Liquid collecting device for preventing circuit board etching waste liquid from precipitating

Abstract

The invention discloses a liquid collecting device for preventing circuit board etching waste liquid from precipitating, and relates to the technical field of etching waste liquid collection, the liquid collecting device comprises a collecting box, the top end of the collecting box is provided with a multi-layer treatment mechanism, the multi-layer treatment mechanism is used for putting a precipitating agent in the process of collecting the etching waste liquid and stirring the etching waste liquid during putting, and the collecting box is used for collecting the precipitating agent. The multi-layer treatment mechanism adsorbs the etching waste liquid after stirring treatment, a precipitant and the etching waste liquid are fully mixed through rotation of a treatment plate, formation of solid particles is facilitated, and the solid particles in the etching waste liquid can be buffered when the etching waste liquid is collected, so that abrasion between the solid particles and a separation structure is reduced, and the service life of the etching waste liquid is prolonged. Meanwhile, after the etching waste liquid is treated by the double-layer anti-precipitation mechanism, tiny particles in the etching waste liquid can be further adsorbed through rotation and reciprocating motion of the adsorption plate, so that the phenomenon that particle precipitation does not occur after the etching waste liquid is collected is ensured, and subsequent treatment of a user on the etching waste liquid is facilitated.

Description

Technical Field

[0001] This invention relates to the field of etching waste liquid collection technology, specifically to a liquid collection device for preventing the precipitation of circuit board etching waste liquid. Background Technology

[0002] Printed circuit board etching waste liquid mainly refers to the waste liquid generated during the manufacturing process of printed circuit boards. It mainly includes acidic etching waste liquid and alkaline etching waste liquid. These waste liquids contain a large amount of metallic copper, chlorides, ammonia or hydrochloric acid, sulfuric acid and a certain amount of organic matter. They are classified as high-risk wastewater. Therefore, the waste liquid is collected by liquid collection devices to avoid environmental pollution and to facilitate subsequent centralized treatment.

[0003] Existing liquid collection devices still have the following drawbacks in use: 1. Liquids usually require solid-liquid separation during collection. Separation is achieved by using separation components to allow solids inside the etching waste liquid to settle at the bottom. If multi-layer separation components are used, the separated solids are distributed on the surface of each separation structure, making them difficult to clean. This necessitates separating each separation structure to facilitate cleaning of its surface, which is time-consuming and extends the cleaning time of the separation structure surface.

[0004] 2. In the solid-liquid separation process of etching waste liquid, most of the time a fixed separation operation is adopted. The separation is carried out by using a fixed separation structure and a fixed flow direction of etching waste liquid. This results in solid impurities in the etching waste liquid coming into contact with the surface of the separation structure at a relatively fast speed. As a result, solid impurities are more likely to leave scratches on the surface of the separation structure. Scratches will change the surface roughness of the separation structure, thereby affecting the flow characteristics of the waste liquid, which in turn leads to a decrease in separation efficiency and a situation where the waste liquid cannot fully contact the separation structure, thus affecting the normal separation of the separation structure. Summary of the Invention

[0005] To address the aforementioned shortcomings of existing technologies, this invention provides a liquid collection device for preventing the sedimentation of PCB etching waste liquid. This device effectively solves the problems in existing technologies where solid impurities are difficult to remove when using multi-layer separation components for fixed separation of etching waste liquid, and where fixed separation methods easily leave scratches on the surface of the separation structure due to solid impurities, affecting the normal separation of the separation structure.

[0006] To achieve the above objectives, the present invention provides the following technical solution: This invention discloses a liquid collection device for preventing the sedimentation of circuit board etching waste liquid, comprising a collection box, a collection hopper fixedly connected inside the collection box, a temperature control chamber opened inside the collection hopper, a gas guide pipe fixedly connected to the inner wall of the temperature control chamber, the gas guide pipe penetrating the inner wall of the collection box, an outlet plate fixedly connected to the outer surface of the collection hopper, a diversion plate fixedly connected to the top of the collection hopper, liquid guide holes opened at both ends of the collection hopper, an inlet hole opened at the top of the diversion plate, a circular hole and an arc-shaped hole opened at the top of the outlet plate, a multi-layer processing mechanism provided at the top of the collection box, and a double-layer discharge mechanism provided between the multi-layer processing mechanism and the collection box; The multi-layer processing mechanism includes a drive box. The multi-layer processing mechanism is used to add a precipitant during the collection of etching waste liquid and to stir the etching waste liquid during the addition process. The multi-layer processing mechanism also performs adsorption treatment on the etching waste liquid after stirring. The dual-layer discharge mechanism is used to extract impurities and precipitates after the etching waste liquid is treated, and automatically removes residual liquid and impurities from the top of the collection tank after extraction.

[0007] Furthermore, the multi-layer processing mechanism includes a drive shaft. The bottom end of the drive box is fixedly connected to the top end of the collection box. The drive shaft is rotatably connected to the top end of the drive box. A cam is fixedly connected to the bottom end of the drive shaft. A transmission wheel is fixedly connected to the bottom end of the cam. A protruding post is fixedly connected to the top end of the transmission wheel. A processing cylinder is fixedly connected to the bottom end of the processing cylinder. A liquid guide cylinder is rotatably connected to the outer surface of the processing cylinder. The outer surface of the liquid guide cylinder is fixedly connected to the bottom end of the drive box and the top end of the collection box. A liquid guide pipe is fixedly connected to the outer surface of the liquid guide cylinder. The liquid guide pipe passes through the inner wall of the drive box. An outlet is opened at the bottom end of the liquid guide cylinder. The outlet is located on the center line between the collection hopper and the diversion plate.

[0008] Furthermore, a guide ring is rotatably connected to the outer surface of the processing cylinder, the guide ring is fixedly connected to the top of the liquid guiding cylinder, a guide cavity is opened inside the guide ring, a guide tube is fixedly connected to the outer surface of the guide ring, the guide tube passes through the inner wall of the drive box, the guide tube communicates with the guide cavity, and multiple guide holes are opened on the outer surface of the processing cylinder, the guide holes communicate with the guide cavity.

[0009] Furthermore, a processing plate is fixedly connected to the outer surface of the processing cylinder, and an initiator cavity is opened inside the processing plate. The initiator cavity is connected to the processing cylinder, and an outlet hole is opened on the outer surface of the processing plate. The outlet hole is connected to the initiator cavity.

[0010] Furthermore, a drive plate is slidably connected inside the drive box, and a spring is fixedly connected to the side of the drive plate away from the cam. The spring is fixedly connected to the inner wall of the drive box. A drive frame is fixedly connected to the outer surface of the drive plate. The drive frame is slidably connected to the inner wall of the drive box. A drive rod is fixedly connected to the end of the drive frame away from the drive plate. The drive rod is slidably connected to the top of the collection box and the top of the collection hopper. A control plate is fixedly connected inside the collection hopper.

[0011] Furthermore, a drive column is fixedly connected to one end of the drive rod near the control board, and a roller is rotatably connected to the outer surface of the drive column. The outer surface of the roller abuts against the top of the control board, and an adsorption plate is fixedly connected to the other end of the roller away from the drive rod.

[0012] Furthermore, the double-layer discharge mechanism includes a transmission plate, which is rotatably connected to the inner wall of the drive box. A transmission shaft is fixedly connected to the bottom end of the transmission plate, and the transmission shaft is rotatably connected to the top end of the collection box. A connecting plate is fixedly connected to the bottom end of the transmission shaft, and the connecting plate is rotatably connected to the top end of the collection hopper. Guide plates are fixedly connected to both ends of the connecting plate, and scrapers are fixedly connected to both sides of the connecting plate.

[0013] Furthermore, a sealing plate is provided inside the guide plate, and an integrated mounting plate is fixedly connected to the outer surface of the sealing plate. A rotating shaft is inserted inside the integrated mounting plate, and both ends of the rotating shaft are fixedly connected to the inside of the guide plate. A second spring is fixedly connected to the outer surface of the rotating shaft, and the second spring is fixedly connected to the inside of the integrated mounting plate. A filter hole is opened at the top of the sealing plate.

[0014] Compared with the known prior art, the technical solution provided by this invention has the following beneficial effects: 1. During the collection of etching waste liquid, the treatment plate rotates and a precipitant is added. This allows the precipitant to form larger solid particles with the suspended particles and dissolved substances in the waste liquid during collection. The rotation of the treatment plate ensures thorough mixing of the precipitant and the etching waste liquid, which is beneficial for the formation of solid particles. Furthermore, the treatment plate buffers the solid particles within the waste liquid during collection, reducing wear between the solid particles and the separation structure. After the etching waste liquid is treated by the double-layer anti-precipitation mechanism, the rotation and reciprocating motion of the adsorption plate further adsorbs the tiny particles in the etching waste liquid, ensuring that no particles settle after collection. This effectively prevents the formation of precipitates, avoids precipitates occupying the collection space of the etching waste liquid, and facilitates the user's subsequent treatment of the etching waste liquid.

[0015] 2. During the addition of the precipitant to the etching waste liquid, the rotation of the treatment plate synchronously drives the guide plate and scraper to rotate. After the etching waste liquid is treated with the precipitant, solid particles can be separated by the diversion plate, the sealing plate, and the liquid guide hole at the top of the collection hopper. This prevents solid particles from entering the collection hopper and causing sedimentation. The rotation of the scraper and the automatic opening and closing of the sealing plate can automatically clean the solid particles from the top of the collection hopper into the circular and arc-shaped grooves of the outlet plate. This ensures that there are no solid particles or etching waste liquid residues at the top of the collection hopper, thus completing the collection of solid particles inside the etching waste liquid and preventing the etching waste liquid from being affected by the presence of solid particles during flow, thereby improving the subsequent treatment efficiency of the etching waste liquid. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a three-dimensional structural view of the present invention from another angle; Figure 3 This is a three-dimensional structural diagram of the multi-layer processing mechanism in this invention; Figure 4 This is a partial three-dimensional structural diagram of the multi-layer processing mechanism in this invention; Figure 5 This is a three-dimensional structural diagram of the multi-layer processing mechanism and the double-layer discharge mechanism in this invention; Figure 6 This is a partial three-dimensional structural diagram of the multi-layer processing mechanism and the double-layer discharge mechanism in this invention; Figure 7 This is a side cross-sectional view of the guide plate and the sealing plate in this invention; Figure 8 In this invention Figure 7 Enlarged structural diagram at point A in the middle; Figure 9 This is a cross-sectional view of the collecting hopper in this invention; Figure 10 This is a cross-sectional view of the collecting bucket and roller in this invention.

[0018] The labels in the diagram represent: 1. Collection box; 2. Air delivery tube; Multi-layer processing mechanism: 31. Drive box; 32. Drive shaft; 33. Cam; 34. Transmission wheel; 35. Processing cylinder; 36. Processing plate; 37. Guide ring; 38. Guide tube; 39. Liquid guide cylinder; 310. Liquid guide tube; 311. Drive plate; 312. Spring 1; 313. Drive frame; 314. Drive rod; 315. Drive column; 316. Roller; 317. Adsorption plate; 318. Protruding column; 4. Collection hopper; 5. Control panel; 6. Drainage plate; 7. Discharge plate; Double-layer anti-sedimentation mechanism: 81. Transmission plate; 82. Transmission shaft; 83. Connecting plate; 84. Guide plate; 85. Rotating shaft; 86. Sealing plate; 87. Spring II; 88. Scraper. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0020] The present invention will be further described below with reference to embodiments.

[0021] This embodiment provides a liquid collection device for preventing the sedimentation of circuit board etching waste liquid, such as... Figures 1 to 10 As shown, it includes a collection box 1, a collection hopper 4 fixedly connected inside the collection box 1, a temperature control chamber opened inside the collection hopper 4, a gas guide pipe 2 fixedly connected to the inner wall of the temperature control chamber, the gas guide pipe 2 passing through the inner wall of the collection box 1, an outlet plate 7 fixedly connected to the outer surface of the collection hopper 4, a diversion plate 6 fixedly connected to the top of the collection hopper 4, liquid guide holes opened at both ends of the collection hopper 4, an inlet hole opened at the top of the diversion plate 6, and a circular hole and an arc-shaped hole opened at the top of the outlet plate 7. In view of the above-mentioned collection box 1, it can be implemented as follows: The top of the collection box 1 is equipped with a multi-layer processing mechanism, which includes a drive box 31. The multi-layer processing mechanism is used to add a precipitant during the collection of etching waste liquid and to stir the etching waste liquid during the addition process. After stirring, the multi-layer processing mechanism adsorbs the etching waste liquid.

[0022] As a preferred embodiment of this example, Figure 3 , Figure 4 and Figure 6As shown, the multi-layer processing mechanism includes a drive shaft 32. The bottom end of the drive housing 31 is fixedly connected to the top end of the collection tank 1. The drive shaft 32 is rotatably connected to the top end of the drive housing 31. A cam 33 is fixedly connected to the bottom end of the drive shaft 32. A transmission wheel 34 is fixedly connected to the bottom end of the cam 33. A protrusion 318 is fixedly connected to the top end of the transmission wheel 34. A processing cylinder 35 is fixedly connected to the bottom end of the transmission wheel 34. A liquid guide cylinder 39 is rotatably connected to the outer surface of the processing cylinder 35. The outer surface of the liquid guide cylinder 39 is fixedly connected to the bottom end of the drive housing 31 and the top end of the collection tank 1. A liquid guide pipe 310 is fixedly connected to the outer surface of the liquid guide cylinder 39. The liquid guide pipe 310 penetrates the inner wall of the drive housing 31. The bottom end of the liquid guide cylinder 39... An outlet is provided, located on the center line between the collection hopper 4 and the guide plate 6. A guide ring 37 is rotatably connected to the outer surface of the processing cylinder 35, and the guide ring 37 is fixedly connected to the top of the liquid guiding cylinder 39. A guide cavity is formed inside the guide ring 37, and a guide tube 38 is fixedly connected to the outer surface of the guide ring 37. The guide tube 38 passes through the inner wall of the drive box 31 and communicates with the guide cavity. Multiple guide holes are formed on the outer surface of the processing cylinder 35, and the guide holes communicate with the guide cavity. A processing plate 36 is fixedly connected to the outer surface of the processing cylinder 35. An induction cavity is formed inside the processing plate 36, and the induction cavity communicates with the processing cylinder 35. An outlet hole is formed on the outer surface of the processing plate 36, and the outlet hole communicates with the induction cavity. By rotating the processing plate 36 and adding precipitant, larger solid particles can be formed with suspended particles and dissolved substances in the etching waste liquid during the collection process.

[0023] As a preferred embodiment of this example, Figure 3 , Figure 4 , Figure 9 and Figure 10 As shown, a drive plate 311 is slidably connected inside the drive box 31. A spring 312 is fixedly connected to the side of the drive plate 311 away from the cam 33. The spring 312 is fixedly connected to the inner wall of the drive box 31. A drive frame 313 is fixedly connected to the outer surface of the drive plate 311. The drive frame 313 is slidably connected to the inner wall of the drive box 31. A drive rod 314 is fixedly connected to the end of the drive frame 313 away from the drive plate 311. A drive column 315 is fixedly connected to the end of the drive rod 314 near the control plate 5. A roller 316 is rotatably connected to the outer surface of the drive column 315. The outer surface of the roller 316 abuts against the top of the control plate 5. An adsorption plate 317 is fixedly connected to the end of the roller 316 away from the drive rod 314. The rotation and reciprocating motion of the adsorption plate 317 can further adsorb the tiny particles in the etching waste liquid, thereby ensuring that no particles will precipitate after the etching waste liquid is collected, thus effectively preventing the formation of precipitates.

[0024] Compared with the prior art, the present invention can add a precipitant during the collection of etching waste liquid to form larger solid particles from suspended particles and dissolved substances in the waste liquid. After the solid particles are formed, the flow direction of the etching waste liquid acts as a buffer, which helps to reduce the wear of the solid particles on the separation structure. After separation, the small particles in the etching waste liquid are adsorbed by the rotation and reciprocating motion of the adsorption plate 317, thereby effectively preventing the formation of precipitates after the etching waste liquid is collected. This expands the collection space of the etching waste liquid, making it easier for users to carry out subsequent treatment of the etching waste liquid.

[0025] At other levels, this embodiment also provides a mechanism capable of extracting impurities and precipitates, such as... Figures 1 to 8 As shown, a double-layer discharge mechanism is provided between the multi-layer processing mechanism and the collection box 1. The double-layer discharge mechanism is used to extract the impurities and precipitates after the etching waste liquid is treated, and automatically removes the residual liquid and impurities at the top of the collection box 1 after extraction.

[0026] As a preferred embodiment of this example, Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, the double-layer discharge mechanism includes a transmission plate 81. The top of the transmission plate 81 has four grooves that fit the protrusions 318, and these grooves are positioned along the rotation path of the protrusions 318. The transmission plate 81 is rotatably connected to the inner wall of the drive box 31. A transmission shaft 82 is fixedly connected to the bottom of the transmission plate 81. The transmission shaft 82 is rotatably connected to the top of the collection box 1. A connecting plate 83 is fixedly connected to the bottom of the transmission shaft 82. The connecting plate 83 is rotatably connected to the top of the collection hopper 4. The device has guide plates 84 fixedly connected at both ends, scrapers 88 fixedly connected to both sides of the connecting plate 83, a sealing plate 86 inside the guide plate 84, an integrated mounting plate fixedly connected to the outer surface of the sealing plate 86, a rotating shaft 85 inserted inside the integrated mounting plate, the two ends of the rotating shaft 85 fixedly connected to the inside of the guide plate 84, and a second spring 87 fixedly connected to the outer surface of the rotating shaft 85, which is fixedly connected to the inside of the integrated mounting plate. A filter hole is opened at the top of the sealing plate 86. By rotating the scrapers 88 and automatically opening and closing the sealing plate 86, solid particles can be automatically cleaned from the top of the collection hopper 4 into the circular and arc-shaped grooves of the discharge plate 7, thus ensuring that there is no solid particle sedimentation or etching waste liquid residue at the top of the collection hopper 4.

[0027] Compared with existing technologies, this invention can automatically perform multi-layer separation after the etching waste liquid reacts with the precipitant, further improving the separation effect of the etching waste liquid. It can avoid the phenomenon of particulate matter precipitation in the etching waste liquid, and automatically clean the solid particles and residual etching waste liquid on the surface of the separation structure after separation. Moreover, the whole process does not require manual operation, which can reduce the harm of etching waste liquid to the human body and improve the fluidity of etching waste liquid, thereby improving the subsequent treatment efficiency of etching waste liquid.

[0028] Working principle: Initial limitations: Before using this device, at this time Figure 6 Inside, the guide plate 84 is located below the liquid guide tube 39. At this time, the sealing plate 86 is in the state of sealing the bottom of the guide plate 84, and the spring 87 is in the compressed state. The user needs to connect the precipitant source to the external guide tube 38 and the etching waste liquid source to the external guide tube 310. The user needs to install a motor at the top of the drive shaft 32, and the output shaft of the motor is connected to the top of the drive shaft 32. The motor serves as the power source for the drive shaft 32. Users also need to connect an external temperature control source to the air duct 2. The temperature control source can be divided into a hot air source and a cold air source. Choose the appropriate temperature control source according to the ambient temperature. Users need to place a storage box at the bottom of the collection hopper 4 to collect the etching waste liquid, and place a storage box at the bottom of the discharge plate 7 to collect solid particles. Multiple treatment processes and double-layer anti-sedimentation steps: First, the user needs to select a suitable temperature control source based on the ambient temperature. When the ambient temperature is high, the user should select a cold air source and then turn on the cold air source. The cold air in the cold air source enters the air guide pipe 2 and enters the temperature control chamber from the air guide pipe 2, thereby controlling the overall temperature inside the collection bucket 4 and simultaneously controlling the temperature of the inner wall of the liquid guide holes at both ends of the collection bucket 4, thereby controlling the temperature of the etching waste liquid at an appropriate temperature, which is beneficial to improving the treatment efficiency of the etching waste liquid. The user then connects the etching waste liquid source, such as Figure 6 As shown, the etching waste liquid in the etching waste liquid source enters the liquid guide pipe 310, and then enters the liquid guide cylinder 39 from the liquid guide pipe 310, thus completing the introduction of the etching waste liquid. Simultaneously, the precipitant source is connected, and the precipitant in the precipitant source enters the precipitant guide pipe 38, as shown. Figure 6 As shown, the precipitant enters the precipitant chamber within the precipitant ring 37 from inside the precipitant tube 38. The precipitant then enters the precipitant hole on the processing cylinder 35 from the precipitant chamber, and subsequently enters the processing cylinder 35 through the precipitant hole. From inside the processing cylinder 35, the precipitant enters the induction chamber within the processing plate 36. The user needs to connect the motor power supply; the motor will then start working. Figure 3As shown, the motor's output shaft drives the drive shaft 32 to rotate clockwise. When the drive shaft 32 rotates clockwise, it drives the cam 33 to rotate clockwise. When the cam 33 rotates clockwise, it drives the transmission wheel 34 to rotate clockwise. When the transmission wheel 34 rotates clockwise, it drives the processing cylinder 35 to rotate clockwise. When the processing cylinder 35 rotates clockwise, it drives the processing plate 36 to rotate. This allows the precipitant in the initiator chamber to be released through the outlet hole into the liquid guide cylinder 39 to react with the etching waste liquid. During the collection of the etching waste liquid, the precipitant reacts with suspended particles and dissolved substances in the waste liquid to form larger solid particles. The rotation of the processing plate 36 ensures thorough mixing of the precipitant and the etching waste liquid, which is beneficial for the formation of solid particles. Figure 6 As shown, the etching waste liquid enters the liquid guiding cylinder 39 through the liquid guiding pipe 310, and the liquid guiding pipe 310 is located around the rotation range of the processing plate 36. Therefore, when the etching waste liquid enters the liquid guiding cylinder 39, it comes into contact with the processing plate 36 which is in a rotating state. Then, when the etching waste liquid is collected, the rotation of the processing plate 36 changes the flow direction of the etching waste liquid inside the liquid guiding cylinder 39, thereby buffering the solid particles inside the etching waste liquid and reducing the wear between the solid particles and the separation structure. like Figure 6 As shown, after the above treatment, the etching waste liquid is introduced from the inside of the liquid guiding cylinder 39 into the inside of the sealing plate 86, and the first layer of solid-liquid separation is completed through the filter hole at the top of the sealing plate 86. After the first layer of solid-liquid separation, the etching waste liquid forms a second layer of solid-liquid separation through the inlet hole at the top of the diversion plate 6. After separation, as shown... Figure 5 As shown, when the transmission wheel 34 rotates clockwise, it drives the protrusion 318 to rotate clockwise. Since the groove on the transmission plate 81 is located on the rotation path of the protrusion 318, the protrusion 318 pushes the transmission plate 81 to rotate counterclockwise when rotating clockwise. When the transmission plate 81 rotates counterclockwise, it drives the transmission shaft 82 to rotate counterclockwise. When the transmission shaft 82 rotates counterclockwise, it drives the connecting plate 83 to rotate counterclockwise. Figure 6 As shown, when the connecting plate 83 rotates counterclockwise, it drives the guide plate 84 away from the bottom of the liquid guiding cylinder 39. The rotation angle is 90 degrees. With continuous 90-degree rotation, the guide plate 84, originally located at the bottom of the liquid guiding cylinder 39, rotates to its original position away from the liquid guiding cylinder 39. This causes the sealing plate 86 at the bottom of the guide plate 84 to be directly opposite the circular groove, thus depriving the sealing plate 86 of support from the top of the outlet plate 7. Figure 8As shown, after the sealing plate 86 loses its support from the top of the guide plate 7, its spring 87 loses its compression from the sealing plate 86, thus restoring the spring 87 to its original state. This causes the sealing plate 86 to flip due to the rebound force of the spring 87, so that the end of the sealing plate 86 away from the rotating shaft 85 moves away from the bottom end of the guide plate 84, thereby releasing the blockage on the bottom end of the guide plate 84. This allows the solid particles remaining after the first layer of solid-liquid separation to be introduced into the storage box through the circular groove after flipping, thus completing the cleaning of solid particles on the surface of the sealing plate 86 and facilitating better separation of particles in the etching waste liquid. like Figure 6 As shown, when the connecting plate 83 rotates counterclockwise, it drives the scraper 88 to rotate counterclockwise. Under continuous counterclockwise rotation, the scraper 88 cleans the solid particles from the top of the collection hopper 4 into the arc-shaped groove of the outlet plate 7, thereby ensuring that there are no solid particles precipitated and no etching waste liquid residue at the top of the collection hopper 4. This completes the collection of solid particles inside the etching waste liquid and prevents the etching waste liquid from being affected by the presence of solid particles during flow, thereby improving the subsequent treatment efficiency of the etching waste liquid. By automatically changing the positions of the scraper 88 and the sealing plate 86, it can be ensured that no solid particles block the inlet hole at the top of the guide plate 6 during the separation process, thereby ensuring that the etching waste liquid can be evenly introduced into the interior of the collection hopper 4 through the inlet hole at the top of the guide plate 6. like Figure 10 As shown, the etching waste liquid enters the collection hopper 4 after secondary separation through the inlet hole at the top of the guide plate 6, as... Figure 3 As shown, the drive plate 311 is located around the cam 33 and is slidably connected to the inner wall of the drive housing 31. Therefore, when the cam 33 rotates clockwise, it pushes the drive plate 311 away from the drive shaft 32. When the drive plate 311 moves away from the drive shaft 32, it presses the spring 312, causing the spring 312 to deform. When the cam 33 rotates clockwise to move away from the drive plate 311, the drive plate 311 is no longer pushed by the cam 33, and the spring 312 is no longer pressed by the drive plate 311. This causes the drive plate 311 to move closer to the drive shaft 32 by the restoring force of the spring 312, thus causing the drive plate 311 to reciprocate. During the reciprocating motion, the drive plate 311 drives the drive frame 313 to reciprocate, and the drive frame 313 drives the drive rod 314 to reciprocate. Figure 10As shown, the drive rod 314 drives the drive column 315 to reciprocate during its reciprocating motion. Since the drive column 315 is rotatably connected to the roller 316, and the bottom end of the roller 316 abuts against the top end of the control plate 5, the drive column 315 synchronously drives the roller 316 to reciprocate during its reciprocating motion. The roller 316 generates friction through its contact with the top end of the control plate 5, causing it to rotate during its reciprocating motion. This rotation of the roller 316 drives the adsorption plate 317 to rotate and reciprocate. The rotation of the adsorption plate 317 continuously changes the position of the adsorption plate 317. The contact position between the 17 and the waste liquid increases the dynamic contact area. At the same time, the rotating and moving adsorption plate 317 is suitable for etching waste liquids in different flow states, whether laminar or turbulent, and can effectively treat them. It can further adsorb the tiny particles in the etching waste liquid, thereby ensuring that no particles will settle after the etching waste liquid is collected. This effectively prevents the formation of precipitates and avoids precipitates occupying the collection space of the etching waste liquid, which is beneficial to the user for subsequent treatment of the etching waste liquid. The etching waste liquid treated by the adsorption plate 317 is introduced into the storage tank, thereby completing the collection of etching waste liquid and preventing sedimentation.

[0029] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A liquid collection device for preventing sedimentation of circuit board etching waste liquid, characterized in that, The system includes a collection box (1), a collection hopper (4) is fixedly connected inside the collection box (1), a temperature control chamber is opened inside the collection hopper (4), a gas guide pipe (2) is fixedly connected to the inner wall of the temperature control chamber, the gas guide pipe (2) passes through the inner wall of the collection box (1), an outlet plate (7) is fixedly connected to the outer surface of the collection hopper (4), a flow guide plate (6) is fixedly connected to the top of the collection hopper (4), liquid guide holes are opened at both ends of the collection hopper (4), an inlet hole is opened at the top of the flow guide plate (6), a circular hole and an arc hole are opened at the top of the outlet plate (7), a multi-layer processing mechanism is provided at the top of the collection box (1), and a double-layer discharge mechanism is provided between the multi-layer processing mechanism and the collection box (1). The multi-layer processing mechanism includes a drive box (31), which is used to add a precipitant during the collection of etching waste liquid and to stir the etching waste liquid during the addition. The multi-layer processing mechanism then performs adsorption treatment on the etching waste liquid after stirring. The double-layer discharge mechanism is used to extract impurities and precipitates after the etching waste liquid is treated, and automatically removes residual liquid and impurities from the top of the collection box (1) after extraction.

2. The liquid collection device for preventing precipitation of circuit board etching waste liquid according to claim 1, characterized in that, The multi-layer processing mechanism includes a drive shaft (32), the bottom end of the drive box (31) is fixedly connected to the top end of the collection box (1), the drive shaft (32) is rotatably connected to the top end of the drive box (31), a cam (33) is fixedly connected to the bottom end of the drive shaft (32), a transmission wheel (34) is fixedly connected to the bottom end of the cam (33), a protrusion (318) is fixedly connected to the top end of the transmission wheel (34), and a processing cylinder (3) is fixedly connected to the bottom end of the transmission wheel (34). 5) A liquid guide tube (39) is rotatably connected to the outer surface of the processing tube (35). The outer surface of the liquid guide tube (39) is fixedly connected to the bottom end of the drive box (31) and the top end of the collection box (1). A liquid guide pipe (310) is fixedly connected to the outer surface of the liquid guide tube (39). The liquid guide pipe (310) passes through the inner wall of the drive box (31). An outlet is opened at the bottom end of the liquid guide tube (39). The outlet is located on the center line of the collection hopper (4) and the diversion plate (6).

3. The liquid collection device for preventing precipitation of circuit board etching waste liquid according to claim 2, characterized in that, The outer surface of the processing cylinder (35) is rotatably connected to a guide ring (37), which is fixedly connected to the top of the liquid guide cylinder (39). The guide ring (37) has a guide cavity inside, and a guide tube (38) is fixedly connected to the outer surface of the guide ring (37). The guide tube (38) passes through the inner wall of the drive box (31) and communicates with the guide cavity. The outer surface of the processing cylinder (35) has multiple guide holes, which communicate with the guide cavity.

4. The liquid collection device for preventing precipitation of circuit board etching waste liquid according to claim 2, characterized in that, A processing plate (36) is fixedly connected to the outer surface of the processing cylinder (35). An initiator cavity is provided inside the processing plate (36), and the initiator cavity is connected to the processing cylinder (35). An outlet hole is provided on the outer surface of the processing plate (36), and the outlet hole is connected to the initiator cavity.

5. A liquid collection device for preventing precipitation of circuit board etching waste liquid according to claim 2, characterized in that, A drive plate (311) is slidably connected inside the drive box (31). A spring (312) is fixedly connected to the side of the drive plate (311) away from the cam (33). The spring (312) is fixedly connected to the inner wall of the drive box (31). A drive frame (313) is fixedly connected to the outer surface of the drive plate (311). The drive frame (313) is slidably connected to the inner wall of the drive box (31). A drive rod (314) is fixedly connected to the end of the drive frame (313) away from the drive plate (311). The drive rod (314) is slidably connected to the top of the collection box (1) and the top of the collection hopper (4). A control plate (5) is fixedly connected inside the collection hopper (4).

6. The liquid collection device for preventing precipitation of circuit board etching waste liquid according to claim 5, characterized in that, The drive rod (314) is fixedly connected to a drive column (315) at one end near the control plate (5). A roller (316) is rotatably connected to the outer surface of the drive column (315). The outer surface of the roller (316) abuts against the top of the control plate (5). An adsorption plate (317) is fixedly connected to the end of the roller (316) away from the drive rod (314).

7. A liquid collection device for preventing precipitation of circuit board etching waste liquid according to claim 1, characterized in that, The double-layer discharge mechanism includes a transmission plate (81), which is rotatably connected to the inner wall of the drive box (31). A transmission shaft (82) is fixedly connected to the bottom end of the transmission plate (81). The transmission shaft (82) is rotatably connected to the top end of the collection box (1). A connecting plate (83) is fixedly connected to the bottom end of the transmission shaft (82). The connecting plate (83) is rotatably connected to the top end of the collection hopper (4). Guide plates (84) are fixedly connected to both ends of the connecting plate (83). Scrapers (88) are fixedly connected to both sides of the connecting plate (83).

8. A liquid collection device for preventing precipitation of circuit board etching waste liquid according to claim 7, characterized in that, The guide plate (84) is provided with a sealing plate (86) inside. An integrated mounting plate is fixedly connected to the outer surface of the sealing plate (86). A rotating shaft (85) is inserted inside the integrated mounting plate. The two ends of the rotating shaft (85) are fixedly connected to the inside of the guide plate (84). A second spring (87) is fixedly connected to the outer surface of the rotating shaft (85). The second spring (87) is fixedly connected to the inside of the integrated mounting plate. A filter hole is opened at the top of the sealing plate (86).

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