Multi-grain packaging structure, chip, electronic equipment and packaging method
By setting anti-overflow structures, such as dams or trenches, on the chip surface, the problems of metal pad contamination and metal wires caused by the flowability of insulating adhesive are solved, enabling chip miniaturization and efficient packaging.
CN121368420APending Publication Date: 2026-01-20BESTECHNIC SHANGHAI CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- CN202511540417.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-27
- Publication Date
- 2026-01-20
AI Technical Summary
Technical Problem
In existing technologies, the fluidity of insulating adhesive during chip packaging can lead to contamination of metal pads and bending or breakage of metal wires, affecting electrical performance, and the reserved space limits further miniaturization of the chip.
Method used
Setting spill-proof structures, such as dams or trenches, on the chip surface limits the flow distance of the insulating adhesive, avoids contamination and bending, and simplifies the manufacturing process.
Benefits of technology
It effectively reduces the contamination of the insulating adhesive on the metal pad and the impact on the metal wire, reduces the size of the packaged chip, and improves the packaging yield and efficiency.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN121368420A_ABST
Abstract
The invention provides a multi-grain packaging structure, a chip, electronic equipment and a packaging method. The multi-crystal-grain packaging structure comprises a first crystal grain, a second crystal grain and a substrate, the first crystal grains and the second crystal grains are welded through salient points; insulating glue is filled between the first crystal grains and the second crystal grains; the first crystal grains are arranged on the substrate; the metal gasket of the first crystal grain is connected with the substrate through a metal wire; the first surface of the first crystal grain further comprises an anti-overflow structure, and the anti-overflow structure is arranged between the salient point of the first crystal grain and the metal gasket; the anti-overflow structure is used for limiting the glue overflow distance of the insulation glue flowing towards the metal gasket to be smaller than or equal to the preset glue overflow distance, and the preset glue overflow distance is smaller than the natural flowing distance of the insulation glue on the first surface. The packaging structure is favorable for reducing the packaging size of the chip.
Need to check novelty before this filing date? Find Prior Art