Heat extraction system and cooling system
By using a multi-layered vertically stacked heat dissipation unit and a central air passage design, the problem of insufficient heat dissipation density in data center cooling systems is solved, achieving efficient cooling and maximizing the utilization of server space.
Patent Information
- Application Number
- CN202510767117.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2025-05-23
- Filing Date
- 2025-06-10
- Publication Date
- 2025-12-12
AI Technical Summary
In existing data center cooling systems, the heat dissipation devices are limited by the surface area of the coils and the airflow of the fans, resulting in insufficient heat dissipation density and failing to effectively meet the high-density cooling requirements.
It adopts a multi-layer vertically stacked heat dissipation unit structure, combined with a central air passage and inlet pipe design, to increase heat dissipation density and reduce recirculation through air baffles, while introducing fresh ambient air to improve cooling efficiency.
This achieves increased heat dissipation density within a limited space, maximizes server usable space, reduces recirculation, and improves the efficiency and effectiveness of the cooling system.
Smart Images
Figure CN121126729A_ABST
Abstract
Description
[0001] Cross-reference to related applications
[0002] This application claims the benefit of U.S. Provisional Application No. 63 / 659,198, filed June 12, 2024, pursuant to 35 U.S.SC §119(e), which is incorporated herein by reference in its entirety. Technical Field
[0003] This disclosure relates generally to the field of cooling systems, and more specifically to heat dissipation systems for efficient cooling systems. Background Technology
[0004] Cooling systems for data centers typically include climate control systems to maintain appropriate temperature and humidity levels. Climate control systems usually include one or more computer room air conditioners (CRACs) coupled to heat dissipation units to supply cooling fluid to the CRACs. The heat dissipation units typically transfer heat from the return fluid of the CRACs to a cooler medium, such as ambient air. Due to space constraints within the building itself, current heat dissipation units are limited by coil surface area, fan airflow, and recirculation. Furthermore, the number of cooling units that can be installed is limited. Therefore, there is a need for a heat dissipation unit that provides high-density heat dissipation, addressing the shortcomings of previous methods. Summary of the Invention
[0005] According to one or more embodiments of this disclosure, a heat dissipation system is disclosed. In one embodiment, the heat dissipation system includes: a first heat dissipation unit including a first set of fans and coils; a second heat dissipation unit configured to be stacked on top of the first heat dissipation unit, wherein the second heat dissipation unit includes a second set of fans and coils; one or more central passages configured to connect the first heat dissipation unit to the second heat dissipation unit, wherein the one or more central passages divide the first heat dissipation unit into at least a first segment and a second segment, wherein the first segment includes a first fan and a first coil from the first set of fans and coils, and the second segment includes a second fan and a second coil from the first set of fans and coils; and an inlet pipe configured to communicate with the outside and receive fresh ambient air via an opening in the inlet pipe, wherein the inlet pipe is disposed below the first heat dissipation unit and configured to deflect the fresh ambient air toward at least one of the first or second heat dissipation units for discharge to the outside.
[0006] According to one or more embodiments of this disclosure, a cooling system is disclosed. In one embodiment, the cooling system includes: a first heat dissipation system; and a second heat dissipation system, wherein the first heat dissipation system is arranged close to the second heat dissipation system. In an embodiment, each of the first and second heat dissipation systems includes: a first heat dissipation unit comprising a first set of fans and coils; a second heat dissipation unit configured to be stacked on top of the first heat dissipation unit, wherein the second heat dissipation unit comprises a second set of fans and coils; one or more central passages configured to connect the first heat dissipation unit to the second heat dissipation unit, wherein the one or more central passages divide the first heat dissipation unit into at least a first segment and a second segment, wherein the first segment comprises a first fan and a first coil of the first set of fans and coils, and the second segment comprises a second fan and a second coil of the first set of fans and coils; and an inlet pipe configured to communicate with the outside and receive fresh ambient air via an opening in the inlet pipe, wherein the inlet pipe is disposed below the first heat dissipation unit and configured to deflect the fresh ambient air toward at least one of the first or second heat dissipation units for exhaust to the outside.
[0007] According to one or more embodiments of this disclosure, a cooling system is disclosed. In one embodiment, the cooling system includes: a first heat dissipation system; and a second heat dissipation system, wherein the first heat dissipation system is arranged adjacent to the second heat dissipation system, and wherein a gap is formed between the first heat dissipation system and the second heat dissipation system. In an embodiment, each of the first and second heat dissipation systems includes: a first heat dissipation unit comprising a first set of fans and coils; a second heat dissipation unit configured to be stacked on top of the first heat dissipation unit, wherein the second heat dissipation unit comprises a second set of fans and coils; one or more central passages configured to connect the first heat dissipation unit to the second heat dissipation unit, wherein the one or more central passages divide the first heat dissipation unit into at least a first segment and a second segment, wherein the first segment comprises a first fan and a first coil of the first set of fans and coils, and the second segment comprises a second fan and a second coil of the first set of fans and coils; and an inlet pipe configured to communicate with the outside and receive fresh ambient air via an opening in the inlet pipe, wherein the inlet pipe is disposed below the first heat dissipation unit and configured to deflect the fresh ambient air toward at least one of the first or second heat dissipation units for exhaust to the outside, wherein the first heat dissipation unit of the first heat dissipation system and the first heat dissipation unit of the second heat dissipation system are connected.
[0008] It should be understood that both the foregoing general description and the following detailed description are exemplary and illustrative only, and do not necessarily limit this disclosure. The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate the subject matter of this disclosure. Together, the description and drawings serve to explain the principles of this disclosure. Attached Figure Description
[0009] By referring to the accompanying drawings, those skilled in the art can better understand the many advantages of this disclosure.
[0010] Figure 1A This is a simplified schematic diagram of a heat dissipation system according to one or more embodiments of the present disclosure.
[0011] Figure 1B This is a simplified schematic diagram of a heat dissipation system according to one or more embodiments of the present disclosure.
[0012] Figure 2A It includes one or more embodiments according to this disclosure. Figures 1A to 1B A simplified block diagram of the cooling system for the heat dissipation system.
[0013] Figure 2B It includes one or more embodiments according to this disclosure. Figures 1A to 1B A simplified schematic diagram of the cooling system of the heat dissipation system.
[0014] Figure 2C It includes one or more embodiments according to this disclosure. Figures 1A to 1B A simplified schematic diagram of the cooling system of the heat dissipation system.
[0015] Figure 2D It includes one or more embodiments according to this disclosure. Figures 1A to 1B A simplified schematic diagram of the cooling system of the heat dissipation system.
[0016] Figure 2E It includes one or more embodiments according to this disclosure. Figures 1A to 1B A simplified schematic diagram of the cooling system of the heat dissipation system.
[0017] Figure 3A It includes one or more embodiments according to this disclosure. Figures 1A to 1B A simplified top view of the cooling system of the heat dissipation system.
[0018] Figure 3B It includes one or more embodiments according to this disclosure. Figures 1A to 1B A simplified top view of the cooling system of the heat dissipation system.
[0019] Figure 3C It includes one or more embodiments according to this disclosure. Figures 1A to 1BA simplified top view of the cooling system of the heat dissipation system.
[0020] Figure 4 This is a simplified schematic diagram of a heat dissipation system in a side-by-side configuration according to one or more embodiments of the present disclosure. Detailed Implementation
[0021] The subject matter will now be described in detail with reference to the accompanying drawings.
[0022] Embodiments of this disclosure relate to heat dissipation systems. More specifically, embodiments of this disclosure relate to a novel heat dissipation system with a particular arrangement configured to increase the heat dissipation density at the roof (or data center corridor). For example, the heat dissipation system may include one or more vertically stacked heat dissipation units configured to increase roof density. In this respect, the heat dissipation system can allow multi-story data centers to increase the number of floors within the data center and maximize server utilization. Furthermore, the heat dissipation system can reduce recirculation. For example, one or more heat dissipation units of the heat dissipation system can introduce fresh ambient air through inlet ducts.
[0023] Figure 1A and Figure 1B A simplified schematic diagram of a heat dissipation system 100 according to one or more embodiments of the present disclosure is shown.
[0024] The heat dissipation system 100 may include one or more heat dissipation units. For example, such as Figure 1A As shown, the heat dissipation system 100 may include at least a lower heat dissipation unit 102 and an upper heat dissipation unit 104. For example, the upper heat dissipation unit 104 may be stacked on top of the lower heat dissipation unit 102 to form a vertical stack of heat dissipation units. As another example, such as Figure 1B As shown, the heat dissipation system 100 may also include one or more intermediate heat dissipation units 103. For example, an upper heat dissipation unit 104 may be stacked on top of an intermediate heat dissipation unit 103, which in turn is stacked on top of a lower heat dissipation unit 102, to form a vertical stack of heat dissipation units.
[0025] This paper envisions that the vertical stacking of heat dissipation units can increase the vertical height of the heat dissipation system 100, thereby increasing the heat dissipation density on the roof and leaving blank space to maximize server utilization.
[0026] The heat dissipation system 100 may include one or more central air passages 106. (See reference...) Figure 1AThe heat dissipation system 100 may include a single central air passage 106 passing through the center of at least the lower heat dissipation unit 102. For example, the central air passage 106 may connect the lower heat dissipation unit 102 to the upper heat dissipation unit 104. For example, one or more central air passages 106 may divide at least the lower heat dissipation unit 102 into at least a first segment 108 and a second segment 110, wherein the central air passage 106 is arranged between the first segment 108 and the second segment 110. In this respect, one or more sidewalls of the central air passage 106 may at least partially define the first segment 108 and the second segment 110 within the lower heat dissipation unit 102.
[0027] Reference Figure 1B The heat dissipation system 100 may include a plurality of central air passages 106, the plurality of central air passages 106 including at least a first central air passage 106a and a second central air passage 106b. For example, the first central air passage 106a may pass through the center of one or more intermediate heat dissipation units 103. In this respect, the first central air passage 106a may connect a lower heat dissipation unit 102 to one or more intermediate heat dissipation units 103. For example, the first central air passage 106a may divide the lower heat dissipation unit 102 into a first segment 108a and a second segment 110a, wherein the first central air passage 106a is arranged between the first segment 108a and the second segment 110a of the lower heat dissipation unit 102. In this respect, one or more sidewalls of the first central air passage 106a may at least partially define the first segment 108a and the second segment 110a within the lower heat dissipation unit 102.
[0028] As another example, the second central air passage 106b can connect one or more intermediate heat dissipation units 103 to the upper heat dissipation unit 104. For example, the second central air passage 106b can divide one or more intermediate heat dissipation units 103 into a first segment 108b and a second segment 110b, wherein the second central air passage 106b is arranged between the first segment 108b and the second segment 110b of the intermediate heat dissipation unit 103. In this respect, one or more sidewalls of the second central air passage 106b can at least partially define the first segment 108b and the second segment 110b within the intermediate heat dissipation unit 103.
[0029] In the example above, such as Figure 1BAs shown, the first central air passage 106a may have a first width 106a-a, which is larger than the second width 106b-a of the second central air passage 106b. However, it is contemplated herein that the dimensions are not limited thereto, such that the first width 106a-a may be less than or equal to the second width 106b-a. For example, the width at any given point in the airflow may depend on the amount of airflow through that section. In the case of vertical stacking, more total airflow may pass through the bottom section, and the total airflow may decrease as the air is diverted by various coils / fans.
[0030] Each heat dissipation unit of the heat dissipation system 100 may include one or more coils 112 and one or more fans 114.
[0031] For example, such as Figure 1A As shown, the first segment 108 of the lower heat dissipation unit 102 may include a first set of coils 112 and a fan 114, and the second segment 110 of the lower heat dissipation unit 102 may include a second set of coils 112 and a fan 114, wherein the coils 112 and fans 114 of the respective segments 108 and 110 of the lower heat dissipation unit 102 are separated by a central air passage 106. For example, in a non-limiting example, the first segment 108 may include a first coil 112 and a first fan 114, and the second segment 110 may include a second coil 112 and a second fan 114. Furthermore, as... Figure 1A As shown, the upper heat dissipation unit 104 may include one or more coils 112 and one or more fans 114. For example, in a non-limiting example, the upper heat dissipation unit 104 may include four coils 112 and two fans 114 (e.g., two coils per fan).
[0032] As another example, such as Figure 1B As shown, the first segment 108a of the lower heat dissipation unit 102 may include a first set of coils 112 and a fan 114, and the second segment 110a of the lower heat dissipation unit 102 may include a second set of coils 112 and a fan 114, wherein the coils 112 and fans 114 of the respective segments 108a and 110a of the lower heat dissipation unit 102 are separated by a central air passage 106a. For example, in a non-limiting example, the first segment 108a may include a first coil 112 and a first fan 114, and the second segment 110a may include a second coil 112 and a second fan 114. Furthermore, as... Figure 1BAs shown, the first segment 108b of the intermediate heat dissipation unit 103 may include a first set of coils 112 and a fan 114, and the second segment 110b of the intermediate heat dissipation unit 103 may include a second set of coils 112 and a fan 114, wherein the coils 112 and fans 114 of the corresponding segments 108b and 110b of the intermediate heat dissipation unit 102 are separated by a central air passage 106b. For example, in a non-limiting example, the first segment 108b may include a first coil 112 and a first fan 114, and the second segment 110b may include a second coil 112 and a second fan 114. Furthermore, as... Figure 1B As shown, the upper heat dissipation unit 104 may include one or more coils 112 and one or more fans 114. For example, in a non-limiting example, the upper heat dissipation unit 104 may include four coils 112 and two fans 114 (e.g., two coils per fan).
[0033] although Figure 1A and Figure 1B A specific number, size, and configuration of coils 112 and fans 114 are depicted, but it is envisioned herein that the heat dissipation system 100 may include any number, size, and configuration of coils 112 (e.g., angled, plate-shaped, “V”-shaped, etc.) and fans 114 suitable for the cooling needs of a data center.
[0034] The lower heat dissipation unit 102 can be mounted on a raised solid base plate 116 (or sandwich structure 116) to form an inlet pipe 118. In some cases, the inlet pipe 118 can be placed below or inside the lower heat dissipation unit 102. The inlet pipe 118 can be configured to communicate with the outside and receive fresh ambient air into the heat dissipation system 100.
[0035] The inlet duct 118 may be defined by at least a portion of a raised solid base 116 (or mezzanine structure 116) and the roof 120 (or floor 120) of the building 122, wherein the sides of the inlet duct 118 are open to form openings 119. Therefore, fresh ambient air from the outside can enter the heat dissipation system 100 via the openings 119 within the inlet duct 118 and can be diverted throughout the lower heat dissipation unit 102 and the upper heat dissipation unit 104. For example, as... Figure 1A As shown, the first airflow (flow A) can enter the inlet pipe 118 through the opening 119 and can be diverted to the first section 108 and the second section 110 of the lower heat dissipation unit 102, wherein the first airflow (flow A), indicated by the solid arrow, can be discharged via the fan 114 of the lower heat dissipation unit 102. Furthermore, as... Figure 1BAs shown, the second airflow (flow B), indicated by the dashed arrow, can enter the inlet pipe 118 through the opening 119 and turn to the upper heat dissipation unit 104 through the central passage 106, wherein the second airflow (flow B) can be discharged through the fan 114 of the upper heat dissipation unit 104.
[0036] The heat dissipation unit may include one or more air baffles 121 (or panels) to prevent outside air from entering the heat dissipation system 100. One or more air baffles 121 can deflect air within the heat dissipation unit in a specific manner. Therefore, recirculation is reduced (e.g., almost zero recirculation). For example, as... Figure 1A As shown, the first section 108 and the second section 110 of the lower heat dissipation unit 102 may include one or more air baffles 121, wherein the central passage 106 includes one or more air baffles (or sidewalls). Furthermore, as... Figure 1A As shown, the upper heat dissipation unit 104 may include one or more air-blocking walls. As another example, such as... Figure 1B As shown, the first sections 108a, 108b and the second sections 110a, 110b of the lower heat dissipation unit 102 and the middle heat dissipation unit 103 may include one or more air baffles 121, wherein the central passages 106a, 106b include one or more air baffles (or sidewalls). Furthermore, as... Figure 1B As shown, the upper heat dissipation unit 104 may include one or more air-blocking walls.
[0037] although Figures 1A to 1B A specific number and configuration (e.g., arrangement, shape, size, etc.) of heat dissipation units are described herein; however, it is contemplated herein that the heat dissipation system 100 may include any number and configuration of heat dissipation units. For example, as previously referred to herein... Figure 1A The heat dissipation system discussed may comprise a single unit. As another example, as previously referenced herein... Figure 1B The heat dissipation system under discussion may include two or more units.
[0038] Figure 2A A simplified block diagram of a cooling system 200 including a heat dissipation system 100 according to one or more embodiments of the present disclosure is shown. Figure 2B A simplified schematic diagram of a cooling system 200 including a heat dissipation system 100 according to one or more embodiments of the present disclosure is shown. Figure 2C A simplified schematic diagram of a cooling system 200 including a heat dissipation system 100 according to one or more embodiments of the present disclosure is shown. Figure 2D A simplified schematic diagram of a cooling system 200 including a heat dissipation system 100 according to one or more embodiments of the present disclosure is shown. Figure 2E A simplified schematic diagram of a cooling system 200 including a heat dissipation system 100 according to one or more embodiments of the present disclosure is shown.
[0039] Cooling system 200 may include one or more computer room air conditioning (CRAC) units 202. For example, one or more CRAC units 202 may be coupled to one or more heat dissipation systems 100 to provide cooling liquid to the respective one or more CRAC units 202. In addition, heat dissipation systems 100 may transfer heat from the return fluid from one or more CRAC units 202 to a cooler medium, such as ambient air.
[0040] It is envisioned herein that one or more CRAC units 202 may include any suitable cooling technology. For example, one or more CRAC units 202 may include, but are not limited to, air-cooled heat exchangers or liquid-cooled heat exchangers, or a combination of air-cooled heat exchangers and liquid-cooled heat exchangers.
[0041] Reference Figure 2B The cooling system 200 may include at least a first heat dissipation system 100, which is arranged close to (or adjacent to) the second heat dissipation system 100. For example, such as Figure 2B As shown, the first heat dissipation system 100 can be separated from the second heat dissipation system 100 by a predetermined distance d. Furthermore, the solid base plate 116 of the first heat dissipation system 100 can be flush with the solid base plate 116 of the second heat dissipation system 100, so that there is no gap between the top surfaces of the respective solid base plates 116.
[0042] Reference Figure 2C and Figure 2D The cooling system 200 may include at least a first heat dissipation system 100, which is arranged close to (or adjacent to) the second heat dissipation system 100 and the third heat dissipation system 100. For example, such as Figure 2C and Figure 2D As shown, the first heat dissipation system 100 can be arranged directly adjacent to the second and third heat dissipation systems 100, such that there is no gap between the respective heat dissipation systems 100. In this respect, the cooling system 200 can be a compact cooling system to accommodate a small footprint. In one example, the first, second, and third heat dissipation systems 100 can be located on a single solid base plate 116, as... Figures 2C to 2DAs shown in the illustration. In another example, each system may be located on a corresponding solid base plate 116, wherein the solid base plate 116 of the first heat dissipation system 100 may be flush with the solid base plates 116 of the second heat dissipation system 100 and the third heat dissipation system 100, such that there is no gap between the corresponding solid base plates 116.
[0043] Reference Figure 2E The cooling system 200 may include at least a first heat dissipation system 100 arranged close to (or adjacent to) a second heat dissipation system 100, wherein the second heat dissipation system 100 is arranged close to (or adjacent to) a third heat dissipation system 100, and the third heat dissipation system 100 is arranged close to (or adjacent to) a fourth heat dissipation system 100. For example, such as Figure 2E As shown, the four heat dissipation systems 100 can be arranged directly adjacent to each other, such that there are no gaps between the respective heat dissipation systems 100. In this respect, the cooling system 200 can be a compact cooling system to accommodate a small footprint. In one example, the first heat dissipation system 100, the second heat dissipation system 100, the third heat dissipation system 100, and the fourth heat dissipation system 100 can be located on a single solid base plate 116, as... Figure 2E As shown in the figure. In another example, each system may be located on a corresponding solid base plate 116, wherein the solid base plate 116 of the first heat dissipation system 100 may be flush with the solid base plate 116 of the second heat dissipation system 100, and so on, so that there is no gap between the corresponding solid base plates 116.
[0044] This paper envisions that the configuration of the heat dissipation system 100 can be modified, therefore Figures 2A to 2E The configurations shown are provided for illustrative purposes only and should not be construed as limiting the scope of this disclosure. For example, as Figure 2C and Figure 2E As shown, the heat dissipation system 100 can be generally rectangular. As another example, such as... Figure 2D As shown, the heat dissipation system 100 may include a rectangular base with a trapezoidal top.
[0045] This paper envisions that the heat dissipation system 100 can be infinitely modified based on the building's floor plan (e.g., roof surface area, channel structure, etc.) and / or the cooling needs of users / customers.
[0046] For example, Figures 3A to 3C One or more arrangement structures 300, 310, 320 of the heat dissipation system 100 are depicted. In the first arrangement structure 300, such as... Figure 3A As shown, the heat dissipation system 100 can be arranged such that there are inlet and outlet passages 302 between the respective systems 100. In the second arrangement structure 310, as... Figure 3B As shown, the heat dissipation system 100 can be arranged such that there are inlet and outlet channels 304 around the periphery of the respective system 100. In the third arrangement structure 320, as Figure 3C As shown, the heat dissipation system 100 can be arranged such that there is an inlet / outlet channel 306 below the respective system 100.
[0047] In some cases, the heat dissipation system 100 of the cooling system 200 may be connected together via one or more fastening members to provide additional support. In this respect, the heat dissipation system 100 may be bound together to provide additional support and protection from environmental factors (e.g., wind, earthquakes, tornadoes, etc.).
[0048] Cooling system 200 may include one or more refrigerant units 204. For example, one or more refrigerant units 204 may supply refrigerant to one or more CRAC units 202. In some cases, one or more CRAC units 202 may be phase change refrigerant air conditioning systems with refrigerant compressors, such as direct exchange (DX) systems. It is envisioned herein that the heat dissipation unit may also be used as a dry cooler to dissipate heat from water-based cooling systems. It is envisioned herein that mechanical devices may be mounted below or inside the refrigerant units 204.
[0049] The cooling system 200 may also include one or more controllers 208, each including one or more processors 210 and a memory 212. The one or more controllers 208 may adjust one or more settings of one or more components of the cooling system 200 based on one or more factors (e.g., outdoor temperature).
[0050] Figure 4 A simplified schematic diagram of a side-by-side heat dissipation system 200 according to one or more embodiments of the present disclosure is illustrated. It is envisioned herein that when the heat dissipation systems 100 are installed side-by-side, a gap 400 is formed above the lower fan 114. During periods of cold ambient air, the lower fan 114 can operate in reverse. Therefore, the system 200 is able to intentionally recirculate warmer air from other exhaust systems 100 and mix it with fresh ambient air received via opening 119 (through duct 118), wherein the lower heat dissipation units 102 are connected to allow such mixing. In this respect, the air temperature entering the coil 112 increases, thereby increasing the system pressure when the air temperature is low.
[0051] In a general sense, those skilled in the art will recognize that the aspects described herein, which can be implemented individually and / or collectively by a wide range of hardware, software, firmware, or any combination thereof, can be considered as consisting of various types of "circuits." Therefore, as used herein, "circuit" includes, but is not limited to, circuits having at least one discrete circuit, circuits having at least one integrated circuit, circuits having at least one application-specific integrated circuit, circuits forming a general-purpose computing device configured by a computer program (e.g., a general-purpose computer configured by a computer program that at least partially performs the processes and / or devices described herein, or a microprocessor configured by a computer program that at least partially performs the processes and / or devices described herein), circuits forming a storage device (e.g., in the form of random access memory), and / or circuits forming a communication device (e.g., a modem, communication switch, or optoelectronic device). Those skilled in the art will recognize that the subject matter described herein can be implemented in an analog or digital manner, or some combination thereof.
[0052] The topics described herein sometimes illustrate different components contained within or connected to different other components. It should be understood that the architectures depicted are merely exemplary, and many other architectures that achieve the same functionality can actually be implemented. Conceptually, any arrangement of components that achieve the same functionality is effectively “associated” to achieve the desired functionality. Therefore, any two components combined herein to achieve a particular function can be considered “associated” with each other to achieve the desired functionality, regardless of the architecture or intermediate components. Similarly, any two components so associated can also be considered “operably connected” or “operably linked” to each other to achieve the desired functionality, and any two components that can be so associated can also be considered “operably linked” to each other to achieve the desired functionality. Specific examples of components that can be operatedly linked include, but are not limited to, components that can be physically matched and / or physically interact, and / or components that can wirelessly interact and / or wirelessly interact, and / or components that can logically interact and / or logically interact.
[0053] While specific aspects of the subject matter described herein have been shown and described, it will be readily understood by those skilled in the art that changes and modifications can be made based on the teachings herein without departing from the subject matter and its broader aspects, and therefore, the appended claims include all such changes and modifications within their scope, as well as the true spirit and scope of the subject matter described herein. Furthermore, it should be understood that the invention is defined by the appended claims.
Claims
1. A heat dissipation system, comprising: The first heat dissipation unit includes a first set of fans and coils; A second heat dissipation unit is configured to be stacked on top of the first heat dissipation unit, wherein the second heat dissipation unit includes a second set of fans and coils; One or more central passages configured to connect the first heat dissipation unit to the second heat dissipation unit, wherein the one or more central passages divide the first heat dissipation unit into at least a first segment and a second segment, wherein the first segment includes a first fan and a first coil in the first set of fans and coils, and the second segment includes a second fan and a second coil in the first set of fans and coils; and An inlet duct, configured to communicate with the outside and receive new ambient air via an opening in the inlet duct, wherein the inlet duct is arranged below the first heat dissipation unit and configured to deflect the new ambient air toward at least one of the first heat dissipation unit or the second heat dissipation unit for discharge to the outside.
2. The heat dissipation system according to claim 1, wherein, The first heat dissipation unit is arranged on either a solid base plate or a sandwich structure to form the inlet pipe.
3. The heat dissipation system according to claim 2, wherein, The solid base plate or one of the sandwich structure is installed on the roof of the building.
4. The heat dissipation system according to claim 1, further comprising: A third heat dissipation unit is configured to be stacked on top of the second heat dissipation unit, wherein the first heat dissipation unit includes a first central passage of one or more central passages, and the second heat dissipation unit includes a second central passage of one or more central passages, wherein the first central passage connects the first heat dissipation unit to the second heat dissipation unit, and the second central passage connects the second heat dissipation unit to the third heat dissipation unit.
5. The heat dissipation system according to claim 4, wherein, The first central passage has a first width and the second central passage has a second width, wherein the first width is greater than the second width.
6. The heat dissipation system according to claim 1, wherein, The first heat dissipation unit and the second heat dissipation unit include one or more air barrier walls configured to prevent outside air from entering the heat dissipation system.
7. A cooling system, comprising: First exhaust heating system; as well as A second heat dissipation system, wherein the first heat dissipation system is arranged close to the second heat dissipation system. Each of the first heat dissipation system and the second heat dissipation system includes: The first heat dissipation unit includes a first set of fans and coils; A second heat dissipation unit is configured to be stacked on top of the first heat dissipation unit, wherein the second heat dissipation unit includes a second set of fans and coils; One or more central passages configured to connect the first heat dissipation unit to the second heat dissipation unit, wherein the one or more central passages divide the first heat dissipation unit into at least a first segment and a second segment, wherein the first segment includes a first fan and a first coil in the first set of fans and coils, and the second segment includes a second fan and a second coil in the first set of fans and coils; and An inlet duct, configured to communicate with the outside and receive new ambient air via an opening in the inlet duct, wherein the inlet duct is arranged below the first heat dissipation unit and configured to deflect the new ambient air toward at least one of the first heat dissipation unit or the second heat dissipation unit for discharge to the outside.
8. The cooling system according to claim 7, further comprising: One or more computer room air conditioning units are connected to the first heat dissipation system and the second heat dissipation system, wherein the first heat dissipation system and the second heat dissipation system are configured to provide one or more computer room air conditioning units with either cooling air or cooling liquid.
9. The cooling system according to claim 7, wherein, The first heat exhaust unit of the first heat exhaust system and the first heat exhaust unit of the second heat exhaust system are each arranged on one of the solid base plate or the sandwich structure to form the inlet pipe.
10. The cooling system according to claim 9, wherein, The solid base plate or one of the sandwich structure is installed on the roof of the building.
11. The cooling system according to claim 9, wherein, The first heat dissipation system is arranged at a predetermined distance from the second heat dissipation system.
12. The cooling system according to claim 11, wherein, The top surface of the solid base plate or the sandwich structure of the first heat dissipation system is flush with the top surface of the solid base plate or the sandwich structure of the second heat dissipation system.
13. The cooling system according to claim 7, wherein, The first heat exhaust unit of the first heat exhaust system and the first heat exhaust unit of the second heat exhaust system are arranged on one of a solid base plate or a sandwich structure to form the inlet pipe.
14. The cooling system according to claim 13, wherein, The first heat dissipation system is arranged to be substantially flush with the second heat dissipation system.
15. The cooling system according to claim 7, wherein, Each of the first heat dissipation system and the second heat dissipation system further includes: A third heat dissipation unit is configured to be stacked on top of the second heat dissipation unit, wherein the first heat dissipation unit includes a first central passage of one or more central passages, and the second heat dissipation unit includes a second central passage of one or more central passages, wherein the first central passage connects the first heat dissipation unit to the second heat dissipation unit, and the second central passage connects the second heat dissipation unit to the third heat dissipation unit.
16. The cooling system according to claim 15, wherein, The first central passage has a first width and the second central passage has a second width, wherein the first width is greater than the second width.
17. The cooling system according to claim 7, wherein, The first heat dissipation unit and the second heat dissipation unit include one or more air barrier walls configured to prevent outside air from entering the first heat dissipation system and the second heat dissipation system.
18. The cooling system according to claim 15, wherein, The third heat dissipation unit includes one or more air barrier walls configured to prevent outside air from entering the first heat dissipation system and the second heat dissipation system.
19. A cooling system, comprising: First exhaust heating system; as well as A second heat dissipation system is provided, wherein the first heat dissipation system is arranged adjacent to the second heat dissipation system, and a gap is formed between the first heat dissipation system and the second heat dissipation system. Each of the first heat dissipation system and the second heat dissipation system includes: The first heat dissipation unit includes a first set of fans and coils; A second heat dissipation unit is configured to be stacked on top of the first heat dissipation unit, wherein the second heat dissipation unit includes a second set of fans and coils; One or more central passages configured to connect the first heat dissipation unit to the second heat dissipation unit, wherein the one or more central passages divide the first heat dissipation unit into at least a first segment and a second segment, wherein the first segment includes a first fan and a first coil in the first set of fans and coils, and the second segment includes a second fan and a second coil in the first set of fans and coils; and An inlet duct, configured to communicate with the outside and receive fresh ambient air via an opening in the inlet duct, wherein the inlet duct is arranged below the first heat dissipation unit and configured to deflect the fresh ambient air toward at least one of the first or second heat dissipation units for discharge to the outside. The first heat dissipation unit of the first heat dissipation system and the first heat dissipation unit of the second heat dissipation system are connected.
20. The cooling system according to claim 19, wherein, The fans in each of the first heat dissipation units operate in reverse order to intentionally recirculate warmer air from either the first or second heat dissipation system and mix it with new ambient air received via the opening in the inlet duct.