Cleaning robot

By incorporating heat dissipation holes in the sensor bracket and optimizing the water tank layout in the cleaning robot, the problems of low motherboard heat dissipation efficiency and cleaning dead spots were solved, achieving effective heat dissipation and efficient cleaning coverage.

CN121465451APending Publication Date: 2026-02-06ECOVACS ROBOTICS CO LTD
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Patent Information

Application Number
CN202411224197.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2024-08-05
Filing Date
2024-09-02
Publication Date
2026-02-06

AI Technical Summary

Technical Problem

The existing cleaning robot motherboard components have low heat dissipation efficiency, which cannot meet the high computing power requirements. Furthermore, the cleaning robot has blind spots when cleaning dead corners and edges, and its complex structure occupies space and affects the body design.

Method used

By incorporating heat dissipation holes on the sensor brackets in the cleaning robot to utilize external airflow for active heat dissipation, and optimizing the layout of the cleaning rollers and water tank, effective heat dissipation of the mainboard components and improved cleaning coverage can be achieved.

Benefits of technology

It improves the heat dissipation of the motherboard components, reduces the risk of robot overheating, increases cleaning coverage and the extension space of the cleaning roller, and extends cleaning battery life.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN121465451A_ABST
    Figure CN121465451A_ABST
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Abstract

The embodiment of the invention provides a cleaning robot. The cleaning robot comprises a chassis; the shell is arranged above the chassis to form a machine body of the cleaning robot; the driving assembly is used for driving the chassis to advance; the cleaning module is arranged on the chassis; the mainboard assembly is arranged in the machine body; the obstacle avoidance sensor assembly comprises a sensor module and a sensor support, the obstacle avoidance sensor assembly is arranged on the chassis, and the sensor module is arranged on the sensor support; a window is arranged on the shell corresponding to the position of the sensor module; wherein the sensor support is provided with a heat dissipation hole, the heat dissipation hole is communicated with the interior and the exterior of the machine body through a window, and the mainboard assembly is arranged near the heat dissipation hole to dissipate heat of the mainboard assembly. According to the technical scheme, the heat dissipation holes are formed in the sensor support, external airflow can enter the machine body through the heat dissipation holes to dissipate heat of the mainboard assembly, the heat dissipation effect is good, and the mainboard assembly is not prone to overheating.
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Citation Information

Cited By

  • Cleaning robot

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