Ultrathin glass cutting and splitting method
By forming a modified layer on the surface of ultrathin glass and using liquid nitrogen spraying and infrared laser to control temperature differences, the problem of low directional cracking rate of ultrathin glass was solved, achieving a high yield and low edge chipping processing effect, and reducing production costs.
Patent Information
- Application Number
- CN202511322914.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-16
- Publication Date
- 2025-11-14
AI Technical Summary
Existing technologies have low directional breakage rate and high breakage rate when processing 0.05mm ultrathin glass, which leads to increased production costs and makes it difficult to achieve a yield rate of over 99%.
A modified layer is formed on the surface of ultrathin glass using a laser scalpel. Combined with a liquid nitrogen spraying module and an infrared laser local heating module, the multiple fragile layers are fractured in a directional manner by controlling the temperature difference, thus avoiding the impact of high temperature on optical performance.
It improved the directional cracking rate of ultra-thin glass, reduced the defect rate, with edge chipping less than 30um, and the yield rate reached over 98%, thus reducing production costs.
Smart Images
Figure CN120943520A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of ultra-thin glass, and in particular to a method for cutting and splitting ultra-thin glass. Background Technology
[0002] In the process of processing an ultrathin glass with a thickness of 0.05±0.01mm, the glass is mainly shaped into a predetermined shape by directional cleaving, thereby forming a micro-flexible electronic device.
[0003] However, existing processing techniques generally employ laser cutting followed by contact slicing, meaning laser cutting is performed first, followed by contact slicing.
[0004] However, 0.05mm ultra-thin glass has extremely low strength, resulting in a low directional breakage rate. Consequently, the defective product breakage rate is over 60%. Therefore, the industry requires cutting edge chipping of less than 30um and a breakage yield of over 99% (most require a yield of over 85%, which greatly reduces production costs). Summary of the Invention
[0005] The main objective of this invention is to propose a method for cutting and splitting ultra-thin glass, which aims to prevent the ultra-thin glass from breaking and chipping.
[0006] To achieve the above objectives, this invention proposes a method for cutting and cleaving ultrathin glass, including a laser scalpel and a cleaving device.
[0007] The processing steps of the laser knife include:
[0008] S1: A laser blade is used to modify the surface of the area to be processed in the ultra-thin glass and form a modified layer. The modified layer is used to make the ultra-thin glass processing surface have a predetermined tensile strength and density.
[0009] S2: Employs a fragmentation device including a liquid nitrogen injection module and an infrared laser local heating module.
[0010] S21: The liquid nitrogen injection module cools the lower wall of the processing area to a first predetermined temperature.
[0011] S22: The infrared laser local heating module heats the upper wall of the area to be processed to a second predetermined temperature, thus forming a predetermined sheet product.
[0012] This can be understood as first using a laser cutter to modify the surface of the area to be processed. The preferred embodiment is the upper and lower surfaces. Of course, a single surface can also improve the yield rate compared to the existing single processing method.
[0013] The modified layer can form a restraining protective layer on the upper and lower surfaces of ultrathin glass, thereby reducing non-directional cleavage. If ultrathin glass is directly laser-cut during processing, its fragile nature means that the fracture force will be transmitted (due to its polycrystalline structure). Therefore, minimizing non-directional cleavage is a key design consideration.
[0014] By employing modified layers and forming multiple fragile layers between the two modified layers, the orientation of ultrathin glass can be effectively improved.
[0015] Furthermore, by using a processing method with a first predetermined temperature and a second predetermined temperature, the modification of ultrathin glass caused by a single high temperature can be avoided, thus preventing it from affecting the predetermined optical performance.
[0016] It can also improve the stability of directional fragmentation. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the glass sheet after step S1 in the processing method of this application.
[0018] Figure 2 This is a schematic diagram of processing method S2 in this application;
[0019] Figure 3 This is a schematic diagram of the modular design of this application. Detailed Implementation
[0020] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.
[0021] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, top, bottom, inside, outside, vertical, horizontal, longitudinal, counterclockwise, clockwise, circumferential, radial, axial, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.
[0022] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.
[0023] like Figures 1 to 3 As shown, a method for cutting and cleaving ultrathin glass includes a laser scalpel and a cleaving device.
[0024] The processing steps of the laser knife include:
[0025] S1: A laser blade is used to modify the surface of the area to be processed in the ultra-thin glass and form a modified layer. The modified layer is used to make the ultra-thin glass processing surface have a predetermined tensile strength and density.
[0026] S2: Employs a fragmentation device including a liquid nitrogen injection module and an infrared laser local heating module.
[0027] S21: The liquid nitrogen injection module cools the lower wall of the processing area to a first predetermined temperature.
[0028] S22: The infrared laser local heating module heats the upper wall of the area to be processed to a second predetermined temperature, thus forming a predetermined sheet product.
[0029] This can be understood as first using a laser cutter to modify the surface of the area to be processed. The preferred embodiment is the upper and lower surfaces. Of course, a single surface can also improve the yield rate compared to the existing single processing method.
[0030] The modified layer can form a restraining protective layer on the upper and lower surfaces of ultrathin glass, thereby reducing non-directional cleavage. If ultrathin glass is directly laser-cut during processing, its fragile nature means that the fracture force will be transmitted (due to its polycrystalline structure). Therefore, minimizing non-directional cleavage is a key design consideration.
[0031] By employing modified layers and forming multiple fragile layers between the two modified layers, the orientation of ultrathin glass can be effectively improved.
[0032] Furthermore, by using a processing method with a first predetermined temperature and a second predetermined temperature, the modification of ultrathin glass caused by a single high temperature can be avoided, thus preventing it from affecting the predetermined optical performance.
[0033] It can also improve the stability of directional fragmentation; and two laser systems are used.
[0034] Specifically, the laser ultraviolet nanosecond laser is an ultraviolet laser galvanometer system.
[0035] In this embodiment of the invention, the wavelength of the laser is 355 nm, and the energy density of the laser is 0.5–2 J / cm². 2 The laser is a Gaussian beam with a spot diameter of 10 μm.
[0036] Specifically, the energy density of the laser is less than the glass ablation threshold.
[0037] In this embodiment of the invention, in step S1,
[0038] The area to be processed is the cutting line area, and the modified layer is the bottom and top surfaces of ultra-thin glass.
[0039] The modification depth of the upper surface is 5±1μm, and the modification depth of the bottom surface is 15±3μm. The modified layer on the bottom surface accounts for 30% of the glass thickness. This can be understood as forming a multi-fragile layer in the middle layer of the ultra-thin glass through two protective layers.
[0040] Specifically, there is a multi-fragile layer between the two modified layers.
[0041] In this embodiment of the invention, the first predetermined temperature is -196°C, and the second predetermined temperature is 200 to 300°C.
[0042] The upper wall to be cut (0.03 mm wide) is rapidly cooled with liquid nitrogen; the other side is heated by infrared laser scanning (temperature difference > 400℃), which causes thermal stress to cause directional fracture of multiple fragile layers (edge chipping < 30 μm); finally, a small cut piece that meets the specifications is formed.
[0043] Specifically, the width of the liquid nitrogen injection module is 0.03 mm.
[0044] In this embodiment of the invention, the modified layer is a laser-sintered layer.
[0045] Specifically, a comparison of the processing yield of this application with that of the prior art:
[0046] project conventional cutting and processing This patented process for cutting and processing Yield ～80％ More than 98%
[0047] In Example 1,
[0048] It uses 0.05mm ultra-thin UTG glass.
[0049] Using S1, the modification depth of the upper surface is 5 μm, and the modification depth of the bottom surface is 15 μm.
[0050] Using S2, the liquid nitrogen jet module operates at a first predetermined temperature of -196℃, while the infrared laser local heating module operates at a second predetermined temperature of 250℃. Thermal stress causes directional fracture of multiple fragile layers, resulting in a chipping edge of 22µm in the sheet-like product.
[0051] The chipping is less than 30µm, therefore it meets the requirements.
[0052] In actual ultra-thin glass (UTG) processing, out of 1000 small pieces processed (multiple batches), the number of defective products is between 15 and 25, with an overall defect rate of less than 2%.
[0053] In Example 2,
[0054] It uses 0.05mm ultra-thin UTG glass.
[0055] Using S1, the modification depth of the upper surface is 6 μm, and the modification depth of the bottom surface is 18 μm.
[0056] Using S2, the liquid nitrogen injection module operates at a first predetermined temperature of -196℃, while the infrared laser local heating module operates at a second predetermined temperature of 280℃. Thermal stress causes directional fracture of multiple fragile layers, resulting in a chipping edge of 15µm in sheet-like products.
[0057] The chipping is less than 30µm, therefore it meets the requirements.
[0058] In actual ultra-thin glass (UTG) processing, out of 1000 small pieces processed (multiple batches), the number of defective products is between 10 and 15, with an overall defect rate of less than 2%.
[0059] In Example 3,
[0060] It uses 0.05mm ultra-thin UTG glass.
[0061] Using S1, the modification depth of the upper surface is 6 μm, and the modification depth of the bottom surface is 20 μm.
[0062] Using S2, the liquid nitrogen injection module operates at a first predetermined temperature of -196℃, while the infrared laser local heating module operates at a second predetermined temperature of 280℃. Thermal stress causes directional fracture of multiple fragile layers, resulting in a chipping edge of 15µm in sheet-like products.
[0063] The chipping is less than 30µm, therefore it meets the requirements.
[0064] In actual ultra-thin glass (UTG) processing, out of 1000 small pieces processed (multiple batches), the number of defective products is between 20 and 30, with an overall defect rate of more than 2% but less than 3%.
[0065] Therefore, it can be concluded that the predetermined modification layer can improve the directional cleavage effect. However, if the value is exceeded, the cleavage will still have orientation. However, due to the characteristics of glass materials, the cleavage will still cause inter-crystal chain breakage. Furthermore, when the modification thickness is greater than the predetermined value, its optics will be affected.
[0066] The processing method described in this application does not affect the optical effect of the lens. The directional breakage can be understood as directional cutting, which uses an unconventional laser cutting method.
[0067] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.
Claims
1. A method for cutting and cleaving ultrathin glass, characterized in that, Includes laser scalpel and dicing device, The processing steps of the laser knife include: S1: A laser blade is used to modify the surface of the area to be processed in the ultra-thin glass and form a modified layer. The modified layer is used to make the ultra-thin glass processing surface have a predetermined tensile strength and density. S2: Employs a fragmentation device including a liquid nitrogen injection module and an infrared laser local heating module. S21: The liquid nitrogen injection module cools the lower wall of the processing area to a first predetermined temperature. S22: The infrared laser local heating module heats the upper wall of the area to be processed to a second predetermined temperature, thus forming a predetermined sheet product.
2. The method for cutting and cleaving ultrathin glass as described in claim 1, characterized in that: The laser is an ultraviolet nanosecond laser.
3. The method for cutting and cleaving ultrathin glass as described in claim 1, characterized in that: The wavelength of the laser is 355 nm, and the energy density of the laser is 0.5–2 J / cm². 2 The laser is a Gaussian beam with a spot diameter of 10 μm.
4. The method for cutting and cleaving ultrathin glass as described in claim 1, characterized in that: The energy density of the laser is less than the glass ablation threshold.
5. The method for cutting and cleaving ultrathin glass as described in claim 1, characterized in that: In S1, The area to be processed is the cutting line area, and the modified layer is the bottom and top surfaces of ultra-thin glass. The modification depth of the upper surface is 5±1μm, the modification depth of the bottom surface is 15±3μm, and the modification layer of the bottom surface accounts for 30% of the glass thickness.
6. The method for cutting and cleaving ultrathin glass as described in claim 5, characterized in that: There is a multi-fragile layer between the two modified layers.
7. The method for cutting and cleaving ultrathin glass as described in claim 1, characterized in that: The first predetermined temperature is -196℃, and the second predetermined temperature is 200~300℃. Thermal stress causes directional fracture of multiple fragile layers, and the chipping of sheet products is <30um. To form sheet-like products that meet predetermined specifications.
8. The method for cutting and cleaving ultrathin glass as described in claim 1, characterized in that: The width of the liquid nitrogen injection module is 0.03 mm.
9. The method for cutting and cleaving ultrathin glass as described in claim 1, characterized in that: The modified layer is a laser-sintered layer.