Polyphenyl ether resin composition, polyphenyl ether composite material and preparation method and application thereof

By adding naphthoic acid compounds to polyphenylene ether resin to form quinone structures to end the polyphenylene ether resin, the problems of poor gas barrier properties and insufficient high-temperature processing stability are solved, and efficient gas barrier properties and stable injection molding processing of polyphenylene ether composite materials are achieved.

CN120865535APending Publication Date: 2025-10-31KINGFA SCI & TECH CO LTD
View PDF 3 Cites 0 Cited by

Patent Information

Application Number
CN202410537493.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-04-30
Publication Date
2025-10-31

Smart Images

  • Figure CN120865535A_ABST
    Figure CN120865535A_ABST
Patent Text Reader

Abstract

The invention discloses a polyphenyl ether resin composition, a polyphenyl ether composite material and a preparation method and application thereof. The polyphenyl ether resin composition is obtained by reacting polyphenyl ether and naphthoic acid compounds in a melt, the polyphenyl ether has a repeating unit with the following structure: R1, R2, R3 and R4 are respectively and independently hydrogen, halogen, primary or secondary lower alkyl, phenyl, halogenated alkyl, alkoxy or halogenated alkoxy; the naphthoic acid compound is at least one of naphthoic acid or hydroxyl naphthoic acid. Compared with polyphenyl ether resin, the polyphenyl ether resin not only can improve the gas barrier property of the polyphenyl ether composite material in a melt, but also can improve the high-temperature injection molding processing stability of the polyphenyl ether composite material.
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Preparation method of semi-aromatic polyamide alloy

    CN102796368A

  • Halogen-free flame-retardant polyphenyl ether composite material as well as preparation method and application thereof

    CN114517008A

  • Polyphenylene ether capped with salicylic acid ester

    US4760118A