High-speed connector

Abstract

The invention discloses a high-speed connector. The high-speed connector comprises an insulating body; the conductive contact assembly is arranged on the insulating body, the conductive contact assembly comprises a plurality of first conductive contact pieces and a plurality of second conductive contact pieces, and the plurality of first conductive contact pieces and the plurality of second conductive contact pieces are arranged along the length direction of the insulating body; a first plugging space, a second plugging space and a communication channel are formed between the first conductive contact piece and the second conductive contact piece, the first plugging space and the second plugging space are communicated through the communication channel, and the communication channel is arranged in the first direction. The first plug-in space and the second plug-in space extend along the second direction and are arranged at intervals along the first direction, the first plug-in space is used for being matched with a high-speed connector in a plug-in manner, and the second plug-in space is used for being matched with an OCP card in a plug-in manner; the first direction and the second direction form an included angle. According to the scheme, the integration level is improved, the structure is compact, and a high-speed link is shortened.

Description

Technical Field

[0001] This invention relates to the field of electrical connector technology, and in particular to a high-speed connector. Background Art

[0002] In existing technologies, high-performance electronic systems such as servers and data center switching equipment typically use multiple independent connectors to achieve signal transmission between the motherboard and expansion modules (such as OCP cards). These traditional connectors are mostly single-interface designs, connected to each other via PCB traces or external adapters. This not only occupies a lot of wiring space and limits the high-density integration of the system, but also the long signal path is prone to problems such as impedance mismatch, crosstalk, and signal attenuation, affecting high-frequency performance. Summary of the Invention

[0003] The main objective of this invention is to propose a high-speed connector that improves integration, reduces structural compactness, and shortens high-speed links.

[0004] To achieve the above objectives, the present invention provides a high-speed connector comprising:

[0005] Insulating body;

[0006] A conductive contact assembly is disposed on the insulating body. The conductive contact assembly includes a plurality of first conductive contacts and a plurality of second conductive contacts, all of which are arranged along the length direction of the insulating body.

[0007] A first insertion space, a second insertion space, and a connecting channel are formed between the first conductive contact and the second conductive contact. The first insertion space and the second insertion space are connected through the connecting channel. The connecting channel is arranged along the first direction. The first insertion space and the second insertion space extend along the second direction and are spaced apart along the first direction. The first insertion space is used to insert and cooperate with a high-speed connector, and the second insertion space is used to insert and cooperate with an OCP card.

[0008] The first direction and the second direction are set at an angle.

[0009] In one embodiment, the first conductive contact has a first connecting portion, a second connecting portion, and a third connecting portion. The first connecting portion and the second connecting portion are respectively disposed at both ends of the third connecting portion. The third connecting portion extends along the first direction. The first connecting portion and the second connecting portion extend opposite to each other along the second direction and are spaced apart along the first direction.

[0010] The second conductive contact has a fourth connecting portion, a fifth connecting portion and a sixth connecting portion. The fourth connecting portion and the fifth connecting portion are respectively disposed at both ends of the sixth connecting portion. The sixth connecting portion extends along the first direction. The fourth connecting portion and the fifth connecting portion extend opposite to each other along the second direction and are spaced apart along the first direction.

[0011] The first connecting portion and the fourth connecting portion are arranged opposite each other to form the first insertion space, the second connecting portion and the fifth connecting portion are arranged opposite each other to form the second insertion space, and the third connecting portion and the sixth connecting portion are arranged opposite each other to form the communication channel.

[0012] In one embodiment, the first conductive contact has a first protrusion and a second protrusion that protrude toward the second conductive contact, the first protrusion being disposed on the first connecting portion and the second protrusion being disposed on the second connecting portion;

[0013] The second conductive contact has a third protrusion and a fourth protrusion that protrude toward the first conductive contact, the third protrusion being disposed on the fifth connecting portion and the fourth protrusion being disposed on the sixth connecting portion;

[0014] The first protrusion and the third protrusion are arranged opposite each other to form a first slot. The first slot is located in the first insertion space and is used to insert and cooperate with a high-speed connector. The second protrusion and the fourth protrusion are arranged opposite each other to form a second slot. The second protrusion is located in the second insertion space and is used to insert and cooperate with an OCP card.

[0015] In one embodiment, both the first card slot and the second card slot are elastic holding structures.

[0016] In one embodiment, the elastic holding structure is a cantilevered elastic contact arm structure.

[0017] In one embodiment, the insulating body is provided with a first opening corresponding to the first insertion space and a second opening corresponding to the second insertion space.

[0018] In one embodiment, the insulating body includes a bottom wall, side walls extending along the first direction on both sides of the bottom wall, and a top wall opposite to the bottom wall and connecting the two side walls. The bottom wall has the first opening along the first direction, and the top wall has the first opening along the first direction.

[0019] In one embodiment, the top wall has a guide ramp at the edge of the first opening to guide the high-speed connector insertion.

[0020] In one embodiment, the high-speed connector further includes a shielding housing, which covers the outside of the insulating body. The shielding housing has a third opening corresponding to the first insertion space and a fourth opening corresponding to the second insertion space. The shielding housing is used for grounding.

[0021] In one embodiment, a plurality of first conductive contacts and a plurality of second conductive contacts are arranged in a differential pair structure along the length direction of the insulating body, and a grounding shield is provided between adjacent first conductive contacts and second conductive contacts, the grounding shield being electrically connected to the shielding shell.

[0022] This invention discloses a high-speed connector that enables high-speed signal interconnection between two independent mating spaces within a single connector. The connector primarily comprises an insulating body, serving as a supporting and insulating foundation. Within the insulating body are conductive contact components, including multiple first conductive contacts and multiple second conductive contacts. These conductive contacts are arranged sequentially along the length of the insulating body, forming multiple parallel signal transmission paths. Between the first and second conductive contacts, three regions are formed: a first mating space, a second mating space, and a connecting channel between them. The first mating space is used to connect to a high-speed connector on the motherboard, receiving high-speed electrical signals from the motherboard. The second mating space is used to connect to an OCP card (a commonly used expansion module in data centers) to expand functionality. The connecting channel acts as a signal transmission bridge between the two mating spaces, enabling efficient signal transmission between the motherboard and the expansion module. In terms of structural layout, the connecting channel extends along a first direction, while the first and second mating spaces extend along a second direction, and are spaced apart from each other along the first direction, with the two directions arranged at an angle (usually perpendicular). This staggered arrangement design not only improves the utilization of the connector's internal space but also allows the motherboard connector and OCP card to be inserted into the same connector from different directions, relaying signals through the central connecting channel. This design greatly enhances the connector's integration and flexibility, while also helping to optimize signal integrity, reduce high-frequency interference, and shorten high-speed links. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0024] Figure 1A schematic diagram of a high-speed connector according to an embodiment of the present invention;

[0025] Figure 2 A schematic diagram of another embodiment of the high-speed connector provided by the present invention;

[0026] Figure 3 This is a partial structural schematic diagram of an embodiment of the high-speed connector provided by the present invention;

[0027] Figure 4 This is a schematic diagram of an embodiment of the conductive contact component in the high-speed connector provided by the present invention.

[0028] Explanation of reference numerals in the attached figures:

[0029] 10. Insulating body; 11. First opening; 12. Second opening; 13. Bottom wall; 14. Side wall; 15. Top wall; 151. Guide slope; 20. Conductive contact assembly; 21. First conductive contact; 211. First connecting part; 212. Second connecting part; 213. Third connecting part; 214. First protrusion; 215. Second protrusion; 22. Second conductive contact; 221. Fourth connecting part; 222. Fifth connecting part; 223. Sixth connecting part; 224. Third protrusion; 225. Fourth protrusion; 23. First insertion space; 24. Second insertion space; 25. Connecting channel; 26. First slot; 27. Second slot.

[0030] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0032] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0033] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0034] This invention proposes a high-speed connector.

[0035] Reference Figures 1-4 In this embodiment of the invention, a high-speed connector includes:

[0036] Insulating body 10;

[0037] A conductive contact assembly 20 is disposed on the insulating body 10. The conductive contact assembly 20 includes a plurality of first conductive contacts 21 and a plurality of second conductive contacts 22, wherein the plurality of first conductive contacts 21 and the plurality of second conductive contacts 22 are arranged along the length direction of the insulating body 10; wherein...

[0038] A first insertion space 23, a second insertion space 24, and a connecting channel 25 are formed between the first conductive contact 21 and the second conductive contact 22. The first insertion space 23 and the second insertion space 24 are connected through the connecting channel 25, which is arranged along the first direction. The first insertion space 23 and the second insertion space 24 extend along the second direction and are spaced apart along the first direction. The first insertion space 23 is used for insertion and mating with a high-speed connector, and the second insertion space 24 is used for insertion and mating with an OCP card.

[0039] The first direction and the second direction are set at an angle.

[0040] This invention discloses a high-speed connector, mainly comprising the following components: an insulating body 10, serving as the basic structure of the entire connector, used to support and isolate internal conductive components. It typically uses high-performance engineering plastic materials such as LCP or PBT, possessing excellent insulation and heat resistance. The conductive contact assembly 20 includes multiple first conductive contacts 21 and multiple second conductive contacts 22 arranged along the length of the insulating body, forming multiple independent signal transmission paths. Three spaces are formed between the first and second conductive contacts. The first insertion space 23 is used for insertion with a high-speed connector on the motherboard or cable end, primarily responsible for receiving high-speed electrical signals from the motherboard. The second insertion space 24 is used for insertion with an OCP card (OpenCompute Project card), an expansion card for data centers, enabling support for extended functions such as networking and storage. A connecting channel 25 is located between the first insertion space 23 and the second insertion space 24, serving as a bridge for signal transmission and realizing electrical connection between the two insertion spaces. The first insertion space 23 and the second insertion space 24 are arranged alternately in the first direction, with each insertion space extending along the second direction. The connecting channel 25 in the middle runs through the area between the two insertion spaces along the first direction. This staggered arrangement design allows high-speed connectors on the motherboard or cable end and the OCP card to be inserted into the same connector in different directions, with the same connector simultaneously connecting two different interface objects, improving integration. Connecting the two insertion spaces through the connecting channel 25 in the middle enables a direct signal path from the motherboard to the OCP card, reducing high-frequency interference problems such as signal reflection and crosstalk, and improving signal integrity. The second direction refers to the extension direction of the first insertion space 23 and the second insertion space 24, corresponding to the insertion depth direction of the connector, i.e., the direction in which the connector on the motherboard or cable end and the OCP card penetrate deep into the connector after insertion. The first direction and the second direction are set at an angle, with the first direction determining the direction of signal transmission between the motherboard connector and the OCP card. Specifically, when the motherboard connector is inserted into the first insertion space 23, its conductive terminals form an electrical connection with the first conductive contact 21 and the second conductive contact 22. Similarly, when the OCP card is inserted into the second insertion space 24, it also forms a connection with the corresponding conductive contact. Therefore, the transmission path of this design is as follows: the signal travels from the motherboard to the first insertion space 23, then to the first conductive contact 21, then to the connecting channel 25, then to the second conductive contact 22, then to the second insertion space 24, and finally to the OCP card, and vice versa. Therefore, compared to the conventional link of CPU to MCIO, MCIO to PCB, PCB to OCP connector, the link using the high-speed connector of this invention is CPU to MCIO connector, MCIO to OCP connector (invention), eliminating the loss of traces on the PCB.Therefore, this solution utilizes a multi-layer conductive contact design and staggered insertion space to achieve efficient signal communication between the motherboard and expansion modules, while also ensuring high-speed signal integrity, structural compactness, shortening the high-speed link to reduce trace loss on the PCB, improving ease of plugging and unplugging maintenance, and increasing connector integration.

[0041] Reference Figures 1-4 In this embodiment of the invention, the first conductive contact 21 has a first connecting portion 211, a second connecting portion 212 and a third connecting portion 213. The first connecting portion 211 and the second connecting portion 212 are respectively disposed at both ends of the third connecting portion 213. The third connecting portion 213 extends along the first direction. The first connecting portion 211 and the second connecting portion 212 extend relative to each other along the second direction and are spaced apart along the first direction.

[0042] The second conductive contact 22 has a fourth connecting portion 221, a fifth connecting portion 222 and a sixth connecting portion 223. The fourth connecting portion 221 and the fifth connecting portion 222 are respectively disposed at both ends of the sixth connecting portion 223. The sixth connecting portion 223 extends along the first direction. The fourth connecting portion 221 and the fifth connecting portion 222 extend relative to each other along the second direction and are spaced apart along the first direction.

[0043] The first connecting portion 211 and the fourth connecting portion 221 are arranged opposite each other to form the first insertion space 23, the second connecting portion 212 and the fifth connecting portion 222 are arranged opposite each other to form the second insertion space 24, and the third connecting portion 213 and the sixth connecting portion 223 are arranged opposite each other to form the communication channel 25.

[0044] The first connecting portion 211 and the fourth connecting portion 221 are arranged opposite each other to form a first insertion space 23. The second connecting portion 212 and the fifth connecting portion 222 are arranged opposite each other to form a second insertion space 24. The third connecting portion 213 and the sixth connecting portion 223 are arranged opposite each other to form a connecting channel 25. That is, the two conductive contacts form two insertion spaces and an intermediate signal transmission channel through their respective multiple connecting portions. This structure allows a single conductive contact assembly to include an insertion area facing the motherboard connector (first insertion space), an insertion area facing the expansion module (such as an OCP card) (second insertion space), and a signal conduction path between the two (connecting channel), thereby realizing bidirectional communication between the motherboard and the expansion module within a single connector. The connecting channel is located between the two insertion spaces, forming a direct, short-distance signal path, reducing interference such as high-frequency signal reflection and crosstalk. The third and sixth connecting portions, arranged along the first direction, provide a stable and symmetrical transmission path for the signal, helping to maintain signal quality. The insertion space is composed of oppositely positioned connecting parts, forming a stable insertion interface. Connectors on the motherboard or cable end and the OCP card can be inserted at different stages without interference, supporting hot-swapping of the OCP card and improving system maintainability and flexibility. In this embodiment, the first and second directions form an angle (usually perpendicular), and the connecting parts in different directions can form a good shielding structure, reducing electromagnetic interference between adjacent signal lines and improving the overall system stability. This design enables a single connector to simultaneously support connections to the motherboard and expansion modules.

[0045] Reference Figures 1-4 In this embodiment of the invention, the first conductive contact 21 has a first protrusion 214 and a second protrusion 215 that protrude toward the second conductive contact 22. The first protrusion 214 is disposed on the first connecting portion 211, and the second protrusion 215 is disposed on the second connecting portion 212.

[0046] The second conductive contact 22 has a third protrusion 224 and a fourth protrusion 225 that protrude toward the first conductive contact 21. The third protrusion 224 is provided on the fifth connecting portion 222, and the fourth protrusion 225 is provided on the sixth connecting portion 223.

[0047] The first protrusion 214 and the third protrusion 224 are disposed opposite to each other to form a first slot 26. The first slot 26 is located in the first insertion space 23 and is used to be inserted and engaged with a high-speed connector. The second protrusion 215 and the fourth protrusion 225 are disposed opposite to each other to form a second slot 27. The second protrusion 215 is located in the second insertion space 24 and is used to be inserted and engaged with an OCP card.

[0048] The two protrusions on the first conductive contact 21, namely the first protrusion 214 and the second protrusion 215, and the two protrusions on the second conductive contact 22, namely the third protrusion 224 and the fourth protrusion 225, are arranged opposite each other to form two slot structures. The first protrusion 214 and the third protrusion 224 are arranged opposite each other to form the first slot 26, which is located in the first insertion space 23 and is used for insertion and mating with the high-speed connector. The second protrusion 215 and the fourth protrusion 225 are arranged opposite each other to form the second slot 27, which is located in the second insertion space 24 and is used for insertion and mating with the OCP card. The slot structure formed by the protrusions provides a clear insertion path for the inserted terminal. The slots can guide, limit, and clamp the inserted terminal, improving the stability during insertion and removal, preventing displacement or loosening, and thus improving the connection reliability. Furthermore, the protrusion is usually made of elastic material or has an elastic structure. During the insertion process, the protrusion can generate a certain deformation pressure, so that the terminal and the conductive contact can maintain good contact pressure. This design helps to reduce contact resistance and improve current transmission efficiency, and is especially suitable for high-frequency and high-speed signal transmission scenarios.

[0049] Reference Figures 1-4 In this embodiment of the invention, both the first card slot 26 and the second card slot 27 are elastic holding structures.

[0050] The first slot 26 for inserting high-speed connectors and the second slot 27 for inserting OCP cards are inherently elastic, meaning they can deform under external force during insertion and return to their original shape after the force is removed. Understandably, when a terminal is inserted, the first slot 26 and the second slot 27 open due to elastic deformation, automatically clamping the terminal after insertion to achieve stable contact. This elastic clamping structure provides appropriate clamping force during terminal insertion, preventing poor contact or signal interruption due to loosening. Especially in high-frequency, high-speed transmission, even slight contact instability can cause severe signal distortion. The elastic structure ensures good contact pressure between the terminal and the conductive component, reducing contact resistance and improving current transmission efficiency.

[0051] Reference Figures 1-4 In this embodiment of the invention, the elastic holding structure is a cantilevered elastic contact arm structure.

[0052] A cantilevered elastic contact arm structure refers to a structure where one end of the cantilever is fixed to the conductive contact body, while the other end is free and capable of elastic deformation. When a terminal is inserted, the free end of the cantilever opens under pressure, guiding the terminal smoothly into the slot. After insertion, the cantilever springs back to clamp the terminal, forming a stable contact pressure and preventing loosening or detachment. It also clamps the terminal, forming a stable electrical and mechanical connection. The cantilever structure has elastic properties, enabling controllable deformation during insertion and removal, and quickly returning to its original shape after release. This makes it ideal for use as an elastic holding element in a slot, ensuring stable contact after each insertion and removal.

[0053] Reference Figures 1-4 In this embodiment of the invention, the insulating body 10 is provided with a first opening 11 corresponding to the first insertion space 23 and a second opening 12 corresponding to the second insertion space 24.

[0054] Two openings, a first opening 11 and a second opening 12, are formed on the insulating body 10 of the high-speed connector. The first opening 11 corresponds to a first insertion space 23, which is used for the insertion of the high-speed connector. The second opening 12 corresponds to a second insertion space 24, which is used for the insertion of an OCP card or other expansion module. In other words, these openings are external entrances to the conductive contact components, providing an insertion path for the high-speed connector (which can be a motherboard connector or a cable connector) or the OCP card, and guiding its conductive terminals to the corresponding insertion space to complete the electrical connection. The openings serve a positioning and guiding function. When the high-speed connector (which can be a motherboard connector or a cable connector) or the OCP card is inserted, its terminals will accurately enter the corresponding insertion space along the opening, avoiding offset or misalignment, thereby improving the success rate and stability of the insertion. Since the first and second openings correspond to different insertion objects, namely the high-speed connector (which can be a motherboard connector or a cable connector) and the OCP card, they can be inserted and removed independently without affecting each other, providing the system with good maintainability and flexible expansion capabilities.

[0055] Reference Figures 1-4 In this embodiment of the invention, the insulating body 10 includes a bottom wall 13, side walls 14 formed by extending along the first direction on both sides of the bottom wall 13, and a top wall 15 that is disposed opposite to the bottom wall 13 and connects the two side walls 14. The bottom wall 13 has a first opening 11 along the first direction, and the top wall 15 has a first opening 12 along the first direction.

[0056] By designing the insulating body 10 as an integral structure with a bottom wall 13, side walls 14, and top wall 15, stronger structural rigidity and stability can be provided. Openings are provided in the bottom wall 13 and top wall 15, allowing high-speed connectors (which can be motherboard connectors or cable connectors) or OCP cards to be inserted from different directions. This symmetrical or layered layout design allows the connector to accommodate multiple mating interfaces in a limited space, improving integration and space utilization, making it ideal for high-density electronic devices.

[0057] Reference Figures 1-4 In this embodiment of the invention, the top wall 15 is provided with a guide slope 151 at the edge of the first opening 11 to guide the insertion of the high-speed connector.

[0058] When the high-speed connector is inserted, the inclined angle of the ramp 151 guides the insertion terminal, helping it to enter the first opening more smoothly and accurately align with the mating space formed by the internal conductive contacts. The guide ramp can guide the insertion terminal to the correct mating position, avoiding poor contact, signal interruption, or even mechanical damage caused by misalignment, thereby improving the overall stability and reliability of the connector.

[0059] Reference Figures 1-4 In this embodiment of the invention, the high-speed connector further includes a shielding shell, which covers the outside of the insulating body 10. The shielding shell is provided with a third opening corresponding to the first insertion space 23 and a fourth opening corresponding to the second insertion space 24. The shielding shell is used for grounding.

[0060] A shielding shell is added to the outside of the high-speed connector. This shielding shell covers the outside of the insulating body 10 and has openings corresponding to the internal insertion spaces—a third opening and a fourth opening. The shielding shell completely encloses the insulating body 10 and its internal conductive contact components. Two openings are formed on the shielding shell. The third opening corresponds to the first insertion space 23 (for high-speed connector insertion), and the fourth opening corresponds to the second insertion space 24 (for OCP card insertion). Because the shielding shell has multiple openings (the third and fourth openings), each corresponding to a different insertion space, it allows different modules to be inserted and removed independently without interfering with each other while ensuring shielding performance, thus improving the flexibility and expandability of the connector. Simultaneously, the shielding shell also has a grounding function, i.e., electromagnetic shielding is achieved through grounding. This structure protects internal signal transmission from external interference and prevents the connector itself from interfering with external circuits. Furthermore, the shielding shell is provided with an elastic grounding spring, which provides an electrical connection and continuous grounding pressure when inserted with the high-speed connector or OCP card.

[0061] Reference Figures 1-4 In this embodiment of the invention, a plurality of first conductive contacts 21 and a plurality of second conductive contacts 22 are arranged in a differential pair structure along the length direction of the insulating body 10, and a grounding shield is provided between adjacent first conductive contacts 21 and second conductive contacts 22, and the grounding shield is electrically connected to the shielding shell.

[0062] Multiple first conductive contacts 21 and second conductive contacts 22 in the conductive contact assembly are arranged in a differential pair configuration. Each signal transmission path consists of two opposing conductive contacts, used to transmit a pair of high-speed signals with opposite polarities. Grounding shields are placed between adjacent differential pairs. These grounding shields not only provide isolation but also connect electrically to the external shielding housing, thus achieving effective grounding. In high-density wiring, electromagnetic interference is prone to occur between different signal lines. By adding grounding shields between adjacent differential pairs, the electromagnetic fields between them can be effectively isolated, significantly reducing crosstalk and improving system stability. After the grounding shields are electrically connected to the shielding housing, it is equivalent to placing the entire conductive contact assembly in a closed or semi-closed shielded environment, which not only improves the isolation between individual signal pairs but also enhances the overall connector's resistance to external electromagnetic interference. In addition to its electromagnetic function, the grounding shields also serve as a physical spacing structure between conductive contacts, enhancing the overall structural stability and rigidity, while also aiding in heat conduction and dissipation, improving the connector's reliability under high loads.

[0063] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A high-speed connector, characterized in that, include: Insulating body; A conductive contact assembly is disposed on the insulating body. The conductive contact assembly includes a plurality of first conductive contacts and a plurality of second conductive contacts, all of which are arranged along the length direction of the insulating body. A first insertion space, a second insertion space, and a connecting channel are formed between the first conductive contact and the second conductive contact. The first insertion space and the second insertion space are connected through the connecting channel. The connecting channel is arranged along the first direction. The first insertion space and the second insertion space extend along the second direction and are spaced apart along the first direction. The first insertion space is used to insert and cooperate with a high-speed connector, and the second insertion space is used to insert and cooperate with an OCP card. The first direction and the second direction are set at an angle.

2. The high-speed connector as described in claim 1, characterized in that, The first conductive contact has a first connecting portion, a second connecting portion and a third connecting portion. The first connecting portion and the second connecting portion are respectively disposed at both ends of the third connecting portion. The third connecting portion extends along the first direction. The first connecting portion and the second connecting portion extend relative to each other along the second direction and are spaced apart along the first direction. The second conductive contact has a fourth connecting portion, a fifth connecting portion and a sixth connecting portion. The fourth connecting portion and the fifth connecting portion are respectively disposed at both ends of the sixth connecting portion. The sixth connecting portion extends along the first direction. The fourth connecting portion and the fifth connecting portion extend opposite to each other along the second direction and are spaced apart along the first direction. The first connecting portion and the fourth connecting portion are arranged opposite each other to form the first insertion space, the second connecting portion and the fifth connecting portion are arranged opposite each other to form the second insertion space, and the third connecting portion and the sixth connecting portion are arranged opposite each other to form the communication channel.

3. The high-speed connector as described in claim 2, characterized in that, The first conductive contact has a first protrusion and a second protrusion that protrude toward the second conductive contact. The first protrusion is disposed on the first connecting portion, and the second protrusion is disposed on the second connecting portion. The second conductive contact has a third protrusion and a fourth protrusion that protrude toward the first conductive contact, the third protrusion being disposed on the fifth connecting portion and the fourth protrusion being disposed on the sixth connecting portion; The first protrusion and the third protrusion are arranged opposite each other to form a first slot. The first slot is located in the first insertion space and is used to insert and cooperate with a high-speed connector. The second protrusion and the fourth protrusion are arranged opposite each other to form a second slot. The second protrusion is located in the second insertion space and is used to insert and cooperate with an OCP card.

4. The high-speed connector as described in claim 3, characterized in that, Both the first and second card slots are elastic holding structures.

5. The high-speed connector as described in claim 4, characterized in that, The elastic holding structure is a cantilevered elastic contact arm structure.

6. The high-speed connector as claimed in claim 1, characterized in that, The insulating body is provided with a first opening corresponding to the first insertion space and a second opening corresponding to the second insertion space.

7. The high-speed connector as described in claim 6, characterized in that, The insulating body includes a bottom wall, side walls extending along the first direction on both sides of the bottom wall, and a top wall opposite to the bottom wall and connecting the two side walls. The bottom wall has the first opening along the first direction, and the top wall has the first opening along the first direction.

8. The high-speed connector as claimed in claim 7, characterized in that, The top wall has a guide slope at the edge of the first opening to guide the high-speed connector insertion.

9. The high-speed connector as claimed in claim 1, characterized in that, The high-speed connector also includes a shielding housing, which covers the outside of the insulating body. The shielding housing has a third opening corresponding to the first insertion space and a fourth opening corresponding to the second insertion space. The shielding housing is used for grounding.

10. The high-speed connector as claimed in claim 9, characterized in that, Multiple first conductive contacts and multiple second conductive contacts are arranged in a differential pair structure along the length of the insulating body. A grounding shield is provided between adjacent first conductive contacts and second conductive contacts, and the grounding shield is electrically connected to the shielding shell.

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