A welding fixture

Abstract

The welding fixture provided by the application can realize layered and accurate heat dissipation for the heat characteristics in the laser welding process through the multi-stage cooperative heat dissipation system composed of a cooling flow channel module, a nitrogen cooling module and a semiconductor refrigeration module. The basic heat of the product can be quickly transferred through the conduction effect of the cooling flow channel plate and the support block of the cooling flow channel module. The nitrogen cooling module directly cools the high-temperature welding point through the jet mechanism, effectively inhibiting the local transient heat accumulation of the welding point. The semiconductor refrigeration module actively absorbs the local heat of the product to be welded through the cold end of the semiconductor refrigeration sheet, and discharges the heat to the outside through the hot end, forming an active refrigeration heat dissipation path. The three work cooperatively, greatly improving the overall heat dissipation efficiency, effectively alleviating the heat deformation problem caused by the insufficient heat dissipation of the traditional single metal conduction, significantly inhibiting the mutual coupling effect of multi-welding point heat deformation, ensuring the flatness accuracy of the product to be welded, and further improving the welding yield.

Description

Technical Field

[0001] This application relates to the field of welding technology, and in particular to a welding fixture. Background Technology

[0002] In traditional laser welding processes, the high concentration and fixed nature of laser energy makes the products to be welded prone to deformation due to localized heating during the welding process. This is especially true when there are multiple adjacent weld points in a localized area of ​​the product. The thermal deformation generated by the high-energy welding of each weld point will superimpose and affect each other, resulting in a particularly severe thermal deformation effect.

[0003] However, conventional welding fixtures widely used in the industry currently rely solely on the natural conduction of the metal material for heat dissipation. This single heat dissipation mode is extremely inefficient and cannot quickly transfer the localized concentrated heat generated by high-energy welding. These heat dissipation deficiencies directly lead to a series of problems: irregular deformation of workpieces such as metal sheets at the welding point, flatness of welded products exceeding preset precision standards, a significant drop in welding yield, and ultimately, products failing to meet production and shipment quality requirements.

[0004] Therefore, there is an urgent need to develop a welding fixture that can address the problems of localized high heat accumulation and multi-weld point thermal deformation coupling in laser welding, achieve efficient heat dissipation through multi-module collaboration, thereby suppressing product welding deformation, ensuring product flatness accuracy, and ultimately improving welding yield to meet production and delivery requirements. Summary of the Invention

[0005] The purpose of this application is to provide a welding fixture that, by setting up a cooling channel module, a nitrogen cooling module, and a semiconductor refrigeration module to form a multi-level collaborative heat dissipation system, can achieve layered and precise heat dissipation for the heat characteristics during the laser welding process. The three work together to significantly improve the overall heat dissipation efficiency, effectively alleviate the thermal deformation problem caused by insufficient heat dissipation by traditional single metal conduction, significantly suppress the mutual coupling effect of thermal deformation of multiple weld points, ensure the flatness accuracy of the product to be welded, thereby improving the welding yield and meeting the quality requirements of production and shipment.

[0006] To achieve the above objectives, the technical solution of this application is implemented as follows:

[0007] This application provides a welding fixture for holding a product to be welded for welding, including:

[0008] Base;

[0009] A cooling channel module is installed on the base. The cooling channel module includes a cooling channel plate, and a central hole is provided through the middle of the cooling channel plate.

[0010] A support block for supporting the product to be welded, the support block is installed in the central hole, and the outer side wall of the support block is in contact with the inner side wall of the central hole;

[0011] A nitrogen cooling module is disposed above the cooling channel module. The spray points of the nitrogen cooling module are set to correspond to the welding points of the product to be welded. The nitrogen cooling module is used to spray nitrogen for cooling to the welding points.

[0012] A semiconductor cooling module is disposed below the cooling channel module. The semiconductor cooling module includes a semiconductor cooling chip and a heat dissipation assembly. The semiconductor cooling chip includes a cold end and a hot end disposed opposite to the cold end. The cold end is in contact with the bottom surface of the support block, and the heat dissipation assembly is in contact with the hot end.

[0013] Furthermore, a cooling channel is formed inside the cooling channel plate, and an inlet and an outlet connected to the cooling channel are formed on the side of the cooling channel plate. The inlet and the outlet are used to connect to an external liquid cooling medium.

[0014] Furthermore, the nitrogen cooling module includes a guide plate disposed above the support block and a pipeline connected to an external gas source. The guide plate has a guide hole for guiding the low-temperature nitrogen and an air inlet hole on the side of the guide plate. The air inlet hole is connected to the guide hole, and the pipeline is connected to the air inlet hole. Nitrogen is injected into the welding point through the guide hole.

[0015] Furthermore, the guide plate has an opening in the middle, and the guide hole is disposed on the inner sidewall of the opening, and the guide hole is inclined downward toward the welding point.

[0016] Furthermore, the welding fixture also includes at least one cover plate installed above the support block, the cover plate being used to hold the product to be welded during the welding process.

[0017] Furthermore, the welding fixture also includes a clamping mechanism disposed on the base, the clamping mechanism including a pad mounted on the base and an elbow clamp disposed on the pad, the elbow clamp being used to press the cover plate and the guide plate together.

[0018] Furthermore, the base has a receiving cavity for accommodating the heat dissipation component, and the welding fixture also includes a fixing plate disposed at the bottom of the receiving cavity for supporting the heat dissipation component.

[0019] Furthermore, the base also includes a positioning plate for supporting the cooling channel plate, a positioning pin mounted on the positioning plate and passing through the cooling channel plate for positioning the cooling channel plate, and a positioning block mounted on the positioning plate, the positioning block being used to position the product to be welded by passing through the cooling channel plate and the support block.

[0020] Furthermore, a limiting plate is provided in the middle of the cooling channel plate for the positioning block to pass through. The limiting plate divides the central hole to form two central holes symmetrically arranged relative to the limiting plate. The support block includes two blocks, which are respectively installed in the two central holes.

[0021] Furthermore, the semiconductor cooling module, the fixing plate, and the accommodating cavity each include two units, which are respectively located below the two support blocks.

[0022] The welding fixture of this application comprises a multi-stage synergistic heat dissipation system consisting of a cooling channel module, a nitrogen cooling module, and a semiconductor refrigeration module. This system enables layered and precise heat dissipation tailored to the thermal characteristics during the welding process: the cooling channel module rapidly transfers the product's basic heat through conduction between the cooling channel plate and the support block; the nitrogen cooling module directly and directionally cools the high-temperature welding points via a spray mechanism, effectively suppressing localized instantaneous heat accumulation at the welding points; and the semiconductor refrigeration module actively absorbs localized heat from the product being welded through the cold end of the semiconductor refrigeration chip and dissipates it outwards through the hot end, forming an active cooling and heat dissipation path. The coordinated operation of these three components significantly improves overall heat dissipation efficiency, effectively mitigating the thermal deformation problem caused by insufficient heat dissipation from traditional single-metal conduction, significantly suppressing the mutual coupling effects of thermal deformation at multiple welding points, ensuring the flatness accuracy of the product being welded, thereby improving welding yield and meeting the quality requirements for production and shipment. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of a welding fixture provided in one embodiment of this application.

[0025] Figure 2 for Figure 1 The exploded view of the welding fixture shown.

[0026] Figure 3 for Figure 1The diagram shows the structure of the cooling channel module of the welding fixture.

[0027] Figure 4 for Figure 1 The diagram shows the structure of the nitrogen cooling module of the welding fixture.

[0028] Figure 5 for Figure 1 A schematic diagram of the welding fixture from another perspective.

[0029] Figure 6 for Figure 1 The diagram shows the structure of the semiconductor cooling module of the welding fixture.

[0030] In the diagram: 1. Base; 11. Positioning plate; 12. Positioning pin; 13. Positioning block; 14. Fixing plate; 15. Accommodating cavity; 2. Cooling channel module; 21. Cooling channel plate; 211. Liquid inlet; 212. Liquid outlet; 213. Center hole; 214. Limiting plate; 215. Extension block; 22. Cooling channel; 23. Plug; 3. Nitrogen cooling module; 31. Guide plate; 32. Guide hole; 33. Air inlet; 34. Opening; 4. Semiconductor refrigeration module; 41. Semiconductor refrigeration chip; 411. Cold end; 42. Heat dissipation component; 421. Thermal insulation cotton; 422. Heat dissipation fins; 5. Clamping mechanism; 51. Elbow clamp; 52. Foot pad; 6. Cover plate; 7. Support block. Detailed Implementation

[0031] The specific embodiments of this application will now be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are merely some, not all, of the embodiments of this application. Based on the description of this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0032] In the description of this application, unless otherwise expressly specified and limited, the terms "set," "install," "connect," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms based on the specific circumstances.

[0033] The terms “upper,” “lower,” “left,” “right,” “front,” “back,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used in this application. They are used only for the convenience of description and to simplify the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0034] The terms “first,” “second,” “third,” etc., are used merely to distinguish elements with similar properties, not to indicate or imply relative importance or a specific order.

[0035] The terms “include,” “comprising,” or any other variation thereof are intended to cover non-exclusive inclusion, which includes not only the elements listed but also other elements not expressly listed.

[0036] like Figures 1 to 2 As shown, a preferred embodiment of this application provides a welding fixture for clamping a product to be welded for welding, comprising:

[0037] Base 1;

[0038] Cooling channel module 2 is mounted on base 1. Cooling channel module 2 includes cooling channel plate 21 for conducting heat dissipation of the product. A central hole 213 is provided through the middle of the cooling channel plate 21.

[0039] The support block 7 is used to support the product to be welded. The support block 7 is installed in the central hole 213, and the outer side wall of the support block 7 is in contact with the inner side wall of the central hole 213.

[0040] Nitrogen cooling module 3 is set above cooling channel module 2. The spray point of nitrogen cooling module 3 is set to correspond to the welding point of the product to be welded. Nitrogen cooling module 3 is used to spray nitrogen for cooling the welding point.

[0041] The semiconductor cooling module 4 is located below the cooling channel module 2. The semiconductor cooling module 4 includes a semiconductor cooling chip 41 and a heat dissipation component 42. The semiconductor cooling chip 41 includes a cold end 411 and a hot end (not shown in the figure) opposite to the cold end 411. The cold end 411 is in contact with the bottom surface of the support block 7, and the heat dissipation component 42 is in contact with the hot end.

[0042] The cooling channel module 2, the nitrogen cooling module 3, and the semiconductor refrigeration module 4 constitute a multi-level collaborative heat dissipation system.

[0043] The welding fixture of this application comprises a multi-stage synergistic heat dissipation system consisting of a cooling channel module 2, a nitrogen cooling module 3, and a semiconductor refrigeration module 4. This system enables layered and precise heat dissipation tailored to the thermal characteristics during the welding process: the cooling channel module 2 rapidly transfers the basic heat of the product through conduction between the cooling channel plate 21 and the support block 7; the nitrogen cooling module 3 directly and directionally cools the high-temperature welding points through a spray mechanism, effectively suppressing localized instantaneous heat accumulation at the welding points; and the semiconductor refrigeration module 4 actively absorbs localized heat from the product to be welded through the cold end 411 of the semiconductor refrigeration chip 41 and discharges it outward through the hot end, forming an active cooling and heat dissipation path. The synergistic operation of these three components significantly improves overall heat dissipation efficiency, effectively alleviating the thermal deformation problem caused by insufficient heat dissipation from traditional single-metal conduction, significantly suppressing the mutual coupling effects of thermal deformation at multiple welding points, ensuring the flatness accuracy of the product to be welded, thereby improving welding yield and meeting the quality requirements for production and shipment.

[0044] like Figures 1 to 6 As shown, specifically, the base 1 serves as the basic support structure and is generally H-shaped. The upper surface is used to install the cooling channel module 2 and the clamping mechanism 5, and the middle area is provided with a receiving cavity 15 (for accommodating the heat dissipation component 42 of the semiconductor cooling module 4).

[0045] The cooling channel module 2 is assembled on the upper surface of the base 1. The cooling channel plate 21 has a central hole 213 that matches the size of the support block 7. The support block 7 is embedded in the central hole 213, and its periphery contacts the inner wall of the cooling channel plate 21, achieving a precise fit. The support block 7 is preferably made of pure copper, which has excellent thermal conductivity. The top of the support block 7 is used to place the product to be welded, and the bottom is in direct contact with the semiconductor cooling chip 41 of the semiconductor cooling module 4. The welding fixture also includes a cover plate 6 for fixing the product during welding, which works in conjunction with the support block 7. Multiple cover plates 6 are installed and stacked on the product to be welded, and the cover plates 6 have pre-drilled openings for welding points. Eight contoured pressure blocks are embedded in the cover plates 6 to hold the product and ensure its fixation in the Z-axis direction during welding.

[0046] The nitrogen cooling module 3 is set at the welding point position of the product to be welded, including a guide plate 31 for guiding the nitrogen injection position and a pipeline (not shown in the figure) for connecting to an external gas source. The guide plate 31 is installed on the top of the cover plate 6, and the welding point opening reserved on the cover plate 6 provides a precise installation reference for the guide plate 31. The side wall of the guide plate 31 is provided with a guide hole 32 with a spray angle and an air inlet 33 connected to the pipeline. One end of the pipeline is connected to an external gas source, and the other end is connected to the guide hole 32.

[0047] The semiconductor cooling module 4 includes a semiconductor cooling chip 41 and a heat dissipation component 42. The heat dissipation component 42 is placed in the accommodating cavity of the base 1. The semiconductor cooling chip 41 is installed between the heat dissipation component 42 and the cooling channel module 2, that is, the cold end 411 faces upward and directly contacts the bottom of the support block 7 embedded in the opening of the cooling channel plate 21, and the hot end faces downward for connecting the heat dissipation component 42.

[0048] Specifically, the cooling channel module 2 removes heat through the medium circulation within the cooling channel 22, and the support block 7 acts as a heat conduction medium, transferring the heat of the product to be welded to the cold end 411 of the semiconductor cooling chip 41; the nitrogen cooling module 3 directionally sprays nitrogen to cool the high-temperature solder joint; the semiconductor cooling module 4 actively absorbs the heat conducted by the support block 7 through the cooling chip; the three work together to form a multi-stage heat dissipation system of "medium circulation heat dissipation + local rapid cooling + active cooling" to solve the problem of thermal deformation in laser welding.

[0049] like Figure 3 As shown, in this embodiment, the cooling channel plate 21 is a hollow plate structure with a central hole 213 for embedding the support block 7. A continuous, curved cooling channel 22 is formed around the central hole 213 inside the plate. The cooling channel 22 is preferably annular, enclosing the area surrounding the support block 7. An inlet 211 and an outlet 212 are located on the side of the cooling channel plate 21 and communicate with both ends of the internal cooling channel 22. The outlet 212 and inlet 211 are connected to an external cooling system (such as a chiller) via pipes, forming a closed loop. The cooling medium (such as water or coolant) can continuously flow within the channel, carrying away heat around the support block 7. The sidewalls of the cooling channel plate 21 are also equipped with multiple plugs 23 to prevent the cooling medium from flowing out. Through the circulation of the cooling medium, heat around the support block 7 is quickly carried away, preventing heat accumulation within the cooling channel plate 21 and assisting the support block 7 in efficiently transferring heat to the cold end 411 of the semiconductor cooling chip 41.

[0050] In this embodiment, thermally conductive silicone (not shown) is filled between the inner wall of the opening of the cooling channel 22 and the side wall of the support block 7. It adheres to the space between the inner wall of the opening and the side wall of the support block 7 through its own adhesion or the pressure when the support block 7 is embedded, serving both filling and thermal conduction functions without affecting the embedded positioning of the support block 7. Filling the gap between the opening of the cooling channel plate 21 and the side wall of the support block 7 reduces contact thermal resistance, allowing some of the heat from the product to be welded absorbed by the support block 7 to be transferred to the cooling channel plate 21 and then carried away by the flow medium, improving overall heat dissipation efficiency. Most of the heat is actively absorbed by the cold end 411 of the semiconductor cooling chip 41 through the support block 7. Simultaneously, a small amount of heat is conducted to the cooling channel plate 21 through the thermally conductive silicone and carried away by the circulating coolant to supplement heat dissipation.

[0051] Specifically, the cooling channel module 2 is a cooling water channel embedded inside the welding fixture. Its inlet / outlet connects to an external circulating cooling water system, transferring the basic heat from the weld joints through cooling water circulation and reducing the overall temperature of the fixture. The cooling channel 22 must be located close to the area requiring the strongest heat dissipation (i.e., near the weld joint area), and its diameter must be calculated based on the heat load to ensure sufficient flow rate and velocity, achieving turbulent heat transfer and maximizing heat exchange efficiency. During laser welding, the continuous operation of the cooling channel 22 effectively reduces the temperature of the welding fixture, allowing the localized heat generated during welding to be quickly conducted away, thereby preventing product deformation due to heat and ensuring flatness.

[0052] like Figure 2 , Figure 4 and Figure 5 As shown, in this embodiment, the nitrogen cooling module 3 includes a guide plate 31 fixed to the upper surface of the cover plate 6 and a pipeline connected to an external gas source. The guide plate 31 has the same dimensions as the cover plate 6. The side wall of the guide plate 31 has a guide hole 32 with a spray angle. The axis of the guide hole 32 obliquely penetrates the welding point opening reserved in the cover plate 6, precisely pointing towards the welding point area of ​​the welded product. The guide plate 31 has an opening 34 in the middle. The guide hole 32 is set on the inner side wall of the opening 34, and the guide hole 32 is inclined downward towards the welding point. The pipeline is preferably a high-temperature resistant flexible hose. One end is connected to an external gas source. A pressure reducing valve and a solenoid valve are connected in series on the pipeline. The other end is sealed and connected to the guide hole 32 of the guide plate 31. Nitrogen is transported to the guide plate 31 through the pipeline and sprayed directionally to the high-temperature welding point through the guide hole 32. The inertness and airflow characteristics of nitrogen inhibit the oxidation of the welding point and rapidly cool it down.

[0053] Specifically, the nitrogen cooling module 3 adds an adjustable nitrogen injection system directly above the laser welding point. By adding a guide hole 32 with an injection angle to the side wall of the nitrogen cooling guide plate 31, and an air inlet 33 connected to the guide hole 32 for receiving nitrogen from the pipeline, the nitrogen pipeline is connected to a gas source via a solenoid valve, directionally injecting low-temperature nitrogen (-10℃ to 0℃) onto the high-temperature welding point, forcing convection heat dissipation and suppressing localized thermal deformation (convective heat transfer). High-purity nitrogen is used as the inert gas, controlled by a compressed gas source via a pressure reducing valve and a solenoid valve, and is injected synchronously at the moment of laser irradiation. This module, through a dual mechanism of directional inert gas impact cooling and oxidation isolation, directly acts on the high-temperature core area of ​​the molten pool, effectively improving the cooling efficiency of the heat deformation-sensitive area, and forming millisecond-level synergy with the flow channel and semiconductor cooling, systematically solving the "multi-welding-point thermal deformation coupling" problem in the background technology.

[0054] like Figure 2 and Figure 6As shown, in this embodiment, the semiconductor cooling chip 41 is a solid-state electronic device that achieves cooling based on the thermoelectric effect of semiconductors, which is prior art and will not be described in detail here. The heat dissipation assembly 42 is placed entirely within the accommodating cavity 15 of the base 1, including heat dissipation fins 422 that contact the hot end of the semiconductor cooling chip 41. Further, in other embodiments, a cooling fan can be installed on the heat dissipation fins 422. The hot end of the semiconductor cooling chip 41 contacts the top of the heat dissipation fins 422. The top area of ​​the heat dissipation fins 422 is larger than the area of ​​the semiconductor cooling chip 41. Therefore, the heat dissipation assembly 42 also includes heat insulation cotton 421 installed on the heat dissipation fins 422 and surrounding the semiconductor cooling chip 41. The heat insulation cotton 421 forms a "heat insulation barrier" around the semiconductor cooling chip 41 through its low thermal conductivity, blocking the backflow of heat from the exposed area of ​​the heat dissipation fins 422 to the cold end 411, ensuring that the cooling efficiency is not consumed internally. When the semiconductor cooling chip 41 is working, the cold end 411 absorbs the heat from the support block 7 and transfers the heat to the hot end through the Peltier effect. The heat dissipation fins 422 quickly dissipate the heat transferred from the hot end to the outside of the accommodating cavity, forming a directional heat dissipation path of cold end 411 → hot end → heat dissipation fins 422 → outside.

[0055] Specifically, the semiconductor cooling module 4 integrates a semiconductor cooling chip 41 (TEC) array on the base 1. The semiconductor cooling chip is a solid-state electronic device that achieves cooling based on the thermoelectric effect of semiconductors. The TEC core consists of multiple sets of series-connected N-type semiconductor (electron-rich) and P-type semiconductor (hole-rich) thermocouple pairs sandwiched between two highly thermally conductive ceramic substrates. When direct current flows from the N-type semiconductor to the P-type semiconductor, electrons jump from a lower energy level to a higher energy level at the junction, absorbing heat and forming a cold junction 411; when current flows from the P-type semiconductor to the N-type semiconductor, electrons fall from a higher energy level to a lower energy level at the junction, releasing heat and forming a hot junction. As the current continues to flow, one side of the semiconductor cooling chip 41 (cold junction 411) continuously absorbs heat and cools down, while the other side (hot junction) continuously releases heat and heats up, creating a significant temperature difference. Heat is continuously pumped from the cold end 411 to the hot end. The hot end needs a heat sink (such as a heat pipe, air cooling / water cooling) to dissipate the heat into the environment and maintain the low temperature of the cold end 411. This semiconductor cooling module 4 uses a semiconductor cooling chip 41 + air convection cooling (air cooling) system. The cold end 411 of the semiconductor cooling chip 41 is in close contact with the product support block 7 (thermal conductive copper substrate), actively absorbing heat and transferring it to the hot end through the Peltier effect. The hot end uses a cooling fan to continuously dissipate heat, and with the help of airflow, the generated heat is carried away, thereby achieving a cooling effect. The semiconductor cooling chip 41 is a solid-state electronic component with no moving mechanical parts and zero mechanical vibration, solving the contradiction between "localized strong cooling" and "zero vibration interference" that traditional heat dissipation cannot achieve simultaneously.

[0056] Specifically, the accommodating cavity 15 is used to provide installation space for the heat dissipation component 42. A fixing plate 14 is installed at the bottom of the accommodating cavity 15, and the heat dissipation fins 422 are placed directly on the upper surface of the fixing plate 14 to prevent them from falling from below the base 1 due to the vertical connection of the accommodating cavity 15.

[0057] like Figure 2 As shown, in this embodiment, the base 1 also includes a positioning plate 11 for supporting the cooling channel plate 21, a positioning pin 12 mounted on the positioning plate 11 and passing through the cooling channel plate 21 for positioning, and a positioning block 13 mounted on the positioning plate 11. The positioning block 13 is used to position the product to be welded by passing through the middle of the limiting plate 214 on the cooling channel plate 21. An extension block 215 extends from the side of the limiting plate 214 to limit the support block 7. The support block 7 is inverted L-shaped, and the extension block 215 fixes a portion of the bottom of the support block 7. The bottom surface of the support block 7 contacts the semiconductor cooling chip 41. The positioning plate 11 provides a reference for all positioning components to ensure positioning accuracy; the positioning pin 12 restricts the translation and rotation of the cooling channel plate 21 to ensure that the cooling channel 22 is close to the support block 7; the extension block 215 on the cooling channel plate 21 restricts the position of the support block 7, and the positioning block 13 passes through the limiting plate 214 to position the product to be welded.

[0058] In this embodiment, the welding fixture further includes a clamping mechanism 5 mounted on the base 1 for pressing and fixing the product to be welded. The clamping mechanism 5 includes a pad 52 mounted on the base 1 and an elbow clamp 51 mounted on the pad 52. The pressure head of the elbow clamp 51 can rotate and press down, pressing against the top of the multi-layer cover plate 6 (nitrogen-cooled guide plate + cover plate x2), providing clamping force in the Z-axis direction. By pressing the multi-layer cover plate 6 in the Z-axis direction with the elbow clamp 51, it is ensured that the product to be welded is stably pressed against the upper surface of the support block 7 during the welding process, avoiding product displacement, ensuring welding accuracy, and minimizing the contact thermal resistance between the product and the support block 7, which is beneficial for heat conduction.

[0059] In the initial state: the device is in a standby state without being started or carrying any products. The heat dissipation component 42 is pre-installed in the middle cavity of the base 1. The positioning plate 11, positioning pin 12, and product positioning block 13 on the upper surface are fixed in place. The cooling channel plate 21 is positioned on the positioning block 13 by the positioning pin 12. The middle opening is embedded in the support block 7. The liquid inlet 211 and liquid outlet 212 are connected to the external cooling water system. The cover plate 6 is installed on the support block 7. The nitrogen cooling guide plate 31 is installed on the upper surface of the cover plate 6. The pressure reducing valve and solenoid valve connected in series in the pipeline are connected to the gas source. The semiconductor cooling chip 41 array is clamped between the support block 7 and the heat dissipation component 42. The heat dissipation fins 422 are attached to the hot end. The height of the pad 52 is adjusted and locked.

[0060] In operation, all modules work together. The external cooling water system is activated, and the cooling medium circulates inside the cooling channel plate 21. The support block 7 conducts heat from the product through thermally conductive silicone. The semiconductor cooling chip 41 is energized, and the cold end 411 actively absorbs heat. The hot end transfers heat to the cooling fan through the heat dissipation fins 422. The airflow is drawn in and discharged from the bottom of the accommodating cavity 15. The nitrogen system is activated synchronously with the laser welding equipment. Low-temperature nitrogen passes through the guide plate 31 with angled guide holes 32 and through the opening of the cover plate 6. Directional spray welding achieves forced convection heat dissipation. The elbow clamp 51 fixes the product by pressing the cover plate 6. The positioning pin 12 and the product positioning block 13 restrict the movement of the components and ensure that the weld point is aligned with the guide hole 32.

[0061] The welding fixture provided in this application constitutes a multi-level synergistic heat dissipation system by setting up a cooling channel module 2, a nitrogen cooling module 3, and a semiconductor refrigeration module 4. This system enables layered and precise heat dissipation based on the thermal characteristics during laser welding: the cooling channel module 2 quickly transfers the basic heat of the product through the conduction between the cooling channel plate 21 and the support block 7; the nitrogen cooling module 3 directly cools the high-temperature welding points through a spray mechanism, effectively suppressing the instantaneous heat accumulation in the local area of ​​the welding point; and the semiconductor refrigeration module 4 actively absorbs the local heat of the product to be welded through the cold end 411 of the semiconductor refrigeration chip 41 and discharges it outward through the hot end, forming an active cooling and heat dissipation path. The three components work together to significantly improve the overall heat dissipation efficiency, effectively alleviate the thermal deformation problem caused by insufficient heat dissipation from traditional single metal conduction, significantly suppress the mutual coupling effect of thermal deformation of multiple welding points, ensure the flatness accuracy of the product to be welded, and thus improve the welding yield and meet the quality requirements for production and shipment.

[0062] The cooling channel module 2 enables efficient heat transfer from the weld joint, reducing the overall temperature of the welding fixture by ≥30℃ and preventing flatness deviations caused by heat accumulation.

[0063] By using nitrogen cooling module 3, a dual mechanism of forced convection heat dissipation and oxidation isolation is formed in the weld pool area, which improves the cooling efficiency of the heat-sensitive area by more than 50% and significantly suppresses the coupling effect of thermal deformation of multiple weld points.

[0064] By using the semiconductor cooling module 4, active heat absorption (Peltier effect) and zero vibration interference in local areas are achieved, resolving the contradiction between the inability of traditional heat dissipation to meet both "strong cooling requirements" and "precision welding stability".

[0065] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A welding jig for clamping a product to be welded to perform welding on the product to be welded, characterized by, The welding fixture comprises a base (1), a cooling flow channel module (2) installed on the base (1), the cooling flow channel module (2) comprising a cooling flow channel plate (21) with a cooling flow channel (22) formed therein, and a center hole (213) formed through the middle of the cooling flow channel plate (21) from top to bottom; a support block (7) for bearing a product to be welded, the support block (7) being installed in the center hole (213) and the outer side wall of the support block (7) being in contact with the inner side wall of the center hole (213); a nitrogen cooling module (3) arranged above the cooling flow channel module (2), the nitrogen cooling module (3) having a spray point corresponding to a welding point of the product to be welded, and the nitrogen cooling module (3) being used for spraying nitrogen gas for cooling at the welding point; the nitrogen cooling module (3) comprising a guide plate (31) arranged above the support block (7) and a pipeline in communication with an external gas source, the guide plate (31) having a guide hole (32) for guiding low-temperature nitrogen gas formed therein and an air inlet hole (33) formed in the side of the guide plate (31), the air inlet hole (33) being in communication with the guide hole (32), the pipeline being in communication with the air inlet hole (33), and the guide hole (32) being used for spraying nitrogen gas at the welding point, and the middle of the guide plate (31) being provided with an opening (34), the guide hole (32) being arranged on the inner side wall of the opening (34) and being arranged to be inclined downward toward the welding point; and a semiconductor refrigeration module (4) arranged below the cooling flow channel module (2), the semiconductor refrigeration module (4) comprising a semiconductor refrigeration sheet (41) and a heat dissipation assembly (42), the semiconductor refrigeration sheet (41) comprising a cold end (411) and a hot end arranged opposite to the cold end (411), the cold end (411) being in contact with the bottom surface of the support block (7), and the heat dissipation assembly (42) being in contact with the hot end. The side of the cooling flow channel plate (21) is provided with a liquid inlet (211) and a liquid outlet (212) in communication with the cooling flow channel (22), and the liquid inlet (211) and the liquid outlet (212) are used for communicating with an external liquid cooling medium. The welding fixture further comprises at least one cover plate (6) installed above the support block (7), and the cover plate (6) is used for pressing and holding the product to be welded during welding. The welding fixture further comprises a clamping mechanism (5) arranged on the base (1), the clamping mechanism (5) comprising a foot pad (52) installed on the base (1) and an elbow clamp (51) arranged on the foot pad (52), and the elbow clamp (51) is used for pressing and holding the cover plate (6) and the guide plate (31). The base (1) is provided with a containing cavity (15) for containing the heat dissipation assembly (42), and the welding fixture further comprises a fixing plate (14) arranged at the bottom of the containing cavity (15) and used for bearing the heat dissipation assembly (42). ​ 2. The welding fixture of claim 1, wherein, ​ 3. The welding fixture of claim 1, wherein, ​ 4. The welding fixture of claim 3, wherein, ​ 5. The welding fixture of claim 1, wherein, ​ 6. The welding fixture of claim 5, wherein, The base (1) further comprises a positioning plate (11) for bearing the cooling runner plate (21), positioning pins (12) installed on the positioning plate (11) and penetrating through the cooling runner plate (21) for positioning the cooling runner plate (21), and positioning blocks (13) installed on the positioning plate (11) for positioning the to-be-welded product together with the support blocks (7) through the cooling runner plate (21).

7. The welding fixture of claim 6, wherein, The middle part of the cooling runner plate (21) is provided with a limiting plate (214) for penetrating the positioning blocks (13), the limiting plate (214) divides the center hole (213) into two center holes (213) symmetrically arranged relative to the limiting plate (214); the support blocks (7) include two, respectively installed in the two center holes (213).

8. The welding fixture of claim 7, wherein, The semiconductor refrigeration modules (4), the fixing plates (14), and the accommodating cavities (15) each include two, respectively corresponding to the two support blocks (7) below.

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