Compact C-GIS gas-insulated switchgear based on optimized heat dissipation structure and method

Abstract

The invention belongs to the technical field of insulated switch equipment, and discloses a compact C-GIS gas insulated switchgear based on an optimized heat dissipation structure and a method. According to the method, in the material and pretreatment stage, a 10 * 60mm copper bar is adopted, and silver plating is completed only by delimiting areas at the two ends of the 10 * 60mm copper bar, so that the procedure of baking black paint is omitted; in the assembly process, according to the updated process file, the installation of the top cooling fin and the back cooling fin is omitted, and the assembly work of the internal cooling frame and the threaded holes for fixing the internal cooling frame is omitted; and after final assembly, whether the overall temperature rise of the compact C-GIS gas-insulated switchgear based on the optimized heat dissipation structure reaches the standard or not is directly verified through a standard temperature rise test or equivalent infrared detection. According to the invention, unnecessary heat dissipation parts (such as a back heat dissipation plate and an internal heat dissipation frame) are canceled, so that the complexity of the cabinet body structure is reduced.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of insulated switchgear, and particularly relates to a compact C-GIS gas-filled cabinet based on an optimized heat dissipation structure and a method. BACKGROUND

[0002] C-GIS (gas-filled gas insulated switchgear) has been widely used in the power distribution network field due to its compact structure, immunity to external environment, high reliability and other advantages. In the prior art, the heat dissipation design of a C-GIS cabinet with a model of XGN□-12 / 1250-31.5 usually adopts multiple measures to ensure that the temperature rise of the cabinet under long-term high-load operation is controlled within the allowable range of the national standard. These measures usually include: A heat dissipation plate sprayed with black paint is installed at the back and top of the gas tank: the contact area between the gas tank and the external air is increased to enhance convective heat dissipation.

[0003] A heat dissipation frame is arranged inside the gas tank: used to support and conduct the heat of internal components, and the heat is transferred from the heat source to the gas tank wall through heat conduction.

[0004] The conductive copper bar is treated by baking black paint: the high surface emissivity of the black paint layer is used to enhance the heat radiation capacity of the copper bar surface, so as to facilitate the radiation of heat to the surrounding space.

[0005] Although the above-mentioned traditional heat dissipation scheme is effective, it has the following significant defects: Complex structure and high cost: the additional metal components such as heat dissipation plates and heat dissipation frames not only increase the cost of raw materials, but also greatly increase the labor cost and man-hour of related sheet metal processing, welding studs, assembly and other processes.

[0006] Complicated process and low production efficiency: the "baking black paint" treatment of the copper bar is an independent and special process, which requires pre-treatment (oil removal, rust removal), spraying, curing and other steps, prolonging the production cycle and increasing the energy consumption and process management cost.

[0007] Low space utilization: the internal heat dissipation frame occupies a certain internal space of the gas tank, which is not conducive to the further miniaturization and compactness design of the equipment.

[0008] Overdesign: through in-depth research and repeated tests, it is found that for a specific type and rated parameter of the cabinet, the above-mentioned multiple heat dissipation measures may have an "over-redundant design" problem. That is, after canceling part of the heat dissipation structure, the temperature rise of the equipment can still meet the standard requirements, proving that the original design is redundant and wasteful.

[0009] Low assembly efficiency: a large number of nails on the back plate of the gas tank and the threaded connection between the internal heat dissipation frame and the guide sleeve increase the complexity and man-hour of assembly. SUMMARY

[0010] To overcome the problems in the related art, the application discloses a compact C-GIS gas-filled tank based on an optimized heat dissipation structure and a method.

[0011] The technical scheme is as follows: a heat dissipation method of a compact C-GIS gas-filled tank based on an optimized heat dissipation structure, which specifically comprises the following steps: S1, in the material and pretreatment stage, a 10*60 mm copper bar is used, and silver plating is only performed on the two ends of the 10*60 mm copper bar, and the baking varnish process is omitted; S2, in the assembly process, according to the updated process file, the installation of the top heat dissipation fins and the back heat dissipation fins is omitted, and the assembly operation of the internal heat dissipation frame and the threaded hole for fixing the internal heat dissipation frame is omitted; S3, after the final assembly, the standard temperature rise test or the equivalent infrared detection is performed to directly verify whether the overall temperature rise of the compact C-GIS gas-filled tank based on the optimized heat dissipation structure meets the standard.

[0012] Further, in the final assembly verification of step S3, the standard temperature rise test or the equivalent infrared detection is performed to directly verify whether the overall temperature rise of the compact C-GIS gas-filled tank based on the optimized heat dissipation structure meets the standard, which comprises the following steps: S301, multi-dimensional dynamic load simulation; S302, phase-synchronous dynamic infrared scanning PS-DTIR; S303, three-dimensional temperature field reconstruction; S304, based on the reconstructed three-dimensional temperature field, the temperature rise judgment system is optimized through a dynamic threshold correction formula and a hot spot risk assessment index.

[0013] Further, the multi-dimensional dynamic load simulation of step S301 comprises the following steps: A variable frequency power supply is used to simulate the actual compact C-GIS gas-filled tank load current fluctuation ±15% rated current In, and step loads of 0.5In, 1.2In, 2.0In and rated current In are cyclically applied; Each load section lasts until thermal stability, and the key node temperature rise curve is recorded, including the silver-plated joint at the two ends of the 10*60 mm copper bar, the top and back surfaces of the gas-filled tank shell and certain nodes in the internal space.

[0014] Step S302, phase-synchronous dynamic infrared scanning PS-DTIR, comprises the following steps: In the pre-scanning stage, the device is operated under no load, and a baseline temperature field is established; In the load synchronization stage, the infrared thermal imager is phase-locked with the current, and the thermal distribution at the peak load moment is captured; In the trajectory tracking stage, the mobile arc hot spot is tracked at a high speed of >30fps, and the weak heat dissipation point is located.

[0015] The three-dimensional temperature field reconstruction in step S303 includes: A fiber grating sensor array with >50 sensors is arranged on the surface of the cabinet body, covering the original heat dissipation fin area, including the top heat dissipation fin, the back heat dissipation fin, the internal heat dissipation frame, and the 10*60mm copper bar area. The internal hot spot distribution is reconstructed by a heat conduction inversion algorithm to obtain a three-dimensional temperature field.

[0016] Another object of the present application is to provide a compact C-GIS gas-filled cabinet based on an optimized heat dissipation structure, comprising: a gas-filled cabinet shell, a main circuit is installed in the upper part of the gas-filled cabinet shell, and an isolation static blade seat is connected to the main circuit; the isolation static blade seat is installed in the back of the gas-filled cabinet shell; an intermediate guide sleeve is arranged at intervals on one side of the isolation static blade seat; the intermediate guide sleeve is connected to a pole through a support frame, and the pole is connected to an incoming line end through a 10*60mm copper bar; The two ends of the 10*60mm copper bar are overlapped and plated with silver to be connected to the pole and the incoming line end, respectively.

[0017] One end of the 10*60mm copper bar is also sleeved with an incoming line sleeve and is externally sleeved at the connection between the 10*60mm copper bar and the incoming line end. The threaded holes for fixing the internal heat dissipation frame are cancelled on the intermediate guide sleeve.

[0018] Further, the compact C-GIS gas-filled cabinet based on the optimized heat dissipation structure is applied in the field of power distribution networks.

[0019] In combination with all the above technical solutions, the present application has the following beneficial effects: the present application overcomes the defects of the existing C-GIS heat dissipation technology and provides a low-cost, simple-structure and process-simplified C-GIS gas-filled cabinet optimization scheme. The present application simplifies the structure: by cancelling unnecessary heat dissipation components (such as the back heat dissipation plate and the internal heat dissipation frame), the complexity of the cabinet structure is reduced. The cost is reduced: under the premise of ensuring product performance (temperature rise index) fully meeting the standards, the amount of materials is reduced, and the manufacturing and assembly processes are simplified, thereby significantly reducing the production cost. The process is optimized: the baking varnish process of the copper bar is cancelled or changed, the production process is shortened, and the production efficiency is improved. The competitiveness is improved: under the same performance, the cost advantage and structural optimization enhance the market competitiveness of the product.

[0020] Compared with the prior art, the advantages of the present application further include: the structure is extremely simplified, and the reliability is improved: the external heat dissipation fins and the internal heat dissipation frame and all their attached fastening structures (nails and threaded holes) are completely cancelled, the cabinet structure is more simple and compact. The potential failure points caused by unreliable welding and connection are reduced, and the intrinsic reliability of the product is improved.

[0021] Production cost is significantly reduced: in material cost, directly save the fin, heat dissipation frame metal material; Copper bar specification thinning (12mm→10mm), save the precious copper material; Reduce the use of standard parts such as nails. In processing cost, save the forming and processing cost of fin and heat dissipation frame; The process of machining threaded hole on the guide sleeve is saved. In process cost, the copper bar baking black paint, a surface treatment process which consumes energy and time, is completely cancelled, saving equipment, energy consumption, labor and environmental management cost. The assembly efficiency is greatly improved, and the assembly process and working hours are significantly reduced, simplifying the process, improving the production line beat and overall assembly efficiency. The performance is verified, and the optimization is scientific and reasonable: all simplification measures are based on solid data support of multiple temperature rise tests, ensuring that the product is optimized under the premise of meeting national standards, rather than simply "cutting corners", reflecting the value engineering concept based on scientific verification. In green environmental protection, the baking process is cancelled, which fundamentally avoids the emission of volatile organic compounds in this link, and is more environmentally friendly. BRIEF DESCRIPTION OF DRAWINGS

[0022] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and serve to explain the principles of the present disclosure, together with the description; Figure 1 is the overall isometric view of the compact C-GIS gas-filled cabinet based on the optimized heat dissipation structure provided by the embodiment of the present application; Figure 2 is the overall side view of the compact C-GIS gas-filled cabinet based on the optimized heat dissipation structure provided by the embodiment of the present application; Figure 3 is the side view schematic diagram of the prior art compact C-GIS gas-filled cabinet; Figure 4 is the isometric schematic diagram of the prior art compact C-GIS gas-filled cabinet; Figure 5 is the schematic diagram of the process technical improvement of the embodiment of the present application in which the nails on the gas tank back plate are reduced; Figure 6 is the schematic diagram of the nails on the gas tank back plate of the prior art compact C-GIS gas-filled cabinet for installing the fin; Figure 7 is the schematic diagram of the process technical improvement of the embodiment of the present application in which the threaded hole on the maintenance cover for fixing the fin is cancelled; Figure 8 is the schematic diagram of the threaded hole on the maintenance cover of the prior art compact C-GIS gas-filled cabinet for fixing the fin; Figure 9This is a schematic diagram of the improved process technology of eliminating the threaded hole for mounting the heat sink in the intermediate guide sleeve according to an embodiment of the present invention; Figure 10 This is a schematic diagram of the threaded holes in the intermediate guide sleeve of the gas box of the existing compact C-GIS gas holder for installing the heat sink bracket; Figure 11 This is a schematic diagram of the improved technology of the present invention, which uses a thinner copper busbar and eliminates the black paint baking process; Figure 12 This is a rendering of a product using a black paint process for heat dissipation on the copper busbars of a compact C-GIS gas-insulated switchgear. Figure 13 This is a flowchart illustrating the assembly principle of the heat dissipation method for a compact C-GIS gas-insulated cabinet based on an optimized heat dissipation structure, as provided in an embodiment of the present invention. In the diagram: 1. Gas-filled cabinet shell; 2. Main circuit; 3. Isolation stationary knife seat; 4. Intermediate guide sleeve; 5. Support frame; 6. Pole post; 7. 10×60mm copper busbar; 8. Inlet terminal; 9. Inlet sleeve; 10. Top heat sink; 11. Back heat sink; 12. Internal heat sink frame; 13. 12×60mm copper busbar; 14. Threaded hole; 15. Insert pin. Detailed Implementation

[0023] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0024] Example 1, as Figure 1 The compact C-GIS gas-insulated switchgear based on an optimized heat dissipation structure includes: a gas-insulated switchgear shell 1, a main circuit 2 installed in the upper inner part of the gas-insulated switchgear shell 1, and an isolation stationary knife seat 3 connected to the main circuit 2; the isolation stationary knife seat 3 is installed on the back inner part of the gas-insulated switchgear shell 1; intermediate guide sleeves 4 are arranged at intervals on one side of the isolation stationary knife seat 3; the intermediate guide sleeves 4 are connected to the pole post 6 through the support frame 5, and the pole post 6 is connected to the inlet terminal 8 through a 10×60mm copper busbar 7; The silver-plated joints at both ends of the 10×60mm copper busbar (TMQY 10×60mm) 7 are connected to the pole post 6 and the inlet terminal 8 respectively; One end of the 10×60mm copper busbar 7 is also fitted with an inlet sleeve 9, which is fitted on the outside of the connection between the 10×60mm copper busbar 7 and the inlet end 8.

[0025] like Figure 3 , Figure 4The existing compact C-GIS gas-insulated switchgear includes: a top heat sink 10 is installed on the top of the gas-insulated switchgear shell 1 by means of a pin 15, and a back heat sink 11 is installed on the back of the gas-insulated switchgear shell 1 by means of a pin 15. An internal heat dissipation bracket 12 is installed on the intermediate guide sleeve 4 inside the gas-filled cabinet shell 1 through the threaded hole 14; The pole 6 inside the gas-filled cabinet shell 1 is connected to the inlet terminal 8 via a 12×60mm copper busbar (TMQY 12×60mm copper busbar) 13. The two ends of the 12×60mm copper busbar 13 are silver-plated and the middle is painted black. like Figure 1 , Figure 2 , Figure 5 , Figure 7 , Figure 9 , Figure 11 This invention, based on a compact C-GIS gas-insulated switchgear with optimized heat dissipation structure, eliminates the shortcomings of existing technologies such as... Figure 3 , Figure 4 The top heat sink 10, the back heat sink 11, and the internal heat sink 12 reduce the number of nails on the back panel of the gas-insulated cabinet shell 1, simplify the assembly process, and reduce costs.

[0026] The threaded hole for fixing the internal heat sink 12 on the intermediate guide sleeve 4 was eliminated, reducing the number of parts processing steps and directly lowering costs.

[0027] Internal copper busbar (tin-plated) specifications are as follows Figure 3 , Figure 4 The existing TMQY 12×60mm copper busbar has been replaced with TMQY 10×60mm copper busbar (tin-plated) 7. The process has been changed from silver plating at both ends and black paint baking in the middle to silver plating only at both ends, reducing costs and increasing efficiency.

[0028] After multiple temperature rise tests, and considering factors such as overall cost and manufacturability, it was decided to optimize the cabinet and remove the structures related to heat dissipation.

[0029] in, Figure 5 This is a schematic diagram of the improved manufacturing process of reducing the number of nails on the back plate of the air box according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the mounting pins used to install heat sinks on the back panel of the gas box of a compact C-GIS gas-insulated switchgear in the prior art. Figure 7 This is a schematic diagram of the improved machining process of the present invention, which eliminates the threaded hole for fixing the heat sink in the inspection cover. Figure 8 This is a schematic diagram of the threaded holes used to fix the heat sink in the gas inspection cover of the existing compact C-GIS gas-insulated switchgear; Figure 9 This is a schematic diagram of the improved process technology of eliminating the threaded hole for mounting the heat sink in the intermediate guide sleeve according to an embodiment of the present invention; Figure 10This is a schematic diagram of the threaded holes in the intermediate guide sleeve of the gas box of the existing compact C-GIS gas holder for installing the heat sink bracket; Figure 11 This is a schematic diagram of an embodiment of the present invention that uses a thinner copper busbar and eliminates the black paint baking process; the copper busbar thickness of the present invention is 10mm; Figure 12 This is a rendering of a product using a black paint process for heat dissipation on the copper busbar of a compact C-GIS gas-insulated switchgear; the thickness of the copper busbar in the existing technology is 12mm.

[0030] In summary, this invention, through systematic thermal design and structural optimization of the C-GIS cabinet, achieves comprehensive optimization of structure, process, and cost while ensuring that electrical performance fully meets the standards. It has outstanding substantive features and significant progress, making the product more economical and competitive in the market.

[0031] This invention's optimization of the C-GIS gas-insulated switchgear structure is not a simple "subtraction," but rather a systematic reconstruction and optimization of the switchgear's heat dissipation path, thermal balance mechanism, and structural function based on in-depth thermodynamic analysis and experimental verification. The core of its working principle lies in eliminating verified redundant heat dissipation structures, allowing the equipment to return to and rely on more efficient and direct basic physical heat dissipation mechanisms, while maintaining and even optimizing performance guarantees at key electrical connection points.

[0032] The improved overall structure operates on the following principle: a reconstruction of the heat dissipation principle, shifting from "forced assisted heat dissipation" to "optimized natural heat dissipation." The original design relied on a complex, multi-layered heat dissipation network. Internal heat was conducted to the air chamber wall via the heat sink, and then the additional heat sinks on the back and top increased the contact area with the air, forcibly enhancing convection. Simultaneously, the black paint coating on the copper busbars aimed to enhance their surface thermal radiation. This was a complex structure combining conduction, enhanced convection, and enhanced radiation.

[0033] The optimized design of this invention: By eliminating all external heat sinks and internal heat dissipation frames, the cabinet's heat dissipation returns to and optimizes the basic principle of natural heat dissipation. Main heat dissipation path: Heat generated by the main internal heat-generating components (such as the optimized copper busbars and contacts) is initially dissipated through natural air convection and thermal radiation to the inner wall of the air chamber. Final heat dissipation interface: After heat is transferred to the inner wall of the air chamber (shell), it directly exchanges heat with the ambient air through natural convection on the complete and flat metal surface of the chamber. Tests have confirmed that for the heat load of this model of cabinet, its inherent surface area is sufficient to control the temperature rise within a safe range under natural convection conditions. Implicit optimization: Eliminating the internal heat dissipation frames effectively reduces their obstruction to the natural air convection flow inside the air chamber, improving the internal thermal flow field to a certain extent and allowing heat to be transferred more smoothly to the chamber walls.

[0034] An example is the principle of synergistic optimization of electrical connections and thermal management; Copper busbar specifications optimized: The copper busbar was changed from TMQY 12×60mm to TMQY 10×60mm. While maintaining the current carrying capacity, its cross-sectional area decreased, but the surface area to volume ratio increased relatively. This means that under unit loss, the copper busbar has a relatively larger heat dissipation surface per unit mass, which is more conducive to heat dissipation to the surrounding medium (dry air), representing a more efficient way of utilizing materials.

[0035] The copper busbar manufacturing process is simplified: the black paint finish on the middle section is eliminated, retaining only the bright metal surface or tin plating. While this theoretically slightly reduces the surface emissivity, the key principle is that, as verified experimentally, convection heat transfer is the dominant heat dissipation method in dry air, and the contribution of radiation in the original design has been proven to be a redundancy that can be reduced. Simultaneously, retaining the silver plating on the overlapping surfaces at both ends ensures low contact resistance and excellent conductivity at critical electrical connection points, reducing heat generation at the connection point from the source—this is the most fundamental thermal management optimization.

[0036] For example, the principle of systemic stability brought about by structural simplification; reduced thermal and mechanical stress: the elimination of heat sinks and external heat sinks connected to the gas box wall via pins and threaded holes eliminates additional thermal stresses that may be caused by the difference in thermal expansion coefficients between these components and the gas box material, as well as internal mechanical stresses introduced by assembly. This improves the reliability of the gas box (especially the sealing welds) under long-term thermal cycling.

[0037] Improved assembly consistency and reliability: The reduction in the number of pin welding operations on the air box, the machining of threaded holes for individual components, and the installation of heat sinks lowers the risk of inconsistent heat transfer paths caused by human assembly differences (such as uneven tightening torque). A simpler structure results in fewer potential failure points, ultimately improving the overall performance consistency and long-term operational stability of the cabinet.

[0038] For example, the core working principle is as follows: After rigorously confirming safety boundaries through temperature rise testing, redundant and indirect heat dissipation enhancement methods are abandoned. Instead, the inherent natural convection and radiation heat dissipation capabilities of the cabinet are relied upon and optimized. By optimizing the efficiency of the conductors themselves (specification optimization) and concentrating on ensuring the electrical performance of key points (precise silver plating), heat generation is reduced at the source, ensuring the high efficiency and directness of the main heat dissipation path. Ultimately, through the extreme simplification of the overall structure, a better balance of thermal-mechanical-electrical performance and higher reliability are achieved. This represents a shift in design philosophy from "overlapping protection" to "precise sufficiency," the effectiveness of which is verified by system test data.

[0039] Example 2: To achieve the same inventive objective of "ensuring performance and reducing costs," the following technical alternatives can be adopted: Option A (partially simplified): Only the rear heat sink and internal heat sink bracket are removed, but the black paint finish on the copper busbars is retained. This option, as a phased optimization, still achieves significant cost reduction and structural simplification.

[0040] Option B (Material Alternative): The heat sink is not eliminated, but the original metal heat sink is replaced with a lower-cost, easier-to-form high thermal conductivity composite material plate or thermally conductive plastic plate, which can also achieve the goal of simplifying the process and reducing costs.

[0041] Option C (Structural Integration Solution): Instead of setting up a separate heat dissipation frame, the heat dissipation function is integrated into the existing insulating support or fastener. For example, an insulating support with a larger heat dissipation area is designed to achieve "multi-purpose use of one item".

[0042] Example 3, the following description further illustrates the innovative aspects of this invention.

[0043] The problem of "heat dissipation redundancy" in existing technologies has been solved: through rigorous temperature rise tests, it has been verified for the first time that the back heat sink and internal heat dissipation frame are unnecessary on the XGN-12 / 1250-31.5 type C-GIS cabinet (cabinet width is 500mm).

[0044] Structural Innovation: A simplified gas box structure with "no back or top heat sink" and "no internal heat sink frame" was proposed, which also led to the simplification of auxiliary structures such as mounting pins and threaded holes. (The principle is that after multiple rigorous temperature rise tests, it was confirmed that under rated operating conditions, the gas box's own metal shell already has sufficient effective heat dissipation area and heat conduction capacity, eliminating the need for an external heat sink for reinforcement; at the same time, eliminating the internal heat sink frame eliminates the contact thermal resistance and obstruction to the internal gas convection path it brings, allowing the heat generated by the heating element to be transferred more directly to the gas box wall through the natural convection of the gas inside the gas box, and finally dissipated efficiently through the natural convection between the box surface and the outside air, thus achieving thermal balance that meets the standard requirements in an extremely simplified structure.) Conductor innovation: Specification innovation: Under rated current, a thinner (10×60mm) copper busbar specification was innovatively adopted, which directly reduced material costs.

[0045] Process Innovation: The standard process of blackening the copper busbars with lacquer has been eliminated, simplifying the production process. (The principle behind this is that, after multiple temperature rise tests, it has been verified that in a sealed air chamber with dry air medium, the heat dissipation of the copper busbars mainly relies on gas convection and conduction, and the contribution of its surface heat radiation to the overall thermal balance is negligible. Although eliminating the blackening process slightly reduces the surface emissivity, through the coordinated optimization of conductor specifications and connection processes, it has been ensured that the system temperature rise can still fully meet the standard requirements for cabinet operation even after eliminating the blackening process in the middle section of the copper busbars.) The core protection feature of the product is a compact C-GIS gas-insulated cabinet based on an optimized heat dissipation structure. The outer shell 1 of the gas-insulated cabinet has no external heat sinks on the top and back, and no dedicated heat dissipation frame inside. Furthermore, its main circuit 2 adopts TMQY 10×60mm copper busbar 7, and the 10×60mm copper busbar 7 is only silver-plated at the overlapping ends, and there is no black paint coating in the middle section.

[0046] Related structural protection points: The number of nails 15 on the back plate of the gas-insulated cabinet shell 1 is significantly reduced compared to the original design; there are no threaded holes 13 for fixing the internal heat sink 12 on the internal intermediate guide sleeve 4 and other insulating parts.

[0047] Method Protection Point: A method for manufacturing a compact C-GIS gas-insulated cabinet based on an optimized heat dissipation structure, comprising the steps of: omitting the steps of installing top and back heat sinks; omitting the steps of installing internal heat sinks and related fasteners; using TMQY 10×60mm copper busbar 7, and only silver-plating the overlapping ends of the busbar, without applying black paint to the middle section.

[0048] Example 4, as Figure 13 A heat dissipation method for a compact C-GIS gas-insulated cabinet based on an optimized heat dissipation structure is proposed. Precise process specifications ensure structural simplification, and closed-loop verification is performed through endpoint performance testing. Specifically, this includes: S1, in the material and pretreatment stage, TMYQ's 10×60mm copper busbar 7 is used, and silver plating is only completed in the areas marked at both ends of the 10×60mm copper busbar 7, omitting the black paint baking process. S2, in the assembly process, according to the updated process documents, the installation of the top heat sink 10 and the back heat sink 11 is omitted, the assembly of the internal heat sink 12 and the threaded hole 13 for fixing the internal heat sink 12 is omitted, and preferably all associated fasteners (such as specific pins and screws) for fixing the internal heat sink 12 are also omitted. S3 utilizes the consistency of the simplified compact C-GIS gas-insulated cabinet structure based on optimized heat dissipation to directly verify whether the overall temperature rise of the compact C-GIS gas-insulated cabinet based on optimized heat dissipation structure meets the standard after final assembly through standard temperature rise test or equivalent infrared detection, thereby ensuring the stable and reliable performance of the product after eliminating redundant steps.

[0049] For example, in the post-assembly verification of step S3, the overall temperature rise of the compact C-GIS gas-insulated cabinet based on the optimized heat dissipation structure is directly verified to meet the standard through standard temperature rise test or equivalent infrared detection, including: S301, multi-dimensional dynamic load simulation; A variable frequency power supply was used to simulate the load current fluctuation (±15% of rated current In) of an actual compact C-GIS gas-insulated switchgear, and a step load (0.5I) was applied cyclically. n→1.2I n →2.0I n →Rated I n ).

[0050] Continue each load segment until thermal stability (ΔT≤1°C / 10min), and record the temperature rise curves of key nodes (such as the silver-plated joints in the designated areas at both ends of the 10×60mm copper busbar 7, and a certain node on the top, back surface, and internal space of the gas-insulated cabinet shell 1).

[0051] As can be seen, this invention replaces the traditional static rated load test and more realistically reflects the heat dissipation performance of the equipment under dynamic operating conditions.

[0052] S302, Phase Synchronous Dynamic Infrared Scanning (PS-DTIR); During the pre-scanning phase, the equipment runs unloaded to establish a reference temperature field; During the load synchronization phase, the infrared thermal imager is phase-locked with the current (synchronization accuracy <1ms) to capture the heat distribution at the moment of peak load. During the trajectory tracking phase, the moving arc hotspot is tracked at a high speed of >30fps to locate weak points in heat dissipation.

[0053] It is understood that the present invention solves the error caused by the asynchronous phase of traditional infrared scanning and current, and accurately captures the abnormal local temperature rise after the removal of the top / back heat sink.

[0054] S303, Three-dimensional temperature field reconstruction; Arrange ≥50 fiber Bragg grating sensor arrays on the surface of the cabinet, covering the original heat sink area, including the top heat sink 10, the back heat sink 11, the internal heat sink 12, and the 10×60mm copper busbar 7 area.

[0055] The internal hotspot distribution is reconstructed using a heat conduction inversion algorithm to obtain a three-dimensional temperature field. The formula for the heat conduction inversion algorithm is as follows: ; In the formula, Three-dimensional space for a compact C-GIS gas-insulated switchgear with optimized heat dissipation structure The temperature value at any point inside, including the top and back surfaces of the gas-insulated enclosure 1 and the internal space; , is the temperature weighting coefficient. The thermal decay factor of the material. This represents the area for heat dissipation through temperature convection.

[0056] S304, based on the reconstructed three-dimensional temperature field, optimizes the temperature rise determination system through dynamic threshold correction formula and hot spot risk assessment index; Dynamic threshold correction formula: ; In the formula, This is a dynamic threshold correction value. The standard temperature rise limit is 65K for silver-plated connectors. This is a humidity correction factor (0.002 / %RH). Standard humidity, The altitude correction factor is 0.03 / 1000m. Altitude.

[0057] The above formula dynamically adjusts the upper limit of temperature rise based on environmental parameters, adapting to the heat dissipation verification of the cabinet without heat sinks under harsh conditions such as high altitude and high humidity.

[0058] In step S304, the hotspot risk assessment index is: ; In the formula, This is the hotspot risk assessment index value. For the latest temperature, The average temperature. For temperature variance, For duration.

[0059] In step S304, the determination logic of the temperature rise determination system includes: For safety, the heat dissipation structure has been optimized and is effective; As a warning, the back / top area needs to be retested using PS-DTIR; This is unacceptable and the heat dissipation path needs to be redesigned.

[0060] The above formula quantifies the risk of localized overheating and verifies the temperature uniformity after omitting the internal heat sink and the top and back heat sinks.

[0061] As can be seen, the advantages of this invention compared with traditional methods are shown in Table 1.

[0062] Table 1: Advantages Comparison Table

[0063] For example, the technical closed-loop verification logic is shown in the following code: A [Dynamic Load Test] --> B [Three-Dimensional Temperature Field Reconstruction]; B --> c {{Hotspot Risk Index Rh Calculation}}; C --> |Rh<1.0| D [Certified Effective Optimization of Heat Dissipation Structure]; D --> |R_h≥1.0| E [Initiate PS-DTIR Retest] <; E --> F [Locate Back / Top Heat Dissipation Defects]; F --> G [Heat Conduction Inversion Tracing] <; G --> H [Optimize Copper Busbar Layout or Air Box Design].

[0064] This process has been certified by IEC 62271-200:2021, with a temperature rise control uncertainty of ±0.7K, making it particularly suitable for harsh environments such as high altitudes and humid conditions. Practical applications have shown that this solution still offers advantages such as effective heat dissipation even after omitting heat sinks and internal heat dissipation brackets and optimizing copper busbars.

[0065] To further illustrate the effects of the embodiments of the present invention, the following applications are described.

[0066] This invention provides a low-cost, compact C-GIS gas-insulated switchgear based on an optimized heat dissipation structure. Its core lies in redefining the heat dissipation requirements of this type of switchgear through systematic analysis and experimental verification, and accordingly simplifying its structure and process.

[0067] The overall external heat dissipation structure of the air box has been streamlined: all external heat sinks (or heat dissipation plates) installed on the top and back walls of the air box in the traditional design have been completely eliminated. After the improvement, the top, back and side walls of the air box are all made of complete and flat sheet metal structure, without any protruding or additional metal components for enhancing heat dissipation.

[0068] The coordinated simplification of the internal structure and installation process of the gas box includes: a) Elimination of core heat dissipation components: All dedicated metal heat sinks installed inside the air box for supporting and conducting heat have been completely eliminated.

[0069] b) Optimization of the associated fastening structure (reduction of anchor bolts): As a direct result and chain optimization of the above improvements, the number of anchor bolts (or welding bolts) originally used to fix the internal heat sink frame welded to the air box back plate has been greatly reduced, simplifying the back plate prefabrication process.

[0070] c) Simplification of the mounting interface (elimination of threaded holes): The original threaded holes used for connecting and fixing the heat sink on the internal insulating component of the gas box (specifically the intermediate guide sleeve 4) have been eliminated. The intermediate guide sleeve 4 retains only its original insulating and guiding function, resulting in a simpler structure.

[0071] The comprehensive optimization design of the main circuit conductor 2 includes: 1) Specification optimization: The specifications of the main circuit 2 copper busbar were optimized from the traditional TMQY 12mm×60mm to TMQY 10mm×60mm. Under the premise of rigorous calculation and test verification, ensuring that its current carrying capacity and dynamic and thermal stability still meet the rated parameters (1250A, 31.5kA), the amount of copper material used was directly reduced.

[0072] 2) Simplified Process: The surface treatment process for the optimized copper busbar has been revolutionaryly simplified. The original composite process of "silver plating on the overlapping contact areas at both ends to ensure conductivity, and baking black paint on the entire non-contact section in the middle to enhance heat radiation" has been simplified to a single process of "silver plating only on the electrical overlapping contact areas at both ends". The entire process of "baking black paint on the middle section" involving pretreatment, spraying, and curing has been completely eliminated.

[0073] Synergistic Effect: The overall simplification of the external heat dissipation structure of the air box, the synergistic simplification of the internal structure and installation process of the air box, and the comprehensive optimization design improvement measures of the two conductors in the main circuit work together to form a completely new and streamlined heat dissipation system. Tests have shown that although several heat dissipation measures have been eliminated, the natural convection and radiation heat dissipation capacity of the cabinet itself is sufficient to meet the heat dissipation requirements under rated operating conditions. The temperature rise of the hottest spot in the entire cabinet remains consistently below the limit specified in the national standard GB / T 11022 (for example, for a 1250A current, the temperature rise does not exceed 75K when the copper busbar is silver-plated), demonstrating the redundancy of the original design and the effectiveness of this solution. For example, specific test data on the copper busbar temperature rise are shown in Tables 2-5.

[0074] Table 2 shows the temperature rise test data of the C-GIS500 cabinet. The test current was 1.1 * Ir (1250A) = 1376A (test date: August 2, 2025). Among the changes, factor 1 was that the copper busbar at the terminal post-inlet bushing was changed from a black-painted TMQY 12mm×60mm copper busbar with silver plating at the overlapping surface to a TMQY 10mm×60mm tin-plated copper busbar. Factor 2 was that all heat sinks inside and outside the air box were removed. Table 3 shows the temperature rise test data for the C-GIS50 cabinet. The test current was 1.1*Ir(1250A) = 1376A (test date: August 6, 2025). The first variable factor was: due to the thinning of the copper busbar, the bending angle of the TMOY10mm×60mm tin-plated copper busbar at the pole-inlet bushing was changed to make the overlapping conductive position fit more tightly. Table 4 shows the temperature rise test data for the C-GIS500 cabinet. The test current was 1.12 * Ir (1250A) = 1400A (test date: August 12, 2025). The first variable factor was: the TMQY10mm×60mm tin-plated copper busbar at the inlet bushing was changed to a TMQY10mm×60mm silver-plated copper busbar at the lap joint. Table 5 shows the temperature rise test data for the C-GIS500 cabinet. The test current is 1.12 * lr (1250A) = 1400A (test date: 25.9.11). Change factor 1: The silver-plated copper busbar at the TMQY10mm to 60mm overlap at the pole-inlet bushing was changed to a TMQY12mm×60mm tin-plated copper busbar.

[0075] Table 2 Temperature Rise Data

[0076] Table 3 Temperature Rise Data II

[0077] Table 4 Temperature Rise Data (Part 3)

[0078] Table 5 Temperature Rise Data (Part 4)

[0079] Application Example: In a power distribution equipment upgrade project of a provincial power grid company, this optimized solution was applied to a newly built 10kV switch station. Actual application and comparative testing show that the cabinet using the new solution meets the temperature rise requirements; and the production cost, including heat sinks, heat sink bracket materials, and processing fees, is expected to reduce direct material costs by 20%-25%, significantly lowering the production cost per cabinet. Simultaneously, the elimination of black paint coating on the copper busbars simplifies the copper busbar process, improving assembly efficiency, accelerating the production line pace, and increasing capacity. Finally, the original solution required the installation of heat sink brackets and fixing of heat sinks, a cumbersome process where assembly consistency depended on worker skill, and excessive welding points (pins) and mechanical connection points (threaded holes) could become potential failure points. The optimized solution streamlines the assembly process, simplifies the process, improves consistency, and reduces the risks caused by loose or corroded auxiliary components, thus reducing daily maintenance requirements.

[0080] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications, equivalent substitutions and improvements made by those skilled in the art within the scope of the technology disclosed in the present invention and within the spirit and principles of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A heat dissipation method for a compact C-GIS gas-insulated cabinet based on an optimized heat dissipation structure, characterized in that, The method specifically includes the following steps: S1, in the material and pretreatment stage, a 10×60mm copper busbar (7) is used to complete the silver plating in the areas defined at both ends of the 10×60mm copper busbar (7); S2, In the assembly process, based on the updated process documents, the installation of the top heat sink (10) and the back heat sink (11) is omitted; After final assembly, the S3 unit verifies whether the overall temperature rise of the compact C-GIS gas-insulated cabinet based on the optimized heat dissipation structure meets the standard through standard temperature rise test or equivalent infrared detection.

2. The heat dissipation method for the compact C-GIS gas-insulated cabinet based on an optimized heat dissipation structure according to claim 1, characterized in that, In step S3, verify whether the overall temperature rise of the compact C-GIS gas-insulated switchgear based on the optimized heat dissipation structure meets the standard, including: S301, multi-dimensional dynamic load simulation; S302, Phase Synchronized Dynamic Infrared Scanning PS-DTIR; S303, Three-dimensional temperature field reconstruction; S304, based on the reconstructed three-dimensional temperature field, optimizes the temperature rise determination system through dynamic threshold correction formula and hot spot risk assessment index.

3. The heat dissipation method for the compact C-GIS gas-insulated cabinet based on an optimized heat dissipation structure according to claim 2, characterized in that, In step S301, multi-dimensional dynamic load simulation includes: using a variable frequency power supply to simulate the actual compact C-GIS gas-insulated switchgear load current fluctuation of ±15% of the rated current In, and cyclically applying a step load of 0.5I. n 1.2I n 2.0I n Rated current I n Each load segment continues until thermal stability, and the temperature rise curve of key nodes is recorded, including the silver-plated joints of the two ends of the 10×60mm copper busbar (7), the top and back surfaces of the gas-filled cabinet shell (1), and a certain node in the internal space.

4. The heat dissipation method for the compact C-GIS gas-insulated cabinet based on the optimized heat dissipation structure according to claim 2, characterized in that, Step S302, Phase Synchronized Dynamic Infrared Scanning (PS-DTIR) includes: During the pre-scanning phase, the equipment runs unloaded to establish a reference temperature field; During the load synchronization phase, the infrared thermal imager is phase-locked with the current to capture the instantaneous heat distribution of the peak load. During the trajectory tracking phase, the moving arc hotspot is tracked at a high speed of >30fps to locate weak points in heat dissipation.

5. The heat dissipation method for the compact C-GIS gas-insulated cabinet based on an optimized heat dissipation structure according to claim 2, characterized in that, Step S303, three-dimensional temperature field reconstruction, includes: Arrange ≥50 fiber optic grating sensor arrays on the surface of the cabinet to cover the original heat sink area, including the top heat sink (10), the back heat sink (11), the internal heat sink frame (12), and the 10×60mm copper busbar (7) area; reconstruct the internal hot spot distribution through the heat conduction inversion algorithm to obtain the three-dimensional temperature field.

6. A compact C-GIS gas-insulated cabinet based on an optimized heat dissipation structure, the gas-insulated cabinet implementing the heat dissipation method for a compact C-GIS gas-insulated cabinet based on an optimized heat dissipation structure as described in any one of claims 1-5, the gas-insulated cabinet comprising: The gas-filled cabinet shell (1) has a main circuit (2) installed on the upper inner part of the gas-filled cabinet shell (1), and the main circuit (2) is connected to an isolation stationary knife seat (3); the isolation stationary knife seat (3) is installed on the back of the gas-filled cabinet shell (1); the feature is that an intermediate guide sleeve (4) is provided on one side of the isolation stationary knife seat (3); the intermediate guide sleeve (4) is connected to the pole post (6) through the support frame (5), and the pole post (6) is connected to the inlet terminal (8) through a 10×60mm copper busbar (7).

7. The compact C-GIS gas-insulated switchgear based on an optimized heat dissipation structure according to claim 6, characterized in that, The 10×60mm copper busbar (7) is silver-plated at both ends and connected to the pole (6) and the inlet (8) respectively.

8. The compact C-GIS gas-insulated switchgear based on an optimized heat dissipation structure according to claim 6, characterized in that, One end of the 10×60mm copper busbar (7) is also fitted with an inlet sleeve (9), which is fitted outside the connection between the 10×60mm copper busbar (7) and the inlet end (8).

9. The compact C-GIS gas-insulated switchgear based on an optimized heat dissipation structure according to claim 6, characterized in that, The threaded hole (14) for fixing the internal heat sink (12) is removed from the intermediate guide sleeve (4).

10. The compact C-GIS gas-insulated switchgear based on an optimized heat dissipation structure according to claim 6, characterized in that, The compact C-GIS gas-insulated switchgear based on an optimized heat dissipation structure is applied in the power distribution network field.

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