective; Figure 8 A schematic diagram of the heat conduction device of this application; Figure 9 Schematic diagram of the first switch device and the second switch device or the third switch device of the present application.

[0031] Description of reference numerals: 100. Cabinet body; 101. Installation space; 102. First side wall; 103. Side panel; 104. Folding edge; 105. Circulation duct; 106. First air inlet; 107. First air outlet; 108. Second air outlet; 109. Circulation fan; 110. Second side wall; 111. Second air inlet; 112. Blower; 113. Cabinet door 200, support layer; 201, support surface; 202, air hole; 203, auxiliary fan; 204, radiator; 205, first heat-conducting substrate; 206, first heat dissipation fin; 207, electronic cooling plate; 300. First temperature sensor; 400. Human-computer interaction device; 500. Second temperature sensor; 600, a third temperature sensor; 701, valve plate; 702, expansion joint; 800, heat conduction device; 801, heat conductor; 802, heat conduction body; 803, phase change heat conduction material; 804, second heat conduction base; 805, second heat sink fin; 806, heat insulation layer. DETAILED DESCRIPTION

[0032] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0033] It should be noted that when a component is referred to as being "fixed on" or "disposed on" another component, it may be located directly or indirectly on the other component. When a component is referred to as being "connected to" another component, it may be directly or indirectly connected to the other component. The directions or positions indicated by the terms "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the directions or positions shown in the accompanying drawings and are only for the convenience of description and cannot be understood as limitations on this technical solution. The terms "first" and "second" are only used for the purpose of convenience of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0034] See Figures 1-9 The present application discloses a combined heat dissipation device for a server. The combined heat dissipation device for the server provides a new heat dissipation means that can be applied to the heat dissipation of server equipment, and this heat dissipation means can overcome some of the shortcomings of traditional server heat dissipation that mainly relies on forced air cooling technology or uses forced air cooling technology in combination with air conditioning refrigeration technology to force the production of cold air for cooling.

[0035] In the embodiment of the present disclosure, a combined heat dissipation device for a server includes: a cabinet body 100, such as Figures 1-5 As shown, a relatively closed installation space 101 is provided inside it, a circulating air duct 105 is provided on one side of the installation space 101 along the height direction, a first air inlet 106 communicating with the installation space 101 is provided at the upper end of the circulating air duct 105, and the circulating air duct 105 is provided with a first air outlet 107 communicating with the circulating air duct 105 and the outside of the cabinet body 100; a circulating fan 109 is provided at the upper part of the installation space 101, the installation height of the circulating fan 109 is lower than the first air inlet 106, and the circulating fan 109 is used to blow air upward; a plurality of supporting layers 200 are provided in the installation space 101, and the plurality of supporting layers 200 are arranged along the height direction of the installation space 101, as shown in FIG. Figures 6-8As shown, each support layer 200 has a horizontal support surface 201, the support surface 201 is provided with a plurality of hollow wind holes 202, and a plurality of upward blowing auxiliary fans 203 are arranged (matrix arrangement, such as two rows with two or three in each row) below the support layer 200, and a radiator 204 is arranged on the upper side of each auxiliary fan 203, the first heat dissipation fin 206 of the radiator 204 extends to the upper side of the air outlet of the auxiliary fan 203, and an electronic refrigeration sheet 207 is arranged on the radiator 204 for refrigerating the radiator 204; a first temperature sensor 300, the first temperature sensor 300 is an infrared remote sensing temperature detection, a plurality of first temperature sensors 300 are arranged on each support layer 200, and the detection point of the first temperature sensor 300 points to the upper side of the auxiliary fan 203 arrangement area.

[0036] The combined heat dissipation device of the server of the present application arranges a plurality of support layers 200 in the height direction, then uses the support layer 200 to support and install the server or components (such as switches), and the installation space 101 inside the cabinet body 100 is in a relatively closed state, in the case that the ambient temperature is low and the server is in a low power consumption and low heat state, the circulating fan 109 can work naturally, the circulating fan 109 blows air to form a flowing air current flowing from the bottom to the top inside the installation space 101, and the flowing air current passes through the server and carries away the heat of the server to cool it down. Then the hot air current is sent from the first air outlet 107 at the top of the installation space 101 into the circulating air duct 105 and discharged to the outside.

[0037] Because the air current inside the installation cavity flows from the bottom to the top, the air current will rise in temperature when flowing upwards due to the influence of the heat generated by the server, when the temperature at a certain height inside the installation space 101 is relatively high and the air current driven by the circulating fan 109 cannot further reduce the temperature, the auxiliary fan 203 and the electronic refrigeration sheet 207 at the corresponding height position start to work to cool the air current at the current height position and realize temperature reduction at the height level.

[0038] Among them, the detection point of the first temperature sensor 300 points to the server so as to realize multi-point distributed detection, and through the reaction of the detected temperature, both the temperature at the current height level of the single support layer 200 and the temperature of a certain local part of the server detected by the corresponding first temperature sensor 300 can be reflected and judged. Whether the auxiliary fan 203 or the electronic refrigeration sheet 207 needs to be intervened is controlled by the judgment of the first temperature sensor 300.

[0039] In the embodiments of the present disclosure, in order to intelligently achieve the above functions and effects, the combined heat dissipation device of the server further comprises a controller (such as an industrial control board, a new PLC, or the like), which is connected to the circulating fan 109, the auxiliary fan 203, the first temperature sensor 300, and the electronic refrigeration sheet 207.

[0040] In some embodiments, the following control method can be used, which specifically includes the working method of the circulating fan 109, the working method of the auxiliary fan 203, and the circulating method of the flowing air in the installation space 101, and is specifically as follows.

[0041] Working method of the circulating fan 109: During the working process (of the server), the circulating fan 109 is in a long-term starting state. The circulating fan 109 is used to make the flowing air in the installation space 101 always flow upwards to dissipate heat of the server, so as to avoid heat accumulation to cause local temperature rise of the equipment or the device.

[0042] Working method of the auxiliary fan 203: Three threshold values of the detection data of the first temperature sensor 300 are set in advance, which are respectively designated as threshold value one, threshold value two, and threshold value three, wherein the value of the threshold value one is less than the value of the threshold value two, and the value of the threshold value two is less than the value of the threshold value three; and the threshold value one is designated as follows: not higher than (less than or equal to) the threshold value one, which indicates that the heat dissipation at the identified position is in a good state; the threshold value two is higher than the threshold value one but not higher than the threshold value two, which indicates that the identified position is relatively hot, but is still in a temperature state that is considered not to affect the working efficiency of the server; the threshold value three is higher than the threshold value two but lower than the threshold value three, which indicates that the heat dissipation at the identified position is urgently needed, and the current temperature will affect the working efficiency of the server if the temperature reaches (is equal to or greater than) the threshold value three, and an alarm is triggered to remind manual intervention. Meanwhile, the first temperature sensor 300 set for each support layer 200 is divided into zones, and one or more first temperature sensors 300 are designated in the area serviced by each auxiliary fan 203 to detect the temperature value in the serviced area.

[0043] The auxiliary fan 203 is in a default non-working state, detects and obtains the temperature value of the inspected position by the first temperature sensor 300, and records the detection as the first detection (the first detection is a real-time monitoring state), and then judges the values detected by all the first temperature sensors 300, which are specifically as follows. In the first detection, when the values detected by all the first temperature sensors 300 are not higher than the threshold value one, the auxiliary fan 203 is maintained in a non-working state.

[0044] In the first detection, when the value detected by the first temperature sensor 300 is higher than the threshold value one but not higher than the threshold value two, it is determined which support layer 200 the first temperature sensor 300 belongs to, and then all the auxiliary fans 203 in the support layer 200 start to work to blow air upward, and the continuous blowing time is time value one. During the process, the temperature is continuously monitored by the first temperature sensor 300, and the continuous detection process is recorded as the second detection. In the second detection, when the detected temperature value is still higher than the threshold value one but not higher than the threshold value two, the auxiliary fan 203 maintains the working state. When the detected temperature value is lower than the threshold value one within the continuous time value one, only the auxiliary fan 203 corresponding to the first temperature sensor 300 whose detected value is higher than the threshold value one in the first detection maintains the working state, and the remaining auxiliary fans 203 stop working. The working time of the auxiliary fan 203 is time value two. Then, the process is continuously detected, and the detection process is recorded as the third detection. When the detected temperature value is continuously lower than the threshold value one, all the auxiliary fans 203 in the support layer 200 stop working, and then enter the monitoring state in the first detection. When the third detected temperature value is higher than the threshold value one but not higher than the threshold value two, or when the first temperature sensor 300 whose detected temperature value is higher than the threshold value one but not higher than the threshold value two in the second detection or the third detection is different from the first temperature sensor 300 whose detected temperature value is higher than the threshold value one but not higher than the threshold value two in the first detection, the processing mode in the first detection is used for processing.

[0045] In the first detection, or in the second detection, the third detection, when the value detected by the first temperature sensor 300 is higher than the threshold value two but lower than the threshold value three, first determine which support layer 200 the first temperature sensor 300 belongs to, then all the auxiliary fans 203 in the support layer 200 start working to blow air upwards, at the same time, the electronic refrigerating sheet 207 corresponding to the auxiliary fan 203 (above the auxiliary fan 203) starts working to refrigerate until the value detected by the first temperature sensor 300 in the support layer 200 is not higher than the threshold value one within the continuous time value three, the temperature monitoring process in this process is recorded as the fourth detection; then the remaining auxiliary fans 203 and the corresponding electronic refrigerating sheets 207 except the auxiliary fan 203 corresponding to the first temperature sensor 300 whose detected value is higher than the threshold value two but lower than the threshold value three are closed, and the state continues to run and continuously detect (monitor), which is the fifth detection in the monitoring process, when the temperature value continuously maintained in the fourth detection is not higher than the threshold value one and the continuous time value four is maintained for a period of time, the electronic refrigerating sheet 207 stops working, then when the temperature value is not higher than the threshold value one for a period of time of time value five, the auxiliary fan 203 is closed, and the first detection state is restarted; when the first temperature sensor 300 of the current support layer 200 detects a value higher than the threshold value one but not higher than the threshold value two in the fifth detection process, whether it is the same as the first temperature sensor 300 that triggered higher than the threshold value two but lower than the threshold value three last time, the electronic refrigerating sheet 207 and the auxiliary fan 203 corresponding to the first temperature sensor 300 are made to work at the same time, and the control mode of the electronic refrigerating sheet 207 and the auxiliary fan 203 in the fifth detection process is continued; when the first temperature sensor 300 of the current support layer 200 detects a value higher than the threshold value two but lower than the threshold value three in the fifth detection process, the process in the fourth detection is processed.

[0046] In any detection process, when the temperature value detected by the first temperature sensor 300 reaches the threshold value three, the process in the fourth detection is processed and subsequent processing is performed (i.e., first determine which support layer 200 the first temperature sensor 300 belongs to, then all the auxiliary fans 203 in the support layer 200 start working to blow air upwards, at the same time, the electronic refrigerating sheet 207 corresponding to the auxiliary fan 203 (above the auxiliary fan 203) starts working to refrigerate, and the subsequent steps are continued.). At the same time, the duration of reaching the threshold value three is recorded and archived, and in the process, when the duration of reaching the threshold value three is lower than the time value six, only the archive is kept and a reminder is given; when the duration of reaching the threshold value three reaches or is equal to the time value six, an alarm is immediately given and manual intervention is reminded.

[0047] The circulating method of the air flowing in the installation space 101 is as follows: Under the pressure formed by the upward blowing of the circulating fan 109, the heated air flowing to the top of the installation space 101 enters the circulating air duct 105 through the first air inlet 106 and is discharged from the first air outlet 107.

[0048] In the case where the controller is provided, the correspondence relationship among the first temperature sensors 300, the electronic refrigerating sheet 207, and the auxiliary fan 203 is input into the controller in a pre-designated manner, and the detection information of each first temperature sensor 300 is acquired in real time by the controller, and the above-mentioned three threshold value comparisons are performed according to the value (detection temperature value) of the detection information, and the electronic refrigerating sheet 207 and the auxiliary fan 203 are controlled to perform the above-mentioned steps.

[0049] In some embodiments, further, the combined heat dissipation device of the server is further provided with a man-machine interaction device 400 (touch display) and an alarm (buzzer, voice alarm, message push, etc.) connected with the controller, the control parameters can be viewed and modified through the touch display, and the temperature monitoring curve information, the alarm information such as the record of the temperature reaching the third threshold value, the corresponding duration, and the process change can be viewed on the touch display. The alarm can be used for emergency alarm, such as the case where the temperature reaches the third threshold value.

[0050] In the embodiment of the present disclosure, as shown in Figure 5 To set the circulating air duct 105, a side plate 103 is arranged on one side of the installation space 101, the side wall of the installation space 101 adjacent to the side plate 103 is a first side wall 102, the side plate 103 has two folded edges 104 folded in the direction of the first side wall 102 on both sides in the width direction, the folded edges 104 are fixedly (welded) connected with the first side wall 102, and the first side wall 102, the two folded edges 104, and the side plate 103 jointly enclose the circulating air duct 105.

[0051] Further, the first air inlet 106 is arranged at the top end of the side plate 103; the first air outlet 107 is arranged at the bottom end of the first side wall 102, and the first air outlet 107 is further provided with a first switch device capable of closing or opening the first air outlet 107; the bottom end of the side plate 103 is provided with a second air outlet 108 communicating the circulating air duct 105 and the installation space 101, and the second air outlet 108 is further provided with a second switch device capable of closing or opening the second air outlet 108; the outside of the cabinet body 100 is provided with a second temperature sensor 500 for detecting the ambient temperature outside the cabinet body 100; and the lower end of the circulating air duct 105 is provided with a third temperature sensor 600 for detecting the temperature in the circulating air duct 105.

[0052] The air temperature in the environment outside the cabinet body 100 is detected by the second temperature sensor 500, and the air temperature at the lower end of the circulating air duct 105 is detected by the third temperature sensor 600, and a temperature comparison is performed. When the detection value of the second temperature sensor 500 is lower than the detection value of the third temperature sensor 600, the first air outlet 107 is opened by the first switching device, and the second air outlet 108 is closed by the second switching device, so that the air in the circulating air duct 105 is discharged to the outside, and the external air enters the installation space 101 to form a circulating air flow for heat dissipation of the server or server components; when the detection value of the second temperature sensor 500 is higher than the detection value of the third temperature sensor 600, the first air outlet 107 is closed by the first switching device, and the second air outlet 108 is opened by the second switching device, so that the air in the circulating air duct 105 is circulated into the installation space 101 to form a circulating air flow for heat dissipation of the server or server components. Because the air entering the circulating air duct 105 can be cooled by the heat sink 204, the air entering the installation space 101 for cooling is selected, which can not only ensure the cooling and heat dissipation effect, but also play a role in energy saving and consumption reduction. When the temperature comparison is performed, the higher or lower temperature can be set to a comparison interval value (such as 0.5℃, 1℃, etc.), so that the first switching device and the second switching device are not operated in the case where the difference between the air temperature in the circulating air duct 105 and the air temperature outside the cabinet body 100 has little effect on the heat dissipation performance.

[0053] As shown in Figure 3 and Figure 5 In order to facilitate the air in the environment outside the cabinet body 100 to enter the installation space 101, one of the side walls other than the first side wall 102 of the cabinet body 100 is provided with a second air inlet 111 communicating the installation space 101 and the outside of the cabinet body 100, the side wall where the second air inlet 111 is arranged is designated as the second side wall 110, and the second air inlet 111 is further provided with a third switching device capable of closing or opening the second air inlet 111. Generally, the opening and closing state of the second air inlet 111 is consistent with the opening and closing state of the first air outlet 107, that is, during the process of discharging the air in the circulating air duct 105 to the outside, the external air enters the inside of the installation space 101 from the second air inlet 111.

[0054] In some embodiments, a pressure sensor is further arranged in the installation space 101 to detect the air pressure, and when the detected pressure value is lower than a certain range, the second air inlet 111 is opened to supplement the air.

[0055] In the case where the controller is arranged, the control of the first switching device, the second switching device and the third switching device, and the detection reading and comparison of the second temperature sensor 500 and the third temperature sensor 600 are all completed by the controller. The pressure sensor is also connected to the controller.

[0056] In some embodiments, as shown in Figure 9 The first switch device, the second switch device and the third switch device are provided with a valve plate 701 and a telescopic device 702 (e.g. an electric cylinder) for controlling the sliding of the valve plate 701. The valve plate 701 of the first switch device is arranged at the first air outlet 107, and the valve plate 701 is driven to move by the telescopic device 702 to open or close the first air outlet 107. The valve plate 701 of the second switch device is arranged at the second air outlet 108, and the valve plate 701 is driven to move by the telescopic device 702 to open or close the second air outlet 108. The valve plate 701 of the third switch device is arranged at the second air inlet 111, and the valve plate 701 is driven to move by the telescopic device 702 to open or close the second air inlet 111. In the case of a controller, the telescopic device 702 is controlled by the controller.

[0057] In some embodiments, since the circulating air inside the installation space 101 will eventually enter the circulating air duct 105, the side plate 103 can be provided with heat insulation cotton.

[0058] In the embodiments of the present disclosure, as shown in Figure 8 The heat sink 204 includes a first heat-conducting base 205, and an array of first heat dissipation fins 206 is arranged on the first heat-conducting base 205. The gaps between adjacent first heat dissipation fins 206 are through in the height direction of the installation space 101 to facilitate air flow and form heat exchange. The cooling surface of the electronic cooling sheet 207 is attached to the first heat-conducting base 205 (which can be fixed by heat-conducting silicone adhesive).

[0059] In the embodiments of the present disclosure, the heat generating surface of the electronic cooling sheet 207 is provided with a heat conduction device 800 for dissipating heat from the heat generating surface of the electronic cooling sheet 207.

[0060] The heat conduction device 800 includes a heat conduction device 801 (aluminum alloy metal block), one end of which is in heat-conducting contact with the heat generating surface of the electronic cooling sheet 207 (which can be connected together adjacent to multiple), and the other end (through the side plate 103) extends to the outside of the cabinet body 100. The heat conduction device 801 guides the heat generated by the heat generating surface of the electronic cooling sheet 207 to the outside of the cabinet body 100, which can avoid affecting the air flow in the installation space 101.

[0061] Further, the heat conduction device 801 comprises a heat conduction body 802, which is made of metal and has a hollow structure inside, and the hollow structure is filled with phase change heat conduction material 803. The phase change heat conduction material 803 has good heat conduction effect and large heat capacity, which can better absorb heat and conduct heat, and reduce the temperature rise of the heat conduction body 802. One end of the heat conduction body 802 is in contact with the heat generating surface of the electronic refrigeration sheet 207, and the other end extends to the outside of the cabinet body 100. The heat conduction body 802 is arranged in the circulating air duct 105, and a second heat conduction body 804 is arranged at one end of the heat conduction body 802. The second heat conduction body 804 is provided with a plurality of second heat dissipation fins 805 arranged in an array. The second heat dissipation fins 805 can improve the heat dissipation capacity of the heat conduction body 802.

[0062] Further, the heat conduction body 802 arranged in the installation space 101 is provided with a heat insulation layer 806. The heat insulation layer 806 avoids the contact and heat transfer between the heat conduction body 802 and the electronic refrigeration sheet 207, and reduces the ability of the heat conduction body 802 to affect the temperature inside the installation space 101.

[0063] In some embodiments, as Figure 1 , the cabinet body 100 is provided with a cabinet door 113, as Figure 4 and Figure 5 , the first air inlet 106 is provided with an air supply fan 112 for supplying air to the circulating air duct 105, and the first air outlet 107 and the second air outlet 108 are provided with filter screen structures (conventional structures, not shown in the figure).

[0064] In summary, the combined heat dissipation device of the server can effectively solve the problem of vertical temperature gradient in the installation space 101. The device can realize large-area coverage through air flow, and the air flow rate can be targetedly improved through the circulating fan 109, so as to realize high heat exchange efficiency, accurate and targeted heat dissipation service, and targeted energy consumption scheme. The device can realize energy saving and heat dissipation effect, efficiently and accurately suppress local hot spots, and does not have the disadvantages of low coverage, high energy consumption and poor heat exchange effect of ordinary pipeline water cooling structure. The device has intelligent control ability to adapt to dynamic load changes, and finally ensures safe and reliable operation of the equipment, and significantly improves the overall heat dissipation energy efficiency.

[0065] The above is only a preferred embodiment of the present application, and is not used to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A combined heat dissipation device for a server, characterized in that: include: The cabinet body has an installation space provided therein, a circulating air duct provided on one side of the installation space along the height direction, a first air inlet provided at the upper end of the circulating air duct communicating with the installation space, and a first air outlet provided on the circulating air duct communicating with the outside of the cabinet body; a circulation fan, which is arranged at the upper part of the installation space, the installation height of the circulation fan is lower than the first air inlet, and the circulation fan is used to blow air upward; A plurality of support layers are arranged in the installation space, the plurality of support layers are arranged in a height direction, each support layer has a support surface, the entire support surface is provided with a plurality of hollow air holes, a plurality of upward blowing auxiliary fans are arranged under the support layer, and a radiator is provided on the upper side of each auxiliary fan, the first heat dissipation fin of the radiator extends to the upper side of the air outlet of the auxiliary fan, and the radiator is provided with an electronic cooling fin for cooling the radiator; The first temperature sensor is an infrared remote sensing temperature sensor. A plurality of the first temperature sensors are provided on each of the support layers. The detection point of the first temperature sensor points to the area above the auxiliary fan arrangement area.

2. The combined heat dissipation device for a server according to claim 1, characterized in that: A side panel is provided on one side of the installation space, and the side wall of the installation space adjacent to the side panel is a first side wall. Both sides of the side panel in the width direction have folded edges folded toward the first side wall, and the folded edges are fixedly connected to the first side wall. The first side wall, the two folded edges and the side panel together form the circulating air duct.

3. The combined heat dissipation device for a server according to claim 2, characterized in that: The first air inlet is provided at the top end of the side panel; The first air outlet is provided at the bottom end of the first side wall, and the first air outlet is further provided with a first switch device capable of closing or opening the first air outlet; A second air outlet communicating with the circulating air duct and the installation space is provided at the bottom end of the side panel, and a second switch device capable of closing or opening the second air outlet is also provided on the second air outlet; A second temperature sensor is provided on the outside of the cabinet body for detecting the ambient temperature outside the cabinet body; A third temperature sensor for detecting the temperature in the circulating air duct is provided at the lower end of the circulating air duct.

4. The combined heat dissipation device for a server according to claim 3, characterized in that: Among the other side walls of the cabinet body other than the first side wall, one side wall is connected to the installation space and the second air inlet outside the cabinet body, and the second air inlet is also provided with a third switch device capable of closing or opening the second air inlet.

5. The combined heat dissipation device for a server according to claim 1 or 3, characterized in that: The heat sink comprises a first heat-conducting base, the first heat-dissipating fin array is arranged on the first heat-conducting base, and the gaps between adjacent first heat-dissipating fins are continuous along the height direction of the installation space; The cooling surface of the electronic cooling sheet is attached to the first heat-conducting base.

6. The combined heat dissipation device for a server according to claim 5, characterized in that: The heating surface of the electronic refrigeration plate is provided with a heat conducting device, and the heat conducting device is used to dissipate heat for the heating surface of the electronic refrigeration plate.

7. The combined heat dissipation device for a server according to claim 6, characterized in that: The heat conduction device includes a heat conductor, one end of which is in heat-conducting contact with the heating surface of the electronic refrigeration plate, and the other end of which extends to the outside of the cabinet body.

8. The combined heat dissipation device for a server according to claim 7, characterized in that: The heat conductor comprises a heat conducting body, the heat conducting body is made of metal, the interior of the heat conducting body is a cavity structure, and the cavity structure is filled with a phase change heat conducting material; The side surface of one end of the heat-conducting body is in contact with the heat-generating surface of the electronic refrigeration plate, and the other end extends to the outside of the cabinet body; A second heat-conducting base is provided at one end of the heat-conducting body in the circulating air duct, and a second heat-dissipating fin is arranged in an array on the second heat-conducting base.

9. The combined heat dissipation device for a server according to claim 7, characterized in that: A heat insulation layer is provided on the portion of the heat-conducting body located in the installation space.

10. The combined heat dissipation device for a server according to claim 1, characterized in that: The system further includes a controller connected to the circulation fan, the auxiliary fan, the first temperature sensor and the electronic refrigeration plate.

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