High-entropy filler metal for brazing ceramic matrix composites and gh4950 nickel-based superalloy, preparation method and application

Abstract

This invention proposes a high-entropy brazing filler metal, its preparation method, and its application for brazing ceramic matrix composites with GH4950 nickel-based superalloy. The alloy formula of this high-entropy brazing filler metal is Ni a Cr b Co c Fe d W e Al f Si g B h Mo i C j In the formula, a, b, c, d, e, f, g, h, and i represent the mass percentages of the corresponding components, satisfying the following conditions: a is 27.7–39.5, b is 19–22, c is 13–15, d is 13–15, e is 6–8, f is 3–4, g is 2.5–3.5, h is 2.3–2.6, i is 1.6–2.0, j is 0.1–0.2, and a+b+c+d+e+f+g+h+i+j=100. This high-entropy solder is atomized by arc melting plasma to obtain spherical powder, which is then made into a slurry powder and uniformly coated onto SiC using screen printing technology. f The surface of the SiC composite material is brazed with GH4950 nickel-based superalloy to obtain a safe and reliable SiC composite material. f The SiC-GH4950 heterogeneous brazed joint improves the metallurgical reaction of the joint seam, avoids excessive reaction of interfacial elements, and achieves a brazing strength that is significantly superior to existing technologies, showing broad application prospects.

Description

Technical Field

[0001] This invention belongs to the field of nickel-based superalloy brazing, and relates to a high-entropy brazing filler metal for brazing ceramic matrix composites with GH4950 nickel-based superalloy, its preparation method and application. Background Technology

[0002] As a core component of advanced aircraft power systems, aircraft engines have long been characterized by lightweight design and high-temperature resistance. Currently, nickel-based superalloys are the primary materials for aircraft engines, favored for their excellent strength, toughness, and thermal stability. Among them, GH4950 nickel-based superalloy is widely used in the aerospace field due to its superior high-temperature strength, high-temperature fatigue resistance, creep resistance, and corrosion resistance. Ceramic matrix composites (CMCs) can withstand operating temperatures up to 1650℃ and possess advantages such as low density, high-temperature resistance, and high specific strength. However, the poor machinability of CMCs makes them unsuitable for manufacturing large structural components. To overcome this problem, combining CMCs with nickel-based superalloys to form hybrid components is crucial for resolving bottlenecks in turbine engine development.

[0003] Currently, aircraft engine components made of CMC / nickel-based superalloys primarily utilize mechanical connections and brazing. Riveting and bolting not only disrupt fiber continuity and lead to stress concentration but also increase the overall weight of CMC / superalloy components. Brazing is favored due to its low cost, convenience, and high precision. Two key issues exist in brazed joints between carbide-based composites and nickel-based superalloys. First, the significant difference in thermal expansion coefficients between the carbide-based composite and GH4950 leads to substantial residual stress. Furthermore, strong atomic diffusion between the matrix and filler metal can form hard and brittle intermetallic compounds (IMCs) at the interface, severely degrading joint performance. Currently, the main filler metals used are silver-copper-based or nickel-based materials. Silver-copper-based brazing alloys are primarily suitable for low-temperature applications, while nickel-based brazing alloys continuously interact with the matrix during high-temperature operation, exhibiting poor high-temperature stability. Therefore, it is necessary to design a novel, dedicated filler material to reduce the content of brittle intermetallic compounds within the joint, avoid excessive interfacial reaction, and control residual stress levels, ultimately obtaining a high-performance ceramic matrix composite-GH4950 heterogeneous brazed joint. Summary of the Invention

[0004] To address the problems existing in the prior art, this invention proposes a high-entropy brazing filler metal for brazing ceramic matrix composites to GH4950 nickel-based superalloy, its preparation method, and its application. To achieve the above objectives, this invention adopts the following technical solution:

[0005] High-entropy brazing filler metal for brazing ceramic matrix composites to GH4950 nickel-based superalloy, wherein the ceramic matrix composite is SiC containing SiC fibers. f / SiC composite material, the alloy expression of the high-entropy solder is Ni a Cr b Co c Fe d W e Al f Si g B h Mo i C j In the formula, a, b, c, d, e, f, g, h, and i represent the mass percentages of the corresponding components, and satisfy the following conditions: a is 27.7–39.5, b is 19–22, c is 13–15, d is 13–15, e is 6–8, f is 3–4, g is 2.5–3.5, h is 2.3–2.6, i is 1.6–2.0, j is 0.1–0.2, and a+b+c+d+e+f+g+h+i+j=100.

[0006] Furthermore, the alloy formula of the high-entropy solder is: Ni 35.65 Cr 19 Co 14 Fe 13.5 W7Al 3.5 Si3B 2.45 Mo 1.8 0C 0.1 or Ni 39.50 Cr 19 Co 13 Fe 13 W6Al3Si 2.5 B 2.30 Mo 1.60 C 0.1 or Ni 27.70 Cr 22 Co 15 Fe 15 W8Al 4.0 Si 3.5 B 2.60 Mo 2. 0C 0.2 The mixed entropy of the high-entropy solder is 15.03, 14.46, and 15.73, respectively.

[0007] Ni is preferred. 35.65 Cr 19 Co 14 Fe 13.5 W7Al 3.5 Si3B 2.45 Mo 1.80 C0.1 It not only utilizes the high-entropy effect to suppress the content of intermetallic compounds in the interface, but also promotes the slow growth of the interfacial reaction layer through the hysteresis diffusion effect, enabling SiC to... f The SiC-GH4950 heterogeneous brazed joint exhibits good high-temperature stability and high shear strength.

[0008] Furthermore, the SiC f SiC composite material is a high-performance material composed of SiC fibers as reinforcement and SiC ceramics as the matrix. The SiC fibers are formed by connecting different layers of weft fiber bundles through a corrugated weaving process, and mainly consist of α-SiC and β-SiC phases. Compared to SiC ceramics, the SiC... f / SiC composite materials, by introducing SiC fibers into a SiC ceramic matrix, not only inherit the inherent high temperature resistance, corrosion resistance, high strength and low density of ceramics, but more importantly, they achieve ductile fracture behavior similar to metals. Their operating temperature is far higher than that of nickel-based high temperature alloys, and they have excellent thermal shock resistance and radiation resistance, making them suitable for extremely harsh environments such as hot-end components of aero-engines and cladding materials for nuclear reactors.

[0009] Furthermore, the SiC f The density of the SiC composite material is 2.1 g / cm³. 3 Thermal conductivity is 10 W / (m·K), 20 o At temperature C, the tensile strength is 241 MPa, the elastic modulus is 96 GPa, and the coefficient of thermal expansion is (3.5-4.0) × 10⁻⁶. -6 / o C.

[0010] Furthermore, the atomic percentages of each component in the GH4950 nickel-based superalloy are: 16.07% Co, 9.51% Cr, 3.34% W, 0.10% Fe, 4.74% Ti, 0.72% Mo, 10.12% Al, with the remainder being Ni; its coefficient of thermal expansion is (12.23-17.29)×10⁻⁶. -6 / o C. Compared to traditional wrought nickel-based superalloys, the advantages of GH4950 alloy are mainly reflected in its higher operating temperature, superior overall performance, and optimized processing characteristics.

[0011] The present invention relates to a method for preparing a slurry-like high-entropy solder powder, comprising the following steps:

[0012] The mixed raw materials of the high-entropy brazing filler metal are processed into high-entropy spherical powder by arc melting plasma atomization; 70 wt.% of the high-entropy spherical powder is weighed, and then 27 wt.% of organic carrier, 1.5 wt.% of defoamer and 1.5 wt.% of dispersant are added in sequence; after stirring and grinding, a slurry-like high-entropy powder is obtained.

[0013] Furthermore, the atomization of the arc-melting plasma specifically involves:

[0014] The raw materials for the high-entropy brazing filler metal are mixed according to the mass ratio. The mixed raw materials are placed in a water-cooled copper crucible in the reactor. The vacuum degree in the reactor is first raised to 1.0 × 10⁻⁶. -3 Pa, then argon gas is introduced in stages to a working pressure of 0.05 MPa; pre-melted pure titanium getter is used to eliminate residual oxygen impurities in the furnace; multiple melting processes are carried out with stirring assistance, and after each melting process, the furnace is flipped 180° for remelting. Finally, after 3-5 cycles, the molten metal is atomized by high-speed plasma gas flow and rapidly cooled into high-entropy spherical powder.

[0015] Furthermore, the organic carrier is composed of 8 wt.% resin ethyl cellulose, 52 wt.% butyl carbitol, and 40 wt.% terpineol by mass ratio; the defoamer is polysiloxane, and the dispersant is triethanolamine.

[0016] The present invention relates to the application of the high-entropy solder, wherein the high-entropy solder is made into a slurry-like high-entropy powder, and then printed onto SiC using screen printing technology. f The SiC composite material is used as the base material. The average printing thickness is 60-80 μm. After baking at 150℃-200℃ for 30-35 min, it is removed and cooled to obtain SiC with a uniform surface coating of slurry-like high-entropy powder. f / SiC composite material.

[0017] Furthermore, the assembled GH4950 nickel-based superalloy and the SiC with its surface uniformly coated with slurry-like high-entropy powder are then combined. f The SiC composite material matrix was placed in a vacuum brazing furnace and evacuated to a vacuum level of 6×10⁻⁶. -3 Heat begins after Pa; first at 15 o Heat to brazing temperature 1180 °C / min. o C~1240 o C, and keep warm for 10 minutes, then at 10 o Cool down to 1150 °C / min o C, and keep warm for 2 minutes, then add 10 o Cool down to 450°C / min o C, and hold at that temperature for 60 minutes, then cool to room temperature in the furnace to obtain SiC. f / SiC-GH4950 heterogeneous brazing joint.

[0018] The beneficial effects of this invention are: the multi-principal element high-entropy solder proposed in this invention, which is a slurry powder with a microstructure of spherical and blocky phases mixed together, is effective for SiC containing fiber-reinforced phases. f When SiC composite materials are brazed with GH4950 nickel-based superalloy, they exhibit good wettability. During the brazing process, the high-entropy effect promotes the formation of a high content of multi-principal-element solid solution at the interface, inhibiting the formation of intermetallic compounds and significantly improving the interface's ductility and toughness. Simultaneously, the high-entropy brazing filler metal, with its main elements such as Ni, Co, Cr, and Fe, interacts with SiC... f The difference in diffusion capacity and affinity of SiC composite materials improves the multi-element-dominated metallurgical reaction at the joint interface, avoids excessive reaction of interfacial elements, and ultimately achieves brazing strength that is significantly superior to existing technologies, showing broad application prospects. Attached Figure Description

[0019] Figure 1 The microstructure of NiCrCoFeWAlSiBMoC powdered high-entropy solder;

[0020] Figure 2 SiC obtained according to Example 3 f Microstructure of the SiC-GH4950 heterogeneous brazed joint;

[0021] Figure 3 SiC obtained according to Example 4 f Microstructure of the SiC-GH4950 heterogeneous brazed joint;

[0022] Figure 4 SiC obtained according to Example 5 f / SiC-GH4950 heterogeneous brazed joint microstructure. Detailed Implementation

[0023] This embodiment further describes the technical solution of the present invention in detail with reference to the accompanying drawings.

[0024] Example 1 (Ni) 39.50 Cr 19 Co 13 Fe 13 W6Al3Si 2.5 B 2.30 Mo 1.60 C 0.1 )

[0025] According to Ni 39.50 Cr 19 Co 13 Fe 13 W6Al3Si 2.5B 2.30 Mo 1.60 C 0.1 The atomic mass percentage of the alloy formula represents the mixture of raw materials with a purity of 99.99% or higher.

[0026] Arc melting plasma atomization: The mixed raw materials are placed in a water-cooled copper crucible in the reactor, and the vacuum degree in the reactor is first raised to 1.0 × 10⁻⁶. -3 Pa, then high-purity argon gas (99.999%) is introduced in stages to a working pressure of 0.05 MPa; pre-melted pure titanium getter is used to eliminate residual oxygen impurities in the furnace; multiple melting processes are carried out with stirring assistance, and after each melting process, the furnace is flipped 180° for remelting. Finally, after 3-5 cycles, the molten metal is atomized by high-speed plasma gas flow and rapidly cooled into high-entropy spherical powder.

[0027] Preparation of slurry-like high-entropy powder: 8 wt.% of resin ethyl cellulose, 52 wt.% of butyl carbitol, and 40 wt.% of terpineol were mixed according to the mass ratio and stirred at 500 r / min for 3 h at room temperature using a high-speed dispersing mixer. After cooling, an organic carrier was obtained. 70 wt.% of the high-entropy spherical powder was weighed, and then 27 wt.% of the organic carrier, 1.5 wt.% of the defoamer polysiloxane, and 1.5 wt.% of the dispersant triethanolamine were added sequentially. The mixture was stirred at 300 r / min for 15 min and ground 6-7 times to obtain slurry-like high-entropy powder.

[0028] Sample preparation: SiC containing fibrous phase was prepared separately. f / SiC composite material and GH4950 nickel-based superalloy wire cut to size 3×10×15 mm 3 and 4×14.6×20 mm 3 For the sample, the surface to be welded was polished smooth with 600# sandpaper, and finally ultrasonically cleaned in acetone for 10 min.

[0029] Screen printing: The paste-like high-entropy powder is screen printed onto the fibrous SiC substrate using screen printing technology. f The average printing thickness on the surface of the SiC composite sample was 60-80 μm. After baking at 150 ℃-200 ℃ for 30-35 min, it was removed and cooled to obtain SiC with a uniformly coated surface of high-entropy slurry powder. f / SiC sample.

[0030] Brazing: This involves uniformly coating the assembled surface with a paste-like high-entropy powder of SiC. f The SiC sample and the GH4950 nickel-based superalloy sample were placed in a vacuum brazing furnace and evacuated to a vacuum level of 6 × 10⁻⁶. -3 Heating begins after Pa. First at 15... oHeat to 1180 C / min o Keep warm at 10°C for 10 minutes, then at 10°C. o Cool down to 1150 °C / min o C, and keep warm for 2 minutes, then at 10 o Cool down to 450°C / min o The sample was heated to C and held at that temperature for 60 minutes. Finally, the sample was cooled to room temperature in the furnace.

[0031] This implementation method can yield safe and reliable SiC. f The SiC-GH4950 heterostructure brazed joint achieves a maximum shear strength of 45.2 MPa at room temperature.

[0032] Example 2 (Ni) 27.70 Cr 22 Co 15 Fe 15 W8Al 4.0 Si 3.5 B 2.60 Mo 2.0 C 0.2 )

[0033] According to Ni 27.70 Cr 22 Co 15 Fe 15 W8Al 4.0 Si 3.5 B 2.60 Mo 2.0 C 0.2 The atomic mass percentage of the alloy formula represents the mixture of raw materials with a purity of 99.99% or higher.

[0034] The subsequent steps of arc melting plasma atomization, preparation of slurry high-entropy powder, sample processing, screen printing, and brazing are all the same as in Example 1.

[0035] This implementation method can yield safe and reliable SiC. f The SiC-GH4950 heterostructure brazed joint achieves a maximum shear strength of 47.6 MPa at room temperature.

[0036] Example 3 (Ni) 35.65 Cr 19 Co 14 Fe 13.5 W7Al 3.5 Si3B 2.45 Mo 1.80 C 0.1 )

[0037] According to Ni 35.65 Cr 19 Co14 Fe 13.5 W7Al 3.5 Si3B 2.45 Mo 1.80 C 0.1 The atomic mass percentage of the alloy formula represents the mixture of raw materials with a purity of 99.99% or higher.

[0038] The subsequent steps of arc melting plasma atomization, preparation of slurry high-entropy powder, sample processing, screen printing, and brazing are all the same as in Example 1.

[0039] This implementation method can yield safe and reliable SiC. f The SiC-GH4950 heterostructure brazed joint achieves a maximum shear strength of 52.29 MPa at room temperature.

[0040] Example 4 (Ni) 35.65 Cr 19 Co 14 Fe 13.5 W7Al 3.5 Si3B 2.45 Mo 1.80 C 0.1 )

[0041] According to Ni 35.65 Cr 19 Co 14 Fe 13.5 W7Al 3.5 Si3B 2.45 Mo 1.80 C 0.1 The atomic mass percentage of the alloy formula represents the mixture of raw materials with a purity of 99.99% or higher.

[0042] The subsequent steps of arc melting plasma atomization, preparation of slurry high-entropy powder, sample processing, and screen printing are all the same as in Example 1.

[0043] Brazing: This involves uniformly coating the assembled surface with a paste-like high-entropy powder of SiC. f The SiC sample and the GH4950 nickel-based superalloy sample were placed in a vacuum brazing furnace and evacuated to a vacuum level of 6 × 10⁻⁶. -3 Heating begins after Pa. First at 15... o Heat to 1220 C / min o Keep warm at 10°C for 10 minutes, then at 10°C. o Cool down to 1150 °C / min o C, and keep warm for 2 minutes, then at 10 o Cool down to 450°C / min o The sample was heated to C and held at that temperature for 60 minutes. Finally, the sample was cooled to room temperature in the furnace.

[0044] This implementation method can yield safe and reliable SiC. f The SiC-GH4950 heterostructure brazed joint achieves a maximum shear strength of 93.88 MPa at room temperature.

[0045] Example 5 (Ni) 35.65 Cr 19 Co 14 Fe 13.5 W7Al 3.5 Si3B 2.45 Mo 1.80 C 0.1 )

[0046] According to Ni 35.65 Cr 19 Co 14 Fe 13.5 W7Al 3.5 Si3B 2.45 Mo 1.80 C 0.1 The atomic mass percentage of the alloy formula represents the mixture of raw materials with a purity of 99.99% or higher.

[0047] The subsequent steps of arc melting plasma atomization, preparation of slurry high-entropy powder, sample processing, and screen printing are all the same as in Example 1.

[0048] Brazing: This involves uniformly coating the assembled surface with a paste-like high-entropy powder of SiC. f The SiC sample and the GH4950 nickel-based superalloy sample were placed in a vacuum brazing furnace and evacuated to a vacuum level of 6 × 10⁻⁶. -3 Heating begins after Pa. First at 15... o Heat to 1240 C / min o Keep warm at 10°C for 10 minutes, then at 10°C. o Cool down to 1150 °C / min o C, and keep warm for 2 minutes, then at 10 o Cool down to 450°C / min o The sample was heated to C and held at that temperature for 60 minutes. Finally, the sample was cooled to room temperature in the furnace.

[0049] This implementation method can yield safe and reliable SiC. f The SiC-GH4950 heterostructure brazed joint achieves a maximum shear strength of 81.71 MPa at room temperature.

[0050] Figure 2-4 They respectively demonstrated the use of Ni 35.65 Cr 19 Co 14 Fe 13.5W7Al 3.5 Si3B 2.45 Mo 1.80 C 0.1 High-entropy brazing of SiC containing fibrous phase f Microstructure of the joint obtained after combining SiC composite material with GH4950 nickel-based superalloy. Based on the microstructure morphology and elemental distribution, the SiC containing fibrous phase... f The brazed joint of SiC composite material / GH4950 nickel-based superalloy is mainly divided into four distinct regions: (I) layered region, (II) graphite enrichment region, (III) brazing filler metal solidification region, and (IV) nickel-based superalloy diffusion region. After 1180... o C-1240 o The control of C brazing temperature uses a preferred Ni 35.65 Cr 19 Co 14 Fe 13.5 W7Al 3.5 Si3B 2.4 5Mo 1.80 C 0.1 SiC during soldering f The shear strength of the SiC-GH4950 brazed joint reaches 93.88 MPa. For example... Figure 3 The microstructure shown reveals that significant grain boundary migration occurred in region I of the joint brazing seam, resulting in a wavy interface. This wavy interface effectively alleviates stress in SiC by providing a more complex stress distribution and enhanced mechanical interlocking. f The residual stress at the interface between the SiC base material and Region 1 strengthens the metallurgical bond at the interface. Furthermore, the formation of a multi-principal-element solid solution phase with a white BCC structure in Region IV within the brazed joint suppresses the content of intermetallic compounds at the interface, preventing a sharp deterioration in joint performance caused by the formation of large amounts of intermetallic compounds. Therefore, these two beneficial factors in the joint jointly promote the SiC... f High-performance brazing of SiC composite materials and GH4950 nickel-based superalloy.

[0051] Comparative Example 1

[0052] "Song Y, Liu D, Hu S, Song X, Lei Y, Cao J. Brazing of metallized SiCceramic to GH99 superalloy using graphene nanoplatelets reinforced AgCuTi composite filler. Ceram Int 2019;45:8962-70." The shear strength of the metallized SiC ceramic / GH99 nickel-based superalloy reinforced with graphene nanoplatelets was 26.4 MPa.

[0053] Comparative Example 2

[0054] "Song Y, Liu D, Li X, Song X, Long W, Cao J. Microstructure and mechanical properties of C f / SiC composite / GH99 joints brazed with BNi2-Ti composite filler. J Manuf Process 2020;58:905-13.” (This appears to be a reference to a journal article, possibly related to brazing SiC composite / GH99 joints with BNi2-Ti composite filler.) f The SiC composite material and GH99 nickel-based superalloy have a shear strength of 43.5 MPa.

[0055] Comparative Examples 1 and 2 above used graphene nanosheet-reinforced AgCuTi composite filler metal and BNi2-Ti composite filler metal, respectively, to braze ceramic matrix composites and nickel-based superalloys. The shear strengths were 26.4 MPa and 43.5 MPa, respectively, which are significantly lower than those using the preferred Ni alloy in this invention. 35.65 Cr 19 Co 14 Fe 13.5 W7Al 3.5 Si3B 2.45 Mo 1.80 C 0.1 The shear strength of the high-entropy brazing filler metal after soldering (93.88 MPa) is lower than that of the Ni used in this invention. 39.50 Cr 19 Co 13 Fe 13 W6Al3Si 2.5 B 2.30 Mo 1.60 C 0.1 and Ni 27.70 Cr 22Co 15 Fe 15 W8Al 4.0 Si 3.5 B 2.60 Mo 2.0 C 0.2 Shear properties after brazing with brazing filler metal. This invention utilizes a high-entropy brazing filler metal (NiCrCoFeWAlSiBMoC) that not only promotes the formation of multi-principal-element solid solutions at the interface through the high-entropy effect, thus suppressing the content of IMCs at the interface, but also controls the excessive reaction between the filler metal elements and the ceramic matrix composite material through the hysteresis diffusion effect, inhibiting the growth of the interfacial reaction layer. Based on this, further process control promotes significant interfacial migration, forming a micro-interlocking structure, achieving morphological control of the joint interface microstructure, and ultimately realizing high-performance brazing of the ceramic matrix composite material and GH4950 nickel-based superalloy.

[0056] The above embodiments are merely preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A high-entropy brazing filler metal for brazing ceramic matrix composites to GH4950 nickel-based superalloy, characterized in that, The ceramic matrix composite material is SiC containing SiC fibers. f / SiC composite material, the alloy expression of the high-entropy solder is Ni a Cr b Co c Fe d W e Al f Si g B h Mo i C j In the formula, a, b, c, d, e, f, g, h, i, and j represent the mass percentages of the corresponding components, and satisfy the following conditions: a is 27.7–39.5, b is 19–22, c is 13–15, d is 13–15, e is 6–8, f is 3–4, g is 2.5–3.5, h is 2.3–2.6, i is 1.6–2.0, j is 0.1–0.2, and a+b+c+d+e+f+g+h+i+j=100.

2. The high-entropy solder according to claim 1, characterized in that, The alloy formula for the high-entropy solder is: Ni 35.6 5Cr 19 Co 14 Fe 13.5 W7Al 3.5 Si3B 2.45 Mo 1.80 C 0.1 or Ni 39.50 Cr 19 Co 13 Fe 13 W6Al3Si 2.5 B 2.30 Mo 1.60 C 0.1 or Ni 27.70 Cr 22 Co 15 Fe 15 W8Al 4.0 Si 3.5 B 2.60 Mo 2.0 C 0.2 .

3. The high-entropy solder according to claim 1, characterized in that, The SiC f / SiC composite material is composed of SiC fiber as reinforcement and SiC ceramic as matrix. The SiC fiber is formed by connecting the weft fiber bundles of different layers through a corrugated weaving process, and is mainly composed of α-SiC phase and β-SiC phase.

4. The high-entropy solder according to claim 1, characterized in that, The SiC f The density of the SiC composite material is 2.1 g / cm³. 3 It has a thermal conductivity of 10 W / (m·K), a tensile strength of 241 MPa at 20℃, an elastic modulus of 96 GPa, and a coefficient of thermal expansion of (3.5-4.0)×10⁻⁶. -6 / ℃.

5. The high-entropy solder according to claim 1, characterized in that, The atomic percentages of the components in the GH4950 nickel-based superalloy are: 16.07% Co, 9.51% Cr, 3.34% W, 0.10% Fe, 4.74% Ti, 0.72% Mo, 10.12% Al, with the remainder being Ni; its coefficient of thermal expansion is (12.23-17.29)×10⁻⁶. -6 / ℃.

6. A method for preparing a slurry-like high-entropy powder of the high-entropy solder according to any one of claims 1-5, characterized in that, The steps include the following: The mixed raw materials of the high-entropy brazing filler metal were processed into high-entropy spherical powder by arc melting plasma atomization; 70 wt.% of the high-entropy spherical powder was weighed, and then 27 wt.% of organic carrier, 1.5 wt.% of defoamer and 1.5 wt.% of dispersant were added in sequence; after stirring and grinding, a slurry-like high-entropy powder was obtained.

7. The method for preparing slurry-like high-entropy powder of high-entropy solder according to claim 6, characterized in that, The arc melting plasma atomization is specifically as follows: The raw materials for the high-entropy brazing filler metal are mixed according to the mass ratio. The mixed raw materials are placed in a water-cooled copper crucible in the reactor. The vacuum degree in the reactor is first raised to 1.0 × 10⁻⁶. -3 Pa, then argon gas is introduced in stages to a working pressure of 0.05 MPa; pre-melted pure titanium getter is used to eliminate residual oxygen impurities in the furnace; multiple melting processes are carried out with stirring assistance, and after each melting process, 180° flipping and remelting are performed. Finally, after 3-5 cycles, the molten metal is atomized by high-speed plasma gas flow and rapidly cooled into high-entropy spherical powder.

8. The method for preparing slurry-like high-entropy powder of high-entropy solder according to claim 6, characterized in that, The organic carrier is composed of 8 wt.% resin ethyl cellulose, 52 wt.% butyl carbitol, and 40 wt.% terpineol by mass ratio; the defoamer is polysiloxane, and the dispersant is triethanolamine.

9. The application of the high-entropy solder according to any one of claims 1-5, characterized in that, The high-entropy solder is made into a slurry-like high-entropy powder, and then printed onto the SiC substrate using screen printing technology. f The SiC composite material was used as the base material, and the average printing thickness was 60-80 μm. After baking at 150℃-200℃ for 30-35 min, it was removed and cooled to obtain SiC with a uniform surface coating of slurry-like high-entropy powder. f / SiC composite material.

10. The application of the high-entropy solder according to claim 9, characterized in that, The assembled GH4950 nickel-based superalloy and the SiC with a uniformly coated surface of high-entropy powder were combined. f The SiC composite material matrix was placed in a vacuum brazing furnace and evacuated to a vacuum level of 6×10⁻⁶. -3 After Pa, heating begins; first, heat at 15℃ / min to the brazing temperature of 1180℃~1240℃ and hold for 10 min, then cool at 10℃ / min to 1150℃ and hold for 2 min, then cool at 10℃ / min to 450℃ and hold for 60 min, finally cooling in the furnace to room temperature to obtain SiC. f / SiC-GH4950 heterogeneous brazing joint.

Images