Millimeter wave antenna and radar system
By setting an isolation structure between the soldering area and the functional area of the millimeter waveguide antenna, the problem of solder overflow or breakage during the soldering process is solved, ensuring the consistency of the antenna's electromagnetic performance and manufacturing stability.
Patent Information
- Application Number
- CN202511314725.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-15
- Publication Date
- 2025-11-21
AI Technical Summary
Existing millimeter waveguide antennas are prone to solder overflow or solder breakage during the soldering process, which leads to a sharp deterioration in antenna performance and poor consistency.
An isolation structure, including a solder-blocking component and a solder-receiving tank, is set between the soldering area and the functional area of the waveguide structure to prevent solder from diffusing into the functional area and ensure the stability and electromagnetic performance consistency of the millimeter-wave transmission channel.
It effectively prevents abnormal solder flow, maintains the stability of the geometry and internal state of the millimeter-wave transmission channel, and preserves the consistency of the antenna's electromagnetic performance and manufacturing stability.
Smart Images
Figure CN120999286A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of communication technology, and in particular to a millimeter-wave antenna and a radar system. Background Technology
[0002] With the rapid adoption of millimeter-wave radar technology in fields such as autonomous driving (e.g., collision avoidance detection, adaptive cruise control), millimeter-waveguide antennas, as core components of radar systems, have become crucial for industry competition in terms of performance stability and production economics. Currently, the mainstream millimeter-waveguide antennas in the industry adopt the "plastic metallization solution," which involves forming a waveguide structure through metallization treatment of the plastic substrate surface and connecting the upper and lower waveguide components through welding processes.
[0003] In the process of implementing the embodiments of this application, the inventors discovered that during the welding process of the upper and lower waveguide structures, solder overflow (solder overflows into the waveguide functional area) or solder breakage (discontinuous solder connection) is very likely to occur, which directly leads to changes in the internal state of the waveguide channel, and the antenna performance (such as reflection coefficient, gain, radiation pattern) deteriorates sharply and has poor consistency. Summary of the Invention
[0004] The main technical problem solved by the embodiments of this application is to provide a millimeter-wave antenna. By setting an isolation structure between the welding area and the functional area of the waveguide structure, the welding function and the waveguide performance function are effectively separated. Even if abnormal solder flow occurs during the welding process, the isolation structure can effectively prevent the solder from spreading to the functional area, ensuring that the geometry and internal state of the millimeter-wave transmission channel remain stable and maintaining the consistency of the core electromagnetic performance of the antenna.
[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application embodiment is: providing a millimeter-wave antenna, including a waveguide structure, a metallization layer, an isolation structure, and a welding structure. The waveguide structure includes a first waveguide component and a second waveguide component. The first waveguide component and the second waveguide component are disposed opposite each other to form a bonding surface, and the bonding surface is provided with a functional area and a welding area. The functional area forms a millimeter-wave transmission channel. The metallization layer covers the waveguide structure. The isolation structure is disposed between the welding area and the functional area, and the isolation structure is used to prevent solder from diffusing from the welding area to the functional area.
[0006] Optionally, the isolation structure includes a solder-blocking component disposed between the soldering area and the functional area.
[0007] Optionally, the solder blocking assembly includes a plurality of solder blocking ribs, which are arranged around the functional area.
[0008] Optionally, the solder baffle includes a protective component, and the isolation structure includes a mechanical isolation layer, a thermal isolation layer, and an electromagnetic isolation layer, which are arranged sequentially from the outside to the inside.
[0009] Optionally, the millimeter-wave antenna further includes a welding structure, the welding structure having a solder receiving tank disposed within the welding area, the solder receiving tank being used to hold excess solder.
[0010] Optionally, the solder receiving tank includes a plurality of grooves, which are disposed within the soldering area.
[0011] Optionally, the welding structure includes a plurality of welding columns, which are distributed within the welding area.
[0012] Optionally, the isolation structure is integrally formed with the waveguide structure.
[0013] Optionally, the metallization layer is a multilayer plating structure.
[0014] To solve the above-mentioned technical problems, another technical solution adopted in the embodiments of this application is to provide a radar system including the millimeter-wave antenna described in any of the above claims.
[0015] This application provides a millimeter-wave antenna, including a waveguide structure, a metallization layer, an isolation structure, and a welding structure. The waveguide structure includes a first waveguide component and a second waveguide component, which are disposed opposite to each other to form a bonding surface. The bonding surface has a functional area and a welding area. The functional area forms a millimeter-wave transmission channel. The metallization layer covers the waveguide structure. The isolation structure is disposed between the welding area and the functional area. The isolation structure is used to prevent solder from diffusing from the welding area to the functional area. The welding structure is disposed on the welding structure. By setting an isolation structure between the welding area and the functional area of the waveguide structure, the welding function and the waveguide performance function are effectively separated. Even if abnormal solder flow occurs during the welding process, the isolation structure can effectively prevent solder from diffusing to the functional area, ensuring that the geometric dimensions and internal state of the millimeter-wave transmission channel remain stable and maintaining the consistency of the core electromagnetic performance of the antenna. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.
[0017] Figure 1 This is a schematic diagram of a millimeter-wave antenna according to an embodiment of this application; Figure 2 This is an exploded view of the millimeter-wave antenna according to an embodiment of this application; Figure 3 This is another schematic diagram of a millimeter-wave antenna according to an embodiment of this application; Figure 4 This is a graph showing the S11 parameters of the millimeter-wave antenna according to an embodiment of this application; Figure 5 This is the radiation pattern of the millimeter-wave antenna in an embodiment of this application.
[0018] The reference numerals in the detailed embodiments are as follows: 100, millimeter-wave antenna; 10, waveguide structure; 11, first waveguide assembly; 12, second waveguide assembly; 13, mating surface; 14, functional area; 15, soldering area; 20, metallization layer; 30, isolation structure; 31, solder receiving tank; 32, solder blocking assembly; 321, solder blocking rib; 301, groove. Detailed Implementation
[0019] To facilitate understanding of this application, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "upper," "lower," "inner," "outer," "vertical," "horizontal," etc., used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0020] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.
[0021] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.
[0022] Please see Figure 1 and Figure 2This embodiment provides a millimeter-wave antenna 100, which operates in the 76-77 GHz frequency band and is suitable for vehicle-mounted millimeter-wave radar systems.
[0023] The millimeter-wave antenna 100 includes a waveguide structure 10, a metallization layer 20, an isolation structure 30, and a welding structure (not shown). The waveguide structure 10 includes a first waveguide component 11 and a second waveguide component 12. Both the first waveguide component 11 and the second waveguide component 12 are manufactured using liquid crystal polymer material through injection molding. The first waveguide component 11 forms the upper structure, and the second waveguide component 12 forms the lower structure. The two waveguide components are positioned opposite each other during assembly, achieving accurate alignment through a precise positioning structure to form a mating surface 13. Furthermore, the mating surface 13 is divided into two different functional areas. The functional area 14 is located in the central part of the mating surface 13. After the first waveguide component 11 and the second waveguide component 12 are aligned, the functional area 14 forms a millimeter-wave transmission channel. The cross-section of the millimeter-wave transmission channel is a rectangular structure, with internal dimensions designed to be 3.6 mm × 1.8 mm, meeting the transmission requirements of electromagnetic waves in the 76-77 GHz frequency band. The welding area 15 is distributed around the functional area 14 and is located in the outer area of the mating surface 13. It is used to realize the connection between the first waveguide component 11 and the second waveguide component 12.
[0024] The metallization layer 20 covers the inner surface of the waveguide structure 10. Specifically, the metallization layer 20 is formed as a continuous conductive layer on the plastic surfaces of the first waveguide assembly 11 and the second waveguide assembly 12 using a chemical copper plating process. The thickness of the metallization layer 20 is controlled within the range of 8-12 micrometers to ensure good conductivity. The metallization layer 20 forms a complete electromagnetic boundary within the functional region 14, providing a low-loss transmission environment for millimeter-wave signals.
[0025] An isolation structure 30 is positioned between the soldering area 15 and the functional area 14, forming a physical boundary between the two areas. The isolation structure 30 features a raised design, continuously distributed along the periphery of the functional area 14 to form a closed protective ring. The isolation structure 30, the first waveguide assembly 11, and the second waveguide assembly 12 are manufactured using an integral molding process, ensuring structural integrity and stability. The primary function of the isolation structure 30 is to prevent solder from diffusing from the soldering area 15 to the functional area 14. During the soldering process, when abnormal solder flow occurs, the isolation structure 30 effectively cuts off the solder's diffusion path, confining it within the soldering area 15 and preventing geometric interference to the millimeter-wave transmission channel within the functional area 14.
[0026] The welding structure is located within the welding area 15 and includes multiple welding points. These welding points are evenly distributed along the welding area 15, forming a stable connection array. The welding structure achieves a robust connection between the first waveguide component 11 and the second waveguide component 12 through laser welding, ensuring the mechanical strength and electrical continuity of the millimeter-wave antenna 100 structure.
[0027] Please see Figure 3 The isolation structure 30 includes a solder-blocking component 32, which is disposed between the soldering area 15 and the functional area 14. The solder-blocking component 32 adopts a distributed layout, forming a continuous protective system along the boundary of the functional area 14. The solder-blocking component 32 and the waveguide structure 10 are manufactured using an integral molding process to ensure structural integrity and processing accuracy. Furthermore, the solder-blocking component 32 includes multiple solder-blocking ribs 321, which surround the functional area 14 and are evenly distributed around the perimeter of the functional area 14. The multiple solder-blocking ribs 321 form a closed annular array, constructing a complete protective boundary around the functional area 14.
[0028] Preferably, the solder resist 321 adopts a trapezoidal cross-section design, and the sidewall of the solder resist 321 is inclined at a 15-degree angle to the vertical direction, forming an inward-curving geometric shape. The top of the solder resist 321 is provided with a rounded chamfer to avoid the adverse effects of sharp edges on the soldering process.
[0029] Preferably, the solder resist 321 is made of the same liquid crystal polymer material as the waveguide assembly, and is manufactured simultaneously with the first waveguide assembly 11 and the second waveguide assembly 12 through injection molding. The surface finish of the solder resist 321 is controlled within Ra0.8 to ensure good demolding performance and dimensional accuracy.
[0030] During the soldering process, when solder overflows, the solder baffle 321 can cut off the solder flow path. The ring array formed by multiple solder baffles 321 establishes multiple protective barriers around the functional area 14. Even if the protection fails at a single location, the adjacent solder baffles 321 can still maintain the overall protective effect. The trapezoidal cross-section design of the solder baffles 321 creates climbing resistance when the solder comes into contact, effectively delaying and preventing the solder from spreading into the functional area 14.
[0031] Preferably, the solder baffles 321 and the welding structure are spatially staggered. The welding points of the welding structure are located in the middle of adjacent solder baffles 321, avoiding the direct impact of welding heat on the solder baffle structure. The distribution density of the solder baffles 321 is reasonably matched with the spacing of the welding points, ensuring that each welding point is within the effective protection range of the solder baffles 321. Through the ring configuration of multiple solder baffles 321, this embodiment further improves the reliability and uniformity of anti-spill solder while maintaining basic protection functions, providing a stable structural guarantee for antenna manufacturing under complex welding process conditions. Through the above structural design, this embodiment achieves effective separation of welding function and waveguide performance function, improving the manufacturing stability and electromagnetic performance consistency of the millimeter-wave antenna 100.
[0032] Please see Figure 4 , Figure 4This is a graph showing the S11 parameter of the millimeter-wave antenna 100 according to an embodiment of this application, illustrating the reflection coefficient characteristics of the millimeter-wave antenna 100 in the 72-80 GHz frequency range. The curve shows that within the target operating frequency band of 76-77 GHz, the reflection coefficient S11 remains below -9.95 dB, reaching an optimal value of -34.3644 dB at 76.66 GHz. This performance data indicates that the antenna and transmission system achieve good impedance matching, and the signal reflection loss is controlled at a low level. The stability of the S11 parameter directly verifies the effectiveness of the isolation structure 30 design. In conventional solutions, solder overflow during the soldering process changes the internal geometry of the waveguide channel, causing impedance matching characteristics to drift and S11 parameters to deteriorate. This application uses the isolation structure 30 to prevent solder from diffusing into the functional area 14, ensuring that the waveguide channel dimensional accuracy is not affected by the soldering process, thereby maintaining the consistency and stability of the S11 parameter.
[0033] Figure 5 This is the radiation pattern of the millimeter-wave antenna 100 of this application, showing the radiation gain distribution characteristics of the antenna in different angular directions. Test results show that the gain reaches over 11.47 dBi, the radiation pattern exhibits good directional radiation characteristics, and the main lobe width and sidelobe suppression levels meet the requirements for millimeter-wave radar applications. The gain variation within the angular scanning range is smooth, with no abnormal fluctuations.
[0034] In this embodiment, the solder resist 321 includes a protective component (not shown), which comprises a mechanical isolation layer, a thermal isolation layer, and an electromagnetic isolation layer. The mechanical isolation layer, thermal isolation layer, and electromagnetic isolation layer are arranged sequentially from the outside in, forming a gradient composite protection system. The protective component is manufactured using a layered assembly process, and each isolation layer achieves a stable connection through precise fitting.
[0035] The mechanical isolation layer is located on the outermost layer of the isolation structure 30, directly facing the soldering environment within the soldering zone 15. Made of silicone material, the mechanical isolation layer possesses excellent deformability, enabling controlled deformation under soldering pressure. Its surface features a micro-textured structure to enhance wetting properties with solder. The geometry of the mechanical isolation layer maintains consistency with the outer contour of the solder baffle 321, forming a complete encapsulation structure. During soldering, the mechanical isolation layer can accommodate and constrain abnormal solder overflow, preventing solder from diffusing into the inner layers.
[0036] The thermal insulation layer is located inside the mechanical insulation layer. The thermal insulation layer is made of porous ceramic material with a porosity controlled at 40-50% and a thermal conductivity of 0.2 W / (m·K). Preferably, the thermal insulation layer has micro heat flow channels with a diameter of 0.1 mm distributed along the radial direction of the thermal insulation layer.
[0037] The heat flow channel can quickly direct the localized heat generated during welding to a pre-designed heat dissipation area, preventing heat accumulation inside the isolation structure 30. The ceramic material of the heat insulation layer has excellent dielectric properties, with a dielectric constant of 3.8 and a dielectric loss tangent of less than 0.002, ensuring that the impact on electromagnetic performance is minimized.
[0038] The electromagnetic isolation layer is located at the innermost layer of the isolation structure 30, adjacent to the boundary of the functional area 14. The electromagnetic isolation layer 14 employs a precision metal mesh structure made of copper alloy with a thickness of 0.05 mm. The mesh aperture is designed to be 0.1 mm, and the wire width is 0.03 mm, forming a regular array of square mesh openings. The geometry of the electromagnetic isolation layer maintains similarity to the contour of the functional area 14, avoiding geometric abrupt changes at the electromagnetic boundary and maintaining the continuity of the field distribution.
[0039] The mechanical insulation layer provides physical barrier function, the thermal insulation layer provides thermal conduction barrier, and the electromagnetic insulation layer maintains electromagnetic compatibility. The three-layer structure achieves synergistic protection through precise dimensional matching. The interlayer contact surfaces employ a gradual transition design to avoid stress concentration caused by material mismatch.
[0040] The overall thickness of the isolation structure 30 is controlled within 0.55 mm to ensure that the overall compactness of the antenna is not affected. The relative displacement between the isolation layers is compensated by micron-level fitting gaps to accommodate the dimensional changes of materials with different thermal expansion coefficients when the temperature changes.
[0041] In this embodiment, the isolation structure 30 adopts a layered manufacturing and assembly process. The mechanical isolation layer is manufactured using a liquid silicone casting process, the thermal isolation layer is manufactured using a ceramic slurry molding and sintering process, and the electromagnetic isolation layer is manufactured using a precision etching process. After each layer is manufactured, it is precisely positioned and assembled using a special fixture to form a complete composite isolation structure 30.
[0042] In this embodiment, the welding structure includes multiple welding columns distributed within the welding area 15. The welding columns and the waveguide structure 10 are manufactured using an integral molding process to ensure the integrity of the structure and the reliability of the connection.
[0043] This embodiment achieves comprehensive protection in three dimensions—mechanical, thermodynamic, and electromagnetic—through a three-layer gradient isolation design, further improving the reliability of preventing solder overflow under complex soldering process conditions.
[0044] In this embodiment, the solder receiving tank 31 includes a plurality of grooves 301 disposed in the soldering area 15. The plurality of grooves 301 are evenly distributed along the periphery of the soldering area 15, and the spacing between adjacent grooves 301 is 1.8 mm. The plurality of grooves 301 form a ring array, constructing a complete solder collection structure within the soldering area 15.
[0045] In this embodiment, the surface of the soldering area 15 is designed with fine guide grooves (not shown), which extend from each soldering point to the corresponding groove 301. The bottom surface of the guide groove has a V-shaped cross-section. The guide groove can guide excess solder to flow along a preset path to the groove 301, avoiding disorderly diffusion of solder within the soldering area 15.
[0046] This embodiment achieves active collection and directional containment of excess solder through the distributed arrangement of multiple grooves 301 and the auxiliary function of the guide trench, further improving the stability and controllability of the welding process.
[0047] In this embodiment, the metallization layer 20 is a multi-layer plating structure that covers the surface of the waveguide structure 10, forming a continuous conductive system. The multi-layer plating structure is manufactured using a layered electroplating process, with each layer achieving stable bonding through chemical bonding. The multi-layer plating structure is continuously distributed within both the functional area 14 and the welding area 15 to ensure the integrity of the electrical connection. Specifically, the multi-layer plating structure includes a bottom plating layer, an intermediate plating layer, and a surface plating layer, arranged sequentially from the inside out. The bottom plating layer is in direct contact with the plastic substrate of the waveguide structure 10, the intermediate plating layer is disposed outside the bottom plating layer, and the surface plating layer forms the outermost conductive interface.
[0048] The multi-layered coating structure is manufactured using a continuous electroplating process. First, an underlayer coating is deposited on the surface of the plastic substrate using a chemical plating process. Then, intermediate and surface coatings are sequentially manufactured using an electroplating process. The manufacturing interval between each coating layer is controlled within 30 minutes to avoid interfacial oxidation affecting interlayer bonding. This embodiment, through the composite configuration of three coating layers, achieves comprehensive optimization of conductivity, mechanical protection, and environmental adaptability, improving the long-term reliability of the millimeter-wave antenna 100 in complex operating environments.
[0049] This application provides a millimeter-wave antenna 100, including a waveguide structure 10, a metallization layer 20, an isolation structure 30, and a welding structure. The waveguide structure 10 includes a first waveguide component 11 and a second waveguide component 12. The first waveguide component 11 and the second waveguide component 12 are disposed opposite each other to form a bonding surface 13. The bonding surface 13 has a functional area 14 and a welding area 15. The functional area 14 forms a millimeter-wave transmission channel. The metallization layer 20 covers the waveguide structure 10. The isolation structure 30 is disposed between the welding area 15 and the functional area 14. The isolation structure 30 is used to prevent solder from diffusing from the welding area 15 to the functional area 14. The welding structure is disposed on the welding structure. By setting the isolation structure 30 between the welding area 15 and the functional area 14 of the waveguide structure 10, the welding function and the waveguide performance function are effectively separated. Even if abnormal solder flow occurs during the welding process, the isolation structure 30 can effectively prevent solder from diffusing to the functional area 14, ensuring that the geometric dimensions and internal state of the millimeter-wave transmission channel remain stable and maintaining the consistency of the core electromagnetic performance of the antenna. .
[0050] This application also provides a radar system, including the millimeter-wave antenna 100 described above. For specific embodiments of the radar system, please refer to the millimeter-wave antenna 100 described above, which will not be repeated here.
[0051] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.
Claims
1. A millimeter-wave antenna, characterized in that, include: A waveguide structure includes a first waveguide component and a second waveguide component, the first waveguide component and the second waveguide component are arranged opposite to each other to form a mating surface, and the mating surface is provided with a functional area and a welding area, the functional area forming a millimeter wave transmission channel; A metallization layer covers the waveguide structure; An isolation structure is disposed between the soldering area and the functional area, the isolation structure being used to prevent solder from spreading from the soldering area to the functional area.
2. The millimeter-wave antenna according to claim 1, characterized in that, The isolation structure includes a solder-blocking component, which is disposed between the soldering area and the functional area.
3. The millimeter-wave antenna according to claim 2, characterized in that, The solder blocking assembly includes multiple solder blocking ribs, which are arranged around the functional area.
4. The millimeter-wave antenna according to claim 3, characterized in that, The solder baffle includes a protective component, and the isolation structure includes a mechanical isolation layer, a thermal isolation layer, and an electromagnetic isolation layer, which are arranged sequentially from the outside to the inside.
5. The millimeter-wave antenna according to claim 1, characterized in that, The millimeter-wave antenna also includes a welded structure. The welding structure is provided with a solder receiving tank, which is located in the welding area and is used to hold excess solder.
6. The millimeter-wave antenna according to claim 5, characterized in that, The solder receiving tank includes multiple grooves, which are disposed within the soldering area.
7. The millimeter-wave antenna according to claim 1, characterized in that, The welding structure includes multiple welding columns, which are distributed within the welding area.
8. The millimeter-wave antenna according to claim 7, characterized in that, The isolation structure is integrally formed with the waveguide structure.
9. The millimeter-wave antenna according to claim 1, characterized in that, The metallization layer has a multi-layer plating structure.
10. A radar system, characterized in that, Including the millimeter-wave antenna as described in any one of claims 1-9.