Thixotropic adjustable conductive material carrier and preparation method thereof

Abstract

The invention belongs to the technical field of conductive materials, and particularly discloses a thixotropic adjustable conductive material carrier and a preparation method thereof. Carbon nanotube acidification, silver nanowire silanization and polymer matrix compounding are optimized through a multi-stage mixing process, and the conductive material with high stability and low resistivity is prepared. The preparation method specifically comprises the following steps: acidifying carbon nanotubes with mixed acid, silanizing AgNW with KH550, carrying out ultrasonic dispersion with a TPU solution and an epoxy resin solution, adding MMT / PVP, carrying out shear mixing, and finally introducing the TPU solution and epoxidized soybean oil (ESO) for secondary mixing. The obtained conductive material carrier is low in resistivity and good in stability, the viscosity is remarkably reduced at a high shear rate, and the conductive material carrier has excellent conductivity, processability and long-term stability and is suitable for the fields of flexible electronics, sensors and the like.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of conductive materials, and particularly relates to a thixotropic-adjustable conductive material carrier and a preparation method thereof. BACKGROUND

[0002] With the rapid development of the Internet of Things, artificial intelligence and 5G communication technology, the demand for flexible electronic devices and electromagnetic shielding materials is showing explosive growth. As a core component, the conductive material carrier needs to meet the following requirements: high conductivity, volume resistivity less than 10 -2 Ω·cm to realize efficient signal transmission or electromagnetic wave attenuation; excellent processing performance to adapt to complex forming processes such as 3D printing, coating and molding, especially shear thinning and anti-settling properties; structural stability to maintain the continuity of the conductive path under dynamic deformation such as stretching and bending, and to avoid performance failure caused by filler peeling or polymer matrix fracture.

[0003] At present, the research and development of the conductive material carrier mainly focuses on the composite of conductive fillers and polymer matrix, and the following technical problems still exist: Thixotropy regulation is insufficient. Traditional methods only rely on single additives such as nanoclay or fumed silica, which are difficult to achieve high thixotropic index (TI>3) and low shear viscosity (<10 Pa·s@10 s -1 ) at the same time, resulting in slurry sagging or support structure collapse during printing; weak filler-matrix interface: carbon nanotubes (CNT), silver nanowires (AgNW) and other conductive fillers lack chemical bonding with the polymer matrix, which is easy to slip under external force, damaging the thixotropic recovery ability; Rheological property control is rough, and filler dispersion is uneven: high-speed stirring or ultrasonic treatment easily leads to filler fracture or agglomeration, forming local conductive "islands" and reducing material uniformity; using single fixed molecular weight polyurethane (TPU) or epoxy resin cannot balance the flowability under high shear and the anti-settling property when standing still.

[0004] Conductivity and rheological property are contradictory. When the content of CNT increases, the viscosity of the slurry may skyrocket, which cannot meet the high-precision printing requirements.

[0005] Surface treatment is single. Only by acidizing or silanizing the filler surface can the physical entanglement and chemical bonding with the polymer matrix be improved at the same time.

[0006] Based on the above technical problems, it is urgent to develop a conductive material carrier that meets the requirements of thixotropy and rheological property regulation and has good conductivity. SUMMARY

[0007] To solve the above technical problems, the present application realizes the significant improvement of the conductivity, rheological property and storage stability by screening the conductive material carrier component, optimizing the preparation process, and synergistically regulating the carbon nanotube acidification treatment, silver nanowire silanization modification and polymer matrix compounding through multi-stage mixing process, thereby providing a thixotropic adjustable conductive material carrier and a preparation method thereof for the field of flexible electronics, sensors and the like.

[0008] In one aspect, the present application provides a preparation method of a thixotropic adjustable conductive material carrier, comprising the following steps: S1, carbon nanotube acidification treatment: carbon nanotubes are reacted with mixed acid, heated to 90-100℃ in water bath for 4-5h, and dried after centrifugal washing to prepare acidified carbon nanotubes; the mixed acid is prepared by mixing HNO3 and H2SO4 in a mass ratio of 3-4:1; S2, silver nanowire silanization treatment: after washing the silver nanowires with HCl, they are immersed in an ethanol solution of γ-aminopropyl triethoxysilane for 2-3h, and dried after centrifugal washing to prepare silanized silver nanowires; S3, preparation of TPU solution: TPU particles are mixed with N,N-dimethylformamide in a mass ratio of 20:90-20:100 to prepare a TPU solution; S4, preparation of epoxy resin solution: epoxy resin is mixed with diethylenetriamine and stirred uniformly to prepare an epoxy resin solution; the addition amount of diethylenetriamine is 10%-12% of the total mass of the epoxy resin; S5, ultrasonic dispersion: acidified carbon nanotubes, silanized silver nanowires, TPU solution and epoxy resin solution are mixed in proportion and ultrasonically dispersed to prepare a conductive material carrier dispersion; S6, high-speed shearing mixing: montmorillonite and polyvinylpyrrolidone are added to the conductive material carrier dispersion prepared in S5 and sheared to prepare a primary mixed conductive material carrier; S7, secondary mixing: TPU solution and epoxy soybean oil are added to the primary mixed conductive material carrier prepared in S6 and stirred uniformly to prepare a conductive material carrier.

[0009] Further, in the method, the mass ratio of carbon nanotubes to mixed acid in step S1 is 1:90-1:100.

[0010] Further, in the method, the tube diameter of the carbon nanotubes in step S1 is 10-20nm, and the length is 10-30μm.

[0011] Further, in the method, the concentration of γ-aminopropyl triethoxysilane in the ethanol solution of γ-aminopropyl triethoxysilane in step S2 is 2-3vol%.

[0012] Further, in the method, the mass percentage of each component in step S5 is as follows: acidified carbon nanotubes 20~28wt%, silanized silver nanowires 3~5wt%, TPU solution 38~45wt%, and epoxy resin solution 29~33wt%.

[0013] Furthermore, in the method, the amounts of montmorillonite and polyvinylpyrrolidone added in step S6 are 1~3wt% and 0.5~1wt%, respectively.

[0014] Furthermore, in the method, the amount of TPU solution and epoxidized soybean oil added in step S7 is 25~30wt% and 3~5wt%, respectively.

[0015] In another aspect, a conductive material carrier prepared by the method described in this invention is also provided.

[0016] Furthermore, the conductive material carrier at a shear rate of 100 s -1 The viscosity is ≤4.13 Pa·s.

[0017] Finally, the application of the conductive material carrier in flexible electronic components is also provided, wherein the conductive material carrier is processed into a flexible circuit, electrode, or sensor conductive layer.

[0018] Compared with the prior art, the technical solution provided by the present invention has at least the following beneficial effects or advantages: (1) Significantly improved conductivity: A highly efficient three-dimensional conductive network was constructed by synergistic acidification of carbon nanotubes (CNTs) and silanization of silver nanowires. The mixed acid treatment enhanced the interfacial bonding between CNTs and the matrix, reducing contact resistance. AgNW complemented CNTs, forming a wire-tube interwoven network, which improved conductivity and reduced resistivity to a low level of 0.87 × 10⁻⁶. -3 Ω·cm.

[0019] (2) Precise control of rheological properties: High thixotropic index and low shear viscosity are achieved through the synergistic effect of montmorillonite (MMT) and epoxidized soybean oil (ESO). MMT forms a layered structure to inhibit filler sedimentation, with a stability of >10 months; (3) The lubricating effect of ESO reduces flow resistance and is suitable for 3D printing / coating processes; by adjusting the ratio of TPU solution and epoxy resin, the viscosity and moldability are balanced to adapt to flexible electrode coating; ESO replaces the traditional plasticizer DOP, and its epoxy groups participate in cross-linking to avoid performance degradation caused by small molecule migration.

[0020] (4) Multi-stage dispersion process: Ultrasonic dispersion avoids filler agglomeration and maintains the CNT / AgNW aspect ratio; high-speed shearing oriented arrangement of AgNW improves the connectivity of conductive pathways. The process compatibility of conductive material carriers is expanded by adjusting the mixed acid ratio and KH550 concentration.

[0021] In summary, this invention solves the technical problem of simultaneously achieving "high conductivity, low viscosity, and high stability" in conductive materials through the synergistic effect of filler modification, matrix compounding, and multi-stage dispersion processes. Attached Figure Description

[0022] Figure 1 This is a process flow diagram of the present invention. Detailed Implementation

[0023] The technical solution of the present invention will be described below with reference to the embodiments. However, the present invention is not limited to the following embodiments.

[0024] To enable those skilled in the art to better understand and implement the technical solutions of the present invention, the present invention will be further described below in conjunction with specific embodiments and accompanying drawings. However, the embodiments described are not intended to limit the present invention.

[0025] Unless otherwise specified, the experimental and detection methods described in the following embodiments are conventional methods; unless otherwise specified, the reagents and materials are commercially available.

[0026] Carbon nanotubes: purity ≥95%, diameter 10~20nm, length 10~30μm; Nitric acid: HNO3, analytical grade, concentration 65%; Sulfuric acid: H2SO4, analytical grade, concentration 95%; Silver nanowires (AgNW): purity ≥90%, diameter 30~50nm, length 10~30μm; TPU particles: particle size 100μm~300μm, Shore hardness 85A~95A; N,N-Dimethylformamide (DMF): Concentration ≥99.5%; Epoxy resin: E-51, epoxy value 0.48~0.54eq / 100g; Diethylenetriamine (DETA): Concentration ≥99%; Montmorillonite (MMT): Purity ≥ 90%; Polyvinylpyrrolidone (PVP): Average molecular weight 40,000; Epoxidized soybean oil (ESO): acid value 0.5 mg KOH / g, iodine value 125 g I2 / 100g; Dioctyl phthalate (DOP: acid value 0.03 mg KOH / g, ester content ≥ 99.5%) γ-aminopropyltriethoxysilane (KH550): molecular weight 221.37 g / mol.

[0027] Example 1 This embodiment describes the preparation of a thixotropic conductive material carrier.

[0028] Using carbon nanotubes (10 nm in diameter and 10 μm in length) and silver nanowires (30 nm in diameter and 10 μm in length) as the main fillers, a multi-stage mixing process was employed to prepare a stable conductive material carrier with tunable thixotropic and rheological properties. The process flow diagram is shown below. Figure 1 As shown, the preparation steps are as follows: S1. Carbon nanotube acidification: Carbon nanotubes and (a mixed acid consisting of HNO3 and H2SO4 at a mass ratio of 3:1) are added to a reaction vessel at a mass ratio of 1:100. The mixture is heated in a water bath to 100°C for 4 hours for acidification. After the acidification reaction is completed, the reaction solution is centrifuged at 10,000 rpm for 20 minutes, and the precipitate is collected. The precipitate is washed 5 times with water to remove residual mixed acid. After washing, the mixture is vacuum dried at 60°C for 12 hours to obtain the acidified carbon nanotubes.

[0029] S2. Silanization of Silver Nanowires (AgNW): AgNW (0.1wt%) was sonicated in ethanol for 25 min (100W power), washed with 0.10M HCl for 5 min to remove the surface oxide layer, and then immersed in a 2vol% KH550 ethanol solution (pH=5, adjusted with acetic acid) in a 25℃ constant temperature water bath for 2.0 h. After the reaction, the unreacted KH550 was removed by centrifugation at 8000 rpm for 10 min, and the nanowires were washed three times with anhydrous ethanol (sonicated for 5 min each time) to completely replace water molecules and prevent hydrolysis of the silane layer. Finally, the nanowires were vacuum dried at 60℃ for 12 h to obtain silanized AgNW.

[0030] S3. Preparation of TPU solution: Mix TPU particles with a particle size of 300μm with N,N-dimethylformamide (DMF) at a mass ratio of 20:100, heat in an oil bath at 80℃, and mechanically stir at 300 rpm for 3.5h to obtain the TPU solution.

[0031] S4. Preparation of epoxy resin solution: Degas the epoxy resin at 120℃ for 30 minutes, add DETA at 10% of the mass of epoxy resin, stir at 450 rpm for 6 minutes to obtain epoxy resin solution.

[0032] S5, Ultrasonic Dispersion: 25 wt% of carbon nanotubes treated by acidification in step S1 were added and ultrasonically dispersed for 10 min under 200 W ultrasonic conditions. Then, 4 wt% of silanized AgNW prepared in step S2, 38 wt% of TPU solution prepared in step S3, and 33 wt% of epoxy resin solution prepared in step S4 were added and ultrasonically dispersed for 30 min under 300 W ultrasonic conditions to obtain a conductive material carrier dispersion.

[0033] S6, High-speed shear mixing: Add 3 wt% MMT and 1 wt% PVP to the conductive material carrier dispersion prepared in S5 by mass percentage, with the remainder being the conductive material carrier dispersion prepared in S5. Shear at 1500 rpm for 15 min to obtain the initial mixed conductive material carrier.

[0034] S7, Secondary Mixing: Add 28wt% TPU solution and 4wt% epoxidized soybean oil (ESO) to the initial mixed conductive material carrier prepared by S6 by mass percentage, with the remainder being the initial mixed conductive material carrier prepared by S6. Stir at 1000rpm for 10 min to obtain the conductive material carrier, which is labeled as conductive material carrier #2.

[0035] Example 2 This embodiment describes the preparation of a thixotropic conductive material carrier.

[0036] Using carbon nanotubes (20 nm in diameter and 20 μm in length) and silver nanowires (40 nm in diameter and 20 μm in length) as the main fillers, a multi-stage mixing process was employed to prepare a stable conductive material carrier with tunable thixotropic and rheological properties. The preparation steps are as follows: S1. Carbon nanotube acidification: Carbon nanotubes and (a mixed acid consisting of HNO3 and H2SO4 at a mass ratio of 3:1) are added to a reaction vessel at a mass ratio of 1:90. The mixture is heated in a water bath to 95°C for 4.5 hours for acidification. After the acidification reaction is completed, the reaction solution is centrifuged at 10,000 rpm for 20 minutes, and the precipitate is collected. The precipitate is washed 5 times with water to remove residual mixed acid. After washing, the mixture is vacuum dried at 60°C for 13 hours to obtain the acidified carbon nanotubes.

[0037] S2. Silanization of Silver Nanowires (AgNW): AgNW (0.2wt%) was sonicated in ethanol for 30 min (100W power), washed with 0.11M HCl for 5 min to remove the surface oxide layer, and then immersed in a 3vol% KH550 ethanol solution (pH=5, adjusted with acetic acid) in a 25℃ constant temperature water bath for 2.5 h. After the reaction, the unreacted KH550 was removed by centrifugation at 8000 rpm for 12 min, and washed three times with anhydrous ethanol (sonicated for 5 min each time) to completely replace water molecules and prevent hydrolysis of the silane layer. Subsequently, it was vacuum dried at 60℃ for 11 h to obtain silanized AgNW.

[0038] S3. Preparation of TPU solution: Mix TPU particles with a particle size of 200μm with N,N-dimethylformamide (DMF) at a mass ratio of 20:90, heat in an oil bath at 80℃, and mechanically stir at 300rpm for 3.5h to obtain the TPU solution.

[0039] S4. Preparation of epoxy resin solution: Degas the epoxy resin at 120℃ for 30 minutes, add DETA at 11% of the epoxy resin mass, stir at 450 rpm for 6 minutes to obtain the epoxy resin solution.

[0040] S5, Ultrasonic Dispersion: 28 wt% of the carbon nanotubes treated by acidification in step S1 were added and ultrasonically dispersed for 10 min under 200 W ultrasonic conditions. Then, 3 wt% of the silanized AgNW prepared in step S2, 40 wt% of the TPU solution prepared in step S3, and 29 wt% of the epoxy resin solution prepared in step S4 were added and ultrasonically dispersed for 30 min under 300 W ultrasonic conditions to obtain a conductive material carrier dispersion.

[0041] S6, High-speed shear mixing: Add 2 wt% MMT and 0.8 wt% PVP to the conductive material carrier dispersion prepared in S5 by mass percentage, with the remainder being the conductive material carrier dispersion prepared in S5. Shear at 1500 rpm for 15 min to obtain the initial mixed conductive material carrier.

[0042] S7, Secondary Mixing: Add 30wt% TPU solution and 5wt% epoxidized soybean oil (ESO) to the initial mixed conductive material carrier prepared by S6 by mass percentage, with the remainder being the initial mixed conductive material carrier prepared by S6. Stir at 1200rpm for 20min to obtain the conductive material carrier, which is labeled as conductive material carrier #2.

[0043] Example 3 This embodiment describes the preparation of a thixotropic conductive material carrier.

[0044] Using carbon nanotubes (20 nm in diameter and 30 μm in length) and silver nanowires (50 nm in diameter and 30 μm in length) as the main fillers, a multi-stage mixing process was employed to prepare a stable conductive material carrier with tunable thixotropic and rheological properties. The preparation steps are as follows: S1. Carbon nanotube acidification: Carbon nanotubes and (a mixed acid consisting of HNO3 and H2SO4 at a mass ratio of 4:1) are added to a reaction vessel at a mass ratio of 1:90. The mixture is heated in a water bath to 90°C for 5 hours for acidification. After the acidification reaction is completed, the reaction solution is centrifuged at 10,000 rpm for 18 minutes, and the precipitate is collected. The precipitate is washed 5 times with water to remove residual mixed acid. After washing, the mixture is vacuum dried at 60°C for 10 hours to obtain the acidified carbon nanotubes.

[0045] S2. Silanization of Silver Nanowires (AgNW): AgNW (0.15wt%) was sonicated in ethanol for 30 min (100W power), washed with 0.09M HCl for 5 min to remove the surface oxide layer, and then immersed in a 2.5 vol% KH550 ethanol solution (pH=5, adjusted with acetic acid) in a 25℃ constant temperature water bath for 3 h. After the reaction, the unreacted KH550 was removed by centrifugation at 9000 rpm for 10 min, and washed three times with anhydrous ethanol (sonicated for 5 min each time) to completely replace water molecules and prevent hydrolysis of the silane layer. Subsequently, the silanized AgNW was vacuum dried at 60℃ for 10 h to obtain the silanized AgNW.

[0046] S3. Preparation of TPU solution: Mix TPU particles with a particle size of 100μm with N,N-dimethylformamide (DMF) at a mass ratio of 20:90, heat in an oil bath at 80℃, and mechanically stir at 300 rpm for 3.5h to obtain the TPU solution.

[0047] S4. Preparation of epoxy resin solution: Degas the epoxy resin at 120℃ for 30 min, add DETA at 12% of the epoxy resin mass, stir at 450 rpm for 6 min to obtain epoxy resin solution.

[0048] S5, Ultrasonic Dispersion: 20 wt% of the carbon nanotubes treated by acidification in step S1 were added and ultrasonically dispersed for 10 min under 200 W ultrasonic conditions. Then, 5 wt% of the silanized AgNW prepared in step S2, 45 wt% of the TPU solution prepared in step S3, and 30 wt% of the epoxy resin solution prepared in step S4 were added and ultrasonically dispersed for 30 min under 300 W ultrasonic conditions to obtain a conductive material carrier dispersion.

[0049] S6, High-speed shear mixing: Add 1 wt% MMT and 0.5 wt% PVP to the conductive material carrier dispersion prepared in S5 by mass percentage, with the remainder being the conductive material carrier dispersion prepared in S5. Shear at 1500 rpm for 15 min to obtain the initial mixed conductive material carrier.

[0050] S7, Secondary Mixing: Add 25wt% TPU solution and 3wt% epoxidized soybean oil (ESO) to the initial mixed conductive material carrier prepared by S6 by mass percentage, with the remainder being the initial mixed conductive material carrier prepared by S6. Stir at 1200rpm for 20 min to obtain the conductive material carrier, which is labeled as conductive material carrier #3.

[0051] Comparative Example 1 The difference between this comparative example and Example 1 is that the mixed acid formed by mixing HNO3 and H2SO4 in a mass ratio of 4:1 in step S1 is replaced with single HNO3. All other conditions are the same. The resulting conductive material carrier is labeled as #1 contrast agent.

[0052] Comparative Example 2 The difference between this comparative example and Example 1 is that step S1 is omitted, while all other steps are the same. Unsilanized silver nanowires (AgNW) are added to prepare a conductive material carrier, which is labeled as contrast agent #2.

[0053] Comparative Example 3 The difference between this comparative example and Example 1 is that step S2 is omitted, while all other steps are the same. Untreated carbon nanotubes are added to prepare a conductive material carrier, which is labeled as contrast agent #3.

[0054] Comparative Example 4 The difference between this comparative example and Example 1 is that the epoxidized soybean oil (ESO) in step S7 is replaced with dioctyl phthalate. All other steps are the same. The resulting conductive material carrier is labeled as contrast agent #4.

[0055] Test Example 1 This test example involves fabricating conductive films using conductive material carriers #1-#3 prepared in Examples 1-3 and comparative agents prepared in Comparative Examples 1-4. The resistivity of the conductive films was measured using the four-probe method to evaluate the conductivity of different conductive pastes. The stability of the conductive material carriers was determined by placing them at room temperature and visually observing for agglomeration, recording the time intervals. The test results are shown in Table 1.

[0056] Table 1. Test results of different conductive material carriers

[0057] Table 1 shows that the resistivity of the conductive films prepared from conductive material carriers #1 to #3 is significantly lower than that of contrast agents #1 to #4, especially the conductive film prepared from conductive material carrier #2, which has the lowest resistivity. This may be related to the optimal AgNW silanization effect during its preparation process. The conductivity of conductive material carrier #1 is nearly 20 times higher than that of contrast agent #1, indicating that mixed acid acidification treatment of the nanoducts is significantly better than single nitric acid acidification treatment. The resistance of conductive material carrier #1 is nearly 70 times higher than that of contrast agent #3, further illustrating the key role of nanoduct acidification. The conductivity of conductive material carrier #1 is nearly 10 times higher than that of contrast agent #2, indicating that AgNW silanization is also an important influencing factor on conductivity, which is further verified in the conductivity of conductive material carrier #2. The conductivity of conductive material carrier #1 is only 1 time higher than that of contrast agent #4, indicating that ESO optimizes dispersibility. ESO has a better dispersibility than dioctyl phthalate, and ESO improves the stability of the conductive material carrier. The stability of conductive material carrier #1 is much higher than that of contrast agent #4. The stability of conductive material carriers 1# to 3# is greater than 10 months, which is better than that of contrast agents 1# to 4#. This indicates that the synergistic effect of each component combined with the synergistic effect of the preparation process makes the conductive material carrier prepared by the method of this invention have excellent stability.

[0058] Test Example 2 In this test example, an MCR302 rheometer was used to determine the viscosity of conductive material carriers (#1-#3) prepared in Examples 1-3 and comparative agents prepared in Comparative Examples 1-4 at different shear rates. The shear rate was recorded from 0.01 s⁻¹. 1 It increases logarithmically to 100s -1 The viscosity change over time, with an initial viscosity η0 (shear rate of 0.01 s⁻¹). 1 Maximum viscosity η1 (shear rate of 0.015 s⁻¹) -1 ) and viscosity η2 at high shear rates (shear rate of 100 s) -1 The results are shown in Table 2.

[0059] Table 2. Viscosity test results of different conductive material carriers at different shear rates.

[0060] As shown in Table 2, all samples exhibited shear-thinning characteristics, and the η2 values ​​of conductive material carriers 1# to 3# were all lower than those of contrast agents 1# to 4#, indicating that the conductive material carriers prepared by the method of this invention have better processing fluidity at high shear rates. Contrast agent 4#, which used dioctyl phthalate instead of epoxidized soybean oil, showed the highest η2 value, further confirming the dispersing advantage of epoxidized soybean oil. The small differences between 1# and 3# indicate that the preparation method of this invention has good process stability.

[0061] As described above, the basic principles, main features, and advantages of the present invention have been well described. The above embodiments and specifications are merely descriptions of preferred embodiments of the present invention, and the present invention is not limited to the above embodiments. Various changes and improvements made to the technical solutions of the present invention by those skilled in the art without departing from the spirit and scope of the present invention should fall within the protection scope defined by the present invention.

Claims

1. A method for preparing a thixotropic conductive material carrier, characterized in that, Includes the following steps: S1. Acidification treatment of carbon nanotubes: Carbon nanotubes are reacted with a mixed acid, heated in a water bath to 90-100℃, reacted for 4-5 hours, centrifuged, washed and dried to obtain acidified carbon nanotubes; the mixed acid is HNO3 and H2SO4 mixed in a mass ratio of 3-4:

1. S2. Silanization treatment of silver nanowires: After washing silver nanowires with HCl, they are immersed in an ethanol solution of γ-aminopropyltriethoxysilane for 2-3 hours. After centrifugation, washing, and drying, silanized silver nanowires are obtained. S3. Preparation of TPU solution: Mix TPU particles with N,N-dimethylformamide at a mass ratio of 20:90~20:100 to obtain TPU solution; S4. Preparation of epoxy resin solution: Mix epoxy resin with diethylenetriamine and stir until homogeneous to obtain epoxy resin solution; the amount of diethylenetriamine added is 10%~12% of the total mass of epoxy resin; S5. Ultrasonic dispersion: Acidified carbon nanotubes, silanized silver nanowires, TPU solution and epoxy resin solution are mixed in proportion and ultrasonically dispersed to obtain a conductive material carrier dispersion. S6. High-speed shear mixing: Montmorillonite and polyvinylpyrrolidone are added to the conductive material carrier dispersion prepared in S5, and shear mixing is performed to obtain the initial mixed conductive material carrier. S7. Secondary mixing: Add TPU solution and epoxidized soybean oil to the primary mixed conductive material carrier obtained in S6, stir and mix well to obtain the conductive material carrier.

2. The method according to claim 1, characterized in that, In step S1, the mass ratio of carbon nanotubes to mixed acid is 1:90 to 1:

100.

3. The method according to claim 1, characterized in that, The carbon nanotubes mentioned in step S1 have a diameter of 10~20nm and a length of 10~30μm.

4. The method according to claim 1, characterized in that, In step S2, the concentration of γ-aminopropyltriethoxysilane in the ethanol solution of γ-aminopropyltriethoxysilane is 2-3 vol.

5. The method according to claim 1, characterized in that, The mass percentages of each component in step S5 are as follows: acidified carbon nanotubes 20-28 wt%, silanized silver nanowires 3-5 wt%, TPU solution 38-45 wt%, and epoxy resin solution 29-33 wt%.

6. The method according to claim 1, characterized in that, In step S6, the amounts of montmorillonite and polyvinylpyrrolidone added are 1~3wt% and 0.5~1wt%, respectively.

7. The method according to claim 1, characterized in that, In step S7, the amounts of TPU solution and epoxidized soybean oil added are 25-30 wt% and 3-5 wt%, respectively.

8. A conductive material carrier prepared according to any one of claims 1 to 7.

9. The conductive material carrier according to claim 8, characterized in that, The conductive material carrier is subjected to a shear rate of 100 s. -1 The viscosity is ≤4.13 Pa·s.

10. The application of the conductive material carrier according to claim 8 in flexible electronic components, characterized in that, The conductive material carrier is formed into a flexible circuit, electrode, or sensor conductive layer.

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