Polyether amine nonionic surfactant, preparation thereof and application of polyether amine nonionic surfactant in laser cutting protection liquid

Abstract

The invention discloses a polyether amine nonionic surfactant, preparation thereof and application of the polyether amine nonionic surfactant in laser cutting protection liquid. A methyl gluconate intermediate is formed by controllable ring opening of D-anhydrous gluconolactone in an organic solvent, then the methyl gluconate intermediate and a primary amine group of polyether amine M1000 are subjected to an amidation condensation reaction, the glycosyl-polyether amine nonionic surfactant with an amphiphilic structure is successfully constructed, meanwhile, the reaction process is easy to operate, and the preparation method is suitable for industrial production. The reaction condition is mild, the content of byproducts is low, and excellent wetting ability, easy-to-clean property and heat-resistant stability are achieved. And compounding with water-soluble resin, an organic solvent, an ultraviolet absorbent and water to obtain the easy-to-clean and high-stability laser cutting protection liquid. The laser cutting protection liquid can significantly improve wettability, thermal oxidation resistance stability and residue cleaning efficiency in chip wafer processing, and is suitable for precision processing fields such as semiconductor wafer scribing and the like.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of surfactants and the technical field of laser cutting protective liquid, and particularly relates to a polyether amine nonionic surfactant, a preparation method thereof and application of the surfactant in laser cutting protective liquid. BACKGROUND

[0002] With the development of chip technology towards high precision, laser cutting technology has become the core means of semiconductor wafer slicing process, and has become a key technology in the field of advanced packaging due to its micron-level processing precision, narrow heat-affected zone and non-contact processing advantages. In the cutting process, when the high-energy laser beam acts on the silicon-based material, the instantaneous temperature can reach several thousand degrees Celsius, which causes molten silicon splashing and micro-cracks at the edge of the cutting path, seriously affecting the electrical performance and reliability of the device. Therefore, a protective liquid needs to be coated before cutting to form a thermal buffer layer, and its core functions include inhibiting molten slag splashing, reducing thermal stress, improving the appearance of the cutting path and facilitating subsequent cleaning.

[0003] Laser cutting protective liquid is usually made of water-soluble polymers such as polyvinyl alcohol and polyethylene glycol, organic solvents and functional solvents, and the material obtained by compounding them realizes physical barrier through film formation. However, with the progress of science and technology, the design and use of protective liquid need to meet various complex process conditions, and the requirements for chemicals are becoming more and more stringent. The use of various substances in the protective liquid has an impact on the structure of the compounded compound, reducing the stability of the compounded compound. In the cutting process, there will be certain defects, such as high-temperature-induced thermal cracks, material oxidation and contamination by debris.

[0004] Traditional protective liquid can provide a physical barrier, but it has shortcomings in terms of wettability, cleanliness and thermal stability. In the prior art, the addition of surfactants can improve some properties, but it is still difficult to meet the needs of real precision machining.

[0005] Therefore, developing a surfactant with easy cleaning and thermal stability, and building a high-performance laser cutting protective liquid based on it, has become a key path to break through the current technical bottleneck. SUMMARY

[0006] The present application aims to provide a polyether amine nonionic surfactant, a preparation method thereof and application of the surfactant in laser cutting protective liquid. The D-anhydrous gluconolactone is ring-opened in an organic solvent to generate a methyl gluconate intermediate, the primary amine group of polyether amine M1000 reacts with the carboxyl group of the methyl gluconate to form an amide condensation reaction, forming a stable glycosyl-polyether amine amphiphilic structure, and a polyether amine nonionic surfactant is prepared. The reaction has the characteristics of simple operation, mild reaction conditions and low content of by-products. Further compounding obtains a laser cutting protective liquid, which has the characteristics of easy cleaning, thermal stability and low surface tension, and has a wide application prospect.

[0007] To achieve the above object, the present application adopts the following technical solutions: A preparation method of a polyether amine nonionic surfactant, comprising the following steps, S1: dissolving a saccharide derivative and a polyether amine compound in anhydrous solvent, and then placing in an oil bath pot, and performing magnetic stirring under reflux condensation at a certain temperature for a certain time; S2: after the reaction is completed, the mixture is placed at-15 DEG C for 4-5 times of low-temperature recrystallization, and after separation and purification, the upper clear liquid is collected; S3: the purified solution is subjected to vacuum rotary evaporation to remove the solvent, and finally the polyether amine nonionic surfactant pure product is obtained.

[0008] As a preferred scheme of the present application, in S1, the saccharide derivative is D-anhydrous gluconolactone.

[0009] As a preferred scheme of the present application, in S1, the polyether amine compound is polyether amine M1000.

[0010] As a preferred scheme of the present application, in S1, the anhydrous solvent is anhydrous methanol or anhydrous ethanol.

[0011] As a preferred scheme of the present application, in S1, the molar ratio of the saccharide derivative to the polyether amine compound is 1:1.

[0012] As a preferred scheme of the present application, in S1, the reaction temperature is 40-60 DEG C, and the time is 20-28 h.

[0013] The polyether amine nonionic surfactant prepared by the above method is N-polyoxyalkyl-D-glucosamine, and the molecular structure is as follows: Based on the above easy-to-clean and high-stability laser cutting protection liquid, the laser cutting protection liquid is compounded by a water-soluble resin, an organic solvent, an ultraviolet absorber, a polyether amine nonionic surfactant and water.

[0014] The laser cutting protection liquid composition comprises at least 2-25wt% of component A, 10-30wt% of component B, 0.01-0.05wt% of component C and 0.1-5wt% of component D; the component A is a water-soluble resin; the component B is an organic solvent; the component C is an ultraviolet absorber; and the component D is a polyether amine nonionic surfactant.

[0015] As a preferred scheme of the present application, the component A is any one or a combination of at least two of polyvinyl alcohol, polyethylene glycol, polyvinylpyrrolidone, carboxymethyl cellulose and hydroxypropyl cellulose.

[0016] As a preferred scheme of the present application, component B is any one or a combination of at least two of propyl alcohol, isopropyl alcohol, glycerol, pentaerythritol, propylene glycol phenyl ether, ethylene glycol ether, butyl acetate, and butyrolactone.

[0017] As a preferred scheme of the present application, component C is any one or a combination of at least two of ferulic acid, isoferulic acid, caffeic acid, and sinapic acid.

[0018] As a preferred scheme of the present application, the water is ultrapure water.

[0019] Compared with the prior art, the present application has the following advantages and beneficial effects: 1. In the process of preparing the N-polyoxyalkyl-D-glucosamine nonionic surfactant, the primary amine group of the polyether amine M1000 and the carboxyl group of the methyl gluconate undergo an amide condensation reaction to form a stable glycosyl-polyether amine amphiphilic structure, so that the surfactant has the characteristics of mild reaction conditions, low content of by-products, and the like, and simultaneously has biocompatibility and environmental friendliness.

[0020] 2. The laser cutting protection liquid prepared by compounding the N-polyoxyalkyl-D-glucosamine nonionic surfactant with a water-soluble resin, an organic solvent, an ultraviolet absorber, and water can effectively improve the wettability, thermal oxidation resistance, and residue cleaning efficiency of the protection liquid in the laser cutting process, and has the characteristics of easy cleaning, strong wettability, thermal stability, and good cutting effect. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 FIG. 4 is a nuclear magnetic resonance hydrogen spectrum of the polyether amine nonionic surfactant in Example 1; Figure 2 FIG. 5 is a gel permeation chromatogram of the polyether amine nonionic surfactant in Example 1; Figure 3 FIG. 6 is a cleaning effect test diagram of a wafer coated with the composition in Application Example 1 of the present application; Figure 4 FIG. 7 is a cleaning effect test diagram of a wafer coated with the composition in Application Example 2 of the present application. DETAILED DESCRIPTION

[0022] It should be particularly noted that the specific examples listed below are intended to assist those skilled in the art in thoroughly understanding the technical core of the present application, but the protection scope of the present application is not limited to the details described in the examples. Based on the core idea of the present application, any equivalent replacement, parameter adjustment, or combination of technical elements made by those skilled in the art without departing from the design purpose of the present application should be considered to fall within the scope of the claims of the present application.

[0023] Secondly, the "embodiment" or "specific embodiment" referred to in the specification means a typical implementation scheme capable of embodying a certain technical feature of the present application. The specific technical elements described in different embodiments can exist independently, or can be combined with each other to form a new technical solution. The expressions "in one embodiment" and the like mentioned in the chapters of the specification only serve to emphasize the technical features corresponding to the embodiment, and do not constitute a limitation on the relevance or exclusivity of the embodiment. The combination of technical elements in multiple embodiments still belongs to the feasible implementation path of the present application. Process parameters, material alternatives or structural deformation designs not explicitly recorded in the embodiments, if their implementation principles are consistent with the technical ideas defined in the claims of the present application, are considered as reasonable extensions of the present application.

[0024] In order to make the technical solutions, innovative points and beneficial effects of the present application more clear and explicit, the embodiments of the present application will be systematically described in combination with the embodiments.

[0025] Embodiment 1 The preparation method of the polyetheramine nonionic surfactant of the present embodiment is carried out in the following steps: S1: Dissolve 1.78 g (10 mmol) of gluconolactone and polyetheramine M1000 10 g (10 mmol) in 100 mL of anhydrous ethanol, then place the flask in a 50°C oil bath, and magnetically stir the reaction under reflux condensation for 24 h; S2: After the reaction is completed, the mixture is placed in a refrigerator at -15°C for 5 times of low-temperature recrystallization, and the upper clear liquid is collected after separation and purification.

[0026] S3: The purified solution is vacuum rotary evaporated to remove the solvent, and finally the N-polyoxyalkyl-D-glucosamine nonionic surfactant pure product is obtained, with a yield of 62.8%.

[0027] Figure 1 Nuclear magnetic resonance hydrogen spectrum analysis of the polyetheramine nonionic surfactant obtained in Embodiment 1: 1H NMR (600 MHz, CDC13) δ 7.26 (s, 1H), 3.70 (s, 1H), 3.69 (s, 2H), 3.68 (s, 2H), 3.66 (s, 1H), 3.62 (s, 12H), 3.35 (s, 2H), 1.20 (s, 3H), 1.10 (s, 7H), 0.99 (s, 2H), 0.04 (s, 2H); the total hydrogen integral number is 210, which is consistent with the expected hydrogen number of the target polyether amine nonionic surfactant, and the integral ratio of the terminal methyl δ 0.99 is consistent with the configuration of the terminal alkyl chain in the molecular structure. The signals of δ 3.68 (s, 1H) and δ 3.35 (s, 2H) indicate that the polyether chain is successfully bonded to the amine group to form a hydrophilic-hydrophobic balance structure. The nuclear magnetic resonance hydrogen spectrum analysis results of the substance can prove that the N-polyoxyalkyl-D-glucosamine nonionic surfactant is indeed successfully prepared in Example 1.

[0028] Figure 2 The gel permeation chromatography results of the polyether amine nonionic surfactant prepared in Example 1 can be found in Table 1. Figure 2 The molecular weight of the N-polyoxyalkyl-D-glucosamine nonionic surfactant is about 1180, which is consistent with the molecular structure of the compound.

[0029] Example 2: The difference from Example 1 is that the reaction temperature in S1 is 60°C, and the other parameters and steps are the same as those in Example 1.

[0030] The final N-polyoxyalkyl-D-glucosamine nonionic surfactant product has a yield of 59.4%.

[0031] Example 3: The difference from Example 1 is that the reaction temperature in S1 is 40°C, and the other parameters and steps are the same as those in Example 1.

[0032] The final N-polyoxyalkyl-D-glucosamine nonionic surfactant product has a yield of 56.2%.

[0033] Example 4: The difference from Example 1 is that 0.89 g (5 mmol) of gluconolactone and 5 g (5 mmol) of polyether amine M1000 are added in S1, and the other parameters and steps are the same as those in Example 1.

[0034] The final N-polyoxyalkyl-D-glucosamine nonionic surfactant product has a yield of 57.4%.

[0035] Example 5: The difference from Example 1 is that 3.56g (20mmol) of gluconolactone and 20g (20mmol) of polyetheramine M1000 are added in S1, while the other parameters and steps are the same as in Example 1.

[0036] The final product of the N-polyoxyalkyl-D-glucosamine nonionic surfactant was obtained in a yield of 55.6%.

[0037] Example 6: The difference from Example 1 is that in S1, gluconolactone and polyetheramine M1000 are dissolved in 80 ml of anhydrous ethanol, while the other parameters and steps are the same as in Example 1.

[0038] The final product of the N-polyoxyalkyl-D-glucosamine nonionic surfactant was obtained in a yield of 58.4%.

[0039] Example 7: The difference from Example 1 is that in S1, gluconolactone and polyetheramine M1000 are dissolved in 120 ml of anhydrous ethanol, while the other parameters and steps are the same as in Example 1.

[0040] The final product of the N-polyoxyalkyl-D-glucosamine nonionic surfactant was obtained in a yield of 61.2%.

[0041] Example 8: The difference from Example 1 is that the reaction time in S1 is 20 hours, while the other parameters and steps are the same as in Example 1.

[0042] The final product of the N-polyoxyalkyl-D-glucosamine nonionic surfactant was obtained in a yield of 52.8%.

[0043] Example 9: The difference from Example 1 is that the reaction time in S1 is 28 hours, while the other parameters and steps are the same as in Example 1.

[0044] The final product of the N-polyoxyalkyl-D-glucosamine nonionic surfactant was obtained in a yield of 59.4%.

[0045] Example 10: The difference from Example 1 is that the solvent in S1 is anhydrous methanol, while the other parameters and steps are the same as in Example 1.

[0046] The final product of the N-polyoxyalkyl-D-glucosamine nonionic surfactant was obtained in a yield of 61.3%.

[0047] Comparative example: Unmodified polyetheramine (M1000) surfactant was used as the control group.

[0048] The surface tension of the comparative example M1000 nonionic surfactant and the N-polyoxyalkyl-D-glucosamine nonionic surfactant of Example 1 were tested, and the specific procedure is as follows: The surface tension characteristics of surfactant solutions with different concentrations were investigated using the platinum plate method. The experiment was conducted under constant temperature conditions (25.0±0.1℃) using a BZY-2 surface tension meter for precise measurements. Before the formal testing, the instrument was rigorously calibrated using ultrapure water as the standard. During the experiment, the sample to be tested was placed on a dedicated sample stage, and the platinum plate was vertically suspended above the liquid surface using a precision adjustment device. After the instrument reading stabilized at zero, the sample stage was slowly raised until the lower edge of the platinum plate was just in contact with the liquid surface. Each sample group underwent three independent measurements. After each measurement, the platinum plate was thoroughly cleaned. The average of the three measurements was used as the final data, ensuring that the deviation between two adjacent measurements did not exceed 0.5 mN / m. The experimental data are shown in Table 1. Table 1. Surface tension test results As shown in Table 1, the critical micelle concentration (cmc) of the unmodified polyetheramine (M1000) surfactant in the comparative example is much higher than 0.0004 mol·L⁻¹. -1 The critical micelle concentration (cmc) of the N-polyoxyalkyl-D-glucosamine nonionic surfactant of the present invention is reduced to 0.0001 mol·L⁻¹. -1 Furthermore, the surface tension can be reduced to approximately 53 mN / m. These results demonstrate that polyetheramine nonionic surfactants possess certain surface tension reduction properties.

[0049] Application Example 1 The preparation method of the easy-to-clean, highly stable laser cutting protective fluid in this application example is carried out according to the following steps: Step (1) First, prepare a compound solution containing 5 wt% polyvinyl alcohol, 12.5 wt% propanol, 16.5 wt% isopropanol, and 0.04 wt% ferulic acid. Then, 100g of the polyetheramine nonionic surfactant from Example 1 was weighed and dissolved in 10kg of ultrapure water to prepare a 1wt% polyetheramine nonionic surfactant aqueous solution. Step (2) 10 kg of 1 wt% polyetheramine nonionic surfactant aqueous solution and 10 kg of compound solution were mixed evenly under stirring until the solution was colorless and transparent, thus obtaining the laser cutting protective solution.

[0050] 100g of the laser cutting protective solution from Application Example 1 was placed in a glass bottle and stored. The pH value was measured at regular intervals. The experiment showed that the initial pH value of the laser cutting protective solution was 6.21, the pH value was 6.21 after 72 hours, and the pH value was 6.22 after 168 hours, indicating that the laser cutting protective solution has good storage stability.

[0051] The aforementioned laser cutting protective liquid was spin-coated onto the pretreated metal substrate surface at 25°C. The static contact angle was measured using a contact angle meter, indicating that the liquid rapidly spread and formed a continuous film on the substrate surface, demonstrating excellent wetting properties. Precision cutting was performed using a high-power ultraviolet laser (wavelength 355 nm). The cutting path was observed using a laser confocal microscope, showing no slag or heat-affected zone residue, verifying the high precision and thermal stability of the cutting process. After cutting, the surface was rinsed with ultrapure water and dried. The surface residue coverage was measured to be <0.5% using a white light interferometer, and a cleaning scan test was performed. Figure 3 As shown, its easy-to-clean properties are evident.

[0052] Application Example 2 The preparation method of the laser cutting protective fluid in this application example is carried out according to the following steps: Step (1) First, prepare a compound solution containing 5 wt% polyvinyl alcohol, 12.5 wt% propanol, 16.5 wt% isopropanol, and 0.04 wt% ferulic acid. Then, weigh 100g of the comparative unmodified polyetheramine (M1000) surfactant and dissolve it in 10kg of ultrapure water to prepare a 1wt% polyetheramine nonionic surfactant aqueous solution. Step (2) 10 kg of 1 wt% polyetheramine nonionic surfactant aqueous solution and 10 kg of compound solution were mixed evenly under stirring until the solution was colorless and transparent, thus obtaining the laser cutting protective solution.

[0053] 100g of the laser cutting protective solution from Application Example 2 was placed in a glass bottle and stored. The pH value was measured at regular intervals. The experiment showed that the initial pH value of the laser cutting protective solution was 6.21, the pH value was 6.21 after 72 hours, and the pH value was 6.22 after 168 hours, indicating that the laser cutting protective solution has good storage stability.

[0054] The aforementioned laser cutting protective liquid was spin-coated onto the pretreated metal substrate surface at 25°C. The static contact angle was measured using a contact angle meter, indicating that the liquid rapidly spread and formed a continuous film on the substrate surface, demonstrating excellent wetting properties. Precision cutting was performed using a high-power ultraviolet laser (wavelength 355 nm), and the cutting path was observed using a laser confocal microscope, revealing some slag residue. After cutting, the surface was cleaned with ultrapure water and dried. White light interferometry analysis showed a high coverage of surface residue after cleaning, and a cleaning scan test was conducted. Figure 4 As shown, this indicates that its cleaning properties are poor.

[0055] Application Example 3: The difference from Application Example 1 is that in step (1), the polyvinyl alcohol mass fraction is 5 wt%, the propanol mass fraction is 16.5 wt%, the isopropanol mass fraction is 12.5 wt%, and the ferulic acid mass fraction is 0.04 wt% of the compound solution. The remaining parameters and steps are the same as in Example 1.

[0056] 100g of the laser cutting protective solution from Application Example 1 was placed in a glass bottle and stored. The pH value was measured at regular intervals. The experiment showed that the initial pH value of the laser cutting protective solution was 6.47, the pH value was 6.46 after 72 hours, and the pH value was 6.45 after 168 hours, indicating that the laser cutting protective solution has good storage stability.

[0057] The aforementioned laser cutting protective liquid was spin-coated onto the pretreated metal substrate surface at 25°C. The static contact angle was measured using a contact angle meter, indicating that the liquid rapidly spreads on the substrate surface and forms a continuous film, demonstrating excellent wetting properties. Precision cutting was performed using a high-power ultraviolet laser (wavelength 355 nm). The cutting path was observed using a laser confocal microscope, showing no slag or heat-affected zone residue, verifying the high precision and thermal stability of the cutting process. After cutting, the surface was cleaned with ultrapure water and dried. White light interferometry analysis showed that the surface residue coverage after cleaning was <0.5%, indicating its easy-to-clean properties.

[0058] Application Example 4: The difference from Application Example 1 is that in step (1), the polyvinyl alcohol mass fraction is 10 wt%, the propanol mass fraction is 12.5 wt%, the isopropanol mass fraction is 16.5 wt%, and the ferulic acid mass fraction is 0.04 wt% of the compound solution. The remaining parameters and steps are the same as in Example 1.

[0059] 100g of the laser cutting protective solution from Application Example 1 was placed in a glass bottle and stored. The pH value was measured at regular intervals. The experiment showed that the initial pH value of the laser cutting protective solution was 6.45, the pH value was 6.45 after 72 hours, and the pH value was 6.44 after 168 hours, indicating that the laser cutting protective solution has good storage stability.

[0060] The aforementioned laser cutting protective liquid was spin-coated onto the pretreated metal substrate surface at 25°C. The static contact angle was measured using a contact angle meter, indicating that the liquid rapidly spreads on the substrate surface and forms a continuous film, demonstrating excellent wetting properties. Precision cutting was performed using a high-power ultraviolet laser (wavelength 355 nm). The cutting path was observed using a laser confocal microscope, showing no slag or heat-affected zone residue, verifying the high precision and thermal stability of the cutting process. After cutting, the surface was cleaned with ultrapure water and dried. White light interferometry analysis showed that the surface residue coverage after cleaning was <0.5%, indicating its easy-to-clean properties.

[0061] Application Example 5: The difference from Application Example 1 is that in step (1), the polyvinyl alcohol mass fraction is 5 wt%, the propanol mass fraction is 12.5 wt%, the isopropanol mass fraction is 16.5 wt%, and the ferulic acid mass fraction is 0.08 wt% of the compound solution. The remaining parameters and steps are the same as in Example 1.

[0062] 100g of the laser cutting protective solution from Application Example 1 was placed in a glass bottle and stored. The pH value was measured at regular intervals. The experiment showed that the initial pH value of the laser cutting protective solution was 6.34, the pH value was 6.36 after 72 hours, and the pH value was 6.36 after 168 hours, indicating that the laser cutting protective solution has good storage stability.

[0063] The aforementioned laser cutting protective liquid was spin-coated onto the pretreated metal substrate surface at 25°C. The static contact angle was measured using a contact angle meter, indicating that the liquid rapidly spreads on the substrate surface and forms a continuous film, demonstrating excellent wetting properties. Precision cutting was performed using a high-power ultraviolet laser (wavelength 355 nm). The cutting path was observed using a laser confocal microscope, showing no slag or heat-affected zone residue, verifying the high precision and thermal stability of the cutting process. After cutting, the surface was cleaned with ultrapure water and dried. White light interferometry analysis showed that the surface residue coverage after cleaning was <0.5%, indicating its easy-to-clean properties.

[0064] Application Example 6: The difference from Application Example 1 is that the concentration of the polyetheramine nonionic surfactant aqueous solution in step (1) is 0.5 wt%, while the other parameters and steps are the same as in Example 1; 100g of the laser cutting protective solution from Application Example 1 was placed in a glass bottle and stored. The pH value was measured at regular intervals. The experiment showed that the initial pH value of the laser cutting protective solution was 6.24, the pH value was 6.26 after 72 hours, and the pH value was 6.25 after 168 hours, indicating that the laser cutting protective solution has good storage stability.

[0065] The aforementioned laser cutting protective liquid was spin-coated onto the pretreated metal substrate surface at 25°C. The static contact angle was measured using a contact angle meter, indicating that the liquid rapidly spreads on the substrate surface and forms a continuous film, demonstrating excellent wetting properties. Precision cutting was performed using a high-power ultraviolet laser (wavelength 355 nm). The cutting path was observed using a laser confocal microscope, showing no slag or heat-affected zone residue, verifying the high precision and thermal stability of the cutting process. After cutting, the surface was cleaned with ultrapure water and dried. White light interferometry analysis showed that the surface residue coverage after cleaning was <0.5%, indicating its easy-to-clean properties.

[0066] Application Example 7: The difference from Application Example 1 is that the concentration of the polyetheramine nonionic surfactant aqueous solution in step (1) is 2wt%, while the other parameters and steps are the same as in Example 1; 100g of the laser cutting protective solution from Application Example 1 was placed in a glass bottle and stored. The pH value was measured at regular intervals. The experiment showed that the initial pH value of the laser cutting protective solution was 6.15, the pH value was 6.15 after 72 hours, and the pH value was 6.13 after 168 hours, indicating that the laser cutting protective solution has good storage stability.

[0067] The aforementioned laser cutting protective liquid was spin-coated onto the pretreated metal substrate surface at 25°C. The static contact angle was measured using a contact angle meter, indicating that the liquid rapidly spreads on the substrate surface and forms a continuous film, demonstrating excellent wetting properties. Precision cutting was performed using a high-power ultraviolet laser (wavelength 355 nm). The cutting path was observed using a laser confocal microscope, showing no slag or heat-affected zone residue, verifying the high precision and thermal stability of the cutting process. After cutting, the surface was cleaned with ultrapure water and dried. White light interferometry analysis showed that the surface residue coverage after cleaning was <0.5%, indicating its easy-to-clean properties.

[0068] The above embodiments are merely examples illustrating the core concept of the present invention. Any adaptive adjustments or optimizations made to the implementation methods by conventional technical means within the scope of protection defined by the claims of the present invention should be considered as equivalent embodiments of the present invention and included in the scope of protection.

Claims

1. A method for preparing a polyetheramine nonionic surfactant, characterized in that, Includes the following steps: S1: Dissolve sugar derivatives and polyetheramine compounds in anhydrous solvent, then place them in an oil bath, and magnetically stir them under reflux and condensation conditions at a certain temperature for a certain time. S2: After the reaction is complete, the mixture is placed at -15℃ for 4 to 5 low-temperature recrystallizations. After separation and purification, the supernatant is collected. S3: The purified solution is desolventized by vacuum rotary evaporation to finally obtain the polyetheramine nonionic surfactant.

2. The method according to claim 1, characterized in that, The sugar derivative in S1 is D-gluconic acid lactone.

3. The method according to claim 1, characterized in that, The polyetheramine compound in S1 is polyetheramine M1000.

4. The method according to claim 1, characterized in that, The anhydrous solvent in S1 is anhydrous methanol or anhydrous ethanol.

5. The method according to claim 1, characterized in that, The molar ratio of carbohydrate derivatives to polyetheramine compounds in S1 is 1:

1.

6. The method according to claim 1, characterized in that, in, The reaction temperature in S1 is 40~60℃, and the reaction time is 20~28h.

7. The polyetheramine nonionic surfactant prepared by the method according to any one of claims 1-6, characterized in that, The polyetheramine nonionic surfactant is N-polyoxyalkyl-D-glucosamine, and its molecular structure is as follows: 。 8. The application of the polyetheramine nonionic surfactant according to claim 7 in laser cutting protective fluid, characterized in that, The laser cutting protective fluid is composed of water-soluble resin, organic solvent, ultraviolet absorber, polyetheramine nonionic surfactant and water.

9. The application according to claim 8, characterized in that: The water-soluble resin is any one or a combination of at least two of polyvinyl alcohol, polyethylene glycol, polyvinylpyrrolidone, carboxymethyl cellulose, and hydroxypropyl cellulose; the organic solvent is any one or a combination of at least two of propanol, isopropanol, glycerol, pentaerythritol, propylene glycol phenyl ethers, ethylene glycol ethers, butyl acetate, and butyrolactone; and the ultraviolet absorber is any one or a combination of at least two of ferulic acid, isoferrulic acid, caffeic acid, and sinapic acid.

10. The application according to claim 8, characterized in that: The composition of the laser cutting protective fluid, by weight percentage, includes 2-25 wt% water-soluble resin, 10-30 wt% organic solvent, 0.01-0.05 wt% UV absorber, 0.1-5 wt% polyetheramine nonionic surfactant, and the balance being water.

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