Electronic equipment shell forming process

Abstract

The invention relates to an electronic equipment shell forming process, in particular to the technical field of communication equipment, and the electronic equipment shell forming process comprises the steps of machining, surface treatment and insulator glue injection forming which are carried out in sequence; the insulator glue injection molding comprises the steps of surface activation, mold cavity construction, glue injection, curing and demolding; and the glue injection process comprises glue injection molding of an antenna dividing strip on the back side of the shell and glue injection molding of a decoration strip on the front side of the shell. According to the electronic equipment shell forming process provided by the invention, by adopting the glue injection process, glue injection forming of the antenna isolation strip and the decoration strip on the electronic equipment shell is realized, the bonding force of the antenna isolation strip and the decoration strip with the base material is improved, and the defects of easy cracking, acid spitting and white line generation in the subsequent anode process are avoided; and meanwhile, the antenna isolation strip and the decoration strip obtained by the glue injection molding process have good high and low temperature impact resistance and high temperature and high humidity resistance.

Description

Technical Field

[0001] This invention relates to the field of communication equipment technology, and more specifically to a molding process for electronic device housings. Background Technology

[0002] Currently, with the rapid development of mobile communication technology, smartphones, smartwatches, smart speakers, tablets, and IoT products have become indispensable communication tools in people's lives. Antennas, as a crucial component of these smart products, have a significant impact on their performance. With the imminent arrival of the 5G era, antennas not only need to cover more frequency bands, but people also expect them to be smaller. Therefore, antennas are developing towards miniaturization, multi-frequency operation, and broadband, placing higher demands on their performance.

[0003] Meanwhile, as electronic devices increasingly use metal casings (aluminum alloy, titanium alloy), after the metal casing and screen components are assembled, a corresponding buffer area (decorative strip or protective strip) is required. In traditional processes, antenna strips and decorative strips are formed and processed independently through two separate processes and production lines, resulting in low overall efficiency. Furthermore, due to the use of in-mold injection molding, the metal casing needs to be molded multiple times, which can easily cause scratches.

[0004] Intelligent product structural components formed by surface treatment methods such as anodizing or physical vapor deposition with metal casings are loved by consumers for their beautiful appearance, robust structure, and excellent aging resistance. Therefore, for a more optimized appearance, the colors of the aforementioned decorative strips and antenna strips must match the metal casing to ensure consistency.

[0005] Traditional antennas radiate through a metal frame and the gap between the metal frame and the dielectric substrate. The process of forming this dielectric gap is usually achieved by using resin through injection molding.

[0006] Taking tablet computers as an example, a typical process flow diagram is as follows:

[0007] CNC machining (roughing) + surface treatment roughening + injection molding + CNC machining (Al+PBT) + sandblasting + anodizing.

[0008] For example, CN109688754A discloses a metal frame and a molding process for a metal frame electronic device housing. The metal frame includes: a metal border, a metal middle plate mounted on the metal border, and an injection-molded plastic ring between the metal border and the metal middle plate. The metal border has an annular receiving flange and several antenna slots. The receiving flange has a chamfered surface inclined at a preset angle. The injection-molded plastic ring has several filling blocks to fill the antenna slots. The molding process for the metal frame electronic device housing includes: obtaining a metal border profile and a metal middle plate; mounting the metal middle plate onto the metal border profile to obtain a combined profile; performing injection molding on the combined profile to obtain an injection-molded profile; machining the injection-molded profile with a CNC machine tool to obtain the shape of the metal frame; machining the shape of the metal frame with a CNC machine tool to obtain a receiving flange, and machining a chamfered surface on the receiving flange to obtain the metal frame; and performing anodizing and coloring treatment on the metal frame.

[0009] For example, CN114290609A discloses a high-strength wear-resistant aluminum mobile phone frame and its processing technology. The process includes the following steps: Step 1: Melting and die-casting aluminum alloy raw materials, forging, and CNC rough milling to obtain aluminum mobile phone frame A; Step 2: Performing surface treatment on aluminum mobile phone frame A through alkaline washing, acid washing, and ultrasonic hot water treatment; nano-injection molding, annealing; CNC precision milling; obtaining aluminum mobile phone frame B; Step 3: Hard anodizing aluminum mobile phone frame B in an electrolyte; surface sealing; obtaining a high-strength wear-resistant aluminum mobile phone frame.

[0010] However, separately molding antenna strips and decorative strips is inefficient and has the following drawbacks:

[0011] (1) Separate molding and multiple molding processes are not conducive to the protection of the metal shell;

[0012] (2) In-mold injection molding requires subsequent machining for pre-cutting;

[0013] (3) At the interface between resin and metal, due to the mismatch of thermal expansion coefficients in the injection molding process, the interfacial bonding force is low, which makes it easy to crack, ooze acid, and produce white lines and other process defects in the subsequent anodizing process. At the same time, the low interfacial bonding force leads to poor reliability and poor performance in terms of high and low temperature impact resistance, high temperature and high humidity resistance, etc. Summary of the Invention

[0014] In view of the problems existing in the prior art, the purpose of the present invention is to provide an electronic device housing molding process to solve the defects of low processing efficiency and poor bonding strength in the existing electronic device housing molding processes.

[0015] To achieve this objective, the present invention adopts the following technical solution:

[0016] This invention provides a molding process for an electronic device housing, the molding process comprising:

[0017] The machining, surface treatment, and insulator injection molding are carried out sequentially.

[0018] The insulator injection molding process includes surface activation, mold cavity construction, injection, curing, and demolding.

[0019] The injection molding process includes injection molding of the antenna separator strip on the back of the housing and injection molding of the decorative strip on the front of the housing.

[0020] The electronic device housing molding process provided by this invention, by adopting an injection molding process, enables the antenna isolation strip and decorative strip on the electronic device housing to be injection molded, which improves the adhesion between the antenna isolation strip and decorative strip and the substrate, and avoids defects such as cracking, acid oozing, and white lines that are easy to occur during subsequent anodizing processes. At the same time, the antenna isolation strip and decorative strip obtained by the injection molding process have good resistance to high and low temperature impact and high temperature and high humidity.

[0021] As a preferred technical solution of the present invention, the electronic device housing molding process includes:

[0022] The metal substrate is sequentially subjected to CNC rough machining, polishing, CNC fine machining, sandblasting, and anodizing.

[0023] The metal casing obtained by anodizing is subjected to adhesive injection molding of antenna partition strips and decorative strips.

[0024] The antenna separator strip injection molding process includes sequential activation, injection, curing, and demolding.

[0025] The decorative strip injection molding process includes sequential activation, injection, curing, and demolding.

[0026] The adhesive used in the first injection molding process includes polybutylene terephthalate (PBPT), polycarbonate, dielectric material, and adhesive; the adhesive used in the second injection molding process includes PBPT, polycarbonate, and adhesive.

[0027] As a preferred technical solution of the present invention, the back side of the machined metal shell is provided with at least one through groove, and the outer edge of the top surface of the metal shell is provided with at least one step.

[0028] Preferably, the through groove is used for injection molding of antenna separator strips; the step is used for injection molding of decorative strips.

[0029] Preferably, the antenna separator is embedded in the bottom and / or sidewalls of the metal shell, and the edges of both sides of the shell.

[0030] Preferably, the dielectric constant of the separator strip is different from that of the decorative strip.

[0031] As a preferred technical solution of the present invention, the CNC rough machining is to process the slot, the first injection port and the second injection port of the electronic component according to the design.

[0032] As a preferred embodiment of the present invention, the first activation includes activating the first injection port with plasma.

[0033] Preferably, the gas pressure for forming plasma during the first activation is controlled to be 0.1-10 Pa.

[0034] Preferably, the absolute vacuum degree of the operation in the first activation is 0.0007-0.5 Pa.

[0035] Preferably, the second activation includes activating the second injection port with plasma.

[0036] Preferably, the gas pressure for forming plasma during the second activation is controlled to be 0.1-10 Pa.

[0037] Preferably, the absolute vacuum degree of the operation in the second activation is 0.0007-0.5 Pa.

[0038] As a preferred technical solution of the present invention, the first activation and the second activation are performed separately or simultaneously, which is to process the surface of the metal shell used to form the antenna separator strip and the decorative strip.

[0039] Preferably, the first and second injections are performed separately or simultaneously using a dual-channel injection method.

[0040] As a preferred embodiment of the present invention, the mold cavity construction includes forming a first mold cavity in the first injection molding and forming a second mold cavity in the second injection molding.

[0041] Preferably, the first mold cavity is composed of a first upper mold, a lower mold and a shell, a lower cover plate is provided between the lower mold and the shell, a silicone strip is provided on the lower cover plate, and the lower cover plate, together with the bottom surface of the shell and the forming surface of the first upper mold, forms the first mold cavity.

[0042] Preferably, the second mold cavity is an upper cover plate disposed between the second upper mold, the lower mold and the shell, the upper cover plate is closed on the shell, and a silicone strip is disposed on the upper cover plate and is combined with the shell to form a cavity.

[0043] Preferably, the first upper mold is provided with an injection hole and an vent hole that communicate with the first mold cavity.

[0044] Preferably, the upper cover plate is provided with an injection hole and an vent hole communicating with the second mold cavity.

[0045] Preferably, after the first and second injections are completed, the mixture is transferred to the curing area under pressure for curing.

[0046] Preferably, when the first curing and the second curing are light-cured, the upper cover plate and the lower cover plate are made of light-transmitting material, and the first upper mold, the second upper mold, and the lower mold are all provided with corresponding light-transmitting grooves.

[0047] Preferably, when the first curing and the second curing are performed using heat curing, the upper cover plate and the lower cover plate are made of a material with high thermal conductivity.

[0048] As a preferred technical solution of the present invention, the adhesive used in the first injection comprises, by weight percentage: 30-40% polybutylene terephthalate, 20-30% polycarbonate, 5-35% dielectric material, and 10-45% adhesive; the dielectric constant of the adhesive is greater than the dielectric constant of the dielectric material.

[0049] Preferably, the polybutylene terephthalate material of the adhesive used in the first injection is glass fiber reinforced polybutylene terephthalate, and the glass fiber content is 30-35% by mass.

[0050] Preferably, the polycarbonate material of the adhesive used in the first injection is glass fiber reinforced polycarbonate, and the glass fiber content is 20-40% by mass.

[0051] Preferably, the dielectric material comprises a combination of polytetrafluoroethylene and auxiliary materials or polytetrafluoroethylene.

[0052] Preferably, the excipients include any one or a combination of at least two of the following terpolymers: polypropylene, poly(4-methyl-1-pentene), or acrylonitrile (A)-butadiene (B)-styrene (S).

[0053] Preferably, the dielectric constant of the dielectric material is 1-3.

[0054] Preferably, when the dielectric material is polytetrafluoroethylene, the mass percentage of the dielectric material is 10-20%.

[0055] Preferably, when the dielectric material is a combination of polytetrafluoroethylene and auxiliary materials, the mass percentage of polytetrafluoroethylene accounts for 8-10% of the antenna protection isolation material.

[0056] Preferably, the adhesive used in the first injection includes one or a combination of at least two of epoxy resin adhesives, acrylic adhesives, or polymethyl methacrylate adhesives.

[0057] Preferably, the adhesive used in the first injection also includes pigments.

[0058] Preferably, the pigment includes one or a combination of at least two of red, yellow, or blue pigments.

[0059] Preferably, the red pigment includes one or a combination of at least two of iron oxide red pigment, scarlet pink pigment, or transparent red pigment.

[0060] Preferably, the yellow pigment includes lead chromium yellow pigment and / or iron yellow pigment.

[0061] Preferably, the blue pigment includes phthalocyanine blue pigment and / or ultramarine pigment.

[0062] Preferably, the amount of glue injected in the first injection is 1.002-1.006 times the volume of the injection tank.

[0063] Preferably, the injection pressure of the adhesive in the first injection is ≤0.6MPa.

[0064] As a preferred embodiment of the present invention, the adhesive used in the second injection process comprises, by weight percentage: 30-40% polybutylene terephthalate, 20-30% polycarbonate, and 30-50% adhesive.

[0065] Preferably, the polybutylene terephthalate material of the adhesive used in the second injection is glass fiber reinforced polybutylene terephthalate, and the glass fiber content is 30-35% by mass.

[0066] Preferably, the polycarbonate material of the adhesive used in the second injection is glass fiber reinforced polycarbonate, and the glass fiber content is 20-40% by mass.

[0067] Preferably, the adhesive used in the second injection includes one or a combination of at least two of epoxy resin adhesives, acrylic adhesives, or polymethyl methacrylate adhesives.

[0068] Preferably, the adhesive used in the second injection also includes pigments.

[0069] Preferably, the pigment includes one or a combination of at least two of red, yellow, or blue pigments.

[0070] Preferably, the red pigment includes one or a combination of at least one of iron oxide red pigment, scarlet pink pigment, or transparent red pigment.

[0071] Preferably, the yellow pigment includes lead chromium yellow pigment and / or iron yellow pigment.

[0072] Preferably, the blue pigment includes phthalocyanine blue pigment and / or ultramarine pigment.

[0073] As a preferred embodiment of the present invention, the amount of glue injected in the second glue injection is 1.001-1.002 times the volume of the glue injection tank.

[0074] Preferably, the injection pressure of the adhesive in the second injection is ≤0.6MPa.

[0075] Compared with existing technical solutions, the present invention has the following beneficial effects:

[0076] In this invention, the non-metallic structure on the metal shell is integrally molded using a room-temperature injection molding process, ensuring controllable product dimensions. The injection molding process replaces the traditional PSA bonding, improving bonding strength, with epoxy bonding strength reaching over 20MPa and PU bonding strength reaching over 8MPa. It also facilitates color management, enabling the creation of a variety of colors. Compared to traditional two-stage in-mold heating injection molding, it offers higher production efficiency and improved quality. Attached Figure Description

[0077] Figure 1 This is a schematic diagram of the assembled metal shell and lower mold in an embodiment of the present invention;

[0078] Figure 2 This is a schematic diagram of the first upper mold used to construct the first mold cavity in an embodiment of the present invention;

[0079] Figure 3 This is a schematic diagram of the second upper mold used to construct the second mold cavity in an embodiment of the present invention;

[0080] Figure 4 This is a schematic diagram of the lower mold used in the mold cavity construction in an embodiment of the present invention.

[0081] In the figure: 1.1.1 - First upper mold, 1.1.2 - Second upper mold, 1.2 - Lower mold, 2 - Metal shell, 3.1 - First mold cavity.

[0082] The present invention will now be described in further detail. However, the examples described below are merely simplified examples of the present invention and do not represent or limit the scope of protection of the present invention. The scope of protection of the present invention is determined by the claims. Detailed Implementation

[0083] To better illustrate the present invention and facilitate understanding of its technical solutions, typical but non-limiting embodiments of the present invention are as follows:

[0084] This embodiment provides a molding process for an electronic device housing, which includes the following:

[0085] The machining, surface treatment, and insulator injection molding are carried out sequentially.

[0086] The insulator injection molding process includes surface activation, mold cavity construction, injection, curing, and demolding.

[0087] The injection molding process includes injection molding of the antenna separator strip on the back of the housing and injection molding of the decorative strip on the front of the housing.

[0088] In this invention, the metal substrate used in machining is selected according to the product design requirements, such as aluminum alloy, stainless steel, steel-aluminum composite die casting, titanium alloy and other commonly used metal materials.

[0089] The electronic device housing molding process includes:

[0090] The metal substrate is sequentially subjected to CNC rough machining, polishing, CNC fine machining, sandblasting, and anodizing.

[0091] The metal casing 2 obtained by anodizing is subjected to injection molding of antenna partition strips and decorative strips;

[0092] The antenna separator strip injection molding process includes sequential activation, injection, curing, and demolding.

[0093] The decorative strip injection molding process includes sequential activation, injection, curing, and demolding.

[0094] The adhesive used in the first injection molding process includes polybutylene terephthalate (PBPT), polycarbonate, dielectric material, and adhesive; the adhesive used in the second injection molding process includes PBPT, polycarbonate, and adhesive.

[0095] Specifically, the CNC rough machining is to process the slots, the first injection port and the second injection port of the electronic components according to the design;

[0096] The back side of the machined metal shell 2 is provided with at least one through groove, and the outer edge of the top surface of the metal shell 2 is provided with at least one step.

[0097] The through groove is used for injection molding of antenna separator strips; the step is used for injection molding of decorative strips.

[0098] The antenna separator is embedded in the bottom and / or sidewalls of the metal shell, as well as the edges of the shell on both sides.

[0099] The dielectric constant of the separator strip is different from that of the decorative strip.

[0100] In this invention, a cleaning process can optionally be performed between polishing and CNC finishing to remove impurities and stains remaining on the surface of the workpiece after polishing.

[0101] In this invention, the CNC machining process can be performed according to the intended use of the final metal frame, such as as a mid-frame for a tablet computer, a mobile phone, or a smartwatch. Different machining processes can be performed, such as turning, milling, planing, grinding, drilling, boring, and machining of complex curved surfaces, which are all processes that can be achieved by CNC machining in this field.

[0102] In this invention, deburring and cleaning can be optionally provided between CNC finishing and sandblasting to remove impurities and stains remaining on the surface of the workpiece during finishing.

[0103] In this invention, polishing and sandblasting are performed according to the requirements of the corresponding subsequent processes. For example, polishing can be performed to meet the requirements of CNC precision machining, and the endpoint of sandblasting can be designed and limited according to the conventional anodizing process requirements in the field, such as controlling the surface roughness of the workpiece after sandblasting.

[0104] In this invention, the relevant parameters for anodic oxidation are selected based on the type of oxide film to be formed.

[0105] The first activation includes activating the first injection port with plasma;

[0106] The gas pressure for forming plasma during the first activation is controlled to be 0.1-10 Pa, for example, it can be 0.1 Pa, 0.2 Pa, 0.4 Pa, 0.6 Pa, 0.8 Pa, 1 Pa, 2 Pa, 4 Pa, 6 Pa, 8 Pa or 10 Pa, but is not limited to the listed values. Other unlisted values ​​within this range are also acceptable.

[0107] The absolute vacuum degree of the operation in the first activation is 0.0007-0.5 Pa, for example, it can be 0.0007 Pa, 0.0008 Pa, 0.0009 Pa, 0.001 Pa, 0.002 Pa, 0.004 Pa, 0.006 Pa, 0.008 Pa, 0.01 Pa, 0.02 Pa, 0.04 Pa, 0.06 Pa, 0.08 Pa, 0.1 Pa, 0.2 Pa, 0.4 Pa, or 0.5 Pa, but is not limited to the listed values. Other unlisted values ​​within this range are also acceptable.

[0108] The second activation includes activating the second injection port with plasma;

[0109] In the second activation, the gas pressure for forming plasma is controlled to be 0.1-10 Pa, for example, it can be 0.1 Pa, 0.2 Pa, 0.4 Pa, 0.6 Pa, 0.8 Pa, 1 Pa, 2 Pa, 4 Pa, 6 Pa, 8 Pa or 10 Pa, but is not limited to the listed values. Other unlisted values ​​within this range are also acceptable.

[0110] The absolute vacuum degree of the operation in the second activation is 0.0007-0.5 Pa, for example, it can be 0.0007 Pa, 0.0008 Pa, 0.0009 Pa, 0.001 Pa, 0.002 Pa, 0.004 Pa, 0.006 Pa, 0.008 Pa, 0.01 Pa, 0.02 Pa, 0.04 Pa, 0.06 Pa, 0.08 Pa, 0.1 Pa, 0.2 Pa, 0.4 Pa, or 0.5 Pa, but is not limited to the listed values. Other unlisted values ​​within this range are also acceptable.

[0111] Furthermore, the first activation and the second activation are performed separately or simultaneously, respectively, to process the surface of the metal housing 2 used to form the antenna separator strip and decorative strip.

[0112] The first and second injections are performed separately or simultaneously using a dual-channel injection method.

[0113] In this invention, the relevant structural diagrams of the mold used in the mold cavity construction are as follows: Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown. The mold cavity can be designed reasonably based on the shape of the glue obtained from molding, so as to make full use of the mold. For example, if the shape obtained from the lower mold is consistent, the lower mold can be shared when constructing the mold cavity.

[0114] The mold cavity construction includes forming a first mold cavity 3.1 in the first injection molding and forming a second mold cavity in the second injection molding.

[0115] The first mold cavity 3.1 is composed of a first upper mold 1.1.1, a lower mold 1.2 and a shell. A lower cover plate is provided between the lower mold 1.2 and the shell. A silicone strip is provided on the lower cover plate and it is combined with the bottom surface of the shell and the molding surface of the first upper mold 1.1.1 to form the first mold cavity 3.1.

[0116] The second mold cavity is an upper cover plate disposed between the second upper mold 1.1.2, the lower mold 1.2 and the shell. The upper cover plate covers the shell and is provided with a silicone strip and is combined with the shell to form the cavity.

[0117] The first upper mold 1.1.1 is provided with an injection hole and an vent hole that communicate with the first mold cavity 3.1.

[0118] The upper cover plate is provided with an injection hole and an vent hole that communicate with the second mold cavity.

[0119] After the first and second injections are completed, the mixture is transferred to the curing area under pressure for curing.

[0120] When the first curing and the second curing are carried out by light curing, the upper cover plate and the lower cover plate are made of light-transmitting material, and the first upper mold 1.1.1, the second upper mold 1.1.2 and the lower mold 1.2 are all provided with light-transmitting grooves.

[0121] The light-transmitting material refers to a light-transmitting material with a light transmittance of ≥95%.

[0122] When the first and second curing processes employ heat curing, the upper and lower cover plates are made of materials with high thermal conductivity.

[0123] In this invention, the high thermal conductivity material can be selected as aluminum alloy or beryllium bronze.

[0124] The adhesive used in the first injection process comprises, by weight percentage: 30-40% polybutylene terephthalate, 20-30% polycarbonate, 5-35% dielectric material, and 10-45% adhesive; the dielectric constant of the adhesive is greater than that of the dielectric material.

[0125] In this invention, the adhesive used in the first injection molding process comprises 100% polybutylene terephthalate, polycarbonate, dielectric material, and binder.

[0126] In this invention, the polybutylene terephthalate material used in the first injection adhesive is 30-40% by mass percentage, for example, it can be 30%, 31%, 32%, 33%, 34%, 35%, 36%, 37%, 38%, 39% or 40%, etc., but is not limited to the listed values, and other unlisted values ​​within this range are also acceptable.

[0127] In this invention, the polycarbonate material in the first injection adhesive is 20-30% by mass percentage, for example, it can be 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29% or 30%, etc., but is not limited to the listed values, and other unlisted values ​​within this range are also acceptable.

[0128] In this invention, the dielectric material in the adhesive used in the first injection is 5-35% by mass percentage, for example, it can be 5%, 6%, 8%, 10%, 12%, 14%, 16%, 18%, 20%, 22%, 24%, 26%, 28%, 30%, 32%, 34%, or 35%, etc., but is not limited to the listed values, and other unlisted values ​​within this range are also acceptable.

[0129] In this invention, the adhesive in the first injection adhesive has a mass percentage content of 10-45%, for example, it can be 10%, 12%, 14%, 16%, 18%, 20%, 22%, 24%, 26%, 28%, 30%, 32%, 34%, 36%, 38%, 40%, 42%, 44%, or 45%, etc., but is not limited to the listed values, and other unlisted values ​​within this range are also acceptable.

[0130] The polybutylene terephthalate material of the adhesive used in the first injection is glass fiber reinforced polybutylene terephthalate, and the glass fiber content is 30-35% by mass, for example, it can be 30%, 30.5%, 31%, 31.5%, 32%, 32.5%, 33%, 33.5%, 34%, 34.5% or 35%, etc., but is not limited to the listed values. Other unlisted values ​​within this range are also acceptable.

[0131] The polycarbonate material of the adhesive used in the first injection is glass fiber reinforced polycarbonate, and the glass fiber content is 20-40% by mass, for example, it can be 20%, 22%, 24%, 26%, 28%, 30%, 32%, 34%, 36%, 38% or 40%, etc., but is not limited to the listed values. Other unlisted values ​​within this range are also acceptable.

[0132] The dielectric material includes a combination of polytetrafluoroethylene and auxiliary materials or polytetrafluoroethylene.

[0133] The excipients include any one or a combination of at least two of the following: polypropylene, poly(4-methyl-1-pentene), or acrylonitrile (A)-butadiene (B)-styrene (S) terpolymers.

[0134] The dielectric constant of the dielectric material is 1-3.

[0135] When the dielectric material is polytetrafluoroethylene, the mass percentage of the dielectric material is 10-20%, for example, it can be 10%, 12%, 14%, 16%, 18% or 20%, etc., but is not limited to the listed values. Other unlisted values ​​within this range also meet the requirements.

[0136] When the dielectric material is a combination of polytetrafluoroethylene (PTFE) and auxiliary materials, the mass percentage of PTFE accounts for 8-10% of the antenna protection isolation material, for example, it can be 8%, 8.5%, 9%, 9.5% or 10%, etc., but is not limited to the listed values. Other unlisted values ​​within this range also meet the requirements.

[0137] The adhesive used in the first injection includes one or a combination of at least two of epoxy resin adhesives, acrylic adhesives, or polymethyl methacrylate adhesives.

[0138] The adhesive used in the first injection also includes pigments; the pigments include one or a combination of at least two of red pigments, yellow pigments, or blue pigments; the red pigments include one or a combination of at least one of iron oxide red pigments, scarlet pink pigments, or transparent red pigments; the yellow pigments include lead chromate yellow pigments and / or iron oxide yellow pigments; and the blue pigments include phthalocyanine blue pigments and / or ultramarine pigments.

[0139] In this invention, the amount of pigment added to the glue used in the first injection is reasonably selected according to the required depth and type of color, without specific restrictions.

[0140] In this invention, the adhesive used in the first injection is prepared by mixing ingredients according to their mass percentage content.

[0141] The amount of glue injected in the first injection is 1.002-1.006 times the volume of the injection tank, for example, it can be 1.002 times, 1.003 times, 1.004 times, 1.005 times or 1.006 times, but is not limited to the listed values. Other unlisted values ​​within this range also meet the requirements.

[0142] The injection pressure of the adhesive in the first injection is ≤0.6MPa, for example, it can be 0.6MPa, 0.55MPa, 0.5MPa, 0.45MPa, 0.4MPa, 0.35MPa, 0.3MPa, 0.25MPa, 0.2MPa, 0.15MPa, 0.1MPa, 0.05MPa or 0.01MPa, etc., but is not limited to the listed values. Other unlisted values ​​within this range also meet the requirements.

[0143] The curing method of the first curing includes thermal curing or photocuring.

[0144] The selection of the curing method in the first curing stage is based on the adhesive used in the injection. If the adhesive used in the first injection is a thermosetting adhesive, then the thermosetting method can be selected. If the adhesive used in the first injection is a light-curing adhesive, then the light-curing method can be selected.

[0145] The adhesive used in the second injection process comprises, by weight percentage: 30-40% polybutylene terephthalate, 20-30% polycarbonate, and 30-50% adhesive.

[0146] The polybutylene terephthalate material used in the second injection adhesive is glass fiber reinforced polybutylene terephthalate, and the glass fiber content is 30-35% by mass, for example, it can be 30%, 30.5%, 31%, 31.5%, 32%, 32.5%, 33%, 33.5%, 34%, 34.5% or 35%, etc., but is not limited to the listed values. Other unlisted values ​​within this range are also acceptable.

[0147] The polycarbonate material of the adhesive used in the second injection is glass fiber reinforced polycarbonate, with glass fiber content ranging from 20% to 40% by mass. For example, it can be 20%, 22%, 24%, 26%, 28%, 30%, 32%, 34%, 36%, 38%, or 40%, but is not limited to the listed values. Other unlisted values ​​within this range are also acceptable.

[0148] The adhesive used in the second injection includes one or a combination of at least two of epoxy resin adhesives, acrylic adhesives, or polymethyl methacrylate adhesives.

[0149] The adhesive used in the second injection process also includes pigments; the pigments include one or a combination of at least two of red, yellow, or blue pigments; the red pigments include one or a combination of at least one of iron oxide red pigment, scarlet pink pigment, or transparent red pigment; the yellow pigments include lead chromate yellow pigment and / or iron oxide yellow pigment; and the blue pigments include phthalocyanine blue pigment and / or ultramarine pigment.

[0150] The amount of pigment added to the glue used in the second injection is reasonably selected based on the required depth and type of color, without specific restrictions.

[0151] In this invention, the adhesive used in the second injection is prepared by mixing ingredients according to their mass percentage content.

[0152] The amount of glue injected in the second injection is 1.001-1.002 times the volume of the injection tank, for example, it can be 1.001 times, 1.0012 times, 1.0014 times, 1.0016 times, 1.0018 times or 1.002 times, etc., but is not limited to the listed values. Other unlisted values ​​within this range are also acceptable.

[0153] The injection pressure of the adhesive in the second injection is ≤0.6MPa, for example, it can be 0.6MPa, 0.55MPa, 0.5MPa, 0.45MPa, 0.4MPa, 0.35MPa, 0.3MPa, 0.25MPa, 0.2MPa, 0.15MPa, 0.1MPa, 0.05MPa or 0.01MPa, etc., but is not limited to the listed values. Other unlisted values ​​within this range also meet the requirements.

[0154] The curing method of the second curing includes thermal curing or photocuring;

[0155] The selection of the curing method in the second curing process is based on the appropriate confirmation of the adhesive used in the second injection. If the adhesive used in the second injection is a thermosetting adhesive, then the thermosetting method can be selected. If the adhesive used in the second injection is a light-curing adhesive, then the light-curing method can be selected.

[0156] Furthermore, to illustrate the processing effects achievable by the electronic device housing molding process provided by the present invention, practical examples are used for explanation, as follows:

[0157] Example 1

[0158] This embodiment provides a molding process for an electronic device housing, the electronic device housing molding process including:

[0159] The metal substrate is sequentially subjected to CNC rough machining, polishing, CNC fine machining, sandblasting, and anodizing.

[0160] The metal casing 2 obtained by anodizing is subjected to injection molding of antenna partition strips and decorative strips;

[0161] The antenna separator strip injection molding process includes sequential activation, injection, curing, and demolding.

[0162] The decorative strip injection molding process includes sequential activation, injection, curing, and demolding.

[0163] The processed metal shell 2 has two through grooves on its back side and two steps on the outer edge of its top surface. The through grooves are used for injection molding of antenna separators. The steps are used for injection molding of decorative strips. The antenna separators are embedded in the bottom and side walls of the metal shell and the edges of both sides of the shell. The dielectric constant of the separators is different from that of the decorative strips.

[0164] The CNC rough machining is to process the slots, first injection port and second injection port of the electronic components according to the design;

[0165] The first activation includes activating the first dispensing port with plasma; the gas pressure for forming the plasma in the first activation is controlled at 5 Pa; the absolute vacuum degree of the operation in the first activation is 0.01 Pa;

[0166] The second activation includes activating the second dispensing port with plasma; the gas pressure for forming the plasma in the second activation is controlled at 6 Pa; the absolute vacuum degree of the operation in the second activation is 0.02 Pa;

[0167] The mold cavity construction includes forming a first mold cavity 3.1 in the first injection and a second mold cavity in the second injection. The first mold cavity 3.1 consists of a first upper mold 1.1.1, a lower mold 1.2, and a shell. A lower cover plate is provided between the lower mold 1.2 and the shell. A silicone strip is provided on the lower cover plate, and it is combined with the bottom surface of the shell and the molding surface of the first upper mold 1.1.1 to form the first mold cavity 3.1. The second mold cavity is formed by an upper cover plate provided between the second upper mold 1.1.2, the lower mold 1.2, and the shell. The upper cover plate is placed on the shell and is provided with a silicone strip and is combined with the shell. The first upper mold 1.1.1 is provided with an injection hole and a vent hole communicating with the first mold cavity 3.1. The upper cover plate is provided with an injection hole and a vent hole communicating with the second mold cavity. After the first and second injections are completed, the mixture is transferred to the curing area for curing under pressure.

[0168] The first and second injections are performed simultaneously using a dual-channel injection method.

[0169] The adhesive used in the first injection molding process comprises, by weight percentage: 35% polybutylene terephthalate (PET), 25% polycarbonate, 20% dielectric material, and 20% adhesive; the dielectric constant of the adhesive is greater than that of the dielectric material; the PET material in the first injection molding process is glass fiber reinforced PET, with glass fiber comprising 32% by weight; the polycarbonate material in the first injection molding process is glass fiber reinforced polycarbonate. The fiberglass content is 30% by weight; the dielectric material is polytetrafluoroethylene; the thermosetting adhesive used in the first injection is commercially available LOCTITE-361AB thermosetting resin, which is cured at 80°C for 30 minutes; the adhesive used in the first injection also includes pigment, the color of which is the same as the color of the metal shell 2 product; the injection volume of the adhesive in the first injection is 1.004 times the volume of the injection tank; the injection pressure of the adhesive in the first injection is 0.3 MPa;

[0170] The adhesive used in the second injection molding process comprises, by weight percentage: 30% polybutylene terephthalate (PET), 20% polycarbonate, and 50% binder; the PET material in the second injection molding process is glass fiber reinforced PET, with glass fiber comprising 32% by weight; the polycarbonate material in the second injection molding process is glass fiber reinforced polycarbonate, with glass fiber comprising 30% by weight; the binder in the second injection molding process is commercially available LOCTITE-6104 thermosetting resin, cured at 80°C for 60 minutes; the adhesive in the second injection molding process also includes pigment, the pigment color being the same as the color of the metal casing 2 product; the injection volume of the adhesive in the second injection molding process is 1.0015 times the volume of the injection tank; the injection pressure of the adhesive in the second injection molding process is 0.4 MPa;

[0171] When both the first and second curing processes employ heat curing, the upper and lower cover plates are made of materials with high thermal conductivity.

[0172] The electronic device housing obtained in this embodiment is a mobile phone housing. During use, thermosetting molding is used. The heating of the surface of the mobile phone housing is much lower than the working temperature of the IM injection molding process, which has little impact on the thermal expansion of the mobile phone housing. Therefore, after molding, there is no gap in the joint caused by thermal shrinkage. The antenna isolation strip formed by injection molding has better coverage and can form a protective wrap around the antenna.

[0173] Example 2

[0174] This embodiment provides a molding process for an electronic device housing, the electronic device housing molding process including:

[0175] The metal substrate is sequentially subjected to CNC rough machining, polishing, CNC fine machining, sandblasting, and anodizing.

[0176] The metal casing 2 obtained by anodizing is subjected to injection molding of antenna partition strips and decorative strips;

[0177] The antenna separator strip injection molding process includes sequential activation, injection, curing, and demolding.

[0178] The decorative strip injection molding process includes sequential activation, injection, curing, and demolding.

[0179] The processed metal shell 2 has four through grooves on its back side and three steps on the outer edge of its top surface. The through grooves are used for injection molding of antenna separators. The steps are used for injection molding of decorative strips. The antenna separators are embedded in the bottom and / or sidewalls of the metal shell and the edges of both sides of the shell. The dielectric constant of the separators is different from that of the decorative strips.

[0180] The CNC rough machining is to process the slots, first injection port and second injection port of the electronic components according to the design;

[0181] The first activation includes activating the first dispensing port with plasma; the gas pressure of the plasma generated in the first activation is controlled at 10 Pa; the absolute vacuum degree of the operation in the first activation is 0.0007 Pa;

[0182] The second activation includes activating the second injection port with plasma; the gas pressure for forming the plasma in the second activation is controlled at 0.1 Pa; the absolute vacuum degree during the second activation is 0.5 Pa.

[0183] The mold cavity construction includes forming a first mold cavity 3.1 in the first injection and a second mold cavity in the second injection. The first mold cavity 3.1 consists of a first upper mold 1.1.1, a lower mold 1.2, and a shell. A lower cover plate is provided between the lower mold 1.2 and the shell. A silicone strip is provided on the lower cover plate, and it is combined with the bottom surface of the shell and the molding surface of the first upper mold 1.1.1 to form the first mold cavity 3.1. The second mold cavity is formed by an upper cover plate provided between the second upper mold 1.1.2, the lower mold 1.2, and the shell. The upper cover plate is placed on the shell and is provided with a silicone strip and is combined with the shell. The first upper mold 1.1.1 is provided with an injection hole and a vent hole communicating with the first mold cavity 3.1. The upper cover plate is provided with an injection hole and a vent hole communicating with the second mold cavity. After the first and second injections are completed, the mixture is transferred to the curing area for curing under pressure.

[0184] The first and second injections are performed simultaneously using a dual-channel injection method.

[0185] The adhesive used in the first injection molding process comprises, by weight percentage: 40% polybutylene terephthalate (PBPT), 20% polycarbonate, 10% dielectric material, and 30% adhesive; the dielectric constant of the adhesive is greater than that of the dielectric material; the PBPT material in the first injection molding process is glass fiber reinforced PBPT, with glass fiber comprising 35% by weight; the polycarbonate material in the first injection molding process is glass fiber reinforced polycarbonate, with glass fiber comprising 20% ​​by weight; the dielectric material comprises a combination of polytetrafluoroethylene (PTFE) and auxiliary materials; the auxiliary materials are acrylonitrile (A)-butadiene (B)-styrene. In the terpolymer of olefin (S), the dielectric constant of the dielectric material is 3; when the dielectric material is a combination of polytetrafluoroethylene and auxiliary materials, the mass percentage of polytetrafluoroethylene accounts for 8% of the antenna protection isolation material, and the content of the auxiliary materials is 2%; the adhesive used in the first injection is a thermosetting adhesive, specifically commercially available LOCTITE-6104 thermosetting resin, cured at 65°C for 60 minutes; the adhesive used in the first injection also includes pigment, the color of which is the same as the color of the metal shell 2; the injection volume of the adhesive in the first injection is 1.006 times the volume of the injection tank; the injection pressure of the adhesive in the first injection is 0.6 MPa;

[0186] The adhesive used in the second injection molding process comprises, by weight percentage: 40% polybutylene terephthalate (PBPT), 20% polycarbonate, and 40% adhesive; the PBPT material in the second injection molding process is glass fiber reinforced PBPT, with glass fiber comprising 30% by weight; the polycarbonate material in the second injection molding process is glass fiber reinforced polycarbonate, with glass fiber comprising 20% ​​by weight; the adhesive in the second injection molding process is Henkel Loctite-3494 UV-curable adhesive; the adhesive in the second injection molding process also includes pigment, the color of which is the same as that of the metal casing 2; the injection volume of the adhesive in the second injection molding process is 1.001 times the volume of the injection tank; the injection pressure of the adhesive in the second injection molding process is 0.6 MPa;

[0187] The first curing process uses thermosetting, and the upper and lower cover plates are made of aluminum alloy with high thermal conductivity.

[0188] The second curing process uses light curing, the top cover is made of a light-transmitting material, and the second upper mold 1.1.2 is provided with a corresponding light-transmitting groove.

[0189] The electronic device housing obtained in this embodiment is a flat panel housing. During use, the antenna separator strip is formed by injection molding, which can better fill the flat panel housing with a relatively large span, and can flow and fill without pressure. Since the edge length of the flat panel housing is larger, the glue can be quickly filled by low-pressure injection. During use, the decorative strip is attached to the edge of the flat panel housing. Due to the IM process molding, no heating is required, the dimensional stability is good, and the sealing performance is good after assembly.

[0190] Example 3

[0191] This embodiment provides a molding process for an electronic device housing, the electronic device housing molding process including:

[0192] The metal substrate is sequentially subjected to CNC rough machining, polishing, CNC fine machining, sandblasting, and anodizing.

[0193] The metal casing 2 obtained by anodizing is subjected to injection molding of antenna partition strips and decorative strips;

[0194] The antenna separator strip injection molding process includes sequential activation, injection, curing, and demolding.

[0195] The decorative strip injection molding process includes sequential activation, injection, curing, and demolding.

[0196] The processed metal shell 2 has two through grooves on its back side and two steps on the outer edge of its top surface. The through grooves are used for injection molding of antenna separators. The steps are used for injection molding of decorative strips. The antenna separators are embedded in the bottom and / or sidewalls of the metal shell and the edges of both sides of the shell. The dielectric constant of the separators is different from that of the decorative strips.

[0197] The CNC rough machining is to process the slots, first injection port and second injection port of the electronic components according to the design;

[0198] The first activation includes activating the first dispensing port with plasma; the gas pressure for forming the plasma in the first activation is controlled at 0.1 Pa; the absolute vacuum degree of the operation in the first activation is 0.5 Pa;

[0199] The second activation includes activating the second injection port with plasma; the gas pressure of the plasma generated in the second activation is controlled at 10 Pa; the absolute vacuum degree of the operation in the second activation is 0.0007 Pa;

[0200] The mold cavity construction includes forming a first mold cavity 3.1 in the first injection and a second mold cavity in the second injection. The first mold cavity 3.1 consists of a first upper mold 1.1.1, a lower mold 1.2, and a shell. A lower cover plate is provided between the lower mold 1.2 and the shell. A silicone strip is provided on the lower cover plate, and it is combined with the bottom surface of the shell and the molding surface of the first upper mold 1.1.1 to form the first mold cavity 3.1. The second mold cavity is formed by an upper cover plate provided between the second upper mold 1.1.2, the lower mold 1.2, and the shell. The upper cover plate is placed on the shell and is provided with a silicone strip and is combined with the shell. The first upper mold 1.1.1 is provided with an injection hole and a vent hole communicating with the first mold cavity 3.1. The upper cover plate is provided with an injection hole and a vent hole communicating with the second mold cavity. After the first and second injections are completed, the mixture is transferred to the curing area for curing under pressure.

[0201] The first and second injections are performed simultaneously using a dual-channel injection method.

[0202] The adhesive used in the first injection molding process comprises, by weight percentage: 30% polybutylene terephthalate (PBPT), 30% polycarbonate, 30% dielectric material, and 10% adhesive; the dielectric constant of the adhesive is greater than that of the dielectric material; the PBPT material in the first injection molding process is glass fiber reinforced PBPT, with glass fiber comprising 30% by weight; the polycarbonate material in the first injection molding process is glass fiber reinforced polycarbonate, with glass fiber comprising 40% by weight; the dielectric material is a combination of polytetrafluoroethylene (PTFE) and auxiliary materials; the auxiliary materials are poly(... The mass percentage of 4-methyl-1-pentene and polytetrafluoroethylene accounts for 10% of the antenna protection and isolation material, so the mass percentage of the auxiliary material is 20%. The dielectric constant of the dielectric material is 1. The adhesive used in the first injection is a thermosetting adhesive, specifically commercially available LOCTITE-361AB thermosetting resin, which is cured at 80°C for 30 minutes. The adhesive used in the first injection also includes pigment, the color of which is the same as the color of the metal shell 2. The injection volume of the adhesive in the first injection is 1.002 times the volume of the injection tank. The injection pressure of the adhesive in the first injection is 0.1 MPa.

[0203] The adhesive used in the second injection molding process comprises, by weight percentage: 40% polybutylene terephthalate (PBPT), 30% polycarbonate, and 30% adhesive; the PBPT material in the second injection molding process is glass fiber reinforced PBPT, with glass fiber comprising 35% by weight; the polycarbonate material in the second injection molding process is glass fiber reinforced polycarbonate, with glass fiber comprising 40% by weight; the adhesive in the second injection molding process is Henkel Loctite-3922 UV-curable adhesive; the adhesive in the second injection molding process also includes pigment, the color of which is the same as the color of the metal casing 2 (page 2); the injection volume of the adhesive in the second injection molding process is 1.002 times the volume of the injection tank; the injection pressure of the adhesive in the second injection molding process is 0.1 MPa;

[0204] The first curing process uses thermosetting, and the upper and lower cover plates are made of aluminum alloy with high thermal conductivity.

[0205] The second curing process uses light curing, the top cover is made of a light-transmitting material, and the second upper mold 1.1.2 is provided with a corresponding light-transmitting groove.

[0206] The electronic device housing obtained in this embodiment is a mobile phone housing. During use, the antenna isolation strip of the mobile phone housing is tightly bonded to the metal housing, improving its service life. In addition, plasma treatment is performed on the surface before injection to provide surface activity and improve the bonding strength. By injecting the adhesive at room temperature, the heating process of the metal housing is reduced, resulting in good stability. The decorative strip is formed by injection molding, providing continuous protective decoration at the edges. The low temperature and low pressure flow result in a filling molding effect that is superior to traditional IM injection molding processes.

[0207] In summary, in this invention, the non-metallic structure on the metal shell 2 is integrally molded using a room-temperature injection molding process, ensuring controllable product dimensions; the injection molding process replaces the traditional PSA bonding, improving bonding strength, with epoxy strength reaching over 20MPa and PU bonding strength reaching over 8MPa; it facilitates color management and allows for a variety of colors; compared to the traditional two-stage in-mold heating injection molding, it offers higher production efficiency and improved quality.

[0208] The present invention is described in detail through the above embodiments, but the present invention is not limited to the above detailed structural features, that is, it does not mean that the present invention must rely on the above detailed structural features to be implemented. Those skilled in the art should understand that any improvements to the present invention, equivalent substitutions for the components used in the present invention, additions of auxiliary components, and selection of specific methods, etc., all fall within the protection scope and disclosure scope of the present invention.

[0209] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the specific details in the above embodiments. Within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solution of the present invention, and these simple modifications all fall within the protection scope of the present invention.

[0210] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present invention will not describe the various possible combinations separately.

[0211] Furthermore, various different embodiments of the present invention can be combined in any way, as long as they do not violate the spirit of the present invention, they should also be regarded as the content disclosed by the present invention.

Claims

1. A molding process for an electronic device housing, characterized in that, The electronic device housing molding process includes the following: The machining, surface treatment, and insulator injection molding are carried out sequentially. The insulator injection molding process includes surface activation, mold cavity construction, injection, curing, and demolding. The injection molding process includes injection molding of the antenna separator strip on the back of the housing and injection molding of the decorative strip on the front of the housing.

2. The electronic device housing molding process as described in claim 1, characterized in that, The electronic device housing molding process includes: The metal substrate is sequentially subjected to CNC rough machining, polishing, CNC fine machining, sandblasting, and anodizing. The metal casing obtained by anodizing is subjected to adhesive injection molding of antenna partition strips and decorative strips. The antenna separator strip injection molding process includes sequential activation, injection, curing, and demolding. The decorative strip injection molding process includes sequential activation, injection, curing, and demolding. The adhesive used in the first injection molding process includes polybutylene terephthalate (PBPT), polycarbonate, dielectric material, and adhesive; the adhesive used in the second injection molding process includes PBPT, polycarbonate, and adhesive.

3. The electronic device housing molding process as described in claim 1 or 2, characterized in that, The back side of the machined metal shell is provided with at least one through groove, and the outer edge of the top surface of the metal shell is provided with at least one step. Preferably, the through groove is used for injection molding of antenna separator strips; the step is used for injection molding of decorative strips; Preferably, the antenna separator is embedded in the bottom and / or sidewalls of the metal shell, and the edges of both sides of the shell; Preferably, the dielectric constant of the separator strip is different from that of the decorative strip.

4. The electronic device housing molding process as described in claim 2 or 3, characterized in that, The CNC rough machining is to process the slots, first injection port and second injection port of the electronic components according to the design.

5. The electronic device housing molding process according to any one of claims 2-4, characterized in that, The first activation includes activating the first injection port with plasma; Preferably, the gas pressure for forming plasma during the first activation is controlled to be 0.1-10 Pa; Preferably, the absolute vacuum degree during the first activation is 0.0007-0.5 Pa; Preferably, the second activation includes activating the second injection port with plasma; Preferably, the gas pressure for forming plasma during the second activation is controlled to be 0.1-10 Pa; Preferably, the absolute vacuum degree of the operation in the second activation is 0.0007-0.5 Pa.

6. The electronic device housing molding process according to any one of claims 2-5, characterized in that, The first activation and the second activation are performed separately or simultaneously, which is to treat the surface of the metal shell used to form the antenna separator strip and the decorative strip. Preferably, the first and second injections are performed separately or simultaneously using a dual-channel injection method.

7. The electronic device housing molding process according to any one of claims 2-6, characterized in that, The mold cavity construction includes forming a first mold cavity in the first injection and forming a second mold cavity in the second injection; Preferably, the first mold cavity is composed of a first upper mold, a lower mold and a shell, a lower cover plate is provided between the lower mold and the shell, a silicone strip is provided on the lower cover plate, and the lower cover plate, together with the bottom surface of the shell and the forming surface of the first upper mold, forms the first mold cavity; Preferably, the second mold cavity is an upper cover plate disposed between the second upper mold, the lower mold and the shell, the upper cover plate is closed on the shell, and a silicone strip is disposed on the upper cover plate and is combined with the shell to form a mold cavity. Preferably, the first upper mold is provided with an injection hole and an vent hole communicating with the first mold cavity; Preferably, the upper cover plate is provided with an injection hole and an vent hole communicating with the second mold cavity; Preferably, after the first and second injections are completed, the mixture is transferred to the curing area under pressure for curing. Preferably, when the first curing and the second curing are light-curing, the upper cover plate and the lower cover plate are made of light-transmitting material, and the first upper mold, the second upper mold, and the lower mold are all provided with light-transmitting grooves. Preferably, when the first curing and the second curing are performed using heat curing, the upper cover plate and the lower cover plate are made of a material with high thermal conductivity.

8. The electronic device housing molding process according to any one of claims 2-7, characterized in that, The adhesive used in the first injection molding process comprises, by weight percentage: 30-40% polybutylene terephthalate, 20-30% polycarbonate, 5-35% dielectric material, and 10-45% adhesive; the dielectric constant of the adhesive is greater than that of the dielectric material. Preferably, the polybutylene terephthalate material of the adhesive used in the first injection is glass fiber reinforced polybutylene terephthalate, and the glass fiber content is 30-35% by mass. Preferably, the polycarbonate material of the adhesive used in the first injection is glass fiber reinforced polycarbonate, and the glass fiber content is 20-40% by mass. Preferably, the dielectric material comprises a combination of polytetrafluoroethylene and auxiliary materials or polytetrafluoroethylene; Preferably, the excipients include any one or a combination of at least two of the following terpolymers: polypropylene, poly(4-methyl-1-pentene), or acrylonitrile (A)-butadiene (B)-styrene (S); Preferably, the dielectric constant of the dielectric material is 1-3; Preferably, when the dielectric material is polytetrafluoroethylene, the mass percentage of the dielectric material is 10-20%. Preferably, when the dielectric material is a combination of polytetrafluoroethylene and auxiliary materials, the mass percentage of polytetrafluoroethylene accounts for 8-10% of the antenna protection and isolation material. Preferably, the adhesive used in the first injection includes one or a combination of at least two of epoxy resin adhesives, acrylic adhesives, or polymethyl methacrylate adhesives; Preferably, the adhesive used in the first injection also includes pigments; Preferably, the pigment includes one or a combination of at least two of red, yellow, or blue pigments; Preferably, the red pigment includes one or a combination of at least two of iron oxide red pigment, scarlet pink pigment, or transparent red pigment; Preferably, the yellow pigment includes lead chromium yellow pigment and / or iron yellow pigment; Preferably, the blue pigment includes phthalocyanine blue pigment and / or ultramarine pigment; Preferably, the amount of glue injected in the first injection is 1.002-1.006 times the volume of the injection tank; Preferably, the injection pressure of the adhesive in the first injection is ≤0.6MPa.

9. The electronic device housing molding process according to any one of claims 2-8, characterized in that, The adhesive used in the second injection molding process comprises, by weight percentage: 30-40% polybutylene terephthalate, 20-30% polycarbonate, and 30-50% adhesive. Preferably, the polybutylene terephthalate material of the adhesive used in the second injection is glass fiber reinforced polybutylene terephthalate, and the glass fiber content is 30-35% by mass. Preferably, the polycarbonate material of the adhesive used in the second injection is glass fiber reinforced polycarbonate, and the glass fiber content is 20-40% by mass. Preferably, the adhesive used in the second injection includes one or a combination of at least two of epoxy resin adhesives, acrylic adhesives, or polymethyl methacrylate adhesives; Preferably, the adhesive used in the second injection also includes pigments; Preferably, the pigment includes one or a combination of at least two of red, yellow, or blue pigments; Preferably, the red pigment includes one or a combination of at least one of iron oxide red pigment, scarlet pink pigment, or transparent red pigment; Preferably, the yellow pigment includes lead chromium yellow pigment and / or iron yellow pigment; Preferably, the blue pigment includes phthalocyanine blue pigment and / or ultramarine pigment.

10. The electronic device housing molding process according to any one of claims 2-9, characterized in that, The amount of glue injected in the second injection is 1.001-1.002 times the volume of the injection tank; Preferably, the injection pressure of the adhesive in the second injection is ≤0.6MPa.

Images