Vacuum environment simulation device for ultra-compact cyclotron

Abstract

The invention discloses a vacuum environment simulation device for an ultra-compact cyclotron. The vacuum environment simulation device comprises a vacuum chamber for an accelerator body and a vacuum chamber for a high-frequency transmitter. The vacuum chamber for the accelerator main body is expanded to an accelerator shell from an original local vacuum chamber; a superconducting magnet, a high-frequency cavity, an ion source, a radial target and an electrostatic deflection plate of an original local vacuum chamber are placed in the vacuum chamber for the accelerator body, and water, electricity, gas and other system components related to the accelerator body are further placed in the vacuum chamber. The high-frequency transmitter and various system components such as water, electricity and gas related to the high-frequency transmitter are placed in the vacuum chamber for the high-frequency transmitter; the problems that after integration, the atmospheric environment is converted into the vacuum environment, parts with different vacuum conditions are integrated together, grounding of the high-frequency transmitter in the atmospheric environment and grounding of the high-frequency transmitter in the vacuum environment are not adaptive, and an original local vacuum chamber used for an expanded vacuum chamber is not adaptive are solved.

Description

Technical Field

[0001] This invention belongs to the field of high vacuum technology, specifically relating to a vacuum environment simulation device for an ultra-compact cyclotron accelerator. Background Technology

[0002] The difference between compact and ultra-compact cyclotrons lies in their design: compact cyclotrons are designed as separate units, while ultra-compact cyclotrons are designed as a single unit. The separate design separates the main body of the cyclotron from its motor, water-cooling, and beam measurement components, placing these components far from the accelerator. This results in a large overall size and significant space requirements for compact cyclotrons. In contrast, the ultra-compact single-unit design integrates the main body, motor, water-cooling, and beam measurement components into a single, ultra-compact unit.

[0003] One of the design challenges of the integrated design of the ultra-compact cyclotron accelerator lies in the incompatibility of some components when transitioning from an atmospheric environment to a vacuum environment. The integrated design requires merging the original space, expanding the original internal local vacuum chamber of the accelerator, and then merging the local vacuum chamber with the accelerator shell. This merger introduces new problems: the motor, water cooling, and beam measurement components, which previously operated in an atmospheric environment, become incompatible with the vacuum environment due to material and interface incompatibility. The material incompatibility arises because specific materials are required in a vacuum environment, while the water, electrical, and beam measurement materials used in atmospheric environments are not suitable for a vacuum. The interface incompatibility stems from the fact that the number of interfaces on the accelerator shell has increased dramatically from a dozen or so before integration to over 200. These new interfaces primarily originate from the interfaces of various water, electricity, and gas pipelines.

[0004] The second challenge in the integrated design of the ultra-compact cyclotron accelerator lies in the incompatibility of integrating components with different vacuum conditions. For example, the vacuum condition of the accelerator body is relatively high, while the vacuum condition of the high-frequency transmitter is relatively low. Integrating them together will inevitably affect the components with the relatively low vacuum condition.

[0005] The third challenge in the integrated design of the ultra-compact cyclotron accelerator lies in the fact that the original high-frequency transmitter operates in an atmospheric environment and has its own independent grounding system for atmospheric environments. After the integrated design, the high-frequency transmitter needs to be placed in a vacuum environment, and the grounding of the high-frequency transmitter in the atmospheric environment and the grounding in the vacuum environment are not compatible.

[0006] The fourth challenge in the integrated design of the ultra-compact cyclotron accelerator lies in the fact that all peripheral components of the original accelerator were fixed to the magnetic yoke, which placed relatively high demands on the magnetic yoke. However, after integration, all peripheral components of the accelerator are fixed to the vacuum chamber. Therefore, the original local vacuum chamber is not suitable for use in the expanded vacuum chamber. Summary of the Invention

[0007] To address the problems existing in the prior art, this invention proposes a vacuum environment simulation device for ultracompact cyclotron accelerators. The first objective is to solve the problem of material and interface incompatibility when some components are transferred from an atmospheric environment to a vacuum environment after integrated construction. The second objective is to solve the problem of incompatibility when integrating components with different vacuum conditions. The third objective is to solve the problem of incompatibility between grounding in an atmospheric environment and grounding in a vacuum environment for high-frequency transmitters. The fourth objective is to solve the problem of incompatibility when using existing local vacuum chambers for expanded vacuum chambers.

[0008] To solve its technical problem, the present invention adopts the following technical solution:

[0009] A vacuum environment simulation device for an ultracompact cyclotron accelerator is characterized by the following features: the vacuum environment simulation device includes a vacuum chamber for the accelerator body and a vacuum chamber for a high-frequency transmitter; the vacuum chamber for the accelerator body is expanded from the original local vacuum chamber to the accelerator shell; in addition to housing the superconducting magnet, high-frequency cavity, ion source, radial target, and electrostatic deflection plate of the original local vacuum chamber, the vacuum chamber for the accelerator body also houses various system components related to the accelerator body, such as water, electricity, and gas; the vacuum chamber for the high-frequency transmitter houses the high-frequency transmitter and various system components related to the high-frequency transmitter, such as water, electricity, and gas; the vacuum chamber for the accelerator body and the vacuum chamber for the high-frequency transmitter are connected by a high-frequency feed vacuum pipe, the length of which ensures the connection between the two vacuum chambers under operating conditions while reducing the mutual influence between the vacuum levels of the two vacuum chambers.

[0010] Furthermore, the vacuum chambers used for the accelerator body and the high-frequency transmitter are made of aluminum alloy. This aluminum alloy is used to reduce the influence of the vacuum chamber material on the magnetic circuit of the superconducting magnet. At the same time, the use of aluminum alloy can effectively reduce its activation in the radiation environment after the accelerator has been running for a long time.

[0011] Furthermore, the accelerator body uses a vacuum chamber, which has multiple types of interfaces. In addition to the original ion source mounting holes, radial target mounting holes, and electrostatic deflection plate mounting holes in the vacuum environment, the original water, electricity, and gas feed holes and maintenance and inspection holes in the atmospheric environment are also combined into the vacuum environment.

[0012] Furthermore, in order to ensure interchangeability among the hundreds of feed holes for water, electricity, and gas, the diameters of the hundreds of feed holes are classified as: KF25, KF40, KF50, DN100, DN160, and DN200. This is to solve the problem of incompatibility between pipe interfaces when water, electricity, and gas components that originally worked in an atmospheric environment are placed in a vacuum environment.

[0013] Furthermore, the vacuum chamber for the high-frequency transmitter has conductive oxidation on both its inner and outer surfaces. Conductive oxidation prevents the aluminum alloy from oxidizing with the air and also ensures the conductivity of the inner and outer surfaces, thus solving the problem of incompatibility between grounding in an atmospheric environment and grounding in a vacuum environment for the high-frequency transmitter.

[0014] Furthermore, the high-frequency feed vacuum pipe connecting the vacuum chamber for the accelerator main body and the vacuum chamber for the high-frequency transmitter has a required length. Where: L: length of the high-frequency feed vacuum pipe; N: integer 1, 2, 3…; λ: microwave wavelength; To meet the vacuum difference requirement between the two vacuum chambers, the vacuum difference between the two chambers must be greater than or equal to one order of magnitude and less than or equal to two orders of magnitude, i.e., 100P2≥P1≥10P2, where P1 is the vacuum level of the vacuum chamber used for the high-frequency transmitter; P2 is the vacuum level of the vacuum chamber used for high-frequency cavity thermal measurement. To meet the vacuum level requirements of the two vacuum chambers, the length of the vacuum pipe connecting the two vacuum chambers… Where B is the pipe circumference, L is the pipe length, q is the gas emission rate of the pipe material, and C is the pipe conductivity. ΔP is the pressure difference between the two vacuum chambers. Therefore, to meet the above two requirements, the empty pipe length needs to satisfy formulas 1 and 2.

[0015] Furthermore, in order to ensure the accuracy of each interface of the vacuum chamber used for the accelerator body and the vacuum chamber used for the high-frequency transmitter, the deformation of the vacuum chamber under vacuum conditions is <= 0.5mm, and the overall leakage rate of the vacuum chamber is ≤ 5×10-7Pa·l / s, in order to solve the problem that the original local vacuum chamber is not suitable for use in the expanded vacuum chamber.

[0016] Advantages and effects of the present invention

[0017] 1. This invention significantly reduces magnetic interference through the aluminum alloy vacuum chamber body: effectively reducing the impact of the vacuum chamber material on the magnetic circuit of the superconducting magnet, and improving the stability of the magnet's performance. Excellent anti-activation performance: when operating in a radiation environment for extended periods, the aluminum alloy material effectively reduces the activation level, improving equipment safety and simplifying post-processing.

[0018] 2. This invention ensures interchangeability and versatility by standardizing the feed hole sizes (KF25 / KF40 / KF50 / DN100 / DN160 / DN200), unifying the diameters of hundreds of water, electricity, and gas feed holes into several standard sizes (KF25, KF40, KF50, DN100, DN160, DN200), greatly improving the interchangeability of different functional feed holes and simplifying installation, maintenance, and spare parts management.

[0019] 3. This invention achieves dual protection and function by using conductive oxidation of the inner and outer surfaces of the vacuum chamber of a high-frequency transmitter: it not only effectively prevents aluminum alloy from oxidizing and corroding in the air, thus extending its service life, but also meets the key requirement that the inner and outer surfaces of the vacuum chamber must have good conductivity.

[0020] 4. This invention optimizes system connection and isolation through a specific length design of the high-frequency feed vacuum pipe (satisfying formulas 1 and 2): The precisely designed pipe length (following formulas 1 and 2) effectively reduces mutual interference of vacuum levels between the two vacuum chambers while successfully connecting them and maintaining their operating state. It also meets the vacuum level differential requirement: this design ensures that the necessary vacuum level gradient requirement of the system is achieved.

[0021] 5. This invention meets strict deformation and sealing performance standards (deformation ≤ 0.5 mm, overall leakage rate ≤ 5 × 10⁻⁶). -7 Pa·l / s), ensuring interface accuracy and system integrity: Strictly controlling the overall deformation of the vacuum chamber (≤0.5mm) and extremely low overall leakage rate (≤5×10). -7 The system (Pa·l / s) fundamentally ensures the connection accuracy, airtightness, and long-term operational reliability between the accelerator main vacuum chamber and the high-frequency transmitter vacuum chamber, as well as their respective interfaces with external systems. Attached Figure Description

[0022] Figure 1 This is a layout diagram of the dual vacuum chambers of the present invention;

[0023] Figure 2 For electroporation insertion;

[0024] Figure 3 For water and air penetration. Detailed Implementation

[0025] Design principle of the invention

[0026] Innovation of this invention

[0027] 1. Innovative Material Selection and Processing (Solving Material Adaptability, Magnetic Interference, and Activation Issues): Aluminum alloy is used as the main material for the vacuum chamber. This solves the material incompatibility problem of traditional components when transitioning from an atmospheric environment to a vacuum environment. It significantly reduces the interference of the vacuum chamber material on the magnetic circuit of the superconducting magnet (superior to traditional steel materials). It also reduces the activation risk of the vacuum chamber during long-term radiation operation.

[0028] 2. Standardized feed interface design. The numerous feed holes on the vacuum chamber are standardized by diameter classification (specific standards: KF25, KF40, KF50, DN100, DN160, DN200). This solves the problem of a surge in the number and inconsistency of interfaces after components are integrated into a vacuum environment. It significantly improves the interchangeability, reliability, and ease of maintenance of feed hole inserts for water, electricity, and gas.

[0029] 3. Unique surface treatment solves the grounding problem of high-frequency transmitters: Conductive oxidation treatment is applied to the inner and outer surfaces of the vacuum chamber used in high-frequency transmitters. This solves the problem of ineffective grounding after the high-frequency transmitter is transferred from an atmospheric environment to a vacuum environment. It simultaneously meets the dual requirements of anti-oxidation and surface conductivity, ensuring equipment safety and electromagnetic compatibility.

[0030] 4. The optimized overall vacuum chamber structure solves the structural adaptation problem from local to global: Core Innovation A: Expanding the vacuum chamber design from a localized area to encompass the entire accelerator shell. Core Innovation B: Minimizing deformation (≤0.5mm) and leakage rate (≤5×10⁻⁶) for this large vacuum chamber. -7 The pressure (Pa·l / s) was strictly controlled. Through rigorous deformation control and an extremely low leakage rate guarantee, the accuracy of numerous interfaces (such as standardized feed holes) and the long-term integrity and stability of the entire vacuum system were ensured.

[0031] 5. Scientific vacuum differential control design solves the problem of mutual interference in the vacuum environment: A dedicated high-frequency feed vacuum pipe of a specific length was designed (length calculation based on specific formulas 1 and 2), which solves the problem of crosstalk and influence between vacuum environments when components with different vacuum requirements (accelerator main vacuum chamber vs. high-frequency transmitter vacuum chamber) are integrated in the same system. This ensures effective connection between the two vacuum chambers (for high-frequency feed) while achieving precise vacuum gradient control (100P2≥P1≥10P2), meeting their respective operational requirements.

[0032] The solution to the difficulties in this invention:

[0033] 1. Solutions to Challenge 1: Environmental Adaptability of Materials and Interfaces. Material Adaptability: Choosing aluminum alloy as the main material for the vacuum chamber is key. Magnetic Compatibility: Reduces interference with the superconducting magnet's magnetic field (compared to steel). Activation Characteristics: Lower activation levels (radioactivity) after long-term use in a radiation environment, resulting in greater safety. Interface Adaptability: A fundamental change is achieved by uniformly transferring all interfaces (including water, electricity, gas, and maintenance ports from the original atmospheric environment) to the vacuum environment. Standardization: The diameters of hundreds of feed ports are standardized to a limited number of standard specifications (KF25 / 40 / 50, DN100 / 160 / 200). This ensures high interchangeability of interface components, reliable sealing (using standard vacuum flanges and seals), and ease of maintenance.

[0034] 2. Solution to Challenge Two: Integration of Components with Different Vacuum Levels. Core Strategy: Utilizing the length of the high-frequency feed vacuum pipe as a physical isolation. Working Principle: A sufficiently long pipe increases the flow resistance of the gas. The design length is calculated using specific formulas (Formulas 1 and 2, details not provided). Ensuring the length meets the following requirement: the impact of vacuum level changes in one vacuum chamber on the other is limited to an acceptable range (100P2 ≥ P1 ≥ 10P2, i.e., the pressure difference is controlled within 1-2 orders of magnitude). This effectively reduces the mutual interference between the vacuum levels of the two vacuum chambers.

[0035] 3. Solution to Challenge Three: Grounding Environment Differences. Core Solution: Conductive oxidation treatment of the inner and outer surfaces of the aluminum alloy in the vacuum chamber of the high-frequency transmitter. Dual Functions: Protection: Prevents aluminum from oxidizing in air (atmospheric side) and potential vacuum environment problems. Conductivity: Key Function! Forms a conductive layer on the inner and outer surfaces. Makes the vacuum chamber itself a continuous and good conductor. Unifies the grounding path: Regardless of whether the equipment (high-frequency transmitter) is located in a vacuum or in the atmosphere, its grounding can be achieved by connecting to this conductive vacuum chamber shell, solving the grounding potential difference problem caused by poor insulation or contact between the vacuum and non-vacuum areas.

[0036] 4. Solution to Challenge Four: Stability and Sealing of the Expanded Vacuum Chamber. Core Measures: Ultra-high precision machining and assembly + strict vacuum performance indicators. Precision Control: Strictly control the machining and assembly precision of all interfaces (flanges, openings, etc.). Ensure that the overall deformation of the vacuum chamber is ≤0.5mm under vacuum negative pressure (external atmospheric pressure). This is crucial for maintaining structural stability and preventing displacement or performance degradation of internal precision equipment (such as acceleration chambers and magnets). Sealing Performance: Through precision machining, suitable sealing structures (such as flange seals), and rigorous leak detection processes. Target: Ensure the overall leakage rate of the vacuum chamber is ≤5×10⁻⁶. -7Pa·L / s. This extremely low leakage rate is the fundamental guarantee for maintaining long-term stable operation in ultra-high / high vacuum environments (such as the vacuum required for accelerators), preventing external gases from seeping in and damaging the vacuum level.

[0037] Based on the above principles, this invention designs a vacuum environment simulation device for ultracompact cyclotron accelerators, such as... Figure 1-3 As shown, its features are as follows: the vacuum environment simulation device includes a vacuum chamber for the accelerator body and a vacuum chamber for the high-frequency transmitter; the vacuum chamber for the accelerator body is expanded from the original local vacuum chamber to the accelerator shell; in addition to housing the superconducting magnet, high-frequency cavity, ion source, radial target, and electrostatic deflection plate of the original local vacuum chamber, the vacuum chamber for the accelerator body also houses various system components related to the accelerator body, such as water, electricity, and gas; the vacuum chamber for the high-frequency transmitter houses the high-frequency transmitter and various system components related to the high-frequency transmitter, such as water, electricity, and gas; the vacuum chamber for the accelerator body and the vacuum chamber for the high-frequency transmitter are connected by a high-frequency feed vacuum pipe, the length of which ensures the connection between the two vacuum chambers under working conditions and reduces the mutual influence between the vacuum levels of the two vacuum chambers.

[0038] The vacuum chambers used for the accelerator body and the high-frequency transmitter are made of aluminum alloy. This aluminum alloy is used to reduce the influence of the vacuum chamber material on the magnetic circuit of the superconducting magnet. At the same time, the use of aluminum alloy can effectively reduce its activation in the radiation environment after the accelerator has been running for a long time.

[0039] The accelerator body uses a vacuum chamber, which has multiple types of interfaces. In addition to the original ion source mounting holes, radial target mounting holes, and electrostatic deflection plate mounting holes in the vacuum environment, the original water, electricity, and gas feed holes and maintenance and inspection holes in the atmospheric environment are also combined into the vacuum environment.

[0040] like Figure 2 For electroporation inserts; such as Figure 3 For water and gas through-hole fittings. To ensure interchangeability among the hundreds of water, electricity, and gas feed holes, the diameters of the hundreds of feed holes are classified as: KF25, KF40, KF50, DN100, DN160, and DN200. This is to solve the problem of incompatibility between pipe interfaces when water, electricity, and gas components that originally worked in an atmospheric environment are placed in a vacuum environment.

[0041] The vacuum chamber for the high-frequency transmitter has conductive oxidation on both its inner and outer surfaces. Conductive oxidation prevents the aluminum alloy from oxidizing with the air and also ensures the conductivity of the inner and outer surfaces, thus solving the problem of incompatibility between grounding in an atmospheric environment and grounding in a vacuum environment for the high-frequency transmitter.

[0042] The high-frequency feed vacuum pipe connecting the vacuum chamber for the accelerator main body and the vacuum chamber for the high-frequency transmitter has the following length requirements. Where: L: length of the high-frequency feed vacuum pipe; N: integer 1, 2, 3…; λ: microwave wavelength; To meet the vacuum difference requirement between the two vacuum chambers, the vacuum difference between the two chambers must be greater than or equal to one order of magnitude and less than or equal to two orders of magnitude, i.e., 100P2≥P1≥10P2, where P1 is the vacuum level of the vacuum chamber used for the high-frequency transmitter; P2 is the vacuum level of the vacuum chamber used for high-frequency cavity thermal measurement. To meet the vacuum level requirements of the two vacuum chambers, the length of the vacuum pipe connecting the two vacuum chambers… Where B is the pipe circumference, L is the pipe length, q is the gas emission rate of the pipe material, and C is the pipe conductivity. ΔP is the pressure difference between the two vacuum chambers. Therefore, to meet the above two requirements, the empty pipe length needs to satisfy formulas 1 and 2.

[0043] To ensure the precision of each interface of the vacuum chamber used in the accelerator main body and the vacuum chamber used in the high-frequency transmitter, the deformation of the vacuum chamber under vacuum conditions is <= 0.5mm, and the overall leakage rate of the vacuum chamber is ≤5×10-7Pa·l / s. This is to solve the problem that the original local vacuum chamber is not suitable for use in the expanded vacuum chamber.

[0044] It should be emphasized that the above specific embodiments are merely explanations of the present invention and are not intended to limit the present invention. After reading this specification, those skilled in the art can make modifications to the above embodiments without contributing any inventive step, but such modifications are protected as long as they are within the scope of the claims of the present invention.

Claims

1. A vacuum environment simulation device for an ultracompact cyclotron accelerator, characterized in that: The vacuum environment simulation device includes a vacuum chamber for the accelerator body and a vacuum chamber for the high-frequency transmitter. The vacuum chamber for the accelerator body is an expansion of the original local vacuum chamber to the accelerator shell. In addition to housing the superconducting magnet, high-frequency cavity, ion source, radial target, and electrostatic deflection plate of the original local vacuum chamber, the vacuum chamber for the accelerator body also houses various system components related to the accelerator body, such as water, electricity, and gas. The vacuum chamber for the high-frequency transmitter houses the high-frequency transmitter and various system components related to the high-frequency transmitter, such as water, electricity, and gas. The vacuum chamber for the accelerator body and the vacuum chamber for the high-frequency transmitter are connected by a high-frequency feed vacuum pipe. The length of the high-frequency feed vacuum pipe ensures the connection between the two vacuum chambers under operating conditions while reducing the mutual influence between the vacuum levels of the two vacuum chambers.

2. The vacuum environment simulation device for an ultracompact cyclotron accelerator according to claim 1, characterized in that: The vacuum chambers used for the accelerator body and the high-frequency transmitter are made of aluminum alloy. This aluminum alloy is used to reduce the influence of the vacuum chamber material on the magnetic circuit of the superconducting magnet. At the same time, the use of aluminum alloy can effectively reduce its activation in the radiation environment after the accelerator has been running for a long time.

3. The vacuum environment simulation device for an ultracompact cyclotron accelerator according to claim 1, characterized in that: The accelerator body uses a vacuum chamber, which has multiple types of interfaces. In addition to the original ion source mounting holes, radial target mounting holes, and electrostatic deflection plate mounting holes in the vacuum environment, the original water, electricity, and gas feed holes and maintenance and inspection holes in the atmospheric environment are also combined into the vacuum environment.

4. The vacuum environment simulation device for an ultracompact cyclotron accelerator according to claim 3, characterized in that: To ensure interchangeability among the hundreds of feed holes for water, electricity, and gas, the diameters of these feed holes are classified as: KF25, KF40, KF50, DN100, DN160, and DN200. This addresses the issue of too many pipe interfaces becoming incompatible when water, electricity, and gas components that originally operated in an atmospheric environment are placed in a vacuum environment.

5. The vacuum environment simulation device for an ultracompact cyclotron accelerator according to claim 1, characterized in that: The vacuum chamber for the high-frequency transmitter has conductive oxidation on both its inner and outer surfaces. Conductive oxidation prevents the aluminum alloy from oxidizing with the air and also ensures the conductivity of the inner and outer surfaces, thus solving the problem of incompatibility between grounding in an atmospheric environment and grounding in a vacuum environment for the high-frequency transmitter.

6. The vacuum environment simulation device for an ultracompact cyclotron accelerator according to claim 1, characterized in that: The high-frequency feed vacuum pipe connecting the vacuum chamber for the accelerator main body and the vacuum chamber for the high-frequency transmitter has the following length requirements. Where: L: length of the high-frequency feed vacuum pipe; N: integer 1, 2, 3…; λ: microwave wavelength; To meet the vacuum difference requirement between the two vacuum chambers, the vacuum difference between the two chambers must be greater than or equal to one order of magnitude and less than or equal to two orders of magnitude, i.e., 100P2≥P1≥10P2, where P1 is the vacuum level of the vacuum chamber used for the high-frequency transmitter; P2 is the vacuum level of the vacuum chamber used for high-frequency cavity thermal measurement; To meet the vacuum requirements of the two chambers, the length of the vacuum pipe connecting the two vacuum chambers… Where B is the pipe circumference, L is the pipe length, q is the gas venting rate of the pipe material, and C is the pipe conductivity; ΔP is the pressure difference between the two vacuum chambers; therefore, in order to meet the above two requirements, the empty pipe length needs to satisfy formulas 1 and 2.

7. The vacuum environment simulation device for an ultracompact cyclotron accelerator according to claim 1, characterized in that: To ensure the precision of each interface of the vacuum chamber used in the accelerator main body and the vacuum chamber used in the high-frequency transmitter, the deformation of the vacuum chamber under vacuum conditions is <= 0.5mm, and the overall leakage rate of the vacuum chamber is ≤ 5×10-7Pa·l / s. This improves the precision requirements for the vacuum chamber used in the accelerator main body and the vacuum chamber used in the high-frequency transmitter, in order to solve the problem that the original local vacuum chamber is not suitable for use in the expanded vacuum chamber.

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