Flexible circuit board swing device, swing method, and electronic component heat spreader

Abstract

The application discloses a flexible circuit board swing device, a swing method and an electronic element heat sink, wherein the swing device comprises a mounting seat, a flexible circuit board, a first permanent magnet, a second permanent magnet and a control mainboard; the first permanent magnet, the flexible circuit board and the second permanent magnet are fixed on the same side of the mounting seat; the polarity of the adjacent magnetic poles of the first permanent magnet and the second permanent magnet is opposite; the flexible circuit board is etched with a planar spiral coil, and the first coil port and the second coil port of the planar spiral coil are connected to the control mainboard; the control mainboard is used for alternatingly electrifying the planar spiral coil from the first coil port or the second coil port, so that the flexible circuit board reciprocating swings in the magnetic field of the permanent magnet. The swing device can reduce the heat dissipation cost and the heat dissipation noise, and effectively improves the heat dissipation efficiency. The application relates to the technical field of electronic heat dissipation.

Description

Technical Field

[0001] This application relates to the field of electronic heat dissipation technology, and in particular to a flexible circuit board swinging device, swinging method and heat sink for electronic components. Background Technology

[0002] In order to protect electronic components and extend their service life, heat dissipation of electronic components in electrical appliances that are prone to heat generation (such as resistors, capacitors, transformers, etc.) has become one of the key concerns for relevant personnel.

[0003] Currently, related technologies are usually based on air cooling or liquid cooling to dissipate heat from electronic components. However, because these heat dissipation methods involve motor shaft structures and / or mechanical transmission structures, they require more components, have higher heat dissipation costs, and suffer from mechanical losses, higher heat dissipation noise, and lower heat dissipation efficiency.

[0004] In summary, the technical problems existing in the relevant technologies need to be improved. Summary of the Invention

[0005] The purpose of this invention is to at least partially solve one of the technical problems existing in the related art.

[0006] Therefore, the main objective of this invention is to provide a flexible circuit board swinging device, a swinging method, and an electronic component heat sink. The swinging device is used to dissipate heat from electronic components that are prone to overheating, which can reduce heat dissipation costs and noise, and effectively improve heat dissipation efficiency.

[0007] To achieve the above objectives, one aspect of this application provides a flexible circuit board swinging device, including a mounting base, a flexible circuit board, a first permanent magnet, a second permanent magnet, and a control main board;

[0008] The first permanent magnet, the flexible circuit board, and the second permanent magnet are fixed on the same side of the mounting base;

[0009] The adjacent magnetic pole of the first permanent magnet has the opposite polarity to the adjacent magnetic pole of the second permanent magnet, and the adjacent magnetic pole is the magnetic pole of the first permanent magnet or the second permanent magnet that is adjacent to the flexible circuit board;

[0010] The flexible circuit board is etched with a planar spiral coil, and the first coil port and the second coil port of the planar spiral coil are connected to the control motherboard. The control motherboard is used to alternately energize the planar spiral coil from the first coil port or the second coil port so that the flexible circuit board oscillates back and forth in the magnetic field of a permanent magnet, and the magnetic field of the permanent magnet is the magnetic field formed between the first permanent magnet and the second permanent magnet.

[0011] In some embodiments, the mounting base is a U-shaped mounting base, which includes a first mounting groove, a second mounting groove, and a third mounting groove;

[0012] The first mounting groove is located on the first side wall of the U-shaped mounting base, the second mounting groove is located in the middle of the U-shaped mounting base, and the third mounting groove is located on the second side wall of the U-shaped mounting base;

[0013] The first permanent magnet is fixed in the first mounting groove, the flexible circuit board is fixed in the second mounting groove, and the second permanent magnet is fixed in the third mounting groove.

[0014] In some embodiments, the opening of the second mounting groove is rounded.

[0015] In some embodiments, the angle between the center horizontal plane of the first mounting groove and the center horizontal plane of the U-shaped mounting base is a first tilt angle, and the angle between the center horizontal plane of the second mounting groove and the center horizontal plane of the U-shaped mounting base is a second tilt angle; the first tilt angle is equal to the second tilt angle.

[0016] In some embodiments, the flexible circuit board includes a tail portion, a fixed portion, and a free portion;

[0017] The first coil port and the second coil port of the planar spiral coil are connected to the control motherboard via the tail section;

[0018] The fixing part is fixedly connected to the second mounting groove in the mounting base;

[0019] The free part is equipped with a Hall sensor, which is connected to the control main board via the planar helical coil.

[0020] To achieve the above objectives, another aspect of this application provides a swinging method applied to the aforementioned flexible circuit board swinging device, comprising:

[0021] The control board obtains the current indication information, which is a first swing direction or a second swing direction. The first swing direction is the direction in which the flexible circuit board approaches the first permanent magnet, and the second swing direction is the direction in which the flexible circuit board approaches the second permanent magnet.

[0022] If the current indication information is the first swing direction, the control motherboard energizes the planar spiral coil from the first coil port to form a first electromagnetic field, and drives the flexible circuit board to swing along the first swing direction by the electromagnetic force generated by the first electromagnetic field and the magnetic field of the permanent magnet.

[0023] Alternatively, if the current indication information is the second swing direction, the control motherboard energizes the planar spiral coil from the second coil port to form a second electromagnetic field, and the electromagnetic force generated by the second electromagnetic field and the magnetic field of the permanent magnet drives the flexible circuit board to swing along the second swing direction.

[0024] In some embodiments, the method further includes:

[0025] The control board acquires threshold data corresponding to the target swing position, and acquires the current Hall voltage data of the flexible circuit board through the Hall sensor. The target swing position is used to characterize the swing position of the flexible circuit board at the maximum swing arc.

[0026] The control motherboard performs threshold analysis on the current Hall voltage data based on the threshold data to obtain the threshold analysis result;

[0027] If the threshold analysis result indicates that the current Hall voltage data is less than the threshold data, then the process returns to the steps of obtaining the threshold data corresponding to the target swing position from the control motherboard and obtaining the current Hall voltage data of the flexible circuit board through the Hall sensor; or, if the threshold analysis result indicates that the current Hall voltage data is equal to the threshold data, then the swing direction in the current indication information is updated to obtain the updated indication information.

[0028] In some embodiments, the control motherboard energizes the planar helical coil from the target coil port, including:

[0029] The control board acquires the current swing demand value, which is used to indicate the swing frequency, swing arc, or air volume generated by the swing of the flexible circuit board.

[0030] The control board analyzes the current swing demand value and obtains the current value corresponding to the current swing demand value. The current value is positively correlated with the current swing demand value.

[0031] The control motherboard supplies power to the planar spiral coil from the target coil port according to the current value.

[0032] The target coil port is either the first coil port or the second coil port.

[0033] In some embodiments, the method further includes:

[0034] The control motherboard acquires the target swing position and obtains the current Hall voltage data of the flexible circuit board through the Hall sensor;

[0035] The control board performs position analysis on the current Hall voltage data to obtain the current swing position of the flexible circuit board.

[0036] The control motherboard performs adaptive power-on analysis on the current swing position based on the target swing position to obtain an adaptive current value. The adaptive current value is positively correlated with the swing position difference, which is the absolute position difference between the target swing position and the current swing position.

[0037] The control motherboard supplies power to the planar spiral coil from the target coil port according to the adaptive current value;

[0038] The target coil port is either the first coil port or the second coil port.

[0039] To achieve the above objectives, another aspect of the embodiments of this application proposes an electronic component heat sink, including an electronic component requiring heat dissipation and several of the aforementioned flexible circuit board swinging devices.

[0040] To achieve the above objectives, another aspect of this application provides an electronic device, which includes a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the above-described method.

[0041] To achieve the above objectives, another aspect of the embodiments of this application proposes a computer-readable storage medium storing a computer program that, when executed by a processor, implements the above-described method.

[0042] To achieve the above objectives, another aspect of this application provides a computer program product, including a computer program that, when executed by a processor, implements the above-described method.

[0043] The embodiments of this application include at least the following beneficial effects:

[0044] This application provides a flexible circuit board swinging device, a swinging method, and an electronic component heat sink. The swinging device includes a mounting base, a flexible circuit board, a first permanent magnet, a second permanent magnet, and a control motherboard. The first permanent magnet, the flexible circuit board, and the second permanent magnet are fixed to the same side of the mounting base. The adjacent magnetic poles of the first permanent magnet and the second permanent magnet have opposite polarities, and the adjacent magnetic poles are the poles of the first or second permanent magnet adjacent to the flexible circuit board. The flexible circuit board is etched with a planar spiral coil, and the first and second coil ports of the planar spiral coil are connected to the control motherboard. The control motherboard is used to alternately energize the planar spiral coil from the first or second coil port, causing the flexible circuit board to swing back and forth in the magnetic field of the permanent magnet, where the magnetic field is the magnetic field formed between the first and second permanent magnets. This swinging device fixes a permanent magnet and a flexible circuit board on the same side of the mounting base, and controls the main board to alternately energize the planar spiral coil etched on the flexible circuit board, causing the flexible circuit board to reciprocate in the magnetic field of the permanent magnet. It uses electromagnetic force to drive airflow to dissipate heat from electronic components. Not only are the required parts simple and few in number, effectively reducing heat dissipation costs, but it can also avoid the mechanical losses that exist in air cooling or water cooling, which helps to reduce heat dissipation noise and improve heat dissipation efficiency. Attached Figure Description

[0045] Figure 1 This is a three-dimensional structural schematic diagram of the flexible circuit board swing device provided in the embodiments of this application;

[0046] Figure 2 This is a schematic diagram of the axial structure assembly relationship of the flexible circuit board swing device provided in the embodiments of this application;

[0047] Figure 3 This is a schematic diagram of the side structure assembly relationship of the flexible circuit board swing device provided in the embodiments of this application;

[0048] Figure 4 This is a side view of the mounting base provided in an embodiment of this application;

[0049] Figure 5 This is a schematic diagram of the axial structure of the mounting base provided in the embodiments of this application;

[0050] Figure 6 This is a schematic flowchart of a swinging method provided in an embodiment of this application;

[0051] Figure 7 This is a schematic diagram of the structure of the heat sink for electronic components provided in the embodiments of this application;

[0052] Figure 8This is a schematic diagram of the hardware structure of the electronic device provided in the embodiments of this application. Detailed Implementation

[0053] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit it. In the following description, when referring to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with those of this application; they are merely examples of apparatuses and methods consistent with some aspects of the embodiments of this application as detailed in the appended claims.

[0054] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of this application only and is not intended to limit this application.

[0055] Currently, relevant technologies typically rely on air cooling or liquid cooling to dissipate heat from electronic components. Air cooling uses a fan to circulate air and dissipate heat, while liquid cooling uses a pump to circulate coolant and dissipate heat. Both methods involve a motor shaft structure and / or mechanical transmission, which have several drawbacks.

[0056] 1) Mechanical transmission structures (such as gear transmission components) are prone to mechanical wear and generate significant heat dissipation and noise.

[0057] 2) The motor in the motor shaft structure is difficult to start in high or low temperature environments;

[0058] 3) The motor in the motor shaft structure and / or the gear in the mechanical transmission structure are prone to generating high heat during operation, which has a negative impact on the heat dissipation of electronic components, resulting in poor heat dissipation of electronic components;

[0059] 4) In air-cooled heat dissipation, the fan blades are prone to dust accumulation, which leads to reduced heat dissipation.

[0060] 5) Air-cooled and liquid-cooled heat dissipation equipment have many components, resulting in higher manufacturing costs and larger installation space requirements, which means higher heat dissipation costs.

[0061] 6) Liquid pumps and liquid cooling pipelines in liquid cooling systems are complex and pose a risk of leakage.

[0062] Furthermore, in practical applications, air-cooled and liquid-cooled heat dissipation equipment often experience frequent start-stop phenomena, such as frequent start-stop of cooling fans and motor shafts. The force generated by this frequent start-stop phenomenon can damage internal mechanical moving parts or motor shaft moving parts, thus limiting the service life of the heat dissipation equipment.

[0063] It should be noted that the aforementioned related technologies are only used to assist in understanding the technical solutions of this application and do not mean that they belong to the publicly disclosed prior art.

[0064] In view of this, the present application provides a method that fixes a permanent magnet and a flexible circuit board on the same side of a mounting base, and controls the main board to alternately energize the planar spiral coil etched on the flexible circuit board, causing the flexible circuit board to reciprocate in the magnetic field of the permanent magnet. The electromagnetic force drives the airflow to dissipate heat from the electronic components. This method not only requires simple and fewer components, effectively reducing heat dissipation costs, but also avoids the mechanical losses and heat generation that exist in air cooling or water cooling, which helps to reduce heat dissipation noise and improve heat dissipation efficiency.

[0065] Furthermore, the swinging device alternately powers the planar spiral coil by controlling the main board. The electromagnetic force generated by the interaction between the electromagnetic field generated by the energized planar spiral coil and the electromagnetic field of the permanent magnet drives the flexible circuit board to swing. This can avoid the situation where the motor in the motor shaft structure is difficult to start in high or low temperature environments, and can also avoid the risk of leakage caused by complex liquid pumps and liquid pump pipelines.

[0066] Furthermore, in practical applications, the oscillating device can remove dust by reciprocating the oscillation of the flexible circuit board, thereby achieving dust-free heat dissipation and improving heat dissipation efficiency. Specifically, the energizing current value can be analyzed by the oscillation frequency required to remove dust, and the planar spiral coil can be energized based on the energizing current value, which can realize high-frequency oscillation of the flexible circuit board and remove dust.

[0067] Furthermore, the swing device uses the elastic deformation of the flexible circuit board under the influence of electromagnetic force to drive airflow and achieve heat dissipation for electronic components. Its absence of mechanical transmission structure and motor shaft structure can suppress damage to moving parts caused by frequent start-stop phenomena, effectively improving the service life of the swing device in terms of heat dissipation.

[0068] This application can be used in a wide variety of general-purpose or special-purpose computer system environments or configurations. Examples include: personal computers, server computers, handheld or portable devices, tablet devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer electronics devices, network PCs, minicomputers, mainframe computers, and distributed computing environments including any of the above systems or devices. This application can be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc., that perform specific tasks or implement specific abstract data types. This application can also be practiced in distributed computing environments where tasks are performed by remote processing devices connected via a communication network. In distributed computing environments, program modules can reside in local and remote computer storage media, including storage devices.

[0069] Reference Figures 1 to 3 This application provides a flexible circuit board swinging device, including a mounting base 110, a flexible circuit board 120, a first permanent magnet 131, a second permanent magnet 132, and a control main board 140;

[0070] The first permanent magnet 131, the flexible circuit board 120, and the second permanent magnet 132 are fixed on the same side of the mounting base 110;

[0071] The adjacent magnetic pole of the first permanent magnet 131 has opposite polarity to the adjacent magnetic pole of the second permanent magnet 132, and the adjacent magnetic pole is the magnetic pole of the first permanent magnet 131 or the second permanent magnet 132 that is adjacent to the flexible circuit board 120.

[0072] The flexible circuit board 120 is etched with a planar spiral coil 1204. The first coil port and the second coil port of the planar spiral coil 1204 are connected to the control motherboard 140. The control motherboard 140 is used to alternately energize the planar spiral coil 1204 from the first coil port or the second coil port, so that the flexible circuit board 120 oscillates back and forth in the permanent magnet magnetic field, which is the magnetic field formed between the first permanent magnet 131 and the second permanent magnet 132.

[0073] In this embodiment, the first permanent magnet 131 and the second permanent magnet 132 can be mounted and fixed on the same side of the mounting base 110, and a flexible circuit board 120 is mounted and fixed between the first permanent magnet 131 and the second permanent magnet 132. The flexible circuit board 120 can specifically be an FPCB (Flexible Printed Circuit Board). The first permanent magnet 131 includes a first magnet 1311 and a second magnet 1312, while the second permanent magnet 132 includes a third magnet 1321 and a fourth magnet 1322. The polarity of the second magnet 1312 is adjacent to the magnetic pole of the first permanent magnet 131, and the polarity of the third magnet 1321 is adjacent to the magnetic pole of the second permanent magnet 132.

[0074] It is understood that the flexible circuit board swinging device can satisfy the condition that the adjacent magnetic poles of the first permanent magnet 131 and the adjacent magnetic poles of the second permanent magnet 132 have opposite polarities in various ways. For example, in the first embodiment, the first magnet 1311 and the third magnet 1321 can be N-pole magnets, while the second magnet 1312 and the fourth magnet 1322 can be S-pole magnets. Alternatively, in the second embodiment, the first magnet 1311 and the third magnet 1321 can be S-pole magnets, while the second magnet 1312 and the fourth magnet 1322 can be N-pole magnets. This application does not impose any limitations on this.

[0075] It should be noted that the planar spiral coil 1204 is used to generate an electromagnetic field based on the current provided by the control motherboard 140 after being energized, while the first coil port ( Figure 1 (not shown) and second coil port ( Figure 1 (Not shown) is the interface of the planar helical coil 1204; while the control motherboard 140 can be a motherboard with a control chip (such as an MCU) installed.

[0076] In one feasible implementation, this embodiment of the application takes the first magnet 1311 and the third magnet 1321 as N-pole magnets and the second magnet 1312 and the fourth magnet 1322 as S-pole magnets as an example. If the current provided by the control motherboard 140 is input from the first coil port (i.e., the current direction is from the first coil port through the planar spiral coil 1204 to the second coil port), the electromagnetic field generated by the planar spiral coil 1204 in the flexible circuit board 120 can drive the flexible circuit board 120 to swing along the direction close to the second permanent magnet 132 under the interaction of the permanent magnet magnetic field; or, if the current provided by the control motherboard 140 is input from the second coil port (i.e., the current direction is from the second coil port through the planar spiral coil 1204 to the first coil port), the electromagnetic field generated by the planar spiral coil 1204 in the flexible circuit board 120 can drive the flexible circuit board 120 to swing along the direction close to the first permanent magnet 131 under the interaction of the permanent magnet magnetic field.

[0077] It is worth mentioning that, since the direction and polarity of the magnetic field of the planar spiral coil 1204 are related to the direction of the current after it is energized, this embodiment does not impose any restrictions on the swing direction of the flexible circuit board 120 when the control motherboard 140 energizes the coil port. It can be flexibly set according to the actual situation. For example, the swing direction of the flexible circuit board 120 can be adjusted according to the coil winding direction of the planar spiral coil 1204 and the adjustment of the current input to the first coil port or the second coil port. In another feasible embodiment, after changing the coil winding direction of the planar spiral coil 1204 on the flexible circuit board 120, the current provided by the control motherboard 140 is still input from the first coil port. At this time, the electromagnetic field generated by the planar spiral coil 1204 in the flexible circuit board 120 can drive the flexible circuit board 120 to swing along the direction close to the first permanent magnet 131 under the interaction of the magnetic field of the permanent magnet.

[0078] Continue to refer to Figure 3 In some embodiments, the mounting base 110 is a U-shaped mounting base 110, which includes a first mounting groove 1102, a second mounting groove 1103 and a third mounting groove 1101;

[0079] The first mounting groove 1102 is placed on the first side wall of the U-shaped mounting base 110, the second mounting groove 1103 is placed in the middle of the U-shaped mounting base 110, and the third mounting groove 1101 is placed on the second side wall of the U-shaped mounting base 110.

[0080] The first permanent magnet 131 is fixed in the first mounting groove 1102, the flexible circuit board 120 is fixed in the second mounting groove 1103, and the second permanent magnet 132 is fixed in the third mounting groove 1101.

[0081] Reference Figure 4 In some embodiments, the opening of the second mounting groove 1103 is rounded.

[0082] In some embodiments, the angle between the center horizontal plane of the first mounting groove 1102 and the center horizontal plane of the U-shaped mounting base 110 is a first tilt angle, and the angle between the center horizontal plane of the second mounting groove 1103 and the center horizontal plane of the U-shaped mounting base 110 is a second tilt angle; the first tilt angle is equal to the second tilt angle.

[0083] Continue to refer to Figure 1 , Figure 2 , Figure 3 and Figure 5 In some embodiments, the flexible circuit board 120 includes a tail portion 1203, a fixed portion 1202, and a free portion 1201;

[0084] The first coil port and the second coil port of the planar spiral coil 1204 are connected to the control motherboard 140 through the tail 1203;

[0085] The fixing part 1202 is fixedly connected to the second mounting groove 1103 in the mounting base 110;

[0086] The free part 1201 is provided with a Hall sensor 1205, which is connected to the control main board 140 via the planar spiral coil 1204.

[0087] In this embodiment, the opening of the second mounting groove 1103 can be rounded. The rounded opening of the second mounting groove 1103 avoids repeated bending of the flexible circuit board 120 during the reciprocating swing, thereby preventing cracking on the surface of the flexible circuit board 120 and improving the service life of the flexible circuit board 120.

[0088] It is understandable that the first mounting groove 1102 and the second mounting groove 1103 on the U-shaped mounting base 110 can form a certain mirror angle with the center horizontal plane of the main body of the U-shaped mounting base 110 (e.g., Figure 4 Angle β), so that the center plane of the first mounting groove 1102 is horizontal ( Figure 4 (not shown in the image) and the center horizontal plane of the U-shaped mounting base 110 (i.e. Figure 4 The red dashed and solid lines in the diagram represent the first tilt angle; the contents of the second mounting groove 1103 are similar to those of the first mounting groove 1102, and can be easily deduced by analogy. By mounting and fixing the permanent magnet through the first mounting groove 1102 and the second mounting groove 1103 with the same tilt angle, the U-shaped mounting base 110 and the permanent magnet can present an overall horn-expanded shape, which is beneficial to increasing the maximum angle of the reciprocating swing of the flexible circuit board 120 and increasing the amount of airflow driven by the flexible circuit board 120 during reciprocating swing.

[0089] It should be noted that the first and second coil ports of the planar spiral coil 1204 can each extend a wire etched in the flexible circuit board 120, and the wire is connected to the control main board 140 via the tail 1203 of the flexible circuit board 120; the fixing part 1202 is used to install and fix the flexible circuit board 120 into the second mounting groove 1103 on the mounting base 110; the Hall sensor 1205 on the free part 1201 is used to detect the Hall voltage data of the flexible circuit board 120 under the magnetic field and / or electromagnetic field of the permanent magnet, and send the detected Hall voltage data to the control main board 140 via the planar spiral coil 1204.

[0090] Figure 6 This is an optional flowchart of the swinging method provided in the embodiments of this application. Figure 6 The method described above is applied to the flexible circuit swing device, and may include, but is not limited to, steps S610 to S630.

[0091] S610, The control motherboard 140 obtains the current indication information, the indication information being a first swing direction or a second swing direction, the first swing direction being the direction in which the flexible circuit board 120 approaches the first permanent magnet 131, and the second swing direction being the direction in which the flexible circuit board 120 approaches the second permanent magnet 132.

[0092] S620. If the current indication information is the first swing direction, the control motherboard 140 energizes the planar spiral coil 1204 from the first coil port to form a first electromagnetic field. The electromagnetic force generated by the first electromagnetic field and the magnetic field of the permanent magnet drives the flexible circuit board 120 to swing along the first swing direction.

[0093] S630, or if the current indication information is the second swing direction, the control motherboard 140 energizes the planar spiral coil 1204 from the second coil port to form a second electromagnetic field, and drives the flexible circuit board 120 to swing along the second swing direction through the electromagnetic force generated by the second electromagnetic field and the magnetic field of the permanent magnet.

[0094] In this embodiment of the application, during the swinging process of the flexible circuit board 120, the control motherboard 140 can obtain indication information in real time, and maintain or adjust the swinging direction of the flexible circuit board 120 according to the currently obtained indication information, so as to realize the reciprocating swing of the flexible circuit board 120.

[0095] For example, in this embodiment of the application, taking the flexible circuit board 120 swinging along the first swing direction during the current swing process as an example, if the current indication information is the first swing direction, it means that the flexible circuit board 120 does not need to adjust the swing direction at the current time point. The control motherboard 140 still supplies power to the planar spiral coil 1204 from the first coil port, so that the electromagnetic force generated by the first electromagnetic field formed by the planar spiral coil 1204 under the interaction of the permanent magnet magnetic field drives the flexible circuit board 120 to keep swinging along the first swing direction. Alternatively, if the current indication information is the second swing direction, it means that the flexible circuit board 120 needs to adjust the swing direction at the current time point. The control motherboard 140 switches from supplying power to the planar spiral coil 1204 from the first coil port to supplying power to the planar spiral coil 1204 from the second coil port, so that the electromagnetic field generated by the planar spiral coil 1204 switches from the first electromagnetic field to the second electromagnetic field. In turn, the electromagnetic force generated by the second electromagnetic field formed by the planar spiral coil 1204 under the interaction of the permanent magnet magnetic field drives the flexible circuit board 120 to keep swinging along the second swing direction.

[0096] In some embodiments, the method further includes:

[0097] The control motherboard 140 acquires threshold data corresponding to the target swing position, and acquires the current Hall voltage data of the flexible circuit board 120 through the Hall sensor 1205. The target swing position is used to characterize the swing position of the flexible circuit board 120 at the maximum swing arc.

[0098] The control motherboard 140 performs threshold analysis on the current Hall voltage data based on the threshold data to obtain the threshold analysis result;

[0099] If the threshold analysis result indicates that the current Hall voltage data is less than the threshold data, then the process returns to the steps of obtaining the threshold data corresponding to the target swing position by the control motherboard 140 and obtaining the current Hall voltage data of the flexible circuit board 120 through the Hall sensor 1205; or, if the threshold analysis result indicates that the current Hall voltage data is equal to the threshold data, then the swing direction in the current indication information is updated to obtain the updated indication information.

[0100] In this embodiment of the application, the control motherboard 140 can first obtain the swing position of the flexible circuit board 120 at the maximum swing arc (i.e., the target swing position), which is used to characterize the critical position of the flexible circuit board 120 changing the swing direction; then, based on the target swing position, the critical Hall voltage of the flexible circuit board 120 at the target swing position is predetermined and recorded as threshold data.

[0101] Understandably, during the oscillation of the flexible circuit board 120, as it oscillates closer to the permanent magnet, the Hall voltage data detected by the Hall sensor 1205 increases. The Hall voltage data detected by the Hall sensor 1205 is also at its maximum when the flexible circuit board 120 reaches its maximum oscillation arc position. Conversely, as the flexible circuit board 120 oscillates away from the permanent magnet, the Hall voltage data detected by the Hall sensor 1205 decreases. The Hall voltage data detected by the Hall sensor 1205 is at its minimum when the flexible circuit board 120 reaches the overall center horizontal plane of the oscillation device. Therefore, the control motherboard 140 can collect the Hall voltage data of the flexible circuit board 120 at its current oscillation position through the Hall sensor 1205. Threshold analysis can be performed by comparing the magnitude of the threshold data and the current Hall voltage data to obtain the threshold analysis result.

[0102] Specifically, if the threshold analysis result shows that the current Hall voltage data is less than the threshold data, it indicates that the current swing position of the flexible circuit board 120 is not equal to the target swing position. The flexible circuit board 120 still needs to continue swinging along the current swing direction. At this time, the control motherboard 140 does not update the indication information and returns to the steps of obtaining the threshold data corresponding to the target swing position and obtaining the current Hall voltage data of the flexible circuit board 120 through the Hall sensor 1205. Alternatively, if the threshold analysis result shows that the current Hall voltage data is equal to the threshold data, it indicates that the current swing position of the flexible circuit board 120 is equal to the target swing position. The flexible circuit board 120 needs to switch the swing direction. At this time, the control motherboard 140 can adjust the swing direction in the current indication information to obtain updated indication information. Based on the updated indication information, the control motherboard 140 changes the current direction input to the planar spiral coil 1204, thereby causing the flexible circuit board 120 to swing in the opposite direction. This cycle is repeated to achieve the reciprocating swing of the flexible circuit board 120.

[0103] In some embodiments, the control motherboard 140 energizes the planar spiral coil 1204 from the target coil port, including:

[0104] The control motherboard 140 acquires the current swing demand value, which is used to indicate the swing frequency, swing arc, or air volume generated by the swing of the flexible circuit board 120.

[0105] The control motherboard 140 analyzes the current swing demand value and obtains the current value corresponding to the current swing demand value. The current value is positively correlated with the current swing demand value.

[0106] The control motherboard 140 supplies power to the planar spiral coil 1204 from the target coil port according to the power supply current value;

[0107] The target coil port is either the first coil port or the second coil port.

[0108] In this embodiment of the application, the current swing demand value can be any one of the preset swing frequency, swing arc, air volume required for the swing of the flexible circuit board 120, etc., in the control motherboard 140, or it can be obtained based on the demand command issued by the user through an external device (such as a computer). The demand command records the swing frequency, swing arc or air volume set by the user.

[0109] It is understandable that, after the planar helical coil 1204 is energized, the magnetic field strength of the electromagnetic field it generates is positively correlated with the current intensity. Furthermore, as the magnetic field strength increases, the electromagnetic force generated by the interaction with the permanent magnet's magnetic field also increases. Under the influence of this increased electromagnetic force, the flexible circuit board 120's oscillation frequency, oscillation arc, and generated airflow also increase. Therefore, the energizing current value corresponding to the oscillation demand value can be obtained based on the positive correlation. Specifically, this analysis can be performed by looking up the current value in a table based on the current oscillation demand value, or by substituting the current oscillation demand value into a preset positive correlation function to obtain the energizing current value. Then, the control board 140 inputs a current equal to the energizing current value from the target coil port to the planar helical coil 1204, causing the flexible circuit board 120 to oscillate according to the required oscillation frequency and oscillation arc, or to generate the required airflow.

[0110] In some embodiments, the method further includes:

[0111] The control motherboard 140 acquires the target swing position and acquires the current Hall voltage data of the flexible circuit board 120 through the Hall sensor 1205;

[0112] The control motherboard 140 performs position analysis on the current Hall voltage data to obtain the current swing position of the flexible circuit board 120.

[0113] The control motherboard 140 performs adaptive power-on analysis on the current swing position based on the target swing position to obtain an adaptive current value. The adaptive current value is positively correlated with the swing position difference, and the swing position difference is the absolute position difference between the target swing position and the current swing position.

[0114] The control motherboard 140 supplies power to the planar spiral coil 1204 from the target coil port according to the adaptive current value;

[0115] The target coil port is either the first coil port or the second coil port.

[0116] In this embodiment, the position analysis can be based on the relationship between the aforementioned Hall voltage data and the swing position. The current swing position of the flexible circuit board 120 can be determined using the current Hall voltage data, and the swing radius of the current swing position can be expressed as:

[0117]

[0118] in, The oscillation radius at the current oscillation position; The magnetic field strength of the permanent magnet. To control the current intensity input from the main board 140 to the planar spiral coil 1204; The material stiffness of the flexible circuit board 120; This is the current Hall voltage data.

[0119] It is understood that in the first embodiment, the adaptive energization analysis can first calculate the ratio between the oscillation arc of the current oscillation position and the maximum oscillation arc corresponding to the target oscillation position; then, based on the calculated ratio and the target oscillation position, the oscillation position difference and the corresponding adaptive current value are determined. The calculation method of the adaptive current value is similar to the calculation method of the aforementioned energization current value, and can be simply deduced by analogy. This application will not elaborate further here.

[0120] In the second embodiment, the adaptive current analysis can be based on the swing arc and the three-dimensional attribute information of the flexible circuit board 120 (such as the swing radius of the flexible circuit board 120) to calculate the actual swing position of the flexible circuit board 120. Then, based on the position difference between the actual swing position and the target swing position, the adaptive current value is determined. There are many ways to calculate the specific three-dimensional position, which will not be described in detail here.

[0121] It should be noted that during the swinging process of the flexible circuit board 120, the control motherboard 140 can acquire the current Hall voltage data in real time and perform position and adaptive power-on analysis. Based on the real-time determined adaptive current value, it controls the current intensity input to the planar spiral coil 1204, thereby dynamically adjusting the swing angle and frequency of the flexible circuit board 120 per unit time during the swinging process. This helps to break the mechanical resonance point of the flexible circuit board 120, avoid the material fatigue fracture phenomenon that occurs during the swinging process of the flexible circuit board 120, and effectively improve the heat dissipation and service life of the flexible circuit board 120.

[0122] It is worth mentioning that the closer the flexible circuit board 120 is to the permanent magnet (that is, the closer the swing position of the flexible circuit board 120 is to the target swing position), the smaller the swing position difference becomes. Based on an adaptive current value that is positively correlated with the swing position difference, this embodiment of the application can reduce the electromagnetic force on the flexible circuit board 120 as its swing position approaches the target swing position. This is beneficial for the recovery of the elastic deformation of the flexible circuit board 120 and suppresses the possibility of breakage.

[0123] Reference Figure 7 This application also provides an electronic component heat sink, including an electronic component 200 that needs to be cooled and several of the above-mentioned flexible circuit board swinging devices 100.

[0124] In this embodiment of the application, several flexible circuit board swing devices 100 can be placed next to the electronic component 200 that needs heat dissipation. The flexible circuit board 120 in the flexible circuit board swing device 100 drives the airflow to achieve heat dissipation of the electronic component 200.

[0125] The following is a detailed description and explanation of the solutions in the embodiments of the present invention:

[0126] In the initial state, the planar spiral coil 1204 of the flexible circuit board 120 can be powered by the control motherboard 140, and the planar spiral coil 1204 generates an electromagnetic field. This electromagnetic field is interacted with by the magnetic field of the permanent magnet formed by the first permanent magnet 131 and the second permanent magnet 132 fixed on the U-shaped mounting base 110, so that the flexible circuit board 120 bends upward or downward.

[0127] Next, the control motherboard 140 uses the Hall sensor 1205 connected to the planar spiral coil 1204 of the flexible circuit board 120 to control the direction of the current flowing through the planar spiral coil 1204 to generate an alternating electromagnetic field and electromagnetic force. This electromagnetic force drives the flexible circuit board 120 to reciprocate and deform around its fixed end, thereby realizing the reciprocating non-contact oscillation of the flexible circuit board 120, and thus achieving the purpose of driving airflow to dissipate heat from the electronic components 200.

[0128] During the oscillation of the flexible circuit board 120, the control board 140 can also control the air volume, oscillation arc and frequency by controlling the current flowing through the planar spiral coil 1204; specifically, the greater the current flowing through, the greater the oscillation arc and frequency of the flexible circuit board 120, and the greater the air volume generated; conversely, the smaller the current flowing through, the smaller the oscillation arc and frequency of the flexible circuit board 120, and the smaller the air volume generated.

[0129] This application also provides an electronic device, which includes a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the above-described method. This electronic device can be any smart terminal, including tablet computers, in-vehicle computers, etc.

[0130] It is understood that the content of the above method embodiments is applicable to this device embodiment. The specific functions implemented by this device embodiment are the same as those of the above method embodiments, and the beneficial effects achieved are also the same as those achieved by the above method embodiments.

[0131] Please see Figure 8 , Figure 8 The hardware structure of an electronic device according to another embodiment is illustrated. The electronic device includes:

[0132] The processor 801 can be implemented using a general-purpose CPU (Central Processing Unit), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this application.

[0133] The memory 802 can be implemented as a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 802 can store the operating system and other application programs. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory 802 and is called and executed by the processor 801 using the methods described in the embodiments of this application.

[0134] The 803 input / output interface is used to implement information input and output.

[0135] The communication interface 804 is used to enable communication and interaction between this device and other devices. Communication can be achieved through wired means (such as USB, Ethernet cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.).

[0136] Bus 805 transmits information between various components of the device (e.g., processor 801, memory 802, input / output interface 803, and communication interface 804);

[0137] The processor 801, memory 802, input / output interface 803, and communication interface 804 are connected to each other within the device via bus 805.

[0138] This application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the above-described method.

[0139] It is understood that the content of the above method embodiments is applicable to this storage medium embodiment. The specific functions implemented in this storage medium embodiment are the same as those in the above method embodiments, and the beneficial effects achieved are also the same as those achieved in the above method embodiments.

[0140] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the above-described method.

[0141] It is understood that the content of the above method embodiments is applicable to the embodiments of this program product. The specific functions implemented by the embodiments of this program product are the same as those of the above method embodiments, and the beneficial effects achieved are also the same as those achieved by the above method embodiments.

[0142] Memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, memory may optionally include memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0143] The embodiments described in this application are for the purpose of more clearly illustrating the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions provided by the embodiments of this application. As those skilled in the art will know, with the evolution of technology and the emergence of new application scenarios, the technical solutions provided by the embodiments of this application are also applicable to similar technical problems.

[0144] Those skilled in the art will understand that the technical solutions shown in the figures do not constitute a limitation on the embodiments of this application, and may include more or fewer steps than shown, or combine certain steps, or different steps.

[0145] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0146] Those skilled in the art will understand that all or some of the steps in the methods disclosed above, as well as the functional modules / units in the systems and devices, can be implemented as software, firmware, hardware, or suitable combinations thereof.

[0147] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0148] It should be understood that in this application, "at least one (item)" means one or more, and "more than" means two or more. "And / or" is used to describe the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can represent three cases: only A exists, only B exists, and both A and B exist simultaneously, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one (item) of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one (item) of a, b, or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0149] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of the units described above is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0150] The units described above as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0151] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0152] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes multiple instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned storage medium includes various media capable of storing programs, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0153] The preferred embodiments of the present application have been described above with reference to the accompanying drawings, but this does not limit the scope of the claims of the present application. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and substance of the embodiments of the present application shall be within the scope of the claims of the present application.

Claims

1. A method for oscillating a flexible circuit board, characterized in that, The method for heat dissipation of electronic components includes: The control board obtains the current indication information, which is a first swing direction or a second swing direction. The first swing direction is the direction in which the flexible circuit board approaches the first permanent magnet, and the second swing direction is the direction in which the flexible circuit board approaches the second permanent magnet. If the current indication information is the first swing direction, the control motherboard energizes the planar spiral coil from the first coil port to form a first electromagnetic field, and drives the flexible circuit board to swing along the first swing direction through the electromagnetic force generated by the first electromagnetic field and the magnetic field of the permanent magnet. If the current indication information is the second swing direction, the control motherboard energizes the planar spiral coil from the second coil port to form a second electromagnetic field. The electromagnetic force generated by the second electromagnetic field and the magnetic field of the permanent magnet drives the flexible circuit board to swing along the second swing direction. The method further includes: The control board acquires threshold data corresponding to the target swing position, and acquires the current Hall voltage data of the flexible circuit board through the Hall sensor. The target swing position is used to characterize the swing position of the flexible circuit board at the maximum swing arc. The control motherboard performs threshold analysis on the current Hall voltage data based on the threshold data to obtain the threshold analysis result; If the threshold analysis result is that the current Hall voltage data is less than the threshold data, then return to the steps of the control motherboard acquiring the threshold data corresponding to the target swing position and acquiring the current Hall voltage data of the flexible circuit board through the Hall sensor; or, if the threshold analysis result is that the current Hall voltage data is equal to the threshold data, then update the swing direction in the current indication information to obtain the updated indication information. The control motherboard powers the planar spiral coil from the target coil port, including: The control board acquires the current swing demand value, which is used to indicate the swing frequency, swing arc, or air volume generated by the swing of the flexible circuit board. The control board analyzes the current swing demand value and obtains the current value corresponding to the current swing demand value. The current value is positively correlated with the current swing demand value. The control motherboard supplies power to the planar spiral coil from the target coil port according to the current value. The target coil port is either the first coil port or the second coil port.

2. The method according to claim 1, characterized in that, The method further includes: The control motherboard acquires the target swing position and obtains the current Hall voltage data of the flexible circuit board through the Hall sensor; The control board performs position analysis on the current Hall voltage data to obtain the current swing position of the flexible circuit board. The control motherboard performs adaptive power-on analysis on the current swing position based on the target swing position to obtain an adaptive current value. The adaptive current value is positively correlated with the swing position difference, which is the absolute position difference between the target swing position and the current swing position. The control board supplies power to the planar spiral coil from the target coil port according to the adaptive current value.

3. A flexible circuit board swinging device, characterized in that, For implementing the method as described in claim 1 or 2, the device includes a mounting base, a flexible circuit board, a first permanent magnet, a second permanent magnet, and a control main board; The first permanent magnet, the flexible circuit board, and the second permanent magnet are fixed on the same side of the mounting base; The adjacent magnetic pole of the first permanent magnet has the opposite polarity to the adjacent magnetic pole of the second permanent magnet, and the adjacent magnetic pole is the magnetic pole of the first permanent magnet or the second permanent magnet that is adjacent to the flexible circuit board; The flexible circuit board is etched with a planar spiral coil, and the first coil port and the second coil port of the planar spiral coil are connected to the control motherboard. The control motherboard is used to alternately energize the planar spiral coil from the first coil port or the second coil port so that the flexible circuit board oscillates back and forth in the magnetic field of a permanent magnet, and the magnetic field of the permanent magnet is the magnetic field formed between the first permanent magnet and the second permanent magnet.

4. The apparatus according to claim 3, characterized in that, The mounting base is a U-shaped mounting base, which includes a first mounting groove, a second mounting groove, and a third mounting groove; The first mounting groove is located on the first side wall of the U-shaped mounting base, the second mounting groove is located in the middle of the U-shaped mounting base, and the third mounting groove is located on the second side wall of the U-shaped mounting base; The first permanent magnet is fixed in the first mounting groove, the flexible circuit board is fixed in the second mounting groove, and the second permanent magnet is fixed in the third mounting groove.

5. The apparatus according to claim 4, characterized in that, The opening of the second mounting slot is rounded.

6. The apparatus according to claim 4, characterized in that, The angle between the center horizontal plane of the first mounting groove and the center horizontal plane of the U-shaped mounting base is the first inclination angle, and the angle between the center horizontal plane of the second mounting groove and the center horizontal plane of the U-shaped mounting base is the second inclination angle; the first inclination angle is equal to the second inclination angle.

7. The apparatus according to claim 3, characterized in that, The flexible circuit board includes a tail section, a fixed section, and a free section; The first coil port and the second coil port of the planar spiral coil are connected to the control motherboard via the tail section; The fixing part is fixedly connected to the second mounting groove in the mounting base; The free part is equipped with a Hall sensor, which is connected to the control main board via the planar helical coil.

8. A heat sink for electronic components, characterized in that, It includes electronic components that require heat dissipation and several flexible circuit board oscillation devices as described in any one of claims 3-7.

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