Packaging structure and electronic equipment

Abstract

The invention discloses a packaging structure and electronic equipment. The packaging structure comprises a substrate, a chip and a heat conduction cover plate, the chip is arranged on the substrate; the heat conduction cover plate comprises a supporting part, a heat conduction part and an annular connecting part, the supporting part surrounds the chip and is fixedly connected with the substrate, the heat conduction part is located on the side, away from the substrate, of the chip, the heat conduction part and the supporting part are mutually fixed to form a containing space, the containing space is used for containing the chip, and the annular connecting part is fixed to the side, away from the supporting part, of the heat conduction part; the outer side wall of the annular connecting part is used for being connected with heat exchange equipment. The heat exchange equipment outputs the liquid medium into the space surrounded by the inner side wall of the annular connecting part through the spray head, the liquid medium circulates between the heat conduction cover plate and the spray head to take away heat generated by the chip, and the liquid medium does not enter the packaging structure to affect the chip, so that the packaging efficiency is improved. The reliability of the packaging structure is improved, and the service life of the chip is prolonged.

Description

Technical Field

[0001] This application relates to the field of chip packaging technology, and in particular to a packaging structure and electronic device. Background Art

[0002] As chips become more integrated and more powerful, they generate a lot of heat during operation. Therefore, it is necessary to dissipate heat to prevent overheating and its performance from being affected.

[0003] Liquid cooling technology is a commonly used heat dissipation method. Compared with traditional air cooling technology, liquid cooling technology has higher heat dissipation efficiency and better stability. Its basic principle is to use liquid as a cooling medium, and the heat generated by the internal components of the chip is transferred to the outside through the flow of the liquid to ensure that the chip operates within a safe temperature range. Liquid cooling technology can be divided into two types: direct liquid cooling and indirect liquid cooling. Direct liquid cooling involves direct contact between the heat-generating components and the liquid medium for heat exchange, including immersion liquid cooling technology and spray liquid cooling technology. Indirect liquid cooling refers to a heat exchange method in which there is no direct contact between the heat-generating components and the liquid medium, mainly using cold plate liquid cooling technology.

[0004] Among them, spray liquid cooling technology sprays liquid medium onto the chip that needs to be cooled. The liquid medium evaporates and vaporizes on the heat source and carries away the heat. This technology has a very strong heat exchange capacity. However, in order to avoid the liquid medium from adversely affecting the performance of the chip inside the package structure, this technology has very strict requirements on the sealing and corrosion resistance of the package structure, making it difficult to be widely used in chip packaging. Summary of the Invention

[0005] This application provides a packaging structure and an electronic device. The packaging structure is designed to be compatible with liquid cooling equipment and has both good sealing performance and good thermal conductivity, which helps to improve the reliability and heat dissipation efficiency of the product.

[0006] In a first aspect, this application provides a packaging structure comprising: a substrate, a chip, and a thermally conductive cover plate; the chip is disposed on the substrate; the thermally conductive cover plate includes a support portion, a thermally conductive portion, and an annular connecting portion, wherein the support portion surrounds the chip and is fixedly connected to the substrate, the thermally conductive portion is located on the side of the chip away from the substrate, and the thermally conductive portion and the support portion are fixedly connected to each other to form a receiving space for accommodating the chip, the receiving space being used to accommodate the chip, and the annular connecting portion being fixed to the side of the thermally conductive portion away from the support portion, the outer wall of the annular connecting portion being used to connect a heat exchange device. The heat exchange device outputs a liquid medium through a nozzle into the space surrounding the inner wall of the annular connecting portion, the liquid medium circulates between the thermally conductive cover plate and the nozzle, which can quickly remove the heat generated by the chip, ensuring stable chip operation; the thermally conductive cover plate forms a sealed space for accommodating the chip, thereby isolating the chip from the liquid medium, preventing the liquid medium from entering the packaging structure and adversely affecting the chip's performance, thus the packaging structure has good reliability.

[0007] In some embodiments of this application, the heat-conducting portion of the heat-conducting cover includes one or more heat-conducting plates. When the heat-conducting portion includes multiple heat-conducting plates, the multiple heat-conducting plates are sequentially spaced and stacked on the side of the chip away from the substrate. There is a heat-conducting medium between adjacent heat-conducting plates. This design can avoid insufficient heat transfer or energy waste caused by uneven flow rate of liquid medium, and improve heat exchange efficiency.

[0008] In some embodiments of this application, one or more heat-conducting plates in the heat-conducting part include a first heat-conducting plate. The surface of the first heat-conducting plate away from the chip includes one or more of the following: heat dissipation protrusions, heat dissipation fins, and heat dissipation recesses. When the heat-conducting part includes multiple heat-conducting plates, the first heat-conducting plate is the heat-conducting plate that is farthest from the chip among the one or more heat-conducting plates. This design can increase the contact area between the liquid medium and the heat-conducting cover plate, thereby improving the heat exchange efficiency.

[0009] In some embodiments of this application, the orthographic projection of the annular connection portion on the substrate surrounds the orthographic projection of the chip on the substrate, so that the orthographic projection of the contact portion between the liquid medium and the heat-conducting cover plate on the substrate can cover the orthographic projection of the chip on the substrate, and the heat generated by each part of the chip can be transferred to the liquid medium through the heat-conducting cover plate.

[0010] In some embodiments of this application, the orthographic projection of the support portion on the substrate at least partially overlaps with the orthographic projection of the annular connecting portion on the substrate, or the orthographic projection of the support portion on the substrate surrounds the orthographic projection of the annular connecting portion on the substrate, so as to facilitate the connection of the annular connecting portion and the nozzle of the heat exchange device.

[0011] In this application, the shape of the support portion can be designed according to actual needs to form a space to accommodate the chip.

[0012] In some embodiments of this application, the support portion is perpendicular to the substrate.

[0013] In some embodiments of this application, the support portion includes a first sub-part and a second sub-part connected to each other. The first sub-part is parallel to the substrate and connected to the substrate. The second sub-part is set at a set angle to the substrate. One end of the second sub-part is connected to the first sub-part, and the other end is connected to the heat-conducting part. At this time, the support portion can also be used to support the nozzle of the heat exchange equipment, thereby improving the firmness of the connection between the nozzle and the heat-conducting cover plate.

[0014] In this application, the heat-conducting cover can be an integrated structure or a split structure. The type of heat-conducting cover to be manufactured can be determined according to the actual process capability, and the connection method of the heat-conducting part, the support part and the annular connecting part can be selected according to the actual needs.

[0015] In some embodiments of this application, the heat-conducting part and the supporting part are an integral structure, and the connection method between the heat-conducting part and the annular connecting part includes one of bonding, welding or screw connection.

[0016] In some embodiments of this application, the heat-conducting part and the annular connecting part are an integral structure, and the connection method between the heat-conducting part and the supporting part includes one of bonding, welding or screw connection.

[0017] In some embodiments of this application, the heat-conducting part, the support part, and the annular connecting part are an integrated structure, or the heat-conducting part, the support part, and the annular connecting part are separate structures. The connection method between the heat-conducting part and the annular connecting part includes one of bonding, welding, or screw connection, and the connection method between the heat-conducting part and the support part includes one of bonding, welding, or screw connection.

[0018] In some embodiments of this application, the packaging structure further includes a thermally conductive layer located between the chip and the thermally conductive portion of the thermally conductive cover plate. This thermally conductive layer can more effectively conduct the heat generated by the chip to the thermally conductive cover plate, thereby improving the heat exchange efficiency between the chip and the liquid medium.

[0019] Secondly, this application also provides an electronic device, which includes a heat exchange device and an encapsulation structure. The encapsulation structure is the encapsulation structure described in any possible implementation of the first aspect above. The heat exchange device includes a nozzle, which is connected to the outer wall of the annular connecting portion of the encapsulation structure to achieve radial encapsulation. This reduces the risk of the nozzle separating from the heat-conducting cover or becoming loose during liquid spraying, and avoids liquid medium leakage. The technical effects of the corresponding solution in the second aspect can be referred to the technical effects obtainable by the corresponding solution in the first aspect, and the repetitions are not detailed here.

[0020] In some embodiments of this application, a sealing ring is provided at the connection between the nozzle and the outer wall of the annular connection, which can improve the firmness of the nozzle and the annular connection and prevent liquid medium leakage. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0022] Figure 2 This is a schematic diagram of a packaging structure provided in an embodiment of this application;

[0023] Figure 3 This is a schematic diagram of the structure of a heat-conducting cover plate provided in an embodiment of this application;

[0024] Figure 4 This is a schematic diagram of the structure of another heat-conducting cover provided in an embodiment of this application;

[0025] Figure 5This is a schematic diagram of the structure of another heat-conducting cover provided in an embodiment of this application;

[0026] Figure 6 This is a schematic diagram of the structure of another heat-conducting cover provided in an embodiment of this application;

[0027] Figure 7 This is a schematic diagram of the structure of another heat-conducting cover provided in an embodiment of this application;

[0028] Figure 8 A schematic diagram of a heat dissipation microstructure on a first heat-conducting plate provided in an embodiment of this application;

[0029] Figure 9 A schematic diagram of a heat dissipation microstructure on a first heat-conducting plate provided in an embodiment of this application;

[0030] Figure 10 A schematic diagram of a heat dissipation microstructure on a first heat-conducting plate provided in an embodiment of this application;

[0031] Figure 11 This is a schematic diagram of the structure of another heat-conducting cover provided in an embodiment of this application;

[0032] Figure 12 This is a schematic diagram of the structure of another heat-conducting cover provided in an embodiment of this application;

[0033] Figure 13 This is a schematic diagram of the structure of another heat-conducting cover provided in an embodiment of this application;

[0034] Figure 14 This is a schematic diagram of the structure of another heat-conducting cover provided in an embodiment of this application;

[0035] Figure 15 This is a schematic diagram of the structure of another heat-conducting cover provided in an embodiment of this application;

[0036] Figure 16 This is a schematic diagram of the structure of another heat-conducting cover provided in an embodiment of this application;

[0037] Explanation of reference numerals in the attached figures:

[0038] 100-Heat exchange equipment, P-Nozzle, 200-Encapsulation structure, 300-Heat dissipation equipment, 1-Substrate, 2-Chip, 3-Heat-conducting cover plate, 31-Support part, 311-First sub-part, 312-Second sub-part, 32-Heat-conducting part, 33-Annular connecting part, 41-Conductive structure, 42-Connecting structure, 5-Heat-conducting layer, 61-First heat-conducting plate, 62-Second heat-conducting plate, 7-Heat dissipation microstructure. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. The specific operational methods in the method embodiments can also be applied to the device embodiments or system embodiments. It should be noted that in the description of this application, "multiple" can be understood as "at least two". Furthermore, it should be understood that in the description of this application, terms such as "first" and "second" are used only for distinguishing purposes and should not be construed as indicating or implying relative importance, nor as indicating or implying order.

[0040] It should be noted that the same reference numerals in the accompanying drawings of this application denote the same or similar structures, and therefore repeated descriptions of them will be omitted. Terms expressing position and direction described in this application are illustrative based on the accompanying drawings, but may be modified as needed, and all modifications are included within the scope of protection of this application. The accompanying drawings of this application are for illustrating relative positional relationships only and do not represent actual scale.

[0041] The packaging structure provided in this application can be various electronic devices or integrated circuit devices used to implement one or more functions. Its application areas include, but are not limited to, high-performance computing (HPC) and artificial intelligence (AI) technologies requiring powerful computing capabilities. The packaging structure provided in this application can be widely used in various electronic devices, including, but not limited to, terminal devices, communication devices, and electronic components. Terminal devices include, but are not limited to, computers, televisions, set-top boxes, personal computers (PCs), wearable devices, workstations, and supercomputers. Communication devices include, but are not limited to, wireless networks, fixed networks, servers, and smart broadband. Electronic components include, but are not limited to, device modules, storage circuits, logic circuits, and power devices, etc., and are not listed here. It is understood that the specific implementation of the electronic device can be determined according to the actual application scenario and is not limited here.

[0042] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Figure 1As shown, the electronic device includes a heat exchanger 100 and an encapsulation structure 200. The heat exchanger 100 may include components such as a water tank, a water pump, and a nozzle P. The water tank and water pump, as well as the water pump and nozzle P, are connected by pipes. The water tank stores the liquid medium, and the nozzle P transfers the cooled liquid medium to the surface of the encapsulation structure 200 and carries away the liquid medium after it has absorbed heat. The water pump circulates the liquid medium between the water tank and the nozzle P. The water tank, water pump, and nozzle P form a channel for liquid medium circulation through pipes. After the nozzle P is fixedly connected to the encapsulation structure 200, this circulation channel is sealed, allowing the liquid medium to flow within the circulation channel without leakage, thus enabling the heat exchanger 100 to operate normally. For example, the liquid medium may be one or more liquid media with high thermal conductivity, including but not limited to water, deionized water, alcohol-based solutions, and silicone oil.

[0043] The electronic device may also include a heat dissipation device 300, which is connected to or in contact with the heat exchange device 100 and is used to conduct the heat absorbed by the liquid medium in the heat exchange device 100 to the outside. For example, the heat dissipation device 300 may include a heat sink and a fan. The heat sink may be made of a material with high thermal conductivity and may be designed to have a large surface area. The heat sink is fixedly connected to a water tank, so that the liquid medium can transfer heat to the heat sink and exchange heat with the air. The fan can remove the heat flowing into the air from the heat sink.

[0044] The specific structure and components of the heat exchange device 100 and the heat dissipation device 300 in the electronic device can be designed according to specific requirements, and the embodiments of this application are not limited here.

[0045] Figure 2 This is a schematic diagram of a packaging structure provided in an embodiment of this application. Figure 2 As shown, the packaging structure 200 provided in this application embodiment includes: a substrate 1, a chip 2, and a thermally conductive cover plate 3.

[0046] In this embodiment, chip 2 is disposed on substrate 1. Substrate 1 may be, for example, one of the following: silicon (Si) substrate, glass substrate, or printed circuit board (PCB). The connection method between chip 2 and substrate 1 includes, but is not limited to, soldering, mounting, etc. Conductive structure 41 may also be disposed on the surface of substrate 1 opposite to chip 2. Conductive structure 41 is used to connect package structure 200 to other components in electronic device. For example, package structure 200 can be fixed to control circuit board and electrically connected to control circuit board through conductive structure 41.

[0047] A connection structure 42 can be provided between the thermally conductive cover plate 3 and the substrate 1 to fix the thermally conductive cover plate 3 to the substrate 1. The connection method between the thermally conductive cover plate 3 and the substrate 1 includes, but is not limited to, one of bonding, welding or screw connection. The chip 2 is located between the thermally conductive cover plate 3 and the substrate 1. The thermally conductive cover plate 3 can be made of a material with high thermal conductivity to conduct the heat generated by the chip 2 during operation so as to exchange heat with the liquid medium output by the heat exchange device 100. For example, the material used for the thermally conductive cover plate 3 includes, but is not limited to, one or more of copper (Cu), aluminum silicon carbide (AlSiC), diamond composite material, etc.

[0048] Specifically, the heat-conducting cover plate 3 includes a support portion 31, a heat-conducting portion 32, and an annular connecting portion 33. The support portion 31 surrounds the chip 2 and is fixedly connected to the substrate 1. The heat-conducting portion 32 is located on the side of the chip 2 away from the substrate 1, and the heat-conducting portion 32 and the support portion 31 are fixed to each other to form a receiving space for accommodating the chip 2. The annular connecting portion 33 is fixed to the side of the heat-conducting portion 32 away from the support portion 31 and is used to connect to the nozzle P of the heat exchange device 100.

[0049] like Figure 1 and Figure 2 As shown, the outer wall of the annular connecting part 33 in the heat-conducting cover plate 3 is used to connect the heat exchange device 100. For example, the outline shape of the outer wall of the annular connecting part 33 can be, but is not limited to, one of a circle or an ellipse. The material of the annular connecting part 33 can be, but is not limited to, one or more of copper or stainless steel. The annular connecting part 33 should have good mechanical strength so as to fix the nozzle P of the heat exchange device 100.

[0050] In this embodiment, the nozzle P of the heat exchange device 100 is fixed to the outer wall of the annular connecting part 33, so that a sealed space can be formed between the nozzle P, the heat-conducting part 32 and the inner wall of the annular connecting part 33. The liquid medium output by the heat exchange device 100 circulates in this sealed space, carrying away the heat conducted by the heat-conducting part 32. During the heat exchange process, the liquid medium will not enter the interior of the packaging structure 200, thereby avoiding the liquid medium from corroding the chip 2 and affecting its performance, which is beneficial to improving the reliability of the product.

[0051] Furthermore, since the nozzle P of the heat exchanger 100 is fixed to the outer wall of the annular connection 33, the nozzle P of the heat exchanger 100 can cover at least a portion of the outer wall of the annular connection 33, achieving radial sealing. Since the nozzle P typically uses a spraying method to transfer the liquid medium to the heat-conducting cover plate 3, the impact force between the liquid medium and the nozzle P may cause the connection between the nozzle P and the heat-conducting cover plate 3 to loosen, or even cause the nozzle P to detach. This embodiment uses a radial sealing method to fix the nozzle P and the heat-conducting cover plate 3, which can reduce the risk of the nozzle P separating from the heat-conducting cover plate 3 or becoming loose during liquid spraying, prevent liquid medium leakage from affecting the performance of other components in the electronic device, and ensure the normal operation of the heat exchange process.

[0052] In some embodiments of this application, a sealing ring may be provided at the connection between the nozzle P and the outer side wall of the annular connection 33. The sealing ring may be made of an elastic material, such as rubber. The sealing ring is used to ensure that the circulation channel of the liquid medium remains sealed, preventing the liquid medium from leaking from the connection between the nozzle P and the outer side wall of the annular connection 33 and corroding other components in the electronic equipment, thereby improving the overall reliability of the equipment.

[0053] like Figure 1 and Figure 2 As shown, the annular connecting part 33 of the heat-conducting cover plate has its orthographic projection on the substrate 1 surrounding the orthographic projection of the chip 2 on the substrate 1. Thus, the heat generated on each part of the chip 2 can be transferred to the liquid medium for heat exchange through the heat-conducting part 32, which can prevent the chip 2 from overheating locally.

[0054] In some embodiments of this application, the packaging structure 200 may further include a thermally conductive layer 5. The thermally conductive layer 5 is located between the chip 2 and the thermally conductive portion 32 of the thermally conductive cover plate 3, and is in contact with the surfaces of both, i.e., the thermally conductive layer 5 fills the gap between the thermally conductive cover plate 3 and the thermally conductive portion 32. The thermally conductive layer 5 may be made of thermal interface materials (TIM), including but not limited to one or more of indium (In), indium alloys, carbon-based materials, and other materials with high thermal conductivity. The thermally conductive layer 5 can more fully conduct the heat generated by the chip 2 to the thermally conductive cover plate 3, thereby improving the heat exchange efficiency between the chip 2 and the liquid medium. Alternatively, when performing reliability testing on the chip 2, the heat can be fully transferred to the chip 2 through the thermally conductive cover plate 3 and the thermally conductive layer 5, improving the testing efficiency.

[0055] In this application, the connection method of the annular connecting part 33, the heat-conducting part 32 and the supporting part 31 of the heat-conducting cover plate 3 can be designed according to specific requirements. The heat-conducting cover plate 3 can be an integrated structure or a split structure.

[0056] In some embodiments of this application, reference is made to Figure 3 , Figure 3 This is a schematic diagram of the structure of a heat-conducting cover plate provided in an embodiment of this application. The heat-conducting cover plate 3 is an integrated structure. This design allows it to be integrally molded during manufacturing, which helps to save on process steps.

[0057] In some other embodiments of this application, reference is made to Figure 4 , Figure 4 This is a schematic diagram of another thermally conductive cover plate provided in an embodiment of this application. The thermally conductive part 32 and the supporting part 31 are integrated. A connecting structure 42 is provided between the thermally conductive part 32 and the annular connecting part 33. The connection method between the thermally conductive part 32 and the annular connecting part 33 includes one of bonding, welding or screw connection. This design is compatible with existing packaging processes and can be formed by adding only one process step, which is simple and low in cost.

[0058] In some other embodiments of this application, reference is made to Figure 5 , Figure 5 This is a schematic diagram of another heat-conducting cover plate provided in an embodiment of this application. The heat-conducting part 32 and the annular connecting part 33 are an integrated structure. A connecting structure 42 is provided between the heat-conducting part 32 and the supporting part 31. The connection method between the heat-conducting part 32 and the supporting part 31 includes one of bonding, welding or screw connection.

[0059] In some other embodiments of this application, reference is made to Figure 6 , Figure 6 This is a schematic diagram of another heat-conducting cover plate provided in an embodiment of this application. The heat-conducting part 32, the supporting part 31 and the annular connecting part 33 are separate structures. A connecting structure 42 is provided between the heat-conducting part 32 and the supporting part 31. The connection method between the heat-conducting part 32 and the annular connecting part 33 includes one of bonding, welding or screw connection. At the same time, the connecting structure 42 is provided between the heat-conducting part 32 and the annular connecting part 33. The connection method between the heat-conducting part 32 and the supporting part 31 includes one of bonding, welding or screw connection.

[0060] In this application, the structure of the heat-conducting part 32 in the heat-conducting cover plate 3 can be designed according to specific heat dissipation requirements. The possible structures of the heat-conducting part 32 are described below.

[0061] Figure 7 A schematic diagram of another heat-conducting cover provided in the embodiments of this application is shown below. Figure 7 As shown, the heat-conducting part 32 of the heat-conducting cover plate 3 may include a first heat-conducting plate 61. The first heat-conducting plate 61 is located on the side of the chip 2 away from the substrate 1. The surface of the first heat-conducting plate 61 away from the chip 2 includes one or more heat-conducting microstructures 7 such as heat dissipation protrusions, heat dissipation fins and heat dissipation recesses. The heat dissipation microstructures 7 are provided on the first heat-conducting plate 61, which can increase the contact area between the liquid medium and the heat-conducting cover plate 3, thereby improving the heat exchange efficiency and achieving uniform heat dissipation.

[0062] For example, Figure 8 This is a schematic diagram of a heat dissipation microstructure on a first heat-conducting plate provided in an embodiment of this application, wherein, Figure 8 (a) shows its cross-sectional view. Figure 8 (b) shows its top view, and Figure 8 (a) in the text corresponds to Figure 8 The cross section in direction AA' in (b) of the diagram. Figure 8 The heat dissipation microstructure 7 shown is a columnar protrusion. Multiple columnar protrusions are arranged in an array. The multiple columnar protrusions can be integrally formed with the first heat-conducting plate 61, or they can be fixedly connected to the surface of the first heat-conducting plate 61 away from the chip 2 by means of bonding or welding.

[0063] For example, Figure 9 This is a schematic diagram of a heat dissipation microstructure on a first heat-conducting plate provided in an embodiment of this application, wherein... Figure 9 (a) shows its cross-sectional view. Figure 9 (b) shows its top view, and Figure 9 (a) in the text corresponds to Figure 9 The cross section in direction AA' in (b) of the diagram. Figure 9 The heat dissipation microstructure 7 shown is a columnar recess, and multiple columnar recesses are arranged in an array. The columnar recesses can be formed by drilling holes on the surface of the first heat-conducting plate 61 on the side opposite to the chip 2.

[0064] For example, Figure 10 This is a schematic diagram of a heat dissipation microstructure on a first heat-conducting plate provided in an embodiment of this application, wherein... Figure 10 (a) shows its cross-sectional view. Figure 10 (b) shows its top view, and Figure 10 (a) in the text corresponds to Figure 10 The cross section in direction AA' in (b) of the diagram. Figure 10 The heat dissipation microstructure 7 shown is a sheet structure. Multiple sheet structures are arranged sequentially along a set direction. The multiple sheet structures can be integrally formed with the first heat-conducting plate 61, or they can be fixedly connected to the surface of the first heat-conducting plate 61 away from the chip 2 by means of bonding or welding.

[0065] Figure 11 A schematic diagram of another heat-conducting cover provided in the embodiments of this application is shown below. Figure 11 As shown, the heat-conducting part 32 of the heat-conducting cover plate 3 includes two heat-conducting plates. The two heat-conducting plates are arranged sequentially and spaced apart on the side of the chip 2 away from the substrate 1. There is a heat-conducting medium between the two heat-conducting plates. This design is conducive to achieving uniform heat dissipation and enhancing the heat exchange capacity of the heat-conducting cover plate 3.

[0066] For example, the heat-conducting part 32 can be fabricated based on vacuum chamber (VC) technology. The two heat-conducting plates include a first heat-conducting plate 61 and a second heat-conducting plate 62. The first heat-conducting plate 61 is located on the side of the second heat-conducting plate 62 opposite to the chip 2. Both the first and second heat-conducting plates 61 and 62 have capillary structures filled with a liquid medium. The capillary structures in the first and second heat-conducting plates 61 and 62 are interconnected to form a channel for the flow of the liquid medium. A vacuum chamber is also provided between the first and second heat-conducting plates 61 and 62. During operation, the heat generated by the chip 2 is conducted to the second heat-conducting plate 62. The liquid medium in the second heat-conducting plate 62 absorbs heat and evaporates into vapor, which moves through the chamber to the first heat-conducting plate 61. The vapor condenses into liquid at the first heat-conducting plate 61 and then returns to the second heat-conducting plate 62 through the capillary structure. Thus, the liquid medium can circulate between the two heat-conducting plates, conducting heat to the first heat-conducting plate 61 for extraction. The heat-conducting part 32, designed based on VC technology, can achieve rapid heat conduction and more uniform heat dissipation, avoiding local overheating and preventing insufficient heat transfer or energy waste caused by uneven flow rate of the liquid medium output from the nozzle P of the heat exchange device 100.

[0067] Figure 12 A schematic diagram of another heat-conducting cover provided in the embodiments of this application is shown below. Figure 12 As shown, a heat dissipation microstructure 7 can be disposed on the surface of the first heat-conducting plate 61 on the side opposite to the chip 2, thereby further increasing the contact area between the heat-conducting cover plate 3 and the liquid medium output by the heat exchange device 100, improving heat exchange efficiency, and achieving rapid heat dissipation. For the specific design of the heat dissipation microstructure 7, please refer to... Figure 7-Figure 9 The corresponding descriptions will not be elaborated here.

[0068] It is understood that the heat-conducting portion 32 of the heat-conducting cover plate 3 may also include a greater number of heat-conducting plates. When the heat-conducting portion 32 includes multiple heat-conducting plates, the multiple heat-conducting plates are arranged sequentially and stacked at intervals on the side of the chip 2 away from the substrate 1, and there is a heat-conducting medium between adjacent heat-conducting plates. This design can improve the heat dissipation capacity of the heat-conducting cover plate 3 to a greater extent, avoid insufficient heat transfer or energy waste caused by uneven flow rate of liquid medium output by the nozzle P of the heat exchange device 100, and achieve uniform heat dissipation. The number of heat-conducting plates in the heat-conducting portion 32 can be designed according to specific needs, and this embodiment does not limit it here. When the heat-conducting portion 32 includes multiple heat-conducting plates, the heat-conducting plate farthest from the chip 2 is the first heat-conducting plate 61. A heat dissipation microstructure 7 can be provided on the surface of the first heat-conducting plate 61 away from the chip 2 to further improve the heat dissipation efficiency.

[0069] In this application, the structure of the support portion 31 in the heat-conducting cover 3 can also be adapted to the heat dissipation requirements and the space available in the electronic device to accommodate the heat-conducting cover 3. The possible structures of the support portion 31 are described below.

[0070] In some embodiments of this application, reference is made to Figure 13 , Figure 13 This is a schematic diagram of another heat-conducting cover plate provided in an embodiment of this application. Figure 13 (a) in the figure is a cross-sectional view of the heat-conducting cover plate 3. Figure 13 (b) is a top view of the thermally conductive cover 3 in the encapsulation structure 200, and Figure 13 (a) in the text corresponds to Figure 13 (b) shows the cross-section along the BB' direction. In this design, the support 31 is perpendicular to the substrate 1, and the annular connecting part 33 has a circular annular structure. Figure 13 The dashed line in (b) represents the outline of the inner wall of the support 31. It can be seen that the orthographic projection of the support 31 on the substrate 1 coincides with the orthographic projection of the annular connecting part 33 on the substrate 1. The orthographic projection of the outer wall of the annular connecting part 33 on the substrate 1 extends beyond the range of the substrate 1. This design can be matched with a larger nozzle P.

[0071] In some other embodiments of this application, reference is made to Figure 14 , Figure 14 This is a schematic diagram of another heat-conducting cover plate provided in an embodiment of this application. Figure 14 (a) in the figure is a cross-sectional view of the heat-conducting cover plate 3. Figure 14 (b) is a top view of the thermally conductive cover 3 in the encapsulation structure 200, and Figure 14 (a) in the text corresponds to Figure 14 The cross-section in the BB' direction of (b) is shown in the diagram. In this design, the annular connecting part 33 has a circular structure, and the orthographic projection of the annular connecting part 33 onto the substrate 1 falls within the area of ​​the substrate 1. The supporting part 31 includes a first sub-part 311 and a second sub-part 312 connected to each other. The first sub-part 311 is parallel to and connected to the substrate 1, and the second sub-part 312 is set at a set angle to the substrate 1. One end of the second sub-part 312 is connected to the first sub-part 311, and the other end is connected to the heat-conducting part 32. In this design, the supporting part 31 and the annular connecting part 33 have an angle, so the supporting part 31 can provide support for the nozzle P of the heat exchange device 100, thereby improving the firmness of the connection between the nozzle P of the heat exchange device 100 and the heat-conducting cover plate 3, and further preventing the nozzle P from loosening during operation.

[0072] In some other embodiments of this application, reference is made to Figure 15 , Figure 15 This is a schematic diagram of another heat-conducting cover plate provided in an embodiment of this application. Figure 15 (a) in the figure is a cross-sectional view of the heat-conducting cover plate 3. Figure 15 (b) is a top view of the thermally conductive cover 3 in the encapsulation structure 200, and Figure 15 (a) in the text corresponds to Figure 15 The cross section in the BB' direction in (b) of the design. In this design, the annular connecting part 33 is a circular structure, and the orthographic projection of the annular connecting part 33 onto the substrate 1 falls within the range of the substrate 1. The supporting part 31 is perpendicular to the substrate 1, and a platform parallel to the substrate 1 can be formed between the supporting part 31 and the annular connecting part 33. This platform can also be used to provide support for the nozzle P of the heat exchange device 100, thereby improving the firmness of the connection between the nozzle P of the heat exchange device 100 and the heat-conducting cover plate 3, and further preventing the nozzle P from loosening during operation.

[0073] In some other embodiments of this application, reference is made to Figure 16 , Figure 16 This is a schematic diagram of another heat-conducting cover plate provided in an embodiment of this application. Figure 16 (a) in the figure is a cross-sectional view of the heat-conducting cover plate 3. Figure 16 (b) is a top view of the thermally conductive cover 3 in the encapsulation structure 200, and Figure 16 (a) in the text corresponds to Figure 16 The cross section in the BB' direction in (b) of the design. In this design, the annular connection 33 is an elliptical annular structure, and the orthographic projection of the annular connection 33 onto the substrate 1 falls within the range of the substrate 1. The support 31 is perpendicular to the substrate 1. In this design, the size of the annular connection 33 is adapted to the size of the substrate 1, which is beneficial for controlling the overall size of the packaging structure 200.

[0074] In such Figure 14 (b) Figure 15 (b) and Figure 16 In the heat-conducting cover plate shown in (b), the dashed lines represent the outline of the inner wall of the support portion 31. It can be seen that in the above embodiment, the orthographic projection of the support portion 31 on the substrate 1 coincides with the orthographic projection of the annular connecting portion 33 on the substrate 1. In specific implementations, for example... Figure 14 , Figure 15 and Figure 16The size of the annular connecting portion 33 in the heat-conducting cover structure shown can be designed according to the size of the required matching nozzle P, as long as the orthographic projection of the annular connecting portion 33 on the substrate 1 falls within the range of the substrate 1. For example, the orthographic projection of the support portion 31 on the substrate 1 can surround the orthographic projection of the annular connecting portion 33 on the substrate 1, or the orthographic projection of the support portion 31 on the substrate 1 can coincide with the orthographic projection of the annular connecting portion 33, that is, the outline of the support portion 31 can also be the same as the outline of the annular connecting portion 33, such as a circle or an ellipse. This application does not limit the size and outline shape of the annular connecting portion 33 and the support portion 31.

[0075] In the various embodiments of this application, unless otherwise specified or in case of logical conflict, the terminology and / or descriptions of different embodiments are consistent and can be referenced by each other. The technical features of different embodiments can be combined to form new embodiments according to their inherent logical relationship.

[0076] The above description is only a specific implementation of this application, but the protection scope of this application is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the protection scope of this application.

Claims

1. A packaging structure, characterized in that, include: A substrate, a chip, and a thermally conductive cover plate; the chip is disposed on the substrate; The heat-conducting cover plate includes a support part, a heat-conducting part, and an annular connecting part; The support portion surrounds the chip and is fixedly connected to the substrate; the heat-conducting portion is located on the side of the chip away from the substrate, and the heat-conducting portion and the support portion are fixed to each other to form a receiving space, which is used to receive the chip; The annular connecting part is fixed to the side of the heat-conducting part away from the supporting part, and the outer wall of the annular connecting part is used to connect the heat exchange equipment.

2. The packaging structure as described in claim 1, characterized in that, The heat-conducting part includes one or more heat-conducting plates, which are arranged sequentially at intervals and stacked on the side of the chip away from the substrate, and a heat-conducting medium is provided between adjacent heat-conducting plates.

3. The packaging structure as described in claim 2, characterized in that, The one or more heat-conducting plates include a first heat-conducting plate, the surface of the first heat-conducting plate facing away from the chip having one or more of the following: heat dissipation protrusions, heat dissipation fins, and heat dissipation recesses. When the heat-conducting part includes multiple heat-conducting plates, the first heat-conducting plate is the heat-conducting plate farthest from the chip among the one or more heat-conducting plates.

4. The packaging structure as described in any one of claims 1-3, characterized in that, The orthographic projection of the annular connection portion on the substrate surrounds the orthographic projection of the chip on the substrate.

5. The packaging structure according to any one of claims 1-4, characterized in that, The orthographic projection of the support portion on the substrate at least partially overlaps with the orthographic projection of the annular connecting portion on the substrate, or the orthographic projection of the support portion on the substrate surrounds the orthographic projection of the annular connecting portion on the substrate.

6. The packaging structure as described in claim 5, characterized in that, The support portion is perpendicular to the substrate.

7. The packaging structure as described in claim 5, characterized in that, The support portion includes a first sub-part and a second sub-part connected to each other. The first sub-part is parallel to the substrate and connected to the substrate. The second sub-part is disposed at a set angle to the substrate. One end of the second sub-part is connected to the first sub-part, and the other end is connected to the heat-conducting portion.

8. The packaging structure according to any one of claims 1-7, characterized in that, The heat-conducting part and the supporting part are an integral structure, and the connection method between the heat-conducting part and the annular connecting part includes one of bonding, welding or screw connection.

9. The packaging structure according to any one of claims 1-7, characterized in that, The heat-conducting part and the annular connecting part are an integral structure, and the connection method between the heat-conducting part and the supporting part includes one of bonding, welding or screw connection.

10. The packaging structure according to any one of claims 1-7, characterized in that, The heat-conducting part, the supporting part, and the annular connecting part are an integrated structure, or the heat-conducting part, the supporting part, and the annular connecting part are separate structures. The connection method between the heat-conducting part and the annular connecting part includes one of bonding, welding, or screw connection, and the connection method between the heat-conducting part and the supporting part includes one of bonding, welding, or screw connection.

11. The packaging structure according to any one of claims 1-10, characterized in that, It also includes a thermally conductive layer, which is located between the chip and the thermally conductive portion of the thermally conductive cover plate.

12. An electronic device, characterized in that, The invention includes a heat exchange device and an encapsulation structure as described in any one of claims 1-11, wherein the heat exchange device includes a nozzle connected to the outer wall of the annular connecting portion of the encapsulation structure.

13. The electronic device as claimed in claim 12, characterized in that, A sealing ring is provided at the connection between the nozzle and the outer wall.

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