Semi-flexible combined plate and manufacturing method thereof
By employing a multi-layered structure design of the substrate and the laminated plate assembly, along with positioning, recycling, and protection mechanisms, the problems of milling cutter wear and powder scattering during the processing of semi-flexible composite plates were solved, achieving high-precision and high-quality processing results.
Patent Information
- Application Number
- CN202511500946.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-21
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2045-10-21
AI Technical Summary
Existing processing methods for semi-flexible composite boards result in severe wear of the milling cutter, uneven thickness after processing, and the generation of metal powder that poses a health hazard and may cause short circuits on the circuit board. Furthermore, the processing accuracy and quality are difficult to guarantee.
It adopts a multi-layer structure design of substrate and laminated plate assembly, combined with positioning, recycling and protection mechanisms. The positioning plate, recycling tube and protection plate prevent powder from flying, and the cleaning brush and grinding plate are used to clean the powder. Chemical agents are used to remove residual powder.
It improves the processing precision and quality of semi-flexible composite boards, reduces the health hazards of powder scattering, ensures clean circuit boards, avoids short circuit risks, and enhances overall quality.
Smart Images

Figure CN120980772A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of circuit board processing, in particular to a semi-flexible combination board and a manufacturing method thereof. BACKGROUND
[0002] The semi-flexible combination board is usually formed by pressing two rigid plate materials and a flexible material, and then using a milling cutter to control the depth of milling in the semi-flexible area (such as Figure 1 ) until the thickness of the semi-flexible area reaches a bendable degree. This processing method is prone to cause uneven thickness of the semi-flexible area after long-time processing, which affects the bending performance of the semi-flexible area. In addition, a large amount of powder is generated during the processing of the rigid plate, and the metal layer on the surface of the rigid plate contains metal powder in the generated powder. If the metal powder is not cleaned in time, it will be scattered into the air with the airflow during processing, which is harmful to human health. Moreover, the metal powder falling on the surface of the circuit board during processing will cause short circuit and damage to the circuit board. SUMMARY
[0003] The present application aims to provide a semi-flexible combination board and a manufacturing method thereof to solve the problems in the background art.
[0004] To achieve the above-mentioned purpose, the present application provides the following technical solution: a semi-flexible combination board, comprising a substrate, the substrate being a primary pressing structure formed by pressing a semi-flexible plate, a first prepreg and a copper foil laminated thereon, and then etching and removing the copper foil; the substrate is symmetrically provided with a laminated plate group on both sides; the laminated plate group is composed of a first rigid plate, a second prepreg, a second rigid plate and a third prepreg laminated from top to bottom and then subjected to secondary pressing; and the substrate part between the two laminated plate groups is a semi-flexible area.
[0005] A manufacturing method of a semi-flexible combination board, the specific steps of the method are as follows: Step one: first, the semi-flexible plate, the copper foil and the first prepreg are sequentially laminated and pressed, and then the copper foil is etched and removed to form a primary pressing structure; Step two: then, blind milling grooves are processed on the surface of the second rigid plate, and windows with the same shape as the blind milling grooves are processed on the surface of the third prepreg, the size of the window in the plane is larger than that of the blind milling groove to reserve the glue overflow space; Step three: then, the first rigid plate, the second prepreg, the second rigid plate, the third prepreg and the primary pressing structure are laminated from top to bottom, and then subjected to secondary pressing to form a combination board; Step four: then, the combination board needs to be moved to the surface of the processing equipment to process the semi-flexible area; Step five: finally, the combination board after processing is cleaned and cut. Wherein the processing equipment in step four comprises a processing table, a moving arm is fixedly installed on the surface of the processing table, a milling cutter is installed at the end of the moving arm, a positioning mechanism is arranged on the surface of the processing table, the positioning mechanism is used for positioning the combination plate, a limiting mechanism is arranged on the surface of the positioning mechanism, the limiting mechanism is used for limiting the combination plate when the combination plate is completely moved into the positioning mechanism, a recovery mechanism is arranged on the surface of the processing table, the recovery mechanism is used for recovering the powder generated during processing through air flow suction, a protection mechanism is arranged on the surface of the recovery mechanism, and the protection mechanism is used for protecting the processing position.
[0006] As a further scheme of the present application, the positioning mechanism comprises two L-shaped positioning plates, both of which are fixedly connected to the surface of the processing table, the combination plate is located inside the two positioning plates, the side wall of the combination plate is attached to the positioning plate, and the inner edge of the positioning plate is beveled.
[0007] As a further scheme of the present application, the limiting mechanism comprises four positioning columns, which are respectively arranged at the four corner positions on the surface of the combination plate, the positioning columns penetrate through the combination plate, a notch is arranged on the surface of the positioning plate, the notch penetrates through the positioning plate, the positioning columns are located in the notch, an L-shaped limiting rod is elastically and slidably connected to the surface of the positioning plate, one end of the limiting rod is located above one end of the notch, the other end of the limiting rod extends to one side of the other end of the notch, and the end of the limiting rod is beveled, a blocking rod is elastically and slidably connected to the surface of the positioning plate, the blocking rod is located above the notch and close to the side of the beveled end of the limiting rod, the end of the blocking rod is beveled, a limiting groove is arranged on the surface of the blocking rod, the limiting rod is used for limiting the blocking rod by moving into the limiting groove, and a pulling rod is fixedly connected to the surface of the blocking rod and extends to the outside of the positioning plate.
[0008] As a further scheme of the present application, the recovery mechanism comprises an L-shaped elastically stretchable recovery pipe, which is installed on the surface of the processing table, a recovery port is arranged on the surface of the processing table corresponding to the position of the recovery pipe, the recovery port is connected to an external air blower, the bottom of the recovery pipe is located at one side of the positioning plate, the upper end of the recovery pipe extends above the positioning plate, a plurality of processing ports are arranged on the surface of the recovery pipe, the processing ports penetrate through the recovery pipe, the inside of the recovery pipe communicates with the processing ports, the inside of the processing port forms a negative pressure under the action of the external air blower, and a blocking plate is fixedly connected to the inside of the processing port, which is used for blocking the upper half of the inside of the recovery pipe at the position of the processing port.
[0009] As a further scheme of the present application, the protection mechanism comprises a fixed plate fixedly connected to the inner wall surface of the machining opening, the fixed plate blocks half of the machining opening, two retractable protection plates are fixedly connected to the inner wall surface of the machining opening, the two protection plates and the fixed plate cover the machining opening, the corner of the two protection plates close to the fixed plate is cut off to form a V-shaped entrance, a U-shaped surrounding plate is fixedly connected to the bottom of the recovery pipe, two swing plates are elastically hinged to the inner surface of the surrounding plate, the two swing plates block the opening side of the surrounding plate, and the surrounding plate and the two swing plates surround the position of the machining opening below the recovery pipe.
[0010] As a further scheme of the present application, the first sliding plate is elastically and slidably connected to the surface of the surrounding plate, and the first cleaning brush is fixedly connected to the bottom of the first sliding plate.
[0011] As a further scheme of the present application, the first sliding plate is elastically and slidably connected to the surface of the surrounding plate, and the first cleaning brush is fixedly connected to the bottom of the first sliding plate.
[0012] As a further scheme of the present application, the second sliding plate is elastically and slidably connected to the surface of the surrounding plate, the second sliding plate covers the side surface of the surrounding plate together with the first sliding plate, the second sliding plate is located above the semi-flexible area, the second cleaning brush is fixedly connected to the bottom of the second sliding plate, the storage box is fixedly connected to the surface of the surrounding plate, the storage box stores chemical agents for removing metal powder, the retractable connecting pipe is in communication with the bottom of the storage box, the bottom of the connecting pipe is connected with the second sliding plate, the second sliding plate blocks the connecting pipe, a plurality of drainage grooves are formed in the surface of the second sliding plate, the throttling plate is fixedly connected inside the fixed end of the connecting pipe, the first water outlet is formed in the surface of the throttling plate, the sealing plate is slidably connected inside the fixed end of the connecting pipe, two second water outlets are formed in the surface of the sealing plate, the two second water outlets are arranged in a staggered manner with the first water outlet, the extension plate is fixedly connected to the side surface of the sealing plate, the extension plate penetrates through the connecting pipe and the surrounding plate, and is bent downwardly behind the surrounding plate to extend to the position of the polishing plate, the through hole is formed in the surface of the connecting pipe and the surrounding plate corresponding to the position of the extension plate, the extension plate is elastically connected to the inner wall of the through hole, the retractable sealing plate is fixedly connected inside the through hole, the actuating block is fixedly connected to the surface of the polishing plate, and the actuating block is used to move the extension plate.
[0013] As a further scheme of the present application, the inner side surface of the enclosure is hinged with a swing rod, the middle position of the swing rod is hinged with the enclosure, the swing rod is below the extension plate near the side of the extension plate, the inner side of the enclosure is elastically and slidably connected with an L-shaped sliding rod, the upper end of the sliding rod is above the end of the swing rod away from the extension plate, the bottom of the sliding rod is rotatably connected with a rolling wheel, and the rolling wheel is outside the semi-flexible area.
[0014] Compared with the prior art, the present application has the following beneficial effects: 1. In the process of manufacturing the semi-flexible bonding plate, the copper foil, the first semi-cured sheet and the semi-flexible plate are first pressed and etched to form a primary pressing structure, then a plurality of blind lacing grooves are formed on the surface of the second rigid plate, and a plurality of windows with the same shape as the blind lacing grooves are formed on the surface of the third semi-cured sheet at positions corresponding to the blind lacing grooves, the window size is larger than that of the blind lacing groove to leave a glue overflow area, which prevents the third semi-cured sheet from flowing to the semi-flexible area during pressing, causing excessive glue overflow, affecting the appearance and bending performance of the semi-flexible bonding plate, improving the manufacturing precision and overall quality of the semi-flexible bonding plate, and using the enclosure, swing plate, fixed plate and protective plate to block the debris and metal powder generated during processing, reducing the flying range of the metal powder, avoiding the scattering of the powder in the air during processing, and causing harm to the human body, and the blocked debris and metal powder in the processing port are extracted and removed through the recovery pipe, ensuring the cleanliness of the bonding plate surface processing position.
[0015] 2. In the process of processing the bonding plate, the first sliding plate on the outer side of the enclosure and the first cleaning brush can seal the gap between the bottom of the enclosure and the bonding plate, preventing the powder generated during processing from floating out of the range of the enclosure through the bottom of the enclosure, thereby affecting the circuit of the subsequent circuit board, and when the recovery pipe contracts to drive the enclosure to move, the first cleaning brush moves together, and the first cleaning brush can sweep the powder attached to the surface of the bonding plate.
[0016] 3. In the process of processing the bonding plate, the grinding plate moves together with the recovery pipe, the rolling column moves along the surface of the bonding plate, and then the lacing knife gradually processes the semi-flexible area on the surface of the bonding plate, the grinding plate moves into the semi-flexible area as the processing depth of the semi-flexible area gradually increases, the side surface of the grinding plate grinds and cleans the two sides of the semi-flexible area, thereby cleaning the powder attached to the side wall surface of the semi-flexible area after processing, facilitating the recovery of the powder by the recovery pipe, and ensuring the cleanliness of the processing position. BRIEF DESCRIPTION OF DRAWINGS
[0017] Figure 1 It is a structural schematic diagram of the semi-flexible bonding plate. Figure 2 It is an exploded structural schematic diagram of the semi-flexible bonding plate when the semi-flexible area is not processed. Figure 3 This is a schematic diagram of the structure of a semi-flexible bonded plate after it has been cut open without the semi-flexible area being processed (the dotted line in the figure represents the processing range of the semi-flexible area). Figure 4 for Figure 3 Schematic diagram of the structure at point A in the middle; Figure 5 This is a flowchart of the method of the present invention; Figure 6 This is a schematic diagram of the overall structure of the present invention; Figure 7 for Figure 6 Schematic diagram of the structure at point B; Figure 8 This is a schematic diagram of the overall cross-section of the present invention; Figure 9 for Figure 8 Schematic diagram of the structure at point C; Figure 10 This is a schematic diagram showing the connection relationship between the processing table, the positioning plate, and the connecting plate in this invention; Figure 11 for Figure 10 Schematic diagram of the structure at point D; Figure 12 for Figure 10 Schematic diagram of the structure at point E in the middle; Figure 13 This is a schematic diagram of the positioning plate in this invention; Figure 14 This is an exploded structural diagram of the bonding plate in this invention; Figure 15 This is a schematic diagram showing the positional relationship between the recycling pipe and the surrounding plate in this invention; Figure 16 for Figure 15 Schematic diagram of the structure at point F; Figure 17 This is a schematic diagram of the structure of the enclosure and storage box after being cut open in this invention; Figure 18 for Figure 17 Schematic diagram of the structure at point G.
[0018] In the drawings: 1 - first rigid plate, 2 - second rigid plate, 3 - first prepreg, 4 - second prepreg, 5 - third prepreg, 6 - copper foil, 7 - semi-flexible plate, 8 - primary compression structure, 9 - blind lapping groove, 10 - window, 11 - combined plate, 12 - semi-flexible area, 13 - processing table, 14 - moving arm, 15 - lapping cutter, 16 - positioning plate, 17 - positioning column, 18 - slot, 19 - limiting rod, 20 - blocking rod, 21 - limiting slot, 22 - pulling rod, 23 - recovery pipe, 24 - recovery port, 25 - processing port, 26 - blocking plate, 27 - fixed plate, 28 - protective plate, 29 - inlet, 30 - fence, 31 - swing plate, 32 - first sliding plate, 33 - first cleaning brush, 34 - polishing plate, 35 - rolling column, 36 - second sliding plate, 37 - second cleaning brush, 38 - storage box, 39 - connecting pipe, 40 - drainage groove, 41 - throttling plate, 42 - first water outlet, 43 - plugging plate, 44 - second water outlet, 45 - extension plate, 46 - through port, 47 - sealing plate, 48 - shifting block, 49 - swing rod, 50 - sliding rod, 51 - rolling wheel. DETAILED DESCRIPTION
[0019] Referring to Figures 1-18 The present application provides a technical solution: a semi-flexible combined plate, comprising a substrate, the substrate being a primary compression structure 8 formed by pressing and etching the semi-flexible plate 7, the first prepreg 3, and the copper foil 6 laminated thereon; two symmetrical laminated plate groups are arranged on both sides of the substrate; the laminated plate group is composed of the first rigid plate 1, the second prepreg 4, the second rigid plate 2, and the third prepreg 5 laminated from top to bottom and then subjected to secondary compression; the part of the substrate between the two laminated plate groups is a semi-flexible area 12. A method for manufacturing a semi-flexible combined plate, the specific steps of the method are as follows: Step one: first, the semi-flexible plate 7, the copper foil 6, and the first prepreg 3 are sequentially laminated and compressed to form a primary compression structure 8 after etching the copper foil 6; Step two: then, blind lapping grooves 9 are processed on the surface of the second rigid plate 2, and windows 10 with the same shape as the blind lapping grooves 9 are processed on the surface of the third prepreg 5, the size of the window 10 in the plane is larger than that of the blind lapping groove 9 to reserve the excess glue space; Step three: then, the first rigid plate 1, the second prepreg 4, the second rigid plate 2, the third prepreg 5, and the primary compression structure 8 are laminated from top to bottom, and then subjected to secondary compression to form a combined plate 11; Step four: then, the combined plate 11 needs to be moved to the surface of the processing equipment to process the semi-flexible area 12; Step five: finally, the combined plate 11 after processing is cleaned and cut; The processing equipment in step four includes a processing table 13, a movable arm 14 fixedly installed on the surface of the processing table 13, a milling cutter 15 installed at the end of the movable arm 14, a positioning mechanism arranged on the surface of the processing table 13 and used for positioning the combination plate 11, a limiting mechanism arranged on the surface of the positioning mechanism and used for limiting the combination plate 11 when the combination plate 11 is completely moved into the positioning mechanism, and a recovery mechanism arranged on the surface of the processing table 13 and used for recovering the powder generated in the processing by using air flow. The positioning mechanism includes two L-shaped positioning plates 16, both of which are fixedly connected to the surface of the processing table 13, the combination plate 11 is located on the inner side of the two positioning plates 16, the side wall of the combination plate 11 is attached to the positioning plate 16, and the inner edge of the positioning plate 16 is beveled. The limiting mechanism includes four positioning columns 17, which are arranged at the four corner positions on the surface of the combination plate 11, respectively, the positioning column 17 penetrates through the combination plate 11, a slot 18 is arranged on the surface of the positioning plate 16 and penetrates through the positioning plate 16, the positioning column 17 is located in the slot 18, an L-shaped limiting rod 19 is elastically and slidably connected to the surface of the positioning plate 16, one end of the limiting rod 19 is located above one end of the slot 18, the other end of the limiting rod 19 extends to one side of the other end of the slot 18 and the end of the limiting rod 19 is beveled, a blocking rod 20 is elastically and slidably connected to the surface of the positioning plate 16, the blocking rod 20 is located above the slot 18 and close to the side of the end of the limiting rod 19 which is beveled, the end of the blocking rod 20 is beveled, a limiting groove 21 is arranged on the surface of the blocking rod 20, the limiting rod 19 is used for being moved into the limiting groove 21 to limit the blocking rod 20, and a pulling rod 22 is fixedly connected to the surface of the blocking rod 20 and extends to the outer side of the positioning plate 16. The recovery mechanism includes an L-shaped elastically stretchable recovery pipe 23, which is installed on the surface of the processing table 13, a recovery port 24 is arranged on the surface of the processing table 13 at the position of the recovery pipe 23, the recovery port 24 is connected to an external air blower, the bottom of the recovery pipe 23 is located at one side of the positioning plate 16, the upper end of the recovery pipe 23 extends to the upper side of the positioning plate 16, a plurality of processing ports 25 are arranged on the surface of the recovery pipe 23 and penetrate through the recovery pipe 23, the inside of the recovery pipe 23 is communicated with the processing ports 25, the inside of the processing port 25 forms negative pressure under the action of the external air blower, and a blocking plate 26 is fixedly connected to the inside of the processing port 25 and used for blocking the upper half of the inside of the recovery pipe 23 at the position of the processing port 25. The protection mechanism comprises a fixed plate 27 fixedly connected to the inner wall surface of the machining port 25, the fixed plate 27 blocks half of the machining port 25, two telescopic protection plates 28 are fixedly connected to the inner wall side of the machining port 25, the two protection plates 28 and the fixed plate 27 cover the machining port 25, one corner of each of the two protection plates 28 close to and away from the fixed plate 27 is cut off to form a V-shaped entrance 29, a U-shaped surrounding plate 30 is fixedly connected to the bottom of the recovery pipe 23, two swing plates 31 are elastically hinged to the inner side surface of the surrounding plate 30, the two swing plates 31 block the open side of the surrounding plate 30, and the surrounding plate 30 and the two swing plates 31 surround the position of the machining port 25 below the recovery pipe 23; In the process of manufacturing the semi-flexible bonding plate, the copper foil 6, the first prepreg 3 and the semi-flexible plate 7 are stacked and pressed first, then the copper foil 6 is removed by etching to form a first pressing structure 8, then a plurality of blind slots 9 are formed on the surface of the second rigid plate 2 at the processing positions, and a plurality of windows 10 with the same shape as the blind slots 9 are formed on the surface of the third prepreg 5 corresponding to the positions of the blind slots 9, the size of the window 10 is larger than that of the blind slot 9 to leave a glue overflow area, so that the third prepreg 5 does not flow to the semi-flexible area 12 during the pressing process, causing excessive glue overflow, affecting the appearance and bending performance of the semi-flexible bonding plate, and the third prepreg is a low glue flow prepreg, which is used to reduce the flowability of the resin of the third prepreg 5 during pressing, then the first rigid plate 1, the second prepreg 4, the second rigid plate 2, the third prepreg 5 and the first pressing structure 8 are stacked in order from top to bottom and subjected to a second pressing to obtain a bonding plate 11, then the four corners of the bonding plate 11 are punched and positioned columns 17 are installed, then the bonding plate 11 is moved to the surface of the processing table 13 and pushed from the bottom of the positioning plate 16, the two sides of the bonding plate 11 are guided by the inclined surfaces inside the positioning plate 16 to move between the two positioning plates 16, before the bonding plate 11 is completely in place, the blocking rod 20 is in the state of being clamped in the limiting groove 21 by the limiting rod 19, the positioning column 17 will move into the slot 18, then when the bonding plate 11 is completely moved to the inside of the positioning plate 16, the positioning column 17 will move to the position of the limiting rod 19 and press the limiting rod 19 to move a distance, the end of the limiting rod 19 will move out of the limiting groove 21 to release the limiting of the blocking rod 20, the blocking rod 20 will move above the slot 18 to block the positioning column 17, so that the positioning column 17 and the bonding plate 11 can be stably positioned during processing, then the router bit 15 will move to one side of the recovery pipe 23 under the action of the moving arm 14, then the router bit 15 will move into the processing port 25, the router bit 15 will push the swing plate 31 to rotate and move to the inside of the processing port 25, the two protective plates 28 will be pushed to the two sides by the router bit 15 when entering the entrance 29, the router bit 15 will move into the processing port 25, then during the processing of the bonding plate 11 by the router bit 15, the generated debris and metal powder will be blocked by the surrounding plate 30, the swing plate 31, the fixed plate 27 and the protective plate 28, reducing the flying range of the metal powder, avoiding the scattering of the powder in the air during the processing process to cause harm to the human body, the external air conditioner will exhaust the inside of the processing port 25 through the recovery pipe 23 and the recovery port 24, so as to exhaust the debris and metal powder generated during the processing of the processing port 25, ensure the cleanliness of the processing position of the bonding plate 11, avoid the metal powder falling on the surface of the bonding plate 11 during the processing process, so as to affect the conduction of the subsequent circuit board surface metal circuit, reduce the product quality, the blocking plate 26 can block the upper part of the recovery pipe 23 at the position of the processing port 25, so that the powder scattered into other processing ports 25 can be blocked,The powder entering the inside of the recovery pipe 23 can be prevented from flying out from the position of the other machining port 25, and the fixed plate 27 can be driven to move together with the recovery pipe 23 when the gong knife 15 moves for machining, the recovery pipe 23 is retracted, and the fixed plate 27 can keep the machining position of the gong knife 15 in the middle position of the machining port 25, so as to ensure the machining effect of the gong knife 15, avoid that the gong knife 15 is too close to the surrounding plate 30 when moving for machining, and affect the machining of the gong knife 15, and effectively avoid the problems of glue overflow or glue hollow in the semi-flexible area 12 through the pre-blind gong slot 9 machining process and accurate control of the window size of the third semi-cured sheet 5, so as to further improve the manufacturing precision and overall quality of the semi-flexible bonding plate, then after the machining is completed, the pulling rod 22 is pulled outward, the blocking rod 20 moves outward to release the blocking of the positioning column 17, and the limiting rod 19 moves into the limiting groove 21 to limit the blocking rod 20, and finally the bonding plate 11 after machining needs to be cleaned and cut to obtain a single semi-flexible bonding plate.
[0020] In the process of machining the bonding plate 11, a gap is left between the bottom of the surrounding plate 30 and the bonding plate 11, and the powder generated in the machining process can float out of the range of the surrounding plate 30 from the bottom of the surrounding plate 30, and as a further scheme of the present application, the first sliding plate 32 is elastically and slidably connected to the surface of the surrounding plate 30, and the first cleaning brush 33 is fixedly connected to the bottom of the first sliding plate 32. In the process of machining the bonding plate 11, the first sliding plate 32 and the first cleaning brush 33 on the outer side of the surrounding plate 30 can block the gap between the bottom of the surrounding plate 30 and the bonding plate 11, so as to avoid that the powder in the machining process floats out of the range of the surrounding plate 30 through the bottom of the surrounding plate 30, thereby affecting the circuit of the subsequent circuit board, and when the surrounding plate 30 is driven to move by the recovery pipe 23, the first cleaning brush 33 moves together, and the first cleaning brush 33 can sweep the powder attached to the surface of the bonding plate 11.
[0021] In the process of machining the bonding plate 11, the two side surfaces of the semi-flexible area 12 after machining can be attached with more powder that cannot be recovered by the recovery pipe 23, and as a further scheme of the present application, the grinding plate 34 is elastically and slidably connected to the inner side surface of the surrounding plate 30, the grinding plate 34 is above the semi-flexible area 12, and the grinding plate 34 is used for grinding the side wall of the semi-flexible area 12 by using the side edge in the machining process, the two sides of the bottom of the grinding plate 34 are bevels, the upper end of the grinding plate 34 extends to both sides, and the extension part of the grinding plate 34 and the grinding plate 34 are bevels, the rolling column 35 is rotationally connected to the bottom of the grinding plate 34, and the rolling column 35 is attached to the surface of the first rigid plate 1. In the process of processing the bonding plate 11, the polishing plate 34 moves along with the movement of the recovery pipe 23, the rolling column 35 moves along the surface of the bonding plate 11, and then the polishing plate 34 moves into the semi-flexible area 12 along with the gradual increase of the processing depth of the semi-flexible area 12 in the process that the hammer drill 15 gradually processes the semi-flexible area 12 on the surface of the bonding plate 11, and the side of the polishing plate 34 polishes the two sides of the semi-flexible area 12, so as to clean the powder attached to the side wall surface of the semi-flexible area 12 after processing, facilitate the recovery of the powder by the recovery pipe 23, and ensure the cleanliness of the processing position.
[0022] In the process of processing the bonding plate 11, the first cleaning brush 33 for cleaning the metal powder remaining in the gap after processing the semi-flexible area 12 is difficult to completely clean the metal powder, and as a further scheme of the application, the surface of the surrounding plate 30 is elastically and slidably connected with a second sliding plate 36, the second sliding plate 36 covers the side of the surrounding plate 30 together with the first sliding plate 32, the second sliding plate 36 is above the semi-flexible area 12, the bottom of the second sliding plate 36 is fixedly connected with a second cleaning brush 37, the surface of the surrounding plate 30 is fixedly connected with a storage box 38, the storage box 38 stores chemical agents for cleaning metal powder, the bottom of the storage box 38 is communicated with a telescopic connecting pipe 39, the bottom of the connecting pipe 39 is connected with the second sliding plate 36, the second sliding plate 36 blocks the connecting pipe 39, the surface of the second sliding plate 36 is provided with a plurality of drainage grooves 40, the inside of the fixed end of the connecting pipe 39 is fixedly connected with a throttle plate 41, the surface of the throttle plate 41 is provided with a first water outlet 42, the inside of the fixed end of the connecting pipe 39 is slidably connected with a blocking plate 43, the surface of the blocking plate 43 is provided with two second water outlets 44, the two second water outlets 44 are arranged in a staggered manner with the first water outlet 42, the side of the blocking plate 43 is fixedly connected with an extension plate 45, the extension plate 45 penetrates through the connecting pipe 39 and the surrounding plate 30, and is bent downward to extend to the position of the polishing plate 34 after the surrounding plate 30, the surface of the connecting pipe 39 and the surrounding plate 30 is provided with a through hole 46 corresponding to the position of the extension plate 45, the extension plate 45 is elastically connected with the inner wall of the through hole 46, the through hole 46 is fixedly connected with a telescopic sealing plate 47, the surface of the polishing plate 34 is fixedly connected with a pushing block 48, and the pushing block 48 is used to move the extension plate 45; In the process of processing the bonding plate 11, the rolling column 35 will move on the surface of the bonding plate 11, the first cleaning brush 33 and the bottom of the second cleaning brush 37 will be in contact with the surface of the bonding plate 11, then in the process of gradually processing the semi-flexible area 12 on the surface of the bonding plate 11 by the lapping tool 15, the rolling column 35 and the polishing plate 34 will gradually move downwards, the second sliding plate 36 and the cleaning brush will also gradually move downwards along with the processing of the semi-flexible area 12, then when the semi-flexible area 12 is completely processed, the polishing plate 34 will drive the toggle block 48 to move to the position of the extension plate 45 and drive the extension plate 45 to move downwards by a distance, the extension plate 45 will drive the blocking plate 43 to move downwards together, the blocking plate 43 will be separated from the throttle plate 41, the first water outlet 42 and the second water outlet 44 will be exposed, the reagent stored in the storage box 38 will flow to the surface of the second sliding plate 36 through the first water outlet 42, the second water outlet 44 and the connecting pipe 39, the sealing plate 47 can seal the through hole 46 to prevent the reagent from flowing out from the side of the connecting pipe 39, then the reagent will flow along the drainage groove 40 on the surface of the second sliding plate 36 to the surface of the second cleaning brush 37, then the reagent will be coated in the semi-flexible area 12 when the second cleaning brush 37 sweeps the semi-flexible area 12, the reagent can react with the metal powder remaining in the semi-flexible area 12 to eliminate it, which is beneficial to completely remove the metal powder remaining in the semi-flexible area 12 to ensure the cleanliness of the semi-flexible area 12, avoid the metal powder remaining in the semi-flexible area 12 after the semi-flexible processing is completed, which will affect the normal conduction of the circuit on the surface of the circuit board in the subsequent use of the circuit board, and the content of the reagent can be adjusted as needed without affecting the circuit on the surface of the circuit board, after the semi-flexible area 12 is processed, the processed circuit board needs to be cleaned, and the reagent will be removed in the cleaning process.
[0023] Before processing the bonding plate 11, the polishing plate 34 will be in contact with the processing table 13 when the work station is not placed with the bonding plate 11, the first water outlet 42 and the second water outlet 44 cannot be blocked, and the reagent in the storage box 38 will flow out, as a further scheme of the present application, the inner side surface of the surrounding plate 30 is hinged with a swing rod 49, the middle position of the swing rod 49 is hinged with the surrounding plate 30, the side of the swing rod 49 close to the extension plate 45 is below the extension plate 45, the inner side of the surrounding plate 30 is elastically and slidably connected with an L-shaped sliding rod 50, the upper end of the sliding rod 50 is above the end of the swing rod 49 away from the extension plate 45, the bottom of the sliding rod 50 is rotationally connected with a rolling wheel 51, and the rolling wheel 51 is outside the semi-flexible area 12; Before the binding plate 11 is processed, the rolling wheel 51 at the bottom of the sliding rod 50 is attached to the processing table 13 under the action of the spring force when the binding plate 11 is not moved to the working position, the sliding rod 50 is used to make the swing rod 49 close to the side of the extension plate 45 and be raised, the extension plate 45 is attached to the upper end of the through hole 46 under the action of the swing rod 49, the blocking plate 43 is attached to the throttle plate 41, the first water outlet 42 and the second water outlet 44 are misaligned and arranged to be blocked by the blocking plate 43 and the throttle plate 41 respectively, the medicine in the storage box 38 cannot flow out, on the one hand, the waste of the medicine is reduced, on the other hand, the medicine flowing out can avoid corroding the processing table 13, the grinding plate 34 is lifted under the action of the extension plate 45 and the driving block 48, then when the binding plate 11 is pushed to the inside of the positioning plate 16, the binding plate 11 is used to move the sliding rod 50 upward, the upward movement of the sliding rod 50 can release the pressure on the end of the swing plate 31 away from the extension plate 45, the swing plate 31 cannot support the extension plate 45, then when the semi-flexible area 12 is processed, the grinding plate 34 and the extension plate 45 can move downward.
Claims
1. A semi-flexible bonding plate, comprising a substrate, characterized in that: The substrate is a single-pressed structure (8) consisting of a semi-flexible plate (7), a first prepreg (3) and a copper foil (6) stacked on it, which are then etched to remove the copper foil (6). The substrate is symmetrically provided with stacked plate groups on both sides. The stacked plate groups are composed of a first rigid plate (1), a second prepreg (4), a second rigid plate (2), and a third prepreg (5) stacked from top to bottom and then subjected to a second-pressing process. The substrate portion between the two stacked plate groups is a semi-flexible region (12).
2. A method for manufacturing a semi-flexible bonding plate, applicable to the semi-flexible bonding plate described in claim 1, characterized in that: The specific steps of this method are as follows: Step 1: First, the semi-flexible board (7), copper foil (6) and the first semi-cured sheet (3) need to be stacked and pressed together in sequence, and the copper foil (6) is etched away to form a one-time pressing structure (8). Step 2: Then, a blind groove (9) is machined on the surface of the second rigid plate (2), and a window (10) with the same shape as the blind groove (9) is machined on the surface of the third semi-cured sheet (5). The window (10) is larger than the blind groove (9) in the plane to reserve space for excess glue. Step 3: Then, stack the first rigid plate (1), the second semi-cured sheet (4), the second rigid plate (2), the third semi-cured sheet (5) and the first pressing structure (8) in the order from top to bottom, and then perform a second pressing to form a bonding plate (11). Step 4: Then the bonding plate (11) needs to be moved to the surface of the processing equipment to process a semi-flexible area (12). Step 5: Finally, clean the processed bonding plate (11) and cut it along both sides of the blind groove (9) so that the middle part of the bonding plate (11) located on the upper side of the first pressing structure (8) is cut off, forming the semi-flexible area (12) and two stacked plate groups. The processing equipment in step four includes a processing table (13), on which a movable arm (14) is fixedly installed, and a ker (15) is installed at the end of the movable arm (14). The processing table (13) is provided with a positioning mechanism, which is used to position the connecting plate (11). The positioning mechanism is provided with a limiting mechanism, which is used to limit the connecting plate (11) when it is completely moved into the positioning mechanism. The processing table (13) is provided with a recycling mechanism, which is used to use airflow to recycle the powder generated during processing. The recycling mechanism is provided with a protective mechanism, which is used to protect the processing position.
3. The method for manufacturing a semi-flexible bonding plate according to claim 2, characterized in that: The positioning mechanism includes two L-shaped positioning plates (16), both of which are fixedly connected to the surface of the processing table (13). The connecting plate (11) is located inside the two positioning plates (16), and the side wall of the connecting plate (11) is in contact with the positioning plate (16). The inner edge of the positioning plate (16) is a bevel.
4. The method for manufacturing a semi-flexible bonding plate according to claim 3, characterized in that: The limiting mechanism includes four positioning posts (17), which are respectively located at the four corners of the surface of the connecting plate (11). The positioning posts (17) penetrate the connecting plate (11). A slot (18) is opened on the surface of the positioning plate (16), and the slot (18) penetrates the positioning plate (16). The positioning posts (17) are located inside the slot (18). An L-shaped limiting rod (19) is elastically slidably connected to the surface of the positioning plate (16). One end of the limiting rod (19) is above one end of the slot (18), and the other end of the limiting rod (19) extends into the slot (18). One side of the positioning plate (16) and the end of the limiting rod (19) is inclined. A blocking rod (20) is elastically slidably connected to the surface of the positioning plate (16). The blocking rod (20) is located above the slot (18) and close to the end of the limiting rod (19) which is inclined. The end of the blocking rod (20) is inclined. A limiting groove (21) is opened on the surface of the blocking rod (20). The limiting rod (19) is used to move into the limiting groove (21) to limit the blocking rod (20). A pulling rod (22) is fixedly connected to the surface of the blocking rod (20). The pulling rod (22) extends to the outside of the positioning plate (16).
5. The method for manufacturing a semi-flexible composite plate according to claim 3, characterized in that: The recycling mechanism includes an L-shaped elastically extendable recycling tube (23), which is installed on the surface of the processing table (13). A recycling port (24) is provided on the surface of the processing table (13) corresponding to the position of the recycling tube (23). The recycling port (24) is connected to an external fan. The bottom of the recycling tube (23) is located on one side of the positioning plate (16), and the upper end of the recycling tube (23) extends above the positioning plate (16). Multiple processing ports (25) are provided on the surface of the recycling tube (23). The processing ports (25) penetrate the recycling tube (23). The inside of the recycling tube (23) is connected to the processing ports (25). The inside of the processing ports (25) will form a negative pressure under the action of the external fan. A baffle plate (26) is fixedly connected to the inside of the processing port (25). The baffle plate (26) is used to block the upper part of the inside of the recycling tube (23) at the processing port (25).
6. The method for manufacturing a semi-flexible composite plate according to claim 5, characterized in that: The protective mechanism includes a fixed plate (27), which is fixedly connected to the inner wall surface of the processing port (25). The fixed plate (27) blocks half of the processing port (25). Two retractable protective plates (28) are fixedly connected to the inner wall side of the processing port (25). The two protective plates (28) and the fixed plate (27) cover the processing port (25). The corners of the two protective plates (28) that are close to each other and away from the fixed plate (27) are cut off to form a V-shaped inlet (29). A U-shaped enclosure (30) is fixedly connected to the bottom of the recycling pipe (23). Two swing plates (31) are elastically hinged to the inner surface of the enclosure (30). The two swing plates (31) block one side of the opening of the enclosure (30). The enclosure (30) and the two swing plates (31) surround the position of the recycling pipe (23) corresponding to the processing port (25).
7. The method for manufacturing a semi-flexible bonding plate according to claim 6, characterized in that: The surface of the enclosure (30) is elastically slidably connected to a first sliding plate (32), and a first cleaning brush (33) is fixedly connected to the bottom of the first sliding plate (32).
8. The method for manufacturing a semi-flexible bonding plate according to claim 7, characterized in that: A grinding plate (34) is elastically slidably connected to the inner surface of the enclosure (30). The grinding plate (34) is located above the semi-flexible area (12). During the processing, the grinding plate (34) is used to grind the side wall of the semi-flexible area (12) using its side edge. The two sides of the bottom of the grinding plate (34) are inclined surfaces. The upper end of the grinding plate (34) extends to both sides and the extension part of the grinding plate (34) is inclined with the grinding plate (34). A rolling column (35) is rotatably connected to the bottom of the grinding plate (34). The rolling column (35) is in contact with the surface of the first rigid plate (1).
9. The method for manufacturing a semi-flexible bonding plate according to claim 8, characterized in that: The enclosure (30) is elastically slidably connected to a second sliding plate (36). The second sliding plate (36) and the first sliding plate (32) cover the side of the enclosure (30). The second sliding plate (36) is located above the semi-flexible area (12). A second cleaning brush (37) is fixedly connected to the bottom of the second sliding plate (36). A storage box (38) is fixedly connected to the surface of the enclosure (30). The storage box (38) stores a chemical agent for removing metal powder. A retractable connecting pipe (39) is connected to the bottom of the storage box (38). The bottom of the connecting pipe (39) is connected to the second sliding plate (36). The second sliding plate (36) seals the connecting pipe (39). Multiple drainage grooves (40) are opened on the surface of the second sliding plate (36). A throttling plate (41) is fixedly connected inside the fixed end of the connecting pipe (39). The throttling plate (41) has a surface... The first water outlet (42) is provided on the surface of the connecting pipe (39). A sealing plate (43) is slidably connected inside the fixed end of the connecting pipe (39). Two second water outlets (44) are provided on the surface of the sealing plate (43). The two second water outlets (44) are staggered with the first water outlet (42). An extension plate (45) is fixedly connected to the side of the sealing plate (43). The extension plate (45) passes through the connecting pipe (39) and the surrounding plate (30) and then bends downward to the position of the grinding plate (34). A through-hole (46) is provided on the surface of the connecting pipe (39) and the surrounding plate (30) corresponding to the position of the extension plate (45). The inner wall of the extension plate (45) is elastically connected to the through-hole (46). A retractable sealing plate (47) is fixedly connected inside the through-hole (46). A toggle block (48) is fixedly connected to the surface of the grinding plate (34). The toggle block (48) is used to move the extension plate (45).
10. The method for manufacturing a semi-flexible bonding plate according to claim 9, characterized in that: A swing rod (49) is hinged to the inner surface of the enclosure (30). The middle position of the swing rod (49) is hinged to the enclosure (30). The side of the swing rod (49) near the extension plate (45) is below the extension plate (45). An L-shaped sliding rod (50) is elastically slidably connected to the inner side of the enclosure (30). The upper end of the sliding rod (50) is above the end of the swing rod (49) away from the extension plate (45). A rolling wheel (51) is rotatably connected to the bottom of the sliding rod (50). The rolling wheel (51) is outside the semi-flexible area (12).
Citation Information
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