Wafer loading and unloading device and method

Abstract

The invention relates to the technical field of semiconductors, and discloses a wafer loading and unloading device and method.The device comprises an upper computer control system and further comprises a mechanical arm system and a detection table system which communicate with the upper computer control system; the mechanical arm system comprises a mechanical arm controller communicating with the upper computer control system, and further comprises a wafer storage box and a feeding and discharging mechanical arm which communicate with the mechanical arm controller, and the wafer storage box and the feeding and discharging mechanical arm communicate with the upper computer control system. The detection table system comprises a detection table controller communicating with the upper computer control system and a detection table communicating with the detection table controller. The problem that in the prior art, transmission errors are large is solved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, specifically to a wafer loading and unloading device and method. Background Technology

[0002] Wafer defect detection is a key step in semiconductor manufacturing to ensure product quality, and is mainly achieved through optical, electron microscopy and AI technologies. The main categories of detection technologies are: (1) Laser scanning detection: used for high-speed screening of the entire wafer, identifying defects such as particles and scratches by laser reflection differences, with a detection speed of hundreds of wafers per hour; (2) Optical microscopy analysis: performing point observation on defects detected by laser, and combining bright field, dark field and differential interference modes to distinguish types such as metal particles and organic residues; (3) Scanning electron microscopy: used for submicron level defect analysis, determining the composition through electron beam imaging and energy spectrum, such as detecting metal impurities.

[0003] Wafer loading and unloading is a crucial step in wafer defect detection. Currently, in the field of wafer defect detection, during the wafer loading and unloading process, a loading and unloading robot takes the wafer out of the wafer storage box and then transfers it to the inspection station for subsequent defect detection.

[0004] However, existing technologies have the following problems: 1. Insufficient transmission accuracy and large transmission error; 2. The control process is relatively complex, and the transmission efficiency needs to be improved; 3. It is difficult to ensure the safety of the device and wafer during the transmission process. Summary of the Invention

[0005] To overcome the shortcomings of the prior art, the present invention provides a wafer loading and unloading device and method, which solves the problems of large transfer errors in the prior art.

[0006] The technical solution of the present invention to solve the above-mentioned technical problems is as follows: A wafer loading and unloading device includes a host computer control system, and also includes a robotic arm system and a testing table system that communicate with the host computer control system respectively. in: The robotic arm system includes: a robotic arm controller that communicates with a host computer control system; and wafer storage boxes and loading / unloading robots that communicate with the robotic arm controller. The wafer storage boxes and loading / unloading robots communicate with the host computer control system. The wafer storage boxes are used to store wafers. The robotic arm controller is used to: transmit loading / unloading robot information to the host computer control system, and control the loading / unloading robot's actions according to the instructions of the host computer control system. The loading / unloading robots are used to: remove wafers from the wafer storage boxes, transport wafers, and place wafers on the inspection stage, and remove wafers from the inspection stage, transport wafers, and place wafers into the wafer storage boxes. The testing station system includes: a testing station controller that communicates with the host computer control system, and a testing station that communicates with the testing station controller; the testing station controller is used to: transmit testing station information to the host computer control system, and control the movement of the testing station according to the instructions of the host computer control system; the testing station is used to: mount wafers.

[0007] The beneficial effects of this invention are: The host computer system provides unified control over the robotic arm system and the inspection table system. The host computer system transmits information about the loading / unloading robotic arms to the host computer control system via the robotic arm controller, and controls the robotic arm's movements according to the instructions from the host computer control system. Similarly, the host computer system transmits inspection table information to the host computer control system via the inspection table controller, and controls the inspection table's movement according to the instructions from the host computer control system. Real-time monitoring of the inspection table position and wafer in-situ status ensures accurate transfer and reduces transfer errors. Furthermore, real-time control of the loading / unloading robotic arms and inspection table controllers simplifies the control process and improves loading / unloading efficiency.

[0008] Based on the above technical solution, the present invention can be further improved as follows.

[0009] As a preferred technical solution, the wafer storage box includes a box door and a box sensor that communicates with a host computer control system and a robot controller respectively; wherein, the box sensor is used to: detect the opening and closing state of the box door and transmit the opening and closing state to the host computer control system, and control the opening and closing state of the box door according to the control instructions of the host computer control system.

[0010] The beneficial effects of adopting the above-mentioned preferred technical solution are: The host computer control system monitors and controls the opening and closing status of the box door in real time through the box sensor.

[0011] As a preferred technical solution, the loading and unloading robot includes an adsorption sensor that communicates with a host computer control system, used to: detect the adsorption state of the wafer by the loading and unloading robot and transmit the adsorption state to the host computer control system, and control the adsorption state of the wafer according to the control instructions of the host computer control system.

[0012] The beneficial effects of adopting the above-mentioned preferred technical solution are: The host computer control system uses adsorption sensors to detect and control the adsorption state of the wafer in real time.

[0013] As a preferred technical solution, the host computer control system communicates with the robot controller via the EtherCAT bus, and the host computer control system also communicates with the detection platform controller via the EtherCAT bus.

[0014] The beneficial effects of adopting the above-mentioned preferred technical solution are: The EtherCAT bus has advantages such as simple wiring, high transmission rate, and high synchronization accuracy.

[0015] As a preferred technical solution, the loading and unloading robot is a four-axis robot, and the inspection table is a three-axis movable platform.

[0016] The beneficial effects of adopting the above-mentioned preferred technical solution are: It facilitates the positioning, gripping, moving, releasing, and flipping operations of robotic arms, and also facilitates the positioning and moving operations of inspection tables.

[0017] As a preferred technical solution, the testing station includes a station sensor that communicates with the host computer control system, used for: detecting the position status of the testing station, the position status of the wafer, and whether there is a wafer on the testing station and transmitting the information to the host computer control system, as well as controlling the movement of the testing station according to the control instructions of the host computer control system.

[0018] The beneficial effects of adopting the above-mentioned preferred technical solution are: The host computer control system monitors the position status of the testing platform, the position status of the wafer, and the presence or absence of wafers on the testing platform in real time through platform sensors, and controls the movement of the testing platform in real time through platform sensors.

[0019] As a preferred technical solution, the sensor includes a photoelectric switch, which is used to detect the position status of the detection platform and transmit the information to the host computer control system.

[0020] The beneficial effects of adopting the above-mentioned preferred technical solution are: Photoelectric switches offer advantages such as non-contact detection, long lifespan, fast response speed, high precision, and strong environmental adaptability.

[0021] As a preferred technical solution, the stage sensor includes a reflective sensor, which is used to: detect the wafer's position status, detect whether there is a wafer on the stage, and transmit the information to the host computer control system.

[0022] The beneficial effects of adopting the above-mentioned preferred technical solution are: The reflective sensor has a compact structure, is easy to install, and offers high positioning accuracy, making it suitable for precision applications such as small object detection and marker recognition.

[0023] Based on the above technical solutions, the present invention also provides a wafer loading and unloading method.

[0024] A wafer loading / unloading method, using the aforementioned wafer loading / unloading apparatus to unload wafers, includes the following steps: After the robot controller receives the signal that there is no product on the inspection table (ON) and the signal that the inspection table has reached the upper or lower material position (ON), it will set the signal that the robot arm has not been inserted (OFF). After the inspection stage controller receives an OFF signal indicating that the robotic arm has not been inserted, it prohibits the inspection stage from moving; then, the robotic arm begins the wafer placement action. After the film loading action is completed, the robotic arm sets the "robotic arm not inserted" signal to ON; After the inspection stage controller receives the signal that the robot arm has not been inserted and turns ON, it allows the inspection stage to move; then, the robot arm controller turns ON the signal that the robot arm has completed the placement of the film.

[0025] The beneficial effects of this invention are: During wafer unloading, the robot arm and the inspection station are interlocked to ensure safe and reliable interaction.

[0026] A wafer loading / unloading method, using the aforementioned wafer loading / unloading apparatus, includes the following steps: After the robot controller receives the ON signal that the detection table has reached the upper or lower material position, it sets the OFF signal that the robot arm has not been inserted. After the inspection stage controller receives an OFF signal indicating that the robotic arm has not reached in, it prohibits the inspection stage from moving; then, the robotic arm begins the wafer picking action. After the wafer retrieval operation is completed, the robotic arm sets the "robotic arm not inserted" signal to ON. After the inspection stage controller receives the ON signal that the robot arm has not been inserted, it allows the inspection stage to move; then, the robot arm controller sets the ON signal that the robot arm has completed picking up the wafer.

[0027] The beneficial effects of this invention are: During wafer loading, the robot arm and the inspection station are interlocked to ensure safe and reliable interaction.

[0028] Compared with the prior art, the present invention has the following advantages: (1) The host computer system provides unified control over the robotic arm system and the inspection table system; the host computer system transmits the information of the loading and unloading robotic arm to the host computer control system through the robotic arm controller, and controls the loading and unloading robotic arm according to the instructions of the host computer control system; the host computer system transmits the inspection table information to the host computer control system through the inspection table controller, and controls the inspection table to move according to the instructions of the host computer control system; by monitoring the position of the inspection table and the wafer in-situ status in real time, the transmission accuracy is ensured and the transmission error is reduced; and the real-time control of the loading and unloading robotic arm and the inspection table controller simplifies the control process and improves the loading and unloading efficiency; (2) The host computer control system monitors and controls the opening and closing status of the box door in real time through the box sensor; (3) The host computer control system detects and controls the adsorption state of the wafer in real time through the adsorption sensor; (4) The Ethercat bus has advantages such as simple wiring, high transmission rate, and high synchronization accuracy; (5) Facilitates the positioning, grasping, moving, releasing, and flipping of the robotic arm, and facilitates the positioning and moving of the testing platform; (6) The host computer control system monitors the position status of the testing platform, the position status of the wafer, and the information of whether there is a wafer on the testing platform in real time through the platform sensor, and controls the movement of the testing platform in real time through the platform sensor. (7) Photoelectric switches have the advantages of non-contact detection, long life, fast response speed, high precision, and strong environmental adaptability; (8) The reflection sensor has a compact structure, is easy to install, has high positioning accuracy, and is suitable for precision scenarios such as small object detection and marker recognition; (9) During wafer unloading, the robot and the inspection station are interlocked to ensure safe and reliable interaction. (10) When loading wafers, the robot and the inspection station are interlocked to ensure safe and reliable interaction. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the structure of a wafer loading and unloading device according to the present invention; Figure 2 This is a flowchart of the wafer transfer process of the present invention; Figure 3 This is a signal interaction diagram of the code reading process of the present invention; Figure 4 This is a signal interaction diagram of the wafer unwrapping process of the present invention; Figure 5 This is a signal interaction diagram of the wafer retrieval process of the present invention. Detailed Implementation

[0030] The present invention will be further described in detail below with reference to the embodiments and accompanying drawings, but the embodiments of the present invention are not limited thereto.

[0031] The principles and features of the present invention are described below. The embodiments given are only for explaining the present invention and are not intended to limit the scope of the present invention.

[0032] Example 1 like Figures 1 to 5 As shown, a wafer loading and unloading device includes a host computer control system, and also includes a robotic arm system and a testing platform system that communicate with the host computer control system respectively. in: The robotic arm system includes: a robotic arm controller that communicates with a host computer control system; and wafer storage boxes and loading / unloading robots that communicate with the robotic arm controller. The wafer storage boxes and loading / unloading robots communicate with the host computer control system. The wafer storage boxes are used to store wafers. The robotic arm controller is used to: transmit loading / unloading robot information to the host computer control system, and control the loading / unloading robot's actions according to the instructions of the host computer control system. The loading / unloading robots are used to: remove wafers from the wafer storage boxes, transport wafers, and place wafers on the inspection stage, and remove wafers from the inspection stage, transport wafers, and place wafers into the wafer storage boxes. The testing station system includes: a testing station controller that communicates with the host computer control system, and a testing station that communicates with the testing station controller; the testing station controller is used to: transmit testing station information to the host computer control system, and control the movement of the testing station according to the instructions of the host computer control system; the testing station is used to: mount wafers.

[0033] The beneficial effects of this invention are: The host computer system provides unified control over the robotic arm system and the inspection table system. The host computer system transmits information about the loading / unloading robotic arms to the host computer control system via the robotic arm controller, and controls the robotic arm's movements according to the instructions from the host computer control system. Similarly, the host computer system transmits inspection table information to the host computer control system via the inspection table controller, and controls the inspection table's movement according to the instructions from the host computer control system. Real-time monitoring of the inspection table position and wafer in-situ status ensures accurate transfer and reduces transfer errors. Furthermore, real-time control of the loading / unloading robotic arms and inspection table controllers simplifies the control process and improves loading / unloading efficiency.

[0034] Based on the above technical solution, the present invention can be further improved as follows.

[0035] As a preferred technical solution, the wafer storage box includes a box door and a box sensor that communicates with a host computer control system and a robot controller respectively; wherein, the box sensor is used to: detect the opening and closing state of the box door and transmit the opening and closing state to the host computer control system, and control the opening and closing state of the box door according to the control instructions of the host computer control system.

[0036] The beneficial effects of adopting the above-mentioned preferred technical solution are: The host computer control system monitors and controls the opening and closing status of the box door in real time through the box sensor.

[0037] As a preferred technical solution, the loading and unloading robot includes an adsorption sensor that communicates with a host computer control system, used to: detect the adsorption state of the wafer by the loading and unloading robot and transmit the adsorption state to the host computer control system, and control the adsorption state of the wafer according to the control instructions of the host computer control system.

[0038] The beneficial effects of adopting the above-mentioned preferred technical solution are: The host computer control system uses adsorption sensors to detect and control the adsorption state of the wafer in real time.

[0039] As a preferred technical solution, the host computer control system communicates with the robot controller via the EtherCAT bus, and the host computer control system also communicates with the detection platform controller via the EtherCAT bus.

[0040] The beneficial effects of adopting the above-mentioned preferred technical solution are: The EtherCAT bus has advantages such as simple wiring, high transmission rate, and high synchronization accuracy.

[0041] As a preferred technical solution, the loading and unloading robot is a four-axis robot, and the inspection table is a three-axis movable platform.

[0042] The beneficial effects of adopting the above-mentioned preferred technical solution are: It facilitates the positioning, gripping, moving, releasing, and flipping operations of robotic arms, and also facilitates the positioning and moving operations of inspection tables.

[0043] As a preferred technical solution, the testing station includes a station sensor that communicates with the host computer control system, used for: detecting the position status of the testing station, the position status of the wafer, and whether there is a wafer on the testing station and transmitting the information to the host computer control system, as well as controlling the movement of the testing station according to the control instructions of the host computer control system.

[0044] The beneficial effects of adopting the above-mentioned preferred technical solution are: The host computer control system monitors the position status of the testing platform, the position status of the wafer, and the presence or absence of wafers on the testing platform in real time through platform sensors, and controls the movement of the testing platform in real time through platform sensors.

[0045] As a preferred technical solution, the sensor includes a photoelectric switch, which is used to detect the position status of the detection platform and transmit the information to the host computer control system.

[0046] The beneficial effects of adopting the above-mentioned preferred technical solution are: Photoelectric switches offer advantages such as non-contact detection, long lifespan, fast response speed, high precision, and strong environmental adaptability.

[0047] As a preferred technical solution, the stage sensor includes a reflective sensor, which is used to: detect the wafer's position status, detect whether there is a wafer on the stage, and transmit the information to the host computer control system.

[0048] The beneficial effects of adopting the above-mentioned preferred technical solution are: The reflective sensor has a compact structure, is easy to install, and offers high positioning accuracy, making it suitable for precision applications such as small object detection and marker recognition.

[0049] Based on the above technical solutions, the present invention also provides a wafer loading and unloading method.

[0050] A wafer loading / unloading method, using the aforementioned wafer loading / unloading apparatus to unload wafers, includes the following steps: After the robot controller receives the signal that there is no product on the inspection table (ON) and the signal that the inspection table has reached the upper or lower material position (ON), it will set the signal that the robot arm has not been inserted (OFF). After the inspection stage controller receives an OFF signal indicating that the robotic arm has not been inserted, it prohibits the inspection stage from moving; then, the robotic arm begins the wafer placement action. After the film loading action is completed, the robotic arm sets the "robotic arm not inserted" signal to ON; After the inspection stage controller receives the signal that the robot arm has not been inserted and turns ON, it allows the inspection stage to move; then, the robot arm controller turns ON the signal that the robot arm has completed the placement of the film.

[0051] The beneficial effects of this invention are: During wafer unloading, the robot arm and the inspection station are interlocked to ensure safe and reliable interaction.

[0052] A wafer loading / unloading method, using the aforementioned wafer loading / unloading apparatus, includes the following steps: After the robot controller receives the ON signal that the detection table has reached the upper or lower material position, it sets the OFF signal that the robot arm has not been inserted. After the inspection stage controller receives an OFF signal indicating that the robotic arm has not reached in, it prohibits the inspection stage from moving; then, the robotic arm begins the wafer picking action. After the wafer retrieval operation is completed, the robotic arm sets the "robotic arm not inserted" signal to ON. After the inspection stage controller receives the ON signal that the robot arm has not been inserted, it allows the inspection stage to move; then, the robot arm controller sets the ON signal that the robot arm has completed picking up the wafer.

[0053] The beneficial effects of this invention are: During wafer loading, the robot arm and the inspection station are interlocked to ensure safe and reliable interaction.

[0054] Example 2 like Figures 1 to 5 As shown, based on Example 1, this example provides a more detailed implementation method.

[0055] The objectives of this invention include: 1. Provide technical solutions on how to improve transmission accuracy and reduce transmission errors; 2. Provide technical solutions on how to simplify the control process and improve transmission efficiency; 3. Provide technical solutions on how to ensure the safety of devices and wafers during transmission.

[0056] This invention proposes a wafer loading and unloading device, including a host computer control system, and a robotic arm system and a testing platform system that communicate with the host computer control system respectively. The device performs real-time monitoring and judgment on the testing platform and the wafer, and the host computer system performs unified control of the robotic arm system and the testing platform system. Safety interlocking is achieved through interlock logic.

[0057] The more specific technical solutions are as follows: 1. Host computer control system: Structure: It consists of a host computer controller, a PLC controller, a monitor, a keyboard and mouse, etc.

[0058] Features and Functions: This system collects sensor signals and interlock logic signals to uniformly control the movement rhythm of the loading / unloading robot and the inspection table. The PLC controller collects sensor signals, while the host computer controller controls the movement rhythm. Regarding interlock logic, the PLC controller and the host computer controller employ dual safety interlocks. For control commands, the PLC controller communicates directly with the robot controller and the inspection table controller, transmitting control commands and monitoring signals. Due to the stable communication of the PLC controller, the failure rate is low. The host computer controller communicates with the PLC controller, processing and coordinating the control commands and monitoring signals. Because of its high processing speed and large data storage capacity, the host computer controller is highly efficient.

[0059] 2. The robotic arm system includes: a robotic arm controller that communicates with the host computer control system, and wafer storage boxes and loading / unloading robotic arms that communicate with the robotic arm controller. (1) Robot controller: communicates with the host computer control system, wafer storage box, and loading / unloading robot respectively. The robot controller is used to: transmit the loading / unloading robot information to the host computer control system, and control the loading / unloading robot's actions according to the instructions of the host computer control system.

[0060] (2) Wafer storage box: It consists of a box body, positioning slot, box door, box sensor, etc.

[0061] Features and Functions: The wafer storage box contains multiple wafers and is fixedly positioned in a positioning slot. A loading / unloading robot can reach into the box to retrieve the wafers. The box sensor communicates with the host computer control system and the robot controller. The wafer storage box includes a door and a box sensor that communicates with both the host computer control system and the robot controller. The box sensor is used to: detect the open / closed state of the door and transmit this state to the host computer control system; detect the presence of wafers at various locations within the wafer storage box; and control the opening / closing state of the door according to control commands from the host computer control system. Preferably, the box sensor is installed on the outer edge of the door surface, preventing positional changes and wear due to door opening and closing, ensuring high detection stability.

[0062] (3) Loading and unloading robot: Structure: It is an XYRZ four-axis robotic arm, with a wafer-carrying end effector at the end of the arm.

[0063] Features and Functions: The host computer control system precisely controls the robot arm via EtherCAT bus communication (EtherCAT bus has advantages such as simple wiring, high transmission rate, and high synchronization accuracy. Preferably, both the host computer controller and the PLC controller communicate via EtherCAT bus to precisely control the robot arm, facilitating unified communication protocols, strong compatibility, and further reducing wiring). The robot arm can reach into the wafer storage box to retrieve wafers and place them on the inspection table, and can also remove wafers from the inspection table and return them to the wafer storage box. The robot arm sends a "robot arm has reached" signal to the host computer during loading and unloading. The loading and unloading robot arm includes an adsorption sensor that communicates with the host computer control system. This sensor is used to: detect the adsorption state of the wafers by the loading and unloading robot arm and transmit the adsorption state to the host computer control system; and control the adsorption state of the wafers according to the control commands of the host computer control system. The loading and unloading robot arm preferably uses vacuum adsorption to adsorb wafers, which provides strong adsorption force and minimizes damage to the wafers.

[0064] 3. The testing platform system includes: a testing platform controller that communicates with the host computer control system, and a testing platform that communicates with the testing platform controller. (1) Testing station controller: The host computer control system and the testing station communicate separately; the testing station controller is used to: transmit the testing station information to the host computer control system, and control the movement of the testing station according to the instructions of the host computer control system; (2) Testing station: Structure: It is an XYR three-axis movable platform, and the inspection stage can carry the wafer movement. Figure 1The interface is a structure that provides a channel for wafers to enter and exit the inspection station. The inspection station includes station sensors that communicate with the host computer control system. These sensors are used to: detect the station's position status, the wafer's position status, and whether a wafer is present on the inspection station, transmitting this information to the host computer control system; and control the movement of the inspection station according to control commands from the host computer control system. The station sensors include photoelectric switches, which are used to: detect the inspection station's position status and transmit this information to the host computer control system. Reflection sensors are used to: detect the wafer's position status and whether a wafer is present on the inspection station, transmitting this information to the host computer control system.

[0065] Features and Functions: The host computer control system precisely controls the X, Y, and R axes of the inspection station via EtherCAT bus communication (EtherCAT bus has advantages such as simple wiring, high transmission rate, and high synchronization accuracy. Preferably, both the host computer controller and the PLC controller communicate via EtherCAT bus to precisely control the inspection station, which facilitates unified communication protocols, strong compatibility, and further reduces wiring). The XYR coordinates of the inspection station are determined by photoelectric switches, and the presence of a wafer on the inspection station is determined by a reflection sensor. When the inspection station is in position, a "permission for robotic arm to enter" signal is sent to the host computer.

[0066] The structure of the wafer loading and unloading device described in this invention is as follows: Figure 1 As shown.

[0067] The wafer transfer process of this invention is as follows: Figure 2 As shown.

[0068] The following are the steps of a wafer passing through the "wafer storage box - inspection station - wafer storage box" path. The interlocking logic is used during the process of placing the wafer into the inspection station (step B) and removing the wafer from the inspection station (step C).

[0069] A. Remove the wafer from the wafer storage cassette and transport it to the testing station: The host computer control system sends a control command to the robot arm controller to open the wafer storage box, and the robot arm controller controls the wafer storage box to open according to the control command; The host computer control system sends a control command to the robot arm controller to remove the wafer from the wafer storage box. The robot arm controller controls the loading and unloading robot arm to move to the wafer storage box to remove the wafer according to the control command. The host computer control system sends control commands for wafer movement to the robot controller, and the robot controller controls the loading and unloading robot to transport the wafer to the inspection station according to the control commands. B. Place the wafer into the testing station: The host computer control system sends a control command to the test platform controller to move the test platform, and the test platform controller controls the test platform to move to the set position according to the control command. The test station controller detects that the test station is in place and there are no wafers on the test station, and then transmits this information to the host computer control system. The host computer control system sends a control command to the robot controller to place the wafer on the inspection stage, and then places the wafer on the inspection stage; The testing station controller detects that the wafer has been placed and transmits this information to the host computer control system. The host computer control system sends a control command to the robot arm controller to leave the inspection table. The robot arm controller controls the loading and unloading robot arm to leave the inspection table according to the control command. C. Remove the wafer from the testing station: After the inspection is completed, the host computer control system sends a control command to the robot controller to remove the wafer from the inspection table. The robot controller then controls the loading and unloading robot to move to the inspection table and remove the wafer according to the control command. D. Transport the wafer to the wafer storage container and place it inside: The host computer control system sends control commands for wafer movement to the robot controller. The robot controller then controls the loading and unloading robot to transport the wafer to the wafer storage box according to the control commands, and then places the wafer into the wafer storage box.

[0070] The interaction signals between the AOI machine (Automated Optical Inspection, the inspection table includes several AOI machines, in this invention, the AOI machine refers to the console controller) and the robot are shown in Table 1. Table 1 shows the interaction signals between the monitoring signal stream and the control command stream.

[0071] Table 1. Interaction Signals between AOI Machine and Robotic Arm The code reading (reading the identification code of the wafer that needs to be inspected for defects) process signal interaction is as follows: Figure 3 As shown.

[0072] Reading the code includes the following steps: 1) The robot controller sets the "code reading request" signal to ON, and the AOI machine receives it and scans the code with a barcode scanner; 2) After the barcode scanner successfully scans the code, the AOI machine will set the "code reading successful" signal to ON; 3) After the robot controller receives the "code reading successful" signal and turns it ON, it sets the "code reading request" signal OFF; 4) After the AOI machine receives the "Read Code Request" signal as OFF, it sets the "Read Code Successful" signal to OFF.

[0073] The signal interaction during the film loading (unloading) process is as follows: Figure 4As shown in the figure. Steps 2), 3), 4), and 5) embody the interlocking logic.

[0074] The film loading process includes the following steps: 1) When the AOI machine confirms that there is no product on the chuck, set the "No product on chuck" signal to ON. When the chuck reaches the loading / unloading position, set the "Chuck reaches loading / unloading position" signal to ON. 2) After the robot controller receives the "No product on chuck" signal as ON and the "chuck has reached the loading / unloading position" signal as ON, it sets the "Robot arm not inserted" signal to OFF; 3) Robotic arm loading of film: 3-1) After the AOI machine receives the "robotic arm not inserted" signal and sets it to OFF, chuck movement is prohibited; 3-2) The robotic arm begins the film placement action; 4) After the film loading action is completed, the robotic arm sets the "robotic arm not inserted" signal to ON; 5) Chuck movement: 5-1) After the AOI machine receives the "robotic arm not inserted" signal and turns ON, it allows the chuck to move; 5-2) The robot controller sets the "robot arm completes film placement" signal to ON; 6) AOI machine reception complete: 6-1) After the AOI machine receives the "Robot arm completes film placement" signal and turns it ON, it sets the "AOI machine reception complete" signal ON. 6-2) The AOI machine sets the "chuck has reached the loading / unloading position" signal to OFF; 6-3) The AOI machine sets the "No product on chuck" signal to OFF; 7) After the robot controller receives the "AOI machine reception complete" signal and turns ON, it turns the "robot arm completes placement" signal OFF; 8) After the AOI machine receives the "Robot arm completes film placement" signal and sets it to OFF, it sets the "AOI machine reception complete" signal to OFF.

[0075] The signal interaction of the chip loading (loading) process is as follows: Figure 5 As shown in the figure. Steps 2), 3), 4), and 5) embody the interlocking logic.

[0076] The steps for retrieving the film are as follows: 1-1) To confirm whether to flip the object, set "Flip Object" to ON or OFF on the AOI machine. 1-2) The AOI machine sets the "Detection Result" to ON or OFF based on the detection result, confirms that the chuck has reached the loading / unloading position, and sets the "Chuck has reached the loading / unloading position" signal to ON; where, the Chuck (wafer chuck / suction cup) is a key mechanical component used to fix, support and position the wafer. Its core function is to ensure the stability and accuracy of the wafer during processing, inspection or handling. The Chuck firmly adsorbs the wafer onto the surface by physical or electrostatic means to prevent displacement or vibration during processing. In this invention, the Chuck moves with the inspection stage; 2) After the robot controller receives the "chuck has reached the loading / unloading position" signal and turns it ON, it turns the "robot arm not inserted" signal OFF; 3) Robotic arm picks up the wafer: 3-1) After the AOI machine receives the "robotic arm not inserted" signal and sets it to OFF, chuck movement is prohibited; 3-2) The robotic arm begins the wafer picking action; 4) After the wafer retrieval operation is completed, the robotic arm sets the "robotic arm not inserted" signal to ON; 5) Chuck movement: 5-1) After the AOI machine receives the "robotic arm not inserted" signal and turns ON, it allows the chuck to move; 5-2) The robot controller sets the "Robot has completed picking up the piece" signal to ON; 6) AOI machine completes wafer retrieval: 6-1) After the AOI machine receives the "Robot arm completes wafer pickup" signal and turns it ON, it sets the "AOI machine wafer pickup complete" signal to ON. 6-2) The AOI machine sets the "chuck has reached the loading / unloading position" signal to OFF; 7) After the robot controller receives the "AOI machine completes wafer retrieval" signal as ON, it sets the "robot arm completes wafer retrieval" signal to OFF; 8) After the AOI machine receives the "Robot arm completes wafer pickup" signal as OFF, it sets the "AOI machine wafer pickup complete" signal to OFF.

[0077] The present invention has the following technical effects: 1. By monitoring the position of the testing station and the wafer's in-situ status in real time, accurate transfer is ensured, reducing transfer errors; 2. The upper computer system controls the loading and unloading robot and the inspection table in real time, which simplifies the control process and improves the loading and unloading efficiency; 3. Interlocking logic between the robotic arm and the inspection station ensures safe and reliable interaction.

[0078] As described above, the present invention can be implemented well.

[0079] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0080] In the description of this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0081] In the description of this invention, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0082] In the description of this invention, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0083] In the description of this invention, although embodiments of the invention have been shown and described herein, it is to be understood that the above embodiments are exemplary and should not be construed as limiting the invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this invention.

[0084] In the description of this invention, all features disclosed in all embodiments of this specification, or steps in all methods or processes implied in the disclosure, may be combined and / or extended or replaced in any way, except for mutually exclusive features and / or steps.

[0085] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Based on the technical essence of the present invention, any simple modifications, equivalent substitutions, and improvements made to the above embodiments within the spirit and principles of the present invention shall still fall within the protection scope of the present invention.

Claims

1. A wafer flipper, comprising: The wafer loading and unloading device comprises an upper computer control system, a mechanical arm system and a detection table system. The wafer loading and unloading device comprises an upper computer control system, a mechanical arm system and a detection table system. The mechanical arm system comprises a mechanical arm controller in communication with the upper computer control system, a wafer storage box and a wafer loading and unloading mechanical arm in communication with the mechanical arm controller, respectively, and the wafer storage box and the wafer loading and unloading mechanical arm are in communication with the upper computer control system, respectively. The wafer storage box is used for storing wafers.

2. The wafer on-chip device according to claim 1, wherein The mechanical arm controller is used for transmitting information of the wafer loading and unloading mechanical arm to the upper computer control system and controlling the wafer loading and unloading mechanical arm to act according to the instruction of the upper computer control system.

3. The wafer on-chip device of claim 1, wherein The wafer loading and unloading mechanical arm is used for taking wafers from the wafer storage box, carrying the wafers, placing the wafers on the detection table, and taking the wafers from the detection table, carrying the wafers and placing the wafers into the wafer storage box.

4. The wafer on-chip device of claim 1, wherein The detection table system comprises a detection table controller in communication with the upper computer control system and a detection table in communication with the detection table controller.

5. The wafer on-chip device of claim 1, wherein The detection table controller is used for transmitting information of the detection table to the upper computer control system and controlling the detection table to move according to the instruction of the upper computer control system.

6. The wafer on-chip device according to any one of claims 1 to 5, wherein The detection table is used for carrying wafers.

7. The wafer on-chip device according to claim 6, wherein The wafer storage box comprises a box door and a box sensor in communication with the upper computer control system and the mechanical arm controller, respectively.

8. The wafer on-chip device of claim 6, wherein, The box sensor is used for detecting the opening and closing state of the box door and transmitting the opening and closing state to the upper computer control system and controlling the opening and closing state of the box door according to the control instruction of the upper computer control system.

9. A wafer backside thinning method, characterized by, The wafer loading and unloading mechanical arm comprises a suction sensor in communication with the upper computer control system. The wafer loading and unloading mechanical arm is in communication with the mechanical arm controller through an Ethercat bus, and the detection table controller is in communication with the upper computer control system through the Ethercat bus. The wafer loading and unloading mechanical arm is a four-axis mechanical arm, and the detection table is a three-axis movable platform. The detection table comprises a table sensor in communication with the upper computer control system. The table sensor is used for detecting the arrival state of the detection table and transmitting the information to the upper computer control system. The table sensor comprises a photoelectric switch. The table sensor comprises a reflection sensor. The wafer loading and unloading device is used for wafer unloading, comprising the following steps: After the mechanical arm controller receives the signal that there is no product on the detection table and the signal that the detection table reaches the loading and unloading position, the mechanical arm not inserted signal is set to OFF; After the detection table controller receives the signal that the mechanical arm is not inserted, the detection table is prohibited from moving. After the wafer loading and unloading mechanical arm finishes the wafer placing action, the mechanical arm not inserted signal is set to ON. The detection table controller receives the non-extended signal of the robot as ON, and allows the detection table to move; then, the robot controller sets the wafer placing completion signal of the robot as ON.

10. A wafer backside thinning method, characterized by, A wafer placing operation using the wafer placing and taking device of any one of claims 1 to 8, comprising the steps of: The robot controller receives the detection table reaching the loading and unloading position signal as ON, and sets the non-extended signal of the robot as OFF; The detection table controller receives the non-extended signal of the robot as OFF, and prohibits the detection table from moving; then, the robot starts the wafer taking action; After the wafer taking action is completed, the robot sets the non-extended signal of the robot as ON; The detection table controller receives the non-extended signal of the robot as ON, and allows the detection table to move; then, the robot controller sets the wafer placing completion signal of the robot as ON.

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