Water-guided laser-ultrasonic-mechanical composite energy field in-situ collaborative processing device and process thereof

Abstract

A water-guided laser assembly and a precision machining assembly are fixed to the same side of a sliding plate of a vertical five-axis machine tool, an ultrasonic vibration platform is installed on a C-axis workbench of the vertical five-axis machine tool, and the water-guided laser assembly, the ultrasonic vibration platform and the precision machining assembly are controlled by an industrial personal computer to cooperate with each other; a positioning measuring head is adopted to realize relative compensation of the water jet and the cutter; the water jet cooling effect is utilized in water-guided laser processing to reduce the heat affected area and improve the processing quality; ultrasonic vibration auxiliary machining effectively reduces cutting force, inhibits the surface water return phenomenon, improves machining efficiency and prolongs the service life of a cutter; and precise machining (milling, grinding and drilling) is carried out, so that the machining size precision is accurately corrected, and the residual laser-induced damage layer is removed. Through multi-energy-field in-situ combined machining, collaborative optimization of technological parameters and coordinate compensation, the problems of insufficient precision, low efficiency, thermal damage and the like during machining of complex geometrical shapes and difficult-to-machine materials in a single machining technology are solved.

Description

Technical Field

[0001] This invention belongs to the field of precision machining technology for difficult-to-machine materials, specifically relating to an in-situ synergistic machining device and process for a water-guided laser-ultrasound-mechanical composite energy field. Background Technology

[0002] Optical glass, engineering ceramics, and high-temperature alloys, among other difficult-to-machine materials, possess excellent physical and chemical properties such as low coefficients of thermal expansion, high hardness, high wear resistance, oxidation resistance, and corrosion resistance. They are widely used in aerospace engine blades, electronic instruments, medical devices, and optical lenses. However, the high hardness and brittleness of these materials make them prone to defects such as cracks and chipping during traditional machining processes, limiting device performance and reducing lifespan. While traditional laser processing avoids mechanical stress through non-contact processing, it is susceptible to thermal damage and recast layers due to heat accumulation, affecting the integrity of the machined surface. Therefore, improving the machining quality of difficult-to-machine materials and achieving efficient processing while maintaining accuracy is a pressing issue that needs to be addressed.

[0003] Machining (milling, grinding, drilling) offers advantages such as high precision, high repeatability, and excellent surface quality, making it widely used in aerospace, medical devices, and high-end manufacturing, capable of meeting stringent dimensional and tolerance requirements. However, traditional machining often generates significant cutting heat and residual stress when processing difficult-to-machine materials. These adverse factors lead to severe localized temperature rise in the material and significant tool wear, resulting in low cutting efficiency. Furthermore, the machining process is prone to microcracks and subsurface damage, limiting the application of machining in high-performance, high-quality processing of difficult-to-machine materials.

[0004] Currently, composite machining technologies such as waterjet-coupled laser processing and ultrasonic-assisted grinding are gradually becoming research hotspots in recent years, breaking through the limitations of traditional single machining technologies and improving the overall performance of key components in aerospace and other fields. Among them, waterjet-coupled laser processing (also known as water-guided laser processing) achieves total reflection of the laser at the water-air interface through precise coupling between the laser and a water-fiber optic cable, forming a high-energy beam with uniform cross-sectional energy distribution that is then directed onto the surface of the material being processed. This processing method not only effectively reduces energy loss and scattering in the air, but also has significant advantages in reducing temperature rise in the processing area, minimizing the heat-affected zone and thermal cracks, and improving surface quality. However, due to its inherent thermal effects and thermal erosion mechanisms, water-guided laser processing still struggles to avoid the generation of micro-defects during the process, especially under the requirements of high-precision surface finishing of difficult-to-machine materials, where its limitations become increasingly apparent. This also limits the further promotion and application of water-guided laser processing technology in the manufacturing of high-precision parts, aerospace, medical devices, and advanced optical components.

[0005] On the other hand, ultrasonic vibration grinding technology introduces ultrasonic vibration into traditional grinding processes. Utilizing the high-frequency vibration characteristics of ultrasound, it alters the contact pattern between the grinding wheel surface and the workpiece surface, effectively reducing friction and heat generation during grinding, suppressing microcracks and subsurface damage, and significantly improving processing efficiency and surface quality. However, while ultrasonic vibration grinding overcomes some of the shortcomings of traditional grinding, it still has limitations. Its applicability is relatively narrow, making it unsuitable for machining complex-shaped workpieces. Furthermore, it performs poorly when high material removal rates are required. Therefore, leveraging the advantages of different processing methods such as laser, ultrasonic, and mechanical machining while eliminating their respective shortcomings to form a complementary and synergistic processing approach is one of the important research directions in the precision machining of difficult-to-machine materials.

[0006] Xu Jinkai et al. from Changchun University of Science and Technology (Publication No. CN119086428A) disclosed a material scribing test device and method under a laser-ultrasonic composite energy field environment. This introduces both laser and ultrasonic energy fields into a traditional scribing device, broadening the scope of material processing research and facilitating in-depth analysis of the mechanical properties and removal mechanisms of materials. Although this device has certain advantages in material scribing and mechanism research, its function is mainly limited to material scribing testing, leaning more towards experimentation and mechanism research. Its actual processing capability is insufficient, making it difficult to directly apply to multifunctional composite processing scenarios. Chen Shuyang et al. from Suzhou Xinyang Electromechanical Technology Co., Ltd. (Publication No. CN219324888U) disclosed an ultrasonic vibration-external electric field composite energy field assisted laser drilling device. By combining ultrasonic vibration and an external electric field, it improves the removal efficiency of molten metal and plasma during the laser drilling process, thereby improving drilling quality and efficiency. Although this device has certain advantages in improving the quality and efficiency of laser drilling, it is limited to a single processing mode and cannot meet the high-precision and diversified processing needs of complex workpieces.

[0007] In summary, existing composite energy field devices improve processing quality and efficiency by introducing multi-energy field processing and provide a good experimental platform for studying material removal mechanisms. However, their functions are relatively limited, failing to achieve deep integration of multi-energy fields with machining (such as milling, grinding, and drilling), and are also insufficient to meet the multi-functional and multi-scenario requirements of complex processing conditions. Furthermore, water-guided laser processing equipment and machining equipment are usually independent devices, with the two processing methods performed step-by-step and the equipment dispersed to complete the processing of parts. However, step-by-step processing involves secondary clamping and positioning of parts, which can easily lead to positional errors due to secondary positioning, making it difficult to accurately guarantee the high precision requirements of part processing. At the same time, multiple transfers in each step reduce production efficiency and increase manual labor intensity. Therefore, there is an urgent need to propose an in-situ collaborative processing device that can rationally integrate water-guided lasers, ultrasonic vibration, and machining, and to achieve a collaborative processing scheme for high-efficiency and high-quality processing of difficult-to-machine materials through in-situ combined processing of multi-energy fields, collaborative optimization of process parameters, and coordinate compensation. Summary of the Invention

[0008] To address the problems and shortcomings of existing technologies for processing difficult-to-machine materials, the present invention aims to provide an in-situ synergistic processing device and process for a water-guided laser-ultrasound-mechanical composite energy field. By integrating water-guided laser, ultrasonic vibration, and precision machining, the three processing methods achieve in-situ synergistic effects on the same platform, thereby significantly improving processing efficiency, accuracy, and surface quality.

[0009] To achieve the above objectives, the present invention adopts the following technical solution:

[0010] A water-guided laser-ultrasound-mechanical composite energy field in-situ collaborative processing device includes a vertical five-axis machine tool, a water-guided laser component, an ultrasonic vibration platform, a precision machining component, and an industrial control computer. The water-guided laser component and the precision machining component are installed parallel to each other on the same side of the slide plate of the vertical five-axis machine tool, and both can move synchronously along the x and z axes while maintaining their relative coordinates, achieving in-situ collaborative processing, thereby improving processing efficiency and reducing workpiece positioning errors. The precision machining includes milling, grinding, and drilling. The ultrasonic vibration platform is installed on the C-axis worktable of the vertical five-axis machine tool, and the workpiece to be processed is installed on the ultrasonic vibration platform. The rotary worktable drives the ultrasonic vibration platform and the workpiece to rotate along the x-axis or z-axis, realizing the processing of the workpiece at different angles. The processing is integrated forming processing on complex free-form surfaces, deep holes, and inclined surfaces. Furthermore, the ultrasonic vibration platform applies longitudinal high-frequency vibration to the workpiece during the processing.

[0011] The vertical five-axis machine tool includes a transmission device, a slide plate, a rotary table, a bed gantry, and a base. The transmission device includes an x-axis linear guide, a y-axis linear guide, and a z-axis linear guide. The x-axis linear guide is mounted on the crossbeam of the bed gantry and arranged along the long axis of the machine tool (left-right movement). The y-axis linear guide is mounted parallel to the base and arranged along the short axis of the machine tool (back-forward movement). The z-axis linear guide is vertically movably mounted on the front of the x-axis linear guide. The rotary table is mounted above the y-axis linear guide, enabling back-forward movement along the short axis of the machine tool. The rotary table includes an A-axis rotary table and a C-axis rotary table. The A-axis rotary table is a horizontal rotation axis, allowing the C-axis rotary table to rotate around the x-axis, achieving different tilt angles in the horizontal direction, thus enabling workpiece machining at different angles. The C-axis rotary table is a vertical rotation axis, allowing the table to rotate around the z-axis, enabling circumferential machining of the workpiece during processing.

[0012] The water-guided laser assembly includes a water-guided laser processing head, a laser controller, a CCD camera, a transmission fiber, a water pump system, a high-pressure tube, and a positioning probe. The water-guided laser processing head is fixed on the slide plate of a vertical five-axis machine tool. Positioning and movement along the x-axis and z-axis are achieved using an x-axis linear guide mounted on the gantry beam of the machine bed and a z-axis linear guide vertically mounted on the front of the x-axis linear guide. The water-guided laser processing head includes a laser-water flow coaxial coupling channel, a focusing lens, a reflecting mirror, and a laser input port. The laser controller is connected to the laser input port via a transmission fiber. The CCD camera is vertically mounted on the top of the water-guided laser processing head, with the other end connected to an industrial control computer. Coaxial visual detection of the laser focal point is achieved through the computer, the reflecting mirror, and the focusing lens. The water pump system is connected to the laser-water flow coaxial coupling channel via a high-pressure tube. The positioning probe is installed on the right side of the bottom surface of the water-guided laser processing head to achieve precise positioning of the workpiece to be processed.

[0013] The ultrasonic vibration platform includes an ultrasonic generator, an ultrasonic platform, a piezoelectric ceramic, an ultrasonic transducer, and an amplitude transformer. One end of the ultrasonic generator is connected to the industrial control box, and the other end is connected to the piezoelectric ceramic. The ultrasonic generator generates high-frequency electrical signals, which are then converted into mechanical vibrations by the piezoelectric ceramic. The ultrasonic transducer is connected at both ends to the piezoelectric ceramic and the amplitude transformer, respectively, to transmit the mechanical vibrations. The other end of the amplitude transformer is connected to the ultrasonic platform to adjust the vibration amplitude to meet different processing requirements, achieving efficient ultrasonic-assisted processing and improving material removal rate and surface accuracy.

[0014] The precision machining assembly includes a controller, a machine spindle, a cutting tool, and a linear guide. The controller is connected to the machine spindle. The machine spindle is mounted on the slide of a vertical five-axis machine tool via the linear guide and is parallel to the water-guided laser machining head.

[0015] The water-guided laser component, the ultrasonic vibration platform, and the precision machining component are all connected to the industrial control computer, which includes a computer and an industrial control box.

[0016] Specifically, the mechanical spindle is a detachable electric high-speed spindle with a built-in fastening flange, and its maximum rotational speed is 100,000 rpm; both the water-guided laser processing head and the electric high-speed spindle are mounted on the slide plate, and their relative coordinates remain unchanged during collaborative processing.

[0017] Preferably, the precision machining assembly can perform various machining processes such as milling, grinding, and drilling by clamping different cutting tools.

[0018] Preferably, the water-guided laser component, the precision machining component, and the ultrasonic vibration platform are all independent modules. Depending on different processing requirements, they can be combined for processing or processed under the action of laser or machinery alone.

[0019] According to another aspect of the present invention, the present invention also provides a process for an in-situ synergistic processing device for a water-guided laser-ultrasound-mechanical composite energy field, specifically including the following steps:

[0020] Step 1: Clamp the workpiece to be processed onto the ultrasonic vibration platform, and install the selected cutting tool on the machine spindle. The machine spindle is mounted on the slide of the vertical five-axis machine tool via a linear guide rail and is arranged parallel to the water-guided laser processing head.

[0021] Step 2: Use the positioning probe on the right end of the bottom surface of the water-guided laser processing head to perform planar calibration on the workpiece to be processed and record the five coordinates to ensure the accuracy of the workpiece position.

[0022] Step 3: Turn on the water pump system of the water-guided laser assembly, adjust the water jet generated by the water-guided laser processing head to the area to be processed on the workpiece, and record the x and y axis coordinates.

[0023] Step 4: After the water jet stabilizes, input the processing parameters via the industrial control computer; turn on the ultrasonic vibration platform and laser controller, and couple the generated laser beam to the water jet through a laser-water coaxial coupling channel to perform layered scanning processing. During processing, ultrasonic vibration acts on the ablation area through high-frequency longitudinal micro-vibration, suppressing plasma shielding and backflow phenomena, and working in conjunction with the water jet to quickly remove the molten material and reduce its adhesion; after completing the water-guided laser-ultrasonic processing, turn off the laser controller, ultrasonic vibration platform, and water pump system.

[0024] The laser used is considered as a Gaussian surface heat source, which can be represented as:

[0025]

[0026] In the formula, u(t) is the unit step function, α is the material absorptivity, P is the laser power, r0 is the effective radius of the heat source, r is the distance from the point to the center of the spot, t is the time within one pulse period, and τ is the pulse width. The laser power P is controlled by the industrial control computer, which in turn controls the laser energy density and the laser heat flux density at the center of the top cross section.

[0027] Step 5: Adjust the position of the machine spindle using the industrial control computer, restart the ultrasonic vibration platform, and perform precision micro-cutting shaping to remove residual material after laser treatment. At this stage, the ultrasonic vibration reduces cutting force, cutting temperature, and tool wear, while improving cutting quality and surface finish. Calculate the equidistant trajectory offset based on the tool diameter difference.

[0028]

[0029] In the formula, D0 is the offset, D1 is the jet diameter at the workpiece surface, and D2 is the tool diameter; x' is the compensation value between the jet and the machine spindle in the x-direction, x w x is the x-coordinate of the workpiece during water-guided laser processing, x0 is the x-coordinate of the workpiece during cutting; y' is the compensation value between the jet and the machine spindle in the y-direction. w y is the y-coordinate value of the workpiece during water-guided laser processing, and y0 is the y-coordinate value of the workpiece during cutting processing.

[0030] Step 6: Adjust the machining process parameters, including depth of cut, feed rate, spindle speed, amplitude, frequency, etc., to ensure that the surface roughness and machining efficiency meet the expected requirements; after machining, turn off the ultrasonic vibration platform and the machining equipment; measure the economic efficiency of tool use by measuring the cutting energy.

[0031]

[0032] In the formula, a p f is the depth of cut; f is the feed rate; v is the feed speed.

[0033] As a further technical solution, the water pump system in the water-guided laser component provides deionized water, which has low conductivity and will not interfere with the electrical equipment of the laser system; the travel range of the A-axis rotary table is +90° to -90°; the travel of the C-axis worktable is 360° and the maximum load is 50kg.

[0034] As a further technical solution, in step four, the process parameters are set as follows: laser power is 1-200W, laser repetition frequency is 3-40kHz, spot diameter is 40-100μm, output water pressure is 1-60MPa, laser scanning speed is 10-55mm / s, ultrasonic frequency is 10-40kHz, and amplitude is 1-9μm.

[0035] As a further technical solution, in step six, the process parameters are set as follows: cutting depth is 1-100 μm, feed rate is 0.01-10 mm / s, spindle speed is 1000-100000 rpm, scanning speed is 0.5-10 mm / s, ultrasonic frequency is 10-40 kHz, and amplitude is 1-9 μm.

[0036] The advantages of this invention over the prior art are as follows:

[0037] (1) Achieving efficient collaborative processing of multiple processes: By combining water-guided laser processing, precision machining, and ultrasonic vibration-assisted processing in a sequential manner, the bottleneck of a single process is overcome. Water-guided lasers utilize the cooling effect of water jets to reduce thermal damage and achieve efficient material removal; precision machining accurately corrects the machining dimensions and removes the laser-induced damage layer; ultrasonic vibration-assisted processing is used during the machining process, applying longitudinal high-frequency micro-vibration during the cutting process, which effectively reduces cutting force, reduces recast layer, and suppresses surface water reflux while ensuring machining accuracy, thereby improving machining efficiency and extending tool life.

[0038] (2) Achieve precise error compensation: The water-guided laser processing head and the grinding spindle adopt a common slide plate mounting structure. The coordinate offset is dynamically compensated by the industrial control computer (error compensation accuracy ±3μm), eliminating the repetitive positioning error in traditional step-by-step processing.

[0039] (3) Achieving complex shape forming: Five-axis linkage expands the processing perspective, enabling integrated forming on complex free-form surfaces, deep holes, and inclined surfaces; by optimizing the spatial layout and motion path of the three modules (laser, ultrasonic, and mechanical), non-processing time is significantly reduced. In addition, this invention combines multifunctionality and process compatibility, and can select single or multi-energy field in-situ combination processing technology (water-guided laser-ultrasound, water-guided laser-mechanical, mechanical-ultrasound, water-guided laser-ultrasound-mechanical) according to different processing requirements. Attached Figure Description

[0040] Figure 1 This is a schematic diagram of the in-situ collaborative processing device for water-guided laser-ultrasound-mechanical composite energy field of the present invention;

[0041] Figure 2 This is a schematic diagram of the structure of the vertical five-axis machine tool 1 involved in this invention;

[0042] Figure 3 This is a schematic diagram of the structure of the water-guided laser processing head 14 involved in the present invention;

[0043] Figure 4 This is a schematic diagram of the structure of the ultrasonic vibration platform 12 involved in the present invention;

[0044] Figure 5 This is a schematic diagram of the structure of the precision machining component 24 involved in the present invention;

[0045] Figure 6 Processing SiC in Embodiment 1 of the present invention f Examples of micropores in SiC materials, and comparison images of the inlet and outlet morphologies after traditional grinding and water-guided laser processing.

[0046] Explanation of key reference numerals in the accompanying drawings:

[0047] 1. Vertical five-axis machine tool; 2. Transmission device; 3. Slide plate; 4. Rotary worktable; 5. Machine bed gantry; 6. Base; 7. X-axis linear guide; 8. Y-axis linear guide; 9. Z-axis linear guide; 10. A-axis rotary table; 11. C-axis worktable; 12. Ultrasonic vibration platform; 13. Water-guided laser assembly; 14. Water-guided laser processing head; 15. Laser controller; 16. CCD camera; 17. Transmission fiber optic cable; 18. Water pump system; 19. High-pressure pipe; 2 0. Positioning probe; 21. Laser-water coaxial coupling channel; 22. Focusing lens; 23. Reflector; 24. Precision machining component; 25. Controller; 26. Machine spindle; 27. Cutting tool; 28. Linear guide; 29. ​​Industrial computer; 30. Workpiece to be processed; 31. Laser input port; 32. Computer; 33. Industrial control box; 34. Ultrasonic generator; 35. Ultrasonic platform; 36. Piezoelectric ceramic; 37. Ultrasonic transducer; 38. Amplitude bar. Detailed Implementation

[0048] It should be noted that the following detailed description is illustrative and intended to provide further explanation of the invention. Unless otherwise specified, all technical and scientific terms used in this invention have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The invention is described in detail below with reference to the accompanying drawings and specific embodiments; however, it should be pointed out that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the invention.

[0049] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of exemplary embodiments according to the invention. As used herein, unless otherwise expressly indicated by the invention, the singular form is also intended to include the plural form. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0050] Example 1

[0051] In this embodiment, the laser controller 15 is a 532nm green solid-state laser controller, and the workpiece 30 to be processed is SiC. f / SiC ceramic matrix composite material, tool 27 is a diamond grinding wheel with an abrasive grain size of 400 mesh, for machining through holes with a diameter of 0.5mm.

[0052] Reference Figure 1 As shown, the in-situ collaborative processing device for a water-guided laser-ultrasound-mechanical composite energy field includes: a vertical five-axis machine tool 1, a water-guided laser component 13, an ultrasonic vibration platform 12, a precision machining component 24, and an industrial control computer. The ultrasonic vibration platform 12, the precision machining component 24, and the water-guided laser component 14 are all connected to the industrial control computer, which includes a computer 32 and an industrial control box 33. The water-guided laser component, the ultrasonic vibration platform, and the precision machining component are all independent modules. Depending on different processing requirements, multiple modules can be combined for processing, or processing can be performed under the sole action of laser or machinery. The precision machining component, by clamping different cutting tools, can achieve various processing methods such as milling, grinding, and drilling.

[0053] Reference Figure 2As shown, the vertical five-axis machine tool includes a transmission device 2, a slide plate 3, a rotary table 4, a bed gantry 5, and a base 6. The transmission device 2 includes an x-axis linear guide 7, a y-axis linear guide 8, and a z-axis linear guide 9. The x-axis linear guide 7 is mounted on the crossbeam of the bed gantry 5 and is arranged along the long axis of the machine tool (left-right movement). The y-axis linear guide 8 is mounted parallel to the top surface of the base 6 and is arranged along the short axis of the machine tool (back-forward movement). The z-axis linear guide 9 is vertically and movably mounted on the front of the x-axis linear guide 7. The rotary table 4 is mounted above the y-axis linear guide 8, enabling the rotary table to move back and forth along the short axis of the machine tool. The rotary table includes an A-axis rotary table 10 and a C-axis worktable 11. The A-axis rotary table 10 allows the C-axis worktable 11 to rotate around the x-axis, achieving different tilt angles in the horizontal direction, thereby enabling the processing of workpieces at different angles. The C-axis worktable 11 allows the worktable to rotate around the z-axis in a direction perpendicular to its movement, enabling circumferential machining of the workpiece during processing. The ultrasonic vibration platform 12 is mounted on the C-axis worktable 11 and applies longitudinal high-frequency vibration to the workpiece during processing.

[0054] Reference Figure 3 As shown, the water-guided laser assembly 13 includes a water-guided laser processing head 14, a laser controller 15, a CCD camera 6, a transmission fiber 17, a water pump system 8, a high-pressure tube 19, and a positioning probe 20. The water-guided laser processing head 14 is fixed on the slide plate 3 of the vertical five-axis machine tool, enabling positioning movement along the x-axis and z-axis. The water-guided laser processing head 14 includes a laser-water coaxial coupling channel 21, a focusing lens 22, a reflecting mirror 23, and a laser input port. The laser controller 15 is connected to the laser input port via the transmission fiber 17. The CCD camera 16 is vertically mounted on the top of the water-guided laser processing head 14, with the other end connected to an industrial control computer 29. Coaxial visual detection of the laser focal point is achieved through the computer 32, the reflecting mirror 23, and the focusing lens 22. The water pump system 18 is connected to the laser-water coaxial coupling channel 21 via the high-pressure tube 19. The positioning probe 20 is installed on the right side of the bottom surface of the water-guided laser processing head 14, enabling precise positioning of the workpiece 30 to be processed.

[0055] Reference Figure 4As shown, the ultrasonic vibration platform 12 includes an ultrasonic generator 34, an ultrasonic platform 35, a piezoelectric ceramic 36, an ultrasonic transducer 37, and an amplitude transformer 38. One end of the ultrasonic generator 34 is connected to the piezoelectric ceramic 36, and the ultrasonic generator 34 is used to generate high-frequency electrical signals, which are converted into mechanical vibrations by the piezoelectric ceramic 36. The two ends of the ultrasonic transducer 37 are connected to the piezoelectric ceramic 36 and the amplitude transformer 38, respectively, to transmit mechanical vibrations. The other end of the amplitude transformer 38 is connected to the ultrasonic platform 35 to amplify the amplitude to meet different processing requirements, realize efficient ultrasonic-assisted processing, and improve material removal rate and surface accuracy.

[0056] Reference Figure 5 As shown, the precision machining assembly 24 includes a controller 25, a machine spindle 26, a cutting tool 27, and a linear guide 28. The controller 25 is connected to the machine spindle 26. The machine spindle 26 is mounted on the slide plate 3 of the vertical five-axis machine tool via the linear guide 26 and is parallel to the water-guided laser processing head.

[0057] The mechanical spindle 26 is a detachable electric high-speed spindle with a built-in fastening flange and a maximum rotation speed of 100,000 rpm. The water-guided laser processing head 14 and the mechanical spindle 26 are both mounted on the slide plate 3 of the vertical five-axis machine tool. When performing collaborative processing, their relative coordinates remain unchanged.

[0058] In summary, the water-guided laser assembly and the precision machining assembly are fixed parallel to each other on the same side of the slide plate of a vertical five-axis machine tool. The ultrasonic vibration platform is mounted on the C-axis worktable of the vertical five-axis machine tool, and the industrial control computer controls the three components to work together. Specifically, water-guided laser machining utilizes the cooling effect of water jets to reduce the heat-affected zone and improve machining quality; ultrasonic vibration-assisted machining effectively reduces cutting forces, suppresses surface water reflux, improves machining efficiency, and extends tool life; precision machining (milling, grinding, drilling) accurately corrects machining dimensional accuracy and removes residual laser-induced damage layers. This invention, through multi-energy field in-situ combined machining and collaborative optimization of process parameters and coordinate compensation, solves the problems of insufficient accuracy, inefficiency, and thermal damage in traditional machining methods when machining complex geometries and difficult-to-machine materials.

[0059] The operation process of a water-guided laser-ultrasound-mechanical composite energy field in-situ synergistic processing device includes the following steps:

[0060] Step 1: Place and fix the workpiece 30 to be processed on the ultrasonic platform 35 of the ultrasonic vibration platform 12; the ultrasonic vibration platform 12 is installed on the C-axis worktable 11; install the tool 27 on the machine spindle 26, which is mounted on the slide plate 3 of the vertical five-axis machine tool via a linear guide 28, and arranged parallel to the water-guided laser processing head. Raise the machine spindle 26 via the linear guide 28 to prevent the tool 27 from interfering with the rotary worktable 4 during water-guided laser processing.

[0061] Step 2: Use the positioning probe 20 on the right end of the bottom surface of the water-guided laser processing head 14 to perform planar calibration on the workpiece 30 to be processed and record the five coordinates.

[0062] Step 3: Turn on the water pump system 18 of the water-guided laser assembly 13, and control the water-guided laser processing head 14 to move left and right along the x-axis linear guide rail 7 via the industrial control computer 29, and control the rotary table 4 to move back and forth along the y-axis linear guide rail 8, so that the water jet generated by the water-guided laser processing head 14 is adjusted to the processing area, and record the x and y axis coordinates.

[0063] Step 4: After the water jet stabilizes, input the processing parameters through the industrial control computer 29 and turn on the laser controller 15. The generated laser beam is focused through the laser input port 31, the reflector 23, and the focusing lens 22. Adjust the laser focusing position captured by the CCD camera 16 through the computer 32 of the industrial control computer 26 to make the laser beam coaxial with the water flow, and achieve laser-water jet coupling through the laser-water flow coaxial coupling channel 21. Observe the stable area of ​​the light-water column. This area is the suitable processing area for water-guided laser, and record the length of this processing area.

[0064] Step 5: Turn off the laser controller 15, and use the industrial control computer 29 to adjust the water-guided laser processing head 14 to move up and down along the z-axis linear guide rail 9 so that the processing area of ​​the workpiece 30 to be processed enters the suitable processing area of ​​the water-guided laser.

[0065] Step Six: Activate the ultrasonic vibration platform 12 and laser controller 15 to perform layer-by-layer scanning processing. During the processing, water jets and ultrasonic vibrations are used to rapidly remove the molten material. The laser used is considered a Gaussian surface heat source, which can be represented as:

[0066]

[0067] In the formula, u(t) is the unit step function, α is the material absorptivity, P is the laser power, r0 is the effective radius of the heat source, r is the distance from the point to the center of the spot, t is the time within one pulse period, and τ is the pulse width. The laser power P is controlled by the industrial control computer, which in turn controls the laser energy density and the laser heat flux density at the center of the top cross section.

[0068] In this embodiment, the laser power is 18W, the laser scanning speed is 10mm / s, the pulse frequency is 11kHz, the water pressure is 15MPa, the ultrasonic frequency is 20kHz, the amplitude is 5μm, and the mechanical spindle speed is 20000rpm. The laser-processed micro-hole inlet diameter is selected as 0.48mm, and the inlet and outlet diameters of the water-guided laser-processed holes range from 0.4874 to 0.4927mm.

[0069] Step 7: After completing the water-guided laser-ultrasonic machining, shut down the laser controller 15, ultrasonic vibration platform 12, and water pump system 18. Adjust the position of the mechanical spindle 26 via the industrial control computer 29, restart the ultrasonic vibration platform 12, and perform ultrasonic-precision micro-cutting shaping to remove residual material after laser treatment and optimize the surface quality. Calculate the trajectory equidistant offset based on the tool diameter difference:

[0070]

[0071] In the formula, D0 is the offset, D1 is the jet diameter at the workpiece surface, and D2 is the tool diameter; x' is the compensation value between the jet and the machine spindle in the x-direction, x w x is the x-coordinate of the workpiece during water-guided laser processing, x0 is the x-coordinate of the workpiece during cutting; y' is the compensation value between the jet and the machine spindle in the y-direction. w y is the y-coordinate value of the workpiece during water-guided laser processing, and y0 is the y-coordinate value of the workpiece during cutting processing.

[0072] Step 8: Adjust the machining process parameters via the industrial control computer 29, including depth of cut, feed rate, spindle speed, amplitude, and frequency, to ensure that the surface roughness and machining efficiency meet the expected requirements. The cutting process is controlled according to the actual degree of laser ablation damage to obtain the optimal machined surface quality. The economic efficiency of tool use is represented by calculating the cutting energy specificity.

[0073]

[0074] In the formula, a p f is the depth of cut; f is the feed rate; v is the feed speed.

[0075] Step 9: After ultrasonic-machining is completed, shut down the ultrasonic vibration platform 12 and the mechanical spindle 26 via the industrial control computer 29, and unload the workpiece.

[0076] Step 10: Observe the surface morphology of the inlet and outlet after in-situ synergistic processing using a scanning microscope with a water-guided laser-ultrasound-mechanical composite energy field, and compare it with the effect of single water-guided laser processing and single grinding processing. Figure 6As shown, after traditional grinding, the inlet and outlet aperture sizes differ, and the inlet aperture edge exhibits tearing and other damage, resulting in poor surface quality. After single water-guided laser processing, the inlet and outlet aperture sizes are slightly different, and the outlet edge integrity is poor, exhibiting chipping. Although water cooling reduces the thermal impact, localized thermal damage areas are still observable. In contrast, the in-situ synergistic processing using water-guided laser-ultrasound-grinding of this invention achieves consistent inlet and outlet sizes. Ultrasound-grinding removes thermal damage areas, resulting in clear inlet and outlet edges without significant chipping or ablation. Furthermore, the in-situ synergistic processing method reduces repeated workpiece positioning, improving processing accuracy and efficiency.

[0077] While specific embodiments of the present invention have been described above, it should be noted that the present invention is not limited to this embodiment. Any equivalent concept or modification within the technical scope disclosed in the present invention shall be included within the protection scope of the present invention.

Claims

1. A water-guided laser-ultrasound-mechanical composite energy field in-situ synergistic processing device, characterized in that, The system includes a vertical five-axis machine tool, a water-guided laser assembly, an ultrasonic vibration platform, a precision machining assembly, and an industrial control computer. The water-guided laser assembly (13) and the precision machining assembly (24) are installed in parallel on the same side of the slide plate (3) of the vertical five-axis machine tool (1), and the two can move synchronously along the x and z axes while maintaining their relative coordinates, thus achieving in-situ collaborative machining. The precision machining includes milling, grinding, and drilling. An ultrasonic vibration platform (12) is installed on the C-axis worktable (11) of a vertical five-axis machine tool (1). The workpiece (30) to be processed is installed on the ultrasonic vibration platform (12). The rotary worktable (4) drives the ultrasonic vibration platform and the workpiece to rotate along the x-axis or z-axis to realize the processing of the workpiece at different angles. The processing is an integrated forming process on complex curved surfaces, deep holes and inclined angle surfaces. The ultrasonic vibration platform (12) applies longitudinal high-frequency vibration to the workpiece during the processing. The ultrasonic vibration platform (12), the water-guided laser assembly (13) and the precision machining assembly (24) are all connected to the industrial control computer (29). The industrial control computer (29) includes a computer (32) and an industrial control box (33) to adjust the processing parameters.

2. The in-situ synergistic processing device for water-guided laser-ultrasound-mechanical composite energy field according to claim 1, characterized in that, The vertical five-axis machine tool includes a transmission device, a slide plate, a rotary table, a bed gantry, and a base; the transmission device (2) includes an x-axis linear guide, a y-axis linear guide, and a z-axis linear guide, wherein the x-axis linear guide (7) is mounted on the crossbeam of the bed gantry (5) and arranged along the long axis of the machine tool (left-right movement); the y-axis linear guide (8) is mounted parallel to the base (6) and arranged along the short axis of the machine tool (back-forward movement); the z-axis linear guide (9) is vertically and movably mounted on the front of the x-axis linear guide (7); The rotary table (4) is installed above the y-axis linear guide (8) to enable the rotary table (4) to move back and forth along the short axis of the machine tool. The rotary table (4) includes an A-axis rotary table (10) and a C-axis worktable (11). The A-axis rotary table (10) causes the C-axis worktable (11) to rotate around the x-axis in a direction that moves parallel to the x-axis, achieving different angles of tilt in the horizontal direction, thereby enabling the processing of the workpiece at different angles. The C-axis worktable (11) rotates around the z-axis in a direction that moves vertically, enabling the circumferential processing of the workpiece during the processing.

3. The in-situ synergistic processing device for water-guided laser-ultrasound-mechanical composite energy field according to claim 2, characterized in that, The water-guided laser assembly includes a water-guided laser processing head, a laser controller, a CCD camera, a transmission fiber, a water pump system, a high-pressure tube, and a positioning probe. The water-guided laser processing head (14) is fixed on the slide plate (3) of a vertical five-axis machine tool. Positioning and movement along the x and z axes are achieved by means of the x-axis linear guide (7) mounted on the gantry beam of the machine bed and the z-axis linear guide (9) vertically movably mounted on the front of the x-axis linear guide (7). The water-guided laser processing head (14) includes a laser-water coaxial coupling channel, a focusing lens, a reflecting mirror, and a laser input port. The laser controller... The device (15) is connected to the laser input port (31) via a transmission optical fiber (17); the CCD camera (16) is vertically mounted on the top of the water-guided laser processing head (14), and the other end is connected to the industrial control computer (29). The coaxial visual detection of the laser focus point is achieved through the computer (32), the reflector (23) and the focusing lens (22); the water pump system (18) is connected to the laser-water coaxial coupling channel (21) via a high-pressure pipe (19); the positioning side head (20) is installed on the right side of the bottom surface of the water-guided laser processing head (14) to achieve precise positioning of the workpiece (30) to be processed.

4. The in-situ synergistic processing device for water-guided laser-ultrasound-mechanical composite energy field according to claim 2, characterized in that, The ultrasonic vibration platform includes an ultrasonic generator, an ultrasonic platform, a piezoelectric ceramic, an ultrasonic transducer, and an amplitude transformer. One end of the ultrasonic generator (34) is connected to the industrial control box (33), and the other end is connected to the piezoelectric ceramic (36). The ultrasonic generator (34) is used to generate high-frequency electrical signals, which are converted into mechanical vibrations by the piezoelectric ceramic (36). The two ends of the ultrasonic transducer (37) are connected to the piezoelectric ceramic (36) and the amplitude transformer (38) respectively to transmit mechanical vibrations. The other end of the amplitude transformer (38) is connected to the ultrasonic platform (35) to adjust the vibration amplitude to meet different processing requirements.

5. The in-situ synergistic processing device for water-guided laser-ultrasound-mechanical composite energy field according to claim 2, characterized in that, The precision machining assembly includes a controller, a machine spindle, a cutting tool, and a linear guide. The controller (25) is connected to the machine spindle (26). The machine spindle (26) is mounted on the slide plate (3) of the vertical five-axis machine tool via the linear guide (28) and is parallel to the water-guided laser machining head (14). The machine spindle (26) is a detachable electric high-speed spindle with a built-in fastening flange and a maximum rotational speed of 100,000 rpm. The cutting tool (27) can be a milling cutter, a grinding wheel, a drill bit, or other machining tools.

6. The process of the in-situ synergistic processing device for a water-guided laser-ultrasound-mechanical composite energy field according to claim 2, characterized in that, Includes the following steps: Step 1: Clamp the workpiece to be processed onto the ultrasonic vibration platform, and install the selected cutting tool on the machine spindle. The machine spindle is mounted on the slide of the vertical five-axis machine tool through a linear guide rail and is arranged parallel to the water-guided laser processing head. Step 2: Use the positioning probe on the right end of the bottom surface of the water-guided laser processing head to perform planar calibration on the workpiece to be processed and record the five coordinates to ensure the accuracy of the workpiece position; Step 3: Turn on the water pump system of the water-guided laser assembly, adjust the water jet generated by the water-guided laser processing head to the area to be processed on the workpiece, and record the x and y axis coordinates; Step 4: After the water jet stabilizes, input the processing parameters through the industrial control computer; turn on the ultrasonic vibration platform and laser controller, and couple the generated laser beam to the water jet through the laser-water coaxial coupling channel to perform layered scanning processing; during the processing, the ultrasonic vibration acts on the ablation area through high-frequency longitudinal micro-vibration, suppressing plasma shielding and backflow phenomena, and working with the water jet to quickly remove the molten material and reduce molten material adhesion; after the water-guided laser-ultrasonic processing is completed, turn off the laser controller, ultrasonic vibration platform and water pump system; The laser used is considered as a Gaussian surface heat source, which can be represented as: In the formula, u(t) is the unit step function, α is the material absorptivity, P is the laser power, r0 is the effective radius of the heat source, r is the distance from the point to the center of the spot, t is the time within one pulse period, and τ is the pulse width. The laser power P is controlled by the industrial control computer, which in turn controls the laser energy density and the laser heat flux density at the center of the top cross section. Step 5: Adjust the position of the machine spindle via the industrial control computer, restart the ultrasonic vibration platform, and perform precision micro-cutting shaping to remove residual damage induced by laser processing. At this stage, the ultrasonic vibration reduces cutting force, cutting temperature, and tool wear, while improving cutting quality and surface finish. Calculate the equidistant trajectory offset based on the tool diameter difference. In the formula, D0 is the offset, D1 is the jet diameter at the workpiece surface, and D2 is the tool diameter; x' is the compensation value between the jet and the machine spindle in the x-direction, x w x is the x-coordinate of the workpiece during water-guided laser processing, x0 is the x-coordinate of the workpiece during cutting; y' is the compensation value between the jet and the machine spindle in the y-direction. w y is the y-coordinate value of the workpiece during water-guided laser processing, and y0 is the y-coordinate value of the workpiece during cutting processing; Step Six: Adjust machining parameters, including depth of cut, feed rate, spindle speed, amplitude, and frequency, to ensure that surface roughness and machining efficiency meet the expected requirements; after machining, shut down the ultrasonic vibration platform and machining equipment; measure the economic efficiency of tool use by analyzing the cutting energy density. In the formula, a p f is the depth of cut; f is the feed rate; v is the feed speed.

7. The process of the in-situ synergistic processing device for a water-guided laser-ultrasound-mechanical composite energy field according to claim 6, characterized in that, The water pump system in the water-guided laser assembly provides deionized water; the travel range of the A-axis rotary table is +90° to -90°; the travel of the C-axis worktable is 360° and the maximum load capacity is 50kg.

8. The process of the in-situ synergistic processing device for a water-guided laser-ultrasound-mechanical composite energy field according to claim 6, characterized in that, In step four, the process parameters are set as follows: laser power is 1-200W, laser repetition frequency is 3-40kHz, spot diameter is 40-100μm, output water pressure is 1-60MPa, laser scanning speed is 10-55mm / s, ultrasonic frequency is 10-40kHz, and amplitude is 1-9μm.

9. The process of the in-situ synergistic processing device for a water-guided laser-ultrasound-mechanical composite energy field according to claim 6, characterized in that, In step six, the process parameters are set as follows: cutting depth is 1-100 μm, feed rate is 0.01-10 mm / s, spindle speed is 1000-100000 rpm, scanning speed is 0.5-10 mm / s, ultrasonic frequency is 10-40 kHz, and amplitude is 1-9 μm.

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