Combined heat dissipation module

Abstract

The utility model relates to a combined heat dissipation module, which belongs to the technical field of water cooling notebook computers and comprises a VC vapor chamber, a water cooling plate is fixed on the upper surface of the VC vapor chamber, and heat dissipation fins are fixed at the leftmost and rightmost ends of the upper surface of the water cooling plate; the water cooling plate comprises an upper cover plate and a lower cover plate, chip contact steps are fixed to the left end and the right end of the upper surface of the upper cover plate, and a water flow channel surrounding the outer sides of the two chip contact steps by a circle is formed in the upper surface of the upper cover plate. According to the combined heat dissipation module, the design of the VC vapor chamber and the water cooling plate is adopted, the upper cover plate of the water cooling plate can make direct contact with the chip and can serve as a common copper block in a water-free state, heat is directly conducted to the VC vapor chamber, when water flow passes through, the water flow surrounds the chip contact step by a circle to be rapidly cooled, and the better cooling effect is achieved; the whole face of the VC vapor chamber conducts heat, gaps between the heat pipes are avoided, and heat conduction can be better conducted.

Description

TECHNICAL FIELD

[0001] The utility model relates to water cooling notebook computer technical field, concretely is a combined heat dissipation module. BACKGROUND

[0002] The heat dissipation performance of notebook computer directly influences its running stability, performance and service life, also influences user experience and product competitiveness to a great extent, along with the progress of technology, the power consumption of game notebook in the market is higher and higher, and light weight is guaranteed, which makes it a severe technical challenge to realize efficient heat dissipation in limited space.

[0003] The past notebook mainly relies on heat pipe + fan to solve power consumption heat, nowadays high performance notebook adopts heat pipe + water cooling plate + fan, greatly improves the heat dissipation efficiency, but water cooling heat dissipation module needs to be equipped with water tank simultaneously, cannot go out with notebook, if not carrying water tank, notebook returns to heat pipe + fan heat dissipation, makes the heat dissipation efficiency greatly reduce, leads to the use experience to be also worse, and further puts forward a combined heat dissipation module to solve the above problems. UTILITY MODEL CONTENTS

[0004] In view of the deficiency of prior art, the utility model provides a combined heat dissipation module, has quick and effective heat dissipation and other advantages, solves the problem that water cooling heat dissipation module needs to be equipped with water tank simultaneously, cannot go out with notebook, if not carrying water tank, notebook returns to heat pipe + fan heat dissipation, makes the heat dissipation efficiency greatly reduce, leads to the use experience to be also worse.

[0005] To achieve the above object, the utility model provides the following technical scheme: a combined heat dissipation module, including VC heat spreader, the upper surface of VC heat spreader is fixed with water cooling plate, the leftmost and rightmost ends of water cooling plate upper surface are all fixed with heat dissipation fin, the middle part of water cooling plate upper surface is equipped with two radiators;

[0006] The water cooling plate includes upper cover plate and lower cover plate, and the left and right ends of the upper surface of the upper cover plate are both fixed with chip contact steps, and a water flow channel is formed in the upper surface of the upper cover plate and arranged around the two chip contact steps.

[0007] The beneficial effects of the above further scheme are: the VC heat spreader + water cooling plate design is adopted, the upper cover plate of the water cooling plate and the chip can be directly contacted, and in the waterless state, the copper block can be directly used to guide the heat to the VC heat spreader, when the water flow passes through, the water flow surrounds the chip contact steps and rapidly cools down, achieving better cooling effect, the VC heat spreader conducts heat from the whole surface, avoiding the gap between the heat pipes, and better heat conduction can be achieved.

[0008] Further, the upper surface of the lower cover plate is provided with a horizontal hole and a vertical hole respectively at the left and right ends, and the horizontal hole and the vertical hole are adapted to the size of the two chip contact steps.

[0009] The beneficial effect of the further scheme is to ensure good contact and heat conduction.

[0010] Further, the water cooling plate further comprises a water nozzle arranged on one side of the upper cover plate, and the water nozzle is provided with a circular hole at the left and right ends of one side.

[0011] The beneficial effect of the further scheme is that the water nozzle is used to connect an external water tank to introduce cooling water.

[0012] Further, the heat dissipation fins are composed of a plurality of single pieces, a top plate and a bottom plate, and the single pieces are provided with through holes on one side.

[0013] The beneficial effect of the further scheme is that the heat dissipation fins are formed by stacking a plurality of single pieces to form a dense array of heat dissipation fins, thereby increasing the air contact area and improving the heat dissipation efficiency, the top plate and the bottom plate are used to fix the single pieces and provide structural support to ensure the overall stability, and the through holes are provided to enable the airflow blown by the fan to pass smoothly, thereby avoiding air resistance and improving the cooling effect.

[0014] Further, the size of the left end of the heat dissipation fin is smaller than that of the right end of the heat dissipation fin, and the upper surface of the left end of the heat dissipation fin is provided with a square hole, and the length and width of the inner cavity of the square hole are greater than the length and width of the chip contact step.

[0015] Further, the upper surface of the right end of the heat dissipation fin is provided with an arc-shaped hole, and the length and width of the inner cavity of the arc-shaped hole are greater than the length and width of the chip contact step.

[0016] Compared with the prior art, the technical scheme of the present application has the following beneficial effects:

[0017] The combination type heat dissipation module adopts a VC heat plate + water cooling plate design, the upper cover plate of the water cooling plate can directly contact the chip, and in the absence of water, the water cooling plate can act as a common copper block to directly guide heat to the VC heat plate, when water flows through, the water flow rapidly cools around the chip contact step, achieving better cooling effect, the VC heat plate conducts heat through the entire surface, avoiding the gap between the heat pipes, and better heat conduction can be achieved. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of the utility model;

[0019] Figure 2 It is a rear view schematic diagram of the water cooling plate explosion structure of the utility model;

[0020] Figure 3The utility model discloses a lower cover plate structure rear view schematic drawing.

[0021] In the drawing: 1VC hot plate, 2 water cooling plate, 21 upper cover plate, 211 chip contact step, 212 water flow channel, 22 lower cover plate, 23 water nozzle, 3 heat dissipation fin, 4 heat dissipation fin. DETAILED DESCRIPTION

[0022] The technical scheme in the embodiments of the utility model will be apparently and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative work belong to the protection scope of the utility model.

[0023] Please refer to Figure 1 In the embodiment, the combined heat dissipation module comprises a VC hot plate 1, the upper surface of the VC hot plate 1 is fixed with a water cooling plate 2, the leftmost and rightmost ends of the upper surface of the water cooling plate 2 are both fixed with heat dissipation fins 3, and the middle part of the upper surface of the water cooling plate 2 is provided with two heat dissipation fins 4, so that a larger heat dissipation area is provided and the heat dissipation capacity is enhanced.

[0024] In the embodiment, the heat dissipation fins 3 are composed of a plurality of single fins, a top plate and a bottom plate, one side of the single fin is provided with a through hole, so that the air flow of the fan can smoothly pass through the heat dissipation fins 3, thereby taking away the heat on the surface of the heat dissipation fins 3, the heat dissipation fins 3 can play the best heat dissipation effect, there is enough space between the adjacent fins, the air can flow smoothly, the uniform distribution of the fins on the whole heat dissipation module is ensured, and the poor heat dissipation in the local area is avoided.

[0025] The heat dissipation fins 3 are formed by stacking a plurality of single fins, a dense heat dissipation fin 3 array is formed, the contact area with the air is increased, the heat dissipation efficiency is improved, the top plate and the bottom plate are used for fixing the single fins and providing structural support, the stability of the whole is ensured, the through hole is provided, the air flow blown by the fan can smoothly pass through, the air flow resistance is avoided, and the cooling effect is improved.

[0026] In addition, the VC hot plate 1, i.e. the steam cavity hot plate, is a new type of high-efficiency heat conduction material utilizing the phase change of working medium for rapid heat transfer. The rapid phase change heat transfer efficiency is extremely great. At present, using the VC hot plate 1 to solve the heat dissipation problem has become a trend. The ultra-thin VC hot plate 1 can be conveniently applied to the ultra-thin environment, is attached to the heating unit by using heat-conducting silicone grease, uniformly disperses and then conducts the heat to the back plate or other heat dissipation areas, thereby reducing the working temperature of the core area, the VC hot plate 1 conducts heat by the whole surface, avoids the gap between the heat pipes, and can better conduct heat.

[0027] Please refer to Figures 2 to 3In order to improve the use convenience of the water-cooled heat dissipation module, the water-cooled plate 2 in the embodiment includes an upper cover plate 21 and a lower cover plate 22, the left and right ends of the upper surface of the upper cover plate 21 are fixed with chip contact steps 211 for directly contacting the heat-generating chip to ensure good heat conduction, the upper surface of the upper cover plate 21 is provided with a water flow channel 212 arranged around the outside of the two chip contact steps 211, the water flow channel 212 is used for guiding the flow of cooling water to absorb and take away the heat on the surface of the chip, and the temperature of the chip surface is cooled through the double conduction of the water-cooled plate 2 and the VC vapor chamber 1, so that the water flow passes through the water tank, the water flow surrounds the chip contact steps 211, the heat on the surface of the chip is absorbed by the water flow, the surface of the chip is rapidly cooled, the temperature of the surface of the chip is lower, the temperature of the surface of the whole machine body is synchronously reduced, and the use temperature of the machine body is more comfortable.

[0028] It can be understood that the chip is placed on the chip contact steps 211, the heat on the surface of the chip is conducted to the water-cooled plate 2 through the chip contact steps 211, the heat on the water-cooled plate 2 is conducted to the VC vapor chamber 1, the heat on the VC vapor chamber 1 is conducted to the heat dissipation fins 3, and the heat on the heat dissipation fins 3 is blown out by the fan.

[0029] It should be noted that when there is no water tank, the water-cooled plate 2 is a common copper block, the upper cover plate 21 of the water-cooled plate 2 directly contacts the chip, and the heat can be directly conducted to the VC vapor chamber 1, the heat on the VC vapor chamber 1 is conducted to the heat dissipation fins 3, and the heat is blown out by the fan.

[0030] The upper surface of the lower cover plate 22 is provided with horizontal holes and vertical holes with sizes matched with the sizes of the two chip contact steps 211, so that good contact and heat conduction are ensured, the water-cooled plate 2 further includes a water nozzle 23 arranged on one side of the upper cover plate 21, the left and right ends of one side of the water nozzle 23 are provided with circular holes for connecting an external water tank to introduce cooling water.

[0031] In addition, the size of the left heat dissipation fin 4 is smaller than the size of the right heat dissipation fin 4, the upper surface of the left heat dissipation fin 4 is provided with a square hole, the length and width of the inner cavity of the square hole are greater than the length and width of the chip contact steps 211, and the upper surface of the right heat dissipation fin 4 is provided with an arc-shaped hole, the length and width of the inner cavity of the arc-shaped hole are greater than the length and width of the chip contact steps 211.

[0032] It should be noted that the common copper block mode without a water tank is supported, and the water-cooled mode with a water tank is compatible, so that multiple application scenarios are adapted, and efficient heat dissipation performance and convenient operation experience are realized.

[0033] The working principle of the above embodiment is as follows:

[0034] The chip is placed on the chip contact step 211, the heat on the surface of the chip is conducted to the water cooling plate 2 through the chip contact step 211, the heat on the water cooling plate 2 is conducted to the VC vapor chamber 1, the heat on the VC vapor chamber 1 is conducted to the heat dissipation fin 3, and the heat on the heat dissipation fin 3 is blown out through the fan; through the double conduction of the water cooling plate 2 and the VC vapor chamber 1, the temperature of the surface of the chip is cooled, the water flows through when there is a water tank, the water flow surrounds the chip contact step 211 once, so that the water flow absorbs the heat on the surface of the chip, thereby rapidly cooling the surface of the chip, so that the temperature of the surface of the chip is lower, the temperature of the surface of the whole machine body is synchronously reduced, so that the use temperature of the machine body is more comfortable; when there is no water tank, the water cooling plate 2 is a common copper block, since the upper cover plate 21 of the water cooling plate 2 directly contacts the chip, the heat can be directly conducted to the VC vapor chamber 1, the heat on the VC vapor chamber 1 is conducted to the heat dissipation fin 3, and the heat on the heat dissipation fin 3 is blown out through the fan.

[0035] It should be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the presence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0036] Although the embodiments of the present application have been shown and described, it should be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made thereto without departing from the principles and spirit of the present application.

Claims

1. A combined heat dissipation module, comprising a VC uniform heating plate (1), characterized in that: The upper surface of the VC hot plate (1) is fixed with a water cooling plate (2), the leftmost and rightmost ends of the upper surface of the water cooling plate (2) are fixed with heat dissipation fins (3), and the middle part of the upper surface of the water cooling plate (2) is provided with two heat dissipation fins (4); The water cooling plate (2) comprises an upper cover plate (21) and a lower cover plate (22), the left and right ends of the upper surface of the upper cover plate (21) are fixed with chip contact steps (211), and the upper surface of the upper cover plate (21) is provided with a water flow channel (212) which is arranged around the outside of the two chip contact steps (211).

2. The modular heat sink module of claim 1, wherein: The left and right ends of the upper surface of the lower cover plate (22) are respectively provided with horizontal holes and vertical holes which are matched with the sizes of the two chip contact steps (211).

3. The modular heat sink module of claim 1, wherein: The water cooling plate (2) further comprises a water nozzle (23) arranged on one side of the upper cover plate (21), and the left and right ends of one side of the water nozzle (23) are respectively provided with circular holes.

4. The modular heat sink assembly of claim 1, wherein: The heat dissipation fins (3) are composed of a plurality of single pieces, top plates and bottom plates, and the single pieces are provided with through holes on one side.

5. The modular heat sink assembly of claim 1, wherein: The size of the left end of the heat dissipation fin (4) is smaller than that of the right end of the heat dissipation fin (4), the upper surface of the left end of the heat dissipation fin (4) is provided with a square hole, and the length and width of the inner cavity of the square hole are greater than the length and width of the chip contact step (211).

6. The modular heat sink assembly of claim 1, wherein: The upper surface of the right end of the heat dissipation fin (4) is provided with an arc-shaped hole, and the length and width of the inner cavity of the arc-shaped hole are greater than the length and width of the chip contact step (211).

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