Composite film material for cleaning probe of probe card and preparation method of composite film material

Abstract

The invention discloses a composite film material for probe card cleaning and a preparation method thereof, and belongs to the technical field of probe card cleaning, and the composite film material comprises a bonding layer, a cushion layer and a functional layer which are stacked in sequence; the tight connection between the composite film material and the substrate is realized through the bonding layer, the cushion layer particles are added in the cushion layer, the first microstructure with macroscopic roughness is formed on the surface of the cushion layer, the functional layer particles with relatively small particle size are added in the functional layer, and the microcosmic roughness is formed on the surface of the functional layer. By means of the synergistic effect of the two different kinds of roughness, efficient removal of pollutants of different sizes is achieved, the cleaning efficiency and adaptability are remarkably improved, meanwhile, by controlling the particle size of particles in each layer, the cleaning effect is guaranteed, and meanwhile the cleaning effect is improved. Therefore, the tip structure of the probe is prevented from being damaged, the probe can be ground and polished, and the service life of the probe is effectively prolonged.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of probe card cleaning, and particularly relates to a composite film material for probe card cleaning and a preparation method thereof. BACKGROUND

[0002] In the semiconductor manufacturing process, as one of the key electrical test tools, the performance of the probe card is crucial to ensure the accuracy and reliability of the test results. In practical applications, the probe inevitably accumulates various forms of pollutants ranging from nanometer scale (<100 nm) to micron scale (1-10 μm) after long-term use. These pollutants include, but are not limited to, metal debris (such as gold, copper, tungsten, aluminum, etc.), oxide particles (silicon dioxide, aluminum oxide, etc.), organic residues (such as photoresist, grease, etc.), and polymer dust, etc. impurities, which can significantly affect the electrical contact quality between the probe and the test point, increase the contact resistance, reduce the accuracy and consistency of the test results, and may even cause false positives, false negatives, or even device failure, thereby threatening the production yield and product quality. Therefore, in order to maintain the high performance and long life of the probe card, effective cleaning and maintenance is essential.

[0003] Currently, the industry often uses adhesive cleaning products to maintain the probe card. Such products mainly remove pollutants by setting a layer of adhesive polymer on their surface. However, this method has significant limitations, as its cleaning efficiency is highly dependent on the adhesion of the adhesive layer, and sub-micron and nanometer-sized harmful residues cannot be effectively removed, and secondary pollution is likely to occur, with limited improvement in contact resistance after cleaning. SUMMARY

[0004] In view of one or more of the above defects or improvement needs of the prior art, the present application provides a composite film material for probe card cleaning and a preparation method thereof, which has a composite abrasive film material system with a double-scale roughness structure. Through the synergistic effect of micro-roughness and macro-roughness, it can efficiently remove pollutants of different sizes while avoiding damage to the probe tip structure, significantly improving cleaning efficiency and adaptability.

[0005] To achieve the above-mentioned purpose, in one aspect of the present application, a composite film material for probe card cleaning is provided, which comprises an adhesive layer, a pad layer and a functional layer arranged in sequence. The material of the adhesive layer includes a first polymer matrix with strong adhesion, which is used to adhere to the substrate. The material of the pad layer comprises a second polymer matrix and pad layer particles, the pad layer particles have a particle size of 3-10 μm and are uniformly dispersed in the second polymer matrix, and the side of the pad layer away from the adhesive layer is provided with a first microstructure which is periodic or aperiodic, and macro-roughness is formed on the surface of the pad layer. The material of the functional layer comprises a third polymer matrix and functional layer particles, the functional layer particles have a particle size of 0.5-1 μm and are uniformly dispersed in the first polymer matrix, and micro-roughness is formed on the surface of the functional layer.

[0006] As a further improvement of the present application, the macro-roughness Ra1 formed by the first microstructure is 5-15 μm, and the micro-roughness Ra2 formed by the functional layer particles on the surface of the functional layer is 1-1.5 μm.

[0007] As a further improvement of the present application, the thickness of the adhesive layer is 0.5-5 μm, and / or the thickness of the pad layer is 5-15 μm, and / or the thickness of the functional layer is 2-3 μm.

[0008] As a further improvement of the present application, the first microstructure is in the form of a multi-scale corrugated or grooved structure.

[0009] As a further improvement of the present application, the side of the functional layer away from the pad layer is provided with a second microstructure which is periodic or aperiodic, and macro-roughness Ra3 formed on the surface of the functional layer is 2-7 μm.

[0010] In another aspect of the present application, a preparation method of a composite film material for probe card cleaning is provided, comprising the following steps: (1) physically grinding inorganic particles, and performing step-by-step screening on the ground particles to obtain pad layer particles with a particle size of 3-10 μm and functional layer particles with a particle size of 0.5-1 μm; (2) mixing the first polymer matrix in a first solvent to obtain an adhesive layer coating, mixing the second polymer matrix and the pad layer particles in a second solvent to obtain a pad layer coating with a viscosity of 100-200 mPa·s, and mixing the third polymer matrix and the functional layer particles in a third solvent to obtain a functional layer coating; (3) spin coating the adhesive layer coating on a substrate and drying to obtain an adhesive layer, spin coating the pad layer coating on the adhesive layer by shaking and drying to obtain a pad layer with a first microstructure on the surface, and spin coating the functional layer coating on the pad layer and drying to obtain a functional layer, thereby completing the preparation of the composite film material for probe card cleaning.

[0011] As a further improvement of the present application, in step (2), the content of the cushion layer particles in the cushion layer coating is 30-60wt%, and the content of the functional layer particles in the functional layer coating is 10-30wt%; and / or, In step (2), the viscosity of the obtained adhesive layer coating is 30-70mPa·s, and the viscosity of the functional layer coating is 140-270mPa·s.

[0012] As a further improvement of the present application, in step (2), a coupling agent is added to the adhesive layer coating, and the content of the coupling agent is 0.5-3wt%.

[0013] As a further improvement of the present application, in step (3), the spin coating speed of the adhesive layer coating is 1000-3000rpm, the spin coating time is 20-60s, and the spin coating thickness is 0.5-5μm; the spin coating speed of the cushion layer coating is 500-3000rpm, the spin coating time is 30-80s, and the spin coating thickness is 5-15μm; the spin coating speed of the functional layer coating is 3000-6000rpm, the spin coating time is 20-30s, and the spin coating thickness is 2-3μm.

[0014] As a further improvement of the present application, in step (3), when the adhesive layer coating is dried, it is first pre-dried at a low temperature of 30℃ to remove the solvent, and then cured at a medium temperature of 150℃ to help the cross-linking and curing between the first polymer substrate material and the substrate; When the cushion layer coating is dried, it is first pre-dried at 80℃ to remove the solvent, then cured at a medium temperature of 150℃ to complete the preliminary cross-linking between the second polymer substrate and the adhesive layer, and then cured at a high temperature of 200℃ to complete the cross-linking reaction between the second polymer substrate and the adhesive layer. When the functional layer coating is dried, it is first pre-dried at 100℃ to remove the solvent, then cured at a medium temperature of 150℃ to complete the preliminary cross-linking between the third polymer substrate and the cushion layer, and then cured at a high temperature of 230℃ to complete the cross-linking reaction between the third polymer substrate and the cushion layer.

[0015] The above technical features can be combined with each other as long as they do not conflict with each other.

[0016] Overall, compared with the prior art, the above technical solutions conceived by the present application have the following beneficial effects: (1) The composite film material for probe card cleaning and its preparation method, by adding cushion particles in the cushion layer and forming a first microstructure with macro-roughness on the surface of the cushion layer, and adding functional layer particles with relatively small particle size in the functional layer and forming micro-roughness on the surface of the functional layer, thereby forming roughness of two levels of micro and macro, utilizing the synergistic effect of two different roughnesses, realizing efficient removal of pollutants of different scales, significantly improving the cleaning efficiency and adaptability, and by controlling the particle size of the particles in each layer, the cleaning effect is ensured while avoiding damage to the probe tip structure, and the probe can be polished, effectively improving the service life of the probe.

[0017] (2) The composite film material for probe card cleaning and its preparation method, by setting the first microstructure and the second microstructure as multi-scale corrugated or grooved, to enhance the relative sliding friction effect between the probe and the film when the probe is inserted and pulled out, which not only improves the overall contact area, but also helps to direct the discharge of abrasive debris and prevent secondary pollution.

[0018] (3) The composite film material for probe card cleaning and its preparation method, with reasonable structure, through the synergistic effect between the layers during the cleaning of the probe card, not only improves the cleaning efficiency and quality, but also significantly reduces the maintenance cost and downtime caused by incomplete cleaning, and avoids the secondary pollution or probe corrosion problem that may be caused during the cleaning process, effectively improves the accuracy during the wafer testing process and prolongs the service life of the probe card, has good application prospect and popularization value. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0020] Figure 1 is a structure diagram of each layer in the composite film material for probe card cleaning in the embodiments of the present application; In all the drawings, the same reference signs represent the same technical features, specifically: 1, substrate; 2, adhesive layer; 201, first polymer matrix; 3, cushion layer; 301, first microstructure; 302, cushion particles; 303, second polymer matrix; 4, functional layer; 401, functional layer particles; 402, third polymer matrix; 403, second microstructure. DETAILED DESCRIPTION

[0021] In order to make the objects, technical solutions and advantages of the present application clearer, the following further describes the present application with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and should not be used to limit the present application. In addition, the technical features involved in the various embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0022] In the description of the present application, it should be understood that, unless otherwise explicitly specified and limited, the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0023] In addition, unless otherwise explicitly specified and limited, the terms "first", "second" are only for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0024] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, can be fixedly connected, or can be detachably connected, or can be integrated; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium; can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0025] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "on", "above" and "over" the second feature can be that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. The first feature "under", "below" and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is horizontally lower than the second feature.

[0026] Embodiments: Please refer to Figure 1 The composite film material for cleaning the probe card in the preferred embodiment of the present application comprises an adhesive layer 2, a pad layer 3 and a functional layer 4 arranged in sequence, so as to adhere the composite film material to the substrate 1 through the adhesive layer 2, and realize cleaning, grinding and polishing of the probe card through the pad layer 3 and the functional layer 4.

[0027] Specifically, the material of the adhesive layer 2 in the preferred embodiment comprises a first polymer matrix 201 and a coupling agent; wherein the first polymer matrix 201 can be epoxy resin, polyimide, polyurethane, etc., and the coupling agent molecule has a double-tube energy group structure, such as silane KH-550 and titanate coupling agent, which can form a covalent bond or a coordination bond with the inorganic substrate at one end, and can physically entangle or chemically cross-link with the organic polymer matrix at the other end, so as to form a "molecular bridge" at the interface, significantly improve the interface bonding strength, and then realize strong adhesion between the adhesive layer 2 and the substrate 1 through the combined action of chemical bonding, physical adsorption and interface cross-linking, preventing peeling or falling off during the cleaning process.

[0028] Preferably, the content of the coupling agent in the mixture with the first polymer matrix 201 is 0.5-3wt%, which can make the interface adhesion strength of the adhesive layer 2 increase by 30%-100%, reaching 15-25MPa or even higher.

[0029] Preferably, the thickness of the adhesive layer 2 is 0.5-5μm.

[0030] Further, the pad layer 3 in the preferred embodiment is arranged on one side of the adhesive layer 2, which is composed of a second polymer matrix 303 and pad particles 302 uniformly dispersed in the second polymer matrix 303; wherein the pad particles 302 are inorganic particles, which can be any one or a combination of two or more of silicon dioxide, aluminum oxide, silicon carbide, silicon carbide and diamond, so as to grind the probe when the probe is inserted into the film material, generate friction between the pad particles 302 and the surface of the probe, clean most of the contaminants on the probe, and enhance the mechanical strength, thermal stability and supporting capacity of the pad layer 3.

[0031] Preferably, the particle size of the cushion layer particles 302 is 3-10 μm, and the Vickers hardness is ≥800 HV, so as to generate moderate friction on the probe surface, effectively remove contaminants, and not damage the probe.

[0032] Correspondingly, the second polymer matrix 303 is a polymer with high and low temperature resistance and strong adhesion, such as epoxy resin, polyurethane, silicone rubber, polyimide, etc., so that the cushion layer 3 maintains good performance in high and low temperature environments, and captures the contaminants abraded from the probe through the strong adhesion of the second polymer matrix 303, prevents them from re-attaching to the probe, polluting the internal equipment, and avoids secondary pollution; at the same time, the second polymer matrix 303 not only gives the film good flexibility and adhesion, but also effectively buffers the impact force during the polishing process of the probe, reduces film wear and shedding, and prolongs the service life.

[0033] At the same time, a first microstructure 301 with specific periodicity or aperiodicity is arranged on the side of the cushion layer 3 away from the adhesive layer 2, which can be a multi-scale corrugated or grooved feature structure, so as to form macroscopic roughness on the surface of the cushion layer 3 and the composite film material, enhance the relative sliding friction effect between the probe and the film, increase the overall contact area between the probe and the film, reduce the wear on the probe, help the directional discharge of polishing debris, prevent secondary pollution, and effectively restore the original sharpness and conductivity of the probe, solving the local passivation phenomenon of the probe caused by wear during long-term use.

[0034] Preferably, the macroscopic roughness Ra1 formed by the first microstructure 301 on the cushion layer 3 can be adjusted to be in the range of 5-15 μm, and is specifically selected and arranged according to the arrangement density and cleaning path requirements of different probe arrays.

[0035] Preferably, the thickness of the cushion layer 3 is controlled in the range of 5-15 μm, and the thickness is adjusted according to the optimization requirements of the contact pressure distribution of the probe under different cleaning scenarios.

[0036] Further, the functional layer 4 in the preferred embodiment is arranged on the side of the cushion layer 3 away from the adhesive layer 2 and is composed of a third polymer matrix 402 and functional layer particles 401 uniformly dispersed in the third polymer matrix 402; wherein the functional layer particles 401 are high-hardness inorganic abrasive particles such as any one or combination of nano-aluminum oxide, nano-silicon oxide, diamond particles, etc., with a particle size controlled within the range of 0.5-1 μm and a Vickers hardness not less than 800 HV, forming a micro-roughness on the surface of the functional layer 4. The micro-roughness can form a local stress concentration area when the probe contacts the film, thereby achieving effective stripping and removal of nano-to-submicron contaminants. In addition, the sphericity of the preferred functional layer particles 401 is ≥0.85 to reduce the risk of scratching the probe tip and improve surface compatibility during grinding.

[0037] Preferably, the micro-roughness Ra2 is 1-1.5 μm, which can effectively match the typical size range of 5-30 μm of the probe tip diameter, achieving precise cleaning without damaging the original geometric profile.

[0038] Correspondingly, the third polymer matrix 402 is also a polymer with high temperature resistance and strong adhesion, such as epoxy resin, polyurethane, silicone rubber, polyimide, etc., to adhere to the small particles ground from the probe.

[0039] Preferably, the thickness of the functional layer 4 is generally 2-3 μm.

[0040] Preferably, a periodic or non-periodic second microstructure 403 is further arranged on the side of the functional layer 4 away from the cushion layer 3, forming a macro-roughness Ra3 of 2-7 μm on the surface of the functional layer 4 to achieve directional discharge of the functional layer 4 grinding debris and further.

[0041] Further, the present application also relates to a preparation method of a composite film material for probe card cleaning, for the preparation of the above-mentioned composite film material, specifically comprising the following steps: (1) Physically grinding the inorganic particles and performing step-by-step screening on the ground particles to obtain cushion layer particles 302 with a particle size of 3-10 μm and functional layer particles 401 with a particle size of 0.5-1 μm, to ensure the particle size consistency, uniform dispersion and functional stability of the inorganic particles in the composite film material.

[0042] In the preferred embodiment, the original particles are ground by a high-energy ball milling device, and the grinding time is controlled to be 1-2 h, and the rotating speed is controlled to be 300-600 rpm, so as to obtain particles with narrow particle size distribution and smooth surface, and the sphericity of the particles is controlled to be ≥0.85; meanwhile, the ground particles are subjected to step-by-step screening by using an ultrasonic vibration screening system device, and coarse particles or fine powder deviating from the target range are removed, so that the particle size distribution standard deviation of the final cushion layer particles 302 and functional layer particles 401 is within ±10%.

[0043] (2) The first polymer matrix 201 material is added into a first solvent for mixing to obtain an adhesive layer coating; the second polymer matrix 303 and the cushion layer particles 302 are added into a second solvent for mixing to obtain a cushion layer coating; and the third polymer matrix 402 and the functional layer particles 401 are added into a third solvent for mixing to obtain a functional layer coating.

[0044] Preferably, the content of the cushion layer particles 302 in the cushion layer coating is 30-60 wt%, and the content of the functional layer particles 401 in the functional layer coating is 10-30 wt%. It can be known that the particle size of the inorganic particles and the amount of the inorganic particles added not only directly affect the micro-morphology and hardness of the material surface, but also significantly affect the grinding performance, wear and potential damage degree to the probe. When the particle size is reduced to a certain critical value (such as less than 0.1 μm) or the amount of the inorganic particles added is too low (such as <5 wt%), the surface of the composite film tends to be smooth, which leads to insufficient friction and makes it difficult to achieve effective probe cleaning; on the contrary, when the particle size is too large (>20 μm) and the amount of the inorganic particles added is too high (>80 wt%), although the surface roughness is significantly increased, the wear is also increased, which easily causes excessive wear and even structural damage to the probe, affecting the service life and test stability of the probe. In the present application, the particle size and the amount of the inorganic particles in the cushion 3 and the functional layer 4 are controlled in the above range, so that the probe can be effectively ground and polished while meeting the probe cleaning requirements, and the probe will not be excessively worn.

[0045] Preferably, the viscosity of the obtained adhesive layer coating is 30-70 mPa·s, the viscosity of the cushion layer coating is 100-200 mPa·s, and the viscosity of the functional layer coating is 140-270 mPa·s.

[0046] Preferably, a coupling agent is further added in the adhesive layer coating, and the content of the coupling agent is 0.5-3 wt%.

[0047] Preferably, when the matrix materials, the particles and the corresponding solvents are mixed, a high-speed device is used for auxiliary physical dispersion, the rotating speed is 1000-5000 rpm, and the time is 10-30 min.

[0048] Preferably, after each coating configuration is completed, the coating is precisely filtered by a multi-stage filter membrane system, the pore size of which decreases from 50 μm to 10 μm in a certain pore size interval, so as to gradually remove the agglomerated large particles and ensure the subsequent spin coating film forming effect.

[0049] (3) The adhesive layer coating is spin coated on the substrate 1 and dried to obtain the adhesive layer 2; the cushion layer coating is spin coated on the adhesive layer 2 by shaking and dried to obtain the cushion layer 3 with the first microstructure 301 on the surface; and the functional layer coating is spin coated on the cushion layer 3 and dried to obtain the functional layer 4, thereby completing the preparation of the composite film material for probe card cleaning.

[0050] It can be known that the high-viscosity material is not easy to flow flat quickly during high-speed rotation, and it is more likely to form a coating with a certain thickness and surface structure on the surface of the substrate, and the presence of the cushion layer particles 302 will also hinder the flow of the coating to a certain extent. Therefore, in the preparation of the cushion layer 3, the viscosity of the cushion layer coating is controlled, and the combined action of the large-diameter cushion layer particles 302, the shaking during high-speed spin coating, the spin coating speed and the spin coating time, etc. is used, so that after the cushion layer coating is spin coated and dried, the first microstructure 301 with a certain macroscopic roughness such as a multi-scale corrugated or grooved structure can be formed on the surface of the cushion layer 3.

[0051] Meanwhile, in the preparation of the functional layer 4, the first microstructure 301 formed on the surface of the cushion layer 3 can also exhibit a second microstructure 403 with a certain macroscopic roughness under the structural support of the cushion layer 3.

[0052] Preferably, during the spin coating of the cushion layer coating, a lower speed can be used in the initial stage according to the thickness requirement of the cushion layer 3, and then quickly increased to a higher speed after a period of time, and then continued for a period of time, so as to create a foundation that can adapt to the removal of large particles and provide good support for the functional layer 4.

[0053] In actual operation, the spin coating speed of the adhesive layer 2 is preferably controlled at 1000-3000 rpm, the spin coating time is controlled at 20-60 s, and the spin coating thickness is 0.5-5 μm; the spin coating speed of the cushion layer 3 is preferably controlled at 500-3000 rpm, the spin coating time is controlled at 30-80 s, and the spin coating thickness is 5-15 μm, and the corrugated or grooved microstructure with a macroscopic roughness Ra of 5-15 μm is formed on the spin coating surface. The spin coating speed of the functional layer 4 is preferably controlled at 3000-6000 rpm, the spin coating time is controlled at 20-30 s, the spin coating thickness is 2-3 μm, and the micro roughness Ra of the spin coating surface is 1-1.5 μm.

[0054] The surface topography of the cushion layer 3 and the functional layer 4 can be characterized by AFM (atomic force microscope) or SEM (scanning electron microscope) to evaluate the distribution state of the abrasive particles and the surface roughness, so as to further optimize the cleaning performance.

[0055] Preferably, when the functional layer 4 is spin-coated, multi-layer and multi-time spin-coating is adopted to ensure uniform distribution of particles and uniformity and consistency of film thickness, to ensure film forming quality, so that the coating containing particles forms micro-roughness on the surface of the cushion layer 3 with macro-roughness.

[0056] Preferably, when each layer is spin-coated in step (3), gradual temperature rising baking is adopted to make the solvent fully play and complete the cross-linking and curing of the polymer, so as to ensure the thermal stability and mechanical strength of the film structure.

[0057] Specifically, when the adhesive layer 2 coating is baked, in order to improve the adhesion between the adhesive layer 2 and the substrate 1, low-temperature pre-baking at 30°C for 30 min is first performed to slowly release the solvent, and then medium-temperature baking at 150°C for 30 min is performed to accelerate the release of the solvent and complete the cross-linking and curing between the first polymer base material and the substrate 1.

[0058] When the cushion layer coating is baked, pre-baking at 80°C for 60 min is first performed to remove the solvent, then medium-temperature curing at 150°C for 90 min is performed to complete the preliminary cross-linking of the second polymer base material and the adhesive layer 2, and then high-temperature curing at 200°C for 60 min is performed to complete the cross-linking reaction of the second polymer base material and the adhesive layer 2.

[0059] When the functional layer coating is baked, pre-baking at 100°C for 60 min is first performed to remove the solvent, then medium-temperature curing at 150°C for 90 min is performed to complete the preliminary cross-linking of the third polymer base material and the cushion layer 3, and then high-temperature curing at 230°C for 90 min is performed to complete the cross-linking reaction of the third polymer base material and the cushion layer 3.

[0060] Example 1: (1) Selecting silicon dioxide as inorganic particles for physical grinding, and obtaining cushion layer particles 302 with a particle size of 3 μm and functional layer particles 401 with a particle size of 0.5 μm through step-by-step screening; (2) Adding epoxy resin to a methanol solution and adding 0.5wt% of a silane coupling agent to obtain an adhesive layer coating with a viscosity of 32 mPa·s; adding epoxy resin and cushion layer particles 302 to a methanol solution and mixing uniformly to obtain a cushion layer coating with a viscosity of 100 mPa·s, the content of the cushion layer particles 302 being 30wt%; adding epoxy resin and functional layer particles 401 to a methanol solution and mixing uniformly to obtain a functional layer coating with a viscosity of 140 Pa·s, the content of the functional layer particles 401 being 10wt%; (3) The adhesive layer coating was spin-coated on the wafer at a spin speed of 2000 rpm for 15 s, and after drying, the adhesive layer 2 with a thickness of 2 μm was obtained. The cushion layer coating was shaken and spin-coated on the adhesive layer 2 at a speed of 3000 rpm for 30 s, and after drying, the cushion layer 3 with a first microstructure 301 of a thickness of 5 μm and a macroscopic roughness Ra of 5.22 μm on the surface was obtained. The functional layer coating was spin-coated on the cushion layer 3 at a spin speed of 6000 rpm for 10 s, and after drying, the functional layer 4 with a thickness of 2.8 μm and a microscopic roughness of 1.08 μm on the surface was obtained, thereby preparing a composite thin film material with a thickness of 9.8 μm.

[0061] Example 2 (1) The silica was selected as the inorganic particles for physical grinding, and the cushion layer particles 302 with a particle size of 5 μm and the functional layer particles 401 with a particle size of 0.6 μm were obtained by step-by-step screening; (2) The polyimide was added to a methanol solution, and 1 wt% of a silane coupling agent was added and uniformly mixed to obtain an adhesive layer coating with a viscosity of 45 mPa·s. The polyimide and the cushion layer particles 302 were added to a methanol solution and uniformly mixed to obtain a cushion layer coating with a viscosity of 130 mPa·s, and the content of the cushion layer particles 302 was 40 wt%. The polyimide and the functional layer particles 401 were added to a methanol solution and uniformly mixed to obtain a functional layer coating with a viscosity of 170 Pa·s, and the content of the functional layer particles 401 was 15 wt%; (3) The adhesive layer coating was spin-coated on the wafer at a spin speed of 1030 rpm for 60 s, and after drying, the adhesive layer 2 with a thickness of 5 μm was obtained. The cushion layer coating was shaken and spin-coated on the adhesive layer 2 at a speed of 500 rpm for 10 s, and then the speed was quickly increased to 3000 rpm and maintained for 20 s, and after drying, the cushion layer 3 with a first microstructure 301 of a thickness of 5.4 μm and a macroscopic roughness Ra of 7.35 μm on the surface was obtained. The functional layer coating was spin-coated on the cushion layer 3 at a spin speed of 5300 rpm for 21 s, and after drying, the functional layer 4 with a thickness of 2.2 μm and a microscopic roughness of 1.12 μm on the surface was obtained, thereby preparing a composite thin film material with a thickness of 12.6 μm.

[0062] Example 3 (1) The silica was selected as the inorganic particles for physical grinding, and the cushion layer particles 302 with a particle size of 7 μm and the functional layer particles 401 with a particle size of 0.8 μm were obtained by step-by-step screening; (2) The polyurethane is added to the methanol solution, and 1.8wt% of the silane coupling agent is added and uniformly mixed to obtain the bonding layer coating with a viscosity of 53 mPa·s; the polyurethane and the cushion layer particles 302 are added to the methanol solution and uniformly mixed to obtain the cushion layer coating with a viscosity of 150 mPa·s, and the content of the cushion layer particles 302 is 45wt%; the polyurethane and the functional layer particles 401 are added to the methanol solution and uniformly mixed to obtain the functional layer coating with a viscosity of 200 Pa·s, and the content of the functional layer particles 401 is 20wt%; (3) The bonding layer coating is spin-coated on the wafer at a spin speed of 2010 rpm for 42 s, and the bonding layer 2 with a thickness of 3.2 μm is obtained after drying; the cushion layer coating is first shaken and spin-coated on the bonding layer 2 at a speed of 1680 rpm for 50 s, and the cushion layer 3 with a thickness of 9.5 μm and the first microstructure 301 with a macroscopic roughness Ra of 11.62 μm on the surface is obtained after drying; the functional layer coating is spin-coated on the cushion layer 3 at a spin speed of 4600 rpm for 25 s, and the functional layer 4 with a thickness of 2.5 μm and a microscopic roughness of 1.24 μm on the surface is obtained after drying, thereby preparing the composite thin film material with a thickness of 15.2 μm.

[0063] Example 4: (1) The silica is selected as the inorganic particles for physical grinding, and the cushion layer particles 302 with a particle size of 8 μm and the functional layer particles 401 with a particle size of 0.9 μm are obtained by step-by-step screening; (2) The epoxy resin is added to the methanol solution, and 2.3wt% of the titanate coupling agent is added and uniformly mixed to obtain the bonding layer coating with a viscosity of 61 mPa·s; the silicone rubber and the cushion layer particles 302 are added to the methanol solution and uniformly mixed to obtain the cushion layer coating with a viscosity of 175 mPa·s, and the content of the cushion layer particles 302 is 50wt%; the silicone rubber and the functional layer particles 401 are added to the methanol solution and uniformly mixed to obtain the functional layer coating with a viscosity of 230 Pa·s, and the content of the functional layer particles 401 is 25wt%; (3) The bonding layer coating is spin-coated on the wafer at a spin speed of 1560 rpm for 46 s, and the bonding layer 2 with a thickness of 3.7 μm is obtained after drying; the cushion layer coating is first shaken and spin-coated on the bonding layer 2 at a speed of 530 rpm for 20 s, and then the speed is quickly increased to 2760 rpm for 10 s, and the cushion layer 3 with a thickness of 7.4 μm and the first microstructure 301 with a macroscopic roughness Ra of 13.31 μm on the surface is obtained after drying; the functional layer coating is spin-coated on the cushion layer 3 at a spin speed of 3800 rpm for 27 s, and the functional layer 4 with a thickness of 2.8 μm and a microscopic roughness of 1.36 μm on the surface is obtained after drying, thereby preparing the composite thin film material with a thickness of 13.9 μm.

[0064] Example 5: (1) Selecting silica as inorganic particles for physical grinding, and by step-by-step screening to obtain 10 μm of the cushion layer particles 302 and 1 μm of the functional layer particles 401; (2) Adding epoxy resin to the methanol solution, and adding 3wt% of titanate coupling agent, mixing uniformly to obtain the bonding layer coating with a viscosity of 68 mPa·s; adding epoxy resin and cushion layer particles 302 to the methanol solution and mixing uniformly to obtain the cushion layer coating with a viscosity of 200 mPa·s, the content of the cushion layer particles 302 being 60wt%; adding epoxy resin and functional layer particles 401 to the methanol solution and mixing uniformly to obtain the functional layer coating with a viscosity of 270 Pa·s, the content of the functional layer particles 401 being 30wt%; (3) Spinning the bonding layer coating on the wafer, the spinning speed being 2530 rpm, the spinning time being 35 s, and after drying, obtaining the bonding layer 2 with a thickness of 1.4 μm; first, shaking and spinning the cushion layer coating on the bonding layer 2 at a speed of 500 rpm, and continuously for 75 s, and after drying, obtaining the cushion layer 3 with a thickness of 14.3 μm and a first microstructure 301 on the surface with a macroscopic roughness Ra of 14.79 μm; spinning the functional layer coating on the cushion layer 3, the spinning speed being 3000 rpm, the spinning time being 28 s, and after drying, obtaining the functional layer 4 with a thickness of 3 μm and a microstructure on the surface with a microscopic roughness of 1.46 μm, and preparing the composite thin film material with a thickness of 18.7 μm.

[0065] The composite thin film prepared by the above-mentioned example is applied to the probe card cleaning, and both the large particles with a diameter greater than 5 μm and the tiny contaminants in nanometer level can be effectively removed, the overall cleaning efficiency is improved by about 40% compared with the existing adhesive cleaning material, the change rate of the contact resistance is significantly reduced, and meanwhile, due to the accurate control of the hardness and particle size distribution of the inorganic particles and the reasonable design of the macroscopic and microscopic roughness, the composite thin film can maximize the reduction of the abrasion to the probe tip while ensuring the high cleaning efficiency, so that the service life of the probe card is significantly prolonged, and the downtime maintenance time and cost are reduced by about 30%.

[0066] The composite thin film material for probe card cleaning and the preparation method thereof have reasonable structure, and when the probe card is cleaned, the cleaning efficiency and quality are improved through the synergistic effect between the layers, the maintenance cost and the downtime caused by incomplete cleaning are significantly reduced, the secondary pollution or probe corrosion problem caused in the cleaning process is avoided, the accuracy in the wafer testing process is effectively improved, and the service life of the probe card is prolonged, so that the composite thin film material has good application prospect and promotion value.

[0067] Those skilled in the art can easily understand that the above description is only the preferred embodiment of the present application, and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A composite film material for probe card cleaning, characterized by, The composite film material comprises an adhesive layer, a cushion layer and a functional layer which are sequentially stacked; The material of the adhesive layer comprises a first polymer matrix with strong adhesion, for bonding with the substrate; The material of the cushion layer comprises a second polymer matrix with strong adhesion and high temperature resistance and cushion layer particles; the particle size of the cushion layer particles is 3-10 μm, which are uniformly dispersed in the second polymer matrix; and the side of the cushion layer away from the adhesive layer is provided with a first microstructure which is periodic or aperiodic, forming macro-roughness on the surface of the cushion layer; The material of the functional layer comprises a third polymer matrix with strong adhesion and high temperature resistance and functional layer particles, the particle size of the functional layer particles is 0.5-1 μm, which are uniformly dispersed in the first polymer matrix, forming micro-roughness on the surface of the functional layer.

2. The composite film material for probe card cleaning according to claim 1, wherein, The macro-roughness Ra1 formed by the first microstructure is 5-15 μm; and the micro-roughness Ra2 formed by the functional layer particles on the surface of the functional layer is 1-1.5 μm.

3. The composite film material for probe card cleaning according to claim 1, wherein, The thickness of the adhesive layer is 0.5-5 μm; and / or, the thickness of the cushion layer is 5-15 μm; and / or, the thickness of the functional layer is 2-3 μm.

4. The composite film material for probe card cleaning according to claim 1, wherein, The first microstructure is in the form of multi-scale corrugation or groove.

5. The composite film material for probe card cleaning according to claim 1, wherein, The side of the functional layer away from the cushion layer is provided with a second microstructure which is periodic or aperiodic, forming macro-roughness Ra3 of 2-7 μm on the surface of the functional layer.

6. A method of making a composite film material for probe card cleaning, characterized by, The method comprises the following steps: (1) physically grinding inorganic particles, and performing step-by-step screening on the ground particles to obtain cushion layer particles with a particle size of 3-10 μm and functional layer particles with a particle size of 0.5-1 μm; (2) mixing the first polymer matrix in a first solvent to obtain adhesive layer paint; mixing the second polymer matrix and the cushion layer particles in a second solvent to obtain cushion layer paint with a viscosity of 100-200 mPa·s; and mixing the third polymer matrix and the functional layer particles in a third solvent to obtain functional layer paint; (3) spin coating the adhesive layer paint on the substrate and drying to obtain the adhesive layer; spin coating the cushion layer paint on the adhesive layer by shaking and drying to obtain the cushion layer with the first microstructure on the surface; and spin coating the functional layer paint on the cushion layer and drying to obtain the functional layer, thereby completing the preparation of the composite film material for probe card cleaning.

7. The method of claim 6, wherein the composite film material for probe card cleaning is prepared by the steps of: In step (2), the content of the cushion layer particles in the cushion layer paint is 30-60 wt%, and the content of the functional layer particles in the functional layer paint is 10-30 wt%; and / or, In step (2), the viscosity of the obtained adhesive layer paint is 30-70 mPa·s, and the viscosity of the functional layer paint is 140-270 mPa·s.

8. The method for preparing the composite thin film material for probe card cleaning needles according to claim 6, characterized in that, In step (2), a coupling agent is added to the adhesive layer paint, and the content of the coupling agent is 0.5-3 wt%.

9. The method for preparing the composite thin film material for probe card cleaning needles according to claim 6, characterized in that, In step (3), the spin coating speed of the adhesive layer coating is 1000-3000 rpm, the spin coating time is 20-60 s, and the spin coating thickness is 0.5-5 μm; the spin coating speed of the cushion layer coating is 500-3000 rpm, the spin coating time is 30-80 s, and the spin coating thickness is 5-15 μm; the spin coating speed of the functional layer coating is 3000-6000 rpm, the spin coating time is 20-30 s, and the spin coating thickness is 2-3 μm.

10. The method for preparing the composite thin film material for probe card cleaning needles according to any one of claims 6 to 9, characterized in that, In step (3), the adhesive layer coating is dried at first at a low temperature of 30℃ for pre-drying to slowly release the solvent, and then at a medium temperature of 150℃ for accelerating the release of the solvent and completing the curing; The cushion layer coating is dried at first at 80℃ for pre-drying to remove the solvent, then at a medium temperature of 150℃ for curing to complete the preliminary crosslinking of the second polymer substrate and the adhesive layer, and finally at a high temperature of 200℃ for curing to complete the crosslinking reaction of the second polymer substrate and the adhesive layer; The functional layer coating is dried at first at 100℃ for pre-drying to remove the solvent, then at a medium temperature of 150℃ for curing to complete the preliminary crosslinking of the third polymer substrate and the cushion layer, and finally at a high temperature of 230℃ for curing to complete the crosslinking reaction of the third polymer substrate and the cushion layer.

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