High-speed imaging system and method suitable for extreme high temperature and strong radiation environment

Abstract

The application discloses a high-speed imaging system and method suitable for an extreme high-temperature and strong radiation environment, the system adopts ZrO2-Y2O3 thermal barrier ceramic, graphene reinforced copper-based composite material and molybdenum alloy packaging to form a multistage heat flow regulation system; meanwhile, an anti-radiation CMOS image sensor based on an SOI process is introduced, and an interference type optical filter structure is supplemented to shield thermal radiation interference, so that the system can stably work at a high temperature of 2000 DEG C and a radiation environment of >=10 6 Rad(Si). The application discloses a high-speed imaging system and method suitable for an extreme high-temperature and strong radiation environment, which is suitable for image acquisition tasks under extreme working conditions such as aerospace, nuclear energy industry and deep space exploration, and has significant technical advantages and industrial promotion prospects.

Description

Technical Field

[0001] This invention relates to the fields of photoelectric detection and image acquisition, and more specifically, to a high-speed imaging system and method suitable for extreme high-temperature and high-radiation environments. Background Technology

[0002] High-speed cameras, as sophisticated optoelectronic devices, are widely used in aerospace, military, industrial inspection, and scientific research. However, in extreme environments (such as rocket engine combustion chambers, nuclear reactor interiors, and volcano detection), traditional high-speed cameras face the following technical challenges:

[0003] 1. High-temperature environments can damage the structural integrity of electronic components;

[0004] 2. Strong radiation causes CMOS image sensor failure (Total Ionizing Dose, TID damage).

[0005] 3. Rapid heat conduction leads to thermal breakdown of internal circuitry;

[0006] 4. Conventional packaging materials cannot withstand temperatures above 2000℃.

[0007] Existing solutions include: using external cooling devices to reduce temperature, but the system is complex and slow to respond; and using special alloys to shield radiation, but the cost is high and integration is difficult; at the same time, using indirect imaging methods, such as fiber optic light guiding light to a photosensitive element far away from the high temperature, results in a large degradation in image quality.

[0008] Therefore, there is an urgent need for an integrated imaging system that can operate stably for extended periods in extreme environments. Summary of the Invention

[0009] The purpose of this invention is to provide a high-speed imaging system and method suitable for extreme high temperature and strong radiation environments, especially an extreme environment imaging system with high temperature resistance and radiation resistance packaging capabilities, which is mainly used in rocket engine internal combustion diagnosis, nuclear reactor monitoring, deep space exploration equipment and extreme industrial scenarios.

[0010] The first aspect of this invention provides a high-speed imaging system suitable for extreme high-temperature and high-radiation environments, comprising:

[0011] The system comprises an outer high-temperature resistant thermal barrier layer, a middle heterogeneous thermal conductivity regulating layer, an inner precision component protection and heat dissipation guiding layer, a radiation-resistant image sensor module, an image acquisition and control module, and a data transmission and external communication module.

[0012] The outer high-temperature resistant thermal barrier layer is used to insulate against high temperatures;

[0013] The middle heterogeneous thermal conductivity regulating layer is used to conduct heat.

[0014] The inner precision component protection and heat dissipation guiding layer is used for support and heat dissipation;

[0015] The radiation-resistant image sensor module is used for imaging;

[0016] The image acquisition and control module is used to acquire images and perform data processing.

[0017] The data transmission and external communication module is used to transmit the processed image to an external source.

[0018] In this solution, the outer high-temperature thermal barrier layer comprises a ceramic matrix composite material, specifically including zirconium oxide-yttrium oxide composite ceramic.

[0019] In this scheme, the thermal conductivity of the zirconia-yttrium oxide composite ceramic is 1.8–2.3 W / m•K, the melting point is greater than 2700℃, and the density is 5.8 g / cm³. 3 .

[0020] In this scheme, the middle heterogeneous thermal conductivity regulating layer includes a graphene-reinforced copper-based composite material, wherein the thermal conductivity of the middle heterogeneous thermal conductivity regulating layer is greater than 800 W / m•K.

[0021] In this scheme, the formula for calculating the thermal conductivity of the intermediate heterogeneous thermal conductivity regulating layer is as follows:

[0022] ;

[0023] in, The thermal conductivity of the middle heterogeneous thermal conductivity adjustment layer is adjusted. This represents the volume fraction of copper material. The thermal conductivity of copper materials, This represents the volume fraction of the graphene material. The thermal conductivity of graphene materials, This is an enhancement term for interfacial thermal conductivity.

[0024] In this solution, the inner precision device protection and heat dissipation guiding layer includes a stacked structure of molybdenum alloy and silicon nitride ceramic, which is used to achieve heat flow distribution regulation and provide electromagnetic shielding, structural fixation and circuit wiring support.

[0025] In this solution, the radiation-resistant image sensor module uses a CMOS image sensor manufactured using SOI technology, including a photosensitive area, an amplification and readout area, an analog-to-digital conversion area, and a register and data output interface. The photosensitive area adopts a deep junction PN structure, the amplification and readout area adopts a dual threshold protected MOS structure, the analog-to-digital conversion area adopts a triple modulo redundant logic unit, and the register and data output interface adopts a low-voltage driving method.

[0026] In this scheme, thermally selective transmission window and heat-resistant aspherical optical components are used to acquire images. The window adopts a TiO2–SiO2 multilayer optical interference structure, with a transmission band of 400-800nm ​​and a transmittance of more than 85%, and a blocking band of 2-5um. A liquid cooling channel is provided between the lens barrel and the main lens, and liquid metal coolant flows in the channel.

[0027] A second aspect of the present invention also provides a high-speed imaging method suitable for extreme high-temperature and high-radiation environments, applied to any of the high-speed imaging systems described in the present invention, wherein the method includes the following steps:

[0028] After power-on, it performs a self-test, acquires configuration parameters, and generates a synchronization signal.

[0029] Acquire sensor monitoring data and perform adaptive responses to acquire images;

[0030] The acquired image data stream is packaged and redundantly output to obtain continuous high-speed imaging, which is then output externally.

[0031] A third aspect of the present invention provides a computer-readable storage medium comprising a machine program for a high-speed imaging method suitable for extreme high-temperature and high-radiation environments. When executed by a processor, the high-speed imaging method program for extreme high-temperature and high-radiation environments implements the steps of the high-speed imaging method for extreme high-temperature and high-radiation environments as described above.

[0032] This invention discloses a high-speed imaging system and method suitable for extreme high temperature and strong radiation environments. It adopts a multi-layer heterogeneous material heat dissipation packaging structure and radiation-resistant integrated circuit design, which enables the high-speed camera system to work continuously and stably in environments with high temperatures up to 2000℃ and strong radiation (≥10^6 Rad), realizing real-time monitoring and diagnosis of the engine combustion process. Attached Figure Description

[0033] Figure 1 A schematic diagram of the structure of a high-speed imaging system suitable for extreme high temperature and strong radiation environments is shown.

[0034] Figure 2 A schematic diagram of the radiation-resistant imaging circuit packaging structure of a high-speed imaging system suitable for extreme high temperature and strong radiation environments is shown.

[0035] Figure 3 The diagram illustrates the principle of an interferometric filter window for a high-speed imaging system suitable for extreme high-temperature and high-radiation environments according to the present invention.

[0036] Figure 4A flowchart of a high-speed imaging method applicable to extreme high-temperature and high-radiation environments is shown. Detailed Implementation

[0037] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0038] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and therefore the scope of protection of the invention is not limited to the specific embodiments disclosed below.

[0039] Figure 1 A schematic diagram of the structure of a high-speed imaging system suitable for extreme high temperature and strong radiation environments is shown.

[0040] like Figure 1 As shown, this application discloses a high-speed imaging system suitable for extreme high-temperature and high-radiation environments, comprising:

[0041] The system comprises an outer high-temperature resistant thermal barrier layer, a middle heterogeneous thermal conductivity regulating layer, an inner precision component protection and heat dissipation guiding layer, a radiation-resistant image sensor module, an image acquisition and control module, and a data transmission and external communication module.

[0042] The outer high-temperature resistant thermal barrier layer is used to insulate against high temperatures;

[0043] The middle heterogeneous thermal conductivity regulating layer is used to conduct heat.

[0044] The inner precision component protection and heat dissipation guiding layer is used for support and heat dissipation;

[0045] The radiation-resistant image sensor module is used for imaging;

[0046] The image acquisition and control module is used to acquire images and perform data processing.

[0047] The data transmission and external communication module is used to transmit the processed image to an external source.

[0048] It should be noted that, in this embodiment, as Figure 1 As shown, the system of the present invention includes an outer high-temperature resistant thermal barrier layer, a middle heterogeneous thermal conductivity regulating layer, an inner precision device protection and heat dissipation guiding layer, a radiation-resistant image sensor module, an image acquisition and control module, and a data transmission and external communication module. The heat flux density model of this system structure is as follows:

[0049] ;

[0050] in, The flux density is (W / m²). The equivalent thermal conductivity of the composite material; The gradient is K / m.

[0051] The following model is constructed using a series / parallel structure of multilayer composite thermal control materials:

[0052] ;

[0053] in, For the first Layer material thickness; For the first The thermal conductivity of the layer materials is as follows, and examples of composite materials are as follows: Surface layer: ZrO2-Y2O3 thermal barrier ceramic (resistant to 2000℃); Middle layer: Copper / graphite heterogeneous thermally conductive composite (high lateral thermal conductivity); Inner layer: Molybdenum / silicon nitride encapsulation module (matching thermal expansion coefficient, structural stability).

[0054] Furthermore, in this embodiment, the outer high-temperature thermal barrier layer comprises a ceramic matrix composite material, specifically including zirconium oxide-yttrium oxide composite ceramic.

[0055] It should be noted that, in this embodiment, a highly stable zirconia (ZrO2) ceramic matrix composite material is used as the outer thermal barrier to enhance the system's high-temperature resistance. It has low thermal conductivity (<2.5 W / m•K) and a coefficient of thermal expansion close to that of silicon, making it suitable for device packaging. The thermal conductivity of the zirconia-yttrium oxide composite ceramic ranges from 1.8 to 2.3 W / m•K, its melting point is greater than 2700℃, and its density is 5.8 g / cm³. 3 The specific parameters are shown in Table 1.

[0056] Table 1. Surface Material Performance Parameters

[0057] .

[0058] Furthermore, in this embodiment, the intermediate heterogeneous thermal conductivity regulating layer comprises a graphene-reinforced copper-based composite material, wherein the thermal conductivity of the intermediate heterogeneous thermal conductivity regulating layer is greater than 800 W / m•K, and the calculation formula for the thermal conductivity of the intermediate heterogeneous thermal conductivity regulating layer is as follows:

[0059] ;

[0060] in, The thermal conductivity of the middle heterogeneous thermal conductivity adjustment layer is adjusted. This represents the volume fraction of copper material. The thermal conductivity of copper materials, This represents the volume fraction of the graphene material. The thermal conductivity of graphene materials, This is an enhancement term for interfacial thermal conductivity.

[0061] It should be noted that, in this embodiment, the middle heterogeneous thermal conductivity regulating layer is composed of graphene-reinforced copper-based composite material, possessing excellent lateral thermal conductivity (thermal conductivity > 800 W / m•K), and controlling heat flow direction through microstructure channels. This layer also has the following functions: absorbing and rapidly diffusing surface radiant heat; establishing a temperature buffer zone to prevent thermal shock from entering the core device; and supporting the thermal structure to reduce thermal expansion stress. Therefore, the thermal conductivity behavior of this layer is modeled as a lateral composite thermal conductivity system, and the effective thermal conductivity is described by the following formula. :

[0062] ;

[0063] in, The thermal conductivity of the middle heterogeneous thermal conductivity adjustment layer is adjusted. This represents the volume fraction of copper material. The thermal conductivity of copper materials, This represents the volume fraction of the graphene material. The thermal conductivity of graphene materials, This is an enhancement term for interfacial thermal conductivity.

[0064] Furthermore, in this embodiment, the inner precision device protection and heat dissipation guiding layer includes a stacked structure of molybdenum alloy and silicon nitride ceramic, which is used to achieve heat flow distribution regulation and provide electromagnetic shielding, structural fixation and circuit wiring support.

[0065] It should be noted that, in this embodiment, the inner precision device protection and heat dissipation guiding layer is constructed using a molybdenum alloy and silicon nitride (Si3N4) ceramic stack. Under the influence of a temperature field, it can achieve heat flow distribution regulation, while also providing electromagnetic shielding, structural fixation, and circuit wiring support functions. Table 2 shows the parameters of the molybdenum alloy.

[0066] Table 2. Parameters of Molybdenum Alloy

[0067] ,

[0068] The molybdenum alloy and silicon nitride are encapsulated with titanium foil and high-temperature eutectic solder to meet high-temperature airtightness requirements. The overall structure exhibits a longitudinal splitting and lateral expansion pattern in terms of heat flow.

[0069] Furthermore, in this embodiment, the radiation-resistant image sensor module is a CMOS image sensor manufactured using SOI technology, including a photosensitive area, an amplification and readout area, an analog-to-digital conversion area, and a register and data output interface. The photosensitive area adopts a deep junction PN structure, the amplification and readout area adopts a dual threshold protected MOS structure, the analog-to-digital conversion area adopts a triple modulo redundant logic unit, and the register and data output interface adopts a low-voltage driving method.

[0070] It should be noted that, in this embodiment, a radiation-hardened image sensor is designed using SOI (Silicon-On-Insulator) technology. By using a buried oxide layer to block insulator injection, the TID and SEU (Single Event Upset) effects are reduced. Specifically, the TID resistance is ≥10^6 Rad(Si), the SEU tolerance charge is ≥0.5 pC, and the photon sensitivity is ≥80%@λ=550nm. The corresponding radiation hardening treatment model is as follows:

[0071] ;

[0072] in, It is the critical charge; For node capacitance; This refers to the power supply voltage. The breakdown factor depends on the material.

[0073] Specifically, in this embodiment, as Figure 2 The diagram shows a schematic of the radiation-hardened imaging circuit package structure. The image sensor used in this system is fabricated using SOI technology and has high resistance to TID (Total Ionizing Dose). The sensor structure is divided into the following key parts: the photodiode array, which uses a deep junction PN structure to improve radiation drift resistance; the amplification and readout area, which uses a dual-threshold protected MOS structure to avoid malfunctions caused by high-energy particle excitation; the analog-to-digital conversion area, which introduces TMR (Triple Modular Redundancy) logic units to reduce SEU risk; and the register and data output interface, which uses a low-voltage drive (LVDS) method to ensure interface stability under radiation. The radiation-hardened technical parameters are shown in Table 3.

[0074] Table 3. Radiation protection technical parameters

[0075]

[0076] Specifically, a noise reduction structure of "non-volatile register + multi-level averaging" is adopted, and the basic formula is as follows:

[0077] ;

[0078] in, Thermal noise, For the statistical fluctuations of photogenerated carriers, To minimize low-frequency flicker noise, the total equivalent noise charge (ENC) of the system was controlled to be <30 e⁻ in actual testing.

[0079] Furthermore, in this embodiment, a thermally selective transmission window and a heat-resistant aspherical optical component are used to acquire images. The window adopts a TiO2–SiO2 multilayer optical interference structure, with a transmission band of 400-800nm ​​and a transmittance greater than 85%, and a blocking band of 2-5um. A liquid cooling channel is provided between the lens barrel and the main lens, and liquid metal coolant flows in the channel.

[0080] It should be noted that, in this embodiment, the system integrates a thermal mirror and a selective filter layer to achieve reflection of the thermal radiation band and transmission of the band of interest: thermal reflector spectral band: 2.5–5 μm; visible light transmittance ≥85%. The structural thickness is controlled by utilizing the principle of interference filtering. This causes coherent interference to enhance transmittance: ,in, For the refractive index of the material, For single-layer thickness, For the target wavelength, The interference order is denoted as .

[0081] Specifically, in this embodiment, directly using ordinary optical lenses in high-temperature scenarios will lead to a decrease in image quality or even failure. Therefore, this invention introduces a special thermally selective transmission window and a heat-resistant aspherical optical component to achieve high-quality thermal field image acquisition, such as... Figure 3 The diagram shown illustrates the principle of an interference filter window. This window employs a TiO2–SiO2 multilayer optical interference structure, with the following wavelength selection range: transmission band: 400–800nm ​​(visible light), blocking band: 2–5µm (thermal infrared interference), transmittance: ≥85%, and the interference filter layer thickness meeting the following requirements: The ability to suppress thermal radiation is verified to be superior to that of a single-layer heat-reflective coating through optical simulation (TransferMatrix Method). Meanwhile, in order to prevent the optical components from heating up, the following heat dissipation measures are adopted: a microchannel is left between the lens barrel and the main lens, and a liquid metal coolant (such as Ga-In alloy) flows inside; the lens assembly is coated with a thermally conductive graphene coating to improve the heat flux diffusion capability.

[0082] In summary, compared with existing technologies, this invention has the following advantages: 1. It enables long-term stable operation of the imaging system in environments ≥2000℃; 2. It significantly improves radiation resistance, meeting aerospace / nuclear industry standards; 3. It has high structural integration and can be embedded in the interior of propulsion shells, reactor compartments, etc.; 4. The material cost is lower than that of traditional heat-resistant materials such as tantalum alloys, making it suitable for industrial application; 5. The imaging resolution can reach 2048×2048, and the frame rate supports 10,000 fps, making it suitable for high-speed combustion analysis.

[0083] In one embodiment of the invention, the assembly sequence of the system components in practical application includes: 1. Preheating of the base plate → Cleaning → Plating a high-temperature anti-oxidation layer; 2. Installing the image sensor module → Welding → Performing TID pretreatment; 3. Constructing the middle layer thermally conductive structure → Micron-level positioning assembly → Pressing and curing; 4. Installing the outer ZrO2 ceramic protective cover → Laser welding sealing; 5. Installing the optical window and cooling fluid channel → Checking airtightness; 6. Overall testing, including: high-temperature baking (1800℃ × 6 hours), gamma ray irradiation (1 Mrad), and high-speed dynamic image acquisition simulation test.

[0084] In addition, to verify the system's stable operation in extreme high-temperature environments, the present invention constructed the following experimental platform:

[0085] • Thermal environment: High-temperature vacuum furnace, maximum temperature 2300℃;

[0086] • Sample assembly: A fully packaged prototype of a high-speed imaging system;

[0087] • Test cycle: Hold at 1500℃, 1800℃, and 2000℃ for 6 hours respectively;

[0088] • Observation indicators: CMOS operating current variation ΔI; imaging image quality (mean grayscale and mean noise); system structural deformation (measured by laser interferometer); data communication integrity rate. The test results are shown in Table 4.

[0089] Table 4. Test Results

[0090] ,

[0091] The results show that the system of the present invention can still maintain imaging function at 2000℃, the packaging material does not show obvious thermal cracking, the data transmission is basically intact, and it meets the requirements for use in extreme environments.

[0092] Meanwhile, in the radiation resistance test, a high-power radiation source (cobalt-60 gamma-ray source) was used to simulate single-event effects and total dose effects:

[0093] • Radiation intensity: 1 × 06 rad(Si);

[0094] • Irradiation time: 12 hours;

[0095] • Observation indicators: pixel failure rate, image blur, logic cell flip count, and power supply current stability.

[0096] The comparison data before and after the experiment are shown in Table 5.

[0097] Table 5. Comparison data before and after the experiment

[0098] ,

[0099] The results show that although some performance characteristics have degraded, the overall system function remains good and it has the practical capability to be used in nuclear reactors and irradiated sites.

[0100] Furthermore, in the imaging performance and dynamic range test, the imaging system was placed inside a simulated flame combustion pipe to capture the entire flame development process (time span 2 ms, frame rate 10,000 fps):

[0101] • Target: Flow field inside a methane flame;

[0102] • Exposure time: 0.1 ms;

[0103] • ISO sensitivity: ISO 2000 (equivalent);

[0104] • Resolution: 2048 × 2048 px;

[0105] • Dynamic range: 72 dB;

[0106] • Shutter error: <2 μs.

[0107] In the image example: Frame 1: Nozzle starts, combustion has not yet formed; Frame 200: Flame develops steadily, cone-shaped jet is clearly visible; Frame 500: Flame undergoes strong shearing with turbulent structure; The system image is clear and without trailing, and has the ability to capture high-speed bright targets.

[0108] In summary, in the application scenario adaptation analysis, taking aerospace propulsion as an example, the application location is the inner wall of the combustion chamber of a liquid rocket engine; the purpose of use is to observe the instantaneous ignition, combustion instability, and mixing non-uniformity; the system installation method is embedded and fixed to the adjacent part of the cooling channel; the technical requirements are: temperature resistance ≥ 1800℃; response time ≤ 1 ms; vibration acceleration tolerance ≥ 100 g; weight ≤ 500 g; the invention demonstrates: stable packaging integrity; high visualization accuracy; and image transmission speed that meets the requirements for synchronous ground analysis.

[0109] Taking nuclear reactor monitoring as an example, the monitoring targets are: surface condition of fuel rods and monitoring of structural loosening; radiation level: ≥10. 6 Rad(Si); Traditional technical problems: CCD breakdown; material fading; frequent communication failures; Advantages of this system: SOI radiation-resistant image chip; fully enclosed optical thermal control structure; multi-path data redundancy transmission scheme (LVDS + optical fiber); and the ability to achieve a continuous working cycle on a monthly basis.

[0110] Taking extraterrestrial extreme environment exploration (such as the surface of Venus) as an example, the environmental parameters are: temperature: 460℃ constant temperature all year round; air pressure: 92 atm; large amount of sulfides and acidic gases; this system is adapted to: corrosion-resistant treatment of the outer shell material; internal working temperature controlled below 75℃; and image acquisition can be achieved under low light and high radiation conditions.

[0111] Furthermore, a comparative analysis with existing technologies is presented in tabular form, as shown in Table 6.

[0112] Table 6. Comparative Analysis of the Invention and the Prior Art

[0113] ,

[0114] The results show that the present invention has achieved a major breakthrough in terms of temperature resistance, radiation resistance, structural integration and applicability, and has obvious technical advantages and patent originality.

[0115] Figure 4 A flowchart of a high-speed imaging method applicable to extreme high temperature and strong radiation environments is shown.

[0116] like Figure 4 As shown, this application discloses a high-speed imaging method suitable for extreme high-temperature and high-radiation environments, comprising the following steps:

[0117] S402 performs a self-test after power-on, acquires configuration parameters, and generates a synchronization signal.

[0118] S404, acquire sensor monitoring data and perform adaptive response to acquire images;

[0119] S406 performs data packaging and redundant output on the acquired image data stream to obtain continuous high-speed imaging, and outputs it externally.

[0120] It should be noted that, in this embodiment, since the high-speed imaging method of the present invention applicable to extreme high temperature and strong radiation environments is applied to the high-speed imaging system applicable to extreme high temperature and strong radiation environments described in any of the above embodiments, the execution process of the system has been described in the above embodiments. Since the execution steps and processes are the same, they will not be repeated in this embodiment.

[0121] A third aspect of the present invention provides a computer-readable storage medium comprising a high-speed imaging method program suitable for extreme high temperature and strong radiation environments. When executed by a processor, the high-speed imaging method program suitable for extreme high temperature and strong radiation environments implements the steps of a high-speed imaging method suitable for extreme high temperature and strong radiation environments as described in any of the preceding claims.

[0122] This invention discloses a high-speed imaging system and method suitable for extreme high-temperature and high-radiation environments. It employs a multi-layered heterogeneous material heat dissipation packaging structure and a radiation-resistant integrated circuit design, enabling the high-speed camera system to operate continuously and stably in environments with temperatures up to 2000℃ and high radiation (≥10^6 Rad). It achieves industry-leading key indicators such as heat resistance, radiation resistance, high frame rate, high resolution, and high stability. It can serve as a core sensing component for rockets, military engines, and the nuclear industry; it can be expanded into a small, wearable extreme monitoring imaging module; the materials are readily available, and the packaging technology is ready for mass production; the cost is reduced by approximately 60% compared to traditional tantalum alloy systems; and it can be exported to global space agencies, deep-earth agencies, and specialized manufacturers.

[0123] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and in actual implementation, there may be other division methods, such as: multiple units or components can be combined, or integrated into another system, or some features can be ignored or not executed. In addition, the coupling, direct coupling, or communication connection between the various components shown or discussed can be through some interfaces, and the indirect coupling or communication connection between devices or units can be electrical, mechanical, or other forms.

[0124] The units described above as separate components may or may not be physically separate. The components shown as units may or may not be physical units. They may be located in one place or distributed across multiple network units. Some or all of the units may be selected to achieve the purpose of this embodiment according to actual needs.

[0125] In addition, in the various embodiments of the present invention, each functional unit can be integrated into one processing unit, or each unit can be a separate unit, or two or more units can be integrated into one unit; the integrated unit can be implemented in hardware or in the form of hardware plus software functional units.

[0126] Those skilled in the art will understand that all or part of the steps of the above method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When the program is executed, it performs the steps of the above method embodiments. The aforementioned storage medium includes various media capable of storing program code, such as mobile storage devices, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0127] Alternatively, if the integrated units of this invention are implemented as software functional modules and sold or used as independent products, they can also be stored in a computer-readable storage medium. Based on this understanding, the technical solutions of the embodiments of this invention, or the parts that contribute to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the methods described in the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as mobile storage devices, ROM, RAM, magnetic disks, or optical disks.

Claims

1. A high-speed imaging system suitable for extreme high-temperature and high-radiation environments, characterized in that, include: The system comprises an outer high-temperature resistant thermal barrier layer, a middle heterogeneous thermal conductivity regulating layer, an inner precision component protection and heat dissipation guiding layer, a radiation-resistant image sensor module, an image acquisition and control module, and a data transmission and external communication module. The outer high-temperature resistant thermal barrier layer is used to insulate against high temperatures; The middle heterogeneous thermal conductivity regulating layer is used to conduct heat. The inner precision component protection and heat dissipation guiding layer is used for support and heat dissipation; The radiation-resistant image sensor module is used for imaging; The image acquisition and control module is used to acquire images and perform data processing. The data transmission and external communication module is used to transmit the processed image to an external source.

2. The high-speed imaging system suitable for extreme high temperature and strong radiation environments according to claim 1, characterized in that, The outer high-temperature thermal barrier layer comprises a ceramic matrix composite material, specifically including zirconium oxide-yttrium oxide composite ceramic.

3. A high-speed imaging system suitable for extreme high-temperature and high-radiation environments according to claim 2, characterized in that, The zirconia-yttrium oxide composite ceramic has a thermal conductivity of 1.8–2.3 W / m•K, a melting point greater than 2700℃, and a density of 5.8 g / cm³. 3 .

4. A high-speed imaging system suitable for extreme high-temperature and high-radiation environments according to claim 1, characterized in that, The intermediate heterogeneous thermal conductivity regulating layer comprises a graphene-reinforced copper-based composite material, wherein the thermal conductivity of the intermediate heterogeneous thermal conductivity regulating layer is greater than 800 W / m•K.

5. A high-speed imaging system suitable for extreme high-temperature and high-radiation environments according to claim 4, characterized in that, The formula for calculating the thermal conductivity of the intermediate heterogeneous thermal conductivity regulating layer is as follows: ； in, The thermal conductivity of the middle heterogeneous thermal conductivity adjustment layer is adjusted. This represents the volume fraction of copper material. The thermal conductivity of copper materials, This represents the volume fraction of the graphene material. The thermal conductivity of graphene materials, This is an enhancement term for interfacial thermal conductivity.

6. A high-speed imaging system suitable for extreme high-temperature and high-radiation environments according to claim 1, characterized in that, The inner precision device protection and heat dissipation guiding layer includes a stacked structure of molybdenum alloy and silicon nitride ceramic, which is used to achieve heat flow distribution regulation and provide electromagnetic shielding, structural fixation and circuit wiring support.

7. A high-speed imaging system suitable for extreme high-temperature and high-radiation environments according to claim 1, characterized in that, The radiation-resistant image sensor module uses a CMOS image sensor manufactured using SOI technology, including a photosensitive area, an amplification and readout area, an analog-to-digital conversion area, and a register and data output interface. The photosensitive area adopts a deep junction PN structure, the amplification and readout area adopts a dual threshold protected MOS structure, the analog-to-digital conversion area adopts a triple modulo redundant logic unit, and the register and data output interface adopts a low-voltage driving method.

8. A high-speed imaging system suitable for extreme high-temperature and high-radiation environments according to claim 1, characterized in that, Images are acquired using a thermally selective transmission window and a heat-resistant aspherical optical component. The window adopts a TiO2–SiO2 multilayer optical interference structure, with a transmission band of 400-800nm ​​and a transmittance greater than 85%, and a blocking band of 2-5um. A liquid cooling channel is provided between the lens barrel and the main lens, and liquid metal coolant flows in the channel.

9. A high-speed imaging method suitable for extreme high-temperature and high-radiation environments, characterized in that, The method is applicable to a high-speed imaging system suitable for extreme high temperature and strong radiation environments, as described in any one of claims 1-8, wherein the method comprises the following steps: After power-on, it performs a self-test, acquires configuration parameters, and generates a synchronization signal. Acquire sensor monitoring data and perform adaptive responses to acquire images; The acquired image data stream is packaged and redundantly output to obtain continuous high-speed imaging, which is then output externally.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium includes a high-speed imaging method program suitable for extreme high temperature and strong radiation environments. When the high-speed imaging method program suitable for extreme high temperature and strong radiation environments is executed by a processor, it implements the steps of the high-speed imaging method suitable for extreme high temperature and strong radiation environments as described in claim 9.

Images