Jet type liquid cooling heat dissipation device for electronic chip and working method of jet type liquid cooling heat dissipation device

Abstract

The invention relates to a jet type liquid cooling heat dissipation device for an electronic chip and a working method of the jet type liquid cooling heat dissipation device. The device comprises a chip carrier provided with an electronic chip, a base, a jet flow guide plate, a backflow collection plate, a cover plate and a connector, the base is installed on the chip carrier in a sealed mode, and the jet flow guide plate, the backflow collecting plate and the cover plate are sequentially stacked and mutually connected in a sealed mode and are integrally fixed to the base. A first through hole and a second through hole are formed in the position, above the electronic chip, of the jet flow guide plate, a cooling liquid through hole and a cooling liquid guide hole are formed in the backflow collection plate, and a first cooling liquid connector and a second cooling liquid connector are formed in the cover plate. Compared with the prior art, through the collaborative design of the jet flow guide plate and the backflow collection plate, cooling liquid directly impacts the surface of an electronic chip in a high-speed jet flow mode, and therefore the local heat exchange efficiency is remarkably improved; and meanwhile, a backflow path is optimized, flowing resistance is reduced, high heat exchange performance and low pressure drop are both considered, and the heat dissipation device is suitable for efficient heat dissipation of high-heat-flux electronic chips.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic device thermal management, in particular to a jet flow liquid cooling heat dissipation device for electronic chips and a working method thereof, which is especially suitable for high-efficiency heat dissipation of high heat flux density electronic chips. BACKGROUND

[0002] With the continuous improvement of the integration of electronic chips and the continuous increase of the working frequency, the heat flux density generated per unit area is significantly increased, and the heat generated during the operation of the chip is dramatically increased. If the heat generated during the operation cannot be timely and effectively dissipated, the junction temperature of the chip will continue to rise, thereby causing performance degradation, unstable operation, and even device failure. In order to meet the heat dissipation requirements of high heat flux density electronic chips, liquid cooling technology has gradually become the mainstream solution due to its excellent heat exchange performance, and jet flow cooling has attracted widespread attention because it can form local high turbulence on the surface of the electronic chip and significantly improve the heat transfer coefficient.

[0003] However, the jet flow path of the existing jet flow liquid cooling structure often does not directly act on the surface of the electronic chip, but is separated by an intermediate plate or a complex microstructure, which weakens the impact and disturbance effect of the cooling liquid. In some designs, the nozzle structure is simple and lacks optimization of the jet angle, diffusion mode and jet height, resulting in insufficient local heat exchange capacity. In addition, the flow path of the cooling liquid lacks targeted design and cannot be flexibly adjusted according to the installation conditions. The matching between the structure components of some devices is poor, and it is difficult to achieve high efficiency and universality under different electronic chip sizes and layout conditions, so the integration and adaptability are insufficient.

[0004] Therefore, there is an urgent need for a jet flow liquid cooling heat dissipation device that can balance high heat exchange performance and low pressure drop. SUMMARY

[0005] The purpose of the present application is to overcome the defects of the prior art and provide a jet flow liquid cooling heat dissipation device for electronic chips and a working method thereof. In view of the problems of indirect jet flow path, insufficient local heat exchange, high flow resistance, and low integration of the existing structure, an optimization flow path scheme of high-speed jet flow directly on the surface of the electronic chip and cooperation with shunt-jet-flow-reflow collection is proposed, thereby further improving the heat exchange performance, reducing the flow resistance, and improving the integration and universality of the liquid cooling heat dissipation device to adapt to high heat flux density chips of different sizes and layouts.

[0006] The purpose of the present application can be achieved by the following technical solutions:

[0007] The first object of the present application is to provide a liquid jet cooling heat dissipation device for electronic chips, which comprises a chip carrier, a base, a jet flow guide plate, a backflow collection plate, a cover plate and a connector; the electronic chip is mounted on the chip carrier; the base is provided with a base cavity for accommodating the electronic chip and exposing the heat-emitting surface of the electronic chip to a cooling liquid flow area, so as to realize direct liquid cooling heat dissipation of the electronic chip; the base is connected to the chip carrier, the jet flow guide plate is connected to the base, the backflow collection plate is connected to the jet flow guide plate, and the cover plate is connected to the backflow collection plate; the chip carrier, the base, the jet flow guide plate, the backflow collection plate and the cover plate are sequentially connected to form a cooling liquid channel; the cover plate is provided with a cooling liquid first interface and a cooling liquid second interface for connecting the connector to realize the inflow and outflow of the cooling liquid.

[0008] Further, the base is sealingly fixed to the chip carrier, the jet flow guide plate is sealingly fixed to the base, the backflow collection plate is sealingly fixed to the jet flow guide plate, and the cover plate is sealingly fixed to the backflow collection plate.

[0009] Further, the base cavity, the chip carrier and the jet flow guide plate together define a jet chamber.

[0010] Further, the jet plate groove of the jet flow guide plate and the backflow collection plate together define a first fluid flow cavity.

[0011] Further, the backflow plate groove of the backflow collection plate and the cover plate together define a second fluid chamber.

[0012] Further, the chip carrier refers to a structure for carrying chips and providing mechanical support and / or electrical connection for the chips; the chip carrier is preferably a circuit board, which is a plate-shaped carrying structure for realizing chip mounting and electrical connection, including but not limited to printed circuit boards, ceramic substrates, metal substrates or packaging substrates, etc.

[0013] Further, the electronic chip can be various types of high heat flux chips, including but not limited to CPUs, GPUs, TPUs, FPGAs, ASICs, laser emitting chips, network communication chips, radio frequency front-end chips, image sensor chips, etc.; according to specific application requirements, the electronic chip can be separately arranged or integrated in the form of a multi-chip module to meet different performance, power consumption and thermal management requirements.

[0014] Preferably, the size and shape of the base cavity can be matched and designed according to the shape and mounting mode of the electronic chip to ensure stable mounting and improve heat dissipation efficiency.

[0015] Further, the connection mode between the joint and the cooling liquid first interface and the cooling liquid second interface can be selected according to installation requirements and use environment, preferably threaded connection or welding connection, also including buckle connection, quick plug connection, flange connection or adhesive connection and the like; the threaded connection is convenient for disassembly and maintenance, the welding connection can improve the structural strength and sealing performance, the buckle connection and the quick plug connection can realize quick assembly and replacement, the flange connection is suitable for high-flow or high-pressure cooling system; the adhesive connection can select sealant, structural adhesive, epoxy adhesive or other adhesives with temperature resistance, pressure resistance and corrosion resistance, and the joint and the interface are firmly combined by coating or pouring, and reliable sealing is formed.

[0016] Further, the joint can be a straight-through joint, an elbow joint, a tee joint or a quick plug joint, and the material thereof can be selected from metal, stainless steel, copper alloy or high-strength engineering plastic according to the type of cooling liquid and working environment, so as to ensure corrosion resistance, pressure resistance and long-term sealing reliability.

[0017] Preferably, the joint selects a right-angle lotus-shaped joint, which has high flexibility in pipeline arrangement, is convenient for hose connection and direction adjustment, can adapt to the installation direction and space limitation of different cooling pipelines, and thus improves the convenience and flexibility of overall assembly; in the installation process, raw material belts, sealants, sealing gaskets, O-rings or other sealing accessories with temperature resistance, pressure resistance and corrosion resistance can be used in combination according to the connection mode and use environment, so as to form a reliable sealing barrier at the connection interface, further improve the sealing reliability of the cooling liquid flow path, and prevent cooling liquid leakage caused by vibration, thermal expansion and contraction or long-term operation.

[0018] Further, the cooling liquid first interface and the cooling liquid second interface include but are not limited to two, and can also be set as multiple inlets and outlets according to the structural requirements of the cooling system, and the arrangement mode and number of the cooling liquid interfaces can be adjusted according to the design requirements of the cooling circuit, the installation space and the flow distribution requirements, so as to adapt to different forms of flow path layout.

[0019] Further, the front inner side of the jet flow guide plate is provided with a jet flow plate groove, and one or more of a plurality of first through holes, second through holes and slits are arranged in the jet flow plate groove; wherein the arrangement positions of the first through holes and the second through holes correspond to the electronic chip and the surrounding area thereof, the first through holes and the second through holes can be used to realize the jet flow function or the backflow function of the cooling liquid, or one type of through hole can be used as a jet flow hole to spray cooling liquid to the surface of the electronic chip, and the other type of through hole can be used as a backflow hole to guide the heat-exchanged cooling liquid to flow out of the heat dissipation device; the slits can independently bear the jet flow function or the backflow function of the cooling liquid, or can be used in combination with the first through holes and / or the second through holes.

[0020] Further, the arrangement positions of the first through holes, the second through holes and / or the slits correspond to the area where the electronic chip is located, or correspond to the electronic chip and its surrounding area, so as to ensure that the cooling liquid can directly act on the surface of the electronic chip or cover the electronic chip and its adjacent area, thereby realizing efficient heat exchange for the high heat flux density area.

[0021] Further, the arrangement mode of the first through holes and the second through holes can adopt a linear arrangement or a staggered arrangement; in the linear arrangement or the staggered arrangement, the first through holes and the second through holes can be alternately arranged in the same row or arranged in different rows respectively. By flexibly adjusting the arrangement mode and distribution of the first through holes and the second through holes, the injection and return flow paths of the cooling liquid can be optimized, the flow field distribution can be improved, and the heat exchange uniformity and overall heat dissipation efficiency can be improved.

[0022] Further, a plurality of division strips can be arranged in the slits, and the division strips separate the slits into a plurality of interval sections; the interval sections can be uniformly distributed or non-uniformly distributed in the same slit, and the interval sections on different slits can be arranged in alignment or staggered in the width direction of the slits. The length, width and spacing between adjacent slits of the slits can be adjusted according to the cooling liquid flow demand, the injection or return flow path design and the target heat exchange area size; the length and number of the division strips can also be flexibly designed to adapt to different fluid distribution requirements and structural strength requirements. By the combined arrangement of the slits, the division strips and the interval sections, the flow velocity distribution can be optimized while ensuring smooth injection or return of the cooling liquid, and local scouring can be slowed down, thereby helping to form a uniform heat exchange flow field on the surface of the electronic chip and improving the heat exchange efficiency.

[0023] Further, at least any one of the first through holes, the second through holes and the slits coaxially surrounds a nozzle structure towards the side of the electronic chip, and the cross-sectional shape of the nozzle structure along the flow direction of the cooling liquid can be outwardly expanding, inwardly contracting or straight, or any combination of the above shapes, including straight first and then outwardly expanding, outwardly expanding first and then straight, straight first and then inwardly contracting, inwardly contracting first and then straight, and the like, so as to adapt to different space layouts and heat exchange requirements.

[0024] Further, the total height of the nozzle structure is denoted as H, and H≥0; in particular, when H≠0: the starting position of the outward expansion or inward contraction of the nozzle structure is denoted as h1, and the ratio of h1 to H ranges from 0 to 1; the distance from the bottom end of the nozzle structure to the surface of the electronic chip is denoted as h2, and h2>0; the included angle a between the vertical wall of the nozzle structure and the outward expansion or inward contraction opening is used to represent the degree of outward expansion or inward contraction of the nozzle structure, and a≥0; in particular, when a>0: the nozzle structure is of the outward expansion type when the flow area gradually increases along the flow direction of the cooling liquid, and is of the inward contraction type when the flow area gradually decreases along the flow direction of the cooling liquid; the nozzle structure is of the straight cylinder type when a=0.

[0025] Further, the nozzle structure of the outward expansion type can form a diffusion flow field at the jetting outlet, so that the cooling liquid covers a wider range when reaching the surface of the electronic chip, which helps to improve the heat exchange uniformity of the large-area region; the nozzle structure of the inward contraction type can contract the flow beam during the jetting process, so as to enhance the impact speed and local turbulence intensity of the cooling liquid, thereby improving the local heat exchange capacity of the higher heat flux density region; the nozzle structure of the straight cylinder type can stably and directly deliver the cooling liquid to the surface of the electronic chip due to the parallelism between the passage wall and the flow direction, so as to reduce the speed attenuation and maintain a relatively high impact flow speed, thereby realizing stable and uniform heat exchange effect. According to the heat flux distribution characteristics of the electronic chip, the structure forms of the outward expansion type, the inward contraction type or the straight cylinder type can be reasonably selected, or a plurality of forms can be combined for application, so as to take into account the heat exchange uniformity of the large-area region and the heat dissipation enhancement demand of the local high heat flux density region.

[0026] Further, at least any one of the first through hole, the second through hole and the slit is coaxially surrounded by a flow guide structure towards one side of the backflow collection plate, the height of the flow guide structure is the same as the depth of the backflow plate groove, so that the upper end surface is flush with the abutting surface of the backflow collection plate, thereby forming a continuous and stable cooling liquid passage after assembly of the components.

[0027] Further, the front surface of the backflow collection plate is provided with a backflow plate groove, and a plurality of cooling liquid through holes and cooling liquid flow guide holes are arranged in the backflow plate groove; the cooling liquid through holes are used for communication with the cooling liquid first interface or the cooling liquid second interface, so as to realize the inflow or outflow of the cooling liquid in the heat dissipation device; the cooling liquid flow guide holes are used for collecting and discharging the heat exchanged cooling liquid or distributing the cooling liquid to a plurality of flow paths.

[0028] Further, the cooling liquid through hole towards one side of the cover plate can be coaxially surrounded by a cooling liquid through hole flow guide structure, the height of the cooling liquid through hole flow guide structure is the same as the depth of the backflow plate groove, so that the upper end surface is flush with the abutting surface of the cover plate, so as to ensure the communication stability and sealing integrity of the cooling liquid passage after installation of the cover plate.

[0029] Further, the cooling liquid guide hole is arranged corresponding to the first through hole, the second through hole or the slit provided with the guide structure on the jet guide plate, and is matched with the first through hole, the second through hole or the slit in shape, size and distribution and is in communication with the first through hole, the second through hole or the slit. The design can keep good alignment and flow continuity of the cooling liquid when entering or leaving the jet flow channel, and reduce flow resistance and energy loss.

[0030] Further, the jet head structure, the guide structure and the cooling liquid through hole guide structure can be regarded as hollow guide walls coaxially arranged around the corresponding through hole in structure form, and the processing mode can be realized by different processes according to material properties and precision requirements, including integrated milling forming, numerical control precision cutting, stamping combined with secondary forming and other integrated processing modes. For structures with complex cross-sectional shape or requiring batch customization, 3D printing, metal injection molding and other additive manufacturing or precision forming processes can also be used.

[0031] Further, the inner diameter of the guide structure and the inner diameter of the cooling liquid through hole guide structure are preferably consistent with the inner diameter of the corresponding through hole, so as to ensure smooth transition of the cooling liquid and reduce local resistance loss. It can be understood as a guide wall coaxially sleeved outside the periphery of the corresponding through hole or slit, which plays a role in extending the flow channel and stabilizing the flow direction, and can be used in structure to effectively separate the inflow passage and the outflow passage of the cooling liquid, thereby avoiding direct mixing of hot and cold fluids and improving heat exchange efficiency.

[0032] Further, between adjacent jet head structures or guide structures, a separation gap can be provided according to design requirements to form independent jet units, or the separation can be cancelled to integrate them, so as to simplify the processing technology and improve the overall structural strength.

[0033] Further, the cross-sectional shape of the first through hole, the second through hole or the cooling liquid guide hole can be circular, parallelogram, triangle, rounded rectangle, ellipse and the like, wherein the circular shape is commonly used in practical application due to convenient processing and small flow resistance; the cross-sectional shape of the slit can be parallelogram or rounded rectangle.

[0034] Further, the connection mode between the base and the chip carrier, between the jet guide plate and the base, between the backflow collection plate and the jet guide plate, and between the cover plate and the backflow collection plate can be selected from one-piece forming, threaded connection, welding connection or buckle connection according to actual requirements and processing technology. The one-piece forming can reduce the assembly link and improve the overall sealing performance; the threaded connection or the buckle connection is convenient for disassembly and maintenance; the welding connection is suitable for occasions with high requirements for sealing performance and structural strength.

[0035] Further, when the base and the chip carrier are fixed by screw connection, the chip carrier is provided with a plurality of carrier threaded holes, and the base is provided with a plurality of base through holes. The carrier threaded holes can be threaded through holes or threaded blind holes, and the base through holes are preferably non-threaded through holes. The first screw can be screwed into the carrier threaded holes through the base through holes, so as to realize the stable connection of the base and the chip carrier.

[0036] Further, when the base and the chip carrier are fixed by screw connection, the chip carrier is provided with a plurality of carrier threaded holes, and the base is provided with a plurality of base through holes. The carrier threaded holes can be threaded through holes or threaded blind holes, and the base through holes are preferably non-threaded through holes. The first screw can be screwed into the carrier threaded holes through the base through holes, so as to realize the stable connection of the base and the chip carrier.

[0037] Further, when the base and the chip carrier are fixed by screw connection, the chip carrier is provided with a plurality of carrier threaded holes, and the base is provided with a plurality of base through holes. The carrier threaded holes can be threaded through holes or threaded blind holes, and the base through holes are preferably non-threaded through holes. The first screw can be screwed into the carrier threaded holes through the base through holes, so as to realize the stable connection of the base and the chip carrier.

[0038] Further, the first screw and the second screw can be the same in structure and function, and are used for fastening and fixing the components. Only the assembly position or size specification is different to adapt to different installation positions and stress requirements.

[0039] Preferably, the base through holes, the jet plate through holes and the cover plate through holes can be countersunk through holes, so that the nuts or screw heads of the first screw and the second screw are embedded in the corresponding through holes during assembly, which can improve the compactness and aesthetics of the overall assembly.

[0040] Further, the base through holes and the carrier threaded holes, the jet plate through holes and the base threaded holes, the backflow plate through holes and the jet plate threaded holes, and the cover plate through holes and the backflow plate through holes are coaxially arranged and correspond to each other in size, number and distribution. The specific conditions can be adjusted flexibly according to actual requirements, so as to ensure the structural strength and installation convenience of the overall heat dissipation device.

[0041] Further, when the base and the chip carrier, the base and the jet flow guide plate, the jet flow guide plate and the backflow collection plate, or the backflow collection plate and the cover plate are connected and fixed by welding, a welding lap joint surface or a welding groove can be arranged at each connection to ensure that the welding is fully penetrated and the structural strength is improved. Preferably, a low deformation welding process such as brazing or laser welding is used to ensure the sealing of the cooling liquid channel and the flatness of the whole.

[0042] Further, when the base and the chip carrier, the base and the jet flow guide plate, the jet flow guide plate and the backflow collection plate, or the backflow collection plate and the cover plate are connected and fixed by buckling, a clamping tongue and a clamping groove structure can be arranged on the relative connection surface of each component to prevent loosening and facilitate disassembly and replacement without the need for special tools.

[0043] Further, when the base and the chip carrier, the jet flow guide plate and the base, the backflow collection plate and the jet flow guide plate, or the cover plate and the backflow collection plate are connected and fixed by screwing or buckling, a sealing member is preferably arranged between each bonding interface, and a sealing groove is arranged on the bonding surface of the corresponding component to accommodate and position the sealing member, thereby enhancing the sealing performance of the interface.

[0044] Specifically, a first sealing member can be arranged between the base and the chip carrier, and a first sealing groove can be arranged on the back surface of the base to accommodate and position the first sealing member. The first sealing member is used for sealing around the electronic chip and can be arranged around the electronic chip or cover the top edge area of the electronic chip.

[0045] A second sealing member can be arranged between the jet flow guide plate and the base, and a second sealing groove can be arranged on the back surface of the jet flow guide plate and / or the front surface of the base to accommodate and position the second sealing member.

[0046] A third sealing member and a fourth sealing member can be arranged between the backflow collection plate and the jet flow guide plate, a third sealing groove can be arranged on the front surface of the jet flow guide plate and / or the back surface of the backflow collection plate to position and accommodate the third sealing member, and a fourth sealing groove can be arranged on the back surface of the backflow collection plate to accommodate and position the fourth sealing member.

[0047] A fifth sealing member can be arranged between the cover plate and the backflow collection plate, and a fifth sealing groove can be arranged on the front surface of the backflow collection plate and / or the back surface of the cover plate to accommodate and position the fifth sealing member.

[0048] A sixth seal member can be arranged between the cooling liquid through hole and the first cooling liquid interface or the second cooling liquid interface, and a cooling liquid through hole sealing step can be arranged at the upper end of the cooling liquid through hole flow guide structure, which is used for mounting and positioning the sixth seal member.

[0049] Further, the first seal member, the second seal member, the third seal member, the fifth seal member and the sixth seal member are preferably annular gasket structures, and the fourth seal member is preferably a gasket structure, and the first avoiding hole and the second avoiding hole are arranged on the fourth seal member to avoid the cooling liquid through hole and the cooling liquid flow guide hole respectively, so as to ensure the smoothness of the cooling path. The first seal member is mainly used for the sealed connection between the chip carrier and the base, and this part is one of the key sealed interfaces of the liquid cooling heat dissipation device. In addition to the annular gasket structure, the seal member can also be replaced by a sealing glue, an adhesive, a liquid sealant or other material structures that can realize reliable sealing, so as to ensure the sealing between the chip carrier and the base.

[0050] Preferably, the thickness of each seal member is greater than the depth of the corresponding sealing groove, so that a moderate compression is generated after the assembly of the components, thereby ensuring the reliability and long-term sealing performance of the sealed interface.

[0051] Further, when the base and the chip carrier, the jet flow guide plate and the base, the backflow collection plate and the jet flow guide plate, or the cover plate and the backflow collection plate are fixed by welding, the sealing of the bonded interface can usually be realized by the welding seam itself, without the need for additional seal members, so as to reduce the structural complexity and improve the overall strength; but in special application environments, for example, when the working pressure of the cooling liquid is high, there is a small deformation of the interface, or the detachability needs to be considered, a seal member and a corresponding sealing groove can also be arranged at the welding position to further improve the sealing reliability and durability.

[0052] Further, the base cavity, the chip carrier and the jet flow guide plate are bonded and enclosed to form a jet flow chamber for accommodating and guiding the high-speed jet flow and backflow of the cooling liquid; the jet flow chamber is located in the area directly above the electronic chip, and the cooling liquid is high-speed sprayed to the upper surface of the electronic chip in the chamber through the first through hole or the second through hole to realize intensified heat exchange, and then flows back to the subsequent flow channel through another through hole, thereby forming a complete liquid cooling heat dissipation path.

[0053] The jet flow plate groove and the backflow collection plate are bonded and enclosed to form a first fluid chamber; the backflow plate groove and the cover plate are bonded and enclosed to form a second fluid chamber; the first fluid chamber and the second fluid chamber can respectively bear the functions of flow splitting or flow converging according to the flow direction of the cooling liquid and the path structure inside the heat dissipation device, and when one of the fluid chambers bears the function of flow splitting, the other fluid chamber bears the function of flow converging.

[0054] Further, the chip carrier is provided with a plurality of carrier through holes, which are used to fix the chip carrier and the electronic chip mounted thereon to an external structure, support or mounting platform, so as to realize overall mounting and positioning.

[0055] Further, the thickness, planar shape or local structure size of the base, jet flow guide plate, backflow collection plate and cover plate can be adjusted according to the cooling liquid flow demand, heat dissipation power requirement and installation space condition, so as to realize overall optimization of heat dissipation performance, structural strength and processing feasibility.

[0056] Further, the material of the base, jet flow guide plate, backflow collection plate or cover plate can be selected according to the heat dissipation performance, mechanical strength, corrosion resistance and processing process requirement, and the preferred materials include copper, aluminum, copper-aluminum alloy, aluminum alloy, stainless steel, titanium alloy, magnesium alloy and other metal materials; high-thermal-conductivity ceramic materials such as alumina, aluminum nitride, silicon nitride and silicon carbide, or silicon-based semiconductor materials can also be selected; in some structures, non-metallic materials such as plastic, epoxy resin or glass can also be used to realize the purpose of weight reduction, insulation or cost reduction; protective treatments such as nickel plating, anodic oxidation and ceramic coating are preferably applied to the surface of the material to improve corrosion resistance and prolong service life, so as to maintain long-term good heat exchange performance.

[0057] Further, the material of the first, second, third, fourth, fifth and sixth sealing members can be selected according to the working environment, cooling liquid type and sealing performance requirement, and the preferred materials include silicone rubber, fluorosilicone rubber, fluororubber, ethylene-propylene-diene rubber, nitrile rubber, hydrogenated nitrile rubber, polyurethane rubber, polytetrafluoroethylene, polyimide and flexible graphite, and other sealing materials with high temperature resistance, corrosion resistance, aging resistance and good elasticity can also be selected to ensure long-term stable sealing performance under different temperature, pressure and working conditions.

[0058] Further, the type of the cooling liquid can be selected according to the use requirement, and the single working medium or the mixed working medium formed by mixing two or more working mediums in a certain proportion can be selected, and the working state can be single-phase working medium or two-phase working medium which undergoes gas-liquid phase change during heat exchange, so as to adapt to different heat dissipation requirements and application conditions.

[0059] Further, the liquid cooling heat dissipation device can be used with an external control system, such as a flow regulator, a temperature controller, a pressure sensor, a flow sensor, a circulating pump, or an electronic valve, etc., for real-time monitoring and precise control of the flow rate, temperature, pressure, and other parameters of the cooling liquid, thereby improving the heat dissipation efficiency, prolonging the service life of the electronic chip, and adapting to the thermal management requirements under variable and complex working conditions.

[0060] A second object of the present application is to provide a working method of the liquid cooling heat dissipation device for electronic chips, which comprises the following steps:

[0061] The cooling liquid enters the liquid cooling heat dissipation device through the joint, flows through the cooling liquid first interface, is split in the chamber for splitting, is driven by pressure to pass through the jet flow guide plate, enters the jet flow chamber, directly impacts the heat-emitting surface of the electronic chip, and the heat-exchanged cooling liquid enters the jet flow guide plate, is then guided into the backflow collection plate, is collected in the chamber for collecting, flows into the cooling liquid second interface, and finally is discharged from the liquid cooling heat dissipation device through the joint, thereby completing the liquid cooling heat dissipation process.

[0062] Further, the working method comprises the following steps:

[0063] The cooling liquid enters the liquid cooling heat dissipation device through the joint connected with the external pipeline, sequentially flows through the cooling liquid first interface and the cooling liquid through hole in communication with the cooling liquid first interface, is split in the chamber for splitting, and is distributed to the first through hole under the driving of pressure; the cooling liquid is high-speed ejected through the spray head structure provided on the first through hole, directly impacts the heat-emitting surface of the electronic chip, the heat-exchanged cooling liquid enters the second through hole, passes through the flow guide structure in the jet flow plate groove, is then guided into the cooling liquid flow guide hole in communication with the flow guide structure, is collected in the chamber for collecting, flows into the cooling liquid second interface, and finally is discharged from the liquid cooling heat dissipation device through the joint, thereby completing the liquid cooling heat dissipation process.

[0064] Optionally, when the first fluid chamber is the chamber for splitting, the second fluid chamber is the chamber for collecting.

[0065] Optionally, when the first fluid chamber is the chamber for collecting, the second fluid chamber is the chamber for splitting.

[0066] The application provides a kind of jet flow liquid cooling heat dissipation device for electronic chip.The device includes chip carrier mounted with electronic chip, base, jet flow guide plate, backflow collection plate, cover plate and connector;The base is sealedly mounted on the chip carrier, the jet flow guide plate, the backflow collection plate and the cover plate are sequentially stacked and sealedly connected with each other, and are integrally fixed on the base.The jet flow guide plate is provided with a plurality of first through holes and second through holes above the electronic chip, the backflow collection plate is provided with cooling liquid through hole and cooling liquid flow guide hole, and the cover plate is provided with cooling liquid first interface and cooling liquid second interface for mounting connector.The first through hole or the second through hole is provided with a flow guide structure towards the side of the backflow collection plate, and the first through hole or the second through hole is communicated with the cooling liquid flow guide hole;The cooling liquid through hole is provided with a cooling liquid through hole flow guide structure towards the side of the cover plate, the cooling liquid through hole is communicated with any cooling liquid interface, and the cooling liquid can flow into and flow out through another cooling liquid interface.Compared with the prior art, the jet flow guide plate and the backflow collection plate are designed in cooperation, so that the cooling liquid directly impacts the surface of the electronic chip at high speed in the form of jet flow, thereby significantly enhancing the local heat exchange efficiency;At the same time, the backflow path is optimized, the flow resistance is reduced, the high heat exchange performance and the low pressure drop are realized, and the high heat flux electronic chip is suitable for high efficiency heat dissipation.

[0067] Compared with the prior art, the application has the following beneficial effects:

[0068] 1) The jet flow liquid cooling heat dissipation device for electronic chip provided by the technical scheme can make the cooling liquid directly impact the surface of the electronic chip at high speed through the cooperation of the jet flow guide plate and the backflow collection plate, realize local enhanced heat exchange, and significantly improve the heat dissipation capacity of the high heat flux electronic chip;And the corresponding coaxial flow guide structure is arranged in the corresponding through hole, so as to effectively separate the inflowing cooling liquid and the backflow cooling liquid after heat exchange in space, avoid direct mixing of hot and cold fluids and heat backflow, and further improve the heat exchange efficiency and heat dissipation stability.

[0069] 2) The jet flow liquid cooling heat dissipation device for electronic chip provided by the technical scheme can flexibly undertake the functions of flow distribution or flow concentration according to the flow direction of the cooling liquid and the structure design of the internal flow channel, realize uniform distribution of the cooling liquid or concentration of the backflow cooling liquid after heat exchange, adapt to different flow path layout and working condition requirements;By optimizing the design of flow channel structure and fluid path, flow dead zone and secondary backflow phenomenon can be effectively reduced, the system pressure drop can be significantly reduced while maintaining high heat exchange performance, and the heat dissipation efficiency can be improved.

[0070] 3) The jet flow liquid cooling heat dissipation device for electronic chips provided by the technical scheme has a modular layered structure design for the base, the jet flow guide plate, the backflow collection plate and the cover plate, and is tightly attached to each other, has a compact overall structure, high integration, small space occupation and is convenient for integrated installation with the electronic chip module and the external liquid cooling circulation system; the geometric parameters and materials of each component can be flexibly adjusted according to cooling requirements, heat dissipation power and installation conditions, various connection modes are supported between the components, and sealing elements can be used as needed to ensure that the sealing performance and structural strength can be kept good for a long time under various working conditions, and the stable operation of the heat dissipation device is ensured.

[0071] 4) The jet flow liquid cooling heat dissipation device for electronic chips provided by the technical scheme has a modular layered structure design for the base, the jet flow guide plate, the backflow collection plate and the cover plate, and is tightly attached to each other, has a compact overall structure, high integration, small space occupation and is convenient for integrated installation with the electronic chip module and the external liquid cooling circulation system; the geometric parameters and materials of each component can be flexibly adjusted according to cooling requirements, heat dissipation power and installation conditions, various connection modes are supported between the components, and sealing elements can be used as needed to ensure that the sealing performance and structural strength can be kept good for a long time under various working conditions, and the stable operation of the heat dissipation device is ensured.

[0072] 5) The jet flow liquid cooling heat dissipation device for electronic chips provided by the technical scheme has a modular layered structure design for the base, the jet flow guide plate, the backflow collection plate and the cover plate, and is tightly attached to each other, has a compact overall structure, high integration, small space occupation and is convenient for integrated installation with the electronic chip module and the external liquid cooling circulation system; the geometric parameters and materials of each component can be flexibly adjusted according to cooling requirements, heat dissipation power and installation conditions, various connection modes are supported between the components, and sealing elements can be used as needed to ensure that the sealing performance and structural strength can be kept good for a long time under various working conditions, and the stable operation of the heat dissipation device is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0073] Figure 1 FIG. 1 is a schematic diagram of the overall structure of the jet flow liquid cooling heat dissipation device for electronic chips of the present application;

[0074] Figure 2For Figure 1 The explosion schematic diagram of the liquid jet cooling heat dissipation device for electronic chip shown in the figure;

[0075] Figure 3 The structure schematic diagram of the chip carrier of the present application;

[0076] Figure 4 The front structure schematic diagram of the base of the present application;

[0077] Figure 5 The back structure schematic diagram of the base of the present application;

[0078] Figure 6 The front structure schematic diagram of the jet flow guide plate of the present application;

[0079] Figure 7 The back structure schematic diagram of the jet flow guide plate of the present application;

[0080] Figure 8 The cross section structure schematic diagram of the nozzle structure of the present application along the cooling liquid flow direction when the nozzle structure is respectively outward expansion type, inward collection type and straight cylinder type;

[0081] Figure 9 The order arrangement schematic diagram of the first through hole and the second through hole of the present application;

[0082] Figure 10 The plug arrangement schematic diagram of the first through hole and the second through hole of the present application;

[0083] Figure 11 The structure schematic diagram of the slit of the present application;

[0084] Figure 12 The front structure schematic diagram of the backflow collection plate of the present application;

[0085] Figure 13 The back structure schematic diagram of the backflow collection plate of the present application;

[0086] Figure 14 The structure schematic diagram of the third sealing element of the present application;

[0087] Figure 15 The front structure schematic diagram of the cover plate of the present application;

[0088] Figure 16 The back structure schematic diagram of the cover plate of the present application;

[0089] Figure 17 The flow direction schematic diagram of the cooling liquid inflow, distribution and jet flow process of the present application;

[0090] Figure 18 The flow direction schematic diagram of the cooling liquid backflow, confluence and outflow process of the present application;

[0091] Fig.

[0092] 1-chip carrier; 11-electronic chip; 12-carrier threaded hole; 13-carrier through hole;

[0093] 2-base; 21-base through hole; 22-base threaded hole; 23-base cavity; 24-first sealing groove; 25-second sealing groove;

[0094] 3-jet flow guide plate; 31-jet flow plate through hole; 32-jet flow plate threaded hole; 33-jet flow plate groove; 331-first through hole; 3311-nozzle structure; 332-second through hole; 3321-flow guide structure; 333-slit; 3331-segmentation strip; 3332-interval section; 34-third sealing groove;

[0095] 4-backflow collection plate; 41-backflow plate through hole; 42-backflow plate groove; 421-cooling liquid through hole; 4211-cooling liquid through hole flow guide structure; 4212-cooling liquid through hole sealing step; 43-fourth sealing groove; 44-fifth sealing groove;

[0096] 5-cover plate; 51-cooling liquid first interface; 52-cooling liquid second interface; 53-cover plate through hole;

[0097] 6-joint;

[0098] 71-first sealing member; 72-second sealing member; 73-third sealing member; 731-first avoiding hole; 732-second avoiding hole; 74-fourth sealing member; 75-fifth sealing member; 76-sixth sealing member;

[0099] 81-first screw; 82-second screw;

[0100] 91-jet flow chamber; 92-first fluid chamber; 93-second fluid chamber;

[0101] H-total height of nozzle structure; h1-height from the starting position of nozzle structure expansion or contraction to the bottom end of nozzle structure; h2-distance from the bottom end of nozzle structure to the surface of electronic chip, α-angle between the vertical wall of nozzle structure and the expansion or contraction opening. DETAILED DESCRIPTION

[0102] The present application will be described in detail below in conjunction with the accompanying drawings and specific embodiments. In the technical solution, the component model, material name, connection structure and other features not explicitly described are considered as common technical features disclosed in the prior art.

[0103] The terms such as "front", "back", "top", "bottom", "adjacent", "opposite", "above", and other orientation or position relationship terms used in the present application are relatively described with the arrangement of the structure in the drawings as the reference, and do not constitute a limitation on the specific orientation. For example, the side of the chip carrier on which the electronic chip is mounted is defined as the front of the chip carrier, and the opposite side is the back; the side of the base facing the jet flow guide plate is defined as the front of the base, and the opposite side is the back; the side of the jet flow guide plate facing the backflow collection plate is defined as the front of the jet flow guide plate, and the opposite side is the back; the side of the backflow collection plate facing the cover plate is defined as the front of the backflow collection plate, and the opposite side is the back; the side of the cover plate facing the backflow collection plate is defined as the back of the cover plate, and the opposite side is the front.

[0104] The terms such as "inflow", "outflow", "shunt", "jet", "backflow", "confluence", and the like used in the present application are described with reference to a flow path of the cooling liquid inside the heat dissipation device, and do not constitute a limitation on the specific flow path shape and structure, size and arrangement. The specific flow path and flow direction can be adjusted according to the inlet and outlet positions, flow path structure and working conditions.

[0105] The ordinal numbers "first", "second", "third" and the like used in the description of the present application are only used to distinguish different technical features, components or steps, and should not be understood as a limitation on the number, order or importance thereof; the size terms "height", "depth", "length", "thickness" and the like are only used to facilitate the description of the structure and relative relationship, and the specific values can be adjusted according to the actual application requirements; the relational or operational terms such as "surrounding", "sleeving", "connecting", "fixing", "mounting", "communicating" and the like used in the text are used to represent the relative position, combination mode or functional relationship between the components, and do not necessarily require direct contact, permanent fixation or rigid connection, unless otherwise explicitly stated.

[0106] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be a fixed connection achieved by screw fastening, welding or cooperation with a sealing element, or it can be a direct communication, indirect communication or interaction relationship between components; it can be fixed connection, or it can be detachable connection, or it can be integrated; it can be mechanical connection, or it can be electrical connection; it can be directly connected, or indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two elements; "up", "down", "left", "right" and the like are only used to represent the relative position relationship, and when the absolute position of the described object changes, the relative position relationship may change. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific situation.

[0107] The terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the presence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0108] The content of the present application will be further described in detail below in conjunction with specific embodiments.

[0109] Embodiment 1

[0110] This embodiment provides a liquid cooling heat dissipation device for electronic chip, as shown in Figure 1 and Figure 2 , the liquid cooling heat dissipation device comprises a chip carrier 1, a base 2, a jet flow guide plate 3, a backflow collection plate 4, a cover plate 5 and a joint 6.

[0111] The base 2 is fixedly installed on the chip carrier 1 by the first screw 81, and the first sealing member 71 is arranged between the base 2 and the chip carrier 1; the jet flow guide plate 3 is fixedly installed on the base 2 by the first screw 81, and the second sealing member 72 is arranged between the jet flow guide plate 3 and the base 2; the third sealing member 73 and the fourth sealing member 74 are arranged between the backflow collection plate 4 and the jet flow guide plate 3, the fifth sealing member 75 and the sixth sealing member 76 are arranged between the backflow collection plate 4 and the cover plate 5, and the backflow collection plate 4 and the cover plate 5 are fixedly installed on the jet flow guide plate 3 in sequence by the second screw 82, and the backflow collection plate 4 is arranged between the cover plate 5 and the jet flow guide plate 3; the joint 6 is preferably a right-angle pagoda joint, and is installed on the cover plate 5.

[0112] As shown in Figure 3 , the electronic chip 11 is installed on the chip carrier 1, and a plurality of carrier threaded holes 12 are arranged around the electronic chip 11; a plurality of carrier through holes 13 are further arranged on the chip carrier 1, and the carrier through holes 13 can be used to fix the chip carrier 1 and the electronic chip 11 installed thereon to an external structure, a support or a mounting platform, so as to realize overall installation and accurate positioning.

[0113] As shown in Figure 4 and Figure 5 , the base 2 is provided with a base cavity 23 for accommodating the electronic chip 11; a plurality of base through holes 21 and base threaded holes 22 are further arranged on the base 2; the back surface of the base 2 is provided with a first sealing groove 24 for positioning and accommodating the first sealing member 71; and the front surface of the base 2 is provided with a second sealing groove 25 for positioning and accommodating the second sealing member 72.

[0114] The first sealing groove 24 and the second sealing groove 25 are both arranged around the outer edge of the base cavity 23, and the depth of the first sealing groove 24 is slightly smaller than the thickness of the first sealing member 71, and the depth of the second sealing groove 25 is slightly smaller than the thickness of the second sealing member 72, so as to ensure that reliable sealing is formed between the electronic chip 11 and the base 2 and the jet flow guide plate 3 after the components are assembled and pressed.

[0115] The base through hole 21 is a counter-sunk through hole without thread, and the size, number and distribution of the base through hole 21 correspond to the carrier threaded hole 12; the first screw 81 is sequentially threaded through the base through hole 21 and screwed into the carrier threaded hole 12, so as to realize the stable connection of the base 2 and the chip carrier 1.

[0116] As shown in Figure 6 and Figure 7 , the jet flow guide plate 3 is provided with a plurality of jet flow plate through holes 31 and a plurality of jet flow plate threaded holes 32; the front surface of the jet flow guide plate 3 is provided with a jet flow plate groove 33 and a third sealing groove 34. The first through hole 331 and the second through hole 332 are arranged in the jet flow plate groove 33; the third sealing groove 34 is arranged around the outer edge of the jet flow plate groove 33, used for positioning and accommodating the third sealing member 73, and the depth of the third sealing groove 34 is slightly smaller than the thickness of the third sealing member 73, so as to ensure that reliable sealing is formed on the cooling liquid passage after the components are assembled and pressed.

[0117] The first through hole 331 is provided with a nozzle structure 3311 on the side facing the electronic chip 11, and the second through hole 332 is provided with a guide structure 3321 in the jet flow plate groove 33, and the height of the guide structure 3321 is equal to the depth of the jet flow plate groove 33.

[0118] The jet flow plate through hole 31 is a counter-sunk through hole without thread, and the size, number and distribution of the jet flow plate through hole 31 correspond to the base threaded hole 22; the first screw 81 is sequentially threaded through the jet flow plate through hole 31 and screwed into the base threaded hole 22, so as to realize the stable connection of the jet flow guide plate 3 and the base 2.

[0119] As shown in Figure 8 , when H>0, the nozzle structure 3311 can be outwardly expanded, inwardly contracted or straight, the starting position of the outward expansion or inward contraction of the nozzle structure 3311 is h1 away from the bottom end of the nozzle structure 3311, and the ratio of h1 to H ranges from 0 to 1; the distance from the bottom end of the nozzle structure 3311 to the surface of the electronic chip 11 is h2, and h2>0; the included angle between the vertical wall of the nozzle structure 3311 and the outward expansion or inward contraction opening is α, when α>0 and the flow area of the nozzle structure 3311 gradually increases along the flow direction of the cooling liquid, it is outwardly expanded, when α>0 and the flow area of the nozzle structure 3311 gradually decreases along the flow direction of the cooling liquid, it is inwardly contracted, and when α=0, it is straight.

[0120] As shown in Figure 9 and Figure 10As shown, the first through hole 331 and the second through hole 332 can be arranged in a row or in a stacked arrangement. Both the first through hole 331 and the second through hole 332 can serve as either jet or return channels for the coolant. When one type of through hole is used as a jet channel, the other type serves as a return channel. The first through hole 331 and the second through hole 332 can be alternately arranged in the same row or arranged in different rows.

[0121] like Figure 11 As shown, the first through hole 331 and / or the second through hole 332 can be replaced by a slit 333 or used in combination with a slit 333. Each slit 333 can be provided with several dividing strips 3331 along its length, thereby dividing the slit 333 into multiple interval segments 3332. The interval segments 3332 within the same slit 333 can be evenly distributed (e.g., Figure 11 The first slit 333 and the fourth slit 333 from top to bottom can also be unevenly distributed (e.g., Figure 11 The second slit 333 from top to bottom; the intervals 3332 on different slits 333 can be aligned or staggered in the width direction.

[0122] Specifically, in this embodiment, the first through hole 331 serves as a jet hole, with a straight-tube nozzle structure 3311 provided on the side facing the electronic chip 11; the second through hole 332 serves as a return hole, with a flow guiding structure 3321 coaxially arranged within the jet plate groove 33. The first through hole 331 and the second through hole 332 are arranged in different rows and in a plug-in arrangement; this design allows the first through hole 331 and the second through hole 332 to be spatially staggered, thereby creating a more uniform flow field distribution of the coolant on the surface of the electronic chip; at the same time, it can shorten the average distance from the jet to the return path, reduce flow resistance, and improve heat exchange uniformity and overall heat dissipation efficiency.

[0123] like Figure 12 and Figure 13 As shown, the reflux collecting plate 4 has multiple threadless reflux plate through holes 41; the front side has a reflux plate groove 42 and a fifth sealing groove 44; the reflux plate groove 42 is provided with coolant through holes 421 and several coolant guide holes 422, and the fifth sealing groove 44 is used to position and accommodate the fifth sealing element 75. The back side of the reflux collecting plate 4 has a fourth sealing groove 43, which is used to position and accommodate the fourth sealing element 74.

[0124] The cooling liquid through hole 421 is coaxially surrounded by a cooling liquid through hole flow guide structure 4211, the height of the cooling liquid through hole flow guide structure 4211 is equal to the depth of the backflow plate groove 42, and a cooling liquid through hole sealing step 4212 is arranged at the upper end of the cooling liquid through hole flow guide structure 4211; the cooling liquid through hole 421 is matched with the second through hole 332 in shape, size and distribution and is in communication with each other; the cooling liquid through hole sealing step 4212 is used for positioning and mounting the sixth sealing member 76.

[0125] As shown in Figure 14 , the shape profile and size of the fourth sealing groove 43 are consistent with the jet flow plate groove 33, and the first avoiding hole 731 and the second avoiding hole 732 are arranged on the fourth sealing groove 43, the size, number and distribution of the first avoiding hole 731 and the second avoiding hole 732 correspond to the cooling liquid through hole 421 and the cooling liquid flow guide hole 422 respectively, so as to ensure that the cooling liquid can smoothly flow into and out of the liquid cooling heat dissipation device. The depth of the fourth sealing groove 43 is slightly smaller than the thickness of the fourth sealing member 74, and the third sealing member 73 and the fourth sealing member 74 jointly ensure that reliable sealing is formed between the jet flow guide plate 3 and the backflow collection plate 4.

[0126] As shown in Figure 15 and Figure 16 , the cover plate 5 is provided with a cooling liquid first interface 51, a cooling liquid second interface 52 and a plurality of cover plate through holes 53. The cooling liquid first interface 51 and the cooling liquid second interface 52 are used for mounting the joint 6, and the inflow and outflow of the cooling liquid can be realized. The cooling liquid through hole 421 is in communication with the cooling liquid first interface 51, the depth of the fifth sealing groove 44 is slightly smaller than the thickness of the fifth sealing member 75, the height of the cooling liquid through hole sealing step 4212 is slightly smaller than the thickness of the sixth sealing member 76, and the fifth sealing member 75 and the sixth sealing member 76 jointly ensure the reliable sealing between the backflow collection plate 4 and the cover plate 5.

[0127] The cover plate through hole 53 is a non-threaded counterbore through hole, and the size, number and distribution of the cover plate through hole 53 correspond to the backflow plate through hole 41; the size, number and distribution of the backflow plate through hole 41 correspond to the jet flow plate threaded hole 32. The second screw 82 passes through the cover plate through hole 53 and the backflow plate through hole 41 in sequence and is screwed into the jet flow plate threaded hole 32, thereby realizing the stable connection between the backflow collection plate 4 and the jet flow guide plate 3 and between the cover plate 5 and the backflow collection plate 4.

[0128] As shown in Figure 15 and Figure 16As shown, the base cavity 23, the chip carrier 1 and the jet flow guide plate 3 jointly define a jet flow chamber 91; the jet flow plate groove 33 of the jet flow guide plate 3 and the backflow collection plate 4 jointly define a first fluid flow cavity 92; the backflow plate groove 42 of the backflow collection plate 4 and the cover plate 5 jointly define a second fluid cavity 93. The working principle of the liquid cooling heat dissipation device is as follows: the cooling liquid enters the device through the joint 6 connected with the external pipeline, flows through the cooling liquid first interface 51 and the cooling liquid through hole 421 communicated with the cooling liquid first interface 51 in sequence, and is distributed to the first through hole 331 in the first fluid flow cavity 92 under the driving of the pressure; the cooling liquid is high-speed jetted out through the spray head structure 3311 provided in the first through hole 31, directly impacts the heat surface of the electronic chip 11, and the cooled cooling liquid enters the second through hole 332, passes through the flow guide structure 3321 in the jet flow plate groove 33, and then is guided into the cooling liquid flow guide hole 422 communicated with the cooling liquid flow guide hole 422, and is collected in the second fluid cavity 93 and then flows into the cooling liquid second interface 52, and finally is discharged from the device through the joint 6, so that the efficient liquid cooling heat dissipation process is completed.

[0129] The above description is only the preferred embodiment of the present application, which is intended to illustrate the technical solutions of the present application, and is not intended to limit the protection scope of the present application. Any equivalent replacement or deformation design of the structure, size ratio, component layout, connection method, manufacturing process and application field of the present application according to the technical concept of the present application should fall within the scope of the present application.

[0130] The above description of the embodiments is for the convenience of the ordinary skilled person in the art to understand and use the application. Those skilled in the art can easily make various modifications to these embodiments, and apply the general principles described herein to other embodiments without having to go through creative labor. Therefore, the present application is not limited to the above embodiments, and the improvements and modifications made by those skilled in the art according to the disclosure of the present application without departing from the scope of the present application should be within the scope of protection of the present application.

Claims

1. A liquid jet cooling device for an electronic chip, characterized in that, The jet flow liquid cooling heat dissipation device comprises a chip carrier (1), a base (2), a jet flow guide plate (3), a backflow collection plate (4), a cover plate (5) and a connector (6); The chip carrier (1) is provided with an electronic chip (11); The base (2) is provided with a base cavity (23) for accommodating the electronic chip (11); The base (2) is connected to the chip carrier (1), the jet flow guide plate (3) is connected to the base (2), the backflow collection plate (4) is connected to the jet flow guide plate (3), and the cover plate (5) is connected to the backflow collection plate (4); The chip carrier (1), the base (2), the jet flow guide plate (3), the backflow collection plate (4) and the cover plate (5) are sequentially connected to form a cooling liquid channel; The cover plate (5) is provided with a cooling liquid first interface (51) and a cooling liquid second interface (52) for connecting the connector (6) to realize the inflow and outflow of the cooling liquid; The base cavity (23), the chip carrier (1) and the jet flow guide plate (3) jointly define a jet flow chamber (91); The jet flow guide plate (3) and the backflow collection plate (4) jointly define a first fluid flow cavity (92); The backflow collection plate (4) and the cover plate (5) jointly define a second fluid chamber (93).

2. The fluidic liquid cooling heat sink for electronic chips according to claim 1, wherein, The jet flow guide plate (3) is provided with a jet flow plate groove (33) on the side facing the backflow collection plate (4); The jet flow plate groove (33) is provided with one or more of a first through hole (331), a second through hole (332) and a slit (333); The first through hole (331) and the second through hole (332) are respectively used to realize the jet flow function or the backflow function of the cooling liquid, and when one type of through hole assumes the jet flow function, the other type of through hole assumes the backflow function; The slit (333) is used to realize the jet flow function or the backflow function of the cooling liquid, or is used in combination with the first through hole (331) and / or the second through hole (332); The arrangement positions of the first through hole (331), the second through hole (332) and / or the slit (333) correspond to the area where the electronic chip (11) is located, or correspond to the electronic chip (11) and the surrounding area thereof; The jet flow plate groove (33) and the backflow collection plate (4) jointly define a first fluid flow cavity (92).

3. The liquid cooling heat sink for electronic chips according to claim 2, wherein, The arrangement mode of the first through hole (331) and the second through hole (332) is selected from a straight arrangement or a plug-in arrangement; In the straight arrangement or the plug-in arrangement, the first through hole (331) and the second through hole (332) are alternately arranged in the same row or are arranged in different rows, respectively.

4. The fluidic liquid cooling heat sink for electronic chips of claim 2, wherein, The slit (333) is provided with a plurality of division strips (3331), and the division strips (3331) divide the slit (333) into a plurality of interval segments (3332). The interval sections (3332) are uniformly or non-uniformly distributed in the same slit (333), and the interval sections (3332) on different slits (333) are arranged in alignment or staggered in the width direction of the slit (333).

5. The fluidic liquid cooling heat sink for electronic chips of claim 2, wherein, One or more of the first through hole (331), the second through hole (332) and the slit (333) is coaxially surrounded by a nozzle structure (3311) on one side of the electronic chip (11), and the cross-sectional shape of the nozzle structure (3311) in the direction of the cooling liquid flow is one of outward expansion, inward contraction or straight cylinder. The total height of the nozzle structure (3311) is H, and H≥0; When H≠0, the starting position of the outward expansion or inward contraction of the nozzle structure (3311) is h1 from the bottom end of the nozzle structure (3311), and the ratio of h1 to H is in the range of 0-1; The distance from the bottom end of the nozzle structure (3311) to the surface of the electronic chip (11) is h2, and h2>0; The angle between the vertical wall of the nozzle structure (3311) and the outward expansion or inward contraction opening is α, which is used to represent the degree of outward expansion or inward contraction of the nozzle structure (3311), and α≥0.

6. The fluidic liquid cooling heat sink for electronic chips of claim 2, wherein, One or more of the first through hole (331), the second through hole (332) and the slit (333) is coaxially surrounded by a flow guide structure (3321) on one side of the return flow collection plate (4); The height of the flow guide structure (3321) is the same as the depth of the jet plate groove (33).

7. The fluidic liquid cooling heat sink for electronic chips of claim 1, wherein, The return flow collection plate (4) is provided with a return flow plate groove (42) on one side facing the cover plate (5); The return flow plate groove (42) is provided with a cooling liquid through hole (421) and a plurality of cooling liquid flow guide holes (422); The return flow plate groove (42) and the cover plate (5) together define a second fluid chamber (93).

8. The fluidic liquid cooling heat sink for electronic chips of claim 7, wherein, The cooling liquid through hole (421) is coaxially surrounded by a cooling liquid through hole flow guide structure (4211) on one side facing the cover plate (5), and the height of the cooling liquid through hole flow guide structure (4211) is the same as the depth of the return flow plate groove (42).

9. The fluidic liquid cooling heat sink for electronic chips of claim 7, wherein, The cooling liquid through hole (421) communicates with the cooling liquid first interface (51) or the cooling liquid second interface (52).

10. A method of operating a fluidic liquid cooling heat sink for an electronic chip as claimed in any one of claims 1-9, characterized in that, The working method comprises the following steps: The cooling liquid enters the jet type liquid cooling heat dissipation device through the joint (6), flows through the cooling liquid first interface (51), is split in the chamber for splitting, is driven by pressure to pass through the jet flow guide plate (3), enters the jet chamber (91), directly impacts the heat generating surface of the electronic chip (11), and the cooled cooling liquid enters the jet flow guide plate (3), is then guided into the return flow collection plate (4), is collected in the chamber for collecting, flows into the cooling liquid second interface (52), and finally is discharged from the jet type liquid cooling heat dissipation device through the joint (6), so as to complete the liquid cooling heat dissipation process. When the first fluid chamber (92) is a chamber for flow division, the second fluid chamber (93) is a chamber for flow combination; or, when the first fluid chamber (92) is a chamber for flow combination, the second fluid chamber (93) is a chamber for flow division.

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