Cutting method, system and equipment for reducing single crystal extraction gradient and storage medium

Abstract

The invention provides a cutting method, system and equipment for reducing the single crystal extraction gradient and a storage medium. The cutting method comprises the following steps: obtaining extraction size data of a plurality of square rods; calculating a compensation value K according to the extraction size data; calculating a cutting positioning size D according to the compensation value K; and according to the cutting positioning size D, performing compensation cutting on the single crystal to be cut within the cutting compensation range. The method has the beneficial effects that cutting compensation is carried out at the cutter feeding section during single crystal extraction, so that the cutting difference between the cutter feeding section and the main cutting section is reduced, and the gradient of the extraction cutting surface is reduced. In the cutter feeding section of single crystal extraction cutting, the cutting line is used for cutting according to the size of the compensated extraction finished product, the main cutting section and the cutter discharging section of single crystal extraction are used for cutting according to the size of the extraction finished product, the extraction size is reduced, silicon materials needing to be ground are reduced in the follow-up grinding process, and therefore silicon loss is reduced, working hours are saved, and working efficiency is improved.

Description

Technical Field

[0001] This invention belongs to the field of photovoltaic technology, and in particular relates to a cutting method, system, device and storage medium for reducing the square root gradient of monocrystalline silicon. Background Technology

[0002] In the squaring process of single crystal, after the single crystal is fed, the squaring equipment (squaring machine) cuts the four sides of the single crystal round rod into a square rod according to the process parameters and the set squaring size. After the cutting is completed, the single crystal square rod can be unloaded and enter the subsequent process.

[0003] In existing technologies, when cutting single crystals, the wire saw is subjected to asymmetric bending deformation due to the combined effects of cutting resistance, coolant impact force, and its own tension, forming a wire bow. The wire bow causes the cutting path to deviate, resulting in a deviation between the cutting size and the set size. This creates a large gradient on the surface of the square bar, leading to greater single crystal loss in subsequent processing, which is time-consuming and inefficient. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides a cutting method, system, device, and storage medium for reducing the squaring gradient of single crystals. This effectively solves the technical problem that after squaring a single crystal, the surface gradient of the square rod is large, resulting in significant single crystal loss, which is time-consuming and inefficient, thus overcoming the shortcomings of existing technologies.

[0005] Through research, analysis, and implementation verification, the technical solution adopted in this invention involves a squaring machine processing single-crystal square rods. As the cutting wire enters, penetrates, and continues to extend until exiting, the cutting wire experiences bowing due to the combined effects of cutting resistance, coolant impact, cutting speed, and the tension of the wire saw itself. This bowing varies across different segments, causing deviations between the cut size and the target or set size, resulting in significant gradients on the square rod surface. Based on the tension characteristics, bowing differences, cutting speed, and deviations of different segments throughout the squaring process of each crystal rod, the crystal rod is divided into different segments for analysis, calculation, and different compensation treatments to reduce the single-crystal squaring gradient. Therefore, this solution first provides a cutting method for reducing the single-crystal squaring gradient, characterized by the following steps:

[0006] Obtain the square root dimensions of multiple square bars;

[0007] Calculate the compensation value K based on the square root dimension data;

[0008] Calculate the cutting positioning dimension D based on the compensation value K;

[0009] Based on the cutting positioning dimension D, the single crystal to be cut is compensated and cut within the cutting compensation range.

[0010] Furthermore, the cutting compensation range is set to the entry segment of the single crystal.

[0011] Furthermore, the square root dimension data includes the square root dimension D1 of the infeed section, the square root dimension D2 of the main cutting section, and the square root dimension D3 of the exit section. The square root dimension D1 of the infeed section is set as the average of the maximum and minimum values ​​of the square root dimension of the infeed section. The square root dimension D2 of the main cutting section is set as the average of the maximum and minimum values ​​of the open size of the main cutting section. The square root dimension D3 of the exit section is set as the average of the maximum and minimum values ​​of the square root dimension of the exit section.

[0012] Furthermore, the step of calculating the compensation value K based on the square root dimension data includes,

[0013] Obtain the maximum deviation value ΔD of the square root dimension of each of the square bars;

[0014] Calculate the compensation value K, which is set as the average of the maximum deviation values ​​ΔD of the square root dimensions of the multiple square bars.

[0015] Furthermore, the step of obtaining the maximum deviation value ΔD of the square root dimension of each of the square bars includes,

[0016] Calculate the first deviation value ΔD1 = D2 - D1;

[0017] Calculate the second deviation value ΔD2 = D3 - D1;

[0018] If ΔD1≥ΔD2, the maximum deviation value ΔD is set to ΔD1; if ΔD1<ΔD2, the maximum deviation value ΔD is set to ΔD2.

[0019] Furthermore, in the step of calculating the cutting and positioning dimension D based on the compensation value K, the square root finished size of the single crystal is d, and D = d + K.

[0020] Furthermore, the step of performing compensated cutting on the single crystal to be cut within the cutting compensation range according to the cutting positioning size D includes:

[0021] Perform square root cutting within the cutting compensation range using the cutting positioning dimension D;

[0022] Complete the remaining cutting with the square root of the finished product size d.

[0023] This invention also provides a cutting system for reducing the square root gradient of a single crystal, comprising,

[0024] The data acquisition unit is used to acquire the square root dimensions of multiple square bars;

[0025] The data processing unit is used to calculate the compensation value K based on the square root dimension data;

[0026] The data compensation unit is used to calculate the cutting positioning dimension D based on the compensation value K;

[0027] The cutting unit is used to perform cutting compensation on the single crystal to be cut within the cutting compensation range according to the cutting positioning size D.

[0028] The present invention also provides an electronic device, including a memory, a processor, and one or more programs stored in the memory and executable on the processor, wherein when the one or more programs are executed by the processor, the electronic device performs the single crystal square root gradient reduction cutting method as described above.

[0029] The present invention also provides a computer-readable storage medium storing computer instructions that, when executed on a processor of an electronic device, cause the device containing the computer storage medium to perform the cutting method for reducing the square root gradient of a single crystal as described above.

[0030] The present invention also provides a single-crystal silicon square rod, which is prepared by the cutting method described above for reducing the single-crystal square root gradient, and the square root dimension deviation of the infeed section, the main cutting section and the exit section is less than 0.2 mm.

[0031] The advantages and positive effects of this invention are as follows: By adopting the above technical solution, the cutting difference between the infeed section and the main cutting section is reduced through cutting compensation during single crystal squaring, thereby reducing the surface gradient of the squaring cut. Within the infeed section of single crystal squaring cutting, the cutting line is cut to the compensated squaring finished size; in the main cutting section and the exit section of single crystal squaring, the cutting is performed to the squaring finished size, thus reducing the squaring size and silicon loss. Attached Figure Description

[0032] The above and other objects, features, and advantages of the present invention will become more apparent from the more detailed description of the embodiments of the invention in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same parts or steps.

[0033] Figure 1 This is a schematic diagram of a square bar.

[0034] Figure 2 This is a schematic flowchart of a cutting method for reducing the square root gradient of a single crystal according to an embodiment of the present invention.

[0035] Figure 3 This is a schematic diagram of the square root gradient of a single crystal in existing technology.

[0036] Figure 4 This is a schematic diagram of the square root gradient of a cutting method for reducing the square root gradient of a single crystal according to an embodiment of the present invention. Detailed Implementation

[0037] The present invention provides a cutting method, system, device and storage medium for reducing the square root gradient of single crystals. The embodiments of the present invention will be described below with reference to the accompanying drawings.

[0038] In the description of the embodiments of this invention, it should be understood that the terms "top," "bottom," etc., indicating orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. In the description of this invention, it should be noted that unless otherwise explicitly specified and limited, the terms "set" and "connected" should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral connection; it can refer to a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication of two elements. Those skilled in the art can understand the specific meaning of the above terms in this invention through specific circumstances.

[0039] In this embodiment, during the processing of single-crystal square rods, as the cutting wire enters, penetrates, and continues to extend until exiting, the cutting wire generates bowing due to the combined effects of cutting resistance, coolant impact, cutting speed, and the tension of the wire saw itself. This bowing varies across different segments, causing a deviation between the cut size and the target or set size, with different segments exhibiting different deviations, resulting in a significant gradient on the surface of the square rod. Based on the tension characteristics, bowing differences, cutting speed, and deviations of different segments throughout the entire process of squaring each crystal rod, the crystal rod is divided into different segments for analysis, calculation, and different compensation treatments to reduce the gradient during single-crystal squaring. For example, the target square rod to be squared may be designed as three segments, such as... Figure 1 As shown, AB is the entry segment, BC is the main cutting segment, and CD is the exit segment.

[0040] Therefore, this embodiment first provides a cutting method to reduce the square root gradient of a single crystal, such as... Figure 2 As shown, the process includes the following steps: obtaining the square root dimensions of multiple square bars; calculating the compensation value K based on the square root dimensions; calculating the cutting positioning dimension D based on the compensation value K; and performing cutting compensation on the single crystal to be cut within the cutting compensation range based on the cutting positioning dimension D.

[0041] When using a circular squaring machine, the cutting guide wheel drives the circular cutting line to rotate, the silicon rod moves horizontally, and the vertical cutting line cuts the silicon rod during its movement. If there is no wire bow, the squaring plane is parallel to the plane of the circular cutting line, resulting in good flatness. However, due to cutting resistance, the cutting line moves towards the direction of less resistance, gradually moving towards the rear end of the cut and the outer side of the silicon rod. Figure 3 As shown, in the AB infeed section, the arc length gradually increases from zero to a gradually increasing actual square root size, resulting in a larger gradient. In the BC main cutting section, the arc length gradually stabilizes, and the gradient remains stable. In the CD exit section, due to the reduced cutting speed, the arc length decreases, the actual square root size decreases, and the gradient decreases somewhat. Therefore, the gradient change along the axis of the silicon rod after square rooting is significant, while the gradient perpendicular to the axis of the silicon rod is negligible due to the small arc length generated by the small distance between the two vertical cutting guide wheels. In the technical solution of this application, the gradient along the axis of the square rod is reduced by compensating for the cutting positioning dimensions and performing cutting compensation within the compensation range.

[0042] Specifically, the cutting compensation range is set to the entry segment of the single crystal. That is, during square root cutting in the entry segment, the single crystal is cut using the compensated cutting positioning size D. During the main cutting segment and the exit segment, normal cutting is performed using the set square root size. Under normal cutting conditions, such as... Figure 3 As shown, during the cutting process of the single crystal in the entry segment AB, the cutting arc is relatively small. As the cutting continues, the cutting resistance increases, the cutting arc increases, the cutting path gradually shifts, and the cutting gradient shows an upward trend. During the cutting process of the main cutting segment BC, the cutting gradually stabilizes, and the cutting gradient shows a stable fluctuation trend. Therefore, cutting compensation is performed within the entry segment AB to reduce the cutting difference between the entry segment AB and the main cutting segment BC, thereby achieving the goal of reducing the cutting gradient.

[0043] S1. Obtain the square root dimensions of multiple square bars;

[0044] The compensation value K is determined based on data analysis of the square root dimensions of multiple square bars. There is no limit to the specific number of square bars; the more bars, the higher the accuracy of the compensation value K.

[0045] To improve the accuracy of the compensation value, preferably, the square root of the single crystal bar is the same as the length, diameter, and square root size of the single crystal to be cut. The square rooting process of the square bar and the single crystal to be cut must be the same, including the feed speed and rotational speed of the cutting wire, the cutting temperature, and the use of coolant, etc. By setting the same square rooting process, the arc of the cutting wire can be kept consistent, thereby ensuring the accuracy of the compensation value.

[0046] The single-crystal squaring process includes an infeed section, a main cutting section, and an exit section. These sections are divided according to their length ratio based on the cutting process. The squaring dimensions include the squaring dimension D1 of the infeed section, the squaring dimension D2 of the main cutting section, and the squaring dimension D3 of the exit section. The squaring dimension D1 of the infeed section is set as the average of the maximum and minimum values ​​of the infeed section's squaring dimension; the squaring dimension D2 of the main cutting section is set as the average of the maximum and minimum values ​​of the main cutting section's squaring dimension; and the squaring dimension D3 of the exit section is set as the average of the maximum and minimum values ​​of the exit section's squaring dimension.

[0047] S2. Calculate the compensation value K based on the square root dimension data;

[0048] S21. Obtain the maximum deviation value ΔD of the square root dimension of each square bar;

[0049] Calculate the first deviation value ΔD1, which is the deviation between the square root dimension of the infeed section and the main cutting section. ΔD1 =

[0050] D2-D1;

[0051] Calculate the second deviation value ΔD2, which is the deviation of the square root dimension between the entry and exit sections. ΔD2=

[0052] D3-D3;

[0053] If ΔD1≥ΔD2, the maximum deviation value ΔD is set to ΔD1; if ΔD1<ΔD2, the maximum deviation value ΔD is set to ΔD2.

[0054] S22. Calculate the compensation value K, which is set as the average value of the maximum deviation value ΔD of the square root dimension of multiple square bars.

[0055] The compensation value K ranges from 0.2 to 1 mm.

[0056] S3. Calculate the cutting positioning dimension D based on the compensation value K;

[0057] The cutting positioning dimension D = d + K, where d is the square root size of the single crystal. The placement of the cutting line during the infeed section is based on this positioning dimension. Since grinding is required after the single crystal is square-rooted, the square root size is larger than the finished product size. If the finished product size is 209mm, the single crystal square root size is set to 210mm. Under ideal processing conditions, only 1mm needs to be ground away in the subsequent grinding process. In existing technologies, the square root process directly sets the cutting positioning dimension to 210mm. However, due to the significant gradient formed on the surface of the square rod during the square root process, the square root size on the surface of the square rod may exceed 210mm in some areas, such as 211mm. Therefore, 2mm needs to be ground away in the subsequent grinding process, resulting in silicon loss. In this step, compensation is directly applied to the square root finished product size of the single crystal. The positioning and cutting are performed using the compensated square root finished product size, reducing the square root size. This reduces the amount of silicon material that needs to be ground in the subsequent grinding process, thereby reducing silicon loss, saving time, and improving work efficiency.

[0058] S4. Based on the cutting positioning size D, perform cutting compensation on the single crystal to be cut within the cutting compensation range;

[0059] In the infeed section of the single-crystal square root cutting process, the cutting line is cut with a cutting positioning dimension D. In the main cutting section and the exit section, the cutting is performed with the finished square root dimension d of the single crystal. During the infeed section cutting, the cutting guide wheel moves the cutting line towards the outside of the silicon rod, cutting with the cutting positioning dimension D. At this time, the square root dimension is relatively large. After the infeed section cutting is completed, the cutting guide wheel moves the cutting line towards the inside of the silicon rod, completing the subsequent cutting with the finished square root dimension. At this time, the square root dimension is relatively small. By performing cutting compensation within the infeed section, the deviation of the square root dimension between the infeed section and the main cutting section is reduced, thereby reducing the cutting gradient of the single crystal. Figure 4 As shown.

[0060] Example 1: A cutting method for reducing the square root gradient of a single crystal, used for cutting a single crystal with a length of 900mm and a diameter of 310mm, setting the square root size to 210mm, and the finished square root size of the single crystal to 209mm, includes the following steps:

[0061] S1. Obtain the square root dimensions of multiple square bars;

[0062] Thirty square bars were selected, each with a single crystal length of 900 mm and a diameter of 310 mm, and the square root size was set to 210 mm. The square rooting process for the 30 square bars was the same as that for the single crystal to be cut, including the feed rate and rotational speed of the cutting wire, the cutting temperature, and the use of coolant, etc.

[0063] The entry section, main cutting section, and exit section are divided according to the proportion of single crystal length based on the cutting process. The entry section is set to 10% of the single crystal length, which is 90mm; the main cutting section is set to 85% of the single crystal length, which is 765mm; and the exit section is set to 5% of the single crystal length, which is 45mm.

[0064] The square root dimensions include the square root dimension D1 of the infeed section, the square root dimension D2 of the main cutting section, and the square root dimension D3 of the exit section. The square root dimension D1 of the infeed section is set as the average of the maximum and minimum values ​​of the square root dimension of the infeed section; the square root dimension D2 of the main cutting section is set as the average of the maximum and minimum values ​​of the open size of the main cutting section; and the square root dimension D3 of the exit section is set as the average of the maximum and minimum values ​​of the square root dimension of the exit section.

[0065] S2. Calculate the compensation value K based on the square root dimension data;

[0066] S21. Obtain the maximum deviation value ΔD of the square root dimension of each square bar;

[0067] Calculate the first deviation value ΔD1, which is the deviation between the square root dimension of the infeed section and the main cutting section. ΔD1 =

[0068] D2-D1;

[0069] Calculate the second deviation value ΔD2, which is the deviation of the square root dimension between the entry and exit sections. ΔD2=

[0070] D3-D1;

[0071] If ΔD1≥ΔD2, the maximum deviation value ΔD is set to ΔD1; if ΔD1<ΔD2, the maximum deviation value ΔD is set to ΔD2.

[0072] S22. Calculate the compensation value K, which is set as the average value of the maximum deviation value ΔD of the square root dimension of multiple square bars.

[0073] The maximum deviation of the square root dimension of multiple square bars is ΔD = 0.2, i.e., K = 0.2.

[0074] S3. Calculate the cutting positioning dimension D based on the compensation value K;

[0075] The cutting positioning dimension D = d + K = 209 + 0.2 = 209.2 mm. The position of the cutting line during the entry section cutting is defined by this cutting positioning dimension.

[0076] S4. Based on the cutting positioning size D, perform cutting compensation on the single crystal to be cut within the cutting compensation range;

[0077] Within the 90mm cutting range of the single-crystal squaring entry section, the cutting line is cut with a cutting positioning dimension D = 209.2. The main cutting section and exit section of the single-crystal squaring are cut with a finished squaring dimension of 209mm. By performing cutting compensation within the entry section, the squaring dimension deviation of the entry and main cutting sections is reduced, the cutting gradient of the single crystal is decreased, the squaring dimension is reduced, and the silicon loss is reduced.

[0078] Example 2: A cutting method for reducing the square root gradient of a single crystal, used for cutting a single crystal with a length of 950 mm and a diameter of 330 mm, setting the square root size to 220 mm, and the finished square root size of the single crystal to 219 mm, includes the following steps:

[0079] S1. Obtain the square root dimensions of multiple square bars;

[0080] Forty square bars were selected, each with a single crystal length of 950 mm and a diameter of 330 mm, and the square root size was set to 220 mm. The square rooting process for the 40 square bars was the same as that for the single crystal to be cut, including the feed rate and rotational speed of the cutting wire, the cutting temperature, and the use of coolant, etc.

[0081] The entry section, main cutting section, and exit section are divided according to the length ratio based on the cutting process. The entry section is set to 10% of the single crystal length, which is 95mm; the main cutting section is set to 85% of the single crystal length, which is 807.5mm; and the exit section is set to 5% of the single crystal length, which is 47.5mm.

[0082] The square root dimensions include the square root dimension D1 of the infeed section, the square root dimension D2 of the main cutting section, and the square root dimension D3 of the exit section. The square root dimension D1 of the infeed section is set as the average of the maximum and minimum values ​​of the square root dimension of the infeed section; the square root dimension D2 of the main cutting section is set as the average of the maximum and minimum values ​​of the open size of the main cutting section; and the square root dimension D3 of the exit section is set as the average of the maximum and minimum values ​​of the square root dimension of the exit section.

[0083] S2. Calculate the compensation value K based on the square root dimension data;

[0084] S21. Obtain the maximum deviation value ΔD of the square root dimension of each square bar;

[0085] Calculate the first deviation value ΔD1, which is the deviation between the square root dimension of the infeed section and the main cutting section. ΔD1 =

[0086] D2-D1;

[0087] Calculate the second deviation value ΔD2, which is the deviation of the square root dimension between the entry and exit sections. ΔD2=

[0088] D3-D1;

[0089] If ΔD1≥ΔD2, the maximum deviation value ΔD is set to ΔD1; if ΔD1<ΔD2, the maximum deviation value ΔD is set to ΔD2.

[0090] S22. Calculate the compensation value K, which is set as the average value of the maximum deviation value ΔD of the square root dimension of multiple square bars.

[0091] The maximum deviation of the square root dimension of multiple square bars is ΔD = 0.6, i.e., K = 0.6.

[0092] S3. Calculate the cutting positioning dimension D based on the compensation value K;

[0093] The cutting positioning dimension D = d + K = 219 + 0.6 = 219.6 mm. The position of the cutting line during the entry section cutting is defined by this cutting positioning dimension.

[0094] S4. Based on the cutting positioning size D, perform cutting compensation on the single crystal to be cut within the cutting compensation range;

[0095] Within the 95mm cutting range of the single-crystal squaring entry section, the cutting line is cut with a cutting positioning dimension D = 219.6. The main cutting section and exit section of the single-crystal squaring are cut with a finished squaring dimension of 219mm. By performing cutting compensation within the entry section, the squaring dimension deviation of the entry and main cutting sections is reduced, the cutting gradient of the single crystal is decreased, the squaring dimension is reduced, and the silicon loss is reduced.

[0096] Example 3: A cutting method for reducing the square root gradient of a single crystal, used for cutting a single crystal with a length of 1000mm and a diameter of 360mm, setting the square root size to 240mm, and the finished square root size of the single crystal to 239mm, includes the following steps:

[0097] S1. Obtain the square root dimensions of multiple square bars;

[0098] Fifty square bars were selected, each with a single crystal length of 1000mm and a diameter of 360mm, and the square root size was set to 240mm. The square rooting process for the 50 square bars was the same as that for the single crystal to be cut, including the feed rate and rotational speed of the cutting wire, the cutting temperature, and the use of coolant, etc.

[0099] The entry section, main cutting section, and exit section are divided according to the length ratio based on the cutting process. The entry section is set to 10% of the single crystal length, which is 100mm; the main cutting section is set to 85% of the single crystal length, which is 850mm; and the exit section is set to 5% of the single crystal length, which is 50mm.

[0100] The square root dimensions include the square root dimension D1 of the infeed section, the square root dimension D2 of the main cutting section, and the square root dimension D3 of the exit section. The square root dimension D1 of the infeed section is set as the average of the maximum and minimum values ​​of the square root dimension of the infeed section; the square root dimension D2 of the main cutting section is set as the average of the maximum and minimum values ​​of the open size of the main cutting section; and the square root dimension D3 of the exit section is set as the average of the maximum and minimum values ​​of the square root dimension of the exit section.

[0101] S2. Calculate the compensation value K based on the square root dimension data;

[0102] S21. Obtain the maximum deviation value ΔD of the square root dimension of each square bar;

[0103] Calculate the first deviation value ΔD1, which is the deviation between the square root dimension of the infeed section and the main cutting section. ΔD1 =

[0104] D2-D1;

[0105] Calculate the second deviation value ΔD2, which is the deviation of the square root dimension between the entry and exit sections. ΔD2=

[0106] D3-D1;

[0107] If ΔD1≥ΔD2, the maximum deviation value ΔD is set to ΔD1; if ΔD1<ΔD2, the maximum deviation value ΔD is set to ΔD2.

[0108] S22. Calculate the compensation value K, which is set as the average value of the maximum deviation value ΔD of the square root dimension of multiple square bars.

[0109] The maximum deviation of the square root dimension of multiple square bars is ΔD = 0.6, which means K = 0.9.

[0110] S3. Calculate the cutting positioning dimension D based on the compensation value K;

[0111] The cutting positioning dimension D = d + K = 239 + 0.9 = 239.9 mm. The position of the cutting line during the entry section cutting is defined by this cutting positioning dimension.

[0112] S4. Based on the cutting positioning size D, perform cutting compensation on the single crystal to be cut within the cutting compensation range;

[0113] Within a 100mm cutting range of the single-crystal squaring entry section, the cutting line is cut with a cutting positioning dimension D = 239.9. The main cutting section and exit section of the single-crystal squaring are cut with a finished squaring dimension of 239mm. By performing cutting compensation within the entry section, the squaring dimension deviation of the entry and main cutting sections is reduced, the cutting gradient of the single crystal is decreased, the squaring dimension is reduced, and the silicon loss is reduced.

[0114] The present invention also provides a cutting system for reducing the square root gradient of a single crystal, comprising a data acquisition unit, a data processing unit, a data compensation unit, and a cutting unit.

[0115] The data acquisition unit is used to acquire the square root dimensions of multiple square bars. The data acquisition unit needs to screen the multiple square bars, ensuring that the selected square bars have the same length, diameter, and set square root dimensions as the single crystal to be cut. The square rooting process of the square bars must be identical to that of the single crystal to be cut, including the feed rate and rotational speed of the cutting wire, cutting temperature, and coolant usage, etc. By setting the same square rooting process, the arc of the cutting wire can be kept consistent, thereby ensuring the accuracy of the compensation value. The square root dimension data acquired by the data acquisition unit includes the square root dimension D1 of the entry section, the square root dimension D2 of the main cutting section, and the square root dimension D3 of the exit section. The square root dimension D1 of the entry section is set as the average of the maximum and minimum values ​​of the square root dimension of the entry section; the square root dimension D2 of the main cutting section is set as the average of the maximum and minimum values ​​of the open size of the main cutting section; and the square root dimension D3 of the exit section is set as the average of the maximum and minimum values ​​of the square root dimension of the exit section.

[0116] The data processing unit calculates the compensation value K based on the square root dimension data. The data processing unit calculates the first deviation value ΔD1, which is the deviation between the square root dimension of the entry section and the main cutting section, ΔD1 = D1 - D2. It also calculates the second deviation value ΔD2, which is the deviation between the square root dimension of the entry section and the exit section, ΔD2 = D1 - D3. If ΔD1 ≥ ΔD2, ΔD1 is set as the maximum deviation value ΔD. If ΔD1 < ΔD2, ΔD2 is set as the maximum deviation value ΔD. The compensation value K is set as the average of the maximum deviation values ​​ΔD of the square root dimensions of the multiple square bars.

[0117] The data compensation unit is used to calculate the cutting positioning dimension D based on the compensation value K. The cutting positioning dimension D = d + K, where d is the set square root dimension of the single crystal.

[0118] The cutting unit is used to perform cutting compensation on the single crystal to be cut within the cutting compensation range according to the cutting positioning size D. In the entry section of the single crystal square root cutting, the cutting line is cut according to the cutting positioning size D, and in the main cutting section and exit section of the single crystal square root cutting, the cutting is performed according to the set square root size d.

[0119] The present invention also provides an electronic device, including a memory, a processor, and one or more programs stored in the memory and executable on the processor, wherein when the one or more programs are executed by the processor, the electronic device performs the single crystal square root gradient reduction cutting method as described above.

[0120] The present invention also provides a computer-readable storage medium storing computer instructions that, when executed on a processor of an electronic device, cause the device containing the computer storage medium to perform the cutting method for reducing the square root gradient of a single crystal as described above.

[0121] The aforementioned functional units can be integrated into a single processing module, or each unit can exist as a separate physical entity, or two or more units can be integrated into a single module. The integrated module can be implemented in hardware or as a software functional unit.

[0122] When integrated modules are implemented as software functional units, they can be stored in a computer-readable storage medium. The technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the single-crystal square root gradient reduction cutting method described in the embodiments of this application.

[0123] The aforementioned storage media include various media that can store program code, such as USB flash drives, portable hard drives, read-only memory, random access memory, magnetic disks, or optical disks.

[0124] The present invention also provides a single-crystal silicon square rod, which is prepared by the cutting method described above for reducing the single-crystal square root gradient, and the square root dimension deviation of the infeed section, the main cutting section and the exit section is less than 0.2 mm.

[0125] The advantages and positive effects of this invention are:

[0126] In single-crystal squaring, cutting compensation is performed at the infeed stage to reduce the cutting difference between the infeed and main cutting stages, thereby lowering the surface gradient of the squaring cut. Within the infeed stage of single-crystal squaring, the cutting line is cut to the compensated squaring finished size. At the main cutting and exit stages, the cutting is performed to the squaring finished size, reducing the squaring size. In subsequent grinding processes, less silicon material needs to be ground, thus reducing silicon loss, saving time, and improving work efficiency.

[0127] The embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. It should be noted that implementations not illustrated or described in the drawings or the main text of the specification are forms known to those skilled in the art and have not been described in detail. Furthermore, the definitions of the various components described above are not limited to the specific structures, shapes, or methods mentioned in the embodiments, and those skilled in the art can easily modify or substitute them.

[0128] The embodiments of the present invention have been described in detail above, but the content described is only a preferred embodiment of the present invention and should not be considered as limiting the scope of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the patent coverage of the present invention.

Claims

1. A cutting method for reducing the square root gradient of a single crystal, characterized in that: Includes the following steps, Obtain the square root dimensions of multiple square bars; Calculate the compensation value K based on the square root dimension data; Calculate the cutting positioning dimension D based on the compensation value K; Based on the cutting positioning dimension D, the single crystal to be cut is compensated and cut within the cutting compensation range.

2. The cutting method for reducing the square root gradient of a single crystal according to claim 1, characterized in that: The cutting compensation range is set to the entry segment of the single crystal.

3. A cutting method for reducing the square root gradient of a single crystal according to claim 1 or 2, characterized in that: The square root dimension data includes the square root dimension D1 of the infeed section, the square root dimension D2 of the main cutting section, and the square root dimension D3 of the exit section. The square root dimension D1 of the infeed section is set as the average of the maximum and minimum values ​​of the square root dimension of the infeed section. The square root dimension D2 of the main cutting section is set as the average of the maximum and minimum values ​​of the open size of the main cutting section. The square root dimension D3 of the exit section is set as the average of the maximum and minimum values ​​of the square root dimension of the exit section.

4. The cutting method for reducing the square root gradient of a single crystal according to claim 3, characterized in that: The step of calculating the compensation value K based on the square root dimension data includes, Obtain the maximum deviation value ΔD of the square root dimension of each of the square bars; Calculate the compensation value K, which is set as the average of the maximum deviation values ​​ΔD of the square root dimensions of the multiple square bars.

5. The cutting method for reducing the square root gradient of a single crystal according to claim 4, characterized in that: In the step of obtaining the maximum deviation value ΔD of the square root dimension of each of the square bars, include, Calculate the first deviation value ΔD1 = D2 - D1; Calculate the second deviation value ΔD2 = D3 - D1; If ΔD1≥ΔD2, the maximum deviation value ΔD is set to ΔD1; if ΔD1<ΔD2, the maximum deviation value ΔD is set to ΔD2.

6. A cutting method for reducing the square root gradient of a single crystal according to any one of claims 1-2 and 4-5, characterized in that: In the step of calculating the cutting and positioning dimension D based on the compensation value K, the square root finished size of the single crystal is d, and D = d + K.

7. The cutting method for reducing the square root gradient of a single crystal according to claim 6, characterized in that: The step, based on the cutting positioning dimension D, involves compensating the single crystal to be cut within the cutting compensation range, including: Perform square root cutting within the cutting compensation range using the cutting positioning dimension D; Complete the remaining cutting with the square root of the finished product size d.

8. A cutting system for reducing the square root gradient of a single crystal, characterized in that: include, The data acquisition unit is used to acquire the square root dimensions of multiple square bars; The data processing unit is used to calculate the compensation value K based on the square root dimension data; The data compensation unit is used to calculate the cutting positioning dimension D based on the compensation value K; The cutting unit is used to perform cutting compensation on the single crystal to be cut within the cutting compensation range according to the cutting positioning size D.

9. An electronic device, characterized in that: The device includes a memory, a processor, and one or more programs stored in the memory and executable on the processor, wherein when the processor executes the one or more programs, the electronic device performs the cutting method for reducing the square root gradient of a single crystal as described in any one of claims 1-7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions that, when executed on a processor of an electronic device, cause the device containing the computer storage medium to perform the cutting method for reducing the square root gradient of a single crystal as described in any one of claims 1-7.

11. A single-crystal silicon square rod, prepared by the cutting method for reducing the square root gradient of the single crystal as described in any one of claims 1-7, characterized in that: The square root deviation of the entry section, main cutting section and exit section is less than 0.2 mm.

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