Modularized packaging test device and method

Abstract

The invention discloses a modularized packaging testing device and method. The modularized packaging testing device comprises a testing support, a function module and a connecting assembly. The test support is of a frame type structure, a main control unit and a power module are arranged in the test support, the main control unit is used for receiving and processing test data, the power module supplies power to the whole device, and a frame of the test support is provided with a module mounting position; the function module is matched with the module installation position of the test support. The connecting assembly comprises a signal interface and a power interface which are arranged in the module mounting position, the signal interface is electrically connected with the main control unit, and the power interface is electrically connected with the power module. According to the invention, the structural design is novel, rapid switching and combination of multiple test functions can be realized, and the test module can be flexibly configured according to different test requirements, so that the test efficiency is remarkably improved, and the marketing cycle of products is shortened.

Description

Technical Field

[0001] This invention relates to the field of electronic testing technology, specifically to a modular packaging testing device and method. Background Technology

[0002] In today's booming electronics industry, the packaging and testing of integrated circuits and electronic components is of paramount importance, as it directly affects the quality and performance of products.

[0003] In terms of testing efficiency, traditional packaging testing equipment often adopts a single testing mode, capable of testing only one or a small number of electronic components at a time. In large-scale production scenarios, such as chip manufacturing for consumer electronics, a massive number of components need to be packaged and tested. Taking the production of a mobile phone chip as an example, millions of chips need to be tested monthly. Using traditional testing equipment, this would be extremely time-consuming, significantly extending the production cycle and failing to meet market demands for rapid product delivery. Furthermore, switching between testing processes often requires manual adjustments to complex parameters and equipment configurations, which is not only time-consuming and labor-intensive but also prone to errors due to human negligence, further reducing testing efficiency. From a flexibility perspective, existing devices have relatively limited functionality and lack scalability and versatility in their structural design. They often struggle to adapt to different types, sizes, and functions of electronic components. For example, in emerging wearable devices, the small chip sizes and dense pin spacing make it difficult for traditional testing equipment to accurately perform electrical connection and functional tests. In the testing of RF chips for 5G communication equipment, due to their high-frequency characteristics, traditional equipment cannot meet the requirements for accurate measurement and analysis of high-frequency signals, severely limiting the testing scope and application scenarios. Therefore, it is necessary to design a modular packaging testing device and method. Summary of the Invention

[0004] The purpose of this invention is to provide a modular packaging testing device and method to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a modular packaging test device, comprising a test bracket, functional modules, and connecting components; The test bracket has a frame structure. The test bracket has a built-in main control unit and a power module. The main control unit is used to receive and process test data, and the power module supplies power to the entire device. The test bracket frame is provided with module mounting positions. The functional module is adapted to the module mounting position of the test bracket; The connection component includes a signal interface and a power interface located in the module mounting position, wherein the signal interface is electrically connected to the main control unit and the power interface is electrically connected to the power module.

[0006] Preferably, the test bracket includes a horizontal load-bearing beam and a vertical support column, which are fixedly connected by angle brackets and bolts; the module mounting positions are opened on the upper surface of the horizontal load-bearing beam, and each module mounting position has a positioning protrusion at its edge.

[0007] Preferably, the bottom of the functional module is provided with a mounting base that is adapted to the module mounting position of the test bracket. The size of the mounting base is matched with the inner contour size of the module mounting position, and the lower surface of the mounting base is provided with conductive contacts, which correspond one-to-one with the signal interface and power interface of the connecting component.

[0008] Preferably, the functional module includes a detection module, a data storage module, and a display module; the detection module has a built-in sensor component for collecting electrical performance parameters and physical size data of the package; the data storage module is used to store the test data processed by the main control unit; the display module uses a touch screen and is embedded on the outside of the vertical support column of the test bracket module, and the detection module, data storage module, and display module are respectively connected to the main control unit.

[0009] Preferably, the sensor components of the detection module include a current sensor, a voltage sensor, and a laser rangefinder. The mounting base of the detection module is also equipped with a temperature sensor, which is electrically connected to the main control unit and is used to monitor the operating temperature of the detection module and feed it back to the main control unit.

[0010] Preferably, the test bracket module is further provided with a locking mechanism in the module mounting position. The locking mechanism includes an elastic buckle located on the inner side of the positioning protrusion, and the mounting base side surface of the functional module is provided with a slot that matches the elastic buckle.

[0011] Preferably, the test bracket module is further provided with a heat dissipation component, which includes a heat dissipation duct inside the frame and a heat dissipation fan installed on the top of the vertical support column; the heat dissipation duct is connected to each module mounting position, and the heat dissipation fan is electrically connected to the main control unit.

[0012] Preferably, a method of using a modular packaging testing device includes the following steps: Step A: Functional Module Selection and Adaptation The inspection process involves selecting the appropriate functional modules based on the testing requirements of the packaged component to be tested. These functional modules include at least one of a testing module, a data storage module, and a display module. Step B: Functional Module Installation and Locking Align the mounting base of the functional module with the module mounting position of the test bracket, and slowly insert it until the conductive contacts are fully in contact with the signal interface and power interface of the connecting component inside the module mounting position. At this time, the elastic buckle on the inner side of the positioning protrusion inside the module mounting position will automatically engage with the slot on the side surface of the mounting base to lock the functional module. Step C: Device Startup and Parameter Setting Startup The power module built into the test bracket powers the entire device. The main control unit's operation interface is accessed through the touch screen of the display module embedded on the outside of the vertical support column of the test bracket. The test parameters are set according to the test requirements. At the same time, the heat dissipation components are turned on, and the cooling fan starts working to dissipate heat for each module through the heat dissipation duct. Step D: Test Execution and Data Processing The main control unit controls the detection module to start the test. The detection module uses built-in current sensors, voltage sensors, laser rangefinders, and temperature sensors to collect the electrical performance parameters, physical size data, and operating temperature data of the packaged component. The collected data is transmitted to the main control unit in real time. The main control unit processes and analyzes the received test data, displays the results on the display module, and stores the processed test data in the data storage module. After the test is completed, the power module is turned off.

[0013] Beneficial effects: This invention features a novel structural design that enables rapid switching and combination of various testing functions. Test modules can be flexibly configured to meet different testing needs, significantly improving testing efficiency and shortening product time-to-market. Simultaneously, the modular design reduces equipment complexity and cost, enhances its versatility and maintainability, and allows companies to achieve efficient and accurate packaging testing at a lower cost.

[0014] In this invention, the functional modules are installed conveniently and stably via a mounting base and a module mounting position with a gap fit, coupled with an elastic snap-locking mechanism. The heat dissipation components ensure continuous and stable operation of the equipment, reducing the probability of failure. Simultaneously, the modular structure reduces the overall complexity of the equipment; if a module fails, the entire device does not need to be replaced, only the corresponding module needs to be replaced, improving maintainability and reducing maintenance costs.

[0015] The above description is merely an overview of the technical solutions of the embodiments of this application. In order to better understand the technical means of the embodiments of this application and to implement them in accordance with the contents of the specification, and to make the above and other objects, features and advantages of the embodiments of this application more apparent and understandable, specific implementation methods of this application are described below. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2This is a block diagram illustrating the principle of the present invention; Figure 3 This is a schematic diagram of the locking mechanism structure of the present invention; Figure 4 This is a flowchart of the workflow of the present invention. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims and drawings of this application are intended to cover non-exclusive inclusion.

[0019] The term "embodiment" as used herein means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of the phrase "embodiment" in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0020] Furthermore, the terms "first," "second," etc., in the specification and claims of this application or in the aforementioned drawings are used to distinguish different objects rather than to describe a specific order, and may explicitly or implicitly include one or more of the features.

[0021] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, "connection" or "joining" in mechanical structures can refer to a physical connection, such as a fixed connection, for example, a connection fixed by fasteners, such as a connection fixed by screws, bolts, or other fasteners; a physical connection can also be a detachable connection, such as a snap-fit ​​or interlocking connection; a physical connection can also be an integral connection, such as a connection formed by welding, bonding, or integral molding. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0022] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.

[0023] Please see Figures 1-4 The present invention discloses a modular packaging test device, including a test bracket 1, a functional module 2 and a connecting component; The test bracket 1 has a frame structure and houses a main control unit 3 and a power module 4. The main control unit 3 receives and processes test data, and the power module 4 supplies power to the entire device. The frame of the test bracket 1 is provided with module mounting positions 5. The main control unit uses an STM32H743 microcontroller, which has high-speed data processing capabilities. The power module uses a 220V to 12V / 5V dual-output switching power supply with an output power of 100W, which meets the power supply requirements of the entire device. The functional module is adapted to the module mounting position of the test bracket; The connection components include a signal interface 6 and a power interface 7 located in the module mounting position 5. The signal interface 6 is electrically connected to the main control unit 3, and the power interface 7 is electrically connected to the power module 4.

[0024] In this invention, the test bracket 1 includes a horizontal bearing beam 8 and a vertical support column 9, which are fixedly connected by angle brackets and bolts; the module mounting position 5 is opened on the upper surface of the horizontal bearing beam 8, and each module mounting position 5 has a positioning protrusion 10 on its edge.

[0025] In this invention, the bottom of the functional module 2 is provided with a mounting base 11 that is adapted to the module mounting position 5 of the test bracket. The size of the mounting base 11 is matched with the inner contour size of the module mounting position 5. The lower surface of the mounting base 11 is provided with conductive contacts 12, which correspond one-to-one with the signal interface 6 and power interface 7 of the connecting component.

[0026] In this invention, functional module 2 includes a detection module 13, a data storage module 14, and a display module 15. The detection module 13 has built-in sensor components for collecting electrical performance parameters and physical size data of the packaged component. The data storage module 14 is used to store the test data processed by the main control unit. The display module 15 uses a touch screen and is embedded on the outside of the vertical support column 9 of the test bracket 1. The detection module 13, data storage module 14, and display module 15 are respectively connected to the main control unit 3. The sensor components of the detection module 13 include a current sensor 16, a voltage sensor 17, and a laser rangefinder sensor 18. The mounting base 11 of the detection module 13 is also provided with a temperature sensor 19, which is electrically connected to the main control unit 3 and is used to monitor the operating temperature of the detection module and feed it back to the main control unit. The current sensor is an ACS712 series Hall current sensor with a measurement range of -5A to +5A and an accuracy of ±1.5%, which can acquire the operating current of the package in real time; the voltage sensor is an LV25-P voltage sensor with an input voltage range of 0-250V and an output signal of 0-5V, used to monitor the voltage parameters of the package.

[0027] The laser rangefinder is a KEYENCE IL-100 series sensor with a measurement range of 10mm-300mm and a resolution of 0.1mm, capable of accurately detecting the physical dimensions of the packaged components. The temperature sensor is a DS18B20 digital temperature sensor with a measurement range of -55℃ to +125℃ and an accuracy of ±0.5℃. It is installed in the center of the detection module mounting base to monitor the module's operating temperature in real time and feed it back to the main control unit.

[0028] In this invention, the module mounting position of the test bracket 1 is further provided with a locking mechanism. The locking mechanism includes an elastic buckle 20 located inside the positioning protrusion 10, and the side surface of the mounting base 11 of the functional module is provided with a slot 21 that matches the elastic buckle 20. When the functional module is installed in place, the elastic buckle automatically engages with the slot, thereby locking the module. To remove the module, simply press the elastic buckle outward.

[0029] In addition, in this invention, the test bracket 1 is also equipped with a heat dissipation assembly, which includes a heat dissipation duct inside the frame and a heat dissipation fan 22 installed on the top of the vertical support column 9; the heat dissipation duct is connected to the mounting positions of each module, and the heat dissipation fan 22 is electrically connected to the main control unit 3. When the operating temperature of the detection module exceeds 40°C, the main control unit automatically starts the heat dissipation fan to cool down each module through the heat dissipation duct.

[0030] Working principle: A method for using a modular packaging test device includes the following steps: Step A: Functional Module Selection and Adaptation The inspection process involves selecting the appropriate functional modules based on the testing requirements of the packaged component to be tested. These functional modules include at least one of a testing module, a data storage module, and a display module. Step B: Functional Module Installation and Locking Align the mounting base of the functional module with the module mounting position of the test bracket, and slowly insert it until the conductive contacts are fully in contact with the signal interface and power interface of the connecting component inside the module mounting position. At this time, the elastic buckle on the inner side of the positioning protrusion inside the module mounting position will automatically engage with the slot on the side surface of the mounting base to lock the functional module. Step C: Device Startup and Parameter Setting Startup The power module built into the test bracket powers the entire device. The main control unit's operation interface is accessed through the touch screen of the display module embedded on the outside of the vertical support column of the test bracket. The test parameters are set according to the test requirements. At the same time, the heat dissipation components are turned on, and the cooling fan starts working to dissipate heat for each module through the heat dissipation duct. Step D: Test Execution and Data Processing The main control unit controls the detection module to start the test. The detection module uses built-in current sensors, voltage sensors, laser rangefinders, and temperature sensors to collect the electrical performance parameters, physical size data, and operating temperature data of the packaged component. The collected data is transmitted to the main control unit in real time. The main control unit processes and analyzes the received test data, displays the results on the display module, and stores the processed test data in the data storage module. After the test is completed, the power module is turned off.

[0031] In this invention, the functional modules are installed conveniently and stably via a mounting base and a module mounting position with a gap fit, coupled with an elastic snap-locking mechanism. The heat dissipation components ensure continuous and stable operation of the equipment, reducing the probability of failure. Simultaneously, the modular structure reduces the overall complexity of the equipment; if a module fails, the entire device does not need to be replaced, only the corresponding module needs to be replaced, improving maintainability and reducing maintenance costs.

[0032] In summary, this invention features a novel structural design that enables rapid switching and combination of various testing functions. Test modules can be flexibly configured according to different testing needs, significantly improving testing efficiency and shortening product launch cycles. Furthermore, the modular design reduces equipment complexity and cost, enhances its versatility and maintainability, and allows companies to achieve efficient and accurate packaging testing at a lower cost.

[0033] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A modular packaging testing device, characterized in that: It includes a test stand (1), a functional module (2), and connecting components; The test bracket (1) is a frame structure. The test bracket (1) has a built-in main control unit (3) and a power module (4). The main control unit (3) is used to receive and process test data. The power module (4) supplies power to the entire device. The test bracket (1) has a module mounting position (5) on its frame. The functional module is adapted to the module mounting position of the test bracket; The connection component includes a signal interface (6) and a power interface (7) located in the module mounting position (5), and the signal interface (6) is electrically connected to the main control unit (3), and the power interface (7) is electrically connected to the power module (4).

2. The modular packaging testing device according to claim 1, characterized in that: The test bracket (1) includes a horizontal bearing beam (8) and a vertical support column (9), which are fixedly connected by angle brackets and bolts; the module mounting position (5) is opened on the upper surface of the horizontal bearing beam (8), and each module mounting position (5) has a positioning protrusion (10) on its edge.

3. The modular packaging testing device according to claim 1, characterized in that: The bottom of the functional module (2) is provided with a mounting base (11) that is compatible with the module mounting position (5) of the test bracket. The size of the mounting base (11) is matched with the inner contour size of the module mounting position (5) with a clearance. The lower surface of the mounting base (11) is provided with conductive contacts (12). The conductive contacts (12) correspond one-to-one with the signal interface (6) and power interface (7) of the connecting component.

4. The modular packaging testing device according to claim 1, characterized in that: The functional module (2) includes a detection module (13), a data storage module (14), and a display module (15). The detection module (13) has a built-in sensor assembly for collecting electrical performance parameters and physical size data of the package. The data storage module (14) is used to store the test data processed by the main control unit. The display module (15) uses a touch screen and is embedded on the outside of the vertical support column (9) of the test bracket (1). The detection module (13), the data storage module (14), and the display module (15) are respectively connected to the main control unit (3).

5. The modular packaging and testing device according to claim 4, characterized in that: The sensor components of the detection module (13) include a current sensor (16), a voltage sensor (17) and a laser rangefinder (18). The mounting base (11) of the detection module (13) is also provided with a temperature sensor (19). The temperature sensor (19) is electrically connected to the main control unit (3) and is used to monitor the working temperature of the detection module and feed it back to the main control unit.

6. The modular packaging testing device according to claim 1, characterized in that: The test bracket (1) is also provided with a locking mechanism in the module mounting position. The locking mechanism includes an elastic buckle (20) located inside the positioning protrusion (10). The mounting base (11) of the functional module has a slot (21) adapted to the elastic buckle (20) on its side surface.

7. The modular packaging testing device according to claim 1, characterized in that: The test bracket (1) is also provided with a heat dissipation component, which includes a heat dissipation duct inside the frame and a heat dissipation fan (22) installed on the top of the vertical support column (9); the heat dissipation duct is connected to the mounting positions of each module, and the heat dissipation fan (22) is electrically connected to the main control unit (3).

8. A method for using the modular packaging testing device as described in claim 1, characterized in that: Includes the following steps: Step A: Functional Module Selection and Adaptation The inspection process involves selecting the appropriate functional modules based on the testing requirements of the packaged component to be tested. These functional modules include at least one of a testing module, a data storage module, and a display module. Step B: Functional Module Installation and Locking Align the mounting base of the functional module with the module mounting position of the test bracket, and slowly insert it until the conductive contacts are fully in contact with the signal interface and power interface of the connecting component inside the module mounting position. At this time, the elastic buckle on the inner side of the positioning protrusion inside the module mounting position will automatically engage with the slot on the side surface of the mounting base to lock the functional module. Step C: Device Startup and Parameter Setting Startup The power module built into the test bracket powers the entire device. The main control unit's operation interface is accessed through the touch screen of the display module embedded on the outside of the vertical support column of the test bracket. The test parameters are set according to the test requirements. At the same time, the heat dissipation components are turned on, and the cooling fan starts working to dissipate heat for each module through the heat dissipation duct. Step D: Test Execution and Data Processing The main control unit controls the detection module to start the test. The detection module uses built-in current sensors, voltage sensors, laser rangefinders, and temperature sensors to collect the electrical performance parameters, physical size data, and operating temperature data of the packaged component. The collected data is transmitted to the main control unit in real time. The main control unit processes and analyzes the received test data, displays the results on the display module, and stores the processed test data in the data storage module. After the test is completed, the power module is turned off.

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